CN111136726B - Concentric die cutting processing technology - Google Patents
Concentric die cutting processing technology Download PDFInfo
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- CN111136726B CN111136726B CN201911392823.2A CN201911392823A CN111136726B CN 111136726 B CN111136726 B CN 111136726B CN 201911392823 A CN201911392823 A CN 201911392823A CN 111136726 B CN111136726 B CN 111136726B
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- cutting
- waste
- die
- die cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
Abstract
The invention provides a concentric die cutting processing technology, which comprises the following steps: s1, carrying out primary die cutting on the adhesive surface, cutting off waste materials in areas except the adhesive areas, and removing waste materials of the adhesive layer formed by die cutting; s2, performing secondary die cutting on the self-adhesive surface to form the outer contour of the product, the back adhesive holes on each adhesive area and the positioning holes which are concentrically arranged with the corresponding back adhesive holes on the release film at one time; and S3, removing the adhesive layer waste and the release film waste formed by the secondary die cutting in a waste extracting mode. The concentric die cutting processing technology adopts a mode of integrally cutting products aiming at the products needing concentricity control. The back glue hole and the positioning hole of the product are cut by one knife, the concentricity is ensured, the waste extraction treatment is carried out, and the waste extraction knife is optimized, so that the waste can be normally extracted.
Description
Technical Field
The invention relates to the technical field of die cutting processing, in particular to a concentric die cutting processing technology for auxiliary material die cutting applied to a mobile phone.
Background
At present, the general control range of the precision of the existing mobile phone accessories is +/-0.15 mm, and when the mobile phone accessories meet a product with concentricity size control. In order to ensure the die cutting precision, a small hole nesting process can be adopted, and the concentricity precision can reach +/-0.12 mm by adopting the process of simultaneously punching and nesting. However, in the above process, two hole structures concentrically arranged are respectively die-cut, so when the precision of the positioning hole punched by the sleeve position is problematic, it is difficult to ensure the precision of the concentric structure formed by die-cutting. Therefore, it is necessary to provide a further solution to the above problems.
Disclosure of Invention
The invention aims to provide a concentric die cutting processing technology to overcome the defects in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a concentric die-cutting processing technology is suitable for die-cutting processing of a product formed by combining an adhesive layer and a release layer together, and comprises the following steps:
s1, carrying out primary die cutting on the adhesive surface, cutting off waste materials in areas except the adhesive areas, and removing waste materials of the adhesive layer formed by die cutting;
s2, performing secondary die cutting on the self-adhesive surface to form the outer contour of the product, the back adhesive holes on each adhesive area and the positioning holes which are concentrically arranged with the corresponding back adhesive holes on the release film at one time;
and S3, removing the adhesive layer waste and the release film waste formed by the secondary die cutting in a waste extracting mode.
As an improvement of the concentric die cutting processing technology, the first die cutting is carried out from the glue surface through a first cutting die, and the first cutting die comprises: the first knife edges are suitable for cutting off waste materials in areas except the glue areas during die cutting, the number of the first knife edges corresponds to the number of the glue areas, and the first knife edges are the same or different in shape.
As an improvement of the concentric die cutting processing technology, the first cutting dies are multiple, and the multiple first cutting dies are continuously arranged according to the conveying direction of the product material belt.
As an improvement of the concentric die cutting processing technology, the second die cutting is carried out from the glue surface through a second cutting die, and the second cutting die comprises: the die cutting device comprises a second cutting edge for forming the external outline of a product during die cutting, a third cutting edge for forming a gum hole in each gum area, and a fourth cutting edge for concentrically arranging a positioning hole in the release film corresponding to the gum hole, wherein the third cutting edge and the fourth cutting edge are positioned in an area surrounded by the second cutting edge, and the third cutting edge and the corresponding fourth cutting edge are concentrically arranged.
As an improvement of the concentric die cutting process of the present invention, the second blade includes: the handle comprises a first circular cutting edge and a handle cutting edge connected to one side of the first circular cutting edge.
As an improvement of the concentric die cutting processing technology, the second cutting edges of the third cutting edges are closed cutting edges with the same shape or different shapes.
As an improvement of the concentric die cutting processing technology, the third cutting edge of each fourth cutting edge is a closed cutting edge which is smaller than the second cutting edge of the third cutting edge in size and is concentrically arranged with the third cutting edge.
As an improvement of the concentric die cutting processing technology, the waste material of the adhesive layer and the waste material of the release film formed by secondary die cutting are removed through a plurality of waste extracting knives, and each waste extracting knife is arranged corresponding to each waste extracting area.
Compared with the prior art, the invention has the beneficial effects that: the concentric die cutting processing technology adopts a mode of integrally cutting products aiming at the products needing concentricity control. The back glue hole and the positioning hole of the product are cut by one knife, the concentricity is ensured, the waste extraction treatment is carried out, and the waste extraction knife is optimized, so that the waste can be normally extracted.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a product formed by a glue layer and a release layer combined together according to an embodiment of the present invention;
FIG. 2 is a die diagram of a first die in accordance with an embodiment of the present invention;
FIG. 3 is a diagram of a second cutting die according to an embodiment of the present invention;
fig. 4 is a die diagram of a waste extracting knife in the embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the product according to the present embodiment includes: and the adhesive layer a and the release layer b are compounded together. The glue layer a is divided into a plurality of areas, and the glue areas a1 are arranged separately. Meanwhile, any glue area a1 is also provided with one or more glue-backed holes a11, the number of the glue-backed holes a11 on each glue area a1 is one or more, and the shapes of the glue-backed holes a11 are the same or different. The release layer b is compounded on one surface of the adhesive layer a, and the outline shape of the release layer b is consistent with that of the adhesive layer a. And the release layer b is also provided with a positioning hole b1, and the positioning hole b1 and the corresponding adhesive-backed hole a11 are concentrically arranged.
The processing technology of the embodiment comprises the following steps:
and S1, carrying out primary die cutting on the adhesive surface, cutting off waste materials of areas except the adhesive areas, and removing waste materials of the adhesive layer formed by die cutting.
As shown in fig. 2, regarding step S1, in one embodiment, the first cutting die is performed from the adhesive surface by a first cutting die 1, and the first cutting die 1 includes: the first blades 11 are suitable for cutting waste materials in areas except a plurality of glue areas during die cutting, the number of the first blades 11 corresponds to the number of the glue areas, and the shapes of the first blades 11 are the same or different. And in the die cutting process, the die cutting is stopped when the first blade 11 die cuts to the release layer, so that the plurality of adhesive areas are formed on the adhesive layer only by die cutting. In order to facilitate the elimination of waste of the adhesive layer formed by die cutting, the first cutting edge 11 is overlapped with the adjacent two die cutting positions so as to form strip waste suitable for waste discharge.
According to actual cross cutting demand, can set up first cutting die 1 and be a plurality of, a plurality of first cutting die 1 set up according to the direction of delivery in product material area in succession. For example, as shown in fig. 2, six first cutting dies 1 are provided in series. Thus, the primary die cutting of six products can be realized through one action of the first cutting die 1.
And S2, performing secondary die cutting on the self-adhesive surface to form the outer contour of the product, the adhesive-backed holes on each adhesive area and the positioning holes which are concentrically arranged with the corresponding adhesive-backed holes on the release film.
As shown in fig. 3, for step S2, in one embodiment, the second cutting is performed by the second cutting die 2 from the glue surface, and the second cutting die 2 includes: the second blade 21 for forming the external profile of the product during die cutting, the third blade 22 for the gum hole on each gum area, and the fourth blade 23 for the positioning hole concentrically arranged with the corresponding gum hole on the release film.
The third blade 22 and the fourth blade 23 are located in the area surrounded by the second blade 21, and the third blade 22 and the corresponding fourth blade 23 are concentrically disposed. Thus, the third blade 22 and the fourth blade 23 which are concentrically arranged can ensure the accuracy of the concentric structure formed by die cutting. And during die cutting, the second blade 21 performs die cutting on the adhesive layer and the release layer, the third blade 22 stops performing die cutting until the release layer is formed, and the fourth blade performs die cutting until the release layer is formed. Therefore, the first blade 21, the second blade 22, and the third blade 23 need to be provided at a corresponding height.
The fourth cutting edges 23 may be concentrically provided inside the corresponding third cutting edges 22 according to actual requirements that the fourth cutting edges 23 may be provided in part or all of the third cutting edges 22. Meanwhile, when a plurality of first cutting dies 1 are provided, the corresponding second cutting dies 2 may be provided according to the number of the first cutting dies 1.
In one embodiment, the second blade 21 comprises: the handle cutting edge is connected to the handle cutting edge on one side of the first circular cutting edge. Thus, the outer contour of the product with the handle is die-cut by the second blade 21.
In one embodiment, the second edge of each third blade 22 is a closed edge with the same or different shape. Wherein, the shape is the same includes: the shapes are all the same or partially the same. Accordingly, the differences in shape include: the shapes may be all different or partially different.
In one embodiment, the third edge of each fourth blade 23 is a closed edge having a size smaller than the second edge of the third blade 22 and concentrically disposed therewith. The distance between the third cutting edge 22 and the fourth cutting edge 23 can be set according to requirements, and can be 1.57-2.41 mm, for example.
And S3, removing the adhesive layer waste and the release film waste formed by the secondary die cutting in a waste extracting mode.
As shown in fig. 4, in step S3, considering that a conventional inner-contracting outer frame cannot be used as a waste extracting knife due to one-knife forming of a product, and the minimum extracting position interval is only 0.8mm, the size of the waste extracting knife needs to be designed according to the actual cutting size of the product, so as to increase the interval between the waste extracting knife line and the knife line. In one embodiment, the waste extracting knives 3 are used for removing the adhesive layer waste and the release film waste formed by the secondary die cutting, the waste extracting knives 3 are multiple, each waste extracting knife 3 is arranged corresponding to each waste extracting area, and the distance between the waste extracting knives 3 is ensured not to interfere with each other.
In conclusion, the concentric die cutting processing technology provided by the invention adopts a product integral cutting mode for products needing concentricity control. The back glue hole and the positioning hole of the product are cut by one knife, the concentricity is ensured, the waste extraction treatment is carried out, and the waste extraction knife is optimized, so that the waste can be normally extracted.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. A concentric die cutting processing technology is suitable for die cutting processing of a product formed by combining an adhesive layer and a release layer together, and is characterized by comprising the following steps:
s1, carrying out primary die cutting on the adhesive surface, cutting off waste materials in areas except the adhesive areas, and removing waste materials of the adhesive layer formed by die cutting;
carry out the first time cross cutting from gluing the face through first cutting die, first cutting die includes: the first cutting edges are suitable for cutting off waste materials in areas except the glue areas during die cutting, the number of the first cutting edges is corresponding to that of the glue areas, and the shapes of the first cutting edges are the same or different;
s2, performing secondary die cutting on the self-adhesive surface to form the outer contour of the product, the back adhesive holes on each adhesive area and the positioning holes which are concentrically arranged with the corresponding back adhesive holes on the release film at one time;
carry out the cross cutting of second time through second cutting die from gluing the face, second cutting die includes: the die cutting device comprises a second blade for forming the external outline of a product during die cutting, a third blade for forming a gum hole on each gum area, and a fourth blade for concentrically arranging a positioning hole on a release film corresponding to the gum hole, wherein the third blade and the fourth blade are positioned in an area surrounded by the second blade, and the third blade and the corresponding fourth blade are concentrically arranged;
s3, removing adhesive layer waste and release film waste formed by secondary die cutting in a waste extraction mode;
the waste extracting knife is used for removing the waste materials of the adhesive layer formed by secondary die cutting and the waste materials of the release film, the waste extracting knife is multiple, and each waste extracting knife and each waste extracting area are correspondingly arranged.
2. The process of claim 1, wherein the first plurality of dies is arranged in series with the direction of feed of the strip of product.
3. The concentric die cutting process of claim 1, wherein the second cutting edge comprises: the handle comprises a first circular cutting edge and a handle cutting edge connected to one side of the first circular cutting edge.
4. The process of claim 1, wherein the second edge of each third blade is a closed edge of the same or different shape.
5. The concentric die cutting process of claim 4 wherein the third edge of each fourth blade is a closed edge sized smaller than the second edge of the third blade and disposed concentrically therewith.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911392823.2A CN111136726B (en) | 2019-12-30 | 2019-12-30 | Concentric die cutting processing technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911392823.2A CN111136726B (en) | 2019-12-30 | 2019-12-30 | Concentric die cutting processing technology |
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| Publication Number | Publication Date |
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| CN111136726A CN111136726A (en) | 2020-05-12 |
| CN111136726B true CN111136726B (en) | 2021-12-03 |
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| CN201911392823.2A Active CN111136726B (en) | 2019-12-30 | 2019-12-30 | Concentric die cutting processing technology |
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Families Citing this family (1)
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| CN111621237B (en) * | 2020-06-29 | 2023-10-20 | 捷邦精密科技股份有限公司 | High-precision hot melt adhesive die-cutting assembly for mobile phone camera and die-cutting production process thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3956616B2 (en) * | 2000-06-07 | 2007-08-08 | 松下電器産業株式会社 | Method for processing sheet member and method for manufacturing movable contact body series using the same |
| CN102689327A (en) * | 2011-03-25 | 2012-09-26 | 比亚迪股份有限公司 | Die cutting preparation method of reflection strip attached with shading adhesive |
| CN202952576U (en) * | 2012-12-18 | 2013-05-29 | 苏州百诚精密科技有限公司 | Continuous die for machining conductive glue |
| CN204123472U (en) * | 2014-10-17 | 2015-01-28 | 苏州百诚精密科技有限公司 | Two one-step forming cutting die groups |
| CN205630841U (en) * | 2016-04-29 | 2016-10-12 | 苏州滕艺科技有限公司 | Cross cutting structure |
| CN207071992U (en) * | 2017-07-05 | 2018-03-06 | 川扬电子（重庆）有限公司 | Wheat draws etching mould |
| CN208117979U (en) * | 2018-03-16 | 2018-11-20 | 厦门京嘉光电科技有限公司 | A kind of die-cutting device of different-thickness and the glue product of shape |
| CN209394781U (en) * | 2019-01-23 | 2019-09-17 | 东莞市达瑞电子股份有限公司 | A kind of cutting die |
-
2019
- 2019-12-30 CN CN201911392823.2A patent/CN111136726B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3956616B2 (en) * | 2000-06-07 | 2007-08-08 | 松下電器産業株式会社 | Method for processing sheet member and method for manufacturing movable contact body series using the same |
| CN102689327A (en) * | 2011-03-25 | 2012-09-26 | 比亚迪股份有限公司 | Die cutting preparation method of reflection strip attached with shading adhesive |
| CN202952576U (en) * | 2012-12-18 | 2013-05-29 | 苏州百诚精密科技有限公司 | Continuous die for machining conductive glue |
| CN204123472U (en) * | 2014-10-17 | 2015-01-28 | 苏州百诚精密科技有限公司 | Two one-step forming cutting die groups |
| CN205630841U (en) * | 2016-04-29 | 2016-10-12 | 苏州滕艺科技有限公司 | Cross cutting structure |
| CN207071992U (en) * | 2017-07-05 | 2018-03-06 | 川扬电子（重庆）有限公司 | Wheat draws etching mould |
| CN208117979U (en) * | 2018-03-16 | 2018-11-20 | 厦门京嘉光电科技有限公司 | A kind of die-cutting device of different-thickness and the glue product of shape |
| CN209394781U (en) * | 2019-01-23 | 2019-09-17 | 东莞市达瑞电子股份有限公司 | A kind of cutting die |
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| CN111136726A (en) | 2020-05-12 |
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