CN104416682A - Substrate Cutting Device - Google Patents
Substrate Cutting Device Download PDFInfo
- Publication number
- CN104416682A CN104416682A CN201410171803.3A CN201410171803A CN104416682A CN 104416682 A CN104416682 A CN 104416682A CN 201410171803 A CN201410171803 A CN 201410171803A CN 104416682 A CN104416682 A CN 104416682A
- Authority
- CN
- China
- Prior art keywords
- substrate
- protrusion
- conveyer
- elastomeric element
- cut according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
Abstract
The invention provides a substrate cutting device. A comparatively thin resin or metal surface layer (2) is arranged on the upper surface of a substrate body (1) in an overlapping manner and a plurality of scratch lines are formed in the lower surface of the substrate body. The substrate cutting device is composed of a conveying machine (3) carrying or transporting a substrate (W) in a state of being orthorhombic to the conveying direction and in the downward direction; a bump part (4) formed in the middle direction of the conveying direction of the conveying machine (3); and an elastic part (5) arranged above the bump part (5) and in elastic contact with the upper surface of the substrate (W) of the substrate (W) conveyed by a conveyer (3); the bump part (4) is formed in a way of swelling upward from the carrying face (a) of the conveyer in a method of bending upward across the bump part (4).
Description
Technical field
The present invention relates to the shearing device of the brittle substrates such as a kind of ceramic substrate.Especially, the present invention relates to a kind of substrate cut, to adhering to the substrate of resin bed or metal level in the one side of substrate, many of being formed in ceramic plane line is that short strip shape or clathrate are cut off substrate and make the unit products such as chip.
Background technology
Conventionally, there is known following method: to brittle substrates such as ceramic substrates, cast-cutting saw etc. is used to be pre-formed many line, then, applying external force makes substrate bend and along line fracture, thus, obtain the unit products (such as patent document 1, patent document 2 etc.) such as chip.
To brittle substrate along line apply bending moment make it fracture time, in most cases, with as described in the three-point bending mode shown in patent document etc. carry out, effectively to produce bending moment.
Fig. 9 and Figure 10 is used to the figure be described the general breaking step of breaking that the aluminum oxide substrate or LTCC (Low Temperature Co-fired Ceramic, LTCC) substrate (low-temperature bake ceramic substrate) that make to comprise in one side resin bed or metal level in three-point bending mode rupture and obtain unit product.In addition, described resin bed or metal level are formed as the function of capacitor or inductor or protection device to play.
By be attached in the substrate W on surface or the inside stacked thinner resin bed in surface or metal level (hereinafter referred to as " superficial layer 12 ") gained that form the base main body 11 of circuit pattern be supported in cut ring (dicing ring) 13 there is flexible adhesive film 14.Many line (grooving) S are formed at the lower surface of base main body 11 by pre-operation.
As shown in Figure 10, stride across line S and configure a pair of the lower surface of supporting substrates W supporting cutter 15,15 at its right position.Fracture cutter 16 is configured above the position right with line S-phase of substrate W.By this fracture cutter 16 is pressed into substrate W as shown in Figure 10 (b), substrate is made to bend and rupture from line S.Now, first the superficial layer 12 pressed by fracture cutter 16 is at first cut off by the point of a knife of fracture cutter 16, then by the further pressing of the cutter 16 that ruptures, substrate W is bent and cuts off from line S.
[background technology document]
[patent document]
[patent document 1] Japanese Patent Laid-Open 2012-131216 publication
[patent document 2] Japanese Patent Laid-Open 2011-212963 publication
Summary of the invention
[inventing problem to be solved]
With regard to aspect in service life, the fracture cutter 16 used during cut-out is preferably formed with point of a knife angle large as far as possible.About the cut-out of base main body 11 part of substrate W, even the point of a knife angle of fracture cutter 16 is the point of a knife at such as 100 degree, the obtuse angle of more than 90 degree, also can cut off fully.But if the point of a knife at obtuse angle, then sometimes cannot thoroughly cut off superficial layer 12, a part for superficial layer 12 is not cut-off and remain.If produce this kind of state, then the flow process of continuous print production line produces disadvantage, and causes processing quality or yield to reduce.On the other hand, if make the point of a knife of fracture cutter 16 be the point of a knife of the acute angle of sharp-pointed such as less than 30 degree, although then superficial layer 12 can be cut off when pressing, the point of a knife of acute angle easily damaged and in service life existing problems.
And, when using fracture cutter 16 to the cut-out of substrate W, the elevating mechanism needing fracture cutter 16 is moved up and down repeatedly and unit scale is larger.And, the line S that should cut off of substrate W must be made during fracture to locate exactly in the mode become immediately below fracture cutter 16 and stop, therefore, need the mechanism of the complexity in order to detecting location.And, substrate W all must be made to stop because of during each fracture, so, there is the problem points that the total time needed for substrate cutting is elongated.
Therefore, the present invention manages to solve described existing issue, its object is to the substrate cut providing a kind of novelty, this substrate cut can not use fracture cutter, and is cut off by the brittle substrate possessing resin or metallic surface layer efficiently with simple mechanism.
[technological means of dealing with problems]
In order to reach described object, take following technological means in the present invention.Namely, in substrate cut of the present invention, be set to following formation, namely, a kind of substrate cut, make stacked resin or metallic surface layer at the upper surface layer of base main body and form the brittle substrates fracture of many line at the lower surface of described base main body with the spacing of regulation, comprising: conveyer, make to be scribed ss the direction orthogonal with throughput direction described in described brittle substrate and loading under state down and transport described brittle substrate; Protrusion, is formed in the throughput direction centre position of described conveyer, and the described brittle substrate in conveyance is moved in the mode declined immediately after swelling upward; And elastomeric element, above described protrusion, Elastic Contact is in the upper surface of the described brittle substrate transported by described conveyer; The mode that described protrusion bends when being and crossing this protrusion with described brittle substrate and move upward is formed.
And described protrusion can utilize lifting piece promote conveyer belt from the lower surface of conveyer belt and formed, or, also conveyer can be divided into anterior conveyer and rearside conveyor, and between the conveyer of described front and back, form described protrusion.
[effect of invention]
According to the present invention, in operation, make the conveyance operation of substrate not stop, while utilize conveyer to make substrate move to downstream from upstream, while bend at the chien shih substrate of protrusion and elastomeric element and cut off successively from ruling, therefore, substrate is stopped with when rupturing at every turn and compared with the existing mode that fracture cutter is moved up and down, significantly can shorten the time needed for cut-out.And, because not using the fracture cutter needing large-scale elevating mechanism repeatedly, so, shearing device can be formed small-sizedly, and can provide with low cost by utilizing the simple formation of protrusion and elastomeric element.And, do not need as the situation utilizing fracture cutter to cut off, the line that should cut off of substrate to be located, therefore, have the multi-effects such as the mechanism of the complexity can omitted in order to detecting location.
In substrate cut of the present invention, preferably be set to following formation: described elastomeric element supported portion part keeps, the rotating belt that can rotate towards substrate throughput direction under the state contacted with the lower surface of described elastomeric element is installed at described holding components, described rotating belt is formed by elastomeric material, makes to cave in together with described elastomeric element when described brittle substrate utilizes described protrusion to bend upward.
Thus, when substrate is by the below of elastomeric element, successfully can transport substrate by utilizing the conveyance of described conveyer and rotating belt towards the rotation of substrate throughput direction.
In substrate cut of the present invention, be preferably set to the formation that described protrusion is formed as adjusting upper-lower position.
Thus, the uplift capacity of protrusion can be adjusted to according to becoming the thickness of substrate of processing object or the kind of material the state being most suitable for cutting off.
In substrate cut of the present invention, be preferably set to the formation that described elastomeric element is formed as adjusting upper-lower position.
Thus, can according to become processing object substrate thickness and inching is carried out to the upper-lower position of elastomeric element, thus successfully can carry out the movement of substrate.
Accompanying drawing explanation
Fig. 1 (a) ~ (c) is the key diagram representing the cutting-off process becoming the substrate cutting off object.
Fig. 2 is the general profile chart of the example representing substrate cut of the present invention.
Fig. 3 (a) ~ (d) is the key diagram representing the substrate cutting operation utilizing substrate cut of the present invention.
Fig. 4 (a), (b) are the key diagrams of other embodiments of the lifting piece represented in the present invention.
Fig. 5 (a), (b) are the key diagrams of other embodiments of the elastomeric element represented in the present invention.
Fig. 6 is the key diagram of other embodiments of the conveyer represented in the present invention.
Fig. 7 (a), (b) are the key diagrams of other embodiments representing the protrusion shown in Fig. 6.
Fig. 8 (a), (b) are the key diagrams of the guiding mechanism up and down of the protrusion represented in the present invention.
Fig. 9 is the stereogram that existing substrate cutting method is described.
Figure 10 (a), (b) are the sectional views representing existing substrate cutting method.
Detailed description of the invention
Below, for the details of substrate cut of the present invention, the accompanying drawing according to expression one embodiment is described in detail.Fig. 1 is the figure of the aluminum oxide substrate W representing the example becoming processing object.Form electronic circuit pattern (not in diagram) in the inside of the base main body 1 of substrate W or upper surface, stacked protection device and control as capacitor or the resin of characteristic of inductor or the superficial layer 2 of the thinner of metal at superficial layer.And at the lower surface of base main body 1, the spacing separating regulation by front-end-of-line forms many line (grooving) S1, the S2 in cross one another X-Y direction.
This substrate W utilizes the following substrate cut of the present invention described, first line S1 along the X direction cuts off, be processed into the rectangular short strip shape substrate W1 as shown in Fig. 1 (b), then, line S2 along the Y direction cuts off, and obtains the unit product W2 shown in Fig. 1 (c).
Fig. 2 is the sectional view of the embodiment roughly representing substrate cut of the present invention.This substrate cut comprises: conveyer 3, and this substrate W also transports to downstream from upstream by mounting substrate W; Protrusion 4, is formed in the centre position of conveyer 3; And elastomeric element 5, be configured in the top of protrusion 4 and Elastic Contact in the position of the upper surface of the substrate W transported by conveyer 3, there is smooth lower surface.
In the present embodiment, protrusion 4 is formed as utilizing lifting piece 4a to make conveyer belt 3a (and placed substrate W) temporarily to top protuberance from the lower surface of the conveyer belt 3a of conveyer 3, then declines at once.This protrusion 4 is protruding upward when crossing this protrusion 4 with substrate W and the mode of flexure, swells upward and formed from the mounting surface a of the level of conveyer 3 with height h.
Lifting piece 4a preferably utilizes the rotating roller rotated freely to be formed.Thus, the slip of conveyer belt 3a can successfully be carried out.In addition, this lifting piece 4a also can utilize the convex material 4b of convex surface upper surface being set to smooth arc-shaped as Suo Shi Fig. 4 (a) or be set to as shown in Fig. 4 (b) smooth roughly triangular shape convex surface convex material 4c and formed.
Elastomeric element 5 utilizes not make substrate W impaired when substrate W is protruding upward and manufactured by the elastic materials such as the flexible natural or synthetic rubber of possessing of can flexibly caving in.And in the present embodiment, elastomeric element 5 supported portion part 6 keeps, and be formed as utilizing position adjusting mechanism (not in diagram) adjustment upper-lower position.Thus, can according to become processing object substrate W thickness and inching is carried out to the interval L of the lower surface of elastomeric element 5 and the mounting surface a of conveyer 3.
Next, the action of substrate cut of the present invention is described.
First, as shown in Figure 2, make the line S1 of the X-direction that should cut off towards the direction orthogonal with throughput direction and under state down, substrate W is being positioned in the upstream position of conveyer 3 and to make it downstream (direction of arrow of figure) mobile.Substrate W is as shown in Fig. 3 (a), moves and arrive to protrusion 4 in the lower horizontal of elastomeric element 5.In addition, now, the lower surface position of elastomeric element 5 being adjusted in advance elastomeric element 5 is positioned at the position close with the surface of substrate W or the degree of gentle touchdown, and substrate W can successfully be moved.
Then, the front part of substrate W as shown in Fig. 3 (b), crosses protrusion 4 and initial line S1 ' bends upward.By by this bending caused flexure, the be full of cracks of the S1 ' that rules is permeated in a thickness direction, and base main body 1 is cut off.Now, the superficial layer 2 on line S1 ' becomes fragile by bending, but not yet cut-off.
Then, as shown in Fig. 3 (c), when the part of line S1 ' arrives to the top of protrusion 4, by the bending of substrate W, the S1 ' that rules ftracture in V shape, and become described in superficial layer 2 fragile part thus time tensile stress cut-out.Thus, substrate W is completely severed from line S1 '.
By repeating action as described as shown in such as Fig. 3 (d) successively, substrate W is cut off from all line S1 of the X-direction shown in Fig. 1 and utilizes conveyer 3 and move to downstream, obtains multiple short strip shape substrate W1.
Then, short strip shape substrate W1 makes the line S2 of Y-direction be the direction orthogonal relative to throughput direction and state is down positioned on conveyer 3.Then, in the same manner as described, rupture successively from the line S2 of front by making substrate W1 downstream move, completing the unit product W2 shown in Fig. 1 (c).
The people such as inventor using on surface respectively the stacked aluminum oxide substrate comprising the thickness 0.4mm of the thinner superficial layer gained of the resin bed of about 100 μm and the metal level of about 10 μm as processing object, repeat fracture experiment with following condition.
The mounting surface a of the conveyer 3 and interval L:0.45mm of elastomeric element 5
The thickness of elastomeric element 5: 3mm
Diameter as the roller of protrusion 4: 1mm
Overhang (projecting height from the mounting surface a of the conveyer 3) h:0.15mm of roller
The spacing of line: 4mm
Utilize the transporting velocity of the substrate W of conveyer 3: 30mm/sec
As a result, all can well and cut off up hill and dale in arbitrary situation.
Fig. 5 is the figure of another embodiment representing substrate cut of the present invention.
In this embodiment, around the holding components 6 keeping elastomeric element 5, arrange rotating belt 7, a part for this rotating belt 7 configures with the state contacted with the lower surface of elastomeric element 5.Rotating belt 7 is kept by multiple such as 4 wheel bodys 8, and to be installed to the mode that substrate throughput direction rotates freely by the contact with the substrate W transported by conveyer 3.Rotating belt 7 utilizes the thinner elastic strip parts such as rubber to be formed, and caves in upward making it possible to as Fig. 5 (b) Suo Shi when substrate W utilizes protrusion 4 to promote together with elastomeric element 5.Thus, easily substrate W is transported.
In addition, rotating belt 7 also can be made synchronously to rotate with the transporting velocity of conveyer 3.Now, drive source (motor) also can be made to be 1 and synchronous.
Fig. 6 is the figure representing another embodiment of the present invention.In this embodiment, conveyer 3 is divided into anterior conveyer 3A and rearside conveyor 3B, before and after this, form protrusion 4 between conveyer 3A, 3B.Protrusion 4 is formed by the rotating roller 4d rotated freely.In addition, in the present embodiment, as the elastomeric element 5 of top being configured in protrusion 4, the elastomeric element of the formation shown in Fig. 2 is shown, but also can uses the elastomeric element comprising the formation of rotating belt 7 of Fig. 5.In arbitrary situation, all the disrupting action identical with embodiment before can be carried out.
In addition, also can replace rotating roller 4d, and utilize the convex material 4f of convex material 4e upper surface being set to the convex surface of smooth arc-shaped as Suo Shi Fig. 7 (a) or the convex surface being set to smooth roughly triangular shape as shown in Fig. 7 (b) to be formed.
As described above, according to the present invention, the conveyance operation of substrate W is not stopped, while utilize conveyer 3 to make substrate W move to downstream from upstream, while bend with the chien shih substrate W of elastomeric element 5 at protrusion 4 and cut off successively along ruling, therefore, the time needed for cut-out can be shortened.And, do not use the fracture cutter of incidentally large-scale elevating mechanism repeatedly, and be made up of the simple parts utilizing protrusion 4 with elastomeric element 5, therefore, can small-sized ground and form shearing device at low cost.In addition, do not need as the situation utilizing fracture cutter to cut off, the line that should cut off of substrate to be located, therefore, the mechanism of the complexity in order to detecting location can be omitted.
In the present invention, the height (uplift capacity) that can adjust described protrusion 4 is preferably formed to.In the case, in the embodiment of fig. 2, upper and lower guiding mechanism about 9 can be utilized as shown in Fig. 8 (a) to adjust lifting piece 4a.And, in the embodiment in fig 6, upper and lower guiding mechanism about 9 can be utilized as shown in Fig. 8 (b) to adjust rotating roller 4d (or convex material 4e, 4f).
Thus, according to the thickness of substrate W that should cut off or the kind of material, the uplift capacity of protrusion 4 can be adjusted to the state being most suitable for cutting off.
Above, representational embodiment of the present invention is illustrated, but the present invention is not necessarily specific to described embodiment.Such as, in the present invention, also can using the brittle substrate of the thinner superficial layer 2 of resin or metal etc. that do not have as described as processing object.In addition, in the present invention, can reaching described object and suitably carry out revising, changing in the scope not departing from right.
[industrial utilizability]
Aluminum oxide substrate, ltcc substrate etc. that shearing device of the present invention is suitable for the thinner superficial layer comprising resin or metal on surface comprise the cut-out of the substrate of fragile material.
[explanation of symbol]
The line that S1, S2 should cut off
W substrate
1 base main body
2 superficial layers
3 conveyers
3a conveyer belt
4 protrusions
4a lifting piece
5 elastomeric elements
6 holding components
7 rotating belt
About 9 guiding mechanisms
Claims (10)
1. a substrate cut, makes stacked resin or metallic surface layer at the upper surface layer of base main body and form the brittle substrates fracture of many line at the lower surface of described base main body with the spacing of regulation, and comprises:
Conveyer, makes to be scribed ss the direction orthogonal with throughput direction described in described brittle substrate and is loading under state down and transport described brittle substrate;
Protrusion, is configured in the throughput direction centre position of described conveyer, and the described brittle substrate in conveyance is moved in the mode declined immediately after swelling upward; And
Elastomeric element, above described protrusion, Elastic Contact is in the upper surface of the described brittle substrate transported by described conveyer;
The mode that described protrusion bends when being and crossing this protrusion with described brittle substrate and move upward is formed.
2. substrate cut according to claim 1, wherein said protrusion utilizes lifting piece that the mode of belt lifting is formed with the below of the belt from described conveyer.
3. substrate cut according to claim 1, wherein said conveyer is divided into anterior conveyer and rearside conveyor, forms described protrusion between the conveyer of described front and back.
4. substrate cut according to any one of claim 1 to 3, wherein said elastomeric element supported portion part keeps, the rotating belt that can rotate towards substrate throughput direction under the state contacted with the lower surface of described elastomeric element is installed at described holding components, described rotating belt is formed by elastomeric material, makes to cave in together with described elastomeric element when described brittle substrate utilizes described protrusion to bend upward.
5. substrate cut according to any one of claim 1 to 3, wherein said protrusion is formed as adjusting upper-lower position.
6. substrate cut according to claim 4, wherein said protrusion is formed as adjusting upper-lower position.
7. substrate cut according to any one of claim 1 to 3, wherein said elastomeric element is formed as adjusting upper-lower position.
8. substrate cut according to claim 4, wherein said elastomeric element is formed as adjusting upper-lower position.
9. substrate cut according to claim 5, wherein said elastomeric element is formed as adjusting upper-lower position.
10. substrate cut according to claim 6, wherein said elastomeric element is formed as adjusting upper-lower position.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013173557A JP6262960B2 (en) | 2013-08-23 | 2013-08-23 | Substrate cutting device |
| JP2013-173557 | 2013-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104416682A true CN104416682A (en) | 2015-03-18 |
Family
ID=52694295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410171803.3A Pending CN104416682A (en) | 2013-08-23 | 2014-04-25 | Substrate Cutting Device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6262960B2 (en) |
| KR (1) | KR20150022638A (en) |
| CN (1) | CN104416682A (en) |
| TW (1) | TWI591030B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104843488A (en) * | 2015-04-10 | 2015-08-19 | 京东方科技集团股份有限公司 | Output device and cutting cracking system |
| CN110587824A (en) * | 2019-10-12 | 2019-12-20 | 苏州鸣动智能设备有限公司 | Grain mechanism is rolled over to ceramic substrate |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI580067B (en) * | 2016-07-01 | 2017-04-21 | 新日光能源科技股份有限公司 | Division device and division method thereof |
| WO2023176068A1 (en) * | 2022-03-16 | 2023-09-21 | ナルックス株式会社 | Methods for manufacturing microlens and microlens array |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577139A (en) * | 1980-06-16 | 1982-01-14 | Mitsubishi Electric Corp | Splitting of semiconductor wafer |
| JPS60164385A (en) * | 1984-02-06 | 1985-08-27 | Rohm Co Ltd | Manufacture of semiconductor laser chip |
| JPS6153741A (en) * | 1984-08-22 | 1986-03-17 | Mitsubishi Electric Corp | Semiconductor wafer dicing apparatus |
| JPS63278804A (en) * | 1987-05-11 | 1988-11-16 | Fujitsu Ltd | Cracking process of semiconductor chip |
| JPH01148512A (en) * | 1987-12-07 | 1989-06-09 | Tadao Totsuka | Wafer breaking equipment |
| JPH0938956A (en) * | 1995-08-01 | 1997-02-10 | 敏行 ▲村▼上 | Tile holder of tile cutting machine |
| CN102555082A (en) * | 2010-11-30 | 2012-07-11 | 三星钻石工业股份有限公司 | Breaking method of fragile material substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4838636B2 (en) * | 2006-05-31 | 2011-12-14 | 日本特殊陶業株式会社 | Splitting apparatus and method for manufacturing ceramic wiring board |
| JP5216040B2 (en) * | 2010-03-31 | 2013-06-19 | 三星ダイヤモンド工業株式会社 | Method for dividing brittle material substrate |
-
2013
- 2013-08-23 JP JP2013173557A patent/JP6262960B2/en not_active Expired - Fee Related
-
2014
- 2014-04-09 KR KR20140042564A patent/KR20150022638A/en unknown
- 2014-04-14 TW TW103113576A patent/TWI591030B/en not_active IP Right Cessation
- 2014-04-25 CN CN201410171803.3A patent/CN104416682A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577139A (en) * | 1980-06-16 | 1982-01-14 | Mitsubishi Electric Corp | Splitting of semiconductor wafer |
| JPS60164385A (en) * | 1984-02-06 | 1985-08-27 | Rohm Co Ltd | Manufacture of semiconductor laser chip |
| JPS6153741A (en) * | 1984-08-22 | 1986-03-17 | Mitsubishi Electric Corp | Semiconductor wafer dicing apparatus |
| JPS63278804A (en) * | 1987-05-11 | 1988-11-16 | Fujitsu Ltd | Cracking process of semiconductor chip |
| JPH01148512A (en) * | 1987-12-07 | 1989-06-09 | Tadao Totsuka | Wafer breaking equipment |
| JPH0938956A (en) * | 1995-08-01 | 1997-02-10 | 敏行 ▲村▼上 | Tile holder of tile cutting machine |
| CN102555082A (en) * | 2010-11-30 | 2012-07-11 | 三星钻石工业股份有限公司 | Breaking method of fragile material substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104843488A (en) * | 2015-04-10 | 2015-08-19 | 京东方科技集团股份有限公司 | Output device and cutting cracking system |
| CN104843488B (en) * | 2015-04-10 | 2017-12-29 | 京东方科技集团股份有限公司 | A kind of output device and cutting splitting system |
| CN110587824A (en) * | 2019-10-12 | 2019-12-20 | 苏州鸣动智能设备有限公司 | Grain mechanism is rolled over to ceramic substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015039872A (en) | 2015-03-02 |
| TWI591030B (en) | 2017-07-11 |
| TW201507984A (en) | 2015-03-01 |
| JP6262960B2 (en) | 2018-01-17 |
| KR20150022638A (en) | 2015-03-04 |
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