CN205283930U - Reinforcement piece former is glued to local nothing - Google Patents
Reinforcement piece former is glued to local nothing Download PDFInfo
- Publication number
- CN205283930U CN205283930U CN201521029993.1U CN201521029993U CN205283930U CN 205283930 U CN205283930 U CN 205283930U CN 201521029993 U CN201521029993 U CN 201521029993U CN 205283930 U CN205283930 U CN 205283930U
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- CN
- China
- Prior art keywords
- cut
- die
- hand
- waste material
- glue
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The utility model discloses a reinforcement piece former is glued to local nothing relates to flexible circuit board processing technology field, and it includes: first station, second station and waste material coiling mechanism, first station includes hole shaping sword, appearance shaping sword, hole shaping sword is used for die -cut locating hole on holding in the palm the basement membrane, appearance shaping sword is used for die -cut product design, and it is equipped with A, two kinds of cutting depths of B, the A cutting depth does not nevertheless break the support basement membrane for breaking the glue film and leaving the type layer, the B cutting depth is for only breaking the glue film, the second station includes the reference column and tears the die -cut sword of hand, the reference column with hold in the palm end film positioning hole phase -match, tearing the die -cut sword of hand and being used for die -cut play to tear the hand, it does the B cutting depth, the waste material coiling mechanism is used for the rolling waste material.
Description
Technical field
The utility model relates to flexible PCB processing technique field, in particular to the glue-free reinforcing chip molding device in one local.
Background technology
In current flexible PCB production process, often use the glue-free reinforcing chip in local. The object of such reinforcing chip is, in order to avoid glue to be subject to pollution effect adagio reliability in process of production, and stays layer protecting film on the surface of glue, follow-up tears cuticula of going bail for facilitate, and the area coverage of glue is less than protective membrane, thus reserves and tear hand. Due to such reinforcing chip cannot once shaped, the many employings of waste material in the past tearing hand place are manually torn and are got, and production efficiency is lower, cannot meet present requirement.
Summary of the invention
The technical problems to be solved in the utility model is: solves the waste material that the glue-free reinforcing chip in local in prior art tears hand place and can only manually tear and get, the problem that production efficiency is lower.
For solving the problems of the technologies described above, the utility model provides the glue-free reinforcing chip molding device in a kind of local, comprising: the first station, the 2nd station and waste material wrap-up; Described first station comprises hole forming cutter, shape molding cutter, and described hole forming cutter is for cutting out pilot hole in backing film upper punch; Described shape molding cutter is used for punching products profile, and it is provided with A, B two kinds of depths of cut, and described A depth of cut is for thrusting glue-line and release layer, but does not thrust backing film, and described B depth of cut is for only thrusting glue-line; Described 2nd station comprises locating dowel and tear the die-cut cutter of hand, and described locating dowel is mated mutually with described backing film pilot hole, described in tear the die-cut cutter of hand and tear hand for punching out, it is described B depth of cut; Described waste material wrap-up is used for rolling waste material.
Preferably, described backing film is adhesive PET material.
This glue-free reinforcing chip molding device in local adopts automatic production mode, tears the mode got and tear hand waste material by hand than ever mutually, and production efficiency significantly improves.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the glue-free reinforcing chip molding device in local of the present utility model.
Fig. 2 is the vertical view of the glue-free reinforcing chip molding device in the local in Fig. 1.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail. Following examples are for illustration of the utility model, but are not used for limiting scope of the present utility model.
The glue-free reinforcing chip molding device in local as shown in Figure 1 to Figure 2, comprising: the first station, the 2nd station and waste material wrap-up.
Processing raw material by glue-line 1, release layer 2, backing film 3 three kinds of materials are bonded to each other and become, the adhesive PET that backing film 3 can adopt hardness higher.
First station comprises hole forming cutter 4, shape molding cutter 5, and hole forming cutter 4 is for cutting out pilot hole 31 in backing film 3 upper punch. Shape molding cutter 5 is for punching products profile, and it is provided with A, B two kinds of depths of cut, and A depth of cut is for thrusting glue-line 1 and release layer 2, but does not thrust backing film 3, B depth of cut for only thrusting glue-line 1.
2nd station comprises locating dowel 6 and tears the die-cut cutter 7 of hand, and locating dowel 6 is mated with backing film pilot hole 31 phase, tears the die-cut cutter 7 of hand and tears hand 8 for punching out, and it is B depth of cut; Waste material wrap-up is used for rolling waste material.
Concrete procedure of processing is:
Step one, by include glue-line 1, release layer 2, backing film 3 three-decker raw material be laid on equipment, glue-line 1 is upward;
Step 2, raw material cut out pilot hole 31 through the first station, hole forming cutter 4 in backing film 3 upper punch; Shape molding cutter 5 punches out closed product design at glue-line 1, punches out the profile 9 of one end open release layer 2;
Step 3, rolling waste material;
Step 4, material are through the 2nd station, and locating dowel 6 is inserted backing film pilot hole 31 and carried out correcting, tear the die-cut release layer 2 of the die-cut cutter of hand 7, by product design closure of openings, are formed and tear hand 8;
Step 5, rolling waste material.
This glue-free reinforcing chip moulding process in local adopts automatic production mode, tears the mode got and tear hand waste material by hand than ever mutually, and production efficiency significantly improves.
Mode of more than implementing is only for illustration of the utility model; and be not limitation of the utility model; about the those of ordinary skill of technical field; when not departing from spirit and scope of the present utility model; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present utility model, and scope of patent protection of the present utility model should be defined by the claims.
Claims (2)
1. the glue-free reinforcing chip molding device in local, it is characterised in that, comprising: the first station, the 2nd station and waste material wrap-up;
Described first station comprises hole forming cutter, shape molding cutter, and described hole forming cutter is for cutting out pilot hole in backing film upper punch; Described shape molding cutter is used for punching products profile, and it is provided with A, B two kinds of depths of cut, and described A depth of cut is for thrusting glue-line and release layer, but does not thrust backing film, and described B depth of cut is for only thrusting glue-line;
Described 2nd station comprises locating dowel and tear the die-cut cutter of hand, and described locating dowel is mated mutually with described backing film pilot hole, described in tear the die-cut cutter of hand and tear hand for punching out, it is described B depth of cut; Described waste material wrap-up is used for rolling waste material.
2. the glue-free reinforcing chip molding device in local as claimed in claim 1, it is characterised in that, described backing film is adhesive PET material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521029993.1U CN205283930U (en) | 2015-12-11 | 2015-12-11 | Reinforcement piece former is glued to local nothing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521029993.1U CN205283930U (en) | 2015-12-11 | 2015-12-11 | Reinforcement piece former is glued to local nothing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205283930U true CN205283930U (en) | 2016-06-01 |
Family
ID=56068450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521029993.1U Withdrawn - After Issue CN205283930U (en) | 2015-12-11 | 2015-12-11 | Reinforcement piece former is glued to local nothing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205283930U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105392278A (en) * | 2015-12-11 | 2016-03-09 | 苏州米达思精密电子有限公司 | Forming equipment for reinforcing sheet without adhesive in partial |
| CN112171783A (en) * | 2019-07-05 | 2021-01-05 | 昊佰电子科技（上海）有限公司 | Small hole waste discharge method for die cutting of single-sided adhesive product |
-
2015
- 2015-12-11 CN CN201521029993.1U patent/CN205283930U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105392278A (en) * | 2015-12-11 | 2016-03-09 | 苏州米达思精密电子有限公司 | Forming equipment for reinforcing sheet without adhesive in partial |
| CN105392278B (en) * | 2015-12-11 | 2018-05-15 | 苏州中拓专利运营管理有限公司 | It is a kind of local without glue reinforcing chip former |
| CN112171783A (en) * | 2019-07-05 | 2021-01-05 | 昊佰电子科技（上海）有限公司 | Small hole waste discharge method for die cutting of single-sided adhesive product |
| CN112171783B (en) * | 2019-07-05 | 2022-06-03 | 昊佰电子科技（上海）有限公司 | Small hole waste discharge method for die cutting of single-sided adhesive product |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160601 Effective date of abandoning: 20180515 |
|
| AV01 | Patent right actively abandoned |