JP2015044722A - Parting mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a parting mechanism capable of parting the side end of a fragile material substrate satisfactorily.SOLUTION: A mechanism 1 for parting the end edge part of a substrate W having a scribe line SL formed in advance, along the scribe line SL comprises: a pair of clamping bodies 2 and 3 for clamping the end edge part; and an attitude changing mechanism 4 for changing the attitudes of the paired clamping bodies 2 and 3. The attitude changing mechanism 4 changes the attitudes of the paired clamping bodies 2 and 3 clamping the end edge part, thereby to apply a torque to the end edge part so that the end edge part can be parted. Moreover, one of the paired clamping bodies 2 and 3 has a protrusion part 5 at a longitudinally central part along the end edge part so that the paired clamping bodies 2 and 3 bring the protrusion part 5 into contact with the end edge part when the clamping bodies 2 and 3 clamp the end edge part for the parting operation.

Description

  The present invention relates to a mechanism for cutting a laminated glass substrate or other brittle material substrate for a liquid crystal panel, and more particularly to a mechanism for cutting an edge portion of a brittle material substrate.

  The liquid crystal panel is generally manufactured by dividing a large-area bonded substrate (mother substrate) having a configuration in which liquid crystal is sealed between two rectangular glass substrates into a predetermined size. On one glass substrate of the liquid crystal panel, a plurality of transistors each forming a liquid crystal element are formed in advance. However, in order to prevent dielectric breakdown due to static electricity, these transistors are provided at the side edge (protruding part) of the mother board through electrode terminals drawn out from the transistor for external connection at the stage of the mother board. The short-circuited electrodes are short-circuited to each other. A technique for dividing and removing a side end portion of a mother substrate provided with a short-circuit electrode in a manufacturing process of a liquid crystal panel is already known (for example, see Patent Document 1).

  Specifically, in Patent Document 1, a scribe line is formed in parallel to the edge at a dividing position at a predetermined distance from one edge of a rectangular mother substrate, and then cut along the formed scribe line. The process of removing the side edge part provided with the short-circuit electrode and further polishing the end surface of the mother substrate after the division is disclosed.

  An apparatus that divides a ceramic substrate by rotating a clamping means that sandwiches the ceramic substrate around a rotation axis is already known (for example, see Patent Document 2).

JP-A-8-197402 Japanese Patent Laid-Open No. 9-19918

  In the case of the mode disclosed in Patent Document 1, the division is realized by applying a predetermined torque to the part to be divided and removed. However, the part to be divided and removed has a strip shape in which the longitudinal direction is the extending direction of the scribe line, while the short direction is narrower than the length of the scribe line, that is, Since the distance between the scribe line and the edge of the mother substrate is relatively shorter than the length of the scribe line, torque cannot be gained by the distance when dividing. Therefore, in order to realize the division, it is necessary to apply a force large enough to cover the short distance between the scribe line and the edge. However, there is a problem that the larger the force to be applied, the more easily the mother substrate is cracked or chipped (eg, chipped) at the dividing position. In addition, since it is difficult to apply such force uniformly and instantaneously over the entire cutting position, there is a local non-uniformity in the magnitude of the applied force, which causes cracks and cracks in the mother board. May occur.

  This invention is made | formed in view of the said subject, and it aims at providing the cutting mechanism which can cut off the side edge part of a brittle material board | substrate favorably.

  In order to solve the above-mentioned problem, the invention of claim 1 is a mechanism for dividing an edge portion of a substrate, on which a scribe line is formed in advance, along the scribe line, and a pair of holding the edge portion. And a posture changing mechanism for changing the posture of the pair of holding members, and the posture changing mechanism changes the posture of the pair of holding members formed by holding the edge portions. The end edge portion can be divided by one of the pair of holding members, and a protrusion is provided at a longitudinal center portion along the end edge portion. Therefore, when the pair of sandwiching bodies sandwich the end edge portion, the projecting portion is brought into contact with the end edge portion.

  Invention of Claim 2 is the dividing mechanism of Claim 1, Comprising: When clamping the said edge part by the said one pair of clamping body, the said protrusion part is the said edge part among said edge part. It is made to contact the surface by which a scribe line is provided.

  The invention according to claim 3 is the dividing mechanism according to claim 1 or 2, wherein the protrusion is provided in a trapezoidal shape that is tapered toward a position closer to the scribe line in a plan view. To do.

  A fourth aspect of the present invention is the dividing mechanism according to any one of the first to third aspects, wherein in the posture changing mechanism, the holding portion that holds the pair of sandwiching bodies has a predetermined rotation axis. It is made rotatable around, and the posture of the pair of sandwiching bodies is changed by moving the rotation shaft along an arcuate locus by causing a predetermined lifting means to move up and down. It is characterized by that.

  According to the first to fourth aspects of the present invention, in the holding body on the side provided with the protruding portion, the force acting on the edge portion of the substrate to be divided is concentrated on the protruding portion. It is possible to stably and surely realize the division of the edge portion where no chipping occurs.

1 is a side view showing a schematic configuration of a cutting mechanism 1. FIG. 3 is a top view of the cutting mechanism 1. FIG. It is the side view which looked at the parting mechanism 1 from the Y-axis direction positive side. It is the top view which looked at the 1st clamping body 2 from the Z-axis direction negative side. It is the side view which looked at the dividing mechanism 1 of the state which clamped the board | substrate W from the Y-axis direction positive side. It is a permeation | transmission top view which shows the mode at the time of the division | segmentation start of the board | substrate W by the division | segmentation mechanism 1. FIG. It is a permeation | transmission top view which shows the mode in the middle of the division | segmentation of the board | substrate W by the division | segmentation mechanism 1. FIG. It is the schematic for demonstrating one illustrative aspect of the attitude | position change mechanism 4, and rotation operation | movement of the clamping part 4a in the said aspect. It is the schematic for demonstrating one illustrative aspect of the attitude | position change mechanism 4, and rotation operation | movement of the clamping part 4a in the said aspect. FIG. 3 is a perspective view showing a main part of the cutting apparatus 100. FIG. 3 is a side view showing a main part of the cutting apparatus 100.

<Outline of the cutting mechanism>
FIG. 1 is a side view showing a schematic configuration of a cutting mechanism 1 according to an embodiment of the present invention. FIG. 2 is a top view of the cutting mechanism 1. The cutting mechanism 1 according to the embodiment of the present invention cuts and removes an edge portion of a rectangular (brittle material substrate (hereinafter simply referred to as a substrate) W. The substrate W is a glass substrate, for example, and is a liquid crystal. A large-area bonded substrate having a configuration in which liquid crystal is sealed between two rectangular glass substrates, which is a mother substrate of a panel, may be used.

  The dividing mechanism 1 forms a pair of sandwiching bodies and realizes a sandwiching operation of the substrate W by the strip-shaped first sandwiching body 2 and the second sandwiching body 3, and the first sandwiching body 2 and the second sandwiching body 3. It mainly includes a clamping portion 4a and a rotation shaft 4b when the clamping portion 4a rotates. The sandwiching portion 4a and the rotating shaft 4b constitute a posture changing mechanism 4 that integrally changes the postures of the first sandwiching body 2 and the second sandwiching body 3 in a state in which the substrate W is sandwiched.

  In the cutting mechanism 1, the first sandwiching body 2 that is roughly strip-shaped in a plan view and in a horizontal posture with the substrate W held by a holding means (not shown) in outline. It is clamped between the second clamping bodies 3. Then, when the posture changing mechanism 4 is driven in the sandwiched state, the postures of the first sandwiching body 2 and the second sandwiching body 3 are changed, whereby torque is applied to the edge portion. As a result of such torque acting, the edge portion is separated from the substrate W.

  In FIGS. 1 and 2, the extending direction of the first sandwiching body 2 and the second sandwiching body 3 in the horizontal plane (that is, the extending direction of the edge of the substrate W to be removed) is the X-axis direction. In the horizontal plane, a right-handed XYZ coordinate is attached in which the direction perpendicular to the X-axis direction is the Y-axis direction and the vertical direction is the Z-axis direction (the same applies to the following drawings). Incidentally, FIG. 1 is a side view of the dividing mechanism 1 as seen from the X axis direction positive side. Further, FIG. 2 shows a mode in which the posture changing mechanism 4 is connected to the first sandwiching body 2 and the second sandwiching body 3 at three locations, but this is merely an example, and the posture changing mechanism 4 The support mode of the first sandwiching body 2 and the second sandwiching body 3 is not limited to this.

<Details of cutting mechanism and cutting mode>
Subsequently, a detailed configuration of the cutting mechanism 1 according to the present embodiment and a cutting mode of the substrate W by the cutting mechanism 1 will be described.

  FIG. 3 is a side view of the cutting mechanism 1 as seen from the Y axis direction positive side. FIG. 4 is a plan view of the first clamping body 2 as seen from the negative side in the Z-axis direction. FIG. 5 is a side view of the dividing mechanism 1 in a state where the substrate W is sandwiched, as viewed from the Y axis direction positive side. FIG. 6 is a transmission plan view showing a state at the start of the cutting of the substrate W by the cutting mechanism 1. FIG. 7 is a transmission plan view showing a state in the middle of dividing the substrate W by the dividing mechanism 1.

  First, as shown in FIG. 1 and FIG. 6, a scribe line SL is formed in advance at a predetermined distance from the edge on the edge portion to be removed of the substrate W prior to division. Formation of the scribe line SL is realized by known scribe line forming means such as a diamond point or a cutter wheel.

  The substrate W on which the scribe line SL has been formed is viewed from the side opposite to the posture changing mechanism 4 (from the Y axis direction positive side) with the side on which the scribe line SL is formed being the upper surface side (Z axis direction positive side). ) It is inserted between the first clamping body 2 and the second clamping body 3. When the substrate W is inserted, the sandwiching portion 4a of the posture changing mechanism 4 causes the first sandwiching body 2 and the second sandwiching body 3 to move the portion between the edge of the substrate W and the formation position of the scribe line SL. Hold it. In such a clamping state, a force (pressing force) of a predetermined magnitude acts on the substrate W from each of the first clamping body 2 and the second clamping body 3.

  Note that the clamping operation in the clamping unit 4a, that is, the approach and separation of the first clamping body 2 and the second clamping body 3 may be realized by simultaneously displacing them, for example, on the positive side in the Z-axis direction Only one positioned (the first holding body 2 in the case of FIG. 1) is operable, and the other (the second holding body 3 in the case of FIG. 1) is fixed to the holding portion 4a. It may be realized by the configuration provided in. In other words, it can be said that the clamping part 4a is a part which hold | maintains the 1st clamping body 2 and the 2nd clamping body 3 so that both clearance gaps can be opened and closed.

  However, as shown in FIG. 3 and FIG. 4, or as further indicated by a broken line in FIG. 1 and FIG. 2, the first sandwiching body 2 is a surface facing the second sandwiching body 3, and X A protrusion 5 is provided at the central portion in the axial direction (longitudinal direction) and at the edge on the positive side in the Y-axis direction. The protrusion 5 is formed by an elastic body such as rubber. Further, the thickness (size in the Z-axis direction) may be uniform, but the planar shape (the shape when viewed in plan in a horizontal posture) is a positive side in the Y-axis direction rather than a rectangular shape. It is preferable that the tip end toward the side is provided in a trapezoidal shape that tapers toward a position closer to the scribe line SL.

  On the other hand, in the 2nd clamping body 3, as shown in FIG.1 and FIG.3, the resin sheet 6 is attached to the substantially whole surface facing the 1st clamping body 2. As shown in FIG.

  Therefore, strictly speaking, clamping of the substrate W in the cutting mechanism 1 according to the present embodiment is performed as shown in FIG. It is made between the resin sheet 6 provided in the.

  At this time, the force acting on the substrate W from the second sandwiching body 3 side, specifically, the pressing force acting on the substrate W from the resin sheet 6 is such that the resin sheet 6 is uniformly provided in the X-axis direction. Therefore, it is uniform in the X-axis direction. On the other hand, on the first sandwiching body 2 side, since only the protrusions 5 are in contact with the substrate W, a pressing force acts on the substrate W only from the protrusions 5. become. At this time, the pressing force acting on the substrate W from the side of the first sandwiching body 2 is concentrated on the projection 5, so that the region of the substrate W close to the tip end side of the projection 5 as shown in FIG. Stress is concentrated on the RE.

  In the dividing mechanism 1, the substrate W is divided in a state where a pressing force is applied in this manner. Specifically, in the posture changing mechanism 4, the holding portion 4a is provided so as to be rotatable around the rotation shaft 4b, and in the case shown in FIG. 1, the rotation shaft 4b in the direction indicated by the arrow AR1. Is moved around the rotation shaft 4b, and the postures of the first sandwiching body 2 and the second sandwiching body 3 are lowered from the horizontal posture toward the Y axis direction negative side where the sandwiching portion 4a exists. Change to posture. As a result, torque acts on the edge of the substrate W in the direction of the arrow AR1. Then, along with the start of the rotation operation, cracks start to extend along the scribe line SL, starting from the central portion in the longitudinal direction of the scribe line SL existing in the region RE where the stress is concentrated. At the same time, cracks extend in the thickness direction sequentially from the starting point. As a result, as shown in FIG. 7, the division of the substrate W along the scribe line SL proceeds in both the X-axis positive and negative directions.

  In addition, it is preferable that the tip portion on the positive side in the Y-axis direction of the protrusion 5 is trapezoidal as described above, because the stress acting on the region RE is further strengthened and the crack progresses along the scribe line SL. This is to make it more likely to occur.

  When the progress of the crack in the thickness direction is made in the entire range from the longitudinal center portion of the scribe line SL to both end portions, the edge of the substrate W sandwiched between the first sandwiching body 2 and the second sandwiching body 3 The part is completely separated from the substrate W.

  In the case of the division according to this aspect, the torque applied to the edge portion of the substrate W acts on the projection portion 5 so that crack extension from the scribe line SL sequentially occurs from the vicinity of the projection portion. . Therefore, the resin sheet is uniformly provided on the first sandwiching body 2 side as well as the second sandwiching body 3 without providing the protrusions 5, and evenly from the first sandwiching body 2 side over the entire edge portion. Even if only a small torque is applied so that the division is not realized when a force is applied, the substrate W can be surely divided without causing cracks or cracks. This is because, if the magnitude of the force applied during clamping is the same, the pressure at the location where the force is applied increases when the projection 5 is provided. This is because even if the force applied is small, a pressure sufficient to realize the division can be applied.

  Further, since it is only necessary to extend the cracks sequentially from the central portion, it is not necessary to apply strong energy to the entire edge portion of the substrate W at once. Even if the speed at which the portion 4a is rotated around the rotation axis 4b is slowed down, the substrate W can be surely divided without causing cracks or chipping.

  In the description so far, the formation surface of the scribe line SL is the upper surface side, the first sandwiching body 2 approaches the substrate W from above, and the second sandwiching body 3 approaches the substrate W from below. Although it is assumed that the substrate W is sandwiched, this is not an essential aspect. In the present embodiment, it is only necessary that the first sandwiching body 2 provided with the protrusions 5 is disposed on the side of the formation surface of the scribe line SL. Therefore, contrary to FIG. 1 and the like, the dividing mechanism 1 is configured to have the first sandwiching body 2 on the lower side and the second sandwiching body 3 on the upper side, and the substrate W is formed on the surface on which the scribe line SL is formed. It may be an aspect in which the cutting is performed by being inserted between the first sandwiching body 2 and the second sandwiching body 3 in a state in which is set as the lower surface side. In such a case, the rotation shaft 4b may be moved in the direction indicated by the arrow AR2 in FIG.

  In addition, in FIG. 1 etc., the resin sheet 7 is attached also to parts other than the projection part 5 which are the opposing surfaces of the 1st clamping body 2 with the 2nd clamping body 3. FIG. This is to avoid damaging the substrate W by touching the substrate W with portions other than the protrusions 5 of the first sandwiching body 2, and is not an essential aspect for the division in the above-described manner. However, when the resin sheet 7 is provided in such a manner, a material that is softer than the constituent material of the protrusion 5 is used and is provided with a thickness smaller than that of the protrusion 5. This is because even when the thickness of the protrusion 5 is reduced by elasticity and the resin sheet 7 can come into contact with the substrate W as a result, the substrate W is divided into the first sandwiching body 2 when the substrate W is divided. This is because the force applied to the substrate W from the side is concentrated on the protrusion 5.

<Attitude change mechanism>
Various configurations of the posture changing mechanism 4 responsible for changing the postures of the first sandwiching body 2 and the second sandwiching body 3 described above are conceivable. FIG. 8 and FIG. 9 are schematic diagrams for explaining one exemplary aspect of the posture changing mechanism 4 and the rotation operation of the holding portion 4a in the aspect. 8 and 9, the shapes of the first sandwiching body 2, the second sandwiching body 3, the sandwiching portion 4 a and the like are appropriately changed from those in FIG. 1 and the like. The same as described. Further, the projections 5 and the resin sheets 6 and 7 are not shown because they are irrelevant to the operation of the posture changing mechanism 4 itself.

  The posture changing mechanism 4 shown in FIG. 8A includes an operation converting unit 4c and an elevating unit 4d in addition to the clamping unit 4a and the rotating shaft 4b described above. The elevating part 4d is a component that can be raised and lowered in the vertical direction (Z-axis direction), such as an air cylinder, for example, and the operation converting part 4c is a component that connects the rotating shaft 4b and the elevating part 4d. Thus, the rotary shaft 4b and the rotary shaft (not shown) provided in the elevating part 4d are provided so as to be rotatable.

  In the posture changing mechanism 4 having such a configuration, the rotation shaft 4b moves on the arc A1 shown in FIG. 8B by changing the posture of the motion converting unit 4c as the elevating unit 4d moves in the vertical direction. It is supposed to move. That is, the motion conversion unit 4c plays a role of converting the lifting / lowering operation of the lifting / lowering unit 4d into a moving operation on the arc of the rotating shaft 4b. As described above, the movement of the rotating shaft 4b leads to the posture change of the clamping part 4a, the first clamping body 2 and the second clamping body 3 as it is.

  The division of the substrate W in the posture changing mechanism 4 changes the posture changing mechanism 4 from the state shown by the solid line in FIGS. 8A and 8B to the state shown by the one-dot chain line in FIG. 8B. It is realized by letting. That is, when the elevating part 4d is lowered as indicated by the arrow AR3 in a state where the substrate W is sandwiched between the first sandwiching body 2 and the second sandwiching body 3, the posture change of the motion converting section 4c and the rotation axis associated therewith 4b moves on the arc A1, and the first sandwiching body 2 and the second sandwiching body 3 change from a horizontal posture to a posture that becomes lower toward the side where the sandwiching portion 4a exists. Thereby, the part clamped by the 1st clamping body 2 and the 2nd clamping body 3 is parted.

  In addition, the arrangement | positioning relationship of each part of the attitude | position change mechanism 4 is not restricted to what is shown in FIG. For example, in FIG. 8B, the motion conversion unit 4c is in a horizontal posture, but this is not an essential aspect, and is not necessarily required as long as the rotation shaft 4b moves on the predetermined arc A1. The motion conversion unit 4 c does not have to take a horizontal posture within the range of the posture change between the first sandwiching body 2 and the second sandwiching body 3.

  Moreover, FIG. 9 has shown the mode in the case where the arrangement position of the 1st clamping body 2 and the 2nd clamping body 3 is reverse from the case shown in FIG. This also applies to the fact that the rotating shaft 4b can move on the arc A2 by moving the lifting unit 4d up and down. Then, the division of the substrate W in the posture changing mechanism 4 changes the posture changing mechanism 4 from the state indicated by the solid line in FIGS. 9A and 9B to the state indicated by the alternate long and short dash line in FIG. 9B. It is realized by letting. That is, when the elevating part 4d is lifted as indicated by the arrow AR4 in a state where the substrate W is sandwiched between the first sandwiching body 2 and the second sandwiching body 3, the posture change of the motion converting section 4c and the rotation axis associated therewith 4b moves on the arc A2, and the first sandwiching body 2 and the second sandwiching body 3 change from a horizontal posture to a posture that becomes higher toward the side where the sandwiching portion 4a exists. Thereby, the part clamped by the 1st clamping body 2 and the 2nd clamping body 3 is parted.

<Configuration example of the cutting processing device>
FIGS. 10 and 11 are a perspective view and a side view, respectively, showing a main part of the cutting processing apparatus 100 provided with the cutting mechanism 1 for cutting the edge of the substrate W according to the principle described above. 10 and 11 illustrate a cutting processing apparatus 100 having a cutting mechanism 1 configured such that the first holding body 2 is provided on the lower side and the second holding body 3 is provided on the upper side. In particular, FIG. 11 exemplifies a state when the posture changing mechanism 4 is in a state of performing the cutting (however, the substrate W is omitted).

  In addition to the cutting mechanism 1, the cutting apparatus 100 includes a substrate holding unit 10 that holds the substrate W, and a discharge path 11 that discharges the edge of the cut substrate W. Both the substrate holding part 10 and the discharge path 11 are provided along the extending direction of the cutting mechanism 1. In addition, the discharge path 11 is separated when the edge portion of the substrate W that has been sandwiched between the first sandwiching body 2 and the second sandwiching body 3 after being divided is released after the sandwiched state is released. The route used.

  In FIG. 10, only one set is shown for the cutting mechanism 1 and its accompanying substrate holding part 10 and discharge path 11 for convenience of illustration, but in the actual cutting processing apparatus 100, two sets (1 A pair of splitting mechanisms 1 are arranged to face each other at a predetermined interval. That is, in the separation processing apparatus 100, the two opposite edge portions of the substrate W can be simultaneously divided in a state where the two substrate holding units 10 that are separated from each other support the substrate W at two locations. It is possible. Alternatively, the separation processing apparatus 100 includes a mechanism that rotates the substrate W by 90 ° in a horizontal plane, and is configured to sequentially divide two sets of opposing edge portions that exist in the rectangular substrate W. It may be.

  Further, the dividing processing device 100 is provided with a guide plate 8 for guiding the posture changing mechanism 4 during the cutting operation in the vicinity of the longitudinal end portion of the posture changing mechanism 4 (however, in FIG. 11). (Not shown). More specifically, the guide plate 8 is provided with an arc-shaped through-hole, and two guide bodies 9 protrude from the through-hole at the end in the longitudinal direction of the posture changing mechanism 4. It is provided. When the posture changing mechanism 4 performs the dividing operation, the guide body 9 moves while drawing an arcuate locus indicated by an arrow AR5 in FIG. The through hole of the guide plate 8 is formed so as to match the locus of the guide body 9. Therefore, the operation range of the posture changing mechanism 4 at the time of dividing is limited to the movable range of the guide body 9 in the through hole. Thereby, in the dividing processing apparatus 100, a stable and reproducible dividing operation is realized.

  As described above, according to the present embodiment, torque is applied to the edge of the substrate on which the scribe line is formed in advance in a state where the edge on the edge side of the scribe line is sandwiched. In the mechanism for separating the edge portion from the substrate along the scribe line, a pair of holding members provided with a trapezoidal projection in a plan view at the contact portion with one substrate, and from the holding member side By concentrating the force acting on the substrate on the protrusions, it is possible to stably and reliably realize the division that does not cause cracks or chipping.

DESCRIPTION OF SYMBOLS 1 Dividing mechanism 2 1st clamping body 3 2nd clamping body 4 Posture change mechanism 4a Clamping part 4b Rotating shaft 4c Motion conversion part 4d Lifting part 5 Projection part 6, 7 Resin sheet 8 Guide plate 9 Guide body 10 Substrate holding part 11 Discharge path 100 Dividing device SL Scribe line W Substrate

Claims (4)

A mechanism for dividing an edge portion of a substrate on which a scribe line is formed in advance along the scribe line,
A pair of clamping bodies for clamping the edge portions;
A posture changing mechanism for changing the posture of the pair of sandwiching bodies;
With
The posture changing mechanism changes the posture of the pair of holding members formed by holding the edge portions, and the edge portions can be divided by applying torque to the edge portions. And
And,
One of the pair of sandwiching bodies has a protrusion at a central portion in the longitudinal direction along the edge,
When the pair of sandwiching bodies sandwich the end edge portion for the division, the projecting portion is brought into contact with the end edge portion.
A cutting mechanism characterized by that. The cutting mechanism according to claim 1,
When the end edge is sandwiched by the pair of sandwiching bodies, the protrusion is brought into contact with the surface of the end edge where the scribe line is provided.
A cutting mechanism characterized by that. The cutting mechanism according to claim 1 or 2,
The protrusion is provided in a trapezoidal shape that is tapered toward a position closer to the scribe line in plan view.
A cutting mechanism characterized by that. The cutting mechanism according to any one of claims 1 to 3,
In the posture changing mechanism, a holding portion that holds the pair of sandwiching bodies is rotatable around a predetermined rotation shaft, and the rotation shaft is moved by causing a predetermined lifting means to move up and down. Changing the posture of the pair of sandwiching bodies by moving along an arcuate trajectory;
A cutting mechanism characterized by that.