CN112171783A - Small hole waste discharge method for die cutting of single-sided adhesive product - Google Patents
Small hole waste discharge method for die cutting of single-sided adhesive product Download PDFInfo
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- CN112171783A CN112171783A CN201910605137.2A CN201910605137A CN112171783A CN 112171783 A CN112171783 A CN 112171783A CN 201910605137 A CN201910605137 A CN 201910605137A CN 112171783 A CN112171783 A CN 112171783A
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- Prior art keywords
- adhesive tape
- waste
- tape
- waste discharge
- small holes
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- 239000002699 waste material Substances 0.000 title claims abstract description 93
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000005520 cutting process Methods 0.000 title claims abstract description 32
- 239000000853 adhesive Substances 0.000 title claims abstract description 25
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 25
- 239000002390 adhesive tape Substances 0.000 claims abstract description 84
- 239000002994 raw material Substances 0.000 claims abstract description 28
- 238000004080 punching Methods 0.000 claims abstract description 21
- 238000007599 discharging Methods 0.000 claims description 11
- 239000010837 adhesive waste Substances 0.000 claims description 6
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000012797 qualification Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1827—Means for removing cut-out material or waste by tearing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention relates to a die-cutting small hole waste discharge method for a single-sided adhesive product, which comprises the following steps of: punching the raw material belt by a cutting die once to finish the small holes and the external outline of the product; sticking the strip waste discharge adhesive tape on the raw material belt along the connecting line of the small holes; sticking a strip-shaped fixing adhesive tape on the raw material belt along the axial direction of the raw material belt, wherein two ends of the fixing adhesive tape are stuck and fixed on the outer contour waste of the raw material belt; the fixing adhesive tape and the waste discharge adhesive tape are not overlapped; tearing off the waste discharge adhesive tape and taking up waste materials in the small holes; and removing the fixing adhesive tape by using an adhesive tape stripping knife. Compared with the prior art, the invention has the advantages of high product qualification rate, simple waste discharge method, cheap and easily-obtained used tools, and the like, and is particularly suitable for small-batch products.
Description
Technical Field
The invention relates to a die cutting process, in particular to a small hole waste discharge method for die cutting of a single-sided adhesive product.
Background
In the current die cutting industry, the circular hole waste discharge of a single-sided adhesive product with a circular hole on a die cutting piece is a processing difficulty, a hardware mould is adopted for the waste discharge of the general circular hole, the hardware mould is expensive and only suitable for mature or designed products, the hardware mould can be designed according to the actual requirements of the products, and then the industrial application is carried out. However, in the stage of product research and development or design, since the product is still in the stage of sample, the specific size, shape and other structures of the product need to be adjusted according to actual needs, and the product is continuously updated, and if each design corresponds to one hardware mold, the production cost can be greatly increased; in addition, for small-batch products, the designed hardware die obviously has no economic value.
At present, manual through holes are generally adopted for samples in the research and development stage or samples produced in small batches, waste is discharged, manpower and material resources are consumed for manual waste discharge, and the production efficiency cannot be improved. At present, the waste discharge is realized through an industrial adhesive tape, a small hole structure is punched on a raw material belt by adopting one-time punching, then the adhesive tape is stuck on the small hole, the small hole waste is discharged by utilizing the viscosity of the adhesive tape, and then the external outline of a product is punched and cut twice; thus, two-step punching is required, which is disadvantageous in productivity improvement.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a small hole waste discharge method for die cutting of single-sided adhesive products.
The purpose of the invention can be realized by the following technical scheme:
a small hole waste discharge method for die cutting of single-sided adhesive products comprises the following steps:
punching the raw material belt by a cutting die once to finish the small holes and the external outline of the product;
sticking the strip waste discharge adhesive tape on the raw material belt along the connecting line of the small holes; sticking a strip-shaped fixing adhesive tape on the raw material belt along the axial direction of the raw material belt, wherein two ends of the fixing adhesive tape are stuck and fixed on the outer contour waste of the raw material belt; the fixing adhesive tape and the waste discharge adhesive tape are not overlapped;
tearing off the waste discharge adhesive tape and taking up waste materials in the small holes;
and removing the fixing adhesive tape by using an adhesive tape stripping knife.
The principle of the invention is as follows:
the raw material belt is firstly punched and cut into products, the fixed adhesive tape is adopted to fix the products and the outer contours of the products, waste materials in small holes are discharged by the waste material discharging belt through the adhesive force of the adhesive surface of the waste material discharging belt, and the waste material discharging belt can not bring the products because the main areas of the products are fixed on the outer contours of the products through the fixed adhesive tape, so that the displacement of the products is effectively prevented.
The width value of the fixed adhesive tape is larger than that of the waste discharge adhesive tape.
The width value of the fixed adhesive tape is 1-1.5 mm larger than that of the waste discharge adhesive tape.
Preferably, the width of the fixing tape is 1mm greater than that of the waste tape.
The fixing adhesive tape and the waste discharge adhesive tape are arranged in parallel, and the distance between the waste discharge adhesive tape and the fixing adhesive tape is 1-2 mm.
Preferably, the distance between the waste discharge adhesive tape and the fixing adhesive tape is 1 mm.
Each waste discharge adhesive tape is matched with one fixed adhesive tape respectively.
In order to ensure that the fixing force of the fixing adhesive tape to the product is greater than the upward tearing force applied by the waste discharge product to the product, and considering that the invention is suitable for products in small batches or in a sample stage and needs manual operation of operators, the invention preferably designs the widths and the sticking positions of the waste discharge adhesive tape and the fixing adhesive tape, and preferably selects the adhesive force of the two adhesive tapes, thereby ensuring the smooth waste discharge and facilitating the operation of workers.
The small holes are circular holes.
The width value of the waste discharge adhesive tape is 1-2 mm larger than the diameter value of the small hole.
The waste discharge method is suitable for products in a development stage or a sample stage.
Compared with the prior art, the invention has the following advantages:
(1) compared with the manual punching for waste discharge, the method saves manpower and material resources and improves the production capacity;
(2) compared with the method adopting twice punching and adopting the adhesive tape to discharge waste, the method can obtain the product through one-time punching, has higher dimensional precision and effectively improves the production efficiency;
(3) the method is suitable for the production of small-batch products or products in a sample stage, is simple to operate, has cheap and easily-obtained used tools, and has higher economic benefit;
(4) adopt on the fixed adhesive tape is fixed in the outline waste material with die-cut product, when tearing off waste discharge adhesive tape, can not take the product up and make the product take place the displacement, guarantee that the relative distance between the product satisfies the requirement, if there is follow-up processing, the product need not direct positioning, can directly get into the subsequent handling.
Drawings
FIG. 1 is a schematic view of a cutting die used in the present invention;
FIG. 2 is a schematic view showing the sticking positions of the waste tape and the fixing tape in the present invention;
FIG. 3 is a schematic view showing the sticking position of the waste tape in comparative example 1;
FIG. 4 is a schematic view showing a process of removing the waste tape in comparative example 1;
FIG. 5 is a schematic structural view of a one-time punching mold in comparative example 2;
fig. 6 is a schematic structural view of the secondary punching mold in comparative example 2;
FIG. 7 is a schematic view showing the sticking position of the waste tape in comparative example 2;
in the figure, 1 is a cutting die, 2 is a product, 3 is outer contour waste, 4 is a small hole, 5 is waste discharge adhesive tape, 6 is fixing adhesive tape, 7 is a primary punching cutting die, and 8 is a secondary punching cutting die.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications can be made by persons skilled in the art without departing from the spirit of the invention. All falling within the scope of the present invention.
Examples
A small hole waste discharge method for die cutting of single-sided adhesive products comprises the following steps:
(1) the method comprises the following steps of (1) punching a raw material belt once by using a cutting die 1 to finish a small hole 4 and the external outline of a product, wherein the cutting die used in the process is shown in figure 1 and comprises a product outline cutting line and a small hole cutting line;
(2) sticking the strip waste discharge adhesive tape 5 on the raw material belt along the connecting line of the small holes 4; sticking a strip-shaped fixed adhesive tape 6 on the raw material belt along the axial direction of the raw material belt, and sticking and fixing two ends of the fixed adhesive tape 6 on the outer contour waste 3 of the raw material belt; the fixing tape 6 is not overlapped with the waste discharge tape 5, as shown in fig. 2; in order to ensure that the fixing force of the fixing adhesive tape to the product is greater than the upward tearing force applied to the product by the waste discharge product, and meanwhile, considering that the invention is suitable for products in small batches or at a sample stage, the manual operation of an operator is needed; in the embodiment, the width of the waste discharge adhesive tape 5 is 4mm, the waste discharge adhesive tape is attached to the position of a circular hole, the width of the fixing adhesive tape 6 is 5mm, the fixing adhesive tape 6 is attached to a position about 1mm below the waste discharge adhesive tape 5 with the thickness of 4mm, and the fixing adhesive tape 6 and the waste discharge adhesive tape 5 are arranged in parallel; each waste discharge adhesive tape 5 is matched with one fixed adhesive tape 6; the waste adhesive tape 6 completely covers the small hole 4 and is 1mm larger than the diameter of the small hole 4.
(3) The waste discharge adhesive tape 5 is torn off, the waste discharge adhesive tape 5 takes up the waste materials in the small holes 4 by the adhesive force of the adhesive surface of the waste discharge adhesive tape, but the product is fixed by the fixing adhesive tape 6 and cannot be taken up by the waste discharge adhesive tape 5 from the bearing material belt or the bearing release film;
(4) and (3) removing the fixed adhesive tape 6 by using an adhesive tape stripping knife to complete waste discharge, and discharging the outer contour waste 3 of the product after the waste discharge to obtain the product 2.
Comparative example 1
A small hole waste discharge method for die cutting of single-sided adhesive products comprises the following steps:
(1) the method comprises the following steps of (1) punching a raw material belt once by using a cutting die 1 to finish a small hole 4 and the external outline of a product, wherein the structure of the cutting die used in the process is the same as that of the cutting die in the embodiment and comprises a product outline cutting line and a small hole cutting line;
(2) sticking the waste discharge adhesive tape 5 on the raw material belt, as shown in figure 3;
(3) tear waste discharge adhesive tape 5 and remove, waste discharge adhesive tape 5 relies on the adhesive force of its face of gluing to bring up the waste material in aperture 4, but the profile department of product has taken off with the raw materials material this moment, and during the wasting discharge, waste discharge adhesive tape 5 can bring the product up, as shown in figure 4, causes the displacement of product to also can't accomplish the wasting discharge, the product defective rate is high.
Comparative example 2
A small hole waste discharge method for die cutting of single-sided adhesive products comprises the following steps:
(1) punching a small hole 4 structure on the raw material belt by adopting a primary punching cutter die 7, wherein the cutter die structure used in the process is shown in figure 5;
(2) waste discharge adhesive tapes are stuck on the raw material tapes punched with the small holes 4, as shown in fig. 7, the waste discharge adhesive tapes 5 carry waste materials in the small holes 4 by virtue of the adhesive force of the adhesive surfaces of the waste discharge adhesive tapes, and the products cannot be carried when the circular hole waste materials are discharged because the outer contours of the products are not punched;
(3) and (3) punching the outer contour of the product on the raw material belt by adopting a secondary punching cutting die 8, wherein the cutting die structure used in the process is shown in figure 6, and the waste material of the contour is discharged, namely the finished product.
The method needs two-step punching, has lower productivity, increases equipment and is not beneficial to improving economic benefit.
Compared with the comparative example 1, the method of the embodiment adopts the fixing adhesive tape to fix the punched product on the outer contour waste material, when the waste discharge adhesive tape is torn off, the product cannot be taken up to cause the product to displace, the relative distance between the products is ensured to meet the requirement, and if the subsequent processing is carried out, the product can directly enter the subsequent working procedure without direct positioning; complete waste discharge and low product failure rate, and is favorable for improving the product quality.
Compared with the comparative example 2, the method of the embodiment can obtain the product by punching once, has higher dimensional precision, effectively improves the production efficiency, saves 1 step and can improve the productivity by 1 time.
Compared with the manual hole poking and waste discharging, the automatic punching machine saves manpower and material resources and improves the production capacity.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes and modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention.
Claims (8)
1. A waste discharge method for die-cutting small holes of single-sided adhesive products is characterized by comprising the following steps:
punching the raw material belt once by using a cutting die (1) to finish the small holes (4) and the external outline of the product;
sticking the strip waste discharge adhesive tape (5) on the raw material belt along the connecting line of the small holes (4); sticking a strip-shaped fixing adhesive tape (6) on the raw material tape along the axial direction of the raw material tape, wherein two ends of the fixing adhesive tape (6) are stuck and fixed on the outer contour waste (3) of the raw material tape; the fixed adhesive tape (6) is not overlapped with the waste discharge adhesive tape (5);
tearing off the waste discharge adhesive tape (5) and taking up waste materials in the small holes (4);
the fixing adhesive tape (6) is removed by an adhesive tape stripping knife.
2. The method for discharging die-cut small holes of single-sided adhesive products as claimed in claim 1, wherein the width of said fixing tape (6) is greater than the width of said waste tape (5).
3. The method for discharging the small holes of the die-cut single-sided adhesive products as claimed in claim 2, wherein the width of the fixing adhesive tape (6) is 1-1.5 mm larger than that of the waste adhesive tape (5).
4. A method as claimed in claim 3, wherein the width of said fixing tape (6) is 1mm larger than the width of said waste tape (5).
5. The method for discharging the small holes in the die-cutting of the single-sided adhesive products as claimed in claim 1, wherein the fixing adhesive tape (6) and the waste adhesive tape (5) are arranged in parallel, and the distance between the waste adhesive tape (5) and the fixing adhesive tape (6) is 1-2 mm.
6. The method for discharging the die-cut small holes of the single-sided adhesive products as claimed in claim 1, wherein the distance between the waste adhesive tape (5) and the fixing adhesive tape (6) is 1 mm.
7. A method for discharging die-cut small holes of single-sided adhesive products according to claim 4, wherein each waste tape (5) is matched with one fixing tape (6).
8. The method for discharging the die-cut small holes of the single-sided adhesive products as claimed in claim 1, wherein the small holes (4) are circular holes, and the width of the waste adhesive tape (5) is 1-2 mm larger than the diameter of the small holes (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910605137.2A CN112171783B (en) | 2019-07-05 | 2019-07-05 | Small hole waste discharge method for die cutting of single-sided adhesive product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910605137.2A CN112171783B (en) | 2019-07-05 | 2019-07-05 | Small hole waste discharge method for die cutting of single-sided adhesive product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112171783A true CN112171783A (en) | 2021-01-05 |
| CN112171783B CN112171783B (en) | 2022-06-03 |
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| CN201910605137.2A Active CN112171783B (en) | 2019-07-05 | 2019-07-05 | Small hole waste discharge method for die cutting of single-sided adhesive product |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113199560A (en) * | 2021-05-11 | 2021-08-03 | 苏州安洁科技股份有限公司 | Pre-cut profiling waste film discharging and die cutting processing technology thereof |
| CN113241526A (en) * | 2021-05-10 | 2021-08-10 | 广州制联物联网科技有限公司 | Manufacturing method of environment-friendly RFID tag antenna |
| CN113619135A (en) * | 2021-08-10 | 2021-11-09 | 苏州安洁科技股份有限公司 | Small-hole semi-cutting waste discharge process |
| CN116038808A (en) * | 2023-03-31 | 2023-05-02 | 苏州可川电子科技股份有限公司 | Small multi-mode product waste discharge device and waste discharge method |
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| CN113241526A (en) * | 2021-05-10 | 2021-08-10 | 广州制联物联网科技有限公司 | Manufacturing method of environment-friendly RFID tag antenna |
| CN113199560A (en) * | 2021-05-11 | 2021-08-03 | 苏州安洁科技股份有限公司 | Pre-cut profiling waste film discharging and die cutting processing technology thereof |
| CN113619135A (en) * | 2021-08-10 | 2021-11-09 | 苏州安洁科技股份有限公司 | Small-hole semi-cutting waste discharge process |
| CN116038808A (en) * | 2023-03-31 | 2023-05-02 | 苏州可川电子科技股份有限公司 | Small multi-mode product waste discharge device and waste discharge method |
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| Publication number | Publication date |
|---|---|
| CN112171783B (en) | 2022-06-03 |
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Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee after: Shanghai Haobai Zhizao Precision Electronics Co.,Ltd. Address before: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |
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