CN208117979U - A kind of die-cutting device of different-thickness and the glue product of shape - Google Patents
A kind of die-cutting device of different-thickness and the glue product of shape Download PDFInfo
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- CN208117979U CN208117979U CN201820365182.6U CN201820365182U CN208117979U CN 208117979 U CN208117979 U CN 208117979U CN 201820365182 U CN201820365182 U CN 201820365182U CN 208117979 U CN208117979 U CN 208117979U
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Abstract
The utility model discloses a kind of different-thickness and the die-cutting device of the glue product of shape, raw material include the lower film layer being successively bonded, PET film layer and upper film layer, which includes：Board；For transmitting the transport mechanism of material, it is installed in board；It is greater than the area the B resigning portion in the area B for cutting out size in upper film layer, pastes glue material in the area B resigning portion and cuts out the first die cutting mechanism of the area B shape glue material, the first die cutting mechanism is installed in board；For cutting out the area A resigning portion and the area C resigning portion in upper film layer, pasting glue material in the area A resigning portion and the area C resigning portion and cutting out the second die cutting mechanism of the area A shape glue material and the area C shape glue material, the second die cutting mechanism is installed in board.Since entire die-cutting device is compact-sized, high degree of automation, the operator needed is less, can save larger manpower and material resources, save the cost.And fraction defective substantially reduces compared with traditional truncation technology.
Description
Technical field
The utility model relates to a kind of different-thickness and the die-cutting devices of the glue product of shape.
Background technique
The glue product of different-thickness and shape is produced, traditional die-cutting device uses truncation technology, that is, cutting die just faces
Quasi- glue product is cut, and is contact of the face with face between cutting die and product, and fraction defective is high.And for different-thickness, difference
The glue product of shape, needs more cutting die to realize, and the semi-finished product that each cutting die is cut out are both needed to by manually being taken
It takes and is delivered to next cutting die.Equipment needed for producing finished product is more complex, production process is complicated, and personnel depaly is more, and one
Platform cutting die equipment just must be equipped with an operator, meanwhile, stock utilization is not high.
Utility model content
The utility model provides a kind of die-cutting device of the glue product of different-thickness and shape, and which overcome background techniques
Existing deficiency.The used technical solution that the utility model solves its technical problem is：
The die-cutting device of a kind of different-thickness and the glue product of shape, raw material include the lower film layer being successively bonded, PET film
Layer and upper film layer, it is characterised in that：It includes：
Board；
For transmitting the transport mechanism of material, it is installed in board；
It is greater than the area the B resigning portion in the area B for cutting out size in upper film layer, pastes glue material in the area B resigning portion and cuts out B
First die cutting mechanism of area's shape glue material, the first die cutting mechanism are installed in board；
For cutting out the area A resigning portion and the area C resigning portion in upper film layer, pasting glue material in the area A resigning portion and the area C resigning portion
And the second die cutting mechanism of the area A shape glue material and the area C shape glue material is cut out, the second die cutting mechanism is installed in board.
Among one preferred embodiment：First die cutting mechanism includes the area the B resigning that rotation is installed in board and is sequentially arranged
Portion's rotor, the area B resigning portion glue material rotor and the area B shape rotor, the area B resigning portion rotor periphery are equipped with the area the B resigning portion edge of a knife, the area B
Resigning portion glue material rotor periphery is equipped with the glue material edge of a knife for cutting the area B resigning portion shape glue material, and the area B shape rotor periphery is equipped with
The area the B shape edge of a knife.
Among one preferred embodiment：The glue material edge of a knife is strip and longitudinally extends along the area B resigning portion glue material rotor.
Among one preferred embodiment：First die cutting mechanism further includes the first row for removing the upper film of the area B resigning portion
Waste-removing device, for will be used for the area B resigning portion glue material and the 4th laminating apparatus that the area B resigning portion fits, will be outside the area B shape glue material
Second waste discharge apparatus of extra glue material removal, the first waste discharge apparatus are installed in board and are located at the area B resigning portion rotor rear, the
Four laminating apparatus are installed in board and between the area B resigning portion glue material rotor and the area B shape rotors, the second waste discharge apparatus attaching
In board and it is located at the area B shape rotor rear.
Among one preferred embodiment：It further include the first laminating apparatus for attaching protective film in the area B shape glue material, it should
First laminating apparatus is installed in board and is located at the area B shape rotor rear.
Among one preferred embodiment：Second die cutting mechanism includes rotating the area A and the area C for being installed in board and being sequentially arranged
Resigning portion rotor and the area A and the area C shape glue material rotor, the area A and the area C resigning portion rotor periphery are equipped with upper and lower spaced apart A
Area's resigning portion edge of a knife and the area the C resigning portion edge of a knife, the area A and the area C shape glue material rotor periphery are equipped with the upper and lower spaced apart area A shape
The edge of a knife and the area the C shape edge of a knife.
Among one preferred embodiment：Second die cutting mechanism further includes for removing the upper film of the area A and the area C resigning portion
Three waste discharge apparatus, the second laminating apparatus and use for the area A and the area C resigning portion glue material to be attached to the area A and the area C resigning portion respectively
In by the 4th waste discharge apparatus of glue material removal extra outside the area A and the area C shape glue material, third waste discharge apparatus is installed in board and position
In the area A and the area C resigning portion rotor rear, the second laminating apparatus is located in front of the area A and the area C shape glue material rotor, the 4th waste discharge dress
It sets and is installed in board and is located at the area A and the area C shape glue material rotor rear.
Among one preferred embodiment：Further include the 5th waste discharge apparatus for removing lower film layer and is used to paste release film
The third laminating apparatus being attached to above the area B, the area A and the area C shape glue material, the 5th waste discharge apparatus and third laminating apparatus are installed in
Board and it is respectively positioned on the area A and the area C shape glue material rotor rear.
Among one preferred embodiment：It further include third die cutting mechanism, it includes for PET film to be cut out the area D shape simultaneously
The area the D shape rotor of shaping is carried out to the area A and the area C shape glue material and the 6th waste discharge apparatus for removing extra PET film,
The area D shape rotor is installed in board and is located at the area A and the area C shape glue material rotor rear.
Compared with the background art, it has the following advantages that the technical program：
1. the first die cutting mechanism will attach the glue material of the area B shape in the PET film floor of raw material, the second die cutting mechanism will be in original
The PET film floor of material attaches the glue material in the area A and the area C shape, and the area B, the area A and the area C shape, thickness can be set as needed as phase
Same or different, this kind of die-cutting device is more simple compared with traditional truncation technology and concentrates, and high degree of automation needs
Operator is less, can save larger manpower and material resources, save the cost.
2. first passing through the area B resigning portion rotor cuts out the B area resigning portion more bigger than the area B shape, the upper of the resigning portion is rejected
After film, then glue material raw material cut by strip by the area B resigning portion glue material rotor and by being attached to the area B resigning portion, then led to
It crosses the area B shape rotor and the glue material for being attached to the area B resigning portion is cut into the area B shape, and extra waste material is removed, that is, complete
The attaching of the area B glue material.Whole process is automatically performed, and carries out hand-held transfer without operator.
3. the edge of a knife in the area A and the area C is arranged on same rotor, and the area A and C since the area A is similar with the area C shape size
Area's size is smaller, and cutting without the glue material to the resigning portion region can directly be attached in the area A and the area C resigning portion, makes
The second die cutting mechanism compact overall structure and simple.
PET film is cut out the area D shape and carries out shaping to the area A and the area C shape glue material by the area 4.D rotor, then passes through the 6th
Waste discharge apparatus removes extra PET film, obtains final finished product.
Detailed description of the invention
The utility model is described in further detail with reference to the accompanying drawings and examples.
Fig. 1 depicts the perspective structure schematic diagram of glue product.
Fig. 2 depicts the distribution schematic diagram of the area glue product A glue material floor, the area B glue material floor and the area C glue material floor.
Fig. 3 depicts the distribution schematic diagram of the area glue product A glue material floor, the area B glue material floor, the area C glue material floor and the area D PET film floor.
Fig. 4 depicts the expanded schematic diagram of the area B resigning portion rotor.
Fig. 5 depicts the expanded schematic diagram of the area B resigning portion glue material rotor.
Fig. 6 depicts the expanded schematic diagram of the area B shape glue material rotor.
Fig. 7 depicts the expanded schematic diagram in the area A and the area C resigning portion rotor.
Fig. 8 depicts the expanded schematic diagram in the area A and the area C shape glue material rotor.
Fig. 9 depicts the expanded schematic diagram of the area D shape rotor.
Specific embodiment
Please refer to Fig. 1 to Fig. 9, an a kind of preferred embodiment of the die-cutting device of the glue product of different-thickness and shape.
Raw material include the lower film layer being successively bonded, PET film layer and upper film layer.
As shown in Figure 1 to Figure 3, glue product includes the PET film floor 1 of the area the D shape positioned at bottom, is located in the middle the area B shape
Glue material floor 2, the area A glue material floor 3 and the area the C shape glue material floor 4 of shape and the release film layer 5 positioned at top layer, the glue area product A and
The glue material in the area C is with a thickness of three times of the area B glue material thickness, and the area B shape is all different with the area A, the area C shape.
Die-cutting device includes board, transport mechanism, the first die cutting mechanism and the second die cutting mechanism.
For transport mechanism for transmitting material, it is installed in board.
First die cutting mechanism is used to cut out size in upper film layer to be pasted greater than the area the B resigning portion in the area B, in the area B resigning portion
Glue material simultaneously cuts out the area B shape glue material, and the first die cutting mechanism is installed in board；
In the present embodiment, the first die cutting mechanism includes rotating the area the B resigning portion rotor for being installed in board and being sequentially arranged
10, the area B resigning portion glue material rotor 20 and the area B shape rotor 30.
As shown in figure 4, resigning portion rotor 10 periphery in the area B is equipped with the area the B resigning portion edge of a knife 11,11 size of the area the B resigning portion edge of a knife
And its number more bigger than the area B size is set as five and uniform intervals are arranged.The resigning portion edge of a knife 11 numbers in the area B are to be actually needed
Standard is not limited.
In the present embodiment, the first die cutting mechanism further includes the first waste discharge apparatus for removing the upper film of the area B resigning portion,
First waste discharge apparatus is installed in board and is located at 10 rear of the area B resigning portion rotor.Due to the waste discharge of waste discharge apparatus and truncation technology
Device is same or like, repeats no more.
As shown in figure 5, resigning portion glue material rotor 20 periphery in the area B is equipped with the glue material for cutting the area B resigning portion shape glue material
The edge of a knife 21.In the present embodiment, the glue material edge of a knife 21 is strip and longitudinally extends along the area B resigning portion glue material rotor.Two neighboring glue
A glue material is cut between the material edge of a knife 21, every glue material size is same or similar with the area B resigning portion size seemingly.
First die cutting mechanism further include for will be used for the area B resigning portion glue material with the area B resigning portion fits the 4th is bonded
Device, the 4th laminating apparatus are installed in board and between the area B resigning portion glue material rotor and the area B shape rotors.The present embodiment
In, the 4th laminating apparatus is the rolling axle that rotation is installed in board, by the raw material for cutting out the area B resigning portion and the glue cut
Item fits in rolling axle.
As shown in fig. 6, shape rotor 30 periphery in the area B is equipped with the area the B shape edge of a knife 31.The area the B shape edge of a knife 31 and the area B shape are complete
It is complete consistent.
In the present embodiment, the first die cutting mechanism further includes second for removing glue material extra outside the area B shape glue material
Waste discharge apparatus, the second waste discharge apparatus are installed in board and are located at 30 rear of the area B shape rotor.
In the present embodiment, which further includes the first fitting dress for attaching protective film in the area B shape glue material 2
It sets, which is installed in board and is located at 30 rear of the area B shape rotor.The protective film is for protecting the area B shape glue
Material 2 is damaged to avoid being influenced by subsequent action.The protective film shape size is identical as the area B shape size.
The working principle of first die cutting mechanism is：
Raw material are sent at the area B resigning portion rotor 10 by transport mechanism, and the area the B resigning portion edge of a knife 11 is cut in upper film layer
Size is greater than the area the B resigning portion in the area B out, and is removed the upper film of the area B resigning portion by the first waste discharge apparatus；At the same time, glue
Glue material is cut into strip by the material edge of a knife 21, and the size and the area B resigning portion adjoining dimensions of the strip glue material are seemingly；Pass through the 4th again
The glue material of strip is attached to the area B resigning portion by laminating apparatus, and transport mechanism transmits the raw material for having attached strip adhesive tape
To the area B shape rotor 30, strip glue material is cut by the area B shape by the area the B shape edge of a knife 31, then passes through the second waste discharge
Device removes glue material extra outside the area B shape glue material, just completes cutting for the area B shape glue material at this time.Then, the first fitting dress
It sets and attaches protective film in the area B shape glue material 2, to wait the second die cutting mechanism to carry out die cut operation.
Second die cutting mechanism is for cutting out the area A resigning portion and the area C resigning portion in upper film layer, allowing in the area A resigning portion and the area C
Position portion pastes glue material and cuts out the area A shape glue material and the area C shape glue material, and the second die cutting mechanism is installed in board.
In the present embodiment, the second die cutting mechanism includes that rotation is installed in board and the area A being sequentially arranged and the area C resigning portion
Rotor 40 and the area A and the area C shape glue material rotor 50.
In the present embodiment, the area A and 40 periphery of the area C resigning portion rotor are equipped with the upper and lower spaced apart area the A resigning portion edge of a knife 41
With the area the C resigning portion edge of a knife 42, the resigning portion edge of a knife 41 numbers in the area A are set as five and uniform intervals are arranged in the area A and the area C resigning portion knife
The lower part of roller 40, the resigning portion edge of a knife 42 numbers in the area C are set as five and uniform intervals are arranged in the area A and the area C resigning portion rotor 40
Top.Seemingly due to the area A size and the area C adjoining dimensions, by the area the A resigning portion edge of a knife 41 and the area the C resigning portion edge of a knife 42 in the present embodiment
It is arranged on same rotor, so that device structure is more compact and small and exquisite, it as needed, can also be by the area the A resigning portion edge of a knife 41 and C
Area's resigning portion edge of a knife 42 is separately positioned on different rotors.
In the present embodiment, the second die cutting mechanism further includes the third waste discharge for removing the upper film of the area A and the area C resigning portion
Device, third waste discharge apparatus are installed in board and are located at 40 rear of the area A and the area C resigning portion rotor.
In the present embodiment, the second die cutting mechanism further includes for the area A and the area C resigning portion glue material to be attached to the area A and C respectively
Second laminating apparatus of area's resigning portion, the second laminating apparatus are located at 50 front of the area A and the area C shape glue material rotor.The area A and the area C allow
Position portion glue material is the rectangle of lateral arrangement.Second laminating apparatus is identical as the 4th laminating apparatus structure, repeats no more.
The area A and 50 periphery of the area C shape glue material rotor are equipped with the upper and lower spaced apart area the A shape edge of a knife 51 and the area C shape knife
The area 52, A of mouth 51 numbers of the shape edge of a knife are set as six and uniform intervals are arranged in the lower end in the area A and the area C shape glue material rotor 50, C
Shape edge of a knife 52 numbers in area's are set as six and uniform intervals are arranged in the upper end in the area A and the area C shape glue material rotor 50.The area A shape
51 numbers of the edge of a knife can be adjusted according to actual needs with 52 numbers of the area the C shape edge of a knife, be not limited.
In the present embodiment, the second die cutting mechanism further includes for removing glue material extra outside the area A and the area C shape glue material
4th waste discharge apparatus, the 4th waste discharge apparatus are installed in board and are located at 50 rear of the area A and the area C shape glue material rotor.
In the present embodiment, which further includes the 5th waste discharge apparatus for removing lower film layer and be used for will be release
Film is attached to the third laminating apparatus of 4 top of the area B shape glue material 2, the area A shape glue material 3 and the area C shape glue material, the 5th waste discharge dress
It sets and is installed in board with third laminating apparatus and is respectively positioned on 50 rear of the area A and the area C shape glue material rotor.
Further include third die cutting mechanism in the present embodiment, it include for PET film is cut out into the area D shape and to the area A and
The area C shape glue material carries out the area the D shape rotor 60 of shaping and the 6th waste discharge apparatus for removing extra PET film, the area D shape
Shape rotor 60 is installed in board and is located at 50 rear of the area A and the area C shape glue material rotor.As shown in figure 9, outside the area D shape rotor 60
Week is equipped with the area the D shape edge of a knife 61, and the shape edge of a knife 61 numbers in the area D are set as six and uniform intervals are arranged in outside the area D shape rotor 60
Week.
The working principle of second die cutting mechanism is：
The material for having attached protective film is sent at the area A and the area C resigning portion rotor 40 by transport mechanism, the area A steps down
Upper film layer is cut out the area A resigning portion shape by portion's edge of a knife 41, and upper film layer is cut out the area C resigning portion shape by the area the C resigning portion edge of a knife 42
Shape, and removed the upper film of the area A resigning portion and the area C resigning portion by third waste discharge apparatus；Second laminating apparatus is by the area A and the area C
Resigning portion glue material is attached to the area A and the area C resigning portion respectively, then the area A resigning portion glue material is cut into A by the area the A shape edge of a knife 51
The area C resigning portion glue material is cut into the area C shape by area's shape, the area the C shape edge of a knife 52, then passes through the 4th waste discharge apparatus for the area A and the area C
Extra glue material removal outside shape glue material；Then, the 5th waste discharge apparatus removes the lower film layer of raw material, and third laminating apparatus will
Release film is attached to 4 top of the area B shape glue material 2, the area A shape glue material 3 and the area C shape glue material, then, passes through the area the D shape edge of a knife
PET film is cut out the area D shape and carries out shaping to the area A and the area C shape glue material by 61, will be extra finally by the 6th waste discharge apparatus
PET film removal, just complete the production of the glue product.
Since entire die-cutting device is compact-sized, high degree of automation, the operator needed is less, can save compared with adult
Power material resources, save the cost.And fraction defective substantially reduces compared with traditional truncation technology.
The above, only the utility model preferred embodiment, therefore, it cannot be limited according to, and the utility model is implemented
It is practical new to should still belong to this for range, i.e., equivalent changes and modifications made according to the scope of the patent of the utility model and the content of the manual
In the range of type covers.
Claims (9)
1. the die-cutting device of a kind of different-thickness and the glue product of shape, raw material include the lower film layer being successively bonded, PET film layer
With upper film layer, it is characterised in that：It includes：
Board；
For transmitting the transport mechanism of material, it is installed in board；
It is greater than the area the B resigning portion in the area B for cutting out size in upper film layer, pastes glue material in the area B resigning portion and cuts out the area B shape
First die cutting mechanism of shape glue material, the first die cutting mechanism are installed in board；
For cutting out the area A resigning portion and the area C resigning portion in upper film layer, pasting glue material in the area A resigning portion and the area C resigning portion and cut out
The second die cutting mechanism of the area A shape glue material and the area C shape glue material is cut out, the second die cutting mechanism is installed in board.
2. the die-cutting device of a kind of different-thickness according to claim 1 and the glue product of shape, it is characterised in that：First
Die cutting mechanism includes rotating the area B resigning portion rotor, the area B resigning portion glue material rotor and the area B for being installed in board and being sequentially arranged
Shape rotor, the area B resigning portion rotor periphery are equipped with the area the B resigning portion edge of a knife, and the area B resigning portion glue material rotor periphery is equipped with for cutting
The glue material edge of a knife of the area B resigning portion shape glue material, the area B shape rotor periphery are equipped with the area the B shape edge of a knife.
3. the die-cutting device of a kind of different-thickness according to claim 2 and the glue product of shape, it is characterised in that：Glue material
The edge of a knife is strip and longitudinally extends along the area B resigning portion glue material rotor.
4. the die-cutting device of a kind of different-thickness according to claim 2 and the glue product of shape, it is characterised in that：First
Die cutting mechanism further include for by the first waste discharge apparatus of the upper film of the area B resigning portion removal, be used to be used for the area B resigning portion glue material
The 4th laminating apparatus to fit with the area B resigning portion, the second waste discharge apparatus for removing glue material extra outside the area B shape glue material,
First waste discharge apparatus is installed in board and is located at the area B resigning portion rotor rear, and the 4th laminating apparatus is installed in board and is located at the area B
Between resigning portion glue material rotor and the area B shape rotor, the second waste discharge apparatus is installed in board and is located at the area B shape rotor rear.
5. the die-cutting device of a kind of different-thickness according to claim 1 and the glue product of shape, it is characterised in that：Also wrap
The first laminating apparatus for attaching protective film in the area B shape glue material is included, which is installed in board and is located at B
Area shape rotor rear.
6. the die-cutting device of a kind of different-thickness according to claim 1 and the glue product of shape, it is characterised in that：Second
Die cutting mechanism includes that rotation is installed in board and the area A and the area C resigning portion rotor that are sequentially arranged and the area A and the area C shape glue
Material rotor, the area A and the area C resigning portion rotor periphery are equipped with the upper and lower spaced apart area the A resigning portion edge of a knife and the area the C resigning portion edge of a knife, A
Area and the area C shape glue material rotor periphery are equipped with the upper and lower spaced apart area the A shape edge of a knife and the area the C shape edge of a knife.
7. the die-cutting device of a kind of different-thickness according to claim 6 and the glue product of shape, it is characterised in that：Second
Die cutting mechanism further includes third waste discharge apparatus for removing the upper film of the area A and the area C resigning portion, is used to step down in the area A and the area C
Portion's glue material is attached to second laminating apparatus in the area A and the area C resigning portion and respectively for will be extra outside the area A and the area C shape glue material
4th waste discharge apparatus of glue material removal, third waste discharge apparatus are installed in board and are located at the area A and the area C resigning portion rotor rear, the
Two laminating apparatus are located in front of the area A and the area C shape glue material rotor, and the 4th waste discharge apparatus is installed in board and is located at the area A and the area C shape
Shape glue material rotor rear.
8. the die-cutting device of a kind of different-thickness according to claim 7 and the glue product of shape, it is characterised in that：Also wrap
It includes the 5th waste discharge apparatus for removing lower film layer and is used to for release film being attached to above the area B, the area A and the area C shape glue material
Third laminating apparatus, the 5th waste discharge apparatus and third laminating apparatus are installed in board and are respectively positioned on the area A and the area C shape glue material
Rotor rear.
9. a kind of die-cutting device of the glue product of different-thickness and shape described according to claim 6 or 7 or 8, feature exist
In：It further include third die cutting mechanism, it includes for PET film to be cut out the area D shape and is carried out to the area A and the area C shape glue material
The area the D shape rotor of shaping and for by the 6th waste discharge apparatus of extra PET film removal, the area D shape rotor to be installed in board
And it is located at the area A and the area C shape glue material rotor rear.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820365182.6U CN208117979U (en) | 2018-03-16 | 2018-03-16 | A kind of die-cutting device of different-thickness and the glue product of shape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820365182.6U CN208117979U (en) | 2018-03-16 | 2018-03-16 | A kind of die-cutting device of different-thickness and the glue product of shape |
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| CN208117979U true CN208117979U (en) | 2018-11-20 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111136726A (en) * | 2019-12-30 | 2020-05-12 | 深圳安洁电子有限公司 | Concentric die cutting processing technology |
-
2018
- 2018-03-16 CN CN201820365182.6U patent/CN208117979U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111136726A (en) * | 2019-12-30 | 2020-05-12 | 深圳安洁电子有限公司 | Concentric die cutting processing technology |
| CN111136726B (en) * | 2019-12-30 | 2021-12-03 | 深圳安洁电子有限公司 | Concentric die cutting processing technology |
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