TW559620B - Device and method for breaking fragile material substrate - Google Patents

Device and method for breaking fragile material substrate Download PDF

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Publication number
TW559620B
TW559620B TW091114128A TW91114128A TW559620B TW 559620 B TW559620 B TW 559620B TW 091114128 A TW091114128 A TW 091114128A TW 91114128 A TW91114128 A TW 91114128A TW 559620 B TW559620 B TW 559620B
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Taiwan
Prior art keywords
substrate
product
brittle material
material substrate
dividing
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TW091114128A
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Chinese (zh)
Inventor
Haruo Wakayama
Noboru Hasaka
Masahiro Fujii
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Mitsuboshi Diamond Ind Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A breaking device for a fragile material substrate is provided, in which a first product table (13) and a second product table (14) are disposed on a sliding table (11) and a tilting table (12), respectively, so that the edge parts thereof can provide specific angles, a substrate (G) having scribed both faces is put on the tables and fixedly pressed by a first clamp bar (15a) and a second clamp bar (16a), and a shearing force and a tension are applied to the substrate (G) at scribe lines (S) by the clamp bar as a pressing point when the second product table (14) is rotated, whereby, since the clamp bar with less clearance acts as a break point, the substrate (G) can be laterally divided into two parts.

Description

559620 A7 _ B7__ 五、發明說明(丨) 【發明之詳細說明】 【發明所屬之技術領域】 本發明係有關用於分割玻璃、半導體晶圓、陶瓷等脆 性材料基板之脆性材料基板之分割裝置及其分割方法。 【背景技術】 圖1係表示使用玻璃切割刀輪2對玻璃板1進行劃線 時之狀態。藉由該劃線,玻璃板1表面上形成刻線S。圖 中,把圓形區域內之截面放大表示於下面的圖。B代表利 用該劃線所形成之垂直方向裂縫之深度。 圖2係表示一般所使用之習知分割裝置之槪略構成。 在該分割裝置中,把內面上形成有刻線S之玻璃板1,以 中間隔著墊子Μ之方式安置於製品台3上。在玻璃板1之 上方有一分割桿4。該分割桿4係在桿狀金屬材料4a之下 面接合著截面呈V字狀之硬質橡膠4b而構成者,利用未 圖示之驅動機構而保持與玻璃板1平行,並且可上下運動 自如。又,把分割桿4硬質橡膠4b之下端部,以透過玻璃 板1而和刻線S吻合的方式從玻璃板之上方予以緊壓。如 此一來,玻璃板1會在墊子Μ上稍微彎曲,而使垂直方向 之裂縫到達玻璃板表面,玻璃板1就沿著刻線S分割開來 〇 圖3,係表示日本專利特開平4-280828號中所揭示之 另一分割法。分成兩個的製品台3a、3b係彼此隔一間隔來 設置而成。玻璃板1,係以其上表面所形成之刻線S位於 3 幸、紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 559620 A7 __B7______ 五、發明說明(,) 間隔部之方式跨在兩製品台3a、3b上並被吸引固定著。又 ,讓一方之製品台3a沿著和下方的間隔平行之旋轉中心軸 〇往箭頭方向稍微旋轉,藉以使玻璃板1彎曲而分割開來 。使兩製品台3a、3b同時旋轉,也可使玻璃板1分割開來 。又,在使一方之製品台3a旋轉的同時,自製品台3b放 開,也能以切割面不產生損傷的方式分割開來。 可是,如前述圖1之下圖所示,刻線的深度並均勻, 如Da、Db有深的地方存在。把與該Da、Db對應之劃線處 以Sa、Sb來表示。當以上述方法對該玻璃板1進行分割時 ,即使對玻璃板1加上均勻的分割力,玻璃板1之分割也 不會均勻地進行,玻璃板之分割會在以Sa、Sb所表示之地 方先完成。亦即,在該位置,垂直裂縫會到達玻璃板1之 下面.,然後,玻璃板1之分割會以Sa、Sb處爲起點往劃線 方向進行。 因此,在習知分割方法中,玻璃板1之分割會在刻線 中有複數之地方均成爲起點下進行,故分割面會變成屏風 狀且彎曲,而有產品價値降低之缺點。 又,爲了能防止劃線時產生塵埃,也正檢討是否使用 雷射光束來進行劃線。在雷射劃線中,把雷射光束照射在 玻璃板上並加以移動,利用冷媒之點冷卻會跟著雷射光束 來進行。如此藉著利用玻璃板之熱變形,來在玻璃板形成 細的刻線。該刻線因細而肉眼看不出來,故該劃線法也稱 爲盲劃線(blmd-scnbe)。然而,對於經盲劃線過之玻璃板而 言,當利用習知分割裝置來進行分割時,因由於盲劃線所 4 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) --------訂---------線泰 559620 A7 _ B7____ 五、發明說明(4 ) 產生之裂縫深度淺,故需要大的分割力。因此’有裝置變 大而且完全不能分割開的問題存在。 (請先閱讀背面之注意事項再填寫本頁) 【發明之揭示】 本發明,係有鑑於上述習知的問題點所開發而成者, 其目的是實現一種脆性材料基板之分割裝置及其方法,其 對於種種形狀之脆性材料基板,可減少加在基板上之分割 力而獲得均勻的分割面。 本發明之分割裝置之特徵在於:係具有第1、第2製 品台,將至少有1面形成刻線之脆性材料基板載置成,前 述刻線位於兩製品台之間隔中;第1製品夾單元,當把與 前述第2製品台對向之前述第1製品台之邊緣當作第1邊 緣,與前述第1製品台對向之前述第2製品台之邊緣當作 第2邊緣時,對前述脆性材料基板之位於前述第1邊緣的 部分進行緊壓及固定;第2製品夾單元,對前述脆性材料 基板之位於前述第2邊緣的部分進行緊壓及固定;滑動機 構,對前述脆性材料基板之刻線施加其直角方向之預壓, 使前述第1製品台及第1製品夾單元一起從前述刻線後退 :傾動機構,把與前述脆性材料基板之刻線平行之傾動軸 當作旋轉軸,可使前述第2製品台及第2製品夾單元一起 轉動;及轉動控制部,控制前述傾動機構來使前述第2製 品台及第2製品夾單元轉動;前述第1製品台及第2製品 台係配置成兩製品台之對向邊緣不平行;前述第2製品台 之傾動軸係從前述脆性材料基板之刻線來看會在基板的厚 度範圍內。 5 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ' " 559620 A7 — ____Β7___ 五、發明說明(次) 又,本發明之分割裝置之特徵在於:係具有第丨、第2 製品台,將至少有1面形成刻線之脆性材料基板載置成, 前述刻線位於兩製品台之間隔中;第1製品夾單元,當把 與前述第2製品台對向之前述第1製品台之邊緣當作第1 邊緣,與前述第1製品台對向之前述第2製品台之邊緣當 作第2邊緣時,對前述脆性材料基板之位於前述第1邊緣 的部分進行緊壓及固定;第2製品夾單元,對前述脆性材 料基板之位於前述第2邊緣的部分進行緊壓及固定;第1 傾動機構,把與前述脆性材料基板之刻線平行之傾動軸當 作旋轉軸,可使前述第1製品台及第1製品夾單元一起轉 動;第2傾動機構,把與前述脆性材料基板之刻線平行之 傾動軸當作旋轉軸,可使前述第2製品台及第2製品夾單 元一起轉動;及轉動控制部,控制前述第1及第2傾動機 構來使前述第1製品台和第1製品夾單元以及第2製品台 和第2製品夾單元轉動;前述第1製品台及第2製品台係 配置成兩製品台之對向邊緣不平行;前述第1製品台之傾 動軸係位於前述脆性材料基板之刻線近旁之基板上側,而 前述第2製品台之傾動軸則位於前述脆性材料基板之刻線 近旁之基板下側。 又,本發明之分割裝置,係於分成2個之製品台固定 上面已劃線之脆性材料基板,使至少一方之製品台旋轉, 藉以來分割前述脆性材料基板;其特徵在於:讓前述製品 台之旋轉中心軸具有相對於前述脆性材料基板之劃線方向 的既定角度。 6 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ' (請先閱讀背面之注意事項再填寫本頁) tr--------- A7 559620 五、發明說明(< ) 又,本發明之分割裝置,係於分成2個之製品台固定 上面已劃線之脆性材料基板,使至少一方之製品台旋轉, 藉以來分割前述脆性材料基板;其特徵在於:前述至少一 方之製品台,係具備6支伸縮自如的臂,至少有一部分不 平行;萬向接頭,設於前述各臂之兩端,並將前述製品台 和前述臂之一端以自由的角度予以連結;及控制部,控制 前述各臂之長度,以控制前述製品台之一方之位置。 其次,本發明之脆性材料基板之分割方法之特徵在於 :對前述製品台透過既定間隔進行位置控制成同一平面, 將預先形成有劃線之脆性材料基板,配合前述製品台間之 間隔而固定在前述製品台上;使前述一方之製品台,沿著 和形成於前述脆性材料基板之刻線不平行而且和前述刻線 不在同一平面上之旋轉軸旋轉,藉以來將前述脆性材料基 板沿著刻線分割開。 又,本發明之脆性材料基板之分割方法,係將貼合2 塊脆性材料基板而成之母貼合基板分割開,並從這裡獲得 複數塊小的貼合基板;其特徵在於具有以下步驟:(1)使用 第1劃線裝置於前述母貼合基板一方基板表面之既定位置 形成刻線S1 ; (2)使用第2劃線裝置,於前述母貼合基板他 方基板表面並且往和前述刻線S1相同之方向形成刻線S2 :及(3)將兩面形成有刻線SI、S2之前述母貼合基板固定 於分割裝置之兩個製品台,使前述製品台之至少一方轉動 ,藉以來對前述刻線SI、S2施加拉應力或剪應力,而將前 述母貼合基板分割成複數塊。 7 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) --------訂---------線* A7 559620 五、發明說明(k ) 又’本發明之脆性材料基板之分割方法,係將刻線未 形成之第1脆性材料基板和預先形成有刻線S2之第2脆性 材料基板貼合而成之母貼合基板分割開,並從這裡獲得複 數塊小的貼合基板;其特徵在於具有下列步驟:(1)使用劃 線裝置,於前述第1脆性材料基板之表面並且往和前述刻 線S2相同之方向形成刻線S1 ;及(2)將兩面形成有刻線S1、 S2之前述母貼合基板固定於分割裝置之兩個製品台,使前 述製品台之至少一方轉動,藉以來對前述刻線SI、S2施加 拉應力或剪應力,而將前述母貼合基板分割成複數塊。 又,本發明之脆性材料基板之分割方法,係將刻線未 形成之第1脆性材料基板和第2脆性材料基板貼合而成之 母貼合基板分割開,並從這裡獲得複數塊小的貼合基板; 其特徵在於具有下列步驟:(1)使用兩面劃線裝置,於前述 第1及第2脆性材料基板之表面同時形成刻線SI、S2 ;及 (2)將兩面形成有刻線SI、S2之前述母貼合基板固定於分割 裝置之兩個製品台,使前述製品台之至少一方轉動,藉以 來對前述刻線SI、S2施加拉應力或剪應力,而將前述母貼 合基板分割成複數塊。 【發明之最佳實施例】 (實施例1) 參閱圖式就本發明實施例1之分割裝置加以說明。圖 4係實施例1之分割裝置10全體構成之外觀立體圖。該分 割裝置10稱爲單傾動分割機。作爲分割對象之基板G係 玻璃等之脆性材料基板。 8 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) " ------------------訂---------線^^" (請先閱讀背面之注意事項再填寫本頁) 559620 A7 ___B7______ 五、發明說明(^]) 在此爲說明方便,而使用空間座標(X,y,Z),設和分割 裝置10之設置地面平行的製品台基準面爲U,y,z。),和設 置地面成鉛直的方向爲z軸,基板G之分割方向爲y軸。 分割裝置10係具有可在- X軸方向滑動之滑動台11、及能 以和y軸平行的旋轉軸爲中心傾動且可在X軸方向滑動調 整之傾動台12。 圖5係表示分割裝置10之左側單元10A和右側單元 10B在分開的狀態之立體圖。當整個分割裝置10是安裝在 圖4之底座17時,左側單元10A係指在如圖4所示之基板 G之刻線S之左側(-X軸方向)所設置之機構部,右側單元 10B則指在基板G之刻線S之右側(+ x軸方向)所設置之機 構部。 又,爲將待切斷基板載置並加以保持,將第1製品台 13固定於滑動台11,將第2製品台14固定於傾動台12 ° 又,在第1製品台13之上部安裝第1製品夾單元15 ’在 第2製品台14之上部安裝第2製品夾單元16。使基板G 之刻線S和y軸平行,以刻線S爲中心將基板之一 x軸側( 左側)之區域稱爲基板左部GL,將+ x軸側(右側)之區域稱 爲基板右部GR。第1製品夾單元15係猛烈地緊壓基板左 部GL之左端部而固定基板,第2製品夾單元16則猛烈地 緊壓基板右部GR之右端部而固定基板。 在左側單元10A設有滑動機構11a。滑動機構1 係 往-X軸方向彈壓滑動台11,並設有施加彈壓力之彈性構 件,例如空壓缸、彈簧等。滑動機構11a上還有限制滑動 9__ 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) --------訂---------線* 559620 A7 _____B7__ 五、發明說明(3 ) 範圍之限位器、限制滑動速度之阻尼器(damper)等(未圖示)。 右側單元10B係利用作爲支柱之一對水平保持塊上部 18及一對水平保持塊下部19而受到保持。水平保持塊下 部19係固定於底座17,水平保持塊上部18則以可旋動自 如的方式保持傾動台12。在水平保持塊上部18及水平保 持塊下部19之間設有未圖示之滑動單元,可將水平保持塊 上部18往X軸方向滑動調整。又,在+y軸及-y軸側之水 平保持塊上部18設有傾動軸18a,傾動台12、第2製品台 14、及第2製品夾單元16被保持成能以傾動軸18a爲旋動 軸傾斜。傾動軸18a係例如在水平保持塊上部18設置軸承 殻,利用被壓入該軸承殼之滾珠軸承而受到保持。在此, 將水平保持塊上部18及傾動軸18a稱爲傾動機構。 第1製品夾單元15係用於固定基板左部GL,並使剪 應力及彎曲應力集中於基板之刻線。在第1製品夾單元15 設有緊壓基板G刻線S附近之第1夾桿15a。該第1夾桿 15a之尖端係位於第1製品台13之右側邊緣,並可往z軸 方向微動。第2製品夾單元16係同樣地用於固定基板右部 GR,並使剪應力及彎曲應力集中於基板之刻線。在第2製 品夾單元16設有緊壓基板G刻線S附近之第2夾桿16a。 該第2夾桿16a之尖端係位於第2製品台14之左側邊緣, 並可往z軸方向微動。 圖6係表示第1和第2製品台13、14之位置關係之俯 視圖。含有第1夾桿15a之第1製品夾單元15之主軸係傾 斜安裝成+y軸側僅張開角度- α。又,含有第2夾桿16a 10 - ----------------- -- 本紙張尺度適用中國國家標準(CNS)A4規格(210 χ 297公釐) ----------·Λ----------訂---------線 (請先閱讀背面之注意事項再填寫本頁) A7 559620 五、發明說明(1 ) 之第2製品夾單元16之主軸係傾斜安裝成+y軸側僅張開 角度+α。又,在這些製品台13、14間形成間隔。 如圖6所示,第1製品台13,,係在滑動台11上以旋 動軸13a爲中心在(X,y)平面內往逆時鐘方向僅可旋動調整 微小角。第2製品台14,係在傾動台12上以旋動軸14a爲 中心在(X,y)平面內往順時鐘方向僅可旋動調整微小角。在 第1製品台13之4個角落設有從旋動軸13a來看在切線方 向成爲長徑之螺孔13b〜13e。同樣地,在第2製品台14之 4個角落設有從旋動軸14a來看在切線方向成爲長徑之螺 孔14b〜14e。因此,使第1製品台13以旋動軸13a爲中心 僅旋動角度- α,在此位置將螺孔13b〜13e之螺栓鎖在滑 動台11上。如此一來,第1製品台13就和第1夾桿15a 一起從以圖6中2點鏈線所示之位置移到以實線所示之位 置並可固定於此。第2製品台14也和第1製品台13相同 。藉由這樣的角度調整,可將第1夾桿15a和第2夾桿16a 之開口角設定爲2α。 作爲基板G的保持方法,藉由真空吸附、其他的手段 可將基板固定於製品台。當基板爲玻璃且其表面形成有樹 脂膜時,也可利用靜電吸附來固定基板。 就傾動台12之傾動機構來說明。如圖4及圖5所示, 水平保持塊上部18之傾動軸18,係以本身爲旋轉軸使除 了水平保持塊下部19之外之右側單元10Β整體可往順時鐘 方向或逆時鐘方向旋動。圖7係表示傾動軸i8a安裝位置 之分割裝置主要部剖面圖。爲透過傾動機構使傾動台12旋 11 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) " 一 (請先閱讀背面之注意事項再填寫本頁) f—— 訂---------線赢 A7 559620 五、發明說明(L。) 動’而設有旋動控制部20。旋動控制部20係也可以是使 用馬達之旋轉力或流體壓缸來使傾動台12僅旋動既定角度 而構成者’也可以是透過臂、連桿等以手動使傾動台12旋 動而構成者。又,傾動台12係開始旋動的同時,也會往+ X方向移動。 在分割裝置之起始設定中,第1製品台13及第2製品 台14被定位成相對於1塊基板G具有同一個載置面。傾動 軸18a之高度係調整至從載置於製品台之基板G之上表面 及下表面來看傾動軸18a均會在中央的位置。 設基板G之厚度爲2d。。第1製品台13之載置面係成 爲(X,y,-do) ’傾動軸18a之位置則成爲(〇, y,〇)。傾動軸 18a之位置係可按照基板G之厚度、材料等來調整。又, 設第.1製品台13右緣及第2製品台14左邊緣之間隙爲2g ,則使第1夾桿15a之對基板G之緊壓位置和第2夾桿 16a之對基板G之緊壓位置的間隙爲圖7所示之程度,並 且希望最接近的部分之緊壓位置之間隔大約和2g相同。還 有,最好是傾動軸18a和基板G之刻線平行且位於基板之 厚度範圍內。 其次,就具有這種機構之分割裝置的動作來說明。假 設基板G爲用於液晶面板之貼合玻璃,其如圖8(a)所示, 係其具備,有各種電極形成於內側之上基板Gl(0.7mm厚) 及下基板G(0.7mm厚),並且在兩者間隔(0.1mm)中有液晶 封入著而構成。在此情形之基板之厚度2d。爲1.50mm。又 ,如圖8(a)所示,在上基板G1上表面及下基板G2下表面 12 本、紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱Ί ----------Λ----------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 559620 A7 __B7___ 五、發明說明(u) ,於從(X,y)平面來看同一位置處分別預先形成刻線SI、S2 。刻線SI、S2之形成方法係和習知例相同,剪應力或拉應 力高的部分將成爲玻璃基板之分割點。 圖9係以刻線S爲中心之分割裝置之局部放大剖面圖 。又,圖10係使用2點鏈線來表示之以刻線S爲中心之分 割裝置之主要部俯視圖。在此使用實線來代表基板G之分 割後之位置。設傾動軸18a之位置(X,y,z)爲(〇, y,〇)。如圖 10所示在分割後之基板左部GL中,設圖8之刻線S2之+ y軸側之終點爲PL,而設一y軸側之終點則爲ql。又,設 基板左部GL和第1製品台13右緣接觸之線之+ y軸側之 終點爲PL’ ’而一y軸側之終點則爲QL’。又,在分割後之 基板右部GR中,設基板右部GR和第2製品台14左緣接 觸之線之+ y軸側之終點爲PR’,而-y軸側之終點則爲 QR’。又,在基板G被分割切斷之前,PR和PL —致,QR 和QL —致。 如圖9(a)所不’當使第2製品台14往逆時鐘方向僅傾 斜角度0時,點PR’之位置從(xi,yi,Zl)移動到(X2, y2, Z2)。 在此,各座標値如下所示。 X1= g2 yi= yi zi= —do X2= d〇 sin Θ 4- g2C〇s Θ y2= yi Z2= d〇 (1 - cos 0 ) + g2 sin 0 — d〇 13 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公楚) --— (請先閱讀背面之注意事項再填寫本頁) --------訂---------. 559620 A7 _____B7_ 五、發明說明( 藉由第2夾桿16a之緊壓力,設基板右部GR之點PR’ (χ2, y2, Z2)之部分爲相對於第2製品台14之不動點,則剪力 與張力會從前述不動點來對位於基板右部GR之點PR之分 割部分產生作用。 這樣的剪力與張力也同樣地作用於圖9(b)之點QR。然 而,從點PR’所見之刻線S2之位置與從QR’所見之刻線S2 之位置如圖9及圖10所示是不同的,相較於+ y軸之一邊( 對面側),在-y軸之一邊(這一側)之剪應力與拉應力較大 。即使玻璃素材之楊氏係數在兩者的部分均相同,相對於 不旋轉移動的基板左部GL之基板右部GR —端支撐之最前 端部,係圖9(b)的場合比圖9(a)的場合爲短。因此,如圖 9(b)所示之一端支撐之最前端部比圖9(a)的場合,剪應力較 難緩和。因此,點QR、QL會成爲分割點而使下基板G2 分割開來。其此,當使第2製品台14往順時鐘方向傾動時 ,和逆時鐘方向傾動之場合同樣地,剪應力與拉應力會作 用於上基板G1之刻線S1,而使上基板G1分割開來。在基 板G切斷時,藉由滑動機構11a,_x軸方向之彈壓力會作 用於基板左部GL,又,傾動台12 —開始旋動的同時就往 + x軸方向移動,並且右緣部(基板左部GL之切斷面)往-X軸方向後退而不會接觸基板右部GR之左緣部。因此,玻 璃基板之分割面不會出現缺陷而獲得平滑的分割面。 基板G分割後,點PR之位置從(X3,y3,Z3)移動到(X4, ys z〇。在此,各座標値如下所示。 X3= 0 14 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ----------^----------訂---------線^^ (請先閱讀背面之注意事項再填寫本頁) 559620 ____B7__ 五、發明說明(l >)) y3= Υ3 Ζ3= 一 do Χ4= d〇sin0 y4= y3 Z4= d〇 (1 — cos 0 ) — d〇 若計算這場合之水平移動量h- 的話,當3°時 ,結果爲0.039mm。 圖8(b)係表示基板右部GR往逆時鐘方向旋動之場合 ,而圖8(c)則是表示基板右部GR往順時鐘方向旋動之場 合之基板變形縱剖面圖及切斷面後退之樣子。在刻線S被 分割成左右之基板,係藉著使第1夾桿15a、第2夾桿16a 離開基板,而能將基板GR、GL從製品台上卸下來。要將 X軸方向呈帶狀之1塊基板分割成許多個時,在基板G之 既定處分別劃上刻線。然後,將基板G往X方向搬運既定 節距,設定製品夾單元,並使傾動台12傾斜。藉著反覆進 行這些操作,即可從1塊母基板製造出複數塊基板。 (實施例2) 其次,參閱圖式來說明本發明實施例2之分割裝置。 圖11係表示實施例2分割裝置30全體構成之外觀立體圖 。該分割裝置30係稱爲兩傾動分割機。在此爲方便說明, 假設與分割裝置30設置床面平行之台基準面爲(x,y),與設 置床面垂直之方向爲ζ·軸,基板之分割方向爲y軸。該分 割裝置30係具有與y軸平行之旋轉軸,並具有可傾動之第 1、2傾動台31、32。 15 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公楚) (請先閱讀背面之注意事項再填寫本頁) --------訂---------線* A7 559620 五、發明說明(V火) 圖12係表示分割裝置30之左側單元3〇A與右側單元 30B分離狀態之立體圖。分割裝置3〇全體係透過保持塊% 、39而安裝於如圖11所示之基座37。第丨製品台33係固 定於第1傾動台31,第2製品台34則固定於第2傾動台 32。又,與實施例1相同,在第1製品台33上部安裝第1 製品夾單元35,在第2製品台34上部則安裝第2製品夾 單元36。這些夾單元之功能也與實施例1相同,故省略機 構之說明。 第1傾動台31、第1製品台33及第1製品夾單元35 係保持於作爲支柱之第1保持塊38。第2傾動台32、第2 製品台34及第2製品夾單兀36係保持於作爲支柱之第2 保持塊39。如圖11所示,第2保持塊39之支柱間隔係比 第1.保持塊38之支柱間隔爲寬,當在正常的位置(動作位 置),左側單元30A與右側單元30B安裝於基座37之後, 所有的支柱大致在對齊y軸上之位置。 假設第1保持塊38之傾動軸爲38a,而第2保持塊39 之傾動軸爲39a,則如圖13所示,傾動軸38a與傾動軸 39a係假設爲從分割裝置之基準位置(χοΜ,ζ。)來看,在z軸 方向大致呈對稱而且位於刻線SI、S2之近旁。又,基準位 置以。,7。,2。)係假設爲與實施例1相同,位於基板〇之刻線 SI、S2之中間位置(0,y,0)。若設基板G厚度之中心位置爲 z=0,則傾動軸38a在z軸上之位置山係以OmmS 20mm爲佳,傾動軸39a之位置一 cb則以一 20mm€ —dd Omm爲佳。 16 本、紙張尺度適用中國國家標準(CNS)A4規格(210 χ 297公釐) ----------^----------訂---------線 (請先閱讀背面之注意事項再填寫本頁) A7 559620 五、發明說明( 第1夾桿35a與第2夾桿36a之安裝位置係與實施例ι 之情形相同。第1保持臂38b係以第1傾動軸38a爲中心 旋動自如,將第1傾動台31保持於任意的角度。在此,第 1保持臂38b及第1傾動軸38a稱爲第1傾動機構。同樣地 ,第2保持臂39b係以第2傾動軸39a爲中心旋動自如, 將第2傾動台32保持於任意的角度。在此,第2保持臂 39b及第2傾動軸39a稱爲第2傾動機構。 旋動控制部40係使用馬達之旋轉力或流體壓缸來使第 1傾動台31及第2傾動台32旋動既定角度者也可以,透 過臂、連桿以手動使傾動台31、32旋動者也可以。第1保 持臂38b及第2保持臂39b係在基板G分割前,藉由旋動 控制部40之起始設定來保持第1傾動台31及第2傾動台 32與(x,y)面平行,亦即保持水平。 在此,含有第1夾桿35a之第1製品夾單元35之主軸 係傾斜安裝成其+ y軸側張開- α角,含有第2夾桿36a之 第2製品夾單元36之主軸係傾斜安裝成其+ y軸側張開+ α角。 假設基板G之厚度爲2d〇,在此也舉例說明要切斷用 於液晶面板之貼合玻璃基板之情形。假設第1製品台33之 載置面爲(x,y,一d〇),傾動軸38a之位置則如圖13所示爲 (〇,y,+ d2)。該位置也可按基板之厚度、材料等之不同而調 整。還有,傾動軸38a、39a係最好是位於以基板之中心位 置爲基準互爲對稱之位置上,亦即ch=d2。 又,假設第1製品台33之右緣與第2製品台34之左 17 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) "" (請先閱讀背面之注意事項再填寫本頁) --------訂--------·線一 559620 A7 B7 五、發明說明(α ) 緣之間隙爲2g,則第1夾桿35a之對基板G之緊壓位置與 第2夾桿36a之對基板G之緊壓位置係如圖13所示接近各 邊緣,最接近之部分的緊壓位置之間隔最好是大致和2g相 同。 就具有這種機構之分割裝置30之動作加以說明。圖 14係以刻線S爲中心之分割裝置之局部放大剖面圖。又, 使用圖10作爲以刻線S爲中心之分割裝置之主要部俯視圖 。如前所述,第1傾動軸38a之位置係成爲(0,y,cL·),第2 傾動軸39a之位置則成爲(0,y,一 d2)。 圖14(a)係圖10之PR點及PL點附近之剖面圖。圖 14(b)係圖10之QR點及QL點附近之剖面圖。在此,第1 製品台33與第2製品台34之緣間隔爲221仏<22)。如圖 14所示,最初先使第2製品台34往順時鐘方向傾斜0角 ,其次再使第1製品台33往順時鐘方向傾斜6>角。與實施 例1同樣地假設基板右部GR之對第2製品台34之緊壓點 爲PR’。該點PR’係可視爲當沿刻線S分割基板G時,施 加剪應力之施力點。 現在考慮最初先使第2製品台34往順時鐘方向旋動Θ 角後之情形。PR’之位置係從(x5,y5,Z5)移動到(X6,y6,Z6)。在此 ,各座標値係如下所示。 X5= g2 y5= y5 Z5= — d〇 X6= (d2—d〇)sin0 +g2C〇n0 18 拿、紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公f) 一 ----------^--------訂---------線^^* (請先閱讀背面之注意事項再填寫本頁) 559620 A7 -------B7____ 五、發明說明(Ά ) Y6= ys Z6= — (d2—d〇)(l — con (9 ) — g2sin (9 — do 如此一來,基板右部GR之(X6,y6,Z6)之部分成爲相對於 第2製品台34之不動點,剪應力及拉張力會從前述不動點 作用於位在基板右部GR之點PR的分割部分。 這種剪應力及拉張力也對如圖14(b)所示之點QR。然 而,從點PR,所見之到刻線S2之距離,與從點QR’所見之 到刻線S2之距離係如圖10所示不同,相較於PR,QR之 剪應力及拉張應力較大。即使玻璃素材之楊氏係數在兩者 之部分相同,對基板左部GL之基板右部GR之懸臂支撐之 前端部之剪應力、拉應力、彎曲應力均比QR之値爲小。 這是因爲該懸臂支撐之前端長如圖14(a)所示是長的’故由 於彈性變形而緩和應力。因此,應力高的點QR成爲分割 點,上基板G1就被分割開。 其次,當使第1製品台33往順時鐘方向傾動Θ角時’ 剪應力及拉應力會施加於刻線S2,而下基板就被分割開。 在此情形,在基板左部GL之PL點及QL點’與前述同樣 的動作也會產生。藉由兩製品台之旋動,以刻線S爲中心 ,拉應力會向-X軸方向及+ x軸方向作用,而且剪應力會 向一 z軸方向及+ z軸方向作用,故能容易地分割基板G。 分割時,基板左部GL及基板右部GR互相分開。在此情形 ,作爲分割面之右緣部也不會接觸基板右部GR之左緣部 。因此,玻璃基板之分割面不會出現傷痕而可獲得光滑的 分割面。 19 衣紙張尺度適用中國國家標準(CNS)A4規格(21〇 x 297公楚1 " (請先閱讀背面之注意事項再填寫本頁) --------訂---------線赢 559620 A7 ___B7___ 五、發明說明(1¾ ) 若計算點PR之水平移動量,則利用(d〇+d〇Sm0,在 d2=5.0mm ’ d〇=0.75mm ’ 0 =3 之情形’其値爲 0.300mm, 這較實施例1之水平移動量0.039mm還大許多。又,若計 算點PR之鉛直方向之移動量,則利用(d〇+d2)(l —con6»), 若把上述數値代入,則求得垂直移動量爲〇.〇〇79mm。這個 値會影響刻線S之剪應力。 被刻線S分割成左右之基板,係藉由解除第1夾桿 35a、第2夾桿36a之緊壓,而能從製品台上卸下。又,使 第1傾動台31及第2傾動台32交替地傾斜相同的角度, 然而,傾斜角度在各傾動台也可不同,不論使哪一個傾動 台先傾動均不影嚮基板G之分割特性。 如上所述,不論使用哪一個分割裝置,基板G之眼前 之端面側均成爲分割之開始點,分割會從眼前往裏面依序 進展下去。在該分割裝置上,因基板之分割之開始點爲1 點,故可使作用於基板之力之大小較習知分割法還低許多 。又,分割端面完全作好,使得在習知技術所述之分割端 面不佳之情形不發生。本發明之裝置上,可容易地變更各 保持塊之安裝位置、高度等,並可隨意地設定製品台之旋 轉量、張開角2α等,故設計之自由度變高。本實施例中 ,已說明用於液晶面板之貼合玻璃基板上所形成之刻線S1 、S2在從(x,y)平面看爲同一位置的情形,而即使SI、S2 之位置由於有液晶面板之端子要形成而分開數mm,也可 使用本分割裝置來進行分割,不會有困難。 又,本實施例之分割裝置係不僅可分割貼合玻璃,當 20 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) ----------^----------訂---------線^^· (請先閱讀背面之注意事項再填寫本頁) 559620 A7 ___B7 _____ 五、發明說明(^ ) 然可分割單片之玻璃,也可分割半導體晶圓、陶瓷基板等 脆性材料基板。尤其在像液晶面板之貼合玻璃基板之情形 ,利用交替的分割動作即可將上下玻璃板交替地分割開, 同時,也不需要翻轉基板之過程,故可大幅提高作業效率 。本發明之分割裝置也可應用於,使用雷射等加熱機構來 加熱脆性材料基板並利用產生於脆性材料基板之熱變形以 分割形成有刻線之脆性材料基板。 (實施例3) 其次說明本發明實施例3之分割裝置。圖15係顯示本 實施例之分割裝置50之一部分的立體圖。本實施例中,分 成2個之製品台51a、51b係設置成相隔間隔Z,一方之製 品台51b係被固定著。在製品台51a之內面,固定有萬向 接頭52、53、54,透過這些接頭又設有3個支撐柱56、57 、58。支撐柱57、58係沿著製品台51a之間隔Z之端面設 置,支撐柱56則設於支撐柱57之後方。在各支撐柱56、 57、58之下部分別安裝有萬向接頭59、60、61。萬向接頭 59、61之另一端係固定於台座62。支撐柱57係較其他的 支撐柱爲短。萬向接頭60之另一端係透過伸縮臂63而固 定於台座62。該伸縮臂63係內部藏有線性馬達等,藉由 外部來的控制訊號會在長邊方向伸縮之臂。 在分割作爲脆性材料基板之一的玻璃板Η時,如表示 俯視圖之圖16所示,將玻璃板配置於製品台。此時,以形 成於上表面之刻線S位於間隔部之方式,將玻璃板Η跨在 製品台51a、51b上並予以吸附而固定。固定好玻璃板Η之 21 ----------^--------^---------^ (請先閱讀背面之注意事項再填寫本頁) 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 559620 A7 ______ Β7 _ 五、發明說明( 後,使伸縮臂63伸長或壓縮。 圖Π係沒有玻璃板時表示使伸縮臂63伸長後之狀態 的說明圖。製品台51a係以一點鏈線所示之連結萬向接頭 59及61的線爲中心軸L1旋轉,該旋轉中心軸之方向並不 平行於劃線方向而是具有某個角度。亦即,要設定成玻璃 板之刻線S與製品台51a之旋轉之中心軸li不平行。如此 一來’如圖中各前頭所不一樣’越住圖中眼前,製品台 51a之間隔Z之端面上之移動量就越大。又,前述角度越 大,該傾向就越大。 結果,玻璃板Η之眼前之端面側會成爲玻璃板之分割 開始點,玻璃板Η之分割就從眼前往裏面依序進展下去。 在這分割法中,因分割之開始點爲1點,故作用於玻璃板 之分割力之大小係較習知分割法還低許多。又,分割端面 ,亦即分割面係完全作好,使得在習知技術所述之玻璃板 Η分割端面不佳的情形不會發生。又,利用前述雷射劃線 裝置也可同樣地將劃好線之玻璃板分割開。在這種分割方 式中,容易地變更各支撐柱56、57、58之安裝位置、高度 等,並可隨意地設定製品台51a之旋轉量、旋轉方向等, 故設計之自由度高。 還有,在本實施例中,他方之製品台51b雖是固定著 ,但也可使該製品台51b具備同樣的旋轉機構。在這情形 ,必須使製品台51b之旋轉方向相反。 圖18係表示液晶母玻璃基板之放大截面。液晶母玻璃 基板70係如眾所周知,在一方之母玻璃基板71之周緣部 22 拿、紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐〉 ----------J--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 559620 A7 ___B7__ 五、發明說明(λ ) (請先閱讀背面之注意事項再填寫本頁) 等塗佈上接著劑72,再以隔著間隔物之方式疊上另一母玻 璃基板74,而使母玻璃基板彼此固定住而構成。又,從設 於接著劑72層之小孔將液晶75注入兩母玻璃基板間之間 隔部,而能獲得未圖示之液晶面板。 爲了使用既定尺寸之母玻璃基板來形成液晶母玻璃基 板70並分離爲複數個液晶面板,故過去一直使用,在上側 之母玻璃基板74之上表面要形成刻線S1而下側之母玻璃 基板71已經形成刻線S2之東西。在習知之分割法中,當 分割液晶母玻璃基板70時,將一方之母玻璃基板分割後, 將表裏翻轉後才分割他方之母玻璃基板。 相對於此,在使用本實施例之分割裝置之情形,圖18 之液晶母玻璃基板70在組裝完成前,會預先在母玻璃基板 74之上表面及母玻璃基板71之上表面形成刻線,利用1 次製品台之旋動動作即可將上下母玻璃基板同時分割開。 因此,也不需要母玻璃基板之翻轉過程,而能大幅提高作 業效率。 (實施例4) 其次說明本發明實施例4之分割裝置。圖19係表示本 實施例分割裝置40之主要部構成之局部立體圖。該分割裝 置80係具有與實施例3相同的製品台81a、81b。假設製品 台81a、81b呈水平時亦即具有同一載置面之姿勢時,製品 台間之間隔爲Z,則間隔Z之大小在此狀態下是均勻的。 與實施例1、2相同地假設間隔Z之中央線爲y軸。在製品 台81a之下部,安裝與y軸不平行且與製品台81a成直角 23 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 559620 A7 _____ B7 ___ 五、發明說明(产) 之軸承板82。又,在軸承板82之下部設置軸孔83,將穿 過該軸孔83之軸當作旋轉軸L2,而將製品台81a保持成 可旋動自如。又,利用未圖示之驅動裝置使軸承板82旋動 。如此一來可獲得與實施例3相同的作用效果。 (實施例5) 其次說明本發明實施例5之分割裝置。圖20及21係 表示本實施例之分割裝置90之主要部構成,圖20係側視 圖,圖21係立體圖。該分割裝置90係藉由同時控制平行 連桿機構之6軸來放大玻璃板之分割之自由度。該分割裝 置90係具有與實施例3、4相同的製品台92a、92b。製品 台92a係當作固定之製品台,而製品台92b則當作可移動 自如之製品台。 如圖20所示,製品台92a係利用4根支撐柱93〜96 而被固定於台座91。製品台92b則下表面透過萬向接頭97 〜102而連接於伸縮臂103〜108。這些伸縮臂103〜108係 具有與圖15之伸縮臂63相同的功能者。在伸縮臂之內部 藏有線性馬達等,其長邊方向之長度藉由控制訊號而可伸 縮自如地受到控制。 各伸縮臂103〜108之下部係透過萬向接頭109〜114 而連接於台座91。又,這些伸縮臂103〜108之長度藉由來 自如圖21所示之控制部115之控制訊號而分別地受到控制 。又,如圖21所示,由製品台92b下面之萬向接頭97〜 102所形成之6角形,與由台座91上之萬向接頭109〜114 所形成之6角形係互爲不同的形狀。又,藉由伸縮臂之伸 24 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) f 訂---------線< 559620 A7 ____B7_ _ _ 五、發明說明( 縮控制,可任意選擇製品台92b之位置、載置面相對於水 平面之角度。如此便利用平行機構而實現了一種使用平行 伸縮動作之6軸伸縮臂來控制控制對象物之旋轉量、控制 位置等之機構。 分割玻璃板時,首先如圖21所示,對製品台92b之姿 勢進行控制,使其相對於製品台92a隔一既定間隔並在同一 平面上。然後,將玻璃板Η跨在製品台上並配置成刻線S在 上面而且位於間隔部之中心。在此狀態下,利用如真空吸附 或其他方法將玻璃板Η固定在製品台92a、92b上。在玻璃 面有矽等絕緣層成膜著的情形,也可利用靜電吸附來固定。 就製品台92b而言,各伸縮臂藉由來自控制部115之 控制訊號會伸縮到既定長度,藉以來使平行連桿機構產生 動作.。與實施例3同樣地,製品台92b以中心軸L3爲假想 軸旋轉。又,中心軸L3係位於製品台92b下方,與刻線S 不平行。亦即,中心軸L3與刻線S在空間座標內爲歪斜的 關係。 圖22係表示玻璃板Η分割後之分割裝置90之側視圖 。與實施例3同樣地,可以旋轉軸之方向相對於刻線方向 成某角度之方式使製品台92b旋轉。亦即,玻璃板Η以眼 前側爲玻璃板Η之分割開始點,從眼前起依序分割進展下 去。因此,作用於玻璃板Η之分割力之大小即使小’也可 做出完美的玻璃板Η之分割面。又,對於形成有由雷射造 成之盲裂縫之線的玻璃板也可藉由施加較習知爲小的分割 力來分割開來。 25 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ----------;----------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 559620 A7 __ B7 __ 五、發明說明(对) 在該實施例中,利用平行連桿機構即可按照作爲對象 之玻璃板之厚度及形狀等來設定任意的旋轉軸。又,完成 分割之後,如圖23所示以分割後之玻璃板Η之端面彼此 不再接觸之方式使製品台92b再度與製品台92a平行,並 設置段差。藉此,可使分割後之玻璃板Η之處理容易進行 〇 再者,在製品台92b內要配置玻璃板之區域之周圍, 如圖24所示預先配置可上下運動自如之推上銷116。分割 完玻璃板,將製品台92b保持水平之後,開放分割後之玻 璃板之吸附,使推上銷116產生動作,即可將玻璃板從製 品台92b推上去。其次,如圖24所示,在切斷後之玻璃板 Η與製品台92b之間插入除材帶117並舉起玻璃板Η,即 可搬運分割後之玻璃板Η。因此,可獲得容易地將玻璃板 Η往下一製程搬運之效果。 又,在本實施例中,已經說明過分割一塊玻璃板之情 形,但對於如圖18所示貼合脆性材料基板之一例,即分割 液晶母玻璃基板(其上下母玻璃基板形成有刻線)之情形也 可應用本實施例。在此情形,也不須翻轉液晶母玻璃基板 之表裏即可分割兩面母玻璃基板。 (實施例6) 其次說明本實施例6之分割方法。本實施例之脆性材 料基板之分割方法,係將一塊作爲前述基板G之液晶母玻 璃基板120分割爲既定形狀而獲得複數個液晶玻璃基板 121之製造方法。爲了從一塊液晶母玻璃基板120中獲得 26 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) --------訂---------線秦 559620 A7 __B7______ 五、發明說明(〆) 液晶面板(利用驅動訊號來以像素爲單位顯示影像或文字) 是需要各種製程的。 將含有TFT、掃描電極、訊號電極、像素電極之基板 稱爲TFT基板(也稱爲AM基板),將含有彩色濾光片之基 板稱爲對向基板,液晶面板係在將前述TFT基板與對向基 板予以貼合並將液晶塡充於該等兩基板後之階段的基板。 又,前述液晶母玻璃基板120係在將分割前之TFT基板(母 TFT基板)與分割前之對向基板(母對向基板)予以貼合後之 階段的基板(母貼合基板)。因此,分割後之貼合基板成爲 液晶玻璃基板121(貼合基板)。又,於液晶玻璃基板121塡 充液晶,封住液晶之注入口,並使得於基板緣之電極可連 接排線(flat cable),而作成液晶面板。 爲了對於前述液晶面板之製程中本實施例之分割方法 作一淸楚的定位,故進一步加以說明。爲了從一塊液晶母 玻璃基板120中獲得複數塊液晶玻璃基板121是須經複數 種分割過程的。該分割過程是按照基板之刻線或分割面位 於液晶面板之哪一部分來區別的。例如有(A)將作爲分成多 塊(gang printing)用之大塊貼合基板的液晶母玻璃基板120 分割成各個既定形狀之液晶玻璃基板121的過程、(B)在分 成多塊的狀態使液晶注入口露出來的過程、(C)取出電極部 分的過程。前述各過程之順序在此不須預先決定好,但本 實施例中至少有(A)(B)之過程。又,在(A)之過程中,只要 是刻線S於液晶母玻璃基板120形成爲格子狀(cross-scribe) ,就需要複數次分割過程。 27 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) -----------^-----I----訂--------- ί請先閱讀背面之注意事項再填寫本頁) 559620 五、發明說明(yw) 圖25係表示含有這種分割過程的液晶母玻璃基板120 之分割方法。該分割方法係包含⑴卡匣式裝載器(cassette loader)、(2)第1基板搬運裝置、(3)第1劃線裝置、(4)第2 劃線裝置、(5)第2基板搬運裝置、(6)第1分割裝置、C7)第 2分割裝置,複數塊液晶玻璃基板121經由這些裝置而製 造出來。因此,將這些分割過程稱爲液晶母玻璃基板自動 分割生產線。 在圖25中,卡匣式裝載器122係用來將許多塊液晶母 玻璃基板120收納於卡匣並保持著。進料機械人R1係用來 從卡匣式裝載器122之卡匣中將液晶母玻璃基板120取出 並傳送至第1基板搬運裝置123。第1基板搬運裝置123係 用來將由進料機械人R1所供應之液晶母玻璃基板120定位 於製品台之既定位置。該定位之進行係將液晶母玻璃基板 120之彼此垂直的端面緊壓於定位銷。 搬運機械人R2係用來將載置於製品台之液晶母玻璃 基板120搬運至第1劃線裝置124之既定位置。液晶母玻 璃基板120中將母TFT基板稱爲120a,母對向基板稱爲 120b。又,與實施例1、2同樣地將基板之加工面當作與 (x,y)面平行的面。第1劃線裝置124係分別形成例如與母 對向基板120b之X軸或y軸方向平行之刻線si,故在此 使用於習知例說明過之分割方法。 搬運機械人R3係從第1劃線裝置124中將形成有刻線 S1之液晶母玻璃基板120予以取出,使上面與下面翻轉並 交給搬運機械人R4。搬運機械人R4係用來將翻轉後之液 28 私紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) " ~ ----------;----------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 559620 A7 __B7_ 五、發明說明(/]) 晶母玻璃基板120搬運至第2劃線裝置125之既定位置。 第2劃線裝置125係用來將刻線S2分別形成爲與母 TFT120a之X軸或y軸方向平行。這些刻線S卜S2之位置 及其長度(描繪資料)係受到未圖示之控制用CPU所控制。 兩面有刻線形成之液晶母玻璃基板120係被搬運機械 人R5移轉至第2基板搬運裝置126。第2基板搬運裝置 126係用來將由搬運機械人R5所供應之液晶母玻璃基板 120定位在既定位置上。搬運機械人R6係用來將載置於第 2基板搬運裝置126之液晶母玻璃基板120移轉至第1分割 裝置127之既定位置上。 第1分割裝置127及第2分割裝置128係與實施例1 或2之分割裝置相同,故構造說明予以省略。第1分割裝 置127係用來將橫跨並載置於第1製品台127a及第2製品 台127b之液晶母玻璃基板120予以緊壓而固定,並使一方 之製品台如圖4所示往+z方向及< 方向旋動,或者是如圖 11所示使兩方之製品台往相同方向同時旋動,而使液晶母 玻璃基板120分割成長條形。 搬運機械人R7係用來將分割成長條形之液晶母玻璃 基板120從製品台127b中取出,並定位於第2分割裝置 128之既定位置,即定位成跨在2個製品台128a、128b。 第2分割裝置128係分割液晶母玻璃基板120。在此所獲得 之基板便成爲既疋形狀之液晶玻璃基板121。這些液晶玻 璃基板121係被搬運機械人R8移轉至第3基板搬運裝置 129,再被帶進下一個液晶面板之製程。 29 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) -ϋ ϋ ϋ ϋ n ί n^OJ* I n ϋ ( 559620 A7 _ B7_ 五、發明說明) 就具有以上過程之本實施例分割方法而言,與習知分 割方法比較並加以說明。圖26係使用習知分割裝置來分割 液晶母玻璃基板120時之過程圖。又’圖27係使用本發明 之分割裝置來分割液晶母玻璃基板120時之過程圖。其中 ,圖26因分割過程表示1個情形,故與圖25之分割過程 數不吻合。 習知分割裝置係,根據圖2所不方法’在玻璃板1之 一方之面上形成刻線S,將分割桿4壓在玻璃板1之他方 之面上,使玻璃板1彎曲,而使玻璃板1分割開來。又’ 根據圖3所示之方法,以拉應力作用於有刻線S形成之部 分之方式使玻璃板彎曲,而分割玻璃板1。若使用這種分 割裝置,在貼合玻璃基板之分割中就需要圖26中所示之 (b)〜(g)之過程。 亦即,使圖26(a)所示之液晶母玻璃基板120之母TFT 基板120a在上面,使用分割裝置如(b)所示在母TFT基板 120a劃上刻線S1。其次如(c)所示’使用翻轉裝置來翻轉液 晶母玻璃基板120。然後,如(d)所示’在母對向基板120b 緊壓上分割桿,在母TFT基板120a使垂直裂縫進展而分割 母TFT基板120a。其次,保持液晶母玻璃基板120 ’使用 劃線裝置如⑹所示在母對向基板12〇b劃上刻線S2。然後 ,使用翻轉裝置再度使液晶母玻璃基板120如(f)所示翻轉 。其次,如(g)所示,在母TFT基板120a緊壓上分割桿’ 在母對向基板120b使垂直裂縫進展。其次’使液晶母玻璃 基板120往左右分開,即可如⑻所示將液晶母玻璃基板 30 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ----------— 1®^--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 559620 A7 ^_B7_. __ 五、發明說明(>f ) 120分割成複數塊液晶玻璃基板121。然而,在這方法中需 要2次基板之翻轉過程。 然而,若使用本實施例1或2之分割裝置,對於液晶 母玻璃基板120只需要圖27之(b)〜⑴之過程。亦即,使圖 27(a)所示之液晶母玻璃基板120之母對向基板120b在上面 ,使用圖25之第1劃線裝置124如(b)所示來在母對向基板 120b劃上刻線S1。其次,如(c)所示使用翻轉裝置來翻轉液 晶母玻璃基板120。然後如(d)所示使用第2劃線裝置125 來在母TFT基板120a劃上刻線S2。 然後,將兩面有刻線之液晶母玻璃基板120設定在圖 25之第1分割裝置127,使一方之製品台往上側及下側旋 動,如(e)及(f)所示在母TFT基板120a及母對向基板120b ,垂直裂縫就分別往基板之厚度方向進展並穿過各基板。 因此,所謂裂縫產生。然後,使液晶母玻璃基板120往左 右分開,如(g)所示就獲得分割後之液晶玻璃基板121。依 據此方法,基板之翻轉過程只需一次。 以上過程係將液晶母玻璃基板120分割成例如長條形 的情形。如圖25所說明的,在液晶母玻璃基板120上以格 子狀形成刻線,又在分割成小尺寸之形狀之液晶玻璃基板 121之情形,圖26及圖27之過程差會變得更大,依據本實 施例之分割方法,不僅使基板之分割面平滑而且能省去基 板之翻轉過程。 (實施例7) 其次,說明本發明實施例7之分割方法。本實施例之 31 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁)559620 A7 _ B7__ V. Description of the invention (丨) [Detailed description of the invention] [Technical field to which the invention belongs] The present invention relates to a dividing device for a brittle material substrate for dividing a brittle material substrate such as glass, semiconductor wafer, ceramic, and the like, and Its segmentation method. [Background Art] Fig. 1 shows a state where a glass plate 1 is scribed by using a glass cutting blade wheel 2. By this scribe line, a score line S is formed on the surface of the glass plate 1. In the figure, the cross section in the circular area is enlarged and shown in the figure below. B represents the depth of a vertical crack formed by using the scribe line. FIG. 2 shows a schematic configuration of a conventional dividing device generally used. In this dividing device, a glass plate 1 having a score line S formed on its inner surface is placed on a product table 3 with a mat M interposed therebetween. Above the glass plate 1 is a dividing rod 4. The divided rod 4 is formed by joining a hard rubber 4b having a V-shaped cross section under the rod-shaped metal material 4a, and is held in parallel with the glass plate 1 by a driving mechanism (not shown), and can move up and down freely. The lower end of the hard rubber 4b of the split rod 4 is pressed from above the glass plate so as to fit the score line S through the glass plate 1. In this way, the glass plate 1 will be slightly bent on the mat M, so that the vertical cracks reach the surface of the glass plate, and the glass plate 1 is divided along the score line S. FIG. 3 shows Japanese Patent Laid-Open No. 4- Another division method disclosed in 280828. The product stands 3a, 3b divided into two are arranged at an interval from each other. The glass plate 1 is based on the engraved line S formed on the upper surface of the glass plate. Fortunately, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------- ----- Order --------- (Please read the notes on the back before filling out this page) 559620 A7 __B7______ V. Description of the invention (,) The way of the spacer is across the two product tables 3a, 3b Up and attracted and fixed. Furthermore, one of the product tables 3a is slightly rotated in the direction of the arrow along a rotation center axis 〇 parallel to the interval below, so that the glass plate 1 is bent and divided. By rotating the two product tables 3a and 3b simultaneously, the glass plate 1 can also be separated. In addition, when one of the product tables 3a is rotated and the self-product table 3b is released, the cut surface can be divided so that the cutting surface is not damaged. However, as shown in the lower diagram of FIG. 1 described above, the depth of the score lines is uniform, such as where Da and Db are deep. The dashed lines corresponding to Da and Db are represented by Sa and Sb. When the glass plate 1 is divided by the above method, even if a uniform dividing force is applied to the glass plate 1, the division of the glass plate 1 will not be performed uniformly, and the division of the glass plate will be represented by Sa and Sb. Place to finish first. That is, at this position, the vertical crack will reach below the glass plate 1. Then, the division of the glass plate 1 will proceed in the direction of the scribing line starting from the points Sa and Sb. Therefore, in the conventional division method, the division of the glass plate 1 is performed at a place where plural lines in the score line are used as starting points, so the division surface becomes screen-like and curved, and there is a disadvantage that the product price is reduced. In addition, in order to prevent the generation of dust during scribing, it is also under review whether to use a laser beam for scribing. In the laser scribing, the laser beam is irradiated on the glass plate and moved. The cooling by the point of the refrigerant will follow the laser beam. In this way, fine scribe lines are formed on the glass plate by utilizing the thermal deformation of the glass plate. The ruled line is thin and invisible to the naked eye, so the scribing method is also referred to as blmd-scnbe. However, for a glass sheet that has been blindly scribed, when the conventional dividing device is used to perform the division, the Chinese paper standard (CNS) A4 (210 X 297 mm) is applicable due to the blind paper sizing. ) (Please read the precautions on the back before filling this page) -------- Order --------- Xiantai 559620 A7 _ B7____ V. Description of the invention (4) Shallow depth of cracks Therefore, a large splitting force is required. Therefore, there is a problem that the device becomes large and cannot be separated at all. (Please read the precautions on the back before filling this page) [Disclosure of the invention] The present invention was developed in view of the conventional problems described above, and its purpose is to realize a device and method for dividing a brittle material substrate. For various shapes of brittle material substrates, it can reduce the division force applied to the substrate and obtain a uniform division surface. The dividing device of the present invention is characterized in that it has first and second product tables, and a brittle material substrate having at least one side forming a score line is placed, and the aforementioned score line is located between the two product tables; the first product clip When the edge of the first product table facing the second product table is regarded as the first edge, and the edge of the second product table facing the first product table is regarded as the second edge, The part of the brittle material substrate located on the first edge is tightly pressed and fixed; the second product clamp unit is used for pressing and fixing the part of the brittle material substrate located on the second edge; and a sliding mechanism is used for the brittle material. The scribe line of the substrate applies a preload in a right-angle direction, so that the first product table and the first product clamp unit are retracted from the scribe line together: a tilting mechanism that uses a tilt axis parallel to the scribe line of the brittle material substrate as rotation The shaft can rotate the second product table and the second product clamp unit together; and a rotation control unit that controls the tilting mechanism to rotate the second product table and the second product clamp unit; the first product table The second product stage is arranged so that the opposing edges of the two product stages are not parallel; the tilting axis of the second product stage is within the thickness range of the substrate from the engraved line of the brittle material substrate. 5 The size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) '" 559620 A7 — ____ Β7 ___ V. Description of the invention (times) In addition, the dividing device of the present invention is characterized in that: In the second product table, at least one side of a brittle material substrate forming a score line is placed, and the aforementioned score line is located between the two product tables. The first product clamp unit is to face the aforementioned second product table. When the edge of the first product table is regarded as the first edge, and when the edge of the second product table facing the first product table is regarded as the second edge, the portion of the brittle material substrate located on the first edge is tightened. Pressing and fixing; the second product clamping unit for tightly pressing and fixing the part of the brittle material substrate located on the second edge; the first tilting mechanism uses the tilt axis parallel to the score line of the brittle material substrate as rotation The shaft can rotate the first product table and the first product clamp unit together; the second tilting mechanism uses the tilting axis parallel to the engraved line of the brittle material substrate as a rotation axis, which enables the second product table and the first product clamp unit to rotate. 2 The product clamp unit rotates together; and the rotation control unit controls the first and second tilting mechanisms to rotate the first product table and the first product clamp unit, and the second product table and the second product clamp unit; the first product The table and the second product table are arranged so that the opposite edges of the two product tables are not parallel; the tilting axis of the first product table is located on the upper side of the substrate near the score line of the brittle material substrate, and the tilting axis of the second product table It is located on the lower side of the substrate near the score line of the aforementioned brittle material substrate. In addition, the dividing device of the present invention is based on the division of two product tables to fix the scribed brittle material substrate, and at least one of the product tables is rotated to divide the aforementioned brittle material substrate; The rotation center axis has a predetermined angle with respect to the scribe direction of the brittle material substrate. 6 Applicable to Chinese National Standard (CNS) A4 specification (210 X 297 mm). (Please read the precautions on the back before filling this page) tr --------- A7 559620 ( <) In addition, the dividing device of the present invention is based on dividing the two brittle material substrates which are divided into two product tables to fix the scribed brittle material substrate thereon, and rotating at least one of the product tables to divide the aforementioned brittle material substrate; At least one product table is provided with 6 telescopic arms, at least a part of which is not parallel; universal joints are provided at both ends of the aforementioned arms, and the aforementioned product table and one of the arms are connected at a free angle ; And a control section that controls the length of each of the aforementioned arms to control the position of one of the aforementioned product tables. Secondly, the method for dividing a brittle material substrate according to the present invention is characterized in that the position of the aforementioned product table is controlled to a same plane through a predetermined interval, and the brittle material substrate with a scribe line formed in advance is fixed in accordance with the interval between the product tables. On the aforementioned product table; making the aforementioned one product table rotate along a rotation axis that is not parallel to the engraving line formed on the brittle material substrate and is not on the same plane as the engraving line; The line is split. In addition, the method for dividing a brittle material substrate of the present invention is to divide a mother bonded substrate formed by bonding two brittle material substrates, and obtain a plurality of small bonded substrates from the mother bonded substrate; it is characterized by having the following steps: (1) Use a first scribing device to form a scribe line S1 at a predetermined position on the surface of one substrate of the mother bonding substrate; (2) Use a second scribing device to apply a second scribing device to the surface of the other substrate of the mother bonding substrate and go to the foregoing The engraved line S2 is formed in the same direction as the line S1: and (3) the aforementioned mother bonded substrate on which the engraved lines SI and S2 are formed on both sides is fixed to two product tables of the dividing device, so that at least one of the aforementioned product tables is rotated, and since A tensile stress or a shear stress is applied to the score lines SI and S2, and the mother bonded substrate is divided into a plurality of pieces. 7 Wood paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) -------- Order -------- -Line * A7 559620 V. Description of the invention (k) The method of dividing the brittle material substrate of the present invention is to paste the first brittle material substrate without the scribe line and the second brittle material substrate with the scribe line S2 formed in advance. The combined mother bonded substrate is divided, and a plurality of small bonded substrates are obtained from it; it is characterized by the following steps: (1) using a scribing device on the surface of the aforementioned first brittle material substrate and toward The scribe line S1 is formed in the same direction as the scribe line S2; and (2) the aforementioned mother bonded substrate on which the scribe lines S1 and S2 are formed on both sides is fixed to two product tables of the dividing device, and at least one of the product tables is rotated, By applying tensile or shear stress to the score lines SI and S2, the mother bonded substrate is divided into a plurality of pieces. In addition, the method for dividing a brittle material substrate according to the present invention is to divide a mother bonded substrate formed by bonding a first brittle material substrate and a second brittle material substrate which are not formed with scribe lines, and obtain a plurality of small pieces from here. Laminating substrates; characterized in having the following steps: (1) using a double-sided scribing device to simultaneously form score lines SI, S2 on the surfaces of the aforementioned first and second brittle material substrates; and (2) forming score lines on both sides The aforementioned mother bonding substrates of SI and S2 are fixed to the two product tables of the dividing device, and at least one of the product tables is rotated, and the aforementioned mother films are bonded by applying tensile stress or shear stress to the score lines SI and S2. The substrate is divided into a plurality of pieces. [Best Embodiment of the Invention] (Embodiment 1) A division device according to Embodiment 1 of the present invention will be described with reference to the drawings. Fig. 4 is an external perspective view of the entire configuration of the dividing device 10 of the first embodiment. This dividing device 10 is called a single tilting dividing machine. The substrate G to be divided is a brittle material substrate such as glass. 8 Wood paper size applies to China National Standard (CNS) A4 (210 X 297 mm) " ------------------ Order --------- Line ^^ " (Please read the notes on the back before filling this page) 559620 A7 ___B7______ V. Description of the Invention (^)) For the convenience of explanation, the space coordinates (X, y, Z) are used to designate and divide The reference plane of the product table on which the device 10 is arranged parallel to the ground is U, y, z. ), The direction perpendicular to the ground is the z-axis, and the division direction of the substrate G is the y-axis. The dividing device 10 is provided with a slide table 11 capable of sliding in the -X axis direction, and a tilt table 12 capable of tilting about a rotation axis parallel to the y axis as a center and sliding adjustment in the X axis direction. FIG. 5 is a perspective view showing the left unit 10A and the right unit 10B of the dividing device 10 in a separated state. When the entire dividing device 10 is mounted on the base 17 of FIG. 4, the left unit 10A refers to a mechanism portion provided on the left side (-X axis direction) of the scribe line S of the substrate G as shown in FIG. 4, and the right unit 10B It refers to a mechanism portion provided on the right side (+ x-axis direction) of the scribe line S of the substrate G. In order to mount and hold the substrate to be cut, the first product stage 13 is fixed to the slide stage 11, and the second product stage 14 is fixed to the tilting stage 12 °. Furthermore, the first product stage 13 is mounted above the first product stage 13. One product clamp unit 15 ′ attaches a second product clamp unit 16 to an upper portion of the second product table 14. The engraved line S of the substrate G is parallel to the y axis, and the area on the x-axis side (left side) of one of the substrates is referred to as the left portion GL of the substrate, and the area on the + x-axis side (right side) is referred to as the substrate. Right GR. The first product clamp unit 15 strongly presses the left end portion of the substrate left portion GL to fix the substrate, and the second product clamp unit 16 strongly presses the right end portion of the substrate right portion GR to fix the substrate. The left unit 10A is provided with a sliding mechanism 11a. The sliding mechanism 1 is configured to elastically press the sliding table 11 in the -X axis direction, and is provided with an elastic member for applying an elastic pressure, such as an air cylinder, a spring, and the like. The sliding mechanism 11a is also limited to slide 9__ The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) -------- Order --------- Line * 559620 A7 _____B7__ V. Description of the invention (3) Range limiter, damper (damper) to limit sliding speed, etc. (not shown). The right unit 10B is held by a pair of horizontal holding block upper portions 18 and a pair of horizontal holding block lower portions 19 as one of the pillars. The lower portion 19 of the horizontal holding block is fixed to the base 17, and the upper portion 18 of the horizontal holding block holds the tilting table 12 in a rotatable manner. A sliding unit (not shown) is provided between the horizontal holding block upper portion 18 and the horizontal holding block lower portion 19, and the horizontal holding block upper portion 18 can be slid and adjusted in the X-axis direction. In addition, a tilting shaft 18a is provided at the upper portion 18 of the horizontal holding block on the + y-axis and -y-axis sides, and the tilting table 12, the second product table 14, and the second product clamp unit 16 are held so that the tilting shaft 18a can rotate The moving shaft is tilted. The tilting shaft 18a is provided with, for example, a bearing housing at the upper portion 18 of the horizontal holding block, and is held by a ball bearing pressed into the bearing housing. Here, the horizontal holding block upper part 18 and the tilting shaft 18a are called a tilting mechanism. The first product clamp unit 15 is used to fix the left part GL of the substrate and concentrate the shear stress and bending stress on the score line of the substrate. The first product clamping unit 15 is provided with a first clamping lever 15 a that presses the substrate G near the score line S. The tip of the first clamp lever 15a is located on the right edge of the first product table 13 and can move slightly in the z-axis direction. The second product clamp unit 16 is similarly used to fix the right part GR of the substrate and concentrate the shear stress and bending stress on the score line of the substrate. The second product clamp unit 16 is provided with a second clamp lever 16a for pressing the vicinity of the engraved line S of the substrate G. The tip of the second clamp lever 16a is located on the left edge of the second product table 14 and can move slightly in the z-axis direction. Fig. 6 is a plan view showing the positional relationship between the first and second product tables 13, 14; The main shaft system of the first product clamp unit 15 including the first clamp lever 15a is installed obliquely so that the + y-axis side only has an opening angle of -α. In addition, it contains the second clamp rod 16a 10-------------------This paper size applies the Chinese National Standard (CNS) A4 specification (210 χ 297 mm)- -------- · Λ ---------- Order --------- line (Please read the precautions on the back before filling this page) A7 559620 V. Description of the invention (1) The main shaft of the second product clamp unit 16 is installed obliquely so that only the opening angle + α is on the + y-axis side. A gap is formed between these product stands 13 and 14. As shown in FIG. 6, the first product table 13 is rotated on the slide table 11 with the rotation axis 13a as the center in the (X, y) plane in a counterclockwise direction to adjust only a slight angle. The second product table 14 is pivoted on the tilting table 12 in the (X, y) plane in the clockwise direction with the rotation axis 14a as the center. Four corners of the first product table 13 are provided with screw holes 13b to 13e which have a long diameter in the tangential direction when viewed from the rotating shaft 13a. Similarly, four corners of the second product table 14 are provided with screw holes 14b to 14e which have a long diameter in the tangential direction when viewed from the rotation shaft 14a. Therefore, the first product table 13 is rotated around the rotation shaft 13a only by the angle -α, and the bolts of the screw holes 13b to 13e are locked to the slide table 11 at this position. In this way, the first product table 13 is moved together with the first clamp lever 15a from the position shown by the chain line at 2 points in FIG. 6 to the position shown by the solid line and can be fixed there. The second product table 14 is also the same as the first product table 13. With such an angle adjustment, the opening angle of the first clamp lever 15a and the second clamp lever 16a can be set to 2α. As a method for holding the substrate G, the substrate can be fixed to the product table by vacuum suction or other means. When the substrate is glass and a resin film is formed on the surface, the substrate may be fixed by electrostatic adsorption. The tilting mechanism of the tilting table 12 will be described. As shown in FIG. 4 and FIG. 5, the tilting axis 18 of the upper portion 18 of the horizontal holding block is a rotation axis so that the entire right-side unit 10B except the lower portion 19 of the horizontal holding block can rotate clockwise or counterclockwise. . Fig. 7 is a sectional view of a main part of a dividing device showing a mounting position of the tilting shaft i8a. In order to make the tilting table 12-rotation 11 wood paper standard through the tilting mechanism, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applicable " I (Please read the precautions on the back before filling this page) f—— Order- -------- Line win A7 559620 V. Description of the invention (L.) It is provided with a rotation control section 20. The rotation control unit 20 may be constituted by using the rotation force of a motor or a fluid pressure cylinder to rotate the tilting table 12 only by a predetermined angle, or may be manually rotating the tilting table 12 through an arm, a link, or the like. Constructor. At the same time, the tilting table 12 series will also move in the + X direction at the same time. In the initial setting of the dividing device, the first product stage 13 and the second product stage 14 are positioned so as to have the same mounting surface with respect to one substrate G. The height of the tilting shaft 18a is adjusted to the center of the tilting shaft 18a as viewed from the upper and lower surfaces of the substrate G placed on the product table. Let the thickness of the substrate G be 2d. . The placement surface of the first product table 13 is (X, y, -do) 'and the position of the tilting axis 18a is (0, y, 0). The position of the tilting axis 18a can be adjusted according to the thickness, material, and the like of the substrate G. In addition, assuming that the gap between the right edge of the first product table 13 and the left edge of the second product table 14 is 2g, the pressing position of the first clamping rod 15a to the substrate G and the second clamping rod 16a to the substrate G The clearance at the pressing position is as shown in FIG. 7, and it is desirable that the interval between the pressing positions of the closest part is about the same as 2 g. Further, it is preferable that the tilt axis 18a is parallel to the engraved line of the substrate G and is located within the thickness range of the substrate. Next, the operation of the dividing device having such a mechanism will be described. Assume that the substrate G is a laminated glass for a liquid crystal panel, and as shown in FIG. 8 (a), it is provided with various electrodes formed on the inner substrate G1 (0.7 mm thick) and the lower substrate G (0.7 mm thick). ), And a liquid crystal is enclosed in the interval (0.1 mm). The thickness of the substrate in this case is 2d. It is 1.50mm. In addition, as shown in FIG. 8 (a), the upper surface of the upper substrate G1 and the lower surface of the lower substrate G2 are 12 books, and the paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297). ---- Λ ---------- Order --------- line (please read the notes on the back before filling this page) 559620 A7 __B7___ V. Description of the invention (u), The scribe lines SI and S2 are respectively formed in advance at the same position as viewed from the (X, y) plane. The method of forming the scribe lines SI and S2 is the same as that in the conventional example. The part with high shear or tensile stress will become the glass substrate. Split point. Figure 9 is a partial enlarged cross-sectional view of a dividing device centered on a scribe line S. Also, Fig. 10 is a plan view of a main part of the dividing device centered on a scribe line S using a 2-point chain line. Here The solid line is used to represent the position of the substrate G after division. The position (X, y, z) of the tilting axis 18a is (0, y, 0). As shown in FIG. 10, in the left portion GL of the substrate after division, Let the end point of the + y-axis side of the engraved line S2 in FIG. 8 be PL, and let the end point of a y-axis side be ql. Also, let the left side of the substrate GL and the right edge of the first product table 13 contact + y The end point on the axis side is PL '' and The end point on the y-axis side is QL '. Furthermore, in the right part GR of the substrate after division, let the end point on the line where the right part GR of the substrate touches the left edge of the second product table 14 + the y-axis side is PR', The end point on the -y axis side is QR '. Before the substrate G is divided and cut, PR and PL are the same, and QR and QL are the same. As shown in Fig. 9 (a), the second product stage should not be used. When the counterclockwise direction is only inclined at an angle of 0, the position of the point PR 'moves from (xi, yi, Zl) to (X2, y2, Z2). Here, each coordinate 値 is shown below. X1 = g2 yi = yi zi = —do X2 = d〇sin Θ 4- g2C〇s Θ y2 = yi Z2 = d〇 (1-cos 0) + g2 sin 0 — d〇13 This paper size applies the Chinese National Standard (CNS) A4 specification ( 210 x 297 Gongchu) --- (Please read the notes on the back before filling out this page) -------- Order ---------. 559620 A7 _____B7_ V. Description of the Invention (Borrowed Based on the tight pressure of the second clamp rod 16a, set the part PR '(χ2, y2, Z2) of the right part GR of the base plate to the fixed point relative to the second product table 14, the shear force and tension will change from the aforementioned fixed point. To act on the divided part of the point PR at the right GR of the substrate. The tension is similarly applied to the point QR in Fig. 9 (b). However, the position of the score line S2 seen from the point PR 'and the position of the score line S2 seen from QR' are different as shown in Figs. 9 and 10 Compared with the + y-axis side (opposite side), the shear stress and tensile stress on the -y-axis side (this side) are larger. Even if the Young's coefficient of the glass material is the same in both parts, the front end portion of the right-side GR-end support of the left-side GL of the substrate that does not rotate moves is the most front-end portion of FIG. 9 (b) than FIG. 9 ( The occasion of a) is short. Therefore, as shown in Fig. 9 (b), the foremost end portion of the one-end support is harder to relieve the shear stress than in the case of Fig. 9 (a). Therefore, the points QR and QL become division points and the lower substrate G2 is divided. Here, when the second product table 14 is tilted in the clockwise direction, as in the case of tilting in the counterclockwise direction, shear stress and tensile stress act on the scribe line S1 of the upper substrate G1, and the upper substrate G1 is divided. Come. When the substrate G is cut, by the sliding mechanism 11a, the spring pressure in the _x axis direction will act on the left portion GL of the substrate, and the tilting table 12-while starting to rotate, moves in the + x axis direction, and the right edge portion (Cross section of the substrate left portion GL) Backward in the -X axis direction without contacting the left edge portion of the substrate right portion GR. Therefore, no defects occur on the divided surface of the glass substrate and a smooth divided surface is obtained. After the substrate G is divided, the position of the point PR is moved from (X3, y3, Z3) to (X4, ys z〇. Here, each coordinate 値 is shown below. X3 = 0 14 The Chinese paper standard is applicable to the CNS) A4 specification (210 X 297 mm) ---------- ^ ---------- Order --------- line ^^ (Please read the note on the back first Please fill in this page again for details) 559620 ____B7__ 5. Description of the invention (l >)) y3 = Υ3 ZO3 = one do χ4 = d〇sin0 y4 = y3 Z4 = d〇 (1 — cos 0) — d〇 When the horizontal movement amount h- is 3 °, the result is 0.039mm. Fig. 8 (b) shows the case where the right GR of the substrate rotates counterclockwise, and Fig. 8 (c) shows the longitudinal section and cut of the substrate when the right GR of the substrate rotates counterclockwise. Face back. The substrate is divided into left and right substrates at the scribe line S, and the substrates GR and GL can be removed from the product table by separating the first clamp rod 15a and the second clamp rod 16a from the substrate. In order to divide one substrate having a strip shape in the X-axis direction into a plurality of portions, a scribe line is formed at a predetermined position on the substrate G, respectively. Then, the substrate G is conveyed by a predetermined pitch in the X direction, a product clamping unit is set, and the tilting table 12 is tilted. By repeating these operations, a plurality of substrates can be manufactured from one mother substrate. (Embodiment 2) Next, a division device according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 11 is an external perspective view showing the entire configuration of the dividing device 30 according to the second embodiment. This dividing device 30 is called a two-tilt dividing machine. For convenience of explanation, it is assumed that the reference plane of the table parallel to the bed surface of the dividing device 30 is (x, y), the direction perpendicular to the bed surface is the ζ axis, and the division direction of the substrate is the y-axis. The separating device 30 has a rotation axis parallel to the y-axis, and has first and second tilting tables 31 and 32 capable of tilting. 15 The size of the paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 Gongchu) (Please read the precautions on the back before filling this page) -------- Order -------- -Line * A7 559620 V. Description of the invention (Vfire) FIG. 12 is a perspective view showing a state where the left unit 30A and the right unit 30B of the split device 30 are separated. The entire system of the dividing device 30 is mounted on the base 37 as shown in FIG. 11 through the holding blocks% and 39. The first product table 33 is fixed to the first tilting table 31, and the second product table 34 is fixed to the second tilting table 32. As in the first embodiment, a first product clamp unit 35 is mounted on the first product table 33, and a second product clamp unit 36 is mounted on the second product table 34. The functions of these clamp units are also the same as those of the first embodiment, so the description of the mechanism is omitted. The first tilting table 31, the first product table 33, and the first product clamp unit 35 are held by a first holding block 38 as a pillar. The second tilting table 32, the second product table 34, and the second product clamp unit 36 are held on a second holding block 39 as a pillar. As shown in FIG. 11, the distance between the pillars of the second retaining block 39 is wider than the distance between the pillars of the first retaining block 38. When in the normal position (action position), the left unit 30A and the right unit 30B are mounted on the base 37. After that, all the pillars are roughly aligned on the y-axis. Assuming that the tilting axis of the first retaining block 38 is 38a and the tilting axis of the second retaining block 39 is 39a, as shown in FIG. 13, the tilting axis 38a and the tilting axis 39a are assumed to be from the reference position of the dividing device (χοM, ζ.), it is roughly symmetrical in the z-axis direction and is located near the score lines SI and S2. The reference position is. , 7. ,2. ) Is assumed to be the same as in Example 1, and is located at the intermediate position (0, y, 0) between the scribe lines SI and S2 of the substrate 0. If the center position of the thickness of the substrate G is z = 0, the position of the tilting axis 38a on the z axis is preferably OmmS 20mm, and the position of the tilting axis 39a is 1 cb, which is preferably 20mm € to dd Omm. 16 The paper and paper size are applicable to the Chinese National Standard (CNS) A4 specification (210 χ 297 mm) ---------- ^ ---------- Order ------- --Line (please read the precautions on the back before filling this page) A7 559620 V. Description of the invention (The installation position of the first clamp lever 35a and the second clamp lever 36a is the same as that in the embodiment. The first holding arm 38b rotates freely around the first tilting shaft 38a, and holds the first tilting table 31 at an arbitrary angle. Here, the first holding arm 38b and the first tilting shaft 38a are referred to as a first tilting mechanism. Similarly, The second holding arm 39b is rotatable around the second tilting shaft 39a, and holds the second tilting table 32 at an arbitrary angle. Here, the second holding arm 39b and the second tilting shaft 39a are referred to as a second tilting mechanism. The rotation control unit 40 may use the rotational force of a motor or a fluid pressure cylinder to rotate the first tilting table 31 and the second tilting table 32 by a predetermined angle. The tilting tables 31 and 32 may be manually operated through an arm or a link. The first holding arm 38b and the second holding arm 39b may hold the first tilting table 31 and the second tilting table 32 and ( The x, y) planes are parallel, that is, keep horizontal. Here, the main shaft of the first product clamp unit 35 containing the first clamp lever 35a is installed obliquely so that its + y-axis side spreads out-α angle, and contains the second clamp lever The main axis of the second product clamp unit 36 of 36a is installed obliquely so that its + y-axis side open + α angle. Assuming that the thickness of the substrate G is 2d〇, here is an example to cut the laminated glass for the liquid crystal panel. In the case of a substrate. Assume that the mounting surface of the first product table 33 is (x, y, d0), and the position of the tilting axis 38a is (0, y, + d2) as shown in FIG. 13. This position may also be It is adjusted according to the thickness, material, etc. of the substrate. Also, it is preferable that the tilting axes 38a and 39a are located at symmetrical positions with respect to the center position of the substrate, that is, ch = d2. Also, suppose the first The right edge of the product table 33 and the left 17 of the second product table 34. The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm). &Quot; " (Please read the precautions on the back before filling this page. ) -------- Order -------- · Line 1 559620 A7 B7 V. Description of the Invention (α) The gap between the edges is 2g, then the first clamp rod 35a presses the substrate G The pressing position of the second clamp lever 36a against the substrate G is close to the edges as shown in FIG. 13, and the interval between the pressing positions of the closest parts is preferably approximately the same as 2g. The operation of the device 30 will be described. Fig. 14 is a partially enlarged sectional view of the division device centered on the scribe line S. Fig. 10 is a plan view of a main part of the division device centered on the scribe line S. As described above, the position of the first tilting axis 38a is (0, y, cL ·), and the position of the second tilting axis 39a is (0, y, d2). Fig. 14 (a) is a cross-sectional view near the PR point and the PL point in Fig. 10. FIG. 14 (b) is a sectional view near the QR and QL points in FIG. Here, the distance between the edge of the first product table 33 and the second product table 34 is 221 mm. < 22). As shown in FIG. 14, first, the second product table 34 is inclined at an angle of 0 clockwise, and then the first product table 33 is inclined at an angle of 6> clockwise. As in Example 1, it is assumed that the pressing point of the right GR of the substrate to the second product stage 34 is PR '. This point PR 'can be regarded as a point of application of shear stress when the substrate G is divided along the score line S. Now consider a case where the second product table 34 is first rotated in the clockwise direction by an angle Θ. The position of PR 'is moved from (x5, y5, Z5) to (X6, y6, Z6). Here, each coordinate system is shown below. X5 = g2 y5 = y5 Z5 = — d〇X6 = (d2—d〇) sin0 + g2C〇n0 18 Take the paper size and apply the Chinese National Standard (CNS) A4 specification (210 x 297 male f) ----- ------ ^ -------- Order --------- line ^^ * (Please read the notes on the back before filling this page) 559620 A7 ------ -B7 ____ V. Description of the invention (Ά) Y6 = ys Z6 = — (d2—d〇) (l — con (9) — g2sin (9 — do) In this way, the right part of the substrate GR (X6, y6, Z6) The part becomes a fixed point with respect to the second product table 34, and the shear stress and tensile tension act on the divided part of the point PR located on the right GR of the substrate from the fixed point. Such shear stress and tensile tension are also shown in the figure. The point QR shown in 14 (b). However, the distance from the point PR to the score line S2 is different from the distance from the point QR 'to the score line S2 as shown in FIG. , QR has a large shear stress and tensile stress. Even if the Young's coefficient of the glass material is the same in both parts, the shear stress, tensile stress, and bending of the front end of the substrate GR on the left side GL of the substrate can be supported The stress is smaller than that of QR. This is because the cantilever supports the front end As shown in FIG. 14 (a), the stress is relieved due to elastic deformation. Therefore, the point QR with a high stress becomes a dividing point, and the upper substrate G1 is divided. Next, when the first product table 33 is made smooth When the clock direction is tilted by Θ angle, 'the shear stress and tensile stress are applied to the score line S2, and the lower substrate is divided. In this case, the PL point and the QL point of the GL on the left side of the substrate' will be the same as described above Generated by the rotation of the two product tables, with the engraved line S as the center, the tensile stress will act in the -X axis direction and the + x axis direction, and the shear stress will act in the z axis direction and the + z axis direction, so The substrate G can be easily divided. When dividing, the substrate left portion GL and the substrate right portion GR are separated from each other. In this case, the right edge portion of the divided surface does not contact the left edge portion of the substrate right portion GR. Therefore, the glass substrate The cut surface will not be scratched and a smooth cut surface can be obtained. 19 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21〇x 297 公 楚 1 " (Please read the precautions on the back before filling this page) ) -------- Order --------- Line Win 559620 A7 ___B7___ V. Invention Explanation (1¾) If the horizontal movement amount of the point PR is calculated, then (d〇 + d〇Sm0, in the case of d2 = 5.0mm'd0 = 0.75mm'0 = 3 ', its 値 is 0.300mm, which is more than the implementation The horizontal movement of 0.039mm in Example 1 is much larger. If the movement in the vertical direction of the point PR is calculated, (d0 + d2) (l — con6 ») is used. If the above number is substituted, it can be obtained. The vertical movement amount is 0.079 mm. This chirp will affect the shear stress of the scribe line S. The substrate divided into the left and right by the score line S can be removed from the product table by releasing the pressing force of the first clamping lever 35a and the second clamping lever 36a. In addition, the first tilting table 31 and the second tilting table 32 are tilted alternately at the same angle. However, the tilting angles may be different for each tilting table, and no matter which tilting table is tilted first, the division characteristics of the substrate G are not affected. . As described above, regardless of which division device is used, the end face side in front of the substrate G is the starting point of the division, and the division proceeds from the eye to the inside in order. In this dividing device, since the starting point of the division of the substrate is one point, the magnitude of the force acting on the substrate can be made much lower than the conventional division method. In addition, the split end surface is completely made, so that the situation in which the split end surface described in the conventional technique is not good does not occur. In the device of the present invention, the mounting position, height, etc. of each holding block can be easily changed, and the rotation amount of the product table, the opening angle 2α, etc. can be arbitrarily set, so the degree of freedom in design becomes higher. In this embodiment, the case where the score lines S1 and S2 formed on the bonded glass substrate for a liquid crystal panel are viewed from the (x, y) plane as the same position has been described, even though the positions of SI and S2 are due to the presence of liquid crystal. The terminals of the panel need to be formed and separated by several mm, and the dividing device can also be used for division without difficulty. In addition, the dividing device of this embodiment is not only capable of dividing and bonding glass. When the size of the 20-wood paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) ---------- ^- -------- Order --------- line ^^ · (Please read the notes on the back before filling in this page) 559620 A7 ___B7 _____ V. Description of the Invention (^) Sheet glass can also be divided into fragile material substrates such as semiconductor wafers and ceramic substrates. Especially in the case of bonding a glass substrate like a liquid crystal panel, the upper and lower glass plates can be alternately separated by using an alternate division operation, and at the same time, the process of inverting the substrate is not required, so the operation efficiency can be greatly improved. The dividing device of the present invention can also be applied to use a heating mechanism such as a laser to heat a brittle material substrate and divide the brittle material substrate formed with a score by thermal deformation generated on the brittle material substrate. (Embodiment 3) Next, a division device according to Embodiment 3 of the present invention will be described. Fig. 15 is a perspective view showing a part of the dividing device 50 of this embodiment. In this embodiment, the two product tables 51a and 51b are arranged at an interval Z, and one product table 51b is fixed. On the inner surface of the product table 51a, universal joints 52, 53, 54 are fixed, and three support posts 56, 57, 58 are provided through these joints. The support columns 57 and 58 are disposed along the end surface of the interval Z of the product table 51a, and the support columns 56 are disposed behind the support column 57. Universal joints 59, 60, and 61 are installed below the support pillars 56, 57, and 58, respectively. The other ends of the universal joints 59 and 61 are fixed to the base 62. The support column 57 is shorter than other support columns. The other end of the universal joint 60 is fixed to the base 62 through a telescopic arm 63. The telescopic arm 63 is an arm which has a linear motor or the like inside, and is controlled by an external control signal to extend and contract in the longitudinal direction. When the glass plate 作为 which is one of the brittle material substrates is divided, the glass plate is placed on a product table as shown in Fig. 16 which shows a plan view. At this time, the glass plate Η is stretched across the product tables 51a, 51b so that the score line S formed on the upper surface is located at the spacer, and is fixed by being sucked. 21 --------- ^ -------- ^ --------- ^ (Please read the precautions on the back before filling this page) The size of the clothing paper applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) 559620 A7 ______ Β7 _ V. Description of the invention (After that, the telescopic arm 63 is extended or compressed. Figure II shows the telescopic arm when there is no glass plate 63 is an explanatory diagram of the state after extension. The product table 51a rotates with the line connecting the universal joints 59 and 61 shown by the one-point chain line as the center axis L1, and the direction of the rotation center axis is not parallel to the scribe line but It has a certain angle. That is, the engraving line S of the glass plate and the center axis li of the rotation of the product table 51a are not parallel. In this way, the products are different from each other as shown in the figure. The greater the amount of movement on the end surface of the interval Z of the stage 51a. Also, the larger the aforementioned angle, the greater the tendency. As a result, the end surface side in front of the eyes of the glass plate 成为 will become the starting point of the division of the glass plate, and the glass plate Η The segmentation progresses from the eye to the inside in order. In this segmentation method, since the starting point of the segmentation is 1 point, it works The magnitude of the splitting force on the glass plate is much lower than that of the conventional splitting method. Moreover, the splitting end surface, that is, the splitting surface is completely completed, which makes the poor splitting end surface of the glass plate 所述 described in the conventional technology. It will happen. Also, the lined glass plate can be divided in the same way by using the aforementioned laser scribing device. In this division method, it is easy to change the installation position, height, etc. of each support post 56, 57 and 58. The amount of rotation and direction of rotation of the product table 51a can be arbitrarily set, so the degree of freedom in design is high. Also, in this embodiment, although the other product table 51b is fixed, the product table 51b can also be made. 51b has the same rotation mechanism. In this case, the rotation direction of the product table 51b must be reversed. Figure 18 shows an enlarged cross section of the liquid crystal mother glass substrate. The liquid crystal mother glass substrate 70 is, as is well known, on one of the mother glass substrates 71. Peripheral department 22, paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) ---------- J -------- order ------- --Line (please read the notes on the back before filling this page) 559620 A7 ___ B7__ 5. Description of the invention (λ) (Please read the precautions on the back before filling in this page) Apply the adhesive 72, and then stack another mother glass substrate 74 with spacers to make the mother glass. The substrates are fixed to each other. In addition, liquid crystal 75 is injected into the space between the two mother glass substrates through a small hole provided in the adhesive layer 72 to obtain a liquid crystal panel (not shown). To use a mother glass substrate of a predetermined size The mother glass substrate 70 is formed and separated into a plurality of liquid crystal panels, so it has been used in the past. The upper mother glass substrate 74 has a score line S1 formed on the upper surface and the lower mother glass substrate 71 has a score line S2. . In the conventional division method, when the liquid crystal mother glass substrate 70 is divided, one mother glass substrate is divided, and the front and rear surfaces are inverted before the other mother glass substrate is divided. In contrast, in the case of using the dividing device of this embodiment, before the assembly of the liquid crystal mother glass substrate 70 of FIG. 18 is performed, a score line is formed on the upper surface of the mother glass substrate 74 and the upper surface of the mother glass substrate 71 in advance. The upper and lower mother glass substrates can be divided at the same time by one rotation of the product table. Therefore, there is no need to reverse the mother glass substrate, and the operating efficiency can be greatly improved. (Embodiment 4) Next, a division device according to Embodiment 4 of the present invention will be described. Fig. 19 is a partial perspective view showing the configuration of the main parts of the dividing device 40 of this embodiment. This dividing device 80 has the same product tables 81a and 81b as those in the third embodiment. It is assumed that when the product tables 81a and 81b are horizontal, that is, when they have the same mounting surface posture, the interval between the product tables is Z, and the size of the interval Z is uniform in this state. As in Examples 1 and 2, it is assumed that the center line of the interval Z is the y-axis. In the lower part of the product table 81a, the installation is not parallel to the y-axis and is at a right angle to the product table 81a. Production) of the bearing plate 82. A shaft hole 83 is provided in the lower portion of the bearing plate 82. A shaft passing through the shaft hole 83 is used as a rotation shaft L2, and the product table 81a is held rotatably. The bearing plate 82 is rotated by a driving device (not shown). In this way, the same effect as that of the third embodiment can be obtained. (Embodiment 5) Next, a division device according to Embodiment 5 of the present invention will be described. Figs. 20 and 21 are diagrams showing the configuration of the main parts of the dividing device 90 of this embodiment. Fig. 20 is a side view and Fig. 21 is a perspective view. The dividing device 90 enlarges the degree of freedom of dividing the glass plate by simultaneously controlling the 6 axes of the parallel link mechanism. This dividing device 90 has the same product tables 92a and 92b as those of the third and fourth embodiments. The product table 92a is regarded as a fixed product table, and the product table 92b is regarded as a movable product table. As shown in FIG. 20, the product table 92 a is fixed to the table 91 using four support columns 93 to 96. The product table 92b is connected to the telescopic arms 103 to 108 through universal joints 97 to 102 on the lower surface. These telescopic arms 103 to 108 have the same functions as those of the telescopic arms 63 in FIG. 15. A linear motor or the like is hidden inside the telescopic boom, and the length in the longitudinal direction can be flexibly controlled by a control signal. The lower portions of the telescopic arms 103 to 108 are connected to the pedestal 91 through universal joints 109 to 114. The lengths of these telescopic arms 103 to 108 are individually controlled by control signals from the control unit 115 shown in FIG. 21. Further, as shown in FIG. 21, the hexagonal shape formed by the universal joints 97 to 102 below the product table 92b is different from the hexagonal shape formed by the universal joints 109 to 114 on the base 91. In addition, with the extension of the telescopic arm, the size of the 24 paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) f Order ------- --line < 559620 A7 ____B7_ _ _ V. Description of the invention (Shrink control, the position of the product table 92b, the angle of the mounting surface relative to the horizontal plane can be arbitrarily selected. This facilitates the use of a parallel mechanism to achieve a 6-axis telescopic arm using parallel telescopic action A mechanism to control the amount of rotation, control position, etc. of a control object. When dividing a glass plate, first, as shown in FIG. 21, the posture of the product table 92b is controlled so that it is spaced at a predetermined interval from the product table 92a and at the same time. On a flat surface. Then, the glass plate Η is placed on the product table, and the scribe line S is placed thereon and positioned at the center of the spacer. In this state, the glass plate Η is fixed to the product table 92a by, for example, vacuum suction or other methods. , 92b. When the glass surface is coated with an insulating layer such as silicon, it can also be fixed by electrostatic adsorption. As for the product table 92b, each telescopic arm will expand and contract to a predetermined length by a control signal from the control unit 115. As a result, the parallel link mechanism is actuated ... As in the third embodiment, the product table 92b rotates with the central axis L3 as an imaginary axis. The central axis L3 is located on the product table. Below 92b, it is not parallel to the engraved line S. That is, the center axis L3 and the engraved line S have a skewed relationship in the space coordinates. FIG. 22 is a side view of the dividing device 90 after the glass plate is divided. Similarly, the product table 92b can be rotated in such a manner that the direction of the rotation axis is at an angle relative to the direction of the engraved line. That is, the glass plate Η uses the front side of the eye as the division start point of the glass plate ,, and the division proceeds in sequence from the front. Therefore, even if the magnitude of the splitting force acting on the glass plate 即使 is small, a perfect splitting surface of the glass plate 做出 can be made. Also, for a glass plate with a line of blind cracks caused by laser light, it can also be used by Apply a smaller splitting force than the conventional one to separate it. 25 Wood paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----------; ----- ----- Order --------- line (please read the notes on the back before filling out this page) 559620 A7 __ B7 __ V. Description of the invention (pair) In this embodiment, parallel connection is used The lever mechanism can set any rotation axis according to the thickness and shape of the target glass plate. After the cutting, as shown in FIG. 23, the product table 92b is again parallel to the product table 92a in such a way that the end faces of the divided glass plate 不再 are no longer in contact with each other, and a step is set. This can make the divided glass plate Η The process is easy to perform. Furthermore, around the area where the glass plate is to be arranged in the product table 92b, as shown in FIG. 24, a pin 116 is arranged in advance to move up and down freely. After opening the adsorption of the divided glass plate, the push-up pin 116 is actuated, and the glass plate can be pushed up from the product table 92b. Second, as shown in FIG. 24, the cut glass plate and the product table 92b Insert the strip 117 and lift the glass plate Η to carry the divided glass plate Η. Therefore, the effect that the glass plate can be easily carried to the next process can be obtained. In this embodiment, the case of dividing a glass plate has been described, but for an example of bonding a fragile material substrate as shown in FIG. 18, that is, dividing a liquid crystal mother glass substrate (the upper and lower mother glass substrates are formed with score lines). In this case, this embodiment is also applicable. In this case, it is not necessary to flip the surface of the liquid crystal mother glass substrate to separate the two-sided mother glass substrate. (Embodiment 6) Next, a division method according to Embodiment 6 will be described. The method for dividing a brittle material substrate in this embodiment is a method for producing a plurality of liquid crystal glass substrates 121 by dividing a liquid crystal mother glass substrate 120 as the substrate G into a predetermined shape. In order to obtain 26 paper sizes from a liquid crystal mother glass substrate 120, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) ------- -Order --------- Xin Qin 559620 A7 __B7______ 5. Description of the Invention (〆) The LCD panel (using drive signals to display images or text in pixels) requires various processes. A substrate containing a TFT, a scanning electrode, a signal electrode, and a pixel electrode is referred to as a TFT substrate (also referred to as an AM substrate), and a substrate containing a color filter is referred to as a counter substrate. A substrate at a stage after the substrates are affixed and filled with liquid crystals on the two substrates. The liquid crystal mother glass substrate 120 is a substrate (mother bonding substrate) at a stage after bonding a TFT substrate (mother TFT substrate) before division and a counter substrate (mother counter substrate) before division. Therefore, the divided bonded substrate becomes a liquid crystal glass substrate 121 (bonded substrate). In addition, the liquid crystal glass substrate 121 is filled with liquid crystal, and the liquid crystal injection port is sealed, so that the electrode on the edge of the substrate can be connected to a flat cable to form a liquid crystal panel. In order to make clear the positioning method of the embodiment in the foregoing liquid crystal panel manufacturing process, it will be further explained. In order to obtain a plurality of liquid crystal glass substrates 121 from one liquid crystal mother glass substrate 120, a plurality of division processes are required. The division process is distinguished according to which part of the liquid crystal panel the scribe line of the substrate or the division plane is located on. For example, (A) the process of dividing the liquid crystal mother glass substrate 120, which is a large-sized bonded substrate for gang printing, into liquid crystal glass substrates 121 of a predetermined shape, and (B) the process of dividing into multiple The process of exposing the liquid crystal injection port, (C) the process of taking out the electrode part. The order of the foregoing processes need not be determined in advance here, but there are at least (A) (B) processes in this embodiment. In the process of (A), as long as the scribe lines S are formed in a cross-scribe pattern on the liquid crystal mother glass substrate 120, a plurality of division processes are required. 27 Wood paper scale is applicable to China National Standard (CNS) A4 (210 X 297 mm) ----------- ^ ----- I ---- Order ------- -ί Please read the precautions on the back before filling this page) 559620 V. Description of the Invention (yw) Figure 25 shows the division method of the liquid crystal mother glass substrate 120 containing this division process. This dividing method includes a cassette loader, (2) a first substrate conveying device, (3) a first scribing device, (4) a second scribing device, and (5) a second substrate conveying. Device, (6) the first division device, and C7) the second division device, and a plurality of liquid crystal glass substrates 121 are manufactured through these devices. Therefore, these division processes are called liquid crystal mother glass substrate automatic division production lines. In Fig. 25, a cassette loader 122 is used to store and hold a plurality of liquid crystal mother glass substrates 120 in a cassette. The feeding robot R1 is used to take out the liquid crystal mother glass substrate 120 from the cassette of the cassette loader 122 and transfer it to the first substrate transfer device 123. The first substrate transfer device 123 is used to position the liquid crystal mother glass substrate 120 supplied by the feeding robot R1 at a predetermined position on the product table. This positioning is performed by pressing the end faces of the liquid crystal mother glass substrate 120 perpendicular to each other against the positioning pins. The transfer robot R2 is used to transfer the liquid crystal mother glass substrate 120 placed on the product table to a predetermined position of the first scribing device 124. In the liquid crystal mother glass substrate 120, the mother TFT substrate is referred to as 120a, and the mother counter substrate is referred to as 120b. In addition, as in Examples 1 and 2, the processed surface of the substrate was regarded as a plane parallel to the (x, y) plane. The first scribing device 124 forms, for example, scribe lines si parallel to the X-axis or y-axis directions of the mother opposing substrate 120b. Therefore, the division method described in the conventional example is used here. The transfer robot R3 removes the liquid crystal mother glass substrate 120 on which the score line S1 is formed from the first scribing device 124, turns the top and bottom surfaces of the liquid crystal mother glass substrate 120, and delivers the transfer robot R4. The handling robot R4 is used to convert the liquid after turning over. The size of the private paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) " ~ ----------; ---- ------ Order --------- Line (Please read the precautions on the back before filling this page) 559620 A7 __B7_ V. Description of the invention (/)) The mother glass substrate 120 is transported to the second A predetermined position of the scribing device 125. The second scribing device 125 is used to form the score lines S2 parallel to the X-axis or y-axis directions of the mother TFT 120a, respectively. The positions and lengths (drawing data) of these score lines S2 and S2 are controlled by a control CPU (not shown). The liquid crystal mother glass substrate 120 formed with score lines on both sides is transferred to the second substrate transfer device 126 by the transfer robot R5. The second substrate transfer device 126 is used to position the liquid crystal mother glass substrate 120 supplied by the transfer robot R5 at a predetermined position. The transfer robot R6 is used to transfer the liquid crystal mother glass substrate 120 placed on the second substrate transfer device 126 to a predetermined position of the first dividing device 127. Since the first division device 127 and the second division device 128 are the same as those of the first or second embodiment, the description of the structure is omitted. The first dividing device 127 is used to press and fix the liquid crystal mother glass substrate 120 straddling and placed on the first product table 127a and the second product table 127b, and to make one product table move toward + z direction and < Rotation in the direction, or as shown in FIG. 11, the two product tables are simultaneously rotated in the same direction, so that the liquid crystal mother glass substrate 120 is divided into long bars. The transfer robot R7 is used to take the liquid crystal mother glass substrate 120 divided into long strips from the product table 127b and position it at a predetermined position of the second dividing device 128, that is, to position it across the two product tables 128a and 128b. The second dividing device 128 divides the liquid crystal mother glass substrate 120. The substrate obtained here becomes a liquid crystal glass substrate 121 having a conventional shape. These liquid crystal glass substrates 121 are transferred by the transfer robot R8 to the third substrate transfer device 129, and are then brought into the next liquid crystal panel manufacturing process. 29 Wood paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page) -ϋ ϋ ϋ ϋ n ί n ^ OJ * I n ϋ (559620 A7 _ B7_ V. Explanation of the invention) As for the segmentation method of the embodiment having the above process, it is compared with the conventional segmentation method and explained. Fig. 26 is a process diagram when the liquid crystal mother glass substrate 120 is divided using a conventional dividing device. Fig. 27 is a process diagram when the liquid crystal mother glass substrate 120 is divided using the dividing device of the present invention. Among them, FIG. 26 does not match the number of division processes in FIG. 25 because the division process represents one situation. According to the conventional dividing device system, a scribe line S is formed on one side of the glass plate 1 according to the method not shown in FIG. 2, and the dividing rod 4 is pressed on the other side of the glass plate 1 to bend the glass plate 1 so that The glass plate 1 is divided. Further, according to the method shown in Fig. 3, the glass sheet is bent so that the tensile stress acts on the portion where the score line S is formed, and the glass sheet 1 is divided. If such a separating device is used, the processes shown in (b) to (g) shown in Fig. 26 are required for the division of the laminated glass substrate. That is, the mother TFT substrate 120a of the liquid crystal mother glass substrate 120 shown in FIG. 26 (a) is placed thereon, and a scribe line S1 is drawn on the mother TFT substrate 120a using a dividing device as shown in (b). Next, as shown in (c) ', the liquid crystal mother glass substrate 120 is inverted using a reversing device. Then, as shown in (d) ', the dividing rod is pressed tightly on the mother opposing substrate 120b, and vertical cracks progress on the mother TFT substrate 120a to divide the mother TFT substrate 120a. Next, the liquid crystal mother glass substrate 120 'is scribed with a score line S2 on the mother opposite substrate 120b using a scribing device as shown in FIG. Then, the liquid crystal mother glass substrate 120 is turned again as shown in (f) by using a turning device. Next, as shown in (g), the upper TFT substrate 120a is pressed against the dividing rod ', and a vertical crack progresses on the mother opposing substrate 120b. Secondly, “Make the liquid crystal mother glass substrate 120 to the left and right, as shown in the figure, the liquid crystal mother glass substrate 30 can be used. The paper size of the paper conforms to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------- ---— 1® ^ -------- Order --------- line (please read the precautions on the back before filling this page) 559620 A7 ^ _B7_. __ 5. Description of the invention ( > f) 120 is divided into a plurality of liquid crystal glass substrates 121. However, this method requires two substrate inversion processes. However, if the dividing device of this embodiment 1 or 2 is used, only the processes of (b) to (b) of FIG. 27 are required for the liquid crystal mother glass substrate 120. That is, the mother opposing substrate 120b of the liquid crystal mother glass substrate 120 shown in FIG. 27 (a) is placed thereon, and the mother opposing substrate 120b is drawn using the first scribing device 124 of FIG. 25 as shown in (b).上 刻 线 S1. Next, as shown in (c), the liquid crystal mother glass substrate 120 is turned using a turning device. Then, as shown in (d), the second scribe device 125 is used to scribe the scribe line S2 on the mother TFT substrate 120a. Then, the liquid crystal mother glass substrate 120 with engraved lines on both sides is set in the first dividing device 127 of FIG. 25, and one product stage is rotated upward and downward, as shown in (e) and (f) on the mother TFT. For the substrate 120a and the mother-opposing substrate 120b, the vertical cracks progress toward the thickness direction of the substrate and pass through each substrate. Therefore, so-called cracks occur. Then, the liquid crystal mother glass substrate 120 is separated from left to right, and the divided liquid crystal glass substrate 121 is obtained as shown in (g). According to this method, the substrate turning process only needs to be performed once. The above process is a case where the liquid crystal mother glass substrate 120 is divided into, for example, a long shape. As illustrated in FIG. 25, in the case where the scribe lines are formed in a grid shape on the liquid crystal mother glass substrate 120, and the liquid crystal glass substrate 121 is divided into small-sized shapes, the process difference between FIG. 26 and FIG. 27 becomes larger. According to the dividing method of this embodiment, not only the dividing surface of the substrate is smoothed, but also the process of reversing the substrate can be omitted. (Embodiment 7) Next, a division method according to Embodiment 7 of the present invention will be described. The paper size of this example applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

559620 A7 _____B7____ 五、發明說明(々Ο) 脆性材料基板之分割方法,係如圖28所示、將液晶母玻璃 基板130分割成複數塊液晶玻璃基板131之方法。將含有 TFT、掃描電極、訊號電極、像素電極之母基板稱爲母對 向基板。該液晶母玻璃基板130係將母對向基板130b與母 TFT基板130a用密封劑132予以貼合而成之基板。 圖29係液晶母玻璃基板自動分割生產線之構成圖,其 顯不适種液晶母玻璃基板130之分割方法。該分割方法係 包含(1)卡匣式裝載器、(2)第1基板搬運裝置、(3)劃線裝置 、⑷第1分割裝置、⑸第2基板搬運裝置、⑹第2分割裝 置、(7)第3基板搬運裝置,複數個液晶玻璃基板131經由 這些裝置而被製造出來。 圖29中,(1)之卡匣式裝載器133係用來將複數塊液 晶母玻璃基板130收納於卡匣並加以保持。進料機械人R1 係用來將複數塊液晶母玻璃基板130從卡匣式裝載器133 之卡匣中取出,並移轉至如⑵所示之第1基板搬運裝置 134。第1基板搬運裝置134係用來將移轉後之液晶母玻 璃基板130定位於製品台之既定位置。 搬運機械人R2係用來將載置於製品台之液晶母玻璃 基板130搬運至(3)之劃線裝置135之既定位置。該劃線裝 置135係用來在如圖28所示之母對向基板130b之上表面 形成刻線S1。 搬運機械人R3係用來將有刻線S1形成之液晶母玻璃 基板130從劃線裝置135中取出,並移轉至(4)之第1分割 裝置136之既定位置。對於第1分割裝置136應用在實施 32 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ----------^--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 559620 A7 __ B7___ 五、發明說明(V) (請先閱讀背面之注意事項再填寫本頁) 例1〜5所說明之分割裝置。圖29係顯示應用實施例1或 2之分割裝置時之情形,有液晶母玻璃基板130橫跨並載 置在第1製品台136a及第2製品台136b ,將該液晶母玻 璃基板130之上表面予以緊壓而固定,使一方之製品台旋 動或使兩方之製品台同時旋動,而使液晶母玻璃基板130 分割成長條形。 搬運機械人R4係用來將分成長條形之液晶母玻璃基 板130取出並載置於(5)之第2基板搬運裝置137之製品台 。搬運機械人R5係用來將分成長條形之液晶母玻璃基板 130移轉至(6)之第2分割裝置138之既定位置。第2分割 裝置138係用來將液晶母玻璃基板130分割成規定形狀, 而獲得複數個液晶玻璃基板131。分割後之液晶玻璃基板 131係被搬運機械人R6移轉至第3基板搬運裝置139,進 而被帶進下一個液晶面板之製程。又,在實施例1〜5所說 明之分割裝置係當作第2分割裝置來應用。 在這種分割方法中,液晶母玻璃基板130之翻轉裝置 也不需要,只要1台如圖29(3)所示之劃線裝置即可。 (實施例8) 其次說明本發明實施例8之分割方法。本實施例之脆 性材料基板之分割方法之特徵爲使用兩面劃線裝置。又’ 本實施例之液晶母玻璃基板140係與實施例7之母玻璃基 板130不同,在母TFT玻璃基板以及在母對向基板均未預 先形成刻線S。 圖30係液晶母玻璃基板自動分割生產線之構成圖,表 33 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 559620 A7 ^_ B7_—_ 五、發明說明(f) 示這種液晶母玻璃基板Η0之分割方法。該分割方法係包 含(1)卡匣式裝載器142、(2)第1基板搬運裝置143、(3)第1 兩面劃線裝置144、(4)第2基板搬運裝置147、(5)第1分 割裝置148、(6)第3基板搬運裝置149、(7)第2兩面劃線 裝置150、⑻第4基板搬運裝置153、(9)第2分割裝置154 、(10)第5基板搬運裝置155,複數塊液晶玻璃基板141經 由這些裝置而被製造出來。 進料機械人R1、搬運機械人R2〜R7、基板搬運裝置 143、147、149、153、155,係與如實施例6、7所示者一樣 有相同的功能,故省略說明。 第1兩面劃線裝置144,係具有複數個製品台145a及 145b、設於該裝置中央之劃線頭座146a、及可移動自如地 保持於劃線頭座146a之上下劃線頭146b。當液晶母玻璃基 板140被製品台145a移轉至劃線頭座146a之部分之後, 使液晶母玻璃基板140之上下兩面之一部分會在加工區域 而保持成橋狀態。劃線頭146b對該橋部分進行掃描,來進 行上下兩面之劃線。 劃線裝置中,如習知例中所說明的,有使用超硬金屬 製、鑽石製的輪形刀而製成者,及使用以雷射光進行雷射 劃線者。輪形刀式之劃線裝置,係2個輪形刀同步緊壓液 晶母玻璃基板140之兩面並在上面旋轉移動(轉動),而同 時形成刻線S1及S2。又,以雷射劃線方式之劃線裝置, 係將2束光束點邊照射邊掃描在液晶母玻璃基板140之兩 面,追隨該照射部分同時進行使用冷媒之點冷卻。以此方 34 (請先閱讀背面之注意事項再填寫本頁)559620 A7 _____B7____ 5. Description of the Invention (々Ο) The method of dividing a brittle material substrate is a method of dividing a liquid crystal mother glass substrate 130 into a plurality of liquid crystal glass substrates 131 as shown in FIG. 28. A mother substrate including a TFT, a scan electrode, a signal electrode, and a pixel electrode is referred to as a mother counter substrate. The liquid crystal mother glass substrate 130 is a substrate obtained by bonding a mother counter substrate 130b and a mother TFT substrate 130a with a sealant 132. Fig. 29 is a structural diagram of a liquid crystal mother glass substrate automatic division production line, which is not suitable for a method of dividing the liquid crystal mother glass substrate 130. This dividing method includes (1) a cassette loader, (2) a first substrate conveying device, (3) a scribing device, a first dividing device, a second substrate conveying device, a second dividing device, ( 7) A third substrate transfer device, in which a plurality of liquid crystal glass substrates 131 are manufactured through these devices. In Fig. 29, the cassette loader 133 of (1) is used to store and hold a plurality of liquid crystal mother glass substrates 130 in the cassette. The feeding robot R1 is used to take out a plurality of liquid crystal mother glass substrates 130 from the cassettes of the cassette loader 133 and transfer them to the first substrate transfer device 134 as shown in FIG. The first substrate transfer device 134 is used to position the transferred liquid crystal mother glass substrate 130 at a predetermined position on the product table. The transfer robot R2 is used to transfer the liquid crystal mother glass substrate 130 placed on the product table to a predetermined position of the scribing device 135 of (3). This scribing device 135 is used to form a score line S1 on the upper surface of the mother opposing substrate 130b as shown in FIG. The transfer robot R3 is used to remove the liquid crystal mother glass substrate 130 formed with the score line S1 from the scribing device 135 and transfer it to a predetermined position of the first dividing device 136 of (4). For the first segmentation device 136 applied in the implementation of 32 wood paper standard applicable Chinese National Standard (CNS) A4 specification (210 X 297 mm) ---------- ^ -------- Order- -------- Line (please read the notes on the back before filling this page) 559620 A7 __ B7___ V. Description of the invention (V) (Please read the notes on the back before filling this page) Example 1 ~ 5 Illustrated dividing device. FIG. 29 shows a case where the dividing device of Example 1 or 2 is applied. A liquid crystal mother glass substrate 130 is placed across the first product stage 136a and the second product stage 136b, and the liquid crystal mother glass substrate 130 is placed thereon. The surface is tightly pressed and fixed, so that one product table is rotated or both product tables are rotated at the same time, so that the liquid crystal mother glass substrate 130 is divided into long bars. The transfer robot R4 is used to take out the liquid crystal mother glass substrate 130 divided into long strips and place it on the product table of the second substrate transfer device 137 of (5). The transfer robot R5 is used to transfer the long liquid crystal mother glass substrate 130 into a predetermined position of the second dividing device 138 of (6). The second dividing device 138 divides the liquid crystal mother glass substrate 130 into a predetermined shape to obtain a plurality of liquid crystal glass substrates 131. The divided liquid crystal glass substrate 131 is transferred by the transfer robot R6 to the third substrate transfer device 139, and is then brought into the next liquid crystal panel manufacturing process. The division device described in the first to fifth embodiments is applied as a second division device. In this division method, the flip device of the liquid crystal mother glass substrate 130 is not required, and only one scribing device as shown in FIG. 29 (3) is sufficient. (Embodiment 8) Next, a division method according to Embodiment 8 of the present invention will be described. The method for dividing a brittle material substrate of this embodiment is characterized by using a double-sided scribing device. In addition, the liquid crystal mother glass substrate 140 of this embodiment is different from the mother glass substrate 130 of Embodiment 7. The scribe lines S are not formed in advance on the mother TFT glass substrate and on the mother opposed substrate. Figure 30 is a composition diagram of a liquid crystal mother glass substrate automatic segmentation production line. Table 33 Applies to Chinese National Standard (CNS) A4 specifications (210 X 297 mm). 559620 A7 ^ _ B7 _—_ V. Description of the invention (f) This method of dividing the liquid crystal mother glass substrate Η0. This division method includes (1) a cassette loader 142, (2) a first substrate conveying device 143, (3) a first double-side scribing device 144, (4) a second substrate conveying device 147, and (5) a 1 dividing device 148, (6) third substrate conveying device 149, (7) second double-sided scribing device 150, fourth substrate conveying device 153, (9) second dividing device 154, (10) fifth substrate conveying The device 155 and the plurality of liquid crystal glass substrates 141 are manufactured through these devices. The feeding robot R1, the conveying robots R2 to R7, and the substrate conveying devices 143, 147, 149, 153, and 155 have the same functions as those shown in Embodiments 6 and 7, and therefore descriptions thereof are omitted. The first two-side scribing device 144 includes a plurality of product tables 145a and 145b, a scribing head base 146a provided in the center of the device, and an underline scribing head 146b movably held on the scribing head base 146a. After the liquid crystal mother glass substrate 140 is moved to the portion of the scribing head 146a by the product table 145a, a portion of the upper and lower surfaces of the liquid crystal mother glass substrate 140 will remain in a bridged state in the processing area. The scribing head 146b scans the bridge portion to scribble the upper and lower sides. As described in the conventional example, the scribing device is made of a wheel blade made of superhard metal or diamond, and a scribing device using laser light. The wheel-shaped knife-type scribing device is that two wheel-shaped knives press the two surfaces of the liquid crystal mother glass substrate 140 simultaneously and rotate (rotate) on them, and simultaneously form score lines S1 and S2. The laser scribing device uses a laser scribing system to scan the two surfaces of the liquid crystal mother glass substrate 140 while irradiating two beam spots, and simultaneously performs spot cooling using a refrigerant following the irradiated portion. Hereby 34 (Please read the notes on the back before filling this page)

衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 559620 A7 _____B7___ 五、發明說明(M ) 式來進行利用玻璃素材之熱變形的盲劃線。第2兩面劃線 裝置150之構造也與第1兩面劃線裝置144相同。 第1分割裝置148及第2分割裝置154係用來以於液 晶母玻璃基板140之兩面形成之劃線S爲分割面之方式來 分割基板。如在實施例1或2所說明的,將左右之製品台 保持成其間隔爲非平行,並使左右之製品台中至少之一方 旋動,以這種方式來分割之裝置也有。圖30中,使用該方 式之分割裝置的有第1分割裝置148,其中圖示著製品台 148a、148b之間隔爲非平行的情形。 第1分割裝置148及第2分割裝置154中,有使用其 他方式之裝置。這如實施例5中所說明的,2個將液晶母 玻璃基板140載置並固定之製品台中,將其一方之製品台 以圖20〜23所示之平行連桿機構予以保持。又,也有在基 板分割時以位於離開刻線之位置之軸爲旋轉軸使該製品台 旋動來分割之方式。在該方式之場合,如圖30所示之製品 台148a、148b之間隔,及製品台154a、154b之間隔均呈平 依據本實施例之分割方法,不需要翻轉液晶母玻璃基 板140之上下面的過程,也不須設置基板之翻轉裝置,而 可縮小液晶母玻璃基板分割生產線之設置面積。 產業上之利用可能性 依據本案之脆性材料基板之分割裝置,因有一機構使 得,在基板分割時分割力會作用於完成劃線之基板上之刻 線之一端,故基板之分割將從刻線之一端側依序進展至另 35 衣紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) (請先閱讀背面之注意事項再填寫本頁) --------訂-丨丨丨-. 559620 A7 ______B7^__ 五、發明說明(騎) ' 一端側,而使基板分開之端面平滑。又,所作用之分割力 係與習知分割法相比變小許多,而可使分割裝置本體小型 化。 又,依據本案之脆性材料基板之分割方法,在從1塊 液晶母玻璃基板分割成複數塊液晶玻璃基板之過程中,不 須翻轉基板,以一次過程即可分割液晶母玻璃基板之兩面 。因此,使基板分割之翻轉過程減少。 【圖式之簡單說明】 圖1,係表示在玻璃板進行劃線時之垂直裂縫之狀態。 圖2,係使用了分割桿之習知分割裝置主要構成之立 體圖。 圖3,係利用製品台之旋轉來進行分割之習知分割裝 置主要構成之立體圖。 圖4,係本發明實施例1分割裝置全體構成之立體圖。 圖5,係實施例1分割裝置全體構成之分解立體圖。 圖6,係表示把基板配置於分割裝置製品台上之狀態。 圖7,係實施例1分割裝置之刻線部之主要構成剖面 圖。 圖8,係分割時基板之變形例。 圖9,係在實施例1分割裝置中,表示基板之分割狀 態之剖面圖。 圖10,係在實施例1分割裝置中,表示基板之分割狀 態之俯視圖。 36 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁)The size of the clothing paper is in accordance with the Chinese National Standard (CNS) A4 (210 X 297 mm) 559620 A7 _____B7___ 5. The description of the invention (M) is used to perform blind scribing using the thermal deformation of glass materials. The structure of the second double-side scribing device 150 is also the same as that of the first double-side scribing device 144. The first division device 148 and the second division device 154 are used to divide the substrate such that the scribe lines S formed on both surfaces of the liquid crystal mother glass substrate 140 are divided. As described in the first or second embodiment, there is also a device that divides the left and right product tables so that their intervals are non-parallel, and rotates at least one of the left and right product tables. In Fig. 30, a first dividing device 148 is used in this type of dividing device, and the case where the intervals between the product tables 148a and 148b are non-parallel is shown. The first division device 148 and the second division device 154 include devices using other methods. As described in Example 5, two product tables on which the liquid crystal mother glass substrate 140 is placed and fixed, and one of the product tables is held by the parallel link mechanism shown in Figs. In addition, there is also a method in which the product table is rotated and divided by using an axis located at a position away from the score line as a rotation axis when the substrate is divided. In this case, the interval between the product tables 148a and 148b and the interval between the product tables 154a and 154b are flat as shown in FIG. 30. According to the dividing method of this embodiment, it is not necessary to flip the top and bottom of the mother glass substrate 140 In the process, it is not necessary to install a substrate turning device, and the installation area of the liquid crystal mother glass substrate dividing production line can be reduced. Industrial application possibility According to the brittle material substrate dividing device of the present case, because of a mechanism, when the substrate is divided, the division force will act on one end of the score line on the substrate where the scribing is completed, so the division of the substrate will be from the score line. One side of the paper progressed to the other 35 in order. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love). (Please read the precautions on the back before filling this page.) -------- Order -丨 丨 丨-. 559620 A7 ______ B7 ^ __ 5. Description of the invention (riding) 'One end side, so that the end face of the substrate is smooth. In addition, the division force applied is much smaller than that of the conventional division method, and the division device can be miniaturized. In addition, according to the method for dividing a brittle material substrate in the present case, in the process of dividing a liquid crystal mother glass substrate into a plurality of liquid crystal glass substrates, the two sides of the liquid crystal mother glass substrate can be divided in one process without turning over the substrate. Therefore, the number of reversal processes of substrate division is reduced. [Brief description of the drawings] FIG. 1 shows the state of vertical cracks when the glass plate is scribed. Fig. 2 is a perspective view of the main structure of a conventional dividing device using a dividing lever. Fig. 3 is a perspective view of the main structure of a conventional dividing device using a rotation of a product table to perform division. FIG. 4 is a perspective view of the entire configuration of the dividing device according to the first embodiment of the present invention. FIG. 5 is an exploded perspective view of the entire configuration of the dividing device of the first embodiment. FIG. 6 shows a state where a substrate is arranged on a product table of a dividing device. Fig. 7 is a cross-sectional view of a main configuration of a score line portion of the dividing device of the first embodiment. FIG. 8 shows a modification example of the substrate during division. Fig. 9 is a sectional view showing a divided state of a substrate in the dividing device of the first embodiment. Fig. 10 is a plan view showing a divided state of a substrate in the dividing device of the first embodiment. 36 Wood paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

-· n n 1 ϋ i_l ϋ 一 δ,· I ί n ϋ n I 559620 A7 ____B7______ 五、發明說明(;)〇 圖11,係本發明實施例2分割裝置全體構成之立體圖。 圖12,係實施例2分割裝置全體構成之分解立體圖。 圖13,係實施例2分割裝置之刻線部之主要構成剖面圖。 圖14,係在實施例2分割裝置中,表示基板之分割狀 態之剖面圖。 圖15,係本發明實施例3分割裝置主要構造之局部剖 開立體圖。 圖16,係在實施例3分割裝置中,表示把玻璃板配置 於製品台上之狀態之俯視圖。 圖17,係在實施例3分割裝置中,表示分割時之動作。 圖18,係表示液晶面板之層構造之放大剖面圖。 圖19,係本發明實施例4分割裝置主要構造之局部剖 開立體圖。 圖20,係本發明實施例5分割裝置主要構造之側視圖。 圖21,係在實施例5分割裝置中,表示把玻璃板配置 於製品台上之狀態之立體圖。 圖22,係在實施例5分割裝置中,表示玻璃板分割時 之動作之側視圖。 圖23,係在實施例5分割裝置中,表示玻璃板分割後 製品台之移動之側視圖。 圖24,係在實施例5分割裝置中,表示玻璃板分割後 讓玻璃板移動時之動作之側視圖。 圖25,係液晶母玻璃基板自動分割線之說明圖,表示 本發明實施例3脆性材料基板之分割方法之一例。 37 木紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 1®^------- —訂---------· A7 559620 __B7 ___ 五、發明說明(;)W ) 圖26,係表示習知脆性材料基板之分割方法之製程圖。 圖27,係表示實施例6分割方法之一例之製程圖。 〜圖28,係用於本發明實施例7分割方法之液晶母玻璃 基板之剖面圖。 圖29,係液晶母玻璃基板自動分割線之說明圖,表示 實施例7脆性材料基板之分割方法之一例。 圖30,係液晶母玻璃基板自動分割線之說明圖,表示 本發明實施例8脆性材料基板之分割方法之一例。 【符號說明】 11 滑動台 12 傾動台 13 第1製品台 14 第2製品台 15a 第1夾桿 16a 第2夾桿 G 基板 S 刻線 _ 38 幸、紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁)-· N n 1 ϋ i_l ϋ a δ, · I ί n ϋ n I 559620 A7 ____B7______ V. Description of the invention (;) 〇 FIG. 11 is a perspective view of the overall configuration of the dividing device according to the second embodiment of the present invention. FIG. 12 is an exploded perspective view showing the overall configuration of the splitting device of the second embodiment. FIG. 13 is a cross-sectional view of a main structure of a score line portion of a splitting device of Embodiment 2. FIG. Fig. 14 is a sectional view showing a divided state of the substrate in the dividing device of the second embodiment. Fig. 15 is a partially cutaway perspective view of a main structure of a dividing device according to a third embodiment of the present invention. Fig. 16 is a plan view showing a state where a glass plate is placed on a product table in the dividing device of the third embodiment. FIG. 17 shows the operation during division in the division device of the third embodiment. FIG. 18 is an enlarged sectional view showing a layer structure of a liquid crystal panel. Fig. 19 is a partially cutaway perspective view of a main structure of a dividing device according to a fourth embodiment of the present invention. FIG. 20 is a side view of a main structure of a dividing device according to Embodiment 5 of the present invention. Fig. 21 is a perspective view showing a state where a glass plate is placed on a product table in the dividing device of the fifth embodiment. Fig. 22 is a side view showing the operation when the glass plate is divided in the dividing device of the fifth embodiment. Fig. 23 is a side view showing the movement of the product table after the glass plate is divided in the dividing device of the fifth embodiment. Fig. 24 is a side view showing the operation when the glass sheet is moved after the glass sheet is divided in the dividing device of the fifth embodiment. Fig. 25 is an explanatory diagram of an automatic dividing line of a liquid crystal mother glass substrate, showing an example of a method for dividing a brittle material substrate in Embodiment 3 of the present invention. 37 Wood paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) 1® ^ ------- —Order ----- ---- · A7 559620 __B7 ___ V. Description of the invention (;) W) Figure 26 is a process diagram showing a conventional method for dividing a brittle material substrate. FIG. 27 is a process diagram showing an example of the division method in Embodiment 6. FIG. Fig. 28 is a sectional view of a liquid crystal mother glass substrate used in the division method of Example 7 of the present invention. Fig. 29 is an explanatory view of an automatic dividing line of a liquid crystal mother glass substrate, showing an example of a method for dividing a brittle material substrate in the seventh embodiment. Fig. 30 is an explanatory diagram of an automatic dividing line of a liquid crystal mother glass substrate, showing an example of a method for dividing a brittle material substrate in Embodiment 8 of the present invention. [Symbol description] 11 Sliding table 12 Tilt table 13 First product table 14 Second product table 15a 1st clamp rod 16a 2nd clamp rod G Substrate S engraving line_ 38 Fortunately, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling this page)

Claims (1)

A8B8C8D8 559620 六、申請專利範圍 1·一種脆性材料基板之分割裝置,其特徵在於:係具 有第1、第2製品台,將至少有1面形成刻線之脆性材料 ^板載置成,前述刻線位於兩製品台之間隔中; 第1製品夾單元,當把與前述第2製品台對向之前述 第1製品台之邊緣當作第1邊緣,與前述第1製品台對向 之前述第2製品台之邊緣當作第2邊緣時,對前述脆性材 料基板之位於前述第1邊緣的部分進行緊壓及固定; 第2製品夾單元,對前述脆性材料基板之位於前述第 2邊緣的部分進行緊壓及固定; 滑動機構,對前述脆性材料基板之刻線施加其直角方 向之預壓,使前述第1製品台及第1製品夾單元一起從前 述刻線後退; 傾動機構,把與前述脆性材料基板之刻線平行之傾動 軸當作旋轉軸,可使前述第2製品台及第2製品夾單元一 起轉動;及 轉動控制部,控制前述傾動機構來使前述第2製品台 及第2製品夾單元轉動; 前述第1製品台及第2製品台係配置成兩製品台之對 向邊緣不平行; 前述第2製品台之傾動軸係從前述脆性材料基板之刻 線來看會在基板的厚度範圍內。 2.如申請專利範圍第1項之脆性材料基板之分割裝置 ,其中前述第1製品夾單元係具有緊壓前述脆性材料基板 之刻線附近的第1夾桿,前述第2製品夾單元則具有緊壓 J;紙張尺度適用中國國家標準(CNS)A4規格(210 X 2971公楚0 " (請先閲讀背面之注意事項再填寫本頁) 訂-- 線丨·- 559620 韻 C8 D8 六、申請專利範圍 (請先閲讀背面之注意事項再塡寫本頁) 前述脆性材料基板之刻線附近的第2夾桿;當前述第2製 品台轉動之後,前述第2夾桿會當作對前述刻線附近之基 板部分施加剪力之施力點來產生作用。 3.如申請專利範圍第1項之脆性材料基板之分割裝置 ,其中前述第2製品台之傾動軸係位於前述脆性材料基板 之上面及下面之中心。 4·一種脆性材料基板之分割裝置,其特徵在於··係具 有第1、第2製品台,將至少有1面形成刻線之脆性材料 基板載置成,前述刻線位於兩製品台之間隔中; 第1製品夾單元,當把與前述第2製品台對向之前述 第1製品台之邊緣當作第1邊緣,與前述第1製品台對向 之前述第2製品台之邊緣當作第2邊緣時,對前述脆性材 料基板之位於前述第1邊緣的部分進行緊壓及固定; 線 第2製品夾單元,對前述脆性材料基板之位於前述第 2邊緣的部分進行緊壓及固定; 第1傾動機構,把與前述脆性材料基板之刻線平行之 傾動軸當作旋轉軸,可使前述第1製品台及第丨製品夾單 元一起轉動; 第2傾動機構,把與前述脆性材料基板之刻線平行之 傾動軸當作旋轉軸,可使前述第2製品台及第2製品夾單 元一起轉動;及 轉動控制部,控制前述第1及第2傾動機構來使前述 第1製品台和第1製品夾單元以及第2製品台和第2製品 夾單元轉動; 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 559620 as ___ D8 六、申請專利範圍 則述第1製品台及第2製品台係配置成兩製品台之對 向邊緣不平行;前述第1製品台之傾動軸係位於前述脆性 材料基板之刻線近旁之基板上側,而前述第2製品台之傾 動軸則位於前述脆性材料基板之刻線近旁之基板下側。 5·如申請專利範圍第4項之脆性材料基板之分割裝置 ’其中前述第1製品夾單元係具有緊壓前述脆性材料基板、 之刻線附近的第1夾桿,前述第2製品夾單元則具有緊壓 前述脆性材料基板之刻線附近的第2夾桿;當前述第1製 品台或第2製品台轉動之後,前述第1夾桿或前述第2夾 桿會當作對前述刻線附近之基板部分施加剪力和拉力之施 力點來產生作用。 6. 如申請專利範圍第4項之脆性材料基板之分割裝置 ,其中前述第1製品台之傾動軸和前述第2製品台之傾動 軸係從前述脆性材料基板之厚度中心位置來看位於上下對 稱之位置。 7. —種脆性材料基板之分割裝置,係於分成2個之製 品台固定上面已劃線之脆性材料基板,使至少一方之製品 台旋轉,藉以來分割前述脆性材料基板;其特徵在於: 讓前述製品台之旋轉中心軸具有相對於前述脆性材料 基板之劃線方向的既定角度。 8. 如申請專利範圍第7項之脆性材料基板之分割裝置 ,其中前述製品台,係利用排在相對於前述劃線方向所成 之既定角度之方向上之2支支撐柱來以可搖動的方式受到 支撐。 ______^ _ 用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閲讀背面之注意事項再填寫本頁) 、-口 線乂 559620 頜 __ 六、申請專利範圍 (請先閲讀背面之注意事項再塡寫本頁) 9. 如申請專利範圍第8項之脆性材料基板之分割裝置 ,係爲了能以3點支撐前述製品台而設置第3支撐柱,並 進一步設置使該支撐柱升降之機構。 10. —種脆性材料基板之分割裝置,係於分成2個之製 品台固定上面已劃線之脆性材料基板,使至少一方之製品 台旋轉,藉以來分割前述脆性材料基板;其特徵在於: 前述至少一方之製品台,係具備 6支伸縮自如的臂,至少有一部分不平行; 萬向接頭,設於前述各臂之兩端,並將前述製品台和 前述臂之一端以自由的角度予以連結;及 控制部,控制前述各臂之長度,以控制前述製品台之 一方之位置。 11. 一種脆性材料基板之分割方法,係申請專利範圍第 10項之脆性材料基板之分割裝置之分割方法;其特徵在於 對前述製品台透過既定間隔進行位置控制成同一平面 ,將預先形成有劃線之脆性材料基板,配合前述製品台間 之間隔而固定在前述製品台上; 使前述一方之製品台,沿著和形成於前述脆性材料基 板之刻線不平行而且和前述刻線不在同一平面上之旋轉軸 旋轉,藉以來將前述脆性材料基板沿著刻線分割開。 12. —種脆性材料基板之分割方法,係將貼合2塊脆性 材料基板而成之母貼合基板分割開,並從這裡獲得複數塊 小的貼合基板;其特徵在於具有以下步驟: ______4_—- 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) A8B8C8D8 559620 六、申請專利範圍 (1) 使用第1劃線裝置於前述母貼合基板一方基板表面 之既定位置形成刻線S1 ; (2) 使用第2劃線裝置,於前述母貼合基板他方基板表 面並且往和前述刻線S1相同之方向形成刻線S2 ;及 (3) 將兩面形成有刻線SI、S2之前述母貼合基板固定 於分割裝置之兩個製品台,使前述製品台之至少一方轉動 ’藉以來對前述刻線SI、S2施加拉應力或剪應力,而將前 述母貼合基板分割成複數塊。 13. 如申請專利範圍第12項之脆性材料基板之分割方 法,係在前述步驟(1)和前述步驟(2)之間設有將前述母貼合 基板之劃線面予以翻轉之翻轉裝置。 14. 如申請專利範圍第12項之脆性材料基板之分割方 法,其中前述步驟(3)之分割裝置係申請專利範圍第1或4 項之分割裝置。 15. —種脆性材料基板之分割方法,係將刻線未形成之 第1脆性材料基板和預先形成有刻線S2之第2脆性材料基 板貼合而成之母貼合基板分割開,並從這裡獲得複數塊小 的貼合基板;其特徵在於具有下列步驟: (1) 使用劃線裝置,於前述第1脆性材料基板之表面並 且往和前述刻線S2相同之方向形成刻線S1 ;及 (2) 將兩面形成有刻線SI、S2之前述母貼合基板固定於 分割裝置之兩個製品台,使前述製品台之至少一方轉動, 藉以來對前述刻線SI、S2施加拉應力或剪應力,而將前述 母貼合基板分割成複數塊。 $紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公笼) (請先閲讀背面之注意事項再填寫本頁) •1T 線 A8毁D8 559620 六、申請專利範圍 16_如申請專利範圍第15項之脆性材料基板之分割方 法,其中前述步驟(2)之分割裝置係申請專利範圍第1〜10 項中任一項之分割裝置。 17. —種脆性材料基板之分割方法,係將刻線未形成之 第1脆性材料基板和第2脆性材料基板貼合而成之母貼合 基板分割開,並從這裡獲得複數塊小的貼合基板;其特徵 在於具有下列步驟= (1) 使用兩面劃線裝置,於前述第1及第2脆性材料基 板之表面同時形成刻線SI、S2 ;及 (2) 將兩面形成有刻線SI、S2之前述母貼合基板固定於 分割裝置之兩個製品台,使前述製品台之至少一方轉動, 藉以來對前述刻線SI、S2施加拉應力或剪應力,而將前述 母貼合基板分割成複數塊。 18. 如申請專利範圍第17項之脆性材料基板之分割方 法,其中前述步驟(2)之分割裝置係申請專利範圍第1或4 項之分割裝置。 19. 如申請專利範圍第17項之脆性材料基板之分割方 法,其中前述步驟(1)之兩面分割裝置,係固定前述母貼合 基板,使用超硬金屬製或鑽石製之輪型刀來對前述第1及 第2脆性材料基板之表面進行劃線。 20. 如申請專利範圍第17項之脆性材料基板之分割方 法,其中前述步驟(1)之兩面分割裝置,係固定前述母貼合 基板,對前述第1及第2脆性材料基板之表面’利用雷射 光束進行加熱以及利用冷媒進行局部冷卻,藉以來進行盲 劃線。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公梦) (請先閲讀背面之注意事項再塡寫本頁)A8B8C8D8 559620 6. Scope of patent application 1. A device for dividing a brittle material substrate, which is characterized in that it has first and second product tables, and at least one side of the brittle material forming a score line is placed on the board. The line is located between the two product tables. The first product clamp unit shall treat the edge of the first product table opposite to the second product table as the first edge, and the first product table facing the first product table. When the edge of the 2 product table is used as the second edge, the part of the brittle material substrate located on the first edge is tightly pressed and fixed; the second product clamp unit is for the part of the brittle material substrate located on the second edge. Tightening and fixing; a sliding mechanism, which applies a preload in a right-angle direction to the engraved line of the brittle material substrate, so that the first product table and the first product clamping unit are retracted from the engraved line together; a tilting mechanism The tilting axis parallel to the engraved line of the brittle material substrate is used as the rotation axis, so that the aforementioned second product table and the second product clamping unit can be rotated together; and a rotation control unit, which controls the aforementioned tilting mechanism to The second product table and the second product clamp unit are rotated; the first product table and the second product table are arranged so that the opposing edges of the two product tables are not parallel; the tilting axis of the second product table is from the brittle material The scribe line of the substrate will be within the thickness of the substrate. 2. The device for dividing a brittle material substrate according to item 1 of the scope of the patent application, wherein the first product clamp unit has a first clamp lever that presses the vicinity of the score line of the brittle material substrate, and the second product clamp unit has Press J; paper size applies Chinese National Standard (CNS) A4 specification (210 X 2971 Gongchu 0 " (Please read the precautions on the back before filling in this page) Order-Line 丨 ·-559620 Rhyme C8 D8 VI 、 Scope of patent application (please read the precautions on the back before writing this page) The second clamp rod near the engraving line of the aforementioned brittle material substrate; when the second product table rotates, the second clamp rod will be regarded as the The substrate part near the line exerts a shearing force application point to produce the effect. 3. For example, the device for dividing a brittle material substrate according to item 1 of the patent application range, wherein the tilting shaft of the second product table is located on the brittle material substrate. And the center below. 4. A device for dividing a brittle material substrate, characterized in that: it has first and second product tables, and the brittle material substrate on which at least one side forms a score line is placed. The line is located between the two product tables. The first product clamp unit shall treat the edge of the first product table opposite to the second product table as the first edge, and the first product table facing the first product table. When the edge of the 2 product table is used as the second edge, the part of the brittle material substrate located on the first edge is tightly pressed and fixed; the line 2 product clamp unit is for the brittle material substrate located on the second edge. Partially press and fix; The first tilting mechanism uses the tilting axis parallel to the engraved line of the brittle material substrate as the rotation axis, so that the first product table and the product clamp unit can rotate together; the second tilting mechanism , Using the tilting axis parallel to the engraved line of the brittle material substrate as the rotation axis, the second product table and the second product clamping unit can be rotated together; and a rotation control unit to control the first and second tilting mechanisms to Rotate the first product table and the first product clamp unit, and the second product table and the second product clamp unit; The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 559620 as ___ D8 6. The scope of the patent application states that the first product table and the second product table are arranged so that the opposing edges of the two product tables are not parallel; the tilting axis of the first product table is located on the upper side of the substrate near the engraved line of the brittle material substrate. The tilting axis of the second product table is located on the lower side of the substrate near the engraved line of the brittle material substrate. 5. If the device for dividing a brittle material substrate according to item 4 of the patent application, 'wherein the first product clamp unit is The first clamping rod is pressed against the brittle material substrate and near the score line, and the second product clamping unit is provided with the second clamping rod near the score line of the brittle material substrate; when the first product table or After the product table is rotated, the first clamping rod or the second clamping rod acts as a point of application of a shearing force and a pulling force to the substrate portion near the score line. 6. For the device for dividing a brittle material substrate according to item 4 of the scope of patent application, the tilting axis of the aforementioned first product table and the tilting axis of the aforementioned second product table are located symmetrically from the center of the thickness of the aforementioned brittle material substrate. Its location. 7. —A device for dividing a brittle material substrate, which is fixed on the product table divided into two and fixes the scribed brittle material substrate on it, and rotates at least one product table to divide the aforementioned brittle material substrate; it is characterized by: The rotation center axis of the product table has a predetermined angle with respect to the scribe direction of the brittle material substrate. 8. As for the device for dividing a brittle material substrate according to item 7 of the scope of patent application, the aforementioned product table uses two support columns arranged in a direction at a predetermined angle with respect to the direction of the scribe line to swing it. Way is supported. ______ ^ _ Use Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) 、 口 线 乂 559620 Jaw __ VI. Patent application scope (please read first (Notes on the back are reproduced on this page.) 9. If the device for dividing a brittle material substrate in item 8 of the scope of the patent application, a third support column is provided to support the aforementioned product table at three points, and further support is provided for the support. Column lifting mechanism. 10. —A device for dividing a brittle material substrate, which is divided into two product tables to fix the scribed brittle material substrate, and at least one of the product tables is rotated to divide the aforementioned brittle material substrate; it is characterized by: At least one product table is provided with 6 telescopic arms, at least a part of which is non-parallel; universal joints are provided at both ends of the arms, and the product table and one end of the arms are connected at a free angle ; And a control section that controls the length of each of the aforementioned arms to control the position of one of the aforementioned product tables. 11. A method for dividing a fragile material substrate, which is a method for dividing a fragile material substrate dividing device for patent application No. 10; characterized in that the position of the aforementioned product table is controlled to a same plane through a predetermined interval, and a pre-formed The brittle material substrate of the line is fixed on the product table in accordance with the interval between the product tables; the product table of the one side is not parallel to the score line formed on the brittle material substrate and is not on the same plane as the score line The upper rotation axis rotates, thereby dividing the aforementioned brittle material substrate along the score line. 12. —A method for dividing a brittle material substrate, which is to divide a mother bonded substrate formed by bonding two brittle material substrates, and obtain a plurality of small bonded substrates from here; it is characterized by having the following steps: ______4_ —- This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) A8B8C8D8 559620 6. Scope of patent application (1) Use the first scribing device to form at a predetermined position on the surface of one of the substrates of the aforementioned mother laminated substrate Scribe line S1; (2) Use a second scribing device to form a scribe line S2 on the surface of the other substrate of the mother bonding substrate and in the same direction as the scribe line S1; and (3) form scribe lines SI on both sides, The aforementioned mother bonded substrate of S2 is fixed to two product tables of the dividing device, and at least one of the aforementioned product tables is rotated to 'divide the mother bonded substrate by applying tensile or shear stress to the score lines SI and S2. Into plural blocks. 13. If the method for dividing a brittle material substrate according to item 12 of the patent application range is provided between the foregoing step (1) and the foregoing step (2), a reversing device is provided for reversing the scribe surface of the aforementioned mother bonded substrate. 14. For the method of dividing a brittle material substrate according to item 12 of the patent application, wherein the dividing device of step (3) is the dividing device of item 1 or 4 of the patent application. 15. —A method for dividing a fragile material substrate is to divide a mother bonded substrate formed by bonding a first fragile material substrate on which a score line is not formed and a second fragile material substrate on which a score line S2 is formed in advance. Here are obtained a plurality of small bonded substrates; characterized in having the following steps: (1) using a scribing device, forming a score line S1 on the surface of the aforementioned first brittle material substrate and in the same direction as the aforementioned score line S2; and (2) Fix the aforementioned mother bonded substrate with scribe lines SI and S2 on both sides to the two product tables of the dividing device, and rotate at least one of the product tables, thereby applying tensile stress to the scribe lines SI and S2 or The mother bonded substrate is divided into a plurality of pieces by shear stress. $ Paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 male cage) (Please read the precautions on the back before filling this page) • 1T line A8 destroyed D8 559620 6. Scope of patent application 16_If you apply for patent scope The method for dividing a brittle material substrate according to item 15, wherein the dividing device of the aforementioned step (2) is the dividing device of any one of items 1 to 10 of the scope of patent application. 17. —A method of dividing a brittle material substrate, which is to divide a mother bonded substrate formed by laminating a first brittle material substrate and a second brittle material substrate that are not formed with scribe lines, and obtain a plurality of small patches from here. It is characterized by having the following steps = (1) using a double-sided scribing device to simultaneously form score lines SI, S2 on the surfaces of the aforementioned first and second brittle material substrates; and (2) forming score lines SI on both sides The aforementioned mother bonding substrate of S2 is fixed to two product tables of the dividing device, at least one of the aforementioned product tables is rotated, and the tensile bonding or shearing stress is applied to the score lines SI and S2, so that the mother bonding substrate is applied. Split into plural blocks. 18. For a method for dividing a brittle material substrate according to item 17 of the patent application, wherein the dividing device of step (2) is a device for applying item 1 or 4 of the patent application. 19. For example, the method for dividing a brittle material substrate according to item 17 of the patent application, wherein the two-sided dividing device of the aforementioned step (1) is to fix the aforementioned mother bonded substrate, and a super-hard metal or diamond wheel knife is used for alignment. The surfaces of the first and second brittle material substrates are scribed. 20. The method for dividing a brittle material substrate according to item 17 of the scope of the patent application, wherein the two-sided dividing device of the aforementioned step (1) fixes the mother bonding substrate and utilizes the surfaces of the first and second brittle material substrates. Laser beams are used for heating and refrigerants are used for local cooling. This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 public dreams) (Please read the precautions on the back before writing this page)
TW091114128A 2001-06-28 2002-06-27 Device and method for breaking fragile material substrate TW559620B (en)

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JP2009101692A (en) 2009-05-14
JP2009078569A (en) 2009-04-16
JP4482328B2 (en) 2010-06-16
JP4902631B2 (en) 2012-03-21
CN1259264C (en) 2006-06-14
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KR20030040392A (en) 2003-05-22
CN1464866A (en) 2003-12-31

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