JPS60164385A - Manufacture of semiconductor laser chip - Google Patents

Abstract

PURPOSE:To eliminate the need for cleaning after a cleavage process and to allow small pieces to be separated one by one from an adhesive sheet by a method wherein a wafer whereupon scratches are created at a constant pitch whereat cleavage is initiated is attached to an adhesive sheet and a pressing member is caused to roll up to cover the entire wafer surface. CONSTITUTION:A wafer 1, with scratches 2 for initiating cleavage created on one side, is attached to an adhesive sheet 6 composed of soft plastic formed on an adhesive surface A so that the scratches 2 may be exposed. The laminate is placed on an elastic member 7 constituted of a flat rubber sheet, with the wafer facing down. Pressure is applied upon the adhesive sheet 6 from behind by a small-radius roller 8. The roller 8 applies a local pressure to the wafer 1 and the wafer 1 bends. Cleavage proceeds starting at the scratches 2 and small pieces 5 are left in the track of the roller 8.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method for manufacturing semiconductor laser chips.

Semiconductor laser chips are made by cutting the wafer into thin strips, which have been cut into pieces, and then cutting them into pieces in the longitudinal direction with appropriate pinches. Conventionally, as shown in FIG.
Scratches 2 are formed at a predetermined pitch on one end edge of the wafer 1 using a diamond scriber or the like, and the wafer 1 is fixed to a copper plate 3 using an adhesive 4 so that the scribe scratches 2 are exposed. As shown in FIG. 2, a method was used in which the material was curved in a convex manner, and then cleavage was performed using each chipping wound 2 as a starting point to form five groups of small pieces for forming chimps.

However, this method has the following drawbacks.

That is, after the cleavage process is performed using this method, the adhesive 4 is washed and removed and the 5 groups of small pieces are removed. However, the adhesive 4 used to convey the deformation effect of the copper plate 3 to the An adhesive 4 having adhesive strength was selected, and such an adhesive 4 was difficult to clean and took time to remove small pieces.

In addition, the small pieces 5 that can be separated from the copper plate 3 through the cleaning process are broken into pieces, and the order in which they are arranged with respect to the original wafer 1 is unknown. It was difficult to tell the difference between the outer edge and the outer edge, which caused problems in handling for quality control. In addition, since the separated small pieces could come into contact with each other, problems such as scratches on the cleavage planes, which serve as reflective surfaces, were likely to occur.

The present invention has been made in view of the above circumstances, and includes:
・The purpose is to make improvements to the external means to eliminate the above-mentioned drawbacks.

Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. First, as shown in FIG. 3, a wafer 1 having two groups of scribe scratches for cleavage starting points formed on one edge is placed on a soft plastic adhesive sheet 6 (for example, Either the wafer 1 is pasted onto the vinyl sheet 6) so that the scribe scratches 2 are exposed, or the scribe scratches 2 are formed after the wafer 1 is pasted on the adhesive sheet 6.

Next, as shown in FIG. 4, with the wafer 1 facing down, this adhesive sheet 6 is placed on an elastic member made of a flat rubber sheet, and then the outer surface of the adhesive sheet 6 is The small-diameter roller 8 as a suppressing member is transferred to suppress. Then, as shown in Fig. f55, the wafer 1 is locally pressed downward in the roller action area and curved, and starting from the scribing scratch 2, it cleaves and advances, forming 5 groups of small pieces at the roller passage trace. Ru. In this case, as shown in FIG. 6, if the roller 8 is pressed in an inclined position with the side where the scribe scratches 2 are located close to the elastic member 7, stress will be concentrated on the scribe scratches 2 and the cleavage will be smooth and smooth. progress for sure. Alternatively, instead of using a roller as the suppressing member 8, a bar with a rounded tip, such as a pin, may be rubbed against the outer surface of the adhesive tape to perform the same cleavage process. Furthermore, as a means for achieving higher efficiency, as shown in FIG. It is conceivable to allow the attached wafer 1 to pass through. Also in this case, it is preferable to tilt the suppression roller 8 slightly as shown in FIG. The base of the adhesive sheet 6 may be made of any material such as plastic, paper, cloth, metal film, etc. However, if a feed base with extensibility is used, the sheet 6 can be stretched after cleavage to form each small piece. When peeling off the sheet 5 from the sheet 6, there will be no damage caused by scraping the open surface between adjacent pieces, making handling easier.

As described above, according to the present invention, 1. The cleaning process is no longer necessary to remove each small piece after the cleavage process, and the pieces can be easily removed one by one by peeling directly from the adhesive sheet. While easily checking the position of the small piece with respect to the original wafer, remove it.
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Even during the process, it is possible to process each wafer with the small pieces attached to the adhesive sheet, which is advantageous in terms of handling.

[Brief explanation of drawings]

1 and 2 show a conventional cleavage means, with FIG. 1 showing the state before processing and FIG. 2 showing the state after processing. Fig. 43 is a perspective view of a wafer showing the state of processing 111 according to the embodiment of the present invention, Fig. 4 is a partially cutaway perspective view showing the open processing means, and Fig. 5 shows its operating state. Fig. 6 is a front view thereof, Fig. 7 is a perspective view showing a pond opening processing means, Fig. 33 is a side view showing a part thereof, and Fig. 9 is a front view thereof. . 1 is a wafer, 2 is a scribing scratch, 6 is a sticky λ'1 sheet), ■ is an elastic member, and 8 is a suppressor. Applicant Population - Mu stock interest agent Patent attorney Oka III Kazuhide Figure 6 Figure 8 Figure 9

Claims (4)

[Claims] (1) A wafer with scribing scratches for cleavage starting points formed at a predetermined pitch on the surface of one edge is pasted on an adhesive sheet in a manner that exposes the scribing scratches, and the wafer is placed on the elastic member. A method for manufacturing a semiconductor laser chip, characterized in that a suppressing member is positioned so as to be on the side of the adhesive sheet and applies an external force locally from the outer surface of the adhesive sheet toward the elastic member, and the suppressing member is sequentially applied over the entire surface of the wafer. (2) The semiconductor laser chip manufacturing method according to claim 1, wherein the elastic member is a flat rubber sheet, and the suppressing member is a roller. (3) The semiconductor laser chip manufacturing method according to claim 1, wherein the elastic member is a large-diameter rubber roller, and the suppressing member is a small-diameter roller facing the rubber roller. (4) The semiconductor laser chip manufacturing method according to any one of claims 1 to 3, wherein the base of the adhesive sheet is made of a stretchable material.