JP2008308368A - Method of dividing glass substrate - Google Patents

Method of dividing glass substrate Download PDF

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JP2008308368A
JP2008308368A JP2007158425A JP2007158425A JP2008308368A JP 2008308368 A JP2008308368 A JP 2008308368A JP 2007158425 A JP2007158425 A JP 2007158425A JP 2007158425 A JP2007158425 A JP 2007158425A JP 2008308368 A JP2008308368 A JP 2008308368A
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glass substrate
integrated circuit
dividing
scribe
scribing
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JP4915294B2 (en
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Yasuyuki Oda
容征 織田
Yoshito Yamada
義人 山田
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Toshiba Mitsubishi Electric Industrial Systems Corp
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Toshiba Mitsubishi Electric Industrial Systems Corp
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Abstract

<P>PROBLEM TO BE SOLVED: To obtain a method of dividing a glass substrate without providing a specific contact-possible area on the integrated circuit forming surface of the glass substrate. <P>SOLUTION: The method of dividing the glass substrate 1 having an integrated circuit 2 formed on the surface includes: a step for placing and holding the glass substrate on a working table 3 with the surface of the glass substrate on which the integrated circuit is formed turned up; a step for carrying out scribing to form a cutting guide scratch 5 on the back surface of the glass substrate by a scribe cutter 4 arranged on the edge of the back surface side of the cutting position of the glass substrate and preventing the deflection of the glass substrate when carrying out scribing by a back-up member 5 arranged on the outer edge of the surface side of the glass substrate; and a step for carrying out breaking to divide the glass substrate by clamping the end part of the glass substrate by a clamp mechanism 7 and rotating. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

この発明は、表面に集積回路を形成したガラス基板、特に集積型薄膜太陽電池の製造におけるガラス基板の分割方法に関するものである。   The present invention relates to a glass substrate having an integrated circuit formed on its surface, particularly to a method for dividing a glass substrate in the manufacture of an integrated thin film solar cell.

一般的に、表面に集積回路を形成したガラス基板の分割方法としては、ガラス基板の片面に切断案内傷を形成し、その切断案内傷を成長させるように基板に負荷を与えてガラス基板を分割する方法が用いられている。以下、切断案内傷をスクライブ線と呼び、切断案内傷を成長させる行為をスクライブと呼び、切断案内傷を成長させるように基板に負荷を与えてガラス基板を分割する行為をブレイクと呼ぶ。   Generally, as a method of dividing a glass substrate with an integrated circuit formed on the surface, a cutting guide flaw is formed on one side of the glass substrate, and the glass substrate is divided by applying a load to the substrate so that the cutting guide flaw grows. Method is used. Hereinafter, the cutting guide flaw is referred to as a scribe line, the action of growing the cutting guide flaw is referred to as scribe, and the action of applying a load to the substrate so as to grow the cutting guide flaw and dividing the glass substrate is referred to as break.

図２は第１の従来例におけるガラス基板の分割方法を説明する説明図であり、（ａ）において、１はガラス基板であり、１０はガラス基板１を保持する加工台、４はガラス基板１をスクライブするスクライブカッターであり、ガラス基板１の上方に配置する。スクライブカッター４をガラス基板１上に当て、シリンダ、バネ等により加圧しながらガラス基板１の表面を図面と垂直な方向に走行することで、スクライブ線を形成する。（ｂ）において、６はスクライブカッター４により形成されたスクライブ線（切断案内傷）である。（ｃ）において、ガラス基板１はブレイク動作を行うために表裏反転させている。１１はスキージであり、スクライブ線６の反対側でスクライブ線６の位置に合せて配置する。スキージ１１がシリンダ、あるいはバネ等により加圧されてガラス基板１に負荷を与えることで、Ｖ字型のスクライブ線６が開く力が働き、スクライブ線が反対面まで成長して分割に至り、（ｄ）に示すような所望のガラス基板１を得る。   FIG. 2 is an explanatory view for explaining a method of dividing a glass substrate in the first conventional example. In FIG. 2A, 1 is a glass substrate, 10 is a processing table for holding the glass substrate 1, and 4 is a glass substrate 1. A scribing cutter for scribing and is disposed above the glass substrate 1. A scribe line is formed by placing the scribe cutter 4 on the glass substrate 1 and running the surface of the glass substrate 1 in a direction perpendicular to the drawing while pressing with a cylinder, a spring or the like. In (b), 6 is a scribe line (cutting guide flaw) formed by the scribe cutter 4. In (c), the glass substrate 1 is turned upside down in order to perform a breaking operation. Reference numeral 11 denotes a squeegee, which is arranged on the opposite side of the scribe line 6 according to the position of the scribe line 6. When the squeegee 11 is pressurized by a cylinder or a spring to apply a load to the glass substrate 1, a force for opening the V-shaped scribe line 6 works, and the scribe line grows to the opposite surface, leading to the division ( A desired glass substrate 1 as shown in d) is obtained.

図３は第２の従来例におけるガラス基板の分割方法を説明する説明図であり、（ａ）、（ｂ）において、１はガラス基板であり、１２はガラス基板１を保持する加工台、４はガラス基板１をスクライブするスクライブカッターであり、ガラス基板１の上方に配置する。スクライブカッター４をガラス基板１上に当て、シリンダ、バネ等により加圧しながらガラス基板１の表面を図面と垂直な方向に走行することで、ガラス基板１上にスクライブ線６を形成する工程までは図２の従来例と同一であるが、（ｃ）において、ガラス基板１を表裏反転させずに、スキージ１１がスクライブ線６と同じ面側でスクライブ線６よりも外側に配置される点が図２の従来例と異なる。スキージ１１は図面の下方に下降してガラス基板１に負荷を与えてスクライブ線６を成長させ、ガラス基板１を分割する。
上記の２つの従来例はガラス基板を分割する際に用いられる一般的な方法であるが、液晶表示装置用の液晶パネルや太陽電池など、ガラス基板上に集積回路を形成した状態で分割する場合には問題が生じる。図２を例とすると、ガラス基板１の表面全体に集積回路があると、スクライブする際に表面の集積回路を破壊、あるいは機能を損なう原因となる。また、集積回路を構成する材料の硬度が高い場合、スクライブカッター４に対する負荷が大きくなり、スクライブカッター４の寿命が短くなる問題がある。さらには集積回路をスクライブしたときに発生したゴミがスクライブカッター４に付着し、別のガラス基板に再付着する問題もある。逆に集積回路が形成されていないガラス基板１の裏面をスクライブすると、ブレイクする際にスキージ１１が集積回路側を押えることになるため、集積回路の破壊、機能低下の原因となる。 FIG. 3 is an explanatory view for explaining a method of dividing a glass substrate in the second conventional example. In FIGS. 3A and 3B, 1 is a glass substrate, 12 is a work table for holding the glass substrate 1, 4 Is a scribe cutter for scribing the glass substrate 1 and is disposed above the glass substrate 1. Until the step of forming the scribe line 6 on the glass substrate 1 by applying the scribe cutter 4 on the glass substrate 1 and running the surface of the glass substrate 1 in a direction perpendicular to the drawing while pressing with a cylinder, a spring or the like. 2 (c), the squeegee 11 is arranged on the same surface side as the scribe line 6 and outside the scribe line 6 without inverting the glass substrate 1 in FIG. 2 is different from the conventional example. The squeegee 11 descends downward in the drawing, applies a load to the glass substrate 1 to grow the scribe line 6, and divides the glass substrate 1.
The above two conventional examples are general methods used when dividing a glass substrate, but when dividing in a state where an integrated circuit is formed on a glass substrate such as a liquid crystal panel or a solar cell for a liquid crystal display device. Problems arise. Taking FIG. 2 as an example, if there is an integrated circuit on the entire surface of the glass substrate 1, the integrated circuit on the surface may be destroyed or the function may be impaired when scribing. Further, when the hardness of the material constituting the integrated circuit is high, there is a problem that the load on the scribe cutter 4 is increased and the life of the scribe cutter 4 is shortened. Furthermore, there is a problem that dust generated when the integrated circuit is scribed adheres to the scribe cutter 4 and reattaches to another glass substrate. On the contrary, when the back surface of the glass substrate 1 on which no integrated circuit is formed is scribed, the squeegee 11 presses the integrated circuit side when breaking, which causes destruction of the integrated circuit and deterioration of functions.

この様な問題を解決し、集積回路を表面に形成したガラス基板を分割する方法として、例えば、図４に示すものがある。（ａ）において、１はガラス基板であり、片面には周縁部の接触可能部位を除き、集積回路２が形成されている。１３はガラス基板１を保持する基板固定用定盤であり、中央部は定盤が集積回路２に触れないように凹部１４が形成されている。ガラス基板１は集積回路２を下向きにして基板固定用定盤１３上に置かれ、ガラス基板１は真空吸着するための真空吸着および解除用穴１５により基板固定用定盤１３の周縁部で吸着固定される。４はスクライブカッターであり、集積回路２の反対側をスクライブする。１６は基板固定用定盤１３の凹部１４の中央に設けられた排水口である。（ｂ）において、６はスクライブカッター４によるスクライブ線である。（ｃ）において、１１はスクライブ線６の外側に配置されたスキージであり、ガラス基板１に負荷を与えブレイクする（例えば、特許文献１参照）。   As a method of solving such a problem and dividing a glass substrate on which an integrated circuit is formed, there is a method shown in FIG. 4, for example. In (a), reference numeral 1 denotes a glass substrate, and an integrated circuit 2 is formed on one side except for a contactable portion of the peripheral portion. Reference numeral 13 denotes a substrate fixing surface plate for holding the glass substrate 1, and a concave portion 14 is formed at the center so that the surface plate does not touch the integrated circuit 2. The glass substrate 1 is placed on the substrate fixing platen 13 with the integrated circuit 2 facing downward, and the glass substrate 1 is adsorbed at the peripheral portion of the substrate fixing platen 13 by the vacuum adsorption and release holes 15 for vacuum adsorption. Fixed. A scribe cutter 4 scribes the opposite side of the integrated circuit 2. Reference numeral 16 denotes a drain outlet provided in the center of the concave portion 14 of the substrate fixing surface plate 13. In (b), 6 is a scribe line by the scribe cutter 4. In (c), 11 is a squeegee arranged outside the scribe line 6 and applies a load to the glass substrate 1 to break (see, for example, Patent Document 1).

特開平１１−３２６８５６号公報（図１、図２）JP-A-11-326856 (FIGS. 1 and 2)

従来のガラス基板を分割する方法では、以上のように構成されているため、ガラス基板の周縁部に集積回路を形成しない接触可能部位を予め設けておく必要があった。しかし、この接触可能部位を予め設けておくためには、集積回路製作時のマスク処理や、集積回路除去のためのエッチング等の余分な手間が必要となっていた。   Since the conventional method for dividing a glass substrate is configured as described above, it is necessary to provide in advance a contactable portion that does not form an integrated circuit on the peripheral edge of the glass substrate. However, in order to provide the contactable portion in advance, extra work such as mask processing at the time of integrated circuit manufacture and etching for removing the integrated circuit is required.

この発明は上記のような課題を解決するためになされたものであり、ガラス基板の集積回路形成面に特別な接触可能部位を設けることなく、ガラス基板の分割方法を提供することを目的とする。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for dividing a glass substrate without providing a special contactable portion on the integrated circuit forming surface of the glass substrate. .

この発明に係るガラス基板の分割方法は、表面に集積回路が形成されているガラス基板を分割する方法において、ガラス基板の集積回路が形成された表面を上にしてガラス基板を加工台上に載置保持する工程と、ガラス基板の切断位置の裏面側端縁に配置されたスクライブカッターによりガラス基板の裏面に切断案内傷を形成するスクライブを行うとともに、ガラス基板の切断位置の表面側外端縁に配置されたバックアップ部材によりスクライブする際にガラス基板の撓みを防止する工程と、ガラス基板の端部にクランプ機構をクランプして回転することにより、ガラス基板を分割するブレイクを行う工程とを備えたものである。   The method for dividing a glass substrate according to the present invention is a method for dividing a glass substrate having an integrated circuit formed on a surface thereof. The glass substrate is placed on a processing table with the surface of the glass substrate on which the integrated circuit is formed facing upward. The surface side outer edge of the cutting position of the glass substrate is performed while performing a scribing process to form a cutting guide flaw on the back surface of the glass substrate by the step of holding and the scribing cutter disposed on the rear surface side edge of the cutting position of the glass substrate A step of preventing bending of the glass substrate when scribing with a backup member disposed on the substrate, and a step of performing a break to divide the glass substrate by clamping and rotating the clamp mechanism at the end of the glass substrate. It is a thing.

この発明によれば、ガラス基板の集積回路が形成されていない面（裏面）をスクライブし、ガラス基板の端材部をクランプして回転することでガラス基板を分割できる構成であるため、スクライブやスキージによる集積回路の破壊や機能低下を防止することが出来る。また、スクライブカッターは集積回路に作用しないため、スクライブカッターの寿命低下や集積回路へのゴミ付着の問題を防止することが出来る。   According to the present invention, since the glass substrate can be divided by scribing the surface (back surface) where the integrated circuit of the glass substrate is not formed, clamping the end material portion of the glass substrate and rotating, It is possible to prevent the integrated circuit from being destroyed and the function from being deteriorated by the squeegee. In addition, since the scribe cutter does not act on the integrated circuit, it is possible to prevent problems such as a reduction in the life of the scribe cutter and adhesion of dust to the integrated circuit.

実施の形態１．
以下、この発明の実施の形態１を図に基づいて説明する。
図１はこの発明の実施の形態１におけるガラス基板の分割方法を説明する説明図である。（ａ）において、１は例えば集積型薄膜太陽電池の製造に用いられるガラス基板であり、片面全体に集積回路２が形成されている。従来のガラス基板では、片面に周縁部の接触可能部位を除き、集積回路を形成しているため、集積回路製作時のマスク処理や、集積回路除去のためのエッチング等の余分な手間が必要であったが、この発明のガラス基板１によれば、片面全体に集積回路２を形成しているので、余分な手間が不要となる。ガラス基板１は集積回路２の形成された面（以下、この面を表面とする）を上にして加工台３上に置き、ガラス基板１の周縁部が加工台３の端部からはみ出るように載置する。そして、ガラス基板１の切断位置の裏面側両端にスクライブカッター４を配置し、ガラス基板１の切断位置の表面側の最外側両端にはスクライブする際にガラスが撓むことを防止するバックアップ部材５を配置する。（ｂ）はスクライブ後の図面であり、６はスクライブカッター４によりガラス基板１の裏面側両端に形成されたスクライブ線（切断案内傷）である。（ｃ）において、７はガラス基板１の周縁部の端材となる両端部分の表裏両面をクランプするクランパーからなるクランプ機構であり、回転中心軸８を中心として矢印の方向に回転動作する。（ｄ）において、９はブレイクにより発生するガラス基板１の切り離された端材で、クランパー７にクランプされて取り除かれる。 Embodiment 1 FIG.
Embodiment 1 of the present invention will be described below with reference to the drawings.
FIG. 1 is an explanatory view for explaining a glass substrate dividing method according to Embodiment 1 of the present invention. In (a), 1 is a glass substrate used for manufacturing an integrated thin film solar cell, for example, and an integrated circuit 2 is formed on the entire surface. In the conventional glass substrate, an integrated circuit is formed by excluding the contactable part of the peripheral part on one side, so that extra work such as mask processing at the time of integrated circuit manufacture and etching for removing the integrated circuit is necessary. However, according to the glass substrate 1 of the present invention, since the integrated circuit 2 is formed on the entire surface, no extra work is required. The glass substrate 1 is placed on the processing table 3 with the surface on which the integrated circuit 2 is formed (hereinafter, this surface is referred to as the surface) so that the peripheral edge of the glass substrate 1 protrudes from the end of the processing table 3. Place. And the backup member 5 which arrange | positions the scribe cutter 4 at the back surface side both ends of the cutting position of the glass substrate 1, and prevents that glass is bent when scribing to the outermost both ends of the surface side of the cutting position of the glass substrate 1 is carried out. Place. (B) is a drawing after scribing, and 6 is a scribe line (cutting guide flaw) formed on both ends of the back side of the glass substrate 1 by the scribe cutter 4. In (c), reference numeral 7 denotes a clamp mechanism comprising a clamper that clamps both front and back surfaces of both end portions as end materials of the peripheral edge of the glass substrate 1, and rotates in the direction of the arrow about the rotation center axis 8. In (d), reference numeral 9 denotes a cut end material of the glass substrate 1 generated by the break, which is clamped by the clamper 7 and removed.

次に動作について説明する。図１の（ａ）において、ガラス基板１は、図示しない搬送機構により集積回路２が形成された表面を上にして加工台３に搬送され、図示しない位置決め機構により位置決めされる。位置決め後、バックアップ部材５が下降しガラス基板１が上方に撓まないように保持する。この際、バックアップ部材５は集積回路２面上を押えることになるが、分割後に端材９として取り除かれる部分であるので、製品となる太陽電池の機能には何ら問題を与えない。スクライブカッター４はガラス基板１に当たるまで上昇し、シリンダやバネなどにより適正な加圧力をガラス基板１に付与する。ガラスカッター４は図面と垂直な方向に動作する駆動部とガイド部からなる機構を有しており、適正な加圧力をガラス基板１に付与しながらガラス基板１の端から端まで走行し、スクライブ線６を形成する。この発明では、ガラス基板１の集積回路２が形成されていない裏面を下方からスクライブカッター４がスクライブするため、スクライブ時に発生するマイクロカレットは集積回路２に付着することが無く、ガラス基板１の洗浄、あるいはエアブロー等によるマイクロカレットの除去工程は不要である。（ｃ）において、スクライブ後、スクライブカッター４およびバックアップ部材５がそれぞれ退避し、クランパー７がガラス基板１の両端部をそれぞれクランプできる位置まで前進する。クランパー７の把持部は開閉できる機構となっており、クランパー７の前進完了後にガラス基板１の両端部の表裏両面をクランプする。上記のバックアップ部材５と同様にクランパー７は集積回路２面上に作用するが、分割位置の外側の端材９として取り除かれる部位をクランプするため、製品である太陽電池の機能に何ら影響を与えない。（ｄ）において、クランパー７が回転中心軸８を中心として矢印方向に回転することによりスクライブ線６のＶ型溝が成長し、ガラス基板１の表面に到達することでガラス基板１が分割される。分割後のガラス基板１のソゲやカジリを抑制するためには、回転中心軸８を適正な位置に設定することが必要であり、集積回路２表面上に引いた分割予定線を上方に平行にオフセットした位置が適正である。   Next, the operation will be described. In FIG. 1A, the glass substrate 1 is transported to the processing table 3 with the surface on which the integrated circuit 2 is formed by a transport mechanism (not shown) and positioned by a positioning mechanism (not shown). After positioning, the backup member 5 is lowered and held so that the glass substrate 1 is not bent upward. At this time, the backup member 5 is pressed on the surface of the integrated circuit 2, but is a part that is removed as the end material 9 after the division, so that no problem is given to the function of the solar cell as a product. The scribe cutter 4 rises until it hits the glass substrate 1 and applies an appropriate pressure to the glass substrate 1 by a cylinder or a spring. The glass cutter 4 has a mechanism composed of a drive unit and a guide unit that operate in a direction perpendicular to the drawing. The glass cutter 4 travels from end to end of the glass substrate 1 while applying an appropriate pressing force to the glass substrate 1, and is scribed. Line 6 is formed. In this invention, since the scribe cutter 4 scribes the back surface of the glass substrate 1 where the integrated circuit 2 is not formed from below, the micro cullet generated at the time of scribing does not adhere to the integrated circuit 2 and the glass substrate 1 is cleaned. Alternatively, the process of removing the micro cullet by air blow or the like is unnecessary. In (c), after scribing, the scribe cutter 4 and the backup member 5 are retracted, and the clamper 7 moves forward to a position where both ends of the glass substrate 1 can be clamped. The gripping portion of the clamper 7 has a mechanism that can be opened and closed, and clamps both the front and back surfaces of both ends of the glass substrate 1 after the advancement of the clamper 7 is completed. The clamper 7 acts on the surface of the integrated circuit 2 in the same manner as the backup member 5 described above. However, the clamper 7 clamps a portion to be removed as the end material 9 outside the division position, and thus has no influence on the function of the solar cell as a product. Absent. In (d), when the clamper 7 rotates about the rotation center axis 8 in the direction of the arrow, the V-shaped groove of the scribe line 6 grows and reaches the surface of the glass substrate 1 to divide the glass substrate 1. . In order to suppress the stagnation and galling of the glass substrate 1 after the division, it is necessary to set the rotation center axis 8 at an appropriate position, and the planned division line drawn on the surface of the integrated circuit 2 is parallel upward. The offset position is appropriate.

上記の動作により、集積回路２の形成されたガラス基板１が分割できるため、従来例のようにガラス基材１を表裏反転させる必要がなく、また、全面に集積回路２を形成した表面を上にして処理できるため、従来のように集積回路製作時のマスク処理や、集積回路除去のためのエッチング等の余分な手間が不要となり、装置のコストを低減することが可能である。   By the above operation, the glass substrate 1 on which the integrated circuit 2 is formed can be divided, so that it is not necessary to invert the glass substrate 1 as in the conventional example, and the surface on which the integrated circuit 2 is formed on the entire surface is upside down. Therefore, it is possible to reduce the cost of the apparatus by eliminating the need for extra processing such as mask processing at the time of manufacturing the integrated circuit and etching for removing the integrated circuit as in the conventional case.

実施の形態２．
なお、上記実施の形態１では、ガラス基板１を加工する場所として、加工台３を使用しているが、特に台状のものである必要は無く、例えば、コンベアのような搬送機構上であっても良い。 Embodiment 2. FIG.
In the first embodiment, the processing table 3 is used as a place where the glass substrate 1 is processed. However, the processing table 3 is not particularly required to be a trapezoidal shape. May be.

実施の形態３．
また、上記実施の形態１では、加工台３で、スクライブ線（切断案内傷）６を成長させるスクライブと、切断案内傷を成長させるように基板に負荷を与えてガラス基板１を分割するブレイクとを行っているが、タクトタイムを短縮するために、上記スクライブとブレイクを別の場所に分けて行っても良い。 Embodiment 3 FIG.
Moreover, in the said Embodiment 1, the scribe which grows the scribe line (cutting guide flaw) 6 on the processing stand 3, and the break which divides | segments the glass substrate 1 by applying a load to a board | substrate so that a cutting guide flaw may be grown, However, in order to shorten the tact time, the scribe and break may be performed separately.

この発明の実施の形態１におけるガラス基板の分割方法を説明する説明図である。It is explanatory drawing explaining the division | segmentation method of the glass substrate in Embodiment 1 of this invention. 第１の従来例におけるガラス基板の分割方法を説明する説明図である。It is explanatory drawing explaining the division | segmentation method of the glass substrate in a 1st prior art example. 第２の従来例におけるガラス基板の分割方法を説明する説明図である。It is explanatory drawing explaining the division | segmentation method of the glass substrate in a 2nd prior art example. 従来の集積回路を表面に形成したガラス基板の分割する方法を説明する説明図である。It is explanatory drawing explaining the method to divide | segment the glass substrate which formed the conventional integrated circuit on the surface.

符号の説明Explanation of symbols

１ ガラス基板
２ 集積回路
３、１０、１２ 加工台
４ スクライブカッター
５ バックアップ部材
６ スクライブ線（切断案内傷）
７ クランパー（クランプ機構）
８ 回転中心軸
９ 端材
１１ スキージ
１３ 基板固定用定盤
１４ 凹部
１５ 真空吸着および解除用穴
１６ 排水口 DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Integrated circuit 3, 10, 12 Processing stand 4 Scribe cutter 5 Backup member 6 Scribe wire (cutting guide flaw)
7 Clamper (Clamp mechanism)
8 Rotating center shaft 9 End material 11 Squeegee 13 Substrate fixing surface plate 14 Recess 15 Vacuum suction and release hole 16 Drain port

Claims (4)

表面に集積回路が形成されているガラス基板を分割する方法において、
前記ガラス基板の集積回路が形成された表面を上にして前記ガラス基板を加工台上に載置保持する工程と、
前記ガラス基板の切断位置の裏面側端縁に配置されたスクライブカッターにより前記ガラス基板の裏面に切断案内傷を形成するスクライブを行うとともに、前記ガラス基板の切断位置の表面側外端縁に配置されたバックアップ部材により前記スクライブする際に前記ガラス基板の撓みを防止する工程と、
前記ガラス基板の端部にクランプ機構をクランプして回転することにより、前記ガラス基板を分割するブレイクを行う工程と、
を備えたことを特徴とするガラス基板の分割方法。 In a method of dividing a glass substrate on which an integrated circuit is formed on the surface,
Placing and holding the glass substrate on a processing table with the surface on which the integrated circuit of the glass substrate is formed facing up;
A scribing cutter disposed on the back surface side edge of the cutting position of the glass substrate performs scribing to form a cutting guide flaw on the back surface of the glass substrate, and is disposed on the front side outer edge of the cutting position of the glass substrate. A step of preventing the glass substrate from being bent when the scribe is performed by the backup member;
A step of performing a break to divide the glass substrate by clamping and rotating a clamp mechanism at an end of the glass substrate;
A method for dividing a glass substrate, comprising: ガラス基板は、表面全体に集積回路が形成され、前記ガラス基板の表面側端縁には特別な接触可能部位が設けられていないことを特徴とする請求項１記載のガラス基板の分割方法。   The glass substrate dividing method according to claim 1, wherein an integrated circuit is formed on the entire surface of the glass substrate, and no special contactable portion is provided on an edge of the surface of the glass substrate. ガラス基板の裏面側端縁が加工台からはみ出るように前記加工台上に載置し、前記ガラス基板の切断位置の裏面側端縁に配置されたスクライブカッターにより、前記ガラス基板の前記加工台からはみ出た部分をスクライブすること特徴とする請求項１記載のガラス基板の分割方法。   The glass substrate is placed on the processing table so that the edge on the back side of the glass substrate protrudes from the processing table, and from the processing table of the glass substrate by a scribe cutter arranged at the edge on the back side of the cutting position of the glass substrate. The method for dividing a glass substrate according to claim 1, wherein the protruding portion is scribed. スクライブする際にガラス基板の撓みを防止するバックアップ部材は、ブレイク工程により前記ガラス基材から切り離され、取り除かれる端材部分の表面に作用することを特徴とする請求項１記載のガラス基板の分割方法。   2. The glass substrate division according to claim 1, wherein the back-up member for preventing the glass substrate from being bent at the time of scribing acts on the surface of the end material portion which is separated from the glass base material and removed by a breaking process. Method.
JP2007158425A 2007-06-15 2007-06-15 Method for dividing glass substrate used for manufacturing integrated thin film solar cell Expired - Fee Related JP4915294B2 (en)

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TWI667210B (en) * 2016-03-29 2019-08-01 日商三星鑽石工業股份有限公司 Sap material removing device and method
CN111633852A (en) * 2020-04-16 2020-09-08 江苏京创先进电子科技有限公司 Edge removing processing method of wafer chip and dicing saw applied by same
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* Cited by examiner, † Cited by third party
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JP2015502907A (en) * 2011-11-30 2015-01-29 コーニング インコーポレイテッド Method and apparatus for removing the peripheral portion of a glass sheet
CN104249412A (en) * 2013-06-28 2014-12-31 三星钻石工业股份有限公司 Brittle material base board parting tool and brittle material base board supporting fixture
JP2015044722A (en) * 2013-08-29 2015-03-12 三星ダイヤモンド工業株式会社 Parting mechanism
CN104418493A (en) * 2013-08-29 2015-03-18 三星钻石工业股份有限公司 Dividing mechanism
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CN107406294A (en) * 2015-01-06 2017-11-28 康宁股份有限公司 For processing the glass carrier component and method of flexible glass plate
TWI667210B (en) * 2016-03-29 2019-08-01 日商三星鑽石工業股份有限公司 Sap material removing device and method
EP3410473A1 (en) * 2017-05-30 2018-12-05 Infineon Technologies AG Apparatus and method for dividing substrates
CN111633852A (en) * 2020-04-16 2020-09-08 江苏京创先进电子科技有限公司 Edge removing processing method of wafer chip and dicing saw applied by same
WO2022153859A1 (en) * 2021-01-12 2022-07-21 日本電気硝子株式会社 Method for producing glass film

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