CN105392294B - A kind of glue inside contracts the positioning production method of reinforcing chip - Google Patents
A kind of glue inside contracts the positioning production method of reinforcing chip Download PDFInfo
- Publication number
- CN105392294B CN105392294B CN201510918845.3A CN201510918845A CN105392294B CN 105392294 B CN105392294 B CN 105392294B CN 201510918845 A CN201510918845 A CN 201510918845A CN 105392294 B CN105392294 B CN 105392294B
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- Prior art keywords
- hot
- setting adhesive
- steel plate
- feed
- high viscosity
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses the positioning production method that a kind of glue inside contracts reinforcing chip, it is related to flexible PCB processing technique field, it includes：Roll of steel plate band 3 is punched into by two rows of location holes by forming machine 6, is respectively the first location hole 801 and the second location hole 802, obtains roll of steel plate band middle material 8；By the one side with release liners 12 of hot-setting adhesive winding, it is bonded with high viscosity PET5, and is punched by forming machine 6, hot-setting adhesive is punched into 4 shape of shaping glue of regular array, high viscosity PET5 is not thrust, and is only punched into the first location hole 501.The positioning production method is used as hot-setting adhesive and the overall carrier band of release liners using high viscosity PET, eliminates the link that hot-setting adhesive is shifted to low mucous membrane, and steel disc offset and hot-setting adhesive can be avoided to produce the phenomenon of bubble.
Description
Technical field
The present invention relates to flexible PCB processing technique field, more particularly to a kind of glue inside contracts the positioning making side of reinforcing chip
Method.
Background technology
Due to the use of the special of environment, some reinforcing chips have the size for carrying glue special requirement, reinforcement as shown in Figure 1
Piece, including reinforcing chip steel disc 1 and hot-setting adhesive 2, certain distance should be kept at the edge at the most positions of reinforcement steel disc 1 with hot-setting adhesive 2,
But at spill position 101 and circular hole position 102,1 edge of reinforcement steel disc needs to align with hot-setting adhesive 2.
Continuous production is carried out using automation equipment in the prior art, but the kind equipment is in hot pressing, thermosetting
Glue 2 be typesetting on low mucous membrane, then overall and steel band fitting, but the viscous force of low mucous membrane does not live, and steel disc can be made to deviate and send out
Raw excessive glue；And hot-setting adhesive 2 is producing bubble toward also easy in low mucous membrane transfer process.
The content of the invention
The technical problem to be solved in the present invention is：Solve it is existing automation processing glue inside contract reinforcing chip during, steel disc
The problem of easily offset, hot-setting adhesive transferring film easily produce bubble.
In order to solve the above technical problems, the present invention provides the positioning production method that a kind of glue inside contracts reinforcing chip, including under
Row step：
Step 1: pass through forming machine（6）By roll of steel plate band（3）Two rows of location holes are punched into, are respectively the first location hole
（801）With the second location hole（802）, obtain roll of steel plate band middle material（8）；
Step 2: the band release liners by hot-setting adhesive winding（12）One side, with high viscosity PET（5）Fitting, and by forming machine
（6）Punching, hot-setting adhesive are punched into the shaping glue of regular array（4）Shape, high viscosity PET（5）Do not thrust, it is fixed to be only punched into first
Position hole（501）；
Step 3: the waste material die cutting in removal step two, obtains comprising hot-setting adhesive, release liners（12）, high viscosity PET（5）
The hot-setting adhesive winding middle material of three-layer-material（9）；
Step 4: pass through gauge（7）, by the roll of steel plate band middle material in step 1（8）With the thermosetting film in step 3
Band middle material（9）Fitting, gauge（7）Positioning column（701）With roll of steel plate band middle material（8）The first location hole（801）, thermosetting
Film band middle material（9）The first location hole（501）Sequentially it is socketed, hot-setting adhesive winding middle material（9）Be stained with hot-setting adhesive one
Face and roll of steel plate band middle material（8）Contact, obtains the hot pressing pre-feed of winding shape（10）；
Step 5: pass through the hot pressing pre-feed in roller press sintering step four（10）, make shaping glue（4）Pasted with steel plate
Close, obtain the punching press pre-feed of winding shape（11）；
Step 6: pass through forming machine（6）By the punching press pre-feed set in step pitch punch steps five（11）, punching press pre-feed
（11）Band high viscosity PET（5）One facing to cutter, high viscosity PET, hot-setting adhesive, steel plate are punched into outside complete reinforcing chip
Shape, during punching, forming machine（6）Pilot pin（601）It is inserted into punching press pre-feed（11）The second location hole（802）Carry out correcting；
Step 7: from punching press pre-feed（11）Remove reinforcing chip finished product.
Preferably, in step 5, the punching press pre-feed（11）High viscosity PET（5）With respect to release liners（12）Viscosity
It is greater than release liners（12）With respect to the viscosity of hot-setting adhesive.
The positioning production method is used as hot-setting adhesive and the overall carrier band of release liners using high viscosity PET, eliminates thermosetting
The link that glue is shifted to low mucous membrane, can avoid steel disc offset and hot-setting adhesive from producing the phenomenon of bubble.
Brief description of the drawings
Fig. 1 is that the glue of the present invention inside contracts the schematic diagram of reinforcing chip finished product.
Fig. 2 is the structure diagram of gauge of the present invention.
Operating diagram when Fig. 3 is forming machine first time punching press of the present invention.
Fig. 4 is schematic diagram of the roll of steel plate in manufacturing process of the present invention with middle material.
Fig. 5 is the schematic diagram of the hot-setting adhesive winding middle material in manufacturing process of the present invention.
Fig. 6 is the operating diagram that gauge is bonded in manufacturing process of the present invention.
Fig. 7 is the schematic diagram of the hot pressing pre-feed in manufacturing process of the present invention.
Operating diagram when Fig. 8 is second of punching press of forming machine of the present invention.
Fig. 9 is schematic diagram of the punching press pre-feed after second of punching press in manufacturing process of the present invention.
Embodiment
With reference to the accompanying drawings and examples, the embodiment of the present invention is described in further detail.Implement below
Example is used to illustrate the present invention, but is not limited to the scope of the present invention.
The final product of this production method is：Reinforcing chip as shown in Figure 1, it is bonded by reinforcing chip steel disc 1 and hot-setting adhesive 2
Composition.
Raw material employed in manufacturing process have：Roll of steel plate band 3, the hot-setting adhesive winding with release liners 12 and high viscosity
Viscosity after PET5, hot-setting adhesive and steel plate hot pressing is greater than the viscosity between hot-setting adhesive and release liners 12, and high viscosity PET5
Viscosity with respect to release liners 12 is greater than viscosity of the release liners 12 with respect to hot-setting adhesive
Equipment employed in manufacturing process has：Forming machine 6 and gauge 7.As shown in figures 3 and 8, forming machine 6 can basis
Different cutters are needed replacing, with the work completed punching and rush product design, as needed manual control can also be selected to be punched
And automatic cutting.Forming machine 6 can be arranged as required to pilot pin 601, for the location hole being inserted into punching on material strip, realize
Correcting to material strip.
Gauge 7 is as shown in Fig. 2, which is provided with positioning column 701, for being positioned with the location hole socket on material strip, realization.
Production method is as follows：
It is respectively the first location hole 801 and the Step 1: roll of steel plate band 3 is punched into two rows of location holes by forming machine 6
Two location holes 802, obtain roll of steel plate band middle material 8；
Step 2: by the one side with release liners 12 of hot-setting adhesive winding, it is bonded with high viscosity PET5, and is rushed by forming machine 6
Cut, hot-setting adhesive is punched into 4 shape of shaping glue of regular array, and high viscosity PET5 is not thrust, and is only punched into the first location hole 501；
Step 3: the waste material die cutting in removal step two, obtains comprising hot-setting adhesive, release liners 12, tri- layers of high viscosity PET5
The hot-setting adhesive winding middle material 9 of material；
Step 4: by gauge 7, by the roll of steel plate in step 1 with the hot-setting adhesive winding in middle material 8 and step 3
Between the fitting of material 9, the positioning column 701 of gauge 7 and first location hole 801 of the roll of steel plate with middle material 8, hot-setting adhesive winding middle material 9
The first location hole 501 be sequentially socketed, the one side for being stained with hot-setting adhesive of hot-setting adhesive winding middle material 9 and roll of steel plate band middle material 8
Contact, obtains the hot pressing pre-feed 10 of winding shape；
Step 5: by the hot pressing pre-feed 10 in roller press sintering step four, shaping glue 4 is bonded with steel plate, obtain
To the punching press pre-feed 11 of winding shape；
Step 6: by forming machine 6 by the punching press pre-feed 11 set in step pitch punch steps five, 11 band of punching press pre-feed
High viscosity PET, hot-setting adhesive, steel plate are punched into complete reinforcing chip shape, are punched by the one of high viscosity PET5 facing to cutter
When, the pilot pin 601 of forming machine 6 is inserted into the second location hole 802 progress correcting of punching press pre-feed 11；
Step 7: remove reinforcing chip finished product from punching press pre-feed 11.
The positioning production method is used as hot-setting adhesive and the overall carrier band of release liners using high viscosity PET, eliminates thermosetting
The link that glue is shifted to low mucous membrane, can avoid steel disc offset and hot-setting adhesive from producing the phenomenon of bubble.
Embodiment of above is merely to illustrate the present invention, and not limitation of the present invention, in relation to the common of technical field
Technical staff, without departing from the spirit and scope of the present invention, can also make a variety of changes and modification, therefore all
Equivalent technical solution falls within scope of the invention, and scope of patent protection of the invention should be defined by the claims.
Claims (2)
1. a kind of glue inside contracts the positioning production method of reinforcing chip, it is characterised in that comprises the following steps：
Step 1: pass through forming machine（6）By roll of steel plate band（3）Two rows of location holes are punched into, are respectively the first location hole（801）With
Second location hole（802）, obtain roll of steel plate band middle material（8）；
Step 2: the band release liners by hot-setting adhesive winding（12）One side, with high viscosity PET（5）Fitting, and by forming machine（6）
Punching, hot-setting adhesive are punched into the shaping glue of regular array（4）Shape, high viscosity PET（5）Do not thrust, be only punched into the first positioning
Hole（501）；
Step 3: the waste material die cutting in removal step two, obtains comprising hot-setting adhesive, release liners（12）, high viscosity PET（5）Three layers
The hot-setting adhesive winding middle material of material（9）；
Step 4: pass through gauge（7）, by the roll of steel plate band middle material in step 1（8）With in the hot-setting adhesive winding in step 3
Between expect（9）Fitting, gauge（7）Positioning column（701）With roll of steel plate band middle material（8）The first location hole（801）, thermosetting film
Band middle material（9）The first location hole（501）Sequentially it is socketed, hot-setting adhesive winding middle material（9）The one side for being stained with hot-setting adhesive with
Roll of steel plate band middle material（8）Contact, obtains the hot pressing pre-feed of winding shape（10）；
Step 5: pass through the hot pressing pre-feed in roller press sintering step four（10）, make shaping glue（4）It is bonded, obtains with steel plate
To the punching press pre-feed of winding shape（11）；
Step 6: pass through forming machine（6）By the punching press pre-feed set in step pitch punch steps five（11）, punching press pre-feed（11）
Band high viscosity PET（5）One facing to cutter, high viscosity PET, hot-setting adhesive, steel plate are punched into complete reinforcing chip shape, rushed
When cutting, forming machine（6）Pilot pin（601）It is inserted into punching press pre-feed（11）The second location hole（802）Carry out correcting；
Step 7: from punching press pre-feed（11）Remove reinforcing chip finished product.
2. glue as claimed in claim 1 inside contracts the positioning production method of reinforcing chip, it is characterised in that in step 5, the punching
Press pre-feed（11）High viscosity PET（5）With respect to release liners（12）Viscosity be greater than release liners（12）It is viscous with respect to hot-setting adhesive
Degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510918845.3A CN105392294B (en) | 2015-12-11 | 2015-12-11 | A kind of glue inside contracts the positioning production method of reinforcing chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510918845.3A CN105392294B (en) | 2015-12-11 | 2015-12-11 | A kind of glue inside contracts the positioning production method of reinforcing chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105392294A CN105392294A (en) | 2016-03-09 |
| CN105392294B true CN105392294B (en) | 2018-05-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510918845.3A Active CN105392294B (en) | 2015-12-11 | 2015-12-11 | A kind of glue inside contracts the positioning production method of reinforcing chip |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106077212B (en) * | 2016-06-29 | 2018-05-01 | 苏州安洁科技股份有限公司 | A kind of jointing product forming cutter coiled strip Sheet Metal Forming Technology |
| CN106231798A (en) * | 2016-08-01 | 2016-12-14 | 苏州市东苏发五金粘胶制品有限公司 | A kind of FPC stiffening plate inside contracts the processing technique of glue product |
| CN108848626B (en) * | 2018-07-27 | 2020-10-27 | 江门崇达电路技术有限公司 | Method for improving attaching alignment precision of circuit board adhesive tape |
| CN109821938B (en) * | 2019-01-23 | 2021-04-13 | 深圳市中软信达电子有限公司 | Novel machining method of bent steel sheet |
| CN110958763B (en) * | 2019-11-22 | 2021-09-21 | 盐城维信电子有限公司 | Reinforcing automatic laminating method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050096656A (en) * | 2004-03-31 | 2005-10-06 | (주) 액트 | Manufacturing method of photo imageable coverlay on flexible printed circuit board |
| CN104244592A (en) * | 2014-09-01 | 2014-12-24 | 苏州米达思精密电子有限公司 | Manufacturing method for fiberglass reinforced sheet |
| CN104244594A (en) * | 2014-09-01 | 2014-12-24 | 苏州米达思精密电子有限公司 | Method for manufacturing regularly-arranged rectangular indentation reinforcing pieces |
| CN104244595A (en) * | 2014-09-09 | 2014-12-24 | 苏州米达思精密电子有限公司 | Method for manufacturing adhesive indentation reinforcing sheet |
-
2015
- 2015-12-11 CN CN201510918845.3A patent/CN105392294B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050096656A (en) * | 2004-03-31 | 2005-10-06 | (주) 액트 | Manufacturing method of photo imageable coverlay on flexible printed circuit board |
| CN104244592A (en) * | 2014-09-01 | 2014-12-24 | 苏州米达思精密电子有限公司 | Manufacturing method for fiberglass reinforced sheet |
| CN104244594A (en) * | 2014-09-01 | 2014-12-24 | 苏州米达思精密电子有限公司 | Method for manufacturing regularly-arranged rectangular indentation reinforcing pieces |
| CN104244595A (en) * | 2014-09-09 | 2014-12-24 | 苏州米达思精密电子有限公司 | Method for manufacturing adhesive indentation reinforcing sheet |
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| Publication number | Publication date |
|---|---|
| CN105392294A (en) | 2016-03-09 |
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Effective date of registration: 20180514 Address after: 215100 Suli Road, Wuzhong District, Suzhou, Jiangsu Province, No. 63 Patentee after: SUZHOU ZHONGTUO PATENT OPERATIONS MANAGEMENT CO., LTD. Address before: 215104 Suzhou, Suzhou, Jiangsu Luzhi Town, 18 East Road, -4, Suzhou, Suzhou, Wuzhong District Precision Electronics Co., Ltd. Patentee before: Suzhou Midas Precision Electronic Co., Ltd. |
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Effective date of registration: 20190930 Address after: 226300 No. five, 8 Avenue, five town, Nantong, Jiangsu, Tongzhou District Patentee after: Nantong Meelain Electric Appliance Co., Ltd. Address before: 215100 Jiangsu city of Suzhou province Wuzhong District Su Li Road No. 63 Patentee before: SUZHOU ZHONGTUO PATENT OPERATIONS MANAGEMENT CO., LTD. |
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