CN102555082A - Breaking method of fragile material substrate - Google Patents
Breaking method of fragile material substrate Download PDFInfo
- Publication number
- CN102555082A CN102555082A CN2011103911239A CN201110391123A CN102555082A CN 102555082 A CN102555082 A CN 102555082A CN 2011103911239 A CN2011103911239 A CN 2011103911239A CN 201110391123 A CN201110391123 A CN 201110391123A CN 102555082 A CN102555082 A CN 102555082A
- Authority
- CN
- China
- Prior art keywords
- disjunction
- brittle substrate
- material substrate
- fragile material
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
Abstract
The invention provides a breaking method capable of properly breaking a fragile material substrate even though the condition is not rated in advance. The breaking method of the fragile material substrate comprises the following steps: preparing the fragile material substrate, wherein a partition preset position is arranged on the fragile material substrate in a special partition distance perpendicular with a main surface and a micro crack is formed on the partition preset position; adhering the fragile material substrate on an elastic film and horizontally keeping the elastic film; arranged a first breaking bar vertically below the partition preset position; a second breaking bar respectively arranged on two positions in equal distance with the partition preset position above the fragile material substrate; applying the force on the upper, lower surfaces of the fragile material substrate by ascending the first breaking bar and descending the two second breaking bars, so as to break the fragile material substrate; setting the arrangement distance of the second breaking bars more than 1.3 times and less than 1,6 times of the partition distance and keeping the arrangement distance to make the second breaking bars bunted with the fragile material substrate.
Description
Technical field
The present invention relates to a kind of method of dividing brittle material substrate, especially relate to a kind of method of utilizing the be full of cracks progress to come the disjunction substrate.
Background technology
To use LTCC (Low Temperature Co-fired Ceramics; LTCC) or HTCC (High Temperature Co-fired Ceramics; HTCC) etc. the brittle substrate (comprising that first type surface or inside are forming substrates such as circuit) that constitutes of pottery and other fragile materials is cut apart, and has multiple and cut out a plurality of gimmicks of cutting apart a sheet.For example known have a following form: use cutting wheel etc. to form line of cut in the precalculated position of cutting apart of brittle substrate; Whereby along line of cut and form vertical be full of cracks at the thickness direction of brittle substrate; Utilize 3 bendings to apply external force (loading) afterwards; Thereby vertical be full of cracks is stretched, on the thickness direction of brittle substrate thus with brittle substrate disjunction (for example with reference to patent documentation 1).In this case, be through inside the vertical be full of cracks that forms along line of cut being stretched arrive on the thickness direction of brittle substrate, thereby with the brittle substrate disjunction.
The look-ahead technique document
Patent documentation
Patent documentation 1: Japanese Patent Laid is opened the 2010-173251 communique
Summary of the invention
Utilize break-up device disjunction brittle substrate; Normally realize in the following manner: on the disjunction object's position of the lower face side of the brittle substrate of disjunction object, compress a following cutter (downside disjunction bar), in upper surface side with two upper slitters (upside disjunction bar) to press on this brittle substrate from the equally spaced state of disjunction object's position.
Therefore the brittle substrate of disjunction object has all thickness, and the interval (cutting apart spacing) of the disjunction position when substrate of a plurality of positions disjunction also has multiplely, thinks in the past must correspondence want the substrate of disjunction and make the interval optimization of two upper slitters.So, in the time will cutting apart size or cut apart the different brittle substrate of spacing, must carry out the regulation upper slitter at interval and the step of other disjunction conditions.
Yet, must prepare extra brittle substrate in order to carry out this condition regulation step, thereby cause waste.And, under the situation such as trial target that disjunction batch number is not easy to increase, might not after rated condition, carry out disjunction, will cause like this to obtain the uneven situation of cutting apart a sheet of appearance and size.
The present invention forms in view of said Study on Problems, even if its purpose is to provide a kind of also method of disjunction brittle substrate rightly of rated condition not in advance.
In order to solve said problem; The invention of technical scheme 1 is a kind of method for dividing of brittle substrate; It is characterized in that comprising: preparation process; Prepare brittle substrate, this brittle substrate is to set and cut apart the precalculated position to cut apart spacing perpendicular to first type surface specific, and is forming small be full of cracks on the precalculated position in said cutting apart; Keep step, elastic membrane is fixed in said brittle substrate adhesion, then said elastic membrane level is kept; The 1st configuration step is cut apart configuration the 1st disjunction bar below precalculated position vertical said; The 2nd configuration step above said brittle substrate, is disposing the 2nd disjunction bar respectively with said cutting apart on equidistant two positions, precalculated position; And disjunction step; Make said the 1st disjunction bar rising and said two the 2nd disjunction bars are descended; Cut apart two positions of precalculated position symmetry and the said of lower surface of said brittle substrate cut apart on the precalculated position at the upper surface of said brittle substrate and with respect to said; To the said brittle substrate application of force, whereby with said brittle substrate disjunction; In said the 2nd configuration step; The configuration space of said two the 2nd disjunction bars is set at said more than 1.3 times and below 1.6 times of spacing of cutting apart; In said disjunction step; Keep the said configuration space of setting in said the 2nd configuration step and make said two the 2nd disjunction bars be connected to said brittle substrate, whereby by said the 2nd disjunction bar to the said brittle substrate application of force.
The invention of technical scheme 2 is according to the method for dividing of technical scheme 1 described brittle substrate, it is characterized in that: in said the 2nd configuration step, the configuration space of said two the 2nd disjunction bars is set at said 1.5 times of cutting apart spacing.
The invention of technical scheme 3 is according to the method for dividing of technical scheme 1 or 2 described brittle substrates, and it is characterized in that: said brittle substrate is a ltcc substrate.
[effect of invention]
Invention according to technical scheme 1 to 3; Even if be not used to set upper slitter condition regulation step at interval; Also can suppress to cut apart the appearance and size inequality of a sheet, thereby carry out appropriate cutting apart, dimensional accuracy, the one side that therefore can simultaneously guarantee to cut apart a sheet improve the disjunction productivity.
Description of drawings
Fig. 1 is the schematic section of outward appearance of the break-up device 10 of the expression method for dividing that can use this embodiment.
Fig. 2 is that expression is an object to set the different brittle substrates that cut spacing p; Configuration space d to upside disjunction bar 3 carries out various changes and disjunction brittle substrate 5, obtain to overlook rectangular-shaped when cutting apart sheet, than d/p, with chart by the relation of inequality 3 σ of the appearance and size of cutting apart a sheet of disjunction gained.
Fig. 3 is that expression is an object with the different brittle substrate of thickness t; Configuration space d to upside disjunction bar 3 carries out various changes and disjunction brittle substrate 5, obtain to overlook rectangular-shaped when cutting apart sheet, than d/p, with chart by the relation of inequality 3 σ of the appearance and size of cutting apart a sheet of disjunction gained.
[explanation of symbol]
1 elastic membrane
1a (elastic membrane) bonding plane
2 frameworks
3 (3a, 3b) upside disjunction bar
3ae, 3be (upside disjunction bar) front end
4 downside disjunction bars
4e (downside disjunction bar) front end
5 brittle substrates
5a, 5b (brittle substrate) first type surface
10 break-up devices
CR vertically chaps
The F diaphragm
L is cut apart preset lines
D (upside disjunction bar) configuration space
P (brittle substrate) is cut apart spacing
The specific embodiment
< disjunction summary >
Fig. 1 is the schematic section of outward appearance of the break-up device 10 of the expression method for dividing that can use this embodiment.
Break-up device 10 mainly comprises: framework 2, and face presents elastic membrane 1 one side of having fixed machined object (disjunction object) of adhering in the end edge portion level and keeps; Two upside disjunction bars (upper slitter) 3 (3a, 3b) move up and down at the machined object upside during disjunction; And a downside disjunction bar (following cutter) 4, move up and down at the machined object downside.Two upside disjunction bar 3a, 3b (figure looks left and right directions) in the horizontal direction separate configuration, and both partition distance can be regulated.And, downside disjunction bar 4 configuration in the horizontal direction with two upside disjunction bar 3a, the equidistant position of 3b on.
Below, illustrate the situation that brittle substrate 5 is carried out disjunction as machined object.Brittle substrate 5 is to use the substrate that LTCC (Low Temperature Co-fired Ceramics) or HTCC (High Temperature Co-fired Ceramics) etc. are ceramic and other fragile materials constitute.Also have, in this embodiment, brittle substrate 5 is overlooked and is rectangle.And brittle substrate 5 comprises that first type surface or inner is forming the substrate of circuit etc.
In this embodiment, cut apart the precalculated position and be set at vertical with first type surface 5a, the 5b of brittle substrate 5.In Fig. 1, the precalculated position of cutting apart that is actually the brittle substrate 5 of face is that the preset lines L of cutting apart with wave-like line representes.The interval (being also referred to as separation pitch) each other, precalculated position of respectively cutting apart in the face of brittle substrate 5 on the direction is made as p.And, before the disjunction, utilize cutter sweep etc. on the precalculated position in cutting apart of first type surface 5a side and forming small vertical be full of cracks CR as the disjunction starting point.
Also have, the size of the brittle substrate 5 among Fig. 1 is an illustration.Brittle substrate 5 can corresponding its purpose and select suitable size.Though there is not particular determination, the thickness t of brittle substrate 5 for example can be made as about 0.2～3mm.And that has represented 7 positions among Fig. 1 cuts apart precalculated position (cutting apart preset lines L for 7), but this also illustration just.
Using break-up device 10 will be as brittle substrate 5 disjunctions of machined object the time, the first type surface 5b that at first will not form vertical be full of cracks CR be fixed to brittle substrate 5 adhesions on the bonding plane 1a of elastic membrane 1 as stationary plane.
Elastic membrane 1 is also referred to as dicing tape etc., and it is to be the membrane-like member of material with for example polyvinyl chloride (PVC), polyolefin (PO), PET polyester such as (PET) etc., and thickness is about tens of μ m～hundreds of μ m, for example has the thickness of 100 μ m.
If brittle substrate 5 is fixed on the bonding plane 1a, then under the state above bonding plane 1a is, elastic membrane 1 is presented on the framework 2 of break-up device 10.After Fig. 1 representes that the maintenance assembly through not shown break-up device 10 will keep the framework 2 of elastic membrane to keep, the state that brittle substrate 5 levels are kept.Under this state, cutting apart the precalculated position is on the direction perpendicular to drawing, to extend.Also have, as shown in Figure 1, also can when disjunction, on the first type surface 5a that is forming vertical be full of cracks CR, paste diaphragm F.
Next, with the state of downside disjunction bar 4, be configured on the position as the vertical below of cutting apart preset lines L (below be called Object Segmentation preset lines L1) of disjunction object to separate with elastic membrane 1.Then, with two upside disjunction bar 3a, 3b state,, separate configuration with specific configuration space d with respect to this Object Segmentation preset lines L1 symmetry (being respectively d/2) with the horizontal range of Object Segmentation preset lines L1 to separate with brittle substrate 5.
Then; Make two upside disjunction bars 3 keep configuration space d and descend in vertical direction; Make separately front end 3ae, 3be be connected to the first type surface 5a of brittle substrate 5; And downside disjunction bar 4 is risen in vertical direction, make its front end 4e be connected to the first type surface 5b of brittle substrate 5 across elastic membrane 1.Whereby, vertical through upside disjunction bar 3 down to brittle substrate 5 application of forces, vertical through downside disjunction bar 4 up to brittle substrate 5 application of forces.So, the stress of 3 bendings of effect on the position of the Object Segmentation preset lines L1 on the brittle substrate 5.When this stress is done the time spent, be starting point with the vertical be full of cracks CR that forms along this position, produce along the be full of cracks of this Object Segmentation preset lines L1 and stretch.Till making this be full of cracks arrive first type surface 5b, and realize the disjunction of the position of Object Segmentation preset lines L1.
Also have; In Fig. 1; Illustration the front end 4e of the front end 3ae of upside disjunction bar 3,3be and downside disjunction bar 4 all form the cross section acute angle; And contact the form of (being a contact in the cross section shown in Figure 1) with brittle substrate 5 or elastic membrane 1 line, but and nonessential so, also can be front end 3ae, 3be and front end 4e form the cross section rectangular-shaped and with brittle substrate 5 or 1 form that contacts of elastic membrane.
And, can upside disjunction bar 3 be connected to brittle substrate 5 back butt downside disjunction bars 4 and carry out disjunction, also can make reversed.
< configuration space of upside disjunction bar >
Next, the establishing method of the configuration space of two upside disjunction bars 3 when having distinctive break-up device 10 in this embodiment carries out disjunction is described.
Fig. 2 and Fig. 3 are that expression is carried out various changes and disjunction brittle substrate 5 to the configuration space d of upside disjunction bar 3, obtain to overlook rectangular-shaped when cutting apart sheet, the ratio d/p of cutting apart spacing p (being equivalent to cut apart an a sheet big or small desired value on one side) and configuration space d and by the chart of the relation of inequality 3 σ (σ is a standard deviation) of the appearance and size of cutting apart a sheet of disjunction gained.Also have, the mensuration of appearance and size is to carry out to 20 2 limits of cutting apart the quadrature of a sheet.That is, the mensuration number of each data point of Fig. 2 and Fig. 3 is 40.
Among Fig. 2, represented the result when cutting apart spacing p and promptly cut apart five kinds of ltcc substrates that the big or small desired value of sheet is set at 1mm, 1.5mm, 2mm, 4mm, 6mm respectively and carry out disjunction.The thickness t of ltcc substrate is 0.55mm.Also have, when cutting apart spacing p and do not reach 1mm, so owing to can't stablize and utilize cutting to form vertical be full of cracks CR not assess.
Result when on the other hand, having represented among Fig. 3 that two kinds of ltcc substrates that thickness t to ltcc substrate is respectively 0.2mm, 0.55mm carry out disjunction.Also have, cut apart spacing p and be set at 1.0mm.Under which kind of situation, all be the mode that becomes 0.5,0.75,1.0,1.25,1.5,1.75 these 6 levels with value no matter, set the value of the configuration space d of upside disjunction bar 3 than d/p.Also have, when thickness t hour, but rule of thumb knowledge capital come just to be difficult to because disjunction to produce size uneven, perhaps also have only through the just alienable situation of cutting, so when thickness t reaches 0.2mm, do not assess.
According to the result of Fig. 2 and Fig. 3, change even if cut apart the thickness of spacing p and ltcc substrate, no matter under which kind of disjunction situation, be that the value of 1.5: 3 σ all is a minimum of a value than the value of d/p.And more greatly then thickness t is big more to cut apart spacing p, and the change of value is tending towards becoming big.Cutting apart spacing p is the given value of before disjunction, predesignating; So the brittle substrate 5 of disjunction if any to cut apart spacing p or thickness d different; Be set at 1.5 times that cut apart spacing p through configuration space d, and realize suppressing to cut apart the uneven disjunction of appearance and size of a sheet upside disjunction bar 3.
Therefore; In this embodiment; Will be through cutting utilize break-up device cutting apart the precalculated position through the be full of cracks progress during disjunction cutting apart brittle substrate that the precalculated position forming small vertical be full of cracks, the configuration space of upside disjunction bar is set at cuts apart more than 1.3 times and below 1.6 times of spacing.Whereby, can suppress to cut apart uneven and appropriate the cutting apart of the appearance and size of a sheet.More preferably the configuration space with upside disjunction bar is set at 1.5 times that cut apart spacing.So, can be described as the configuration space of mechanically setting upside disjunction bar, the condition regulation step that is used to set the upper slitter interval that need not look like whereby in the past to carry out.So,, can guarantee simultaneously that the dimensional accuracy of cutting apart a sheet simultaneously improves the disjunction productivity according to this embodiment.
Claims (3)
1. the method for dividing of a brittle substrate is characterized in that comprising:
Preparation process is prepared brittle substrate, and this brittle substrate is to set and cut apart the precalculated position to cut apart spacing perpendicular to first type surface specific, and is forming small be full of cracks on the precalculated position in said cutting apart;
Keep step, elastic membrane is fixed in said brittle substrate adhesion, then said elastic membrane level is kept;
The 1st configuration step is cut apart configuration the 1st disjunction bar below precalculated position vertical said;
The 2nd configuration step above said brittle substrate, is disposing the 2nd disjunction bar respectively with said cutting apart on equidistant two positions, precalculated position; And
The disjunction step; Make said the 1st disjunction bar rising and said two the 2nd disjunction bars are descended; Cut apart on the precalculated position at the upper surface of said brittle substrate and with respect to said two positions and the said of said brittle substrate lower surface of cutting apart the precalculated position symmetry; To the said brittle substrate application of force, whereby with said brittle substrate disjunction;
In said the 2nd configuration step; The configuration space of said two the 2nd disjunction bars is set at said more than 1.3 times and below 1.6 times of spacing of cutting apart; In said disjunction step; Keep the said configuration space set in said the 2nd configuration step, make said two said the 2nd disjunction bars be connected to said brittle substrate, whereby by said the 2nd disjunction bar to the said brittle substrate application of force.
2. the method for dividing of brittle substrate according to claim 1 is characterized in that:
In said the 2nd configuration step, the configuration space of said two the 2nd disjunction bars is set at said 1.5 times of cutting apart spacing.
3. the method for dividing of brittle substrate according to claim 1 and 2 is characterized in that:
Said brittle substrate is a ltcc substrate.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-265881 | 2010-11-30 | ||
| JP2010265881 | 2010-11-30 | ||
| JP2011-185656 | 2011-08-29 | ||
| JP2011185656A JP5187421B2 (en) | 2010-11-30 | 2011-08-29 | Breaking method for brittle material substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102555082A true CN102555082A (en) | 2012-07-11 |
| CN102555082B CN102555082B (en) | 2014-10-15 |
Family
ID=46647377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110391123.9A Expired - Fee Related CN102555082B (en) | 2010-11-30 | 2011-11-25 | Breaking method of fragile material substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5187421B2 (en) |
| KR (1) | KR101299793B1 (en) |
| CN (1) | CN102555082B (en) |
| TW (1) | TWI436871B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102789780A (en) * | 2012-07-14 | 2012-11-21 | 福州大学 | Method for identifying environment sound events based on time spectrum amplitude scaling vectors |
| CN103786267A (en) * | 2012-10-26 | 2014-05-14 | 三星钻石工业股份有限公司 | Method and device for fracturing fragile-material substrate |
| CN104416682A (en) * | 2013-08-23 | 2015-03-18 | 三星钻石工业股份有限公司 | Substrate Cutting Device |
| CN105304562A (en) * | 2014-07-28 | 2016-02-03 | 三星钻石工业股份有限公司 | Breaking method and breaking device of lamination substrate |
| CN106182152A (en) * | 2014-08-21 | 2016-12-07 | 三星钻石工业股份有限公司 | The dividing method of composite base plate and segmenting device |
| CN107009524A (en) * | 2015-09-29 | 2017-08-04 | 三星钻石工业股份有限公司 | The method for cutting of brittle base |
| CN111391147A (en) * | 2018-12-18 | 2020-07-10 | 三星钻石工业股份有限公司 | Method for manufacturing ceramic wafer and method for manufacturing sintered front sheet for manufacturing ceramic wafer |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6154713B2 (en) | 2013-09-30 | 2017-06-28 | 三星ダイヤモンド工業株式会社 | Method and apparatus for breaking brittle material substrate |
| JP6185812B2 (en) * | 2013-09-30 | 2017-08-23 | 三星ダイヤモンド工業株式会社 | Method and apparatus for breaking brittle material substrate |
| JP6243699B2 (en) | 2013-10-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | Fragment material substrate cutting device |
| JP2016040079A (en) * | 2014-08-12 | 2016-03-24 | 三星ダイヤモンド工業株式会社 | Segmentation method and segmentation apparatus for brittle material substrate |
| JP2016043505A (en) * | 2014-08-20 | 2016-04-04 | 三星ダイヤモンド工業株式会社 | Dividing method and dividing device of brittle material substrate |
| JP6446912B2 (en) * | 2014-08-26 | 2019-01-09 | 三星ダイヤモンド工業株式会社 | Break device |
| JP7098173B2 (en) * | 2020-02-12 | 2022-07-11 | 三星ダイヤモンド工業株式会社 | Brittle material Substrate splitting mechanism |
| WO2023176068A1 (en) * | 2022-03-16 | 2023-09-21 | ナルックス株式会社 | Methods for manufacturing microlens and microlens array |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003267742A (en) * | 2002-03-13 | 2003-09-25 | Nakamura Tome Precision Ind Co Ltd | Method for scribing hard fragile plate |
| JP2006289625A (en) * | 2005-04-05 | 2006-10-26 | Sony Corp | Substrate breaking apparatus of laminated substrate and substrate breaking method |
| CN1868943A (en) * | 2005-05-27 | 2006-11-29 | 肖特股份有限公司 | Method of mechanically breaking a scribed flat workpiece of brittle fracturing material |
| CN101099228A (en) * | 2005-01-05 | 2008-01-02 | Thk株式会社 | Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function |
| JP2010173251A (en) * | 2009-01-30 | 2010-08-12 | Mitsuboshi Diamond Industrial Co Ltd | Substrate breaking device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6368397A (en) * | 1986-09-05 | 1988-03-28 | 三菱電機株式会社 | Breaker for substrate |
| JP2007067365A (en) * | 2005-08-05 | 2007-03-15 | Alps Electric Co Ltd | Method for manufacturing electronic device |
| JP5216040B2 (en) * | 2010-03-31 | 2013-06-19 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle material substrate |
-
2011
- 2011-08-29 JP JP2011185656A patent/JP5187421B2/en not_active Expired - Fee Related
- 2011-10-17 TW TW100137522A patent/TWI436871B/en not_active IP Right Cessation
- 2011-10-31 KR KR1020110112115A patent/KR101299793B1/en not_active IP Right Cessation
- 2011-11-25 CN CN201110391123.9A patent/CN102555082B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003267742A (en) * | 2002-03-13 | 2003-09-25 | Nakamura Tome Precision Ind Co Ltd | Method for scribing hard fragile plate |
| CN101099228A (en) * | 2005-01-05 | 2008-01-02 | Thk株式会社 | Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function |
| JP2006289625A (en) * | 2005-04-05 | 2006-10-26 | Sony Corp | Substrate breaking apparatus of laminated substrate and substrate breaking method |
| CN1868943A (en) * | 2005-05-27 | 2006-11-29 | 肖特股份有限公司 | Method of mechanically breaking a scribed flat workpiece of brittle fracturing material |
| JP2010173251A (en) * | 2009-01-30 | 2010-08-12 | Mitsuboshi Diamond Industrial Co Ltd | Substrate breaking device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102789780A (en) * | 2012-07-14 | 2012-11-21 | 福州大学 | Method for identifying environment sound events based on time spectrum amplitude scaling vectors |
| CN102789780B (en) * | 2012-07-14 | 2014-10-01 | 福州大学 | Method for identifying environment sound events based on time spectrum amplitude scaling vectors |
| CN103786267A (en) * | 2012-10-26 | 2014-05-14 | 三星钻石工业股份有限公司 | Method and device for fracturing fragile-material substrate |
| CN104416682A (en) * | 2013-08-23 | 2015-03-18 | 三星钻石工业股份有限公司 | Substrate Cutting Device |
| CN105304562A (en) * | 2014-07-28 | 2016-02-03 | 三星钻石工业股份有限公司 | Breaking method and breaking device of lamination substrate |
| CN106182152A (en) * | 2014-08-21 | 2016-12-07 | 三星钻石工业股份有限公司 | The dividing method of composite base plate and segmenting device |
| CN107009524A (en) * | 2015-09-29 | 2017-08-04 | 三星钻石工业股份有限公司 | The method for cutting of brittle base |
| CN107009524B (en) * | 2015-09-29 | 2019-03-29 | 三星钻石工业股份有限公司 | The method for cutting of brittle base |
| CN111391147A (en) * | 2018-12-18 | 2020-07-10 | 三星钻石工业股份有限公司 | Method for manufacturing ceramic wafer and method for manufacturing sintered front sheet for manufacturing ceramic wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5187421B2 (en) | 2013-04-24 |
| TWI436871B (en) | 2014-05-11 |
| KR101299793B1 (en) | 2013-08-23 |
| KR20120059355A (en) | 2012-06-08 |
| CN102555082B (en) | 2014-10-15 |
| TW201244902A (en) | 2012-11-16 |
| JP2012131216A (en) | 2012-07-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102555082B (en) | Breaking method of fragile material substrate | |
| CN103635438B (en) | The cutting and separating method of plate glass | |
| CN104626710A (en) | Gum product processing technology and gum product | |
| CN104942859B (en) | Method and apparatus for dividing resin sheet | |
| CN102416672B (en) | The dividing method of attached resin brittle material substrate | |
| CN105152540A (en) | Manufacturing method of 3D (three-dimensional) glass plate | |
| TWI623402B (en) | Method and device for cutting brittle material substrate | |
| CN106426395A (en) | Manufacturing technique for foam die cutting unit | |
| CN102416674A (en) | Cutting method of resin brittle material substrate | |
| KR20150044367A (en) | Breaking apparatus and dividing method | |
| CN104276751A (en) | Bonded substrate processing apparatus | |
| KR20150044368A (en) | Expander, breaking apparatus and dividing method | |
| CN112171783A (en) | Small hole waste discharge method for die cutting of single-sided adhesive product | |
| CN105392294B (en) | A kind of glue inside contracts the positioning production method of reinforcing chip | |
| CN108858446B (en) | Die cutting method of irregular die-cut piece | |
| KR20180111520A (en) | Dividing apparatus and dividing method of resin sheet | |
| US10526235B2 (en) | Process for manufacturing glass sheets of complex shape | |
| CN110948573A (en) | Annular high-viscosity double-sided adhesive die cutting process | |
| JP2015039872A (en) | Substrate breaking device | |
| EP3915640A4 (en) | Production method for cell population including nk cells | |
| CN111251361A (en) | Double-sided adhesive tape punching process | |
| CN105578713B (en) | A kind of production method of reinforcing chip support plate with holes | |
| CN210308202U (en) | Cutting die for producing trapezoidal foam die cutting piece | |
| CN105365052B (en) | Cutting device and method for cutting brittle material substrate by cutting device | |
| CN109077082B (en) | Method for producing wafer half shells |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 Termination date: 20161125 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |