TWI620633B - Breaking mechanism - Google Patents

Abstract

The invention provides a breaking mechanism capable of breaking a side end portion of a brittle material substrate well.

The mechanism for cutting the edge portion of the substrate on which a scribe line is formed in advance along the scribe line includes a pair of clamping bodies that clamp one of the end edge portions, and a posture changing mechanism that changes the posture of the pair of clamping bodies. The posture changing mechanism changes the posture of the pair of clamping bodies holding the end edge portion to apply a torque to the end edge portion, so that the end edge portion can be divided, and the pair of clampings can be performed. One of the bodies has a protruding portion in a central portion along the longitudinal direction of the end edge portion. When the end edge portion is held by the pair of clamping bodies for the breaking, the protruding portion and the end edge portion are made contact.

Description

Breaking mechanism

The present invention relates to a mechanism for breaking a laminated glass substrate and other brittle material substrates for a liquid crystal panel, and in particular to a mechanism for breaking an edge portion of a brittle material substrate.

The liquid crystal panel is roughly manufactured by dividing a large-area bonded substrate (mother substrate) formed by sealing liquid crystal between two rectangular glass substrates into a specific size. A plurality of transistors each constituting a liquid crystal element are formed in advance on a glass substrate of a liquid crystal panel. However, in the stage where the above-mentioned plurality of transistor systems are on the mother substrate, the electrode terminals drawn from the transistor for connection to the outside are shorted to each other by the short-circuit electrodes provided on the side ends (protrusions) of the mother substrate. To prevent insulation damage caused by static electricity. In the manufacturing process of a liquid crystal panel, a technique of cutting off the side ends of a mother substrate provided with a short-circuit electrode is well known (for example, refer to Patent Document 1).

Specifically, Patent Document 1 discloses a process in which a scribe line is formed parallel to the edge at a breaking position of a specific distance from an edge of the rectangular mother substrate, and then the cutting is performed along the formed scribe line. Thereby, the side end portion provided with the short-circuit electrode is removed, and then the end surface of the mother substrate after the cutting is polished.

Further, a device for dividing a ceramic substrate by rotating a holding member holding the ceramic substrate around a rotation axis is also known (for example, refer to Patent Document 2).

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 8-197402

[Patent Document 2] Japanese Patent Laid-Open No. 9-19918

In the case of the aspect disclosed in Patent Document 1, the breaking is achieved by applying a specific torque to the portion removed by the breaking. However, the part that is removed due to the division is formed into a short strip with a long side direction extending along the scribe line and a short side width that is shorter than the length of the scribe line. The distance between the edges is relatively short compared to the length of the scribe line, so torque cannot be obtained from the distance when breaking. Therefore, in order to achieve breaking, a force sufficient to make up for the insufficient distance between the scribe line and the edge must be applied. However, there is a problem that the larger the applied force is, the easier it is to generate cracks or nicks (burrs, etc.) of the mother substrate at the breaking position. In addition, it is difficult to uniformly and instantaneously impart the force to the entire breaking position as described above. Therefore, there may be local unevenness in the magnitude of the acting force, which may cause cracks or gaps in the mother substrate.

The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a breaking mechanism capable of breaking a side end portion of a brittle material substrate well.

In order to solve the above-mentioned problem, the invention of claim 1 is a breaking mechanism, which is characterized in that it is a mechanism for breaking the end edge of a substrate on which a scribe line is formed in advance along the scribe line, and includes clamping the end edge. One of the pair of grippers and a posture changing mechanism that changes the posture of the pair of grippers can be performed by changing the posture of the pair of grippers that grips the edge portion by the posture changing mechanism. The edge portion is divided, and one of the pair of clamp bodies has a protruding portion at a central portion along the longitudinal direction of the edge portion, and the end is clamped by the pair of clamp bodies for the division. In the case of an edge portion, the protruding portion is brought into contact with the end edge portion.

The invention of the technical scheme 2 is the breaking mechanism of the technical scheme 1, which is characterized by: When the edge portion is clamped by the pair of clamping bodies, the protruding portion is brought into contact with a surface of the edge portion where one of the scribe lines is provided.

The invention according to claim 3 is the breaking mechanism according to claim 1 or 2, characterized in that the protruding portion is provided in a ladder shape having a thinner tip as the closer to the scribe line in a plan view.

The invention of claim 4 is the breaking mechanism according to any one of claims 1 to 3, characterized in that in the posture changing mechanism, a holding portion that holds the pair of holders is set freely around a specific rotation axis By turning, the specific rotation member moves up and down to move the rotation shaft along an arc-shaped trajectory, thereby changing the posture of the pair of clamping bodies.

According to the inventions of claims 1 to 4, in the clamping body provided with one side of the protruding portion, the force acting on the edge portion of the substrate to be broken can be concentrated on the protruding portion, which can be stable and stable. Breaking of edge portions without cracks, burrs, or the like is surely achieved.

1‧‧‧ Breaking agency

2‧‧‧ the first clamp

3‧‧‧ 2nd clamping body

4‧‧‧ posture change mechanism

4a‧‧‧Clamping section

4b‧‧‧rotation shaft

4c‧‧‧Action Conversion Department

4d‧‧‧Lift

5‧‧‧ protrusion

6, 7‧‧‧ resin sheet

8‧‧‧ Guide

9‧‧‧ Guide

10‧‧‧ substrate holding section

11‧‧‧Exhaust path

100‧‧‧ Breaking processing device

A1‧‧‧Circle

A2‧‧‧arc

AR1‧‧‧Arrow

AR2‧‧‧Arrow

AR3‧‧‧Arrow

AR4‧‧‧Arrow

AR5‧‧‧Arrow

RE‧‧‧Area

SL‧‧‧ crossed

W‧‧‧ substrate

FIG. 1 is a side view showing a schematic configuration of the breaking mechanism 1.

FIG. 2 is a plan view of the breaking mechanism 1. FIG.

FIG. 3 is a side view of the breaking mechanism 1 as viewed from the positive side in the Y-axis direction.

FIG. 4 is a plan view of the first holder 2 viewed from the negative side in the Z-axis direction.

FIG. 5 is a side view of the breaking mechanism 1 when the substrate W is held from the positive side in the Y-axis direction.

FIG. 6 is a perspective plan view showing a state at the time when the cutting of the substrate W by the cutting mechanism 1 is started.

FIG. 7 is a perspective plan view showing a situation in which the substrate W of the cutting mechanism 1 is cut in the middle.

8 (a) and 8 (b) are schematic diagrams for explaining one example of the posture changing mechanism 4 and the rotation operation of the clamping part 4a in the example.

FIGS. 9 (a) and 9 (b) are schematic diagrams for explaining one example of the posture changing mechanism 4 and the rotation operation of the clamping part 4 a in the example.

FIG. 10 is a perspective view showing a main part of the breaking processing apparatus 100.

FIG. 11 is a side view showing a main part of the breaking processing apparatus 100. As shown in FIG.

<Outline of Breaking Mechanism>

Fig. 1 is a side view showing a schematic configuration of a breaking mechanism 1 according to an embodiment of the present invention. FIG. 2 is a plan view of the breaking mechanism 1. FIG. The breaking mechanism 1 according to the embodiment of the present invention is a mechanism that cuts and removes the edges of a rectangular brittle material substrate (hereinafter, simply referred to as a substrate) W. The substrate W is, for example, a glass substrate, and may be a large-area bonded substrate formed by sealing liquid crystal between two rectangular glass substrates as a mother substrate of a liquid crystal panel.

The breaking mechanism 1 mainly includes: a first clamping body 2 and a second clamping body 3, which constitute a pair of clamping bodies, both of which are short strips; a clamping portion 4a, which realizes the use of the first clamping body 2 A clamping operation for clamping the substrate W with the second clamping body 3; and a rotating shaft 4b when the clamping section 4a performs a rotational operation. The holding portion 4 a and the rotation shaft 4 b constitute an attitude changing mechanism 4 that integrally changes the attitude of the first holding body 2 and the second holding body 3 in a state where the substrate W is held.

In the breaking mechanism 1, in a state in which the substrate W is held by a holding member (not shown), the end edge portion of the substrate W is roughly clamped in the first position that is short in a plan view and in a horizontal posture. Between the clamp body 2 and the second clamp body 3. Then, by driving the posture changing mechanism 4 in the clamped state, the postures of the first clamp body 2 and the second clamp body 3 are changed, thereby applying torque to the end edge portion. After the torque is applied, the edge portion is cut off from the substrate W.

Furthermore, in FIGS. 1 and 2, the right-handed XYZ coordinates (the same in the following drawings) are marked, and the right-handed XYZ coordinates are the first holder 2 and the second holder 3 in the horizontal plane. The direction of extension (that is, the direction of extension of the edge of the substrate W to be removed) is set to the X-axis direction, and the direction orthogonal to the X-axis direction in the horizontal plane is set to the Y-axis direction. The straight direction is set to the Z-axis direction. 1 is a side view of the breaking mechanism 1 as viewed from the positive side in the X-axis direction. In addition, in FIG. 2, the posture changing mechanism 4 is shown connected to the first holder 2 and the second holder 3 at three locations, but this is merely an example. The support aspect of the 1st clamp body 2 and the 2nd clamp body 3 is not limited to this.

<Details of the breaking mechanism and breaking patterns>

Next, the detailed structure of the breaking mechanism 1 and the breaking state of the substrate W using the breaking mechanism 1 will be described.

FIG. 3 is a side view of the breaking mechanism 1 as viewed from the positive side in the Y-axis direction. FIG. 4 is a plan view of the first holder 2 viewed from the negative side in the Z-axis direction. FIG. 5 is a side view of the breaking mechanism 1 when the substrate W is held from the positive side in the Y-axis direction. FIG. 6 is a perspective plan view showing a state at the time when the cutting of the substrate W by the cutting mechanism 1 is started. FIG. 7 is a perspective plan view showing a situation in which the substrate W of the cutting mechanism 1 is cut in the middle.

First, as shown in FIG. 1 and FIG. 6, a scribe line SL is formed in advance on the edge of the substrate W as a removal target at a specific distance from the edge before cutting. The scribe line SL is formed by a well-known scribe formation member such as a diamond point or a cutter wheel.

The substrate W on which the scribe line SL has been formed is in a state where one side on which the scribe line SL is formed is set to the upper surface side (the positive side in the Z-axis direction) from the side opposite to the posture changing mechanism 4 (from the Y axis (Positive side) is inserted between the first holder 2 and the second holder 3. When the substrate W is inserted, the holding portion 4 a of the posture changing mechanism 4 is configured to hold the portion between the edge of the substrate W and the formation position of the scribe line SL between the first holder 2 and the second holder 3. In the above-mentioned clamping state, a specific magnitude of force (pressing force) is applied to the substrate W from the first clamping body 2 and the second clamping body 3.

In addition, the clamping operation of the clamping portion 4a, that is, the approach and separation of the first clamping body 2 and the second clamping body 3, can be achieved by both shifting simultaneously, or, for example, as follows To achieve: only one clamping body located on the positive side of the Z-axis direction (the first clamping body in the case of FIG. 1) 2) Operation is possible, and another holding body (the second holding body 3 in the case of FIG. 1) is fixed to the holding portion 4 a. In other words, the holding portion 4a may be a portion that holds the first holding body 2 and the second holding body 3 so as to be able to open and close a gap portion therebetween.

Among them, as shown in FIG. 3 and FIG. 4, or further, as shown by dashed lines in FIG. 1 and FIG. 2, in the first clamping body 2, on the surface facing the second clamping body 3 and the X axis A protruding portion 5 is provided at a central edge portion in the direction (long-side direction) and a positive edge portion in the Y-axis direction. The protruding portion 5 is formed of an elastic body such as rubber. In addition, the thickness (the dimension in the Z-axis direction) may be the same, but the top-view shape (the shape in the case of looking down in a horizontal posture) is rectangular instead of the rectangular shape. It is better to set it toward the positive side of the Y-axis direction. The tip portion has a trapezoidal shape with a thinner tip as the position is closer to the scribe line SL.

On the other hand, as shown in FIGS. 1 and 3, in the second holder 3, a resin sheet 6 is attached to substantially the entire surface of the second holder 3 facing the first holder 2.

Therefore, strictly speaking, as shown in FIG. 5, the clamping of the substrate W in the breaking mechanism 1 of this embodiment is performed on the protruding portion 5 provided on the first holding body 2 and on the second holding body 3. It is performed between the resin sheets 6.

At this time, the force acting on the substrate W from one side of the second holder 3, specifically, the pressing force acting on the substrate W from the resin sheet 6 is uniformly set in the X-axis direction because the resin sheet 6 is disposed in the X-axis direction. Uniform in the axial direction. On the other hand, on one side of the first holding body 2, the portion in contact with the substrate W is only the protruding portion 5. Therefore, the pressing force acts only on the substrate W from the protruding portion 5. At this time, since the pressing force acting on the substrate W from one side of the first holder 2 is concentrated on the portion of the protrusion 5, as shown in FIG. 6, the stress is concentrated on the substrate W close to the front end side of the protrusion 5. The state of the area RE.

In the breaking mechanism 1, the substrate W is cut in a state where the pressing force is applied in the above-mentioned state. Specifically, in the posture changing mechanism 4, the gripping portion 4a is provided to be rotatable about the rotation axis 4b. If it is the case shown in FIG. 1, the rotation axis 4b is moved in the direction shown by the arrow AR1 The holding part 4a rotates around the rotation axis 4b, so that the first holding body 2 and the second holding body 3 The posture is changed from the horizontal posture to a posture where the negative side of the Y-axis direction existing in the grip portion 4a becomes lower. Thereby, the torque acts on the edge portion of the substrate W in the direction of the arrow AR1. In this way, as the turning operation starts, starting from the central portion in the long side direction of the scribe line SL existing in the region RE where the stress is concentrated, the crack starts to extend along the scribe line SL. At the same time, cracks also extend in the thickness direction in this order from the starting point. Thereby, as shown in FIG. 7, the substrate W is divided along the scribe line SL in both the positive and negative directions of the X axis.

In addition, as described above, it is preferable that the front end portion on the front side in the Y-axis direction of the protruding portion 5 has a trapezoidal shape in order to make the stress acting on the region RE stronger, and to make it easier for cracks to extend along the scribe line SL.

If the crack in the thickness direction is spread over the entire range from the central portion to the two end portions in the longitudinal direction of the scribe line SL, the substrate W held by the first holder 2 and the second holder 3 The edge portion is completely cut off from the substrate W.

In the case of the break of the above aspect, the torque applied to the end edge portion of the substrate W is concentrated on the protruding portion 5, whereby cracks extending from the scribe line SL are sequentially generated from the vicinity of the protruding portion. . Therefore, as in the case where the protruding portion 5 is not provided, the resin sheet is uniformly attached to one side of the first holder 2 as well as the second holder 3 and extends from the one side of the first holder 2 to the end edge. In the case where the force is uniformly applied to the entire part, even if only a small torque is applied, the substrate W can be reliably broken without cracks or burrs. The reason is that if the magnitude of the force applied during clamping is the same, the pressure at the portion where the force acts when the protrusion 5 is provided will increase. Therefore, if the protrusion 5 is provided, The force is small, and it can also exert enough pressure to achieve breaking.

Moreover, the cracks only need to be sequentially extended from the central portion. Therefore, it is not necessary to apply strong energy all over the entire end edge portion of the substrate W. Therefore, even if the speed of rotating the clamping portion 4a around the rotation axis 4b is set, In order to be slower than the case where the resin sheet is provided as described above, it is possible to realize that the substrate W is reliably cut without cracks or burrs.

Furthermore, before the description so far, the substrate W is held in the following state, that is, the scribe line The formation surface of the SL is the upper surface side, and the first holder 2 approaches the substrate W from above and the second holder 3 approaches the substrate W from below, but this is not necessary. In this embodiment, the first holder 2 provided with the protruding portion 5 may be disposed on one side of the formation surface of the scribe line SL. Therefore, in contrast to FIG. 1 and the like, the breaking mechanism 1 may be configured to include the first holder 2 on the lower side and the second holder 3 on the upper side, and the substrate W to be scribed SL The forming surface is inserted between the first holding body 2 and the second holding body 3 in a state where the formation surface is on the lower surface side, and is divided. In the above case, the rotating shaft 4b may be moved in the direction indicated by the arrow AR2 in FIG. 1.

In addition, in FIG. 1 and the like, a resin sheet 7 is also attached to a portion of the first clamping body 2 facing the second clamping body 3 and other than the protruding portion 5. This is to prevent the substrate W from being damaged due to contact with the substrate W and the like other than the protruding portion 5 of the first holder 2, and it is not necessary for the cutting in the above aspect. When the resin sheet 7 is provided as described above, a material softer than the material constituting the protrusions 5 is used, and the thickness is smaller than the thickness of the protrusions 5. The reason is that even if the thickness of the protruding portion 5 is reduced due to elasticity, so that the resin sheet 7 is in contact with the substrate W, the substrate W can be separated from one of the first clamping bodies 2 when the substrate W is broken. The force applied to the substrate W from the side is concentrated on the protrusion 5.

<Posture changing mechanism>

There are various configurations of the specific configuration of the posture changing mechanism 4 responsible for the posture change of the first and second clamps 2 and 3 described above. FIG. 8 and FIG. 9 are schematic diagrams for explaining one example of the posture changing mechanism 4 and the rotation operation of the gripping portion 4a in the example. In addition, in FIGS. 8 and 9, although the shapes of the first holder 2, the second holder 3, the holding portion 4 a, and the like are appropriately changed from those of FIG. 1 and the like, the functions of the plurality of parts described above are changed. All are the same as the parts described so far. The protrusions 5 and the resin sheets 6 and 7 are not related to the operation of the posture changing mechanism 4 and are not shown.

The posture changing mechanism 4 shown in FIG. 8 (a) includes an operation conversion section 4c and a lifting section 4d in addition to the clamping section 4a and the rotation shaft 4b. The lifting part 4d is, for example, a cylinder equal to a vertical It is a constituent element for free lifting in the direction (Z-axis direction), and the motion conversion unit 4c is a constituent element connecting the rotary shaft 4b and the lifting unit 4d, and is provided so as to be able to be opposed to the rotary shaft 4b and the lifting unit 4d. Each of the rotation axes rotates.

In the posture changing mechanism 4 having the above-mentioned structure, the posture of the motion conversion section 4c changes along with the vertical movement of the elevating section 4d, whereby the rotation shaft 4b moves on the arc A1 shown in FIG. 8 (b). . That is, the motion conversion unit 4c performs a role of converting the lifting motion of the lifting unit 4d into a moving motion on an arc of the rotation shaft 4b. As described above, the movement of the rotation shaft 4b directly causes the postures of the holding portion 4a, the first holding body 2 and the second holding body 3 to change.

In addition, the division of the substrate W in the posture changing mechanism 4 is performed by changing the posture changing mechanism 4 from the state shown by the solid lines in FIGS. 8 (a) and 8 (b) to a point chain in FIG. 8 (b). The state shown in the line is realized. That is, if the lifting portion 4d is lowered as shown by the arrow AR3 in a state where the substrate W is held by the first holder 2 and the second holder 3, the posture change of the motion conversion portion 4c and the accompanying change occur. When the rotation axis 4b of the posture changes on the arc A1, the first clamp body 2 and the second clamp body 3 change from a horizontal posture to a posture where one side of the clamp portion 4a becomes lower. Thereby, the part clamped by the 1st clamp body 2 and the 2nd clamp body 3 is divided | segmented.

In addition, the arrangement relationship of the various parts of the posture changing mechanism 4 is not limited to the relationship shown in FIG. 8. For example, in FIG. 8 (b), the motion conversion unit 4c is in a horizontal posture, but this is not necessary. As long as the rotation shaft 4b is moved on a specific arc A1, it is placed on the first holder 2. Within a range where the posture of the second gripper 3 changes, the motion conversion unit 4c may not take a horizontal posture.

9 shows a situation in which the arrangement positions of the first holder 2 and the second holder 3 are reversed from those shown in FIG. 8. The above-mentioned situation is also the same in that the lifting and lowering portion 4d is used for lifting and lowering, and the rotating shaft 4b can also move on the arc A2. Moreover, the division of the substrate W in the posture changing mechanism 4 is performed by changing the posture changing mechanism 4 from the state shown by the solid lines in FIGS. 9 (a) and 9 (b) to a one-point chain in FIG. 9 (b). The state shown in the line is realized. That is, if the substrate W is held by the first holder 2 and the second holder 3, the lifting portion 4d is raised as shown by an arrow AR4. Rise, the posture change of the motion conversion unit 4c and the movement of the rotation axis 4b on the arc A2 accompanied by the posture change occur, and the first and second clamps 2 and 3 change from the horizontal posture to the clamp 4a There is a posture where one side becomes high. Thereby, the part clamped by the 1st clamp body 2 and the 2nd clamp body 3 is divided | segmented.

<Configuration Example of Breaking Processing Device>

FIG. 10 and FIG. 11 are a perspective view and a side view, respectively, of a main part of a breaking processing apparatus 100 having a breaking mechanism 1 for cutting off an edge portion of a substrate W based on the principle described above. In FIG. 10 and FIG. 11, a cutting processing apparatus 100 including a cutting mechanism 1 configured to have a first holder 2 on a lower side and a second holder 3 on an upper side is exemplified. In particular, FIG. 11 illustrates a case where the posture changing mechanism 4 is in a state when the breaking is performed (where the substrate W is omitted).

The breaking processing device 100 includes, in addition to the breaking mechanism 1, a substrate holding portion 10 holding a substrate W, and a discharge path 11 for discharging an edge portion of the substrate W that has been cut. Both the substrate holding portion 10 and the discharge path 11 are provided along the extending direction of the breaking mechanism 1. Further, the discharge path 11 is a path used when the end edge portion of the substrate W still held between the first holder 2 and the second holder 3 is released from the above-mentioned holding state after the separation, Drain it.

Moreover, in FIG. 10, for the sake of convenience of illustration, only one set of the breaking mechanism 1, the substrate holding portion 10 and the discharge path 11 attached thereto are shown. However, in the actual breaking processing device 100, 2 The group (pair) breaking mechanism 1 is arranged to face each other at a specific interval. That is, in the separation processing apparatus 100, the edge portions of the two portions facing the substrate W can be simultaneously held in a state where the substrate W is supported at two locations in the two substrate holding portions 10 separated from each other. Break in parallel. Alternatively, the breaking processing device 100 may be configured to include a mechanism that rotates the substrate W by 90 ° in a horizontal plane, and sequentially divides a group of two opposite edge portions of the rectangular substrate W into two groups. Off.

In the cutting processing device 100 and further at the end in the longitudinal direction of the posture changing mechanism 4 A guide plate 8 for guiding the posture changing mechanism 4 during the breaking operation is provided nearby (not shown in FIG. 11). More specifically, an arc-shaped through hole is provided in the guide plate 8. On the other hand, at the end in the longitudinal direction of the posture changing mechanism 4, two guide bodies 9 are provided so as to protrude from the through hole. The guide body 9 is moved by drawing an arc-shaped trajectory shown by an arrow AR5 in FIG. 11 when the breaking operation is performed by the posture changing mechanism 4. The through holes of the guide plate 8 are formed to coincide with the trajectory of the guide body 9 described above. Therefore, the operating range of the posture changing mechanism 4 at the time of breaking is limited to the range in which the guide body 9 in the through hole can move. Thereby, the breaking processing device 100 realizes a stable and reproducible breaking operation.

As described above, according to the present embodiment, the end portion of the substrate on which the scribe line is formed in advance is clamped to the end edge portion by applying a torque to the end edge portion in a state where the end edge portion is closer to the edge side than the scribe line. In the mechanism that the edge portion is cut off from the substrate along the scribe line, a contact portion of one of the pair of clamping bodies with the substrate is provided with a protrusion in a ladder shape in plan view, so that one side of the clamping body acts on The force of the substrate is concentrated on the protrusions, and thereby the separation without cracks, burrs, or the like can be achieved stably and reliably.

Claims (5)

A breaking mechanism is characterized in that it is a mechanism for breaking an end edge portion of a substrate on which a scribe line is formed in advance along the scribe line, and includes: a pair of clamping bodies, which are configured to clamp the end edge portion; And a posture changing mechanism that changes the posture of the pair of clamping bodies; the posture changing mechanism changes the posture of the pair of clamping bodies that sandwich the end edge portion to apply torque to the end edge portion, thereby The end edge portion can be divided, and one of the pair of clamping bodies has a protruding portion at a central portion along the longitudinal direction of the end edge portion, and is clamped by the pair of clamping bodies for the division. When holding the edge portion, the protruding portion is brought into contact with the edge portion. The breaking mechanism according to claim 1, wherein when the end edge portion is clamped by the pair of clamping bodies, the protruding portion is brought into contact with a surface of the end edge portion provided with one of the scribe lines. For example, the breaking mechanism of claim 1 or 2, wherein the protruding portion is provided in a ladder shape having a thinner tip as it approaches the position of the scribe line in a plan view. For example, the breaking mechanism of claim 1 or 2, wherein in the posture changing mechanism, the holding portion holding the pair of clamping bodies is set to rotate freely about a specific rotation axis, and the specific lifting member is moved up and down to The posture of the pair of clamping bodies is changed by moving the rotation axis along an arc-shaped trajectory. For example, the breaking mechanism of item 3, wherein in the posture changing mechanism, a holding portion that holds the pair of clamp bodies is set as Rotate freely around a specific rotation axis, and move the rotation axis along a circular arc-like trajectory by moving the specific elevation member up and down, thereby changing the posture of the pair of clamping bodies.