JP2006289625A - Substrate breaking apparatus of laminated substrate and substrate breaking method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a substrate breaking apparatus of a laminated substrate capable of breaking the laminated substrate into an upper surface substrate and an undersurface substrate indivisually almost at the same time and at the same place, and a substrate breaking method. <P>SOLUTION: The substrate breaking apparatus is equipped with an upper breaking unit 30A, which is equipped with a substrate support plate 211 having an opening part formed thereto, an elastic plate 212 mounted on the upper surface of the substrate support plate 211 so as to cover the opening part, the upper breaking bar 31A provided above the elastic plate 212 and capable of being moved up and down above the opening part of the substrate support plate 211 and a pair of the upper fixing bars 32A arranged on both sides of the upper breaking bar 31A, a lower breaking unit 30B which is equipped with the lower breaking bar 31B opposed to the upper breaking unit 30A and capable of being moved up and down in opposed relation to the elastic plate 212 under the opening part of the substrate support plate 211 and a pair of the lower substrate fixing bars 32B arranged on both sides of the lower breaking bar 31B, and a movement control part 50 for individually controlling the movements of both breaking bars 31A and 31B and both substrate fixing bars 32A and 32B. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention breaks a bonded substrate (hereinafter referred to as “mother substrate”) bonded with a brittle material substrate such as a glass substrate having a large area, a semiconductor wafer, etc. A substrate breaker for bonded substrates to obtain a large number of substrates of a predetermined small area, in which a lower substrate is broken to a small area after being ("break" or "cut") or vice versa. The present invention relates to a substrate breaking method.

  First, a conventional substrate breaking method and apparatus for a bonded substrate will be described with reference to FIGS. In the following description, “substrate break method for bonded substrates” is simply “substrate break method” except for special cases, and “substrate break apparatus for bonded substrates” is simply excluded except for special cases. It will be described as “substrate breaker”.

  FIG. 23 is a flowchart of a conventional substrate break process, FIG. 24 shows a part of a display panel when a conventional substrate break method is broken, FIG. A is a plan view thereof, and FIG. B is a sectional side view thereof. FIG. 25 is a conceptual diagram showing a conventional substrate breaker.

  For example, in a conventional substrate breaking method in which a mother substrate obtained by bonding two glass substrates having a large area is broken into a plurality of small panels having a small area, for example, the two glass surfaces of the mother substrate are cut and drawn in advance. A break bar of a substrate breaker is aligned with the scribe line, a load exceeding the stress is applied by the break bar, and a crack grows perpendicularly to the lower surface of the mother substrate. This is done by a break method that breaks into a large number of small panels.

  Since the substrate for a liquid crystal display device and the like is a mother substrate having a two-layer structure in which two glass substrates are bonded together, it breaks along a scribe line drawn in advance on each side of the front and back surfaces in the breaking process. There is a need.

  In such a break process of the mother substrate, as shown in FIG. 23, the mother substrate is carried into a scribe device (step S30), and first, a glass substrate on the upper surface substrate side on which one thin film transistor (TFT) is formed. A scribe line is formed in a grid pattern at predetermined intervals (step S31), and then the mother substrate is unloaded from the scribe device, turned over, and loaded into the substrate breaking device (step S32), and formed as described above. The upper substrate (TFT surface) side is broken by pressing from above with a break bar along the scribe line (Step S33), and then the upper substrate (TFT surface) side is thus broken. Is once carried out of the substrate breaking device, and again carried into the scribe device (step S34), A scribe line is formed on the surface of the glass substrate on the lower surface substrate side where the other color film (CF) different from the upper surface substrate (TFT surface) side glass substrate is formed so as to match the scribe line formed on the upper surface substrate. Is formed (step S35). In the same manner as described above, the mother substrate is again unloaded from the scribe device, turned over and loaded into the substrate break device (step S36), and the upper surface substrate (TFT surface) is pressed from above with a break bar. The lower substrate (CF surface) side is broken along the scribe line (step S37), and the display panel with the upper and lower surfaces broken is removed from the substrate breaker (step S38). (Step S39) A substrate break method is generally adopted.

Thus, in the conventional substrate break process,
1. 1. There are two processes (steps S32 and S36) for inverting the mother substrate after the break. Further, in the reversing operation of these mother substrates, it is conceivable that the break surfaces of the individual display panels having small areas collide with each other (hereinafter referred to as “interference”). As shown in FIG. 2. Damage C such as cracks and chippings occurs on each break surface, etc., resulting in poor display panel yield. In addition, in the conventional substrate break process, high voltage static electricity is generated when the mother substrate in the substrate breaker is carried in and out of the work table as an operation for inverting the mother substrate, and is formed in the mother substrate. There are problems, such as that the TFTs that are being processed may break down.

  In the substrate break process, there is a step in which the mother substrate has to be reversed. For this reason, a defect due to the interference has occurred. However, a technique for eliminating the inversion step is disclosed in [Patent Document 1].

  The technique disclosed in [Patent Document 1] is called “glass break method and apparatus”, and as shown in FIG. 25, a glass break that breaks both sides of a panel formed by bonding two glass substrates G together. In this method, a mechanism Sp3 that supports the panel is provided on the opposite side of the first break blade Br1 that breaks one surface of the panel, and a second break blade Br2 that breaks the other surface of the panel. Similarly, a mechanism Sp4 for supporting the panel is also provided on the opposite side of the glass, and a glass breaking method is adopted in which the panel is broken from both sides of the panel while supporting the panel from the opposite side of the break blades Br1 and Br2.

The first break blade Br1 and the second break blade Br2 are diamond wheel cutters. The mechanism Sp3 and the mechanism Sp4 arranged to face each other are rollers made of metal such as iron, aluminum, stainless steel or resin. It is said that a structure in which a resin or rubber sheet is attached to the surface of the roller for the purpose of preventing damage to the glass or preventing slipping.
JP 2003-313036 (page 3, FIG. 1)

  As described above, the glass break method of [Patent Document 1] employs a method of performing a break (break) on both sides of a bonded glass substrate (mother substrate) from each surface side. Although it is unnecessary, when there are two break points and the size of the display panel to be broken is small, the two pairs of the first break blade Br1 and the mechanism Sp3 and the second break blade Br2 and the mechanism Sp4 are brought close to each other. On the contrary, when the area of the display panel that has been broken is large, the two must be separated from each other. In such a case, the substrate breaker becomes large.

  In addition, for the break of the mother substrate, a diamond wheel cutter and a hard roller are used, and a method of breaking while rolling the diamond wheel cutter from one end to the other end for each scribe line is adopted. There is a problem that the glass substrate break method is not different.

  Therefore, the present invention is intended to solve the various problems as described above, and a mother substrate set in the substrate breaker in the substrate breaker process in the substrate breaker is placed in the same position in the upper and lower sides. Another object of the present invention is to provide a bonded substrate breaker and a substrate break method that can break the lower substrate and the upper substrate and the lower substrate almost simultaneously.

  Therefore, the substrate breaking device of the present invention is a substrate breaking device for breaking a bonded brittle material substrate formed on the surface of a position where a scribe line is desired to break along the scribe line, and an opening is formed. A substrate support plate, an elastic plate mounted on the upper surface of the substrate support plate so as to cover the opening, and fixing the brittle material substrate, and located above the elastic plate, and of the substrate support plate The upper break bar disposed above the opening and arranged to move up and down, and breaks along the scribe line at the center, and upper substrate fixing bars formed on both sides of the upper break bar. An upper break unit, a movement control unit for individually controlling movement of the upper break bar and the upper substrate fixing bars, and the lower portion of the substrate support plate below the opening. A lower break unit provided with a lower break bar which is arranged so as to move up and down relative to the insulating plate and breaks along the scribe line at the center, and lower substrate fixing bars formed on both sides of the lower break bar And a movement control unit that individually controls movement of the lower break bar and the lower substrate fixing bars.

  The elastic plate is mounted on the substrate support plate so as to be able to rotate over an angular range of 90 degrees to the left or right, or an angular range of 90 degrees in one direction. The elastic plate has a function of sucking and holding the bonded brittle material substrate mounted thereon. The substrate support plate is mounted on a surface plate having a horizontal surface so as to be movable in at least one direction. In addition, a first vibration sensor is mounted on the upper break bar, and a second vibration sensor is mounted on the upper substrate fixing bar, and an upper cutting detection unit and an upper break unit movement control unit are connected to both the vibration sensors. A first vibration sensor is also mounted on the lower break bar, and a second vibration sensor is mounted on the lower substrate fixing bar, and a lower cutting detection unit and a lower break unit movement control unit are connected to both the vibration sensors. ing.

  The substrate breaking method of the present invention is a large format in which an elastic plate is mounted horizontally on the substrate supporting plate having an opening formed and the surface is horizontal, covering the opening, and attempting to break on the elastic plate. The mother board in which the upper substrate and the lower substrate of the two brittle materials having scribe lines formed on the surface are bonded in a horizontal state, and the scribe line at the position where the mother substrate is to be broken is opened. When the mother substrate exposed at the opening is broken from above or from below, it is broken through the elastic plate.

In the substrate breaking method of the present invention, an elastic plate is mounted horizontally on the substrate support plate having an opening formed and the surface being in a horizontal state so as to cover the opening and to break on the elastic plate. A large mother board in which two upper surfaces of a brittle material having a scribe line formed on a surface and a lower substrate are bonded together is fixed in a horizontal state, and the scribe line at the position where the mother substrate is to be broken is Positioned in the middle of the opening, a pair of lower substrate fixing bars are brought into contact with the elastic plate portion existing under the lower substrate exposed in the opening so as to straddle the scribe line to be broken In this state, the upper substrate is pressed by an upper break bar along the scribe line to be broken on the upper surface substrate, and the mother substrate is bent into a V shape. Characterized by breaking the lower surface substrate. (Fig. 9)
In the substrate breaking method of the present invention, the elastic plate is mounted horizontally on the substrate support plate having the opening formed and the surface being in a horizontal state so as to cover the opening and to break on the elastic plate. A large-sized mother board in which the upper and lower substrates of the brittle material having scribe lines formed on the surface are bonded in a horizontal state, and the scribe line at the position where the mother board is desired to break is fixed. The scribe to be broken on the lower substrate is positioned in a middle portion of the opening, and a pair of upper substrate fixing bars are in contact with the upper surface of the upper substrate so as to straddle the scribe line to be broken. Pressing with a lower break bar through the elastic plate exposed at the opening along the line to bend the mother substrate in an inverted V shape Characterized by breaking the top substrate Ri.

  Furthermore, in the substrate breaking method of the present invention, an elastic plate is mounted horizontally on the substrate support plate having an opening formed and the surface being in a horizontal state so as to cover the opening and to break on the elastic plate. A large-sized mother board on which the upper surface substrate and the lower surface substrate of the brittle material having a scribe line formed on the surface are fixed in a horizontal state, and the scribe line at the position where the mother substrate is to be broken is opened. The upper break bar is placed in contact with the upper break bar along the scribe line to be broken on the upper surface of the upper substrate so as to straddle the scribe line to be broken on the lower substrate. By pressing with a pair of lower substrate fixing bars through the elastic plate exposed in the opening, the mother substrate is bent into a V shape. Characterized by breaking the serial underside substrate.

  Further, the substrate breaking method of the present invention is such that an opening is formed and an elastic plate is horizontally mounted on the substrate support plate having a horizontal surface so as to cover the opening and to break on the elastic plate. A large-sized mother board in which the upper and lower substrates of the brittle material having scribe lines formed on the surface are bonded in a horizontal state, and the scribe line at the position where the mother board is desired to break is fixed. The upper surface is positioned in an intermediate portion of the opening and is in contact with a lower break bar through the elastic plate exposed to the opening along the scribe line to be broken on the lower surface substrate. Pressing the upper surface of the substrate with a pair of upper substrate fixing bars so as to straddle the scribe line to be broken, and bending the mother substrate in an inverted V shape Characterized by breaking the top substrate Ri.

  Still further, the substrate breaking method of the present invention is performed by the substrate breaking method according to claim 7 or 9 along all the scribe lines formed on the surface of the lower substrate of the mother substrate. Breaking the lower substrate, and then breaking the upper substrate along all the scribe lines formed on the surface of the upper substrate of the mother substrate by the substrate breaking method according to claim 8 or 10. It is characterized by.

  Still further, in the substrate breaking method of the present invention, first, the upper substrate is broken along all the scribe lines formed on the surface of the upper substrate of the mother substrate, and then the lower substrate of the mother substrate is broken. The lower substrate is broken along all scribe lines formed on the surface. (FIG. 19) As described above, the lower substrate is broken along the scribe lines formed on the surface of the lower substrate of the mother substrate, and the electrode terminals formed on the inner surface of the upper substrate are exposed. And

  Still further, in the substrate breaking method of the present invention, an elastic plate is mounted horizontally on the substrate supporting plate having an opening formed and the surface being horizontal, covering the opening, and break on the elastic plate. The above-mentioned scribe line at a position where the mother substrate in which the upper substrate and the lower substrate of the brittle material are bonded together is fixed in a horizontal state and the mother substrate is to be broken. Is positioned in the middle of the opening, and a pair of lower substrate fixing bars are applied to the elastic plate portion exposed under the lower substrate exposed in the opening so as to straddle the scribe line to be broken. In contact with the upper substrate, the upper substrate is pressed along the scribe line to be broken by the upper break bar to bend the mother substrate into a V shape. The break of the lower substrate is made almost immediately after the pair of upper substrate fixing bars are in contact with the upper surface of the upper substrate so as to straddle the scribe line to be broken. Breaking the upper substrate by applying pressure to the lower break bar through the elastic plate exposed in the opening along the scribe line to be bent, and bending the mother substrate in an inverted V shape It is characterized by.

  Still further, in the substrate breaking method of the present invention, an elastic plate is mounted horizontally on the substrate supporting plate having an opening formed and the surface being horizontal, covering the opening, and break on the elastic plate. The mother board in which the upper substrate and the lower substrate of the two brittle materials on which the scribe lines are formed is bonded in a horizontal state is fixed, and the break is attempted on the upper surface of the upper substrate. In a state where the pair of upper substrate fixing bars are in contact with each other so as to straddle the scribe line, the lower plate is interposed through the elastic plate exposed at the opening along the scribe line to be broken on the lower substrate. After the upper substrate is broken by pressurizing with a break bar and bending the mother substrate in an inverted V shape, the break of the lower substrate is almost instantaneously attempted. Along the scribe line to be broken on the upper surface of the upper substrate while the pair of lower substrate fixing bars are in contact with each other via the elastic plate exposed to the opening so as to straddle the scribe line And pressing the upper break bar to break the lower substrate by bending the mother substrate into a V-shape.

  Still further, in the substrate breaking method of the present invention, an elastic plate is mounted horizontally on the substrate supporting plate having an opening formed and the surface being horizontal, covering the opening, and break on the elastic plate. A large scribe line in which a mother substrate in which two upper and lower substrates of a brittle material having a scribe line formed on the surface are bonded together is fixed in a horizontal state and the lower substrate is to be broken. A pair of the upper substrates is fixed so as to straddle the scribe line to be broken on the upper surface of the upper substrate while the lower break bar is in contact with the elastic plate exposed to the opening along Break the upper substrate by pressing with a bar and bending the mother substrate in an inverted V shape, and then break the upper substrate on the upper surface almost instantaneously. In a state where the upper break bar is in contact with the scribe line, the pair of the elastic plates exposed to the opening so as to straddle the scribe line to be broken on the lower surface substrate. The lower substrate is broken by pressurizing with a lower substrate fixing bar and bending the mother substrate into a V shape.

Still further, in the substrate breaking method of the present invention, an elastic plate is mounted horizontally on the substrate supporting plate having an opening formed and the surface being horizontal, covering the opening, and break on the elastic plate. The above-mentioned scribe line at a position where the mother substrate in which the upper substrate and the lower substrate of the brittle material are bonded together is fixed in a horizontal state and the mother substrate is to be broken. Is positioned at an intermediate portion of the opening, and the upper substrate fixing bar is in contact with the upper surface of the upper substrate so as to straddle the scribe line to be broken. The mother board is bent in an inverted V shape by applying pressure with a lower break bar through the elastic plate exposed at the opening along the scribe line. After the upper substrate is broken by the above, the scribe to break the lower substrate while the upper break bar is in contact with the upper surface of the upper substrate along the scribe line to be broken almost instantaneously. Pressing the lower substrate fixing bar through the elastic plate exposed in the opening so as to straddle the line, and breaking the lower substrate by bending the mother substrate into a V-shape. A substrate breakage method for a bonded substrate. (Fig. 17)
Still further, in the substrate breaking method of the present invention, an elastic plate is mounted horizontally on the substrate supporting plate having an opening formed and the surface being horizontal, covering the opening, and break on the elastic plate. The above-mentioned scribe line at a position where the mother substrate in which the upper substrate and the lower substrate of the brittle material are bonded together is fixed in a horizontal state and the mother substrate is to be broken. In the state where the lower break bar is in contact with the elastic plate exposed to the opening along the scribe line to be broken on the lower surface substrate. The mother board is bent in an inverted V shape by applying pressure to the upper surface of the upper substrate by a pair of upper substrate fixing bars so as to straddle the scribe line to be broken. A pair of lower substrates so as to straddle the scribe line to be broken across the elastic plate portion exposed under the lower surface substrate exposed to the opening almost instantaneously after breaking the upper substrate. Breaking the lower substrate by pressing the upper break bar along the scribe line to be broken on the upper substrate while bending the mother substrate into a V shape with the fixed bar in contact It is characterized by.

  Therefore, according to the substrate breaker of the bonded substrate and the substrate breaker method of the present invention, the upper break bar and the pair of upper substrates are separated upward from the elastic plate that adsorbs and holds the bonded substrate by the substrate breaker. Since the fixing bar has a configuration in which a lower break bar and a pair of lower substrate fixing bars are arranged symmetrically below, the bonded substrate loaded into the substrate breaking device can be moved upside down without being inverted. It is possible to break the upper surface substrate or the lower surface substrate at the same position, or both the upper and lower substrates almost instantaneously along the scribe line.

  Further, according to the substrate breaker of the bonded substrate and the substrate break method of the present invention, the bonded substrate is adsorbed and held by the elastic plate, and the elastic plate at the break position is bent at the time of the break. Can be bent more greatly, and a vertical crack can be grown along the scribe line, and the break can be favorably promoted.

  Further, according to the substrate breakage method of the bonded substrate of the present invention, the breakage between the break surfaces (collision, hereinafter referred to as “interference”)) is caused by breaking the upper surface substrate and then the lower surface substrate. Decrease.

According to the substrate breaker and the substrate break method for bonded substrates of the present invention, the following effects can be obtained.
1. 1. It is possible to reduce defects such as cracks and chips during breaks. 2. Improve the quality of the finished product. 3. High-throughput production is possible. 4. It is possible to prevent destruction of semiconductor elements and the like formed in the substrate due to high-voltage static electricity generated when carrying out the substrate that has been broken from the substrate breaker. 5. The processing efficiency of the substrate breaking process is improved. 6. Space saving of production equipment can be achieved. Numerous excellent effects can be obtained, such as a reduction in investment in production equipment.

  The present invention is a substrate breaking method and apparatus for breaking a scribe line formed on the surfaces of both of the two brittle material substrates constituting the mother substrate as described below by applying a load more than stress to the substrate, In a substrate breaker comprised of a break unit driven up and down by a break robot for breaking the upper surface / lower surface of the mother substrate and a work stage for sucking and fixing the mother substrate, the mother conveyed into the substrate breaker A substrate breaking method and apparatus have been developed, in which a small panel having a small area is obtained by carrying out breaks on both sides almost simultaneously at the same place in the same process without carrying out the substrate and carrying in / inverting the substrate.

  The bonded substrate breaking method and apparatus according to the present invention will be described below with reference to the drawings.

  FIG. 1 shows a mother substrate for a liquid crystal display panel. FIG. 1A is a plan view thereof, FIG. 1B is a sectional view taken along line Y1-Y2 of FIG. 1A, and FIG. 3 is a front view showing the configuration of the substrate breaker, FIG. 3 is a schematic view of a substrate support in the substrate breaker shown in FIG. 2, FIG. A is a plan view thereof, and FIG. 4 is a cross-sectional side view on line A, FIG. 4 is a cross-sectional side view schematically showing the relationship between the work stage with the mother substrate placed thereon and the break unit, and FIG. 5 is a diagram of FIG. 2 corresponding to the mother substrate shown in FIG. FIG. 6 is a side view showing the principal part of the substrate breaking device shown in FIG. 6 in principle, FIG. 6 is a side view showing a partially enlarged view of cutting the lower substrate 104 in the embodiment according to the present invention, and FIG. In the substrate breaker 1 of the present invention, the first vibration data V1 and the first vibration data V1 FIG. 4A is a waveform diagram showing vibration data V2 and difference data D. FIG. 1A is a waveform diagram when the upper break bar 31A and the upper substrate fixing bar 32A receive vibration due to disturbance, and FIG. FIG. 8C is a waveform diagram when the upper substrate fixing bar 32A receives vibration, and FIG. 8 is controlled by the upper break bar movement control unit 51A in the embodiment according to the present invention. It is a waveform diagram showing position data P in the vertical direction of upper break bar 31A moved by upper break bar moving unit 41A and difference data D between first vibration data V1 and second vibration data V2.

  First, the configuration and structure of a mother substrate from which a large number of display panels are cut out will be described with reference to FIG.

  In FIG. 1, reference numeral 101 indicates a mother substrate 101. A plurality of display panels 102 are formed on the mother substrate 101. As shown in FIG. B, the mother substrate 101 includes a color filter substrate 103 (hereinafter referred to as “upper surface substrate 103”) and an array substrate 104 (hereinafter referred to as “lower surface substrate 104”). The top substrate 103 and the array substrate 104 are bonded to each other with a slight gap therebetween.

  The top substrate 103 is formed such that a color filter layer 103a for coloring light corresponds to the pixel region of the display panel 102, as shown in FIG. The color filter layer 103a has a black matrix layer (not shown) and colored layers of red, blue and green (not shown), and each colored layer is formed in a mosaic pattern in a region partitioned by the black matrix layer. Has been. Further, the upper substrate 103 is formed with a common electrode (not shown) so as to face the pixel electrode of the lower substrate 104. The common electrode is formed to correspond to the pixel region of the display panel 102 using, for example, ITO (Indium Tin Oxido). The common electrode is integrally formed so as to cover the color filter layer 103a.

  On the other hand, as shown in FIG. 7B, the lower surface substrate 104 is formed in an array so that the pixel switching elements 104a for controlling the switching of the pixels correspond to the respective pixels in the pixel region of the display panel 102. The pixel switching element 104a is, for example, a thin film transistor (TFT), and a channel region is formed using, for example, a polycrystalline silicon semiconductor thin film. The lower substrate 104 is formed in an array so that pixel electrodes (not shown) correspond to the pixels, and the pixel electrodes face the common electrode of the upper substrate 103. The pixel electrode is made of, for example, ITO and is connected to the pixel switching element 104a.

  As shown in FIG. 5A, the mother substrate 101 has scribe lines 105 formed in a matrix at the cutting positions around each display panel 102 so as to correspond to the display panel 102. Here, as shown in FIG. B, the first scribe line 105 is formed on one surface of the upper surface substrate 103 opposite to the surface on which the upper surface substrate 103 and the lower surface substrate 104 face each other. The line 105a is cut and formed so as to be a linear groove. Further, as the scribe line 105, the second scribe line 105b is a linear groove on one surface of the lower substrate 104 that is opposite to the surface on which the upper substrate 103 and the lower substrate 104 face each other. It is cut and formed like this. The first scribe line 105 a and the second scribe line 105 b are formed to face each other at the cutting position of the mother substrate 101. And the mother board | substrate 101 is cut | disconnected for every display panel 102 by the board | substrate breaking apparatus 1 mentioned later in the cutting position in which each scribe line 105 of the 1st scribe line 105a and the 2nd scribe line 105b was formed. In the cut display panel 102, a liquid crystal layer is injected into the gap between the upper substrate 103 and the lower substrate 104 to form a liquid crystal panel.

  Next, as shown in FIGS. 2 to 4, the configuration and structure of the substrate breaker according to one embodiment of the present invention will be sequentially described.

  In FIG. 2, reference numeral 1 denotes a substrate breaker according to an embodiment of the present invention. The substrate breaker 1 includes a substrate breaker body 11 and a break bar controller 50.

  A substrate support base 21 is horizontally disposed at an intermediate portion of the substrate breaker main body 11. The substrate breaker main body 11 has an upper storage space 111A at the upper side and a lower storage at the lower side with the substrate support base 21 as a center. A space 111B is formed.

  The upper storage space 111A includes an upper break unit 30A and an upper break bar moving portion 41A in the upper storage space 111A above the substrate support 21 and a lower break unit in the lower storage space 111B below the substrate support 21. 30B, a lower break bar moving part 41B, and the like are disposed.

  The upper break bar moving unit 41A is connected to the upper break bar moving control unit 51A of the break bar control unit 50, and the upper break unit 30A is connected to the upper break detecting unit 61A of the break bar control unit 50. .

  Similarly, the lower break bar moving control unit 51B is connected to the lower break bar moving unit 41B, and the lower break detecting unit 61B of the break bar control unit 50 is connected to the lower break unit 30B.

  The substrate support 21 includes a substrate support plate 211 and a turntable 213 provided with an elastic plate 212 placed thereon. The configuration and structure of the substrate support 21 will be described later with reference to FIG.

  As shown in the schematic diagram of FIG. 5, the upper break unit 30A is provided in the center, and is centered on one upper break bar 31A having a length slightly longer than the width of the mother substrate 101 and the upper break bar 31A. The upper break bar is provided with a pair of upper substrate fixing bars 32A which are symmetrically arranged on both sides with a predetermined interval and are slightly longer than the width of the mother substrate 101. The first vibration sensor 611a for detecting the moment when the mother substrate 101 is broken and the vibration of the break are attached to 31A, and the second vibration sensor 611b is attached to the upper substrate fixing bar 32A (FIGS. 2 and 4). , They are connected to the upper break detector 61A.

  Similarly, the upper break unit 30B is provided at the center and has a single lower break bar 31B having a length slightly longer than the width of the mother substrate 101 and a predetermined interval on both sides with the lower break bar 31B as a center. The structure is provided with a pair of lower substrate fixing bars 32B which are symmetrically arranged and have a length slightly longer than the width of the mother substrate 101. The moment when the mother substrate 101 is broken on the lower break bar 31B The first vibration sensor 611a for detecting the vibration of the break and the second vibration sensor 611b are attached to the lower substrate fixing bar 32B (FIG. 2), and these are connected to the lower break detection unit 61B.

  The upper break bar moving unit 41A is composed of an upper servo motor 411A, an upper ball screw 412A, and the like. The upper break bar moving control unit 51A of the break bar control unit 50 includes an upper break bar 31A and an upper substrate fixing bar 32A. The lower break bar moving unit 41B is controlled to move up and down individually. The lower break bar moving unit 41B includes a lower servo motor 411B and a lower ball screw 412B. The lower break bar moving unit 41B is controlled by the lower break detecting unit 61B and the lower break bar moving control unit 51B. The break bar 31B and the lower substrate fixing bar 32B are controlled so as to individually move up and down, and the upper substrate 103 and the lower substrate 104 of the mother substrate 101 are fixed or broken.

  Therefore, the substrate breaker 1 according to the present invention uses the break bars 31A and 31B and the substrate fixing bars 32A and 32B that are disposed at the same position where the mother substrate 101 is vertically opposed to each other by the substrate break method according to the present invention described later. Therefore, it is possible to break almost continuously at the same time from above, from below, or from both sides.

  As shown in FIG. 3, the substrate support 21 includes a substrate support plate 211 and an elastic plate 212, and supports the mother substrate 101 that is a break target. The substrate support plate 211 is installed on a linear motor guide disposed on a horizontal surface of a surface plate (not shown), and is configured to move in the Y-axis direction as indicated by an arrow Y. Yes.

  In addition, an elongated opening 214 is opened through the central portion of the substrate support plate 211. The opening 214 has a width and a length that allow a pair of the lower substrate fixing bar 32B and the lower break bar 31B of the lower break unit 30B to sufficiently enter and exit.

  The elastic plate 212 is a laminate of two thin and rectangular elastic plates (not shown). A large number of air flow grooves 215 are formed in the elastic plate 212, and the thin elastic plate on the upper surface has a mother. A number of suction ports (not shown) are opened so that the substrate 101 can be uniformly held by suction. The elastic plate 212 is mounted on the circular turntable 213 so as to form the same horizontal surface. As a matter of course, a part of the lower surface of the elastic plate 212 is exposed at the opening 214.

  The elastic plate 212 has a thickness of about 5 mm, and a rubber-like elastic body made of urethane rubber or the like is preferably used.

  The turntable 213 provided with the elastic plate 212 is arranged in contact with the outer peripheral end surface thereof, and as indicated by an arrow R by a plurality of turn rollers 216 rotatably supported on the substrate support plate 211. In the state shown in the figure, it is pivotally supported so that it can be rotated to the left and right within an angle range of 90 degrees.

  The substrate support plate 211 provided with such an elastic plate 212 is used to place the mother substrate 101 on a surface on which the surface of the elastic plate 212 is horizontal, preferably with a thin paper (not shown) having air permeability. Then, the mother substrate 101 can be sucked and held. As will be described later, the elastic plate 212 works to relieve the placed mother substrate 101 when the upper break bar 31A or the lower break bar 31B is applied with a stress to break it. The thin paper makes it easy to peel off the mother substrate 101 that has been broken from the surface of the elastic plate 212.

  The upper break unit 30A is accommodated in the upper accommodation space 111A of the substrate breaker main body 11 as described above with reference to FIG. In addition, the break bar 31 </ b> A is formed so as to extend along the scribe line 105 of the mother substrate 101. That is, the upper break bar 31 </ b> A extends linearly in the same manner as the scribe line 105 formed on the mother substrate 101. For example, the upper break bar 31A is formed of a hard material such as plastic. Further, as shown in FIGS. 4 and 5, the upper break bar 31 </ b> A is formed in a taber shape so that one end portion on the substrate support base 21 side becomes narrower toward the substrate support base 21 side. The other end of the upper break bar 31A opposite to the substrate support 21 is coupled to the upper break bar moving part 41A as described above, and is a mother substrate supported by the substrate support 21. The upper break bar moving unit 41A moves the first direction Z1 toward the 101 and the second direction Z2 away from the mother substrate 101 supported by the substrate support 21. Then, the upper break bar 31A is moved in the first direction Z1 by the upper break bar moving unit 41A, thereby contacting and pressing the break position of the mother substrate 101 supported by the substrate support base 21 at one end, The mother substrate 101 is broken (cut).

  A pair of upper substrate fixing bars 32A formed symmetrically on both sides with the upper break bar 31A sandwiched between the upper break bar 31A are accommodated in the upper accommodating space 111A of the substrate breaker body 11. These upper substrate fixing bars 32A are formed so as to extend along the scribe line 105 of the mother substrate 101 as shown in FIG. That is, the pair of upper substrate fixing bars 32 </ b> A extends linearly in the same manner as the scribe line 105 formed on the mother substrate 101. These upper substrate fixing bars 32A are formed of, for example, a hard material such as plastic. Further, as shown in FIG. 2, these upper substrate fixing bars 32A come into contact with the mother substrate 101 which is adsorbed and held by the elastic plate 212 on the substrate support base 21, and are pressed in the first direction Z1. However, it is formed at one end of the upper break unit 30 </ b> A so as to straddle the scribe line 105. Then, these upper substrate fixing bars 32A are located in regions other than the break position of the mother substrate 101 and along the scribe line 105 of the mother substrate 101 by pressing these regions in the first direction Z1. The mother substrate 101 can be pressed and fixed.

  As shown in FIGS. 2 and 4, the upper break bar moving unit 41 </ b> A includes a servo motor 411 and a ball screw 412. As shown in FIG. 2, the servo motor 411 is fixed to the substrate breaker main body 11. The ball screw 412 is provided with an upper break bar 31A at one end on the substrate support 21 side, and the other end on the opposite side to the substrate support 21 is connected to the servo motor 411. In the upper break bar moving part 41A, the servo motor 411 rotates the ball screw 412 to move the upper break bar 31A in the vertical direction. Specifically, the upper break bar moving unit 41A has a first direction Z1 toward the mother substrate 101 supported by the substrate support 21 and a second direction Z2 away from the mother substrate 101 supported by the substrate support 21. Then, the upper break bar 31A is moved. Further, as shown in FIG. 2, the upper break bar moving unit 41A is connected to the upper break bar moving control unit 51A, and the upper break bar moving control unit 51A controls the moving operation of the upper break bar 31A. The

  The upper break bar moving control unit 51A controls the moving operation of the upper break bar moving unit 41A. The upper break bar movement control unit 51A includes a computer and a program that causes the computer to function as the above-described means. The upper break bar movement control unit 51A is connected to the upper break detection unit 61A. When the upper break bar 31A is moved in the first direction Z1 by the upper break bar moving unit 41A, the mother substrate 101 is broken. Based on the break information of the mother substrate 101 detected by the upper break detection unit 61A, the moving operation of the upper break bar moving unit 41A is controlled. Specifically, the upper break bar movement control unit 51A receives the break data S, which is break information of the mother substrate 101 detected by the upper break detection unit 61A, at the time when the mother substrate 101 is broken. Correspondingly, the moving direction of the upper break bar 31A from the first direction Z1 to the second direction Z2 is switched to the upper break bar moving unit 41A.

  The upper break detection unit 61A moves in the first direction Z1 and detects a break of the mother substrate 101 that is cut at the break position by the upper break bar 31A that presses the break position of the mother substrate 101.

  In FIG. 4, the upper break unit 30A, the upper break bar moving unit 41A, the upper break bar moving control unit 51A, the upper break detecting unit 61A, and the elastic plate 212 with respect to the mother substrate 101 placed and fixed on the substrate support 21 are shown. Although only the lower break unit 30B composed of the lower break bar 31B and the pair of lower substrate fixing bars 32B disposed below is shown, the lower break bar detection unit is not shown in the illustrated lower break unit 30B. 61B is connected, and a lower break bar moving control unit 51B for controlling the lower break unit 30B is also arranged vertically symmetrically. A lower break bar moving unit 41B for controlling the lower break unit 30B, a lower break The configuration and operation of the bar movement control unit 51B and the lower break detection unit 61B are the same. Construction, since the operation, although omitted in FIG. 4, and taken up only the upper portion indicated by symbols including the suffixes A in FIG. 2 will be described below.

  In FIG. 4, the upper break bar 31A of the upper break unit 30A is pressurized along the scribe line 105a of the upper surface substrate 103, and the pair of lower substrate fixing bars 32B of the lower break unit 30B are connected to the scribe lines 105a and 105b. In this example, the lower surface of the elastic plate 212 is supported so as to straddle and the lower substrate 104 is broken along the scribe line 105b by the upper break bar 31A. Further, only one servo motor 411A and one ball screw 412A are shown.

  As shown in FIG. 4, the upper break detector 61A includes a first vibration sensor 611a, a second vibration sensor 611b, an amplifier 612, an A / D converter 613, and a vibration calculator 614. Therefore, the break of the mother substrate 101 is detected based on the time change of the vibration of the mother substrate 101. The upper break detection unit 61A includes first vibration data V1 detected by the vibration of the upper break bar 31A detected by the first vibration sensor 611a and first vibration data detected by the vibration of the upper substrate fixing bar 32A detected by the second vibration sensor 611b. The break of the mother board 101 is detected based on the time change of the difference data D from the second vibration data V2. Each unit of the upper break detection unit 61A will be described.

  The first vibration sensor 611a is provided on the upper break bar 31A and detects vibration of the upper break bar 31A. The first vibration sensor 611a is, for example, a contact type and piezoelectric element type acceleration pickup sensor, and detects vibration by measuring the acceleration of the upper break bar 31A. For example, an acceleration pickup sensor that outputs a DC voltage of 2 V with respect to an acceleration of 0.318 m / s 2 is used. Then, the first vibration sensor 611a outputs the first vibration data V1 based on the detected vibration to the amplifier 612 as an analog signal.

  On the other hand, the second vibration sensor 611b is provided on the upper substrate fixing bar 32A and detects the vibration of the upper substrate fixing bar 32A. Similar to the first vibration sensor 611a, the second vibration sensor 611b is an acceleration pickup sensor, and detects vibration by measuring the acceleration of the upper substrate fixing bar 32A. The second vibration sensor 611b outputs the second vibration data V2 based on the detected vibration to the amplifier 612 as an analog signal.

  The amplifier 612 is connected to each of the first vibration sensor 611a and the second vibration sensor 611b. The amplifier 612 receives analog signals of the first vibration data V1 and the second vibration data V2 from the first vibration sensor 611a and the second vibration sensor 611b, respectively. Then, the amplifier 612 processes each of the first vibration data V1 and the second vibration data V2, generates difference data D of the analog signal, and outputs the difference data D to the A / D converter 613. . That is, the amplifier 612 performs a difference between the first vibration data V1 and the second vibration data V2 as the vibration DC voltage, and the difference data D as the relative vibration DC voltage is input to the A / D converter 613 as an analog signal. Output.

  The A / D converter 613 is connected to the amplifier 612, and the difference data D generated by the amplifier 612 is input as an analog signal. The A / D converter 613 converts the difference data D, which is an analog signal, into a digital signal and outputs the digital signal to the vibration calculator 614.

  The vibration calculator 614 is connected to the A / D converter 613, and the difference data D converted into a digital signal by the A / D converter 613 is input. Then, the vibration calculator 614 generates a break data S indicating a break timing of the mother board 101 by performing an operation comparison process with the difference data D and the comparison data H set in advance and stored. For example, the vibration computing unit 614 stores comparison data H in which the relative vibration DC voltage value at the moment of the break is 4 V or more, and the difference data D from the A / D converter 613 is the relative vibration DC voltage. When the value is 4V or more, it is determined that the mother board 101 has been broken, and break data S indicating the break timing of the mother board 101 is generated. Then, the vibration calculator 614 outputs the break data S to the upper break bar movement control unit 51A, and from the first direction Z1 to the upper break bar movement control unit 51A corresponding to the time when the mother substrate 101 is broken. The moving operation of the upper break bar moving unit 41A is controlled so as to switch the moving direction of the upper break bar 31A toward the second direction Z2.

  As described above, the configuration and operation of the upper break unit 30A, the upper break bar moving unit 41A, the upper break bar moving control unit 51A, and the upper break detecting unit 61A are the same as the lower break unit 30B and the lower break bar moving unit 41B. The same applies to the lower break bar movement control unit 51B and the lower break detection unit 61B. For example, the lower break bar 31B of the lower break unit 30B of the lower part is the upper break bar of the upper break unit 30A of the upper part. The vibration when 31A is activated to break the lower substrate 104 of the mother substrate 101 is transmitted to the first vibration sensor and the second vibration sensor disposed in the lower break unit 30B, and the first vibration data V1 and The amplifier 6 disposed in the lower break detection unit 61B with the second vibration data V2 2, the break data S is generated by the A / D converter 613 and the vibration calculator 614 as described above, and the lower break bar 31B is operated to move the upper substrate 103 of the mother substrate 101 to a predetermined first scribe line. Pressurize along 105a. At that time, the pair of upper substrate fixing bars 32A of the upper break unit 30A is controlled by the upper break bar movement control unit 51A, and supports the upper substrate 103 across the scribe line 105a. Therefore, the upper substrate 103 is bent in an inverted V shape by applying a load higher than the stress to the mother substrate 101 via the elastic plate 212 by the lower break unit 30B, and is broken along the scribe line 105a. .

  FIG. 6 is a side view showing a state in which the lower substrate 104 of the mother substrate 101 is broken. When the lower substrate 104 is broken, for example, the upper break bar 31A in the first direction Z1 is placed on the upper substrate 103. By moving from above and supporting the pair of lower substrate fixing bars 32B from below the elastic plate 212, the scribe line 105a to be broken from the upper substrate 103 side of the mother substrate 101 is pressurized. And by this pressurization, the break is extended from the scribe line 105b formed on the lower substrate 104, and the lower substrate 104 is broken into two.

  At this time, the upper break detection unit 61A detects the break of the lower substrate 104, which is broken at the break position of the mother substrate 101, by the upper break bar 31A moving in the first direction Z1.

  In the present embodiment, the upper break detection unit 61 </ b> A detects the break of the mother substrate 101 based on the time change of the vibration of the mother substrate 101. Specifically, the first vibration data V1 of the upper break bar 31A detected by the first vibration sensor 611a and the second vibration data V2 of the upper substrate fixing bar 32A detected by the second vibration sensor 611b. Based on the time change of the difference data D, the upper break detector 61A detects a break of the mother board 101.

  Here, the first vibration sensor 611a of the upper break detector 61A detects the vibration of the upper break bar 31A, and outputs the first vibration data V1 to the amplifier 612 as an analog signal. Further, the second vibration sensor 611b of the upper break detection unit 61A detects the vibration of the pair of substrate fixing bars 32A, and outputs the second vibration data V2 to the amplifier 612 as an analog signal. Thereafter, the amplifier 612 generates difference data D between the first vibration data V1 and the second vibration data V2, and outputs the difference data D to the A / D converter 613.

  FIG. 7 is a waveform diagram showing the first vibration data V1, the second vibration data V2, and the difference data D. 7A is a waveform diagram when the upper break bar 31A and the upper substrate fixing bar 32A receive vibration due to disturbance, and FIG. 7B is a waveform diagram when the upper break bar 31A receives vibration. FIG. 8C is a waveform diagram when the upper substrate fixing bar 32A receives vibration.

  In each of FIGS. 7A and 7B, the horizontal axis indicates time, and the vertical axis indicates the voltage value. In the vertical axis, the origins of the first vibration data V1, the second vibration data V2, and the difference data D are different. From above, the first vibration data V1, the second vibration data V2, and the difference data D are shown in this order.

  As shown in FIG. 7A, when both the upper break bar 31A and the upper substrate fixing bar 32A receive vibration due to disturbance, the upper break bar 31A and the upper substrate fixing bar 32A vibrate similarly. Therefore, the first vibration data V1 of the upper break bar 31A detected by the first vibration sensor 611a and the second vibration data V2 of the upper substrate fixing bar 32A detected by the second vibration sensor 611b are similar to each other. Output in waveform. The difference data D between the first vibration data V1 and the second vibration data V2 is output from the amplifier 612 so that it does not change over time regardless of the presence or absence of vibration due to disturbance. That is, when receiving vibration due to disturbance instead of vibration due to the break of the mother board 101, the amplifier 612 does not change the difference data D between the first vibration data V1 and the second vibration data V2. Is output from.

  Further, as shown in FIG. 7B, when the upper break bar 31A receives vibration, the first vibration data V1 of the upper break bar 31A detected by the first vibration sensor 611a and the second vibration sensor 611b are detected. The second vibration data V <b> 2 of the upper substrate fixing bar 32 </ b> A is output with a waveform different from each other. The difference data D between the first vibration data V1 and the second vibration data V2 is output from the amplifier 612 so as to change over time according to the vibration of the upper break bar 31A. That is, when the vibration due to the break of the mother substrate 101 is received, the first vibration data V1 and the second vibration data V2 are different, so that the difference data D is output from the amplifier 612 so as to change over time.

  Further, as shown in FIG. 7C, when the upper substrate fixing bar 32A receives vibration, the upper break bar 31A detected by the first vibration sensor 611a is the same as when the upper break bar 31A receives vibration. The first vibration data V1 and the second vibration data V2 of the upper substrate fixing bar 32A detected by the second vibration sensor 611b are output in different waveforms. The difference data D between the first vibration data V1 and the second vibration data V2 is output from the amplifier 612 so as to change over time according to the vibration of the upper break bar 31A. That is, when the vibration due to the break of the mother substrate 101 is received, the first vibration data V1 and the second vibration data V2 are different, and therefore the difference data D is output from the amplifier 612 so as to change with time.

  In this way, the amplifier 612 outputs the difference data D to the A / D converter 613. Then, the A / D converter 613 converts the difference data D, which is an analog signal, into a digital signal and outputs it to the vibration calculator 614.

  Then, the vibration calculator 614 performs a comparison calculation process on the difference data D and the comparison data H set and stored in advance, and generates break data S indicating the break timing of the mother substrate 101. For example, the vibration calculator 614 compares the comparison data H that the relative vibration DC voltage value at the moment of the break is 4 V or more and the difference data D that is output from the A / D converter 613 in real time with respect to the break operation. Are compared. Then, when the difference data D indicates the relative vibration DC voltage value 4V or more which is the comparison data H, the break data S indicating the break timing of the mother substrate 101 is generated.

  Next, the movement of the upper break bar 31A in the second direction Z2 is switched.

  At this moment, based on the break information of the mother substrate 101 detected by the upper break detection unit 61A as described above, corresponding to the time when the lower substrate 104 of the mother substrate 101 is broken (FIG. 6), From one direction Z1, the upper break bar moving portion 41A switches so that the upper break bar 31A moves upward in the second direction Z2 away from the mother substrate 101, and the upper substrate fixing bar 32A moves downward toward the mother substrate 101. As described above, the upper break bar moving control unit 51A controls the upper break bar moving unit 41A.

  The broken vibration is transmitted to the first vibration sensor 611a and the second vibration sensor 611b of the lower break unit 30B so that the lower substrate fixing bar 32B is separated downward from the elastic plate 212, and the lower substrate fixing bar 32B is elastic. The lower break bar moving control unit 51B controls the lower break bar moving unit 41B so that the lower break bar moving unit 41B switches so as to move upward toward the plate 212.

  FIG. 8 shows position data P indicating the vertical position of the upper break bar 31A moved by the upper break bar moving unit 41A controlled by the upper break bar movement control unit 51A, the first vibration data V1, and the second vibration data. It is a wave form diagram which shows difference data D with V2. In FIG. 8, the horizontal axis represents time. On the other hand, in FIG. 8, the vertical line indicates the vertical position of the position data P that has advanced from the initial position P0 to the first direction Z1, and the difference data D indicates the voltage value.

  As shown in FIG. 8, the upper break bar moves between time t0 when the upper break bar 31A starts moving and time t1 when the voltage value of the difference data D becomes equal to or higher than the comparison voltage value of the comparison data H. The controller 51A causes the upper break bar moving unit 41A to move the upper break bar 31A from the initial position P0 in the first direction Z1. For example, the upper break bar 31A is moved at a speed of 1000 μm / sec.

  Then, at the time t1 when the voltage value of the difference data D becomes equal to or higher than the comparison voltage value of the comparison data H, the upper break bar movement control unit 51A receives the break data S output from the vibration calculator 614, The break bar moving unit 41A switches the movement direction of the upper break bar 31A from the first direction Z1 to the second direction Z2. Here, the switching of the movement is completed so that the overstroke amount in the first direction Z1 becomes 12 μm after 12 msec from the moment of the break. The overstroke amount is preferably 50 μm or less.

  Then, the upper break bar 31A is advanced in the second direction Z2 and moved from the switching position PK to the initial position P0. For example, the upper break bar 31A is moved at a speed of 15 mm / sec.

  In this way, the lower substrate 104 of the mother substrate 101 is pressurized and broken.

  As described above, in the example illustrated in FIG. 6, the scribe lines 105 a and 105 b are formed, and the scribe line of the mother substrate 101 that is adsorbed and held on the elastic plate 212 that covers the opening 214 of the substrate support base 21. The upper break bar 31A is brought into contact along the line 101, and the pressure is applied while being supported by the lower substrate fixing bar 32B from below the elastic plate 212, thereby breaking along the scribe line 105b of the lower substrate 104 of the mother substrate 101. To do. Here, the upper break bar moving control unit 51A controls the moving operation of the upper break bar moving unit 41A and moves the upper break bar 31A up in the first direction Z1 toward the mother substrate 101 attracted and held by the elastic plate 212. The break bar moving unit 41A moves. On the other hand, the lower break bar movement control unit 51B controls the movement operation of the lower break bar moving unit 41B, and moves the lower substrate fixing bar 32B to the lower surface of the elastic plate 212.

  In this state, the upper break bar 31A is pressed along the scribe line 105a of the upper surface substrate 103 of the mother substrate 101, and the mother substrate 101 is bent into a V shape to break. At this time, the break detection unit 81 detects the break of the upper surface substrate 103 by the upper break bar 31A moving in the first direction Z1. Thereafter, the upper break bar movement control unit 51A moves away from the mother substrate 101 in accordance with the time when the lower substrate 104 is broken based on the break information of the lower substrate 104 detected by the upper break detector 61A. The upper break bar moving unit 41A is controlled so as to switch the moving direction of the upper break bar 31A to the second direction Z2, and the moving direction is changed downward so that the upper substrate fixing bar 32A supports the upper surface substrate 103 of the mother substrate 101. The upper break bar moving unit 41A is controlled so as to switch, and the lower break bar moving unit 41B is controlled so that the lower substrate fixing bar 32B switches the moving direction downward from the elastic plate 212 almost simultaneously, and the lower break unit 30B is raised. The lower break bar moving unit 41B is controlled as described above.

  When the upper break bar 31A is pressed through the elastic plate 212 while the upper substrate 103 is supported by the lower substrate fixing bar 32B, the mother substrate 101 is bent in an inverted V shape so that the upper substrate 103 follows the scribe line 105a. Break. In this manner, each display panel 102 having a small area can be obtained from the mother substrate 101.

  Thereafter, liquid crystal (not shown) is injected between the upper substrate 103 and the lower substrate 104 of the mother substrate 101 that is broken for each display panel 102, and the liquid crystal layer is aligned to form a liquid crystal panel. Then, a driving circuit, a light plate, a backlight, and the like are mounted to complete the display device.

  Next, various substrate breaking methods for breaking the upper and lower substrates 103 and 104 of the mother substrate 101 using the substrate breaking apparatus 1 of the present invention shown in FIGS. 2 to 5 will be described below. As shown, the substrate support 21 of the substrate breaker 1, the upper break bar 31A and the upper substrate fixing bar 32A of the upper break unit 30A, the lower break bar 31B and the lower substrate of the lower break unit 30B are shown in order to simplify the drawing. Only the main part of the fixing bar 32B and the mother substrate 101 will be described. Since the control of the upper break bar 31A and the lower break bar 31B, the upper substrate fixing bar 32A, and the lower substrate fixing bar 32B with respect to the mother substrate 101 is performed by the combination of the control described with reference to FIGS. In the explanation of the substrate breaking method, explanation of these control methods is omitted.

  As described above, the substrate break method of the present invention is characterized by using the upper break unit 30A from the upper side and the lower break unit 30B from the lower side at the same position on the upper substrate 103 and the lower substrate 104 of the mother substrate 101. Using both the upper and lower substrates 103 and 104, the upper substrate 103 alone or the lower substrate 104 alone, and the upper and lower substrates 103 and 104 are instantaneously broken without inverting the mother substrate 101. There is a point that can be done.

  Next, the first substrate breaking method of the present invention will be described with reference to FIGS. In this first substrate breaking method, the upper break bar 31A and the lower break bar 31B are used to apply a load higher than the stress of the mother substrate 101, and the upper substrate is fixed to the upper substrate fixing bar 32B and the pair of lower substrate fixing bars 32B. 103 or the lower substrate 104, and the upper substrate 103 and the lower substrate 104 are broken.

  That is, in the first substrate breaking method, the upper break bar 31A and the lower break bar 31B are applied to the mother substrate 101 with a load higher than the stress applied thereto and are pressed to press the upper break bar 31A and the lower break bar 31B. Is a way to break.

  First, as shown in FIG. 9A, the scribe lines 105a and 105b to which the mother substrate 101 is to break are aligned with the placement surface of the elastic plate 212 at the center of the opening 214 (FIG. 3) of the substrate support plate 211. Then, the elastic plate 212 is attached and held (FIG. 9A).

  In order to break the lower substrate 104 of the mother substrate 101 in this state, as shown in FIG. 9B, the lower break bar moving unit 41B and the like are operated to elastically move the pair of lower substrate fixing bars 32B of the lower break unit 30B. Move to a pre-taught position below the plate 212. This position is a support position when the lower substrate 104 is broken. In a state where the pair of lower substrate fixing bars 32B stand by at the support position, the upper break bar moving unit 41A and the like are operated to lower the upper break bar 31A of the upper break unit 30A, and the upper substrate 103 of the mother substrate 101 is lowered. For example, the upper break bar 31A abuts along all the scribe lines 105a in the row direction, and the upper break bar 31A applies a load more than stress to the mother substrate 101 to pressurize it.

  The alignment between the scribe lines 105a and 105b and the upper and lower break bars 31A and 31B was invented by the present inventor and filed on June 16, 2004 by the present inventor (patent application number 2004-17834 “substrate”). This is done using the “break method”.

  As a result of the above operation, the mother substrate 101 is bent in a square shape around the upper break bar 31A, and the lower substrate 104 that is further bent is broken along the scribe lines 105b in the column direction.

  Next, the turntable 213 on which the mother substrate 101 shown in FIG. 3 is placed is rotated 90 degrees to break the lower surface substrate 104 along all the scribe lines 105a and 105b in the column direction. In the following description, the operation of rotating the turntable 213 to break along the row and column scribe lines 105a and 105b is naturally performed, and the description thereof is omitted.

  The break of the upper surface substrate 103 of the mother substrate 101 is performed by causing the upper break bar moving unit 41A, the lower break bar moving unit 41B, and the like to operate in the opposite direction to the operation when the lower surface substrate 104 is broken.

  That is, as shown in FIG. 10, the breaking operation procedure is such that the elastic plate 212 that sucks and holds the mother substrate 101 with the lower surface substrate 104 broken along the scribe line 105b returns to the horizontal state. In the state (FIG. A), as shown in FIG. B, the pair of upper substrate fixing bars 32A are moved to the previously taught position across the scribe line 105a by operating and lowering the upper break bar moving part 41A and the like. Then, in a state of waiting at that position, the lower break bar moving part 41B and the like are operated to raise the lower break bar 31B, and the mother substrate 101 is centered on the lower break bar 31B via the elastic plate 212. A load equal to or higher than the stress is applied so as to be bent upward in a reverse square shape. By this operation, the upper surface substrate 103 breaks along the scribe line 105a.

  Through the steps described above, the mother substrate 101 can instantaneously break from the lower surface substrate 104 to the upper surface substrate 103 at the same vertical position.

  The time difference in which the upper break bar 31A breaks the lower surface substrate 104 of the mother substrate 101 and the lower break bar 31B breaks the upper surface substrate 103 of the mother substrate 101 is about 200 mSec or less, and this time difference is extremely high. Accordingly, the breaks of the upper and lower substrates are performed in an instant so that it is not an exaggeration to say that the breaks of the upper and lower substrates are performed almost simultaneously at the same position in the vertical direction from the lower surface substrate 104 side to the upper surface substrate 103 side.

  On the other hand, the breaks of the upper and lower substrates are performed in an instant so that the breaks are performed almost simultaneously at the same position in the same manner from the upper surface substrate 103 side to the lower surface substrate 104 side.

  Thereafter, a liquid crystal layer (not shown) is injected into the gap between the upper substrate 103 and the lower substrate 104 of the mother substrate 101 that is broken for each broken display panel 102 (FIG. 1). Are aligned to form a liquid crystal panel. Then, a display device can be completed by mounting a driving circuit, a light guide plate, a backlight, and the like.

  Next, the second substrate breaking method of the present invention will be described with reference to FIGS.

  In this second substrate breaking method, the upper break bar 31A and the lower break bar 31B support the lower substrate 104 via the upper substrate 103 or the elastic plate 212, while the pair of upper substrate fixing bars 32A and the pair of lower substrate fixing bars. This is a method of breaking the upper surface substrate 103 and the lower surface substrate 104 by applying 32B to the mother substrate 101 by applying a load equal to or greater than its stress.

  First, as shown in FIG. 11A, the scribe lines 105a and 105b to which the mother substrate 101 is to break are aligned with the mounting surface of the elastic plate 212 at the center of the opening 214 (FIG. 3) of the substrate support plate 211. And is adsorbed and held by the elastic plate 212.

  In order to break the lower substrate 104 of the mother substrate 101 in this state, as shown in FIG. 11B, the upper break bar moving unit 41A or the like is operated, and the upper break bar 31A of the upper break unit 30A is moved in advance of the scribe line 105a. Move to the taught position. This position is a support position when the lower substrate 104 is broken.

  Next, the pair of lower substrate fixing bars 32 </ b> B of the lower break unit 30 </ b> B is raised, and a load equal to or greater than stress is applied to the lower surface substrate 104 via the elastic plate 212.

  By this operation, the mother substrate 101 is bent upward in the shape of a square around the upper break bar 31A, and the lower substrate 104 that is further bent is broken along the scribe line 105b.

  Subsequently, the break of the upper substrate 103 of the mother substrate 101 is performed by causing the upper break bar moving unit 41A and the lower break bar moving unit 41B to operate in the opposite direction to the operation when the lower substrate 104 is broken. it can.

  That is, as shown in FIG. 12A, the scribe lines 105a and 105b to which the mother substrate 101 is to break are aligned with the mounting surface of the elastic plate 212 at the center of the opening 214 (FIG. 3) of the substrate support plate 211. And is adsorbed and held by the elastic plate 212.

  Next, in a state where the mother substrate 101 is attracted and held on the elastic plate 212 as described above, as shown in FIG. B, the lower break bar moving unit 41B and the like are operated to lower the lower break unit 30B. After the break bar 31B is moved to the pre-taught position on the scribe line 105b and then waiting at that position, the upper break bar moving unit 41A and the like are operated to operate a pair of upper substrate fixing bars of the upper break unit 30A. 32A is lowered, and the mother substrate 101 is pressurized by applying a load greater than the stress so that the mother substrate 101 bends upward in the shape of an inverted character centering on the lower break bar 31B. By this operation, the upper surface substrate 103 breaks along the scribe line 105a.

  Through the above steps, the upper substrate fixing bar 32A and the lower substrate fixing bar 32B are operated, and the upper substrate 103 and the lower substrate 104 of the mother substrate 101 can be instantaneously broken at the same vertical position.

  Next, a method of instantaneously breaking the upper and lower substrates 103 and 104 of the mother substrate 101 at the same vertical position using the first substrate breaking method and the second substrate breaking method will be described with reference to FIGS. explain.

  First, using FIG. 13 and FIG. 14, the mother substrate 101 is instantaneously broken from the lower substrate 104 to the upper substrate 103 by using the upper and lower break bars for pressurization and the substrate fixing bar for supporting the mother substrate 101. A third substrate breaking method of the present invention will be described.

  First, the mother substrate 101 is placed on the placement surface of the elastic plate 212 on the substrate support 21 with the upper surface substrate 103 of the mother substrate 101 carried into the substrate breaker 1 of the present invention facing upward, and is sucked and held. (Step S1).

  Next, as shown in FIG. A, a predetermined number of scribe lines 105a and 105b of upper and lower upper and lower break bars 31A and 31B formed in advance on both upper and lower surfaces of the mother substrate 101 in that state. First, the lower substrate 104 of the mother substrate 101 in that state is broken.

  For this purpose, as shown in FIG. B, the lower break bar moving unit 41B and the like are operated to move the pair of lower substrate fixing bars 32B to the pre-taught position below the elastic plate 212. This position is a support position when the lower substrate 104 is broken (step S2). Subsequently, the upper break bar moving unit 41A and the like are operated to lower the break bar 31A onto the scribe line 105a of the upper break unit 30A, and pressurize the mother substrate 101 by applying a load greater than stress. By this operation, the mother substrate 101 is bent in a square shape around the upper break bar 31A, a vertical crack grows along the scribe line 105b of the lower substrate 104 that is further bent, and the lower substrate 104 is broken ( Step S3).

  Next, as shown in FIG. 3C, the upper break bar moving unit 41A and the lower break bar moving unit 41B are operated in reverse, so that the upper substrate fixing bar 32A is elastically moved from the upper surface substrate 103 and the lower break bar 31B is elastically moved. Retreat from the plate 212 to the previously taught position.

  Then, the elastic plate 212 bounces by its own elasticity, and immediately passes through the horizontal state of FIG. C, and the elastic plate 212 is bent upward in an inverted V shape (not shown).

  Then, as shown in FIG. 4D, the first vibration sensor 611a and the second vibration sensor 611b detect the vibration at the moment of the break (step S4), and the upper break detector 61A and the upper break bar movement controller Under the control of 51A, the upper break bar moving unit 41A is operated to switch the upper break bar 31A to the upward movement, while the lower break bar is below the lower break detecting unit 61B and the lower break bar moving control unit 51B. The moving part 41B is switched in the downward direction, and the lower substrate fixing bar 32B is fixed to the lower surface of the elastic plate 212 (steps S5 and S6).

  The break of the upper substrate 103 of the mother substrate 101 breaks by causing the upper break bar moving unit 41A, the lower break bar moving unit 41B, and the like to perform an operation in the opposite direction to the operation when the lower substrate 104 is broken.

  That is, as shown in FIG. 13D, the elastic plate 212 that sucks and holds the mother substrate 101 in a state where the lower surface substrate 104 is broken along the scribe line 105b, and the upper break bar 31A is separated from the upper surface substrate 103. The upper substrate fixing bar 32A of the upper break unit 30A is lowered to the previously taught position at the same time, and at the same time, the upper substrate fixing bar which is stopped at the above position at the bounce when the elastic plate 212 tries to return to the horizontal state. Bounce up to the position of 32A or below (step S7), and simultaneously the lower break bar moving part 41B and the like operate to raise the lower break bar 31B, along the scribe line 105b via the elastic plate 212 The mother board 101 is bent in an upside down shape around the lower break bar 31B. Pressurizing the load exceeding the stress as (step S8). By this operation, the upper surface substrate 103 grows and breaks along the scribe line 105a.

  Next, the first vibration sensor 611a and the second vibration sensor 611b detect the momentary vibration when the upper surface substrate 103 is broken along the scribe line 105a (step S9), and as shown in FIG. Under the control of the detection unit 61A and the upper break bar movement control unit 51A, the upper break bar moving unit 41A is operated to switch the upper substrate fixing bar 32A to move in the upward direction, while the lower break detection unit 61B and the lower Under the control of the break bar movement control unit 51B, the lower break bar moving unit 41B is switched in the downward direction, the pressing of the lower break bar 31B against the lower surface of the elastic plate 212 is released (step S10), and the upper break unit 30A and the lower The break unit 30B is retracted to a previously taught position (step S11).

  When the pressing of the upper substrate fixing bar 32A and the lower break bar 31B is released, the elastic plate 212 instantaneously bounces slightly, but finally becomes the original horizontal state as shown in FIG. S12).

  Through the above process, the mother substrate 101 can be instantaneously broken from the lower surface substrate 104 to the upper surface substrate 103 at the same vertical position.

  Next, FIG. 15 shows a substrate breaking method according to a fourth embodiment of the present invention in which the mother substrate 101 is instantaneously broken from the upper surface substrate 103 to the lower surface substrate 104 using the first substrate breaking method and the second substrate breaking method. It explains using.

  First, as shown in FIG. 3A, the mother substrate is placed on the mounting surface of the elastic plate 212 on the substrate support 21 with the upper surface substrate 103 of the mother substrate 101 carried into the substrate breaker 1 of the present invention facing upward. 101 is placed, adsorbed and held.

  Next, as shown in FIG. B, positions of predetermined scribe lines 105a and 105b and upper and lower break bars 31A and 31B of a large number of scribe lines formed in advance on both upper and lower surfaces of the mother substrate 101 in that state. First, the upper surface substrate 103 of the mother substrate 101 in this state is broken.

  For this purpose, as shown in FIG. B, the upper break bar moving unit 41A and the like are operated to lower the pair of upper break bars 31A to the positions taught in advance. This position is a support position when the upper surface substrate 103 is broken. Subsequently, the lower break bar moving unit 41B and the like are operated to raise the lower break bar 31B of the lower break unit 30B, and a load higher than stress is applied to the mother substrate 101 to pressurize it. By this operation, the mother substrate 101 is bent upward in the shape of an inverted character centering on the lower break bar 31B, and the upper substrate 103 that is further bent is broken by a vertical crack growing along the scribe line 105a.

  Next, as shown in FIG. 6C, the first vibration sensor 611a and the second vibration sensor 611b detect the moment of the break, and are controlled by the upper break detector 61A and the upper break bar movement controller 51A. As described above, the upper break bar moving unit 41A, the lower break bar moving unit 41B and the like are operated in reverse, and the upper substrate fixing bar 32A is taught from the upper substrate 103 and the lower break bar 31B is taught from the elastic plate 212 in advance. Retract to position.

  Then, the elastic plate 212 bounces by its own elasticity, and the elastic plate 212 is bent upward in a V shape as shown in FIG. In this state, the upper break bar 31A is lowered, the lower substrate fixing bar 32B is raised, a load higher than the stress of the mother substrate 101 is applied to the lower surface of the elastic plate 212, and the elastic plate 212 and the mother substrate 101 are moved upward. The lower surface substrate 104 is bent in a square shape around the break bar 31A, and the lower substrate 104 that is further bent is broken by a vertical crack growing along the scribe line 105b.

  Then, the first vibration sensor 611a and the second vibration sensor 611b detect the vibration at the moment of the break, and the upper break bar moving unit 41A is under the control of the upper break detecting unit 61A and the upper break bar moving control unit 51A. In operation, the upper break bar 31A switches the movement in the upward direction, while the lower break bar moving part 41B operates below the lower break detection part 61B and the upper break bar movement control part 51A to switch to the lowering direction. The lower substrate fixing bar 32B with respect to the lower surface of the plate 212 is lowered to release the fixing.

  The break of the lower substrate 104 of the mother substrate 101 is broken by causing the upper break bar moving unit 41A, the lower break bar moving unit 41B, and the like to operate in the opposite direction to the operation when the upper substrate 103 is broken.

  The elastic plate 212 that sucks and holds the mother substrate 101 in a state where the lower substrate 104 is broken along the scribe line 105b is moved under the lower break unit 30B at the same time as the upper break bar 31A moves away from the upper substrate 103. The substrate fixing bar 32B descends to a previously taught position, and at the same time, jumps to a position below the upper break bar 31A that stops at the above position at the bounce when the elastic plate 212 tries to return to the horizontal state, and then As shown in FIG. E, the elastic plate 212 and the mother substrate 101 return to the horizontal state.

  Through the above process, the mother substrate 101 can be instantaneously broken from the upper surface substrate 103 to the lower surface substrate 104 at the same vertical position.

  The breaking method of the upper substrate 103 and the lower substrate 104 by the first substrate breaking method and the first substrate breaking method can be used in any combination according to the breaking conditions of the brittle material substrate of the upper substrate 103 and the lower substrate 104. It is possible to build a break process flexibly.

  In both of these substrate breaking methods, the same applies to the step of breaking by applying a load, but the difference is due to the transmission of pressure and the displacement of the mother substrate 101 generated at that time.

  That is, in the process D of FIG. 15, since the downward load by the upper break bar 31A is directly transmitted to the upper surface substrate 103, the amount of displacement of the downward mother substrate 101 generated through the elastic plate 212 is small. . On the other hand, in the process D of FIG. 13, since the upward load from the lower break bar 31B is transmitted to the lower surface substrate 104 via the elastic plate 212, the amount of displacement of the mother substrate 101 generated upward is increased. .

  Due to this difference, at the time of the break end operation, there is a difference in the bounce amount and time according to the displacement amount generated at the time of the break. This difference greatly affects the interference between the break surfaces, and appears as damage such as cracks and chips.

  It seems that it is effective to break the lower substrate 104 after breaking the upper substrate 103 as a break process hardly affected by this. Therefore, the substrate breaking method of the fourth embodiment is more effective than the third embodiment. There is an advantage over the example substrate break method.

  Next, the fifth substrate breaking method of the present invention will be described with reference to FIG. This fifth substrate breaking method is also a method for obtaining a large number of display panels having a small area by breaking the upper and lower surfaces of the mother substrate 101 without inverting the mother substrate 101 by using the substrate breaking device 1 of the present invention. As an example, the feature is that the upper substrate fixing bar 32 </ b> A and the lower substrate fixing bar 32 </ b> B are used to apply a load higher than stress to the mother substrate 101 and pressurize it, and the upper break bar 31 </ b> A and the lower break bar 31 </ b> B It is used for support.

  First, as shown in FIG. 1A, the mother substrate 101 is placed on the placement surface of the elastic plate 212 with the upper surface substrate 103 of the mother substrate 101 carried into the substrate breaker 1 of the present invention facing upward. Adsorb and hold.

  Next, as shown in FIG. 5B, the upper substrate fixing bar 32A is brought into contact with a predetermined scribe line 105a of a large number of scribe lines formed in advance on the upper surface substrate 103 of the mother substrate 101 in that state. On the other hand, the lower break bar 31A is brought into contact with the lower surface of the elastic plate 212 corresponding to the position of the scribe line 105b of the lower substrate 104, and the upper substrate fixing bar 32A is lowered in this state so as to exceed the stress on the mother substrate 101. Apply load and pressurize. By this operation, the mother substrate 101 is bent upward in the shape of an inverted character centering on the lower break bar 31B, and a vertical crack grows along the scribe line 105a on the upper substrate 103 that is further bent, so that the upper substrate 103 is broken. Is done.

  Next, after the upper surface substrate 103 is broken, the upper substrate fixing bar 32A is raised from the upper surface substrate 103, the lower break bar 31B is lowered from the elastic plate 212, and each elastic plate is retracted to a previously taught position. 212 and the mother substrate 101 are instantaneously horizontal as shown in FIG. 3C, and then bent into a V shape as shown in FIG.

  In this state, the upper break bar 31A is lowered along the scribe line 105a of the upper substrate 103, while the lower substrate fixing bar 32B is raised, and a load higher than the stress of the mother substrate 101 is applied to the lower surface of the elastic plate 212, When the pressure is applied, the elastic plate 212 and the mother substrate 101 are bent in a square shape around the upper break bar 31A, and the lower substrate 104, which is further bent, is broken by a vertical crack growing along the scribe line 105b. .

  When the break occurs in this manner, as shown in FIG. E, the upper break bar 31A is raised, while the lower substrate fixing bar 32B is lowered and retracted to the previously taught position. 212 and the mother substrate 101 are in the horizontal state shown in FIG.

  Through the above process, the mother substrate 101 can be instantaneously broken from the upper surface substrate 103 to the lower surface substrate 104 at the same vertical position.

  Next, the sixth substrate breaking method of the present invention will be described with reference to FIG. This sixth substrate breaking method is also a method for obtaining a large number of display panels having a small area by breaking the upper and lower surfaces of the mother substrate 101 without inverting the mother substrate 101 by using the substrate breaking device 1 of the present invention. As an example, the feature is that the lower break bar 31B and the lower substrate fixing bar 32B are used to apply a load higher than stress to the mother substrate 101 and pressurize it, and the upper break bar 31A is used to support the mother substrate 101. It is.

  First, as shown in FIG. 1A, the mother substrate 101 is placed on the placement surface of the elastic plate 212 with the upper surface substrate 103 of the mother substrate 101 carried into the substrate breaker 1 of the present invention facing upward. Adsorb and hold.

  Next, as shown in FIG. 5B, the upper substrate fixing bar 32A is brought into contact with a predetermined scribe line 105a of a large number of scribe lines formed in advance on the upper surface substrate 103 of the mother substrate 101 in that state. On the other hand, the lower break bar 31A is brought into contact with the lower surface of the elastic plate 212 corresponding to the position of the scribe line 105b of the lower substrate 104, and in this state, the lower break bar 31B is raised to the mother substrate 101 via the elastic plate 212. On the other hand, a load higher than the stress is applied and pressed. By this operation, the mother substrate 101 is bent upward in the shape of an inverted character centering on the lower break bar 31B, and a vertical crack grows along the scribe line 105a on the upper substrate 103 that is further bent, so that the upper substrate 103 is broken. Is done.

  Next, after the upper surface substrate 103 is broken, the upper substrate fixing bar 32A is raised from the upper surface substrate 103, the lower break bar 31B is lowered from the elastic plate 212, and each elastic plate is retracted to a previously taught position. 212 and the mother substrate 101 are instantaneously horizontal as shown in FIG. 3C, and then bent into a V shape as shown in FIG.

  Subsequently, the upper break bar 31A is lowered from above the upper substrate 103, and the upper break bar 31A is brought into contact with and supported along the scribe line 105a to be broken, and a pair of lower substrates are fixed from below the elastic plate 212. When the bar 32B is raised and a load equal to or greater than the stress of the mother substrate 101 is applied to the lower surface of the elastic plate 212 and pressed, the elastic plate 212 and the mother substrate 101 are bent in a square shape around the upper break bar 31A. The lower substrate 104 that is further bent is broken by a vertical crack growing along the scribe line 105b.

  When the break occurs in this manner, as shown in FIG. E, the upper break bar 31A is raised, while the lower substrate fixing bar 32B is lowered and retracted to the previously taught position. 212 and the mother substrate 101 are in the horizontal state shown in FIG.

  Through the above process, the mother substrate 101 can be instantaneously broken from the upper surface substrate 103 to the lower surface substrate 104 at the same vertical position.

  Next, the seventh substrate breaking method of the present invention will be described with reference to FIG. This seventh substrate breaking method is also a method of obtaining a large number of display panels having a small area by breaking the upper and lower surfaces of the mother substrate 101 without inverting the mother substrate 101 by using the substrate breaking device 1 of the present invention. As an example, the feature is that the upper substrate 103 is broken by using a pair of upper substrate fixing bars 32A to press the mother substrate 101 with a load more than the stress, and the lower substrate 104 is broken by the upper break. That is, the mother substrate 101 is broken by applying a load higher than the stress to the mother substrate 101 using the bar 31A.

  First, as shown in FIG. 1A, the mother substrate 101 is placed on the placement surface of the elastic plate 212 with the upper surface substrate 103 of the mother substrate 101 carried into the substrate breaker 1 of the present invention facing upward. Adsorb and hold.

  Next, as shown in FIG. 5B, the lower break bar 31B is in contact with the elastic plate 212 exposed at the opening 214 along the scribe line 105b to be broken on the lower substrate 104. The upper surface of the upper substrate 103 is pressed by applying a load greater than the stress of the mother substrate 101 by the pair of upper substrate fixing bars 32A so as to straddle the scribe line 105a to be broken. The upper substrate 103 is broken by bending in a letter shape.

  Next, after this upper surface substrate 103 breaks, when the upper substrate fixing bar 32A is raised from the upper surface substrate 103, and the lower break bar 31B is lowered from the lower surface of the elastic plate 212, respectively, and retracted to the previously taught position, The elastic plate 212 and the mother substrate 101 are instantaneously horizontal as shown in FIG. 3C, and then bent into a V shape as shown in FIG.

  Subsequently, the pair of lower substrate fixing bars 32B are raised from below the elastic plate 212 to abut and support the elastic plate 212, while the upper break bar 31A is lowered from above the upper substrate 103 to break. When the upper break bar 31A is brought into contact with the scribe line 105a and a load greater than the stress of the mother substrate 101 is applied and pressed, the mother substrate 101 bends in a square shape around the upper break bar 31A, The lower substrate 104 that is further bent is broken by vertical cracks growing along the scribe lines 105b.

  When the break occurs in this manner, as shown in FIG. E, the upper break bar 31A is raised, while the lower substrate fixing bar 32B is lowered and retracted to the previously taught position. 212 and the mother substrate 101 are in the horizontal state shown in FIG.

  Through the above process, the mother substrate 101 can be instantaneously broken from the upper surface substrate 103 to the lower surface substrate 104 at the same vertical position.

  Next, the eighth substrate breaking method of the present invention will be described with reference to FIG. This eighth substrate breaking method is also a method of obtaining a large number of display panels having a small area by breaking the upper and lower surfaces of the mother substrate 101 without inverting the mother substrate 101 by using the substrate breaking device 1 of the present invention. As an example, the feature is that all the scribe lines 105 a or 105 b formed on one surface of the mother substrate 101 are used by combining the first substrate break method and the second substrate break method. Breaking and then breaking along all the scribe lines 105a or 105b formed on the other substrate surface provides a small area display panel. Only the main points of the technology are described.

  In this description, the upper substrate 103 is broken in a grid pattern along all the scribe lines 105 a formed on the upper substrate 103 of the mother substrate 101, and then all the scribes formed on the lower substrate 104 are used. A substrate breaking method for breaking in a grid pattern along the line 105b will be described. Needless to say, first, the lower substrate 104 may be broken and then the upper substrate 103 may be broken. Further, a description will be given of a method of breaking using the first substrate breaking method as the substrate breaking method.

  First, for example, the mother substrate 101 is placed in a horizontal state with the placement surface of the elastic plate 212 on the upper surface substrate 103 and is attracted and held by the elastic plate 212. The upper substrate fixing bar 32A is contacted and supported from above and straddles all the scribe lines 105a formed on the upper surface substrate 103 of the mother substrate 101, and hits the lower part of the intermediate portion of the contacting upper substrate fixing bar 32A. The lower break bar 31B is brought into contact with the lower surface of the elastic plate 212 along the scribe line 105b of the lower substrate 104. In such a state, the mother substrate 101 is moved along the scribe line 105a of the upper substrate 103 by the lower break bar 31B. When a load equal to or greater than the above stress is applied and pressed, the elastic plate 212 and the mother substrate 101 are bent in an inverted shape centering on the lower break bar 31B, and the upper substrate 103 that is bent further along the scribe line 105a. Vertical cracks grow and break.

  Next, the lower substrate 104 is broken. In a state where the mother substrate 101 in a state where the upper surface substrate 103 is broken is held on the elastic plate 212, that is, in a state where the mother substrate 101 is attracted and held on the elastic plate 212 without being inverted, all of the lower substrate 104 Break along the scribe line 105b.

  The upper break bar 31A is brought into contact with the scribe line 105a of the upper substrate 103, and the lower substrate fixing bar 32B is brought into contact with and supported by the lower surface of the elastic plate 212 so as to straddle the scribe line 105b corresponding to the scribe line 105a. In this state, a load higher than the stress of the mother substrate 101 is applied to the elastic plate 212 by the upper break bar 31A and pressed. Then, the elastic plate 212 and the mother substrate 101 are bent in a square shape with the upper break bar 31A as the center, and the lower substrate 104 that is further bent is broken by a vertical crack growing along the scribe line 105b. Even when the sixth substrate breaking method is adopted, a large number of display panels having a small area can be obtained from the mother substrate 101.

  Further, as shown in FIG. 20, a plurality of electrode terminals T for electrical connection to an external electronic circuit are formed in advance on the upper surface substrate 103 of the mother substrate 101 together with TFTs and the like. Therefore, in order to obtain a broken display panel having a small area, it is necessary to expose this electrode terminal T. For this purpose, if the scribe line 105c is formed at the same time when the scribe line 105b is formed on the lower surface substrate 104, and these scribe lines 105c are also broken during the breaking operation of the lower surface substrate 104, each display panel The electrode terminal T can be exposed every time.

FIG. 21 is a photograph showing a break state after a break of a brittle material substrate broken by the upper and lower instantaneous break process of the upper substrate 103 and the lower substrate 104 of the mother substrate 101.
As apparent from the break photograph of the mother substrate in the prior art shown in FIG. 24, no damage such as cracking or chipping was found in the substrate break method of the present invention.

  FIG. 22 shows a flow of a break process for showing features obtained by using the substrate break method of the present invention. As is apparent from this flow, first, the mother substrate 101 is carried into a scribe device (step S20), and scribe lines are formed in a grid pattern on the upper substrate 103 (TFT surface) (step S21). After forming, the scribe device is unloaded, turned over, loaded again into the scribe device (step S22), and a scribe line is formed on the lower surface substrate 104 (CF surface) side so as to match the scribe line ( Step S23), then, the mother substrate 101 is unloaded from the scribe device, loaded into the substrate breaking device 1 of the present invention, and the upper surface substrate almost instantaneously from both the upper and lower surfaces at the same upper and lower positions by the substrate breaking method of the present invention. 103 and the lower substrate 104 are broken, or only one of the substrates is broken in a grid pattern first, After, to break the other substrate in a grid pattern, when unloading the mother substrate 101 which upper and lower surfaces thereof is breaking from the substrate breaking apparatus 1, a number of display panels break in a predetermined small area is obtained.

  As described above, the superiority of the substrate break process of the present invention by using the substrate break apparatus and method of the present invention is clear as compared with the break process of the prior art substrate break method shown in FIG. The reversing operation is only in the scribe process, but not in the substrate breaking process. Also in the substrate breaking process, it can be understood that the present invention can carry the mother substrate 101 into and out of the substrate breaking device 1 only once.

  As an effect of reducing the work in the break process, a great improvement in processing efficiency in the process, a great reduction in manufacturing cost, an improvement in product quality, and the like can be greatly expected.

  In each of the above embodiments, the mother substrate 101 has been described by taking a substrate in which two glass substrates are bonded together. However, the present invention is also applicable to a bonded substrate of a glass substrate and a semiconductor substrate and other brittle material substrates. I will add what I can do.

  The present invention can be used in an electronic device manufacturing industry such as a video display panel and a video display device, an electronic component manufacturing industry thereof, and the like.

FIG. 2A is a plan view of the mother substrate for a liquid crystal display panel, and FIG. 2B is a cross-sectional view taken along line Y1-Y2 of FIG. It is a front view which shows the structure of the board | substrate breaking apparatus of one Example of this invention. The board | substrate support stand in the board | substrate breaking apparatus shown in FIG. 2 is represented with the schematic diagram, The figure A is the top view, The figure B is the cross-sectional side view on the AA line of the figure A. It is the cross-sectional side view which represented the relationship between the work stage of the state which mounted the mother board | substrate, and the break unit with the schematic diagram. FIG. 3 is a side view showing in principle the principal part of the substrate breaking device shown in FIG. 2 for the mother substrate shown in FIG. 1. In embodiment concerning this invention, it is the side view which expanded and showed a mode that the lower surface board | substrate 104 was cut | disconnected. FIG. 2 is a waveform diagram showing first vibration data V1, second vibration data V2, and difference data D in the substrate breaker 1 of the present invention, where FIG. A shows vibrations caused by disturbances by an upper break bar 31A and an upper substrate fixing bar. FIG. 5B is a waveform diagram when the buoy bar 31 is subjected to vibration, and FIG. C is a waveform diagram when the upper substrate fixing bar 32A is subjected to vibration. In the embodiment according to the present invention, the position data P in the vertical direction of the upper break bar 31A moved by the upper break bar moving unit 41A controlled by the upper break bar movement control unit 51A, the first vibration data V1, and the second vibration. It is a wave form diagram which shows difference data D with data V2. The horizontal axis represents time, the vertical axis represents the position data P in the vertical direction moved from the initial position P0 to the first direction Z1, and the difference data D represents the voltage value. It is the conceptual side view which showed the partial breaking process of the 1st board | substrate breaking method of this invention which breaks the lower surface board | substrate 104. FIG. 10 is a conceptual side view showing a part of the first substrate breaking method of the present invention for breaking the upper surface substrate 103 following FIG. 9. It is the conceptual side view which showed the partial break process of the 2nd substrate break method of this invention which breaks the lower surface board | substrate 104. FIG. 12 is a conceptual side view showing a part of the second substrate breaking method of the present invention for breaking the upper substrate 103 following FIG. 11. It is the conceptual side view which showed the breaking process for demonstrating the 3rd board | substrate breaking method of this invention which breaks the upper surface board | substrate 103 from the lower surface board | substrate 104 at the same position substantially simultaneously. FIG. 14 is a break flowchart of the third substrate breaking method of the present invention shown in FIG. 13. It is the conceptual side view which showed the breaking process for demonstrating the 4th board | substrate breaking method of this invention which breaks the lower surface board | substrate 104 from the upper surface board | substrate 103 at the same position substantially simultaneously using an up-and-down break bar. FIG. 10 is a conceptual side view showing a breaking process for explaining a fifth substrate breaking method of the present invention in which the lower surface substrate 104 to the lower surface substrate 104 are substantially simultaneously broken at the same position using the upper and lower substrate fixing bars. The sixth substrate breaking method of the present invention, in which the upper substrate 103 is broken almost simultaneously at the same position by using the lower break bar 31B from below the lower substrate 104 and the lower substrate 104 by using a pair of lower substrate fixing bars 32B from below. It is the conceptual side view which showed the break process for demonstrating. The seventh substrate break according to the present invention, in which the upper substrate 103 is broken almost simultaneously at the same position using the upper break bar 31A from above the upper substrate 103 using the pair of upper substrate fixing bars 32A from above. It is the conceptual side view which showed the breaking process for demonstrating a method. It is a partial side view of the mother board | substrate 101 used in order to demonstrate the 8th board | substrate breaking method of this invention. It is a partial side view of the mother board | substrate 101 which showed the part in which the electrode terminal T is formed. 1 is an enlarged photograph of a mother substrate 101 cut by using the substrate breaking device and the substrate breaking method of the present invention, and FIG. 1A is an enlarged photograph showing a partial plane of the broken mother substrate 101, and FIG. FIG. 3 is a side view showing an enlarged photograph of a cut surface of a broken mother substrate 101. It is a flowchart of the substrate break process by the substrate break apparatus and substrate break method of this invention. It is a flowchart of the conventional substrate break process. The display panel of a part at the time of breaking by the conventional board | substrate breaking method is shown, The figure A is the top view, The figure B is the cross-sectional side view. It is a conceptual diagram which shows the board | substrate breaking apparatus of a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1A ... Substrate break device of one Example of this invention, 11 ... Substrate break device main body, 111A ... Upper accommodation space, 111B ... Lower accommodation space, 21 ... Substrate support stand, 211 ... Substrate support plate, 212 ... Elastic plate, 213 ... turntable, 214 ... opening formed in substrate support plate 211, 31A ... upper break bar, 31B ... lower break bar, 32A ... pair of upper substrate fixing bars, 32B ... pair of lower substrate fixing bars, 41A ... Upper break bar moving unit, 41B ... lower break bar moving unit, 4111A, 411B ... servo motor, 412A, 412B ... ball screw, 50 ... break bar control unit, 51A ... upper break bar moving control unit, 51B ... lower break bar moving control , 61A: upper break detection unit, 61B: lower break detection unit, 611a ... first vibration sensor, 611b ... second vibration Sensor 612... Amplifier 613 A / D converter 614 vibration calculator 101 mother board 102 display panel 103 upper substrate (color filter substrate) 104 lower substrate (array substrate) Z1 ... 1st direction, Z2 ... 2nd direction, V1 ... 1st vibration data, V2 ... 2nd vibration data, D ... Difference data, H ... Comparison data

Claims (18)

A substrate breaker for a bonded substrate for breaking a bonded brittle material substrate formed on a surface at a position where a scribe line is desired to break along the scribe line,
A substrate support plate in which an opening is formed;
An elastic plate mounted on an upper surface of the substrate support plate so as to cover the opening, and fixing the brittle material substrate;
An upper break bar disposed above the elastic plate and above the opening of the substrate support plate so as to be movable up and down and breaking along the scribe line at the center and the upper break bar An upper break unit having upper substrate fixing bars formed on both sides of the break bar;
A movement control unit for individually controlling movement of the upper break bar and the upper substrate fixing bars;
The substrate support plate is disposed so as to be able to move up and down relative to the elastic plate below the opening, and is formed at the center of the lower break bar that breaks along the scribe line and on both sides of the lower break bar. A lower break unit having a lower substrate fixing bar;
A substrate breaker for bonded substrates, comprising a movement control unit for individually controlling movement of the lower break bar and the lower substrate fixing bars.   2. The bonding according to claim 1, wherein the elastic plate is mounted on the substrate support plate so as to be able to rotate over an angular range of 90 degrees left and right or 90 degrees in one direction. Substrate break device for substrates.   The substrate breaker for a bonded substrate according to claim 1, wherein the elastic plate has a function of sucking and holding the bonded brittle material substrate mounted thereon.   The substrate breaker for a bonded substrate according to claim 1, wherein the substrate support plate is mounted on a surface plate having a horizontal surface so as to be movable in at least one direction.   A first vibration sensor is mounted on the upper break bar, a second vibration sensor is mounted on the upper substrate fixing bar, and an upper cutting detection unit and an upper break unit movement control unit are coupled to both the vibration sensors, A first vibration sensor is also mounted on the lower break bar, a second vibration sensor is mounted on the lower substrate fixing bar, and a lower cutting detection unit and a lower break unit movement control unit are connected to both the vibration sensors. The substrate breaker for bonded substrates according to claim 1.   An opening is formed, and an elastic plate is horizontally mounted on the substrate support plate whose surface is in a horizontal state so as to cover the opening, and a scribe line is formed on the surface of the large format to break on the elastic plate. Fixing the mother substrate on which the upper substrate and the lower substrate of the two brittle materials are bonded together in a horizontal state, and positioning the scribe line at a position where the mother substrate is to be broken at an intermediate portion of the opening, A method for breaking a bonded substrate, comprising: breaking the mother substrate exposed in the opening portion from above or breaking through the elastic plate when breaking from below.   An opening is formed, and an elastic plate is horizontally mounted on the substrate support plate whose surface is in a horizontal state so as to cover the opening, and a scribe line is formed on the surface of the large format to break on the elastic plate. Fixing the mother substrate on which the upper substrate and the lower substrate of the two brittle materials are bonded together in a horizontal state, and positioning the scribe line at a position where the mother substrate is to be broken at an intermediate portion of the opening, Break the upper surface substrate with the pair of lower substrate fixing bars in contact with the elastic plate portion exposed below the lower surface substrate so as to straddle the scribe line to be broken. The lower substrate is broken by pressing the upper break bar along the scribe line and bending the mother substrate into a V shape. Board break method of a bonded substrate.   An opening is formed, and an elastic plate is horizontally mounted on the substrate support plate whose surface is in a horizontal state so as to cover the opening, and a scribe line is formed on the surface of the large format to break on the elastic plate. Fixing the mother substrate on which the upper substrate and the lower substrate of the two brittle materials are bonded together in a horizontal state, and positioning the scribe line at a position where the mother substrate is to be broken at an intermediate portion of the opening, With a pair of upper substrate fixing bars in contact with the upper surface of the upper substrate so as to straddle the scribe line to be broken, the upper substrate is exposed to the opening along the scribe line to be broken on the lower substrate. The upper substrate is broken by applying pressure to the lower break bar through the elastic plate and bending the mother substrate in an inverted V shape. Board break method of a bonded substrate.   An opening is formed, and an elastic plate is horizontally mounted on the substrate support plate whose surface is in a horizontal state so as to cover the opening, and a scribe line is formed on the surface of the large format to break on the elastic plate. Fixing the mother substrate on which the upper substrate and the lower substrate of the two brittle materials are bonded together in a horizontal state, and positioning the scribe line at a position where the mother substrate is to be broken in the middle of the opening, The elastic plate exposed to the opening so as to straddle the scribe line to be broken on the lower surface substrate in a state where the upper break bar is in contact with the upper surface of the substrate along the scribe line to be broken The lower substrate is broken by pressurizing with a pair of the lower substrate fixing bars through the substrate and bending the mother substrate into a V shape. Bonded substrate break method of a substrate that.   An opening is formed, and an elastic plate is horizontally mounted on the substrate support plate whose surface is in a horizontal state so as to cover the opening, and a scribe line is formed on the surface of the large format to break on the elastic plate. Fixing the mother substrate on which the upper substrate and the lower substrate of the two brittle materials are bonded together in a horizontal state, and positioning the scribe line at a position where the mother substrate is to be broken at an intermediate portion of the opening, The scribe line to be broken on the upper surface of the upper substrate in a state where the lower break bar is in contact with the elastic plate exposed to the opening along the scribe line to be broken on the lower substrate. The upper substrate is broken by pressurizing with a pair of upper substrate fixing bars so as to straddle the substrate, and bending the mother substrate in an inverted V shape. Board break method of a bonded substrate.   First, the lower substrate is broken by the substrate breaking method according to claim 7 or 9 along all scribe lines formed on the surface of the lower substrate of the mother substrate, and then the mother substrate A substrate breaking method for a bonded substrate, wherein the upper surface substrate is broken by the substrate breaking method according to claim 8 or 10 along all scribe lines formed on the surface of the upper surface substrate.   First, the upper substrate is broken by the substrate breaking method according to claim 8 or 10 along all the scribe lines formed on the surface of the upper substrate of the mother substrate. 10. A substrate breaking method for a bonded substrate, wherein the lower substrate is broken by the substrate breaking method according to claim 7 or 9 along all scribe lines formed on the surface of the lower substrate.   The lower substrate is broken by the substrate breaking method according to claim 7 or 9 along a scribe line formed on the surface of the lower substrate of the mother substrate, and is formed on the inner surface of the upper substrate. A substrate breaking method of a bonded substrate, characterized by exposing an electrode terminal.   An opening is formed, and an elastic plate is horizontally mounted on the substrate support plate whose surface is in a horizontal state so as to cover the opening, and a scribe line is formed on the surface of the large format to break on the elastic plate. Fixing the mother substrate on which the upper substrate and the lower substrate of the two brittle materials are bonded together in a horizontal state, and positioning the scribe line at a position where the mother substrate is to be broken at an intermediate portion of the opening, Break the upper surface substrate with the pair of lower substrate fixing bars in contact with the elastic plate portion exposed below the lower surface substrate so as to straddle the scribe line to be broken. Almost instantaneously after breaking the lower substrate by bending the mother substrate into a V-shape by pressing with an upper break bar along the scribe line A pair of the upper substrate fixing bars are in contact with the upper surface of the upper substrate so as to straddle the scribe line to be broken, and exposed to the opening along the scribe line to be broken of the lower substrate. A method of breaking a bonded substrate, wherein the upper substrate is broken by applying pressure to the lower break bar through the elastic plate and bending the mother substrate in an inverted V shape.   An opening is formed, and an elastic plate is horizontally mounted on the substrate support plate whose surface is in a horizontal state so as to cover the opening, and a scribe line is formed on the surface of the large format to break on the elastic plate. A mother substrate in which two upper and lower brittle materials are bonded together is fixed in a horizontal state, and a pair of upper substrates are fixed so as to straddle the scribe line to be broken on the upper surface of the upper substrate. With the bar in contact, the lower break bar pressurizes the mother substrate through the elastic plate exposed to the opening along the scribe line to be broken on the lower substrate, and the mother substrate is inverted V After breaking the upper substrate by bending it into a letter shape, almost instantaneously in the opening so as to straddle the scribe line to be broken on the lower substrate. The mother substrate is pressed by the upper break bar along the scribe line to be broken on the upper surface of the upper substrate in a state where the pair of lower substrate fixing bars are in contact with each other via the elastic plate that has been put out. Breaking the lower substrate by bending the substrate into a V shape, the substrate breaking method for a bonded substrate.   An opening is formed, and an elastic plate is horizontally mounted on the substrate support plate whose surface is in a horizontal state so as to cover the opening, and a scribe line is formed on the surface of the large format to break on the elastic plate. The mother substrate in which the two upper and lower substrates of the brittle material are bonded together is fixed in a horizontal state, and is exposed to the opening along the scribe line to be broken on the lower substrate. In a state where the lower break bar is in contact with the elastic plate, a pressure is applied to the upper surface of the upper substrate by the pair of upper substrate fixing bars so as to straddle the scribe line to be broken, and the mother substrate is inverted V-shaped. The upper break along the scribe line to be broken on the upper surface of the upper substrate almost instantaneously after the upper substrate is broken by bending In a state where the base plate is in contact, a pressure is applied by the pair of lower substrate fixing bars through the elastic plate exposed to the opening so as to straddle the scribe line to be broken on the lower substrate, and the mother A substrate breaking method for a bonded substrate, wherein the lower substrate is broken by bending the substrate into a V shape.   An opening is formed, and an elastic plate is horizontally mounted on the substrate support plate whose surface is in a horizontal state so as to cover the opening, and a scribe line is formed on the surface of the large format to break on the elastic plate. Fixing the mother substrate on which the upper substrate and the lower substrate of the two brittle materials are bonded together in a horizontal state, and positioning the scribe line at a position where the mother substrate is to be broken at an intermediate portion of the opening, With a pair of upper substrate fixing bars in contact with the upper surface of the upper substrate so as to straddle the scribe line to be broken, the upper substrate is exposed to the opening along the scribe line to be broken on the lower substrate. Almost instantaneously after the upper substrate is broken by applying pressure to the lower break bar through the elastic plate and bending the mother substrate in an inverted V shape. The upper break bar is in contact with the upper surface of the upper substrate along the scribe line to be broken, and is exposed to the opening so as to straddle the scribe line to be broken of the lower substrate. A substrate breaking method for a bonded substrate, wherein the lower substrate is broken by pressurizing with a pair of lower substrate fixing bars through the elastic plate and bending the mother substrate into a V shape. An opening is formed, and an elastic plate is horizontally mounted on the substrate support plate whose surface is in a horizontal state so as to cover the opening, and a scribe line is formed on the surface of the large format to break on the elastic plate. Fixing the mother substrate on which the upper substrate and the lower substrate of the two brittle materials are bonded together in a horizontal state, and positioning the scribe line at a position where the mother substrate is to be broken at an intermediate portion of the opening, The scribe to be broken on the upper surface of the upper substrate while the lower break bar is in contact with the elastic plate exposed at the opening along the scribe line to be broken on the lower substrate. After the upper substrate is broken by pressing with a pair of upper substrate fixing bars across the line and bending the mother substrate in an inverted V shape, In a state where a pair of lower substrate fixing bars are in contact with each other so as to straddle the scribe line to be broken to an elastic plate portion existing under the lower substrate exposed at the opening, A substrate breaking method for a bonded substrate, wherein the lower substrate is broken by pressing the upper substrate along a scribe line to be broken and bending the mother substrate into a V shape.