TW559620B - Device and method for breaking fragile material substrate - Google Patents

Device and method for breaking fragile material substrate Download PDF

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Publication number
TW559620B
TW559620B TW91114128A TW91114128A TW559620B TW 559620 B TW559620 B TW 559620B TW 91114128 A TW91114128 A TW 91114128A TW 91114128 A TW91114128 A TW 91114128A TW 559620 B TW559620 B TW 559620B
Authority
TW
Taiwan
Prior art keywords
substrate
brittle
dividing
aforementioned
line
Prior art date
Application number
TW91114128A
Other languages
Chinese (zh)
Inventor
Haruo Wakayama
Noboru Hasaka
Masahiro Fujii
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2001196419 priority Critical
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Application granted granted Critical
Publication of TW559620B publication Critical patent/TW559620B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups

Abstract

A breaking device for a fragile material substrate is provided, in which a first product table (13) and a second product table (14) are disposed on a sliding table (11) and a tilting table (12), respectively, so that the edge parts thereof can provide specific angles, a substrate (G) having scribed both faces is put on the tables and fixedly pressed by a first clamp bar (15a) and a second clamp bar (16a), and a shearing force and a tension are applied to the substrate (G) at scribe lines (S) by the clamp bar as a pressing point when the second product table (14) is rotated, whereby, since the clamp bar with less clearance acts as a break point, the substrate (G) can be laterally divided into two parts.

Description

559620 A7 _ B7__ V. Description of the invention (丨) [Detailed description of the invention] [Technical field to which the invention belongs] The present invention relates to a dividing device for a brittle material substrate for dividing a brittle material substrate such as glass, semiconductor wafer, ceramic, and the like, and Its segmentation method. [Background Art] Fig. 1 shows a state where a glass plate 1 is scribed by using a glass cutting blade wheel 2. By this scribe line, a score line S is formed on the surface of the glass plate 1. In the figure, the cross section in the circular area is enlarged and shown in the figure below. B represents the depth of a vertical crack formed by using the scribe line. FIG. 2 shows a schematic configuration of a conventional dividing device generally used. In this dividing device, a glass plate 1 having a score line S formed on its inner surface is placed on a product table 3 with a mat M interposed therebetween. Above the glass plate 1 is a dividing rod 4. The divided rod 4 is formed by joining a hard rubber 4b having a V-shaped cross section under the rod-shaped metal material 4a, and is held in parallel with the glass plate 1 by a driving mechanism (not shown), and can move up and down freely. The lower end of the hard rubber 4b of the split rod 4 is pressed from above the glass plate so as to fit the score line S through the glass plate 1. In this way, the glass plate 1 will be slightly bent on the mat M, so that the vertical cracks reach the surface of the glass plate, and the glass plate 1 is divided along the score line S. FIG. 3 shows Japanese Patent Laid-Open No. 4- Another division method disclosed in 280828. The product stands 3a, 3b divided into two are arranged at an interval from each other. The glass plate 1 is based on the engraved line S formed on the upper surface of the glass plate. Fortunately, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------------- ----- Order --------- (Please read the notes on the back before filling out this page) 559620 A7 __B7______ V. Description of the invention (,) The way of the spacer is across the two product tables 3a, 3b Up and attracted and fixed. Furthermore, one of the product tables 3a is slightly rotated in the direction of the arrow along a rotation center axis 〇 parallel to the interval below, so that the glass plate 1 is bent and divided. By rotating the two product tables 3a and 3b simultaneously, the glass plate 1 can also be separated. In addition, when one of the product tables 3a is rotated and the self-product table 3b is released, the cut surface can be divided so that the cutting surface is not damaged. However, as shown in the lower diagram of FIG. 1 described above, the depth of the score lines is uniform, such as where Da and Db are deep. The dashed lines corresponding to Da and Db are represented by Sa and Sb. When the glass plate 1 is divided by the above method, even if a uniform dividing force is applied to the glass plate 1, the division of the glass plate 1 will not be performed uniformly, and the division of the glass plate will be represented by Sa and Sb. Place to finish first. That is, at this position, the vertical crack will reach below the glass plate 1. Then, the division of the glass plate 1 will proceed in the direction of the scribing line starting from the points Sa and Sb. Therefore, in the conventional division method, the division of the glass plate 1 is performed at a place where plural lines in the score line are used as starting points, so the division surface becomes screen-like and curved, and there is a disadvantage that the product price is reduced. In addition, in order to prevent the generation of dust during scribing, it is also under review whether to use a laser beam for scribing. In the laser scribing, the laser beam is irradiated on the glass plate and moved. The cooling by the point of the refrigerant will follow the laser beam. In this way, fine scribe lines are formed on the glass plate by utilizing the thermal deformation of the glass plate. The ruled line is thin and invisible to the naked eye, so the scribing method is also referred to as blmd-scnbe. However, for a glass sheet that has been blindly scribed, when the conventional dividing device is used to perform the division, the Chinese paper standard (CNS) A4 (210 X 297 mm) is applicable due to the blind paper sizing. ) (Please read the precautions on the back before filling this page) -------- Order --------- Xiantai 559620 A7 _ B7____ V. Description of the invention (4) Shallow depth of cracks Therefore, a large splitting force is required. Therefore, there is a problem that the device becomes large and cannot be separated at all. (Please read the precautions on the back before filling this page) [Disclosure of the invention] The present invention was developed in view of the conventional problems described above, and its purpose is to realize a device and method for dividing a brittle material substrate. For various shapes of brittle material substrates, it can reduce the division force applied to the substrate and obtain a uniform division surface. The dividing device of the present invention is characterized in that it has first and second product tables, and a brittle material substrate having at least one side forming a score line is placed, and the aforementioned score line is located between the two product tables; the first product clip When the edge of the first product table facing the second product table is regarded as the first edge, and the edge of the second product table facing the first product table is regarded as the second edge, The part of the brittle material substrate located on the first edge is tightly pressed and fixed; the second product clamp unit is used for pressing and fixing the part of the brittle material substrate located on the second edge; and a sliding mechanism is used for the brittle material. The scribe line of the substrate applies a preload in a right-angle direction, so that the first product table and the first product clamp unit are retracted from the scribe line together: a tilting mechanism that uses a tilt axis parallel to the scribe line of the brittle material substrate as rotation The shaft can rotate the second product table and the second product clamp unit together; and a rotation control unit that controls the tilting mechanism to rotate the second product table and the second product clamp unit; the first product table The second product stage is arranged so that the opposing edges of the two product stages are not parallel; the tilting axis of the second product stage is within the thickness range of the substrate from the engraved line of the brittle material substrate. 5 The size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) '" 559620 A7 — ____ Β7 ___ V. Description of the invention (times) In addition, the dividing device of the present invention is characterized in that: In the second product table, at least one side of a brittle material substrate forming a score line is placed, and the aforementioned score line is located between the two product tables. The first product clamp unit is to face the aforementioned second product table. When the edge of the first product table is regarded as the first edge, and when the edge of the second product table facing the first product table is regarded as the second edge, the portion of the brittle material substrate located on the first edge is tightened. Pressing and fixing; the second product clamping unit for tightly pressing and fixing the part of the brittle material substrate located on the second edge; the first tilting mechanism uses the tilt axis parallel to the score line of the brittle material substrate as rotation The shaft can rotate the first product table and the first product clamp unit together; the second tilting mechanism uses the tilting axis parallel to the engraved line of the brittle material substrate as a rotation axis, which enables the second product table and the first product clamp unit to rotate. 2 The product clamp unit rotates together; and the rotation control unit controls the first and second tilting mechanisms to rotate the first product table and the first product clamp unit, and the second product table and the second product clamp unit; the first product The table and the second product table are arranged so that the opposite edges of the two product tables are not parallel; the tilting axis of the first product table is located on the upper side of the substrate near the score line of the brittle material substrate, and the tilting axis of the second product table It is located on the lower side of the substrate near the score line of the aforementioned brittle material substrate. In addition, the dividing device of the present invention is based on the division of two product tables to fix the scribed brittle material substrate, and at least one of the product tables is rotated to divide the aforementioned brittle material substrate; The rotation center axis has a predetermined angle with respect to the scribe direction of the brittle material substrate. 6 Applicable to Chinese National Standard (CNS) A4 specification (210 X 297 mm). (Please read the precautions on the back before filling this page) tr --------- A7 559620 ( <) In addition, the dividing device of the present invention is based on dividing the two brittle material substrates which are divided into two product tables to fix the scribed brittle material substrate thereon, and rotating at least one of the product tables to divide the aforementioned brittle material substrate; At least one product table is provided with 6 telescopic arms, at least a part of which is not parallel; universal joints are provided at both ends of the aforementioned arms, and the aforementioned product table and one of the arms are connected at a free angle ; And a control section that controls the length of each of the aforementioned arms to control the position of one of the aforementioned product tables. Secondly, the method for dividing a brittle material substrate according to the present invention is characterized in that the position of the aforementioned product table is controlled to a same plane through a predetermined interval, and the brittle material substrate with a scribe line formed in advance is fixed in accordance with the interval between the product tables. On the aforementioned product table; making the aforementioned one product table rotate along a rotation axis that is not parallel to the engraving line formed on the brittle material substrate and is not on the same plane as the engraving line; The line is split. In addition, the method for dividing a brittle material substrate of the present invention is to divide a mother bonded substrate formed by bonding two brittle material substrates, and obtain a plurality of small bonded substrates from the mother bonded substrate; it is characterized by having the following steps: (1) Use a first scribing device to form a scribe line S1 at a predetermined position on the surface of one substrate of the mother bonding substrate; (2) Use a second scribing device to apply a second scribing device to the surface of the other substrate of the mother bonding substrate and go to the foregoing The engraved line S2 is formed in the same direction as the line S1: and (3) the aforementioned mother bonded substrate on which the engraved lines SI and S2 are formed on both sides is fixed to two product tables of the dividing device, so that at least one of the aforementioned product tables is rotated, and since A tensile stress or a shear stress is applied to the score lines SI and S2, and the mother bonded substrate is divided into a plurality of pieces. 7 Wood paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) -------- Order -------- -Line * A7 559620 V. Description of the invention (k) The method of dividing the brittle material substrate of the present invention is to paste the first brittle material substrate without the scribe line and the second brittle material substrate with the scribe line S2 formed in advance. The combined mother bonded substrate is divided, and a plurality of small bonded substrates are obtained from it; it is characterized by the following steps: (1) using a scribing device on the surface of the aforementioned first brittle material substrate and toward The scribe line S1 is formed in the same direction as the scribe line S2; and (2) the aforementioned mother bonded substrate on which the scribe lines S1 and S2 are formed on both sides is fixed to two product tables of the dividing device, and at least one of the product tables is rotated, By applying tensile or shear stress to the score lines SI and S2, the mother bonded substrate is divided into a plurality of pieces. In addition, the method for dividing a brittle material substrate according to the present invention is to divide a mother bonded substrate formed by bonding a first brittle material substrate and a second brittle material substrate which are not formed with scribe lines, and obtain a plurality of small pieces from here. Laminating substrates; characterized in having the following steps: (1) using a double-sided scribing device to simultaneously form score lines SI, S2 on the surfaces of the aforementioned first and second brittle material substrates; and (2) forming score lines on both sides The aforementioned mother bonding substrates of SI and S2 are fixed to the two product tables of the dividing device, and at least one of the product tables is rotated, and the aforementioned mother films are bonded by applying tensile stress or shear stress to the score lines SI and S2. The substrate is divided into a plurality of pieces. [Best Embodiment of the Invention] (Embodiment 1) A division device according to Embodiment 1 of the present invention will be described with reference to the drawings. Fig. 4 is an external perspective view of the entire configuration of the dividing device 10 of the first embodiment. This dividing device 10 is called a single tilting dividing machine. The substrate G to be divided is a brittle material substrate such as glass. 8 Wood paper size applies to China National Standard (CNS) A4 (210 X 297 mm) " ------------------ Order --------- Line ^^ " (Please read the notes on the back before filling this page) 559620 A7 ___B7______ V. Description of the Invention (^)) For the convenience of explanation, the space coordinates (X, y, Z) are used to designate and divide The reference plane of the product table on which the device 10 is arranged parallel to the ground is U, y, z. ), The direction perpendicular to the ground is the z-axis, and the division direction of the substrate G is the y-axis. The dividing device 10 is provided with a slide table 11 capable of sliding in the -X axis direction, and a tilt table 12 capable of tilting about a rotation axis parallel to the y axis as a center and sliding adjustment in the X axis direction. FIG. 5 is a perspective view showing the left unit 10A and the right unit 10B of the dividing device 10 in a separated state. When the entire dividing device 10 is mounted on the base 17 of FIG. 4, the left unit 10A refers to a mechanism portion provided on the left side (-X axis direction) of the scribe line S of the substrate G as shown in FIG. 4, and the right unit 10B It refers to a mechanism portion provided on the right side (+ x-axis direction) of the scribe line S of the substrate G. In order to mount and hold the substrate to be cut, the first product stage 13 is fixed to the slide stage 11, and the second product stage 14 is fixed to the tilting stage 12 °. Furthermore, the first product stage 13 is mounted above the first product stage 13. One product clamp unit 15 ′ attaches a second product clamp unit 16 to an upper portion of the second product table 14. The engraved line S of the substrate G is parallel to the y axis, and the area on the x-axis side (left side) of one of the substrates is referred to as the left portion GL of the substrate, and the area on the + x-axis side (right side) is referred to as the substrate. Right GR. The first product clamp unit 15 strongly presses the left end portion of the substrate left portion GL to fix the substrate, and the second product clamp unit 16 strongly presses the right end portion of the substrate right portion GR to fix the substrate. The left unit 10A is provided with a sliding mechanism 11a. The sliding mechanism 1 is configured to elastically press the sliding table 11 in the -X axis direction, and is provided with an elastic member for applying an elastic pressure, such as an air cylinder, a spring, and the like. The sliding mechanism 11a is also limited to slide 9__ The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) -------- Order --------- Line * 559620 A7 _____B7__ V. Description of the invention (3) Range limiter, damper (damper) to limit sliding speed, etc. (not shown). The right unit 10B is held by a pair of horizontal holding block upper portions 18 and a pair of horizontal holding block lower portions 19 as one of the pillars. The lower portion 19 of the horizontal holding block is fixed to the base 17, and the upper portion 18 of the horizontal holding block holds the tilting table 12 in a rotatable manner. A sliding unit (not shown) is provided between the horizontal holding block upper portion 18 and the horizontal holding block lower portion 19, and the horizontal holding block upper portion 18 can be slid and adjusted in the X-axis direction. In addition, a tilting shaft 18a is provided at the upper portion 18 of the horizontal holding block on the + y-axis and -y-axis sides, and the tilting table 12, the second product table 14, and the second product clamp unit 16 are held so that the tilting shaft 18a can rotate The moving shaft is tilted. The tilting shaft 18a is provided with, for example, a bearing housing at the upper portion 18 of the horizontal holding block, and is held by a ball bearing pressed into the bearing housing. Here, the horizontal holding block upper part 18 and the tilting shaft 18a are called a tilting mechanism. The first product clamp unit 15 is used to fix the left part GL of the substrate and concentrate the shear stress and bending stress on the score line of the substrate. The first product clamping unit 15 is provided with a first clamping lever 15 a that presses the substrate G near the score line S. The tip of the first clamp lever 15a is located on the right edge of the first product table 13 and can move slightly in the z-axis direction. The second product clamp unit 16 is similarly used to fix the right part GR of the substrate and concentrate the shear stress and bending stress on the score line of the substrate. The second product clamp unit 16 is provided with a second clamp lever 16a for pressing the vicinity of the engraved line S of the substrate G. The tip of the second clamp lever 16a is located on the left edge of the second product table 14 and can move slightly in the z-axis direction. Fig. 6 is a plan view showing the positional relationship between the first and second product tables 13, 14; The main shaft system of the first product clamp unit 15 including the first clamp lever 15a is installed obliquely so that the + y-axis side only has an opening angle of -α. In addition, it contains the second clamp rod 16a 10-------------------This paper size applies the Chinese National Standard (CNS) A4 specification (210 χ 297 mm)- -------- · Λ ---------- Order --------- line (Please read the precautions on the back before filling this page) A7 559620 V. Description of the invention (1) The main shaft of the second product clamp unit 16 is installed obliquely so that only the opening angle + α is on the + y-axis side. A gap is formed between these product stands 13 and 14. As shown in FIG. 6, the first product table 13 is rotated on the slide table 11 with the rotation axis 13a as the center in the (X, y) plane in a counterclockwise direction to adjust only a slight angle. The second product table 14 is pivoted on the tilting table 12 in the (X, y) plane in the clockwise direction with the rotation axis 14a as the center. Four corners of the first product table 13 are provided with screw holes 13b to 13e which have a long diameter in the tangential direction when viewed from the rotating shaft 13a. Similarly, four corners of the second product table 14 are provided with screw holes 14b to 14e which have a long diameter in the tangential direction when viewed from the rotation shaft 14a. Therefore, the first product table 13 is rotated around the rotation shaft 13a only by the angle -α, and the bolts of the screw holes 13b to 13e are locked to the slide table 11 at this position. In this way, the first product table 13 is moved together with the first clamp lever 15a from the position shown by the chain line at 2 points in FIG. 6 to the position shown by the solid line and can be fixed there. The second product table 14 is also the same as the first product table 13. With such an angle adjustment, the opening angle of the first clamp lever 15a and the second clamp lever 16a can be set to 2α. As a method for holding the substrate G, the substrate can be fixed to the product table by vacuum suction or other means. When the substrate is glass and a resin film is formed on the surface, the substrate may be fixed by electrostatic adsorption. The tilting mechanism of the tilting table 12 will be described. As shown in FIG. 4 and FIG. 5, the tilting axis 18 of the upper portion 18 of the horizontal holding block is a rotation axis so that the entire right-side unit 10B except the lower portion 19 of the horizontal holding block can rotate clockwise or counterclockwise. . Fig. 7 is a sectional view of a main part of a dividing device showing a mounting position of the tilting shaft i8a. In order to make the tilting table 12-rotation 11 wood paper standard through the tilting mechanism, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applicable " I (Please read the precautions on the back before filling this page) f—— Order- -------- Line win A7 559620 V. Description of the invention (L.) It is provided with a rotation control section 20. The rotation control unit 20 may be constituted by using the rotation force of a motor or a fluid pressure cylinder to rotate the tilting table 12 only by a predetermined angle, or may be manually rotating the tilting table 12 through an arm, a link, or the like. Constructor. At the same time, the tilting table 12 series will also move in the + X direction at the same time. In the initial setting of the dividing device, the first product stage 13 and the second product stage 14 are positioned so as to have the same mounting surface with respect to one substrate G. The height of the tilting shaft 18a is adjusted to the center of the tilting shaft 18a as viewed from the upper and lower surfaces of the substrate G placed on the product table. Let the thickness of the substrate G be 2d. . The placement surface of the first product table 13 is (X, y, -do) 'and the position of the tilting axis 18a is (0, y, 0). The position of the tilting axis 18a can be adjusted according to the thickness, material, and the like of the substrate G. In addition, assuming that the gap between the right edge of the first product table 13 and the left edge of the second product table 14 is 2g, the pressing position of the first clamping rod 15a to the substrate G and the second clamping rod 16a to the substrate G The clearance at the pressing position is as shown in FIG. 7, and it is desirable that the interval between the pressing positions of the closest part is about the same as 2 g. Further, it is preferable that the tilt axis 18a is parallel to the engraved line of the substrate G and is located within the thickness range of the substrate. Next, the operation of the dividing device having such a mechanism will be described. Assume that the substrate G is a laminated glass for a liquid crystal panel, and as shown in FIG. 8 (a), it is provided with various electrodes formed on the inner substrate G1 (0.7 mm thick) and the lower substrate G (0.7 mm thick). ), And a liquid crystal is enclosed in the interval (0.1 mm). The thickness of the substrate in this case is 2d. It is 1.50mm. In addition, as shown in FIG. 8 (a), the upper surface of the upper substrate G1 and the lower surface of the lower substrate G2 are 12 books, and the paper size is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297). ---- Λ ---------- Order --------- line (please read the notes on the back before filling this page) 559620 A7 __B7___ V. Description of the invention (u), The scribe lines SI and S2 are respectively formed in advance at the same position as viewed from the (X, y) plane. The method of forming the scribe lines SI and S2 is the same as that in the conventional example. The part with high shear or tensile stress will become the glass substrate. Split point. Figure 9 is a partial enlarged cross-sectional view of a dividing device centered on a scribe line S. Also, Fig. 10 is a plan view of a main part of the dividing device centered on a scribe line S using a 2-point chain line. Here The solid line is used to represent the position of the substrate G after division. The position (X, y, z) of the tilting axis 18a is (0, y, 0). As shown in FIG. 10, in the left portion GL of the substrate after division, Let the end point of the + y-axis side of the engraved line S2 in FIG. 8 be PL, and let the end point of a y-axis side be ql. Also, let the left side of the substrate GL and the right edge of the first product table 13 contact + y The end point on the axis side is PL '' and The end point on the y-axis side is QL '. Furthermore, in the right part GR of the substrate after division, let the end point on the line where the right part GR of the substrate touches the left edge of the second product table 14 + the y-axis side is PR', The end point on the -y axis side is QR '. Before the substrate G is divided and cut, PR and PL are the same, and QR and QL are the same. As shown in Fig. 9 (a), the second product stage should not be used. When the counterclockwise direction is only inclined at an angle of 0, the position of the point PR 'moves from (xi, yi, Zl) to (X2, y2, Z2). Here, each coordinate 値 is shown below. X1 = g2 yi = yi zi = —do X2 = d〇sin Θ 4- g2C〇s Θ y2 = yi Z2 = d〇 (1-cos 0) + g2 sin 0 — d〇13 This paper size applies the Chinese National Standard (CNS) A4 specification ( 210 x 297 Gongchu) --- (Please read the notes on the back before filling out this page) -------- Order ---------. 559620 A7 _____B7_ V. Description of the Invention (Borrowed Based on the tight pressure of the second clamp rod 16a, set the part PR '(χ2, y2, Z2) of the right part GR of the base plate to the fixed point relative to the second product table 14, the shear force and tension will change from the aforementioned fixed point. To act on the divided part of the point PR at the right GR of the substrate. The tension is similarly applied to the point QR in Fig. 9 (b). However, the position of the score line S2 seen from the point PR 'and the position of the score line S2 seen from QR' are different as shown in Figs. 9 and 10 Compared with the + y-axis side (opposite side), the shear stress and tensile stress on the -y-axis side (this side) are larger. Even if the Young's coefficient of the glass material is the same in both parts, the front end portion of the right-side GR-end support of the left-side GL of the substrate that does not rotate moves is the most front-end portion of FIG. 9 (b) than FIG. 9 ( The occasion of a) is short. Therefore, as shown in Fig. 9 (b), the foremost end portion of the one-end support is harder to relieve the shear stress than in the case of Fig. 9 (a). Therefore, the points QR and QL become division points and the lower substrate G2 is divided. Here, when the second product table 14 is tilted in the clockwise direction, as in the case of tilting in the counterclockwise direction, shear stress and tensile stress act on the scribe line S1 of the upper substrate G1, and the upper substrate G1 is divided. Come. When the substrate G is cut, by the sliding mechanism 11a, the spring pressure in the _x axis direction will act on the left portion GL of the substrate, and the tilting table 12-while starting to rotate, moves in the + x axis direction, and the right edge portion (Cross section of the substrate left portion GL) Backward in the -X axis direction without contacting the left edge portion of the substrate right portion GR. Therefore, no defects occur on the divided surface of the glass substrate and a smooth divided surface is obtained. After the substrate G is divided, the position of the point PR is moved from (X3, y3, Z3) to (X4, ys z〇. Here, each coordinate 値 is shown below. X3 = 0 14 The Chinese paper standard is applicable to the CNS) A4 specification (210 X 297 mm) ---------- ^ ---------- Order --------- line ^^ (Please read the note on the back first Please fill in this page again for details) 559620 ____B7__ 5. Description of the invention (l >)) y3 = Υ3 ZO3 = one do χ4 = d〇sin0 y4 = y3 Z4 = d〇 (1 — cos 0) — d〇 When the horizontal movement amount h- is 3 °, the result is 0.039mm. Fig. 8 (b) shows the case where the right GR of the substrate rotates counterclockwise, and Fig. 8 (c) shows the longitudinal section and cut of the substrate when the right GR of the substrate rotates counterclockwise. Face back. The substrate is divided into left and right substrates at the scribe line S, and the substrates GR and GL can be removed from the product table by separating the first clamp rod 15a and the second clamp rod 16a from the substrate. In order to divide one substrate having a strip shape in the X-axis direction into a plurality of portions, a scribe line is formed at a predetermined position on the substrate G, respectively. Then, the substrate G is conveyed by a predetermined pitch in the X direction, a product clamping unit is set, and the tilting table 12 is tilted. By repeating these operations, a plurality of substrates can be manufactured from one mother substrate. (Embodiment 2) Next, a division device according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 11 is an external perspective view showing the entire configuration of the dividing device 30 according to the second embodiment. This dividing device 30 is called a two-tilt dividing machine. For convenience of explanation, it is assumed that the reference plane of the table parallel to the bed surface of the dividing device 30 is (x, y), the direction perpendicular to the bed surface is the ζ axis, and the division direction of the substrate is the y-axis. The separating device 30 has a rotation axis parallel to the y-axis, and has first and second tilting tables 31 and 32 capable of tilting. 15 The size of the paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 Gongchu) (Please read the precautions on the back before filling this page) -------- Order -------- -Line * A7 559620 V. Description of the invention (Vfire) FIG. 12 is a perspective view showing a state where the left unit 30A and the right unit 30B of the split device 30 are separated. The entire system of the dividing device 30 is mounted on the base 37 as shown in FIG. 11 through the holding blocks% and 39. The first product table 33 is fixed to the first tilting table 31, and the second product table 34 is fixed to the second tilting table 32. As in the first embodiment, a first product clamp unit 35 is mounted on the first product table 33, and a second product clamp unit 36 is mounted on the second product table 34. The functions of these clamp units are also the same as those of the first embodiment, so the description of the mechanism is omitted. The first tilting table 31, the first product table 33, and the first product clamp unit 35 are held by a first holding block 38 as a pillar. The second tilting table 32, the second product table 34, and the second product clamp unit 36 are held on a second holding block 39 as a pillar. As shown in FIG. 11, the distance between the pillars of the second retaining block 39 is wider than the distance between the pillars of the first retaining block 38. When in the normal position (action position), the left unit 30A and the right unit 30B are mounted on the base 37. After that, all the pillars are roughly aligned on the y-axis. Assuming that the tilting axis of the first retaining block 38 is 38a and the tilting axis of the second retaining block 39 is 39a, as shown in FIG. 13, the tilting axis 38a and the tilting axis 39a are assumed to be from the reference position of the dividing device (χοM, ζ.), it is roughly symmetrical in the z-axis direction and is located near the score lines SI and S2. The reference position is. , 7. ,2. ) Is assumed to be the same as in Example 1, and is located at the intermediate position (0, y, 0) between the scribe lines SI and S2 of the substrate 0. If the center position of the thickness of the substrate G is z = 0, the position of the tilting axis 38a on the z axis is preferably OmmS 20mm, and the position of the tilting axis 39a is 1 cb, which is preferably 20mm € to dd Omm. 16 The paper and paper size are applicable to the Chinese National Standard (CNS) A4 specification (210 χ 297 mm) ---------- ^ ---------- Order ------- --Line (please read the precautions on the back before filling this page) A7 559620 V. Description of the invention (The installation position of the first clamp lever 35a and the second clamp lever 36a is the same as that in the embodiment. The first holding arm 38b rotates freely around the first tilting shaft 38a, and holds the first tilting table 31 at an arbitrary angle. Here, the first holding arm 38b and the first tilting shaft 38a are referred to as a first tilting mechanism. Similarly, The second holding arm 39b is rotatable around the second tilting shaft 39a, and holds the second tilting table 32 at an arbitrary angle. Here, the second holding arm 39b and the second tilting shaft 39a are referred to as a second tilting mechanism. The rotation control unit 40 may use the rotational force of a motor or a fluid pressure cylinder to rotate the first tilting table 31 and the second tilting table 32 by a predetermined angle. The tilting tables 31 and 32 may be manually operated through an arm or a link. The first holding arm 38b and the second holding arm 39b may hold the first tilting table 31 and the second tilting table 32 and ( The x, y) planes are parallel, that is, keep horizontal. Here, the main shaft of the first product clamp unit 35 containing the first clamp lever 35a is installed obliquely so that its + y-axis side spreads out-α angle, and contains the second clamp lever The main axis of the second product clamp unit 36 of 36a is installed obliquely so that its + y-axis side open + α angle. Assuming that the thickness of the substrate G is 2d〇, here is an example to cut the laminated glass for the liquid crystal panel. In the case of a substrate. Assume that the mounting surface of the first product table 33 is (x, y, d0), and the position of the tilting axis 38a is (0, y, + d2) as shown in FIG. 13. This position may also be It is adjusted according to the thickness, material, etc. of the substrate. Also, it is preferable that the tilting axes 38a and 39a are located at symmetrical positions with respect to the center position of the substrate, that is, ch = d2. Also, suppose the first The right edge of the product table 33 and the left 17 of the second product table 34. The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm). &Quot; " (Please read the precautions on the back before filling this page. ) -------- Order -------- · Line 1 559620 A7 B7 V. Description of the Invention (α) The gap between the edges is 2g, then the first clamp rod 35a presses the substrate G The pressing position of the second clamp lever 36a against the substrate G is close to the edges as shown in FIG. 13, and the interval between the pressing positions of the closest parts is preferably approximately the same as 2g. The operation of the device 30 will be described. Fig. 14 is a partially enlarged sectional view of the division device centered on the scribe line S. Fig. 10 is a plan view of a main part of the division device centered on the scribe line S. As described above, the position of the first tilting axis 38a is (0, y, cL ·), and the position of the second tilting axis 39a is (0, y, d2). Fig. 14 (a) is a cross-sectional view near the PR point and the PL point in Fig. 10. FIG. 14 (b) is a sectional view near the QR and QL points in FIG. Here, the distance between the edge of the first product table 33 and the second product table 34 is 221 mm. < 22). As shown in FIG. 14, first, the second product table 34 is inclined at an angle of 0 clockwise, and then the first product table 33 is inclined at an angle of 6> clockwise. As in Example 1, it is assumed that the pressing point of the right GR of the substrate to the second product stage 34 is PR '. This point PR 'can be regarded as a point of application of shear stress when the substrate G is divided along the score line S. Now consider a case where the second product table 34 is first rotated in the clockwise direction by an angle Θ. The position of PR 'is moved from (x5, y5, Z5) to (X6, y6, Z6). Here, each coordinate system is shown below. X5 = g2 y5 = y5 Z5 = — d〇X6 = (d2—d〇) sin0 + g2C〇n0 18 Take the paper size and apply the Chinese National Standard (CNS) A4 specification (210 x 297 male f) ----- ------ ^ -------- Order --------- line ^^ * (Please read the notes on the back before filling this page) 559620 A7 ------ -B7 ____ V. Description of the invention (Ά) Y6 = ys Z6 = — (d2—d〇) (l — con (9) — g2sin (9 — do) In this way, the right part of the substrate GR (X6, y6, Z6) The part becomes a fixed point with respect to the second product table 34, and the shear stress and tensile tension act on the divided part of the point PR located on the right GR of the substrate from the fixed point. Such shear stress and tensile tension are also shown in the figure. The point QR shown in 14 (b). However, the distance from the point PR to the score line S2 is different from the distance from the point QR 'to the score line S2 as shown in FIG. , QR has a large shear stress and tensile stress. Even if the Young's coefficient of the glass material is the same in both parts, the shear stress, tensile stress, and bending of the front end of the substrate GR on the left side GL of the substrate can be supported The stress is smaller than that of QR. This is because the cantilever supports the front end As shown in FIG. 14 (a), the stress is relieved due to elastic deformation. Therefore, the point QR with a high stress becomes a dividing point, and the upper substrate G1 is divided. Next, when the first product table 33 is made smooth When the clock direction is tilted by Θ angle, 'the shear stress and tensile stress are applied to the score line S2, and the lower substrate is divided. In this case, the PL point and the QL point of the GL on the left side of the substrate' will be the same as described above Generated by the rotation of the two product tables, with the engraved line S as the center, the tensile stress will act in the -X axis direction and the + x axis direction, and the shear stress will act in the z axis direction and the + z axis direction, so The substrate G can be easily divided. When dividing, the substrate left portion GL and the substrate right portion GR are separated from each other. In this case, the right edge portion of the divided surface does not contact the left edge portion of the substrate right portion GR. Therefore, the glass substrate The cut surface will not be scratched and a smooth cut surface can be obtained. 19 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (21〇x 297 公 楚 1 " (Please read the precautions on the back before filling this page) ) -------- Order --------- Line Win 559620 A7 ___B7___ V. Invention Explanation (1¾) If the horizontal movement amount of the point PR is calculated, then (d〇 + d〇Sm0, in the case of d2 = 5.0mm'd0 = 0.75mm'0 = 3 ', its 値 is 0.300mm, which is more than the implementation The horizontal movement of 0.039mm in Example 1 is much larger. If the movement in the vertical direction of the point PR is calculated, (d0 + d2) (l — con6 ») is used. If the above number is substituted, it can be obtained. The vertical movement amount is 0.079 mm. This chirp will affect the shear stress of the scribe line S. The substrate divided into the left and right by the score line S can be removed from the product table by releasing the pressing force of the first clamping lever 35a and the second clamping lever 36a. In addition, the first tilting table 31 and the second tilting table 32 are tilted alternately at the same angle. However, the tilting angles may be different for each tilting table, and no matter which tilting table is tilted first, the division characteristics of the substrate G are not affected. . As described above, regardless of which division device is used, the end face side in front of the substrate G is the starting point of the division, and the division proceeds from the eye to the inside in order. In this dividing device, since the starting point of the division of the substrate is one point, the magnitude of the force acting on the substrate can be made much lower than the conventional division method. In addition, the split end surface is completely made, so that the situation in which the split end surface described in the conventional technique is not good does not occur. In the device of the present invention, the mounting position, height, etc. of each holding block can be easily changed, and the rotation amount of the product table, the opening angle 2α, etc. can be arbitrarily set, so the degree of freedom in design becomes higher. In this embodiment, the case where the score lines S1 and S2 formed on the bonded glass substrate for a liquid crystal panel are viewed from the (x, y) plane as the same position has been described, even though the positions of SI and S2 are due to the presence of liquid crystal. The terminals of the panel need to be formed and separated by several mm, and the dividing device can also be used for division without difficulty. In addition, the dividing device of this embodiment is not only capable of dividing and bonding glass. When the size of the 20-wood paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) ---------- ^- -------- Order --------- line ^^ · (Please read the notes on the back before filling in this page) 559620 A7 ___B7 _____ V. Description of the Invention (^) Sheet glass can also be divided into fragile material substrates such as semiconductor wafers and ceramic substrates. Especially in the case of bonding a glass substrate like a liquid crystal panel, the upper and lower glass plates can be alternately separated by using an alternate division operation, and at the same time, the process of inverting the substrate is not required, so the operation efficiency can be greatly improved. The dividing device of the present invention can also be applied to use a heating mechanism such as a laser to heat a brittle material substrate and divide the brittle material substrate formed with a score by thermal deformation generated on the brittle material substrate. (Embodiment 3) Next, a division device according to Embodiment 3 of the present invention will be described. Fig. 15 is a perspective view showing a part of the dividing device 50 of this embodiment. In this embodiment, the two product tables 51a and 51b are arranged at an interval Z, and one product table 51b is fixed. On the inner surface of the product table 51a, universal joints 52, 53, 54 are fixed, and three support posts 56, 57, 58 are provided through these joints. The support columns 57 and 58 are disposed along the end surface of the interval Z of the product table 51a, and the support columns 56 are disposed behind the support column 57. Universal joints 59, 60, and 61 are installed below the support pillars 56, 57, and 58, respectively. The other ends of the universal joints 59 and 61 are fixed to the base 62. The support column 57 is shorter than other support columns. The other end of the universal joint 60 is fixed to the base 62 through a telescopic arm 63. The telescopic arm 63 is an arm which has a linear motor or the like inside, and is controlled by an external control signal to extend and contract in the longitudinal direction. When the glass plate 作为 which is one of the brittle material substrates is divided, the glass plate is placed on a product table as shown in Fig. 16 which shows a plan view. At this time, the glass plate Η is stretched across the product tables 51a, 51b so that the score line S formed on the upper surface is located at the spacer, and is fixed by being sucked. 21 --------- ^ -------- ^ --------- ^ (Please read the precautions on the back before filling this page) The size of the clothing paper applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) 559620 A7 ______ Β7 _ V. Description of the invention (After that, the telescopic arm 63 is extended or compressed. Figure II shows the telescopic arm when there is no glass plate 63 is an explanatory diagram of the state after extension. The product table 51a rotates with the line connecting the universal joints 59 and 61 shown by the one-point chain line as the center axis L1, and the direction of the rotation center axis is not parallel to the scribe line but It has a certain angle. That is, the engraving line S of the glass plate and the center axis li of the rotation of the product table 51a are not parallel. In this way, the products are different from each other as shown in the figure. The greater the amount of movement on the end surface of the interval Z of the stage 51a. Also, the larger the aforementioned angle, the greater the tendency. As a result, the end surface side in front of the eyes of the glass plate 成为 will become the starting point of the division of the glass plate, and the glass plate Η The segmentation progresses from the eye to the inside in order. In this segmentation method, since the starting point of the segmentation is 1 point, it works The magnitude of the splitting force on the glass plate is much lower than that of the conventional splitting method. Moreover, the splitting end surface, that is, the splitting surface is completely completed, which makes the poor splitting end surface of the glass plate 所述 described in the conventional technology. It will happen. Also, the lined glass plate can be divided in the same way by using the aforementioned laser scribing device. In this division method, it is easy to change the installation position, height, etc. of each support post 56, 57 and 58. The amount of rotation and direction of rotation of the product table 51a can be arbitrarily set, so the degree of freedom in design is high. Also, in this embodiment, although the other product table 51b is fixed, the product table 51b can also be made. 51b has the same rotation mechanism. In this case, the rotation direction of the product table 51b must be reversed. Figure 18 shows an enlarged cross section of the liquid crystal mother glass substrate. The liquid crystal mother glass substrate 70 is, as is well known, on one of the mother glass substrates 71. Peripheral department 22, paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) ---------- J -------- order ------- --Line (please read the notes on the back before filling this page) 559620 A7 ___ B7__ 5. Description of the invention (λ) (Please read the precautions on the back before filling in this page) Apply the adhesive 72, and then stack another mother glass substrate 74 with spacers to make the mother glass. The substrates are fixed to each other. In addition, liquid crystal 75 is injected into the space between the two mother glass substrates through a small hole provided in the adhesive layer 72 to obtain a liquid crystal panel (not shown). To use a mother glass substrate of a predetermined size The mother glass substrate 70 is formed and separated into a plurality of liquid crystal panels, so it has been used in the past. The upper mother glass substrate 74 has a score line S1 formed on the upper surface and the lower mother glass substrate 71 has a score line S2. . In the conventional division method, when the liquid crystal mother glass substrate 70 is divided, one mother glass substrate is divided, and the front and rear surfaces are inverted before the other mother glass substrate is divided. In contrast, in the case of using the dividing device of this embodiment, before the assembly of the liquid crystal mother glass substrate 70 of FIG. 18 is performed, a score line is formed on the upper surface of the mother glass substrate 74 and the upper surface of the mother glass substrate 71 in advance. The upper and lower mother glass substrates can be divided at the same time by one rotation of the product table. Therefore, there is no need to reverse the mother glass substrate, and the operating efficiency can be greatly improved. (Embodiment 4) Next, a division device according to Embodiment 4 of the present invention will be described. Fig. 19 is a partial perspective view showing the configuration of the main parts of the dividing device 40 of this embodiment. This dividing device 80 has the same product tables 81a and 81b as those in the third embodiment. It is assumed that when the product tables 81a and 81b are horizontal, that is, when they have the same mounting surface posture, the interval between the product tables is Z, and the size of the interval Z is uniform in this state. As in Examples 1 and 2, it is assumed that the center line of the interval Z is the y-axis. In the lower part of the product table 81a, the installation is not parallel to the y-axis and is at a right angle to the product table 81a. Production) of the bearing plate 82. A shaft hole 83 is provided in the lower portion of the bearing plate 82. A shaft passing through the shaft hole 83 is used as a rotation shaft L2, and the product table 81a is held rotatably. The bearing plate 82 is rotated by a driving device (not shown). In this way, the same effect as that of the third embodiment can be obtained. (Embodiment 5) Next, a division device according to Embodiment 5 of the present invention will be described. Figs. 20 and 21 are diagrams showing the configuration of the main parts of the dividing device 90 of this embodiment. Fig. 20 is a side view and Fig. 21 is a perspective view. The dividing device 90 enlarges the degree of freedom of dividing the glass plate by simultaneously controlling the 6 axes of the parallel link mechanism. This dividing device 90 has the same product tables 92a and 92b as those of the third and fourth embodiments. The product table 92a is regarded as a fixed product table, and the product table 92b is regarded as a movable product table. As shown in FIG. 20, the product table 92 a is fixed to the table 91 using four support columns 93 to 96. The product table 92b is connected to the telescopic arms 103 to 108 through universal joints 97 to 102 on the lower surface. These telescopic arms 103 to 108 have the same functions as those of the telescopic arms 63 in FIG. 15. A linear motor or the like is hidden inside the telescopic boom, and the length in the longitudinal direction can be flexibly controlled by a control signal. The lower portions of the telescopic arms 103 to 108 are connected to the pedestal 91 through universal joints 109 to 114. The lengths of these telescopic arms 103 to 108 are individually controlled by control signals from the control unit 115 shown in FIG. 21. Further, as shown in FIG. 21, the hexagonal shape formed by the universal joints 97 to 102 below the product table 92b is different from the hexagonal shape formed by the universal joints 109 to 114 on the base 91. In addition, with the extension of the telescopic arm, the size of the 24 paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) f Order ------- --line < 559620 A7 ____B7_ _ _ V. Description of the invention (Shrink control, the position of the product table 92b, the angle of the mounting surface relative to the horizontal plane can be arbitrarily selected. This facilitates the use of a parallel mechanism to achieve a 6-axis telescopic arm using parallel telescopic action A mechanism to control the amount of rotation, control position, etc. of a control object. When dividing a glass plate, first, as shown in FIG. 21, the posture of the product table 92b is controlled so that it is spaced at a predetermined interval from the product table 92a and at the same time. On a flat surface. Then, the glass plate Η is placed on the product table, and the scribe line S is placed thereon and positioned at the center of the spacer. In this state, the glass plate Η is fixed to the product table 92a by, for example, vacuum suction or other methods. , 92b. When the glass surface is coated with an insulating layer such as silicon, it can also be fixed by electrostatic adsorption. As for the product table 92b, each telescopic arm will expand and contract to a predetermined length by a control signal from the control unit 115. As a result, the parallel link mechanism is actuated ... As in the third embodiment, the product table 92b rotates with the central axis L3 as an imaginary axis. The central axis L3 is located on the product table. Below 92b, it is not parallel to the engraved line S. That is, the center axis L3 and the engraved line S have a skewed relationship in the space coordinates. FIG. 22 is a side view of the dividing device 90 after the glass plate is divided. Similarly, the product table 92b can be rotated in such a manner that the direction of the rotation axis is at an angle relative to the direction of the engraved line. That is, the glass plate Η uses the front side of the eye as the division start point of the glass plate ,, and the division proceeds in sequence from the front. Therefore, even if the magnitude of the splitting force acting on the glass plate 即使 is small, a perfect splitting surface of the glass plate 做出 can be made. Also, for a glass plate with a line of blind cracks caused by laser light, it can also be used by Apply a smaller splitting force than the conventional one to separate it. 25 Wood paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ----------; ----- ----- Order --------- line (please read the notes on the back before filling out this page) 559620 A7 __ B7 __ V. Description of the invention (pair) In this embodiment, parallel connection is used The lever mechanism can set any rotation axis according to the thickness and shape of the target glass plate. After the cutting, as shown in FIG. 23, the product table 92b is again parallel to the product table 92a in such a way that the end faces of the divided glass plate 不再 are no longer in contact with each other, and a step is set. This can make the divided glass plate Η The process is easy to perform. Furthermore, around the area where the glass plate is to be arranged in the product table 92b, as shown in FIG. 24, a pin 116 is arranged in advance to move up and down freely. After opening the adsorption of the divided glass plate, the push-up pin 116 is actuated, and the glass plate can be pushed up from the product table 92b. Second, as shown in FIG. 24, the cut glass plate and the product table 92b Insert the strip 117 and lift the glass plate Η to carry the divided glass plate Η. Therefore, the effect that the glass plate can be easily carried to the next process can be obtained. In this embodiment, the case of dividing a glass plate has been described, but for an example of bonding a fragile material substrate as shown in FIG. 18, that is, dividing a liquid crystal mother glass substrate (the upper and lower mother glass substrates are formed with score lines). In this case, this embodiment is also applicable. In this case, it is not necessary to flip the surface of the liquid crystal mother glass substrate to separate the two-sided mother glass substrate. (Embodiment 6) Next, a division method according to Embodiment 6 will be described. The method for dividing a brittle material substrate in this embodiment is a method for producing a plurality of liquid crystal glass substrates 121 by dividing a liquid crystal mother glass substrate 120 as the substrate G into a predetermined shape. In order to obtain 26 paper sizes from a liquid crystal mother glass substrate 120, this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) ------- -Order --------- Xin Qin 559620 A7 __B7______ 5. Description of the Invention (〆) The LCD panel (using drive signals to display images or text in pixels) requires various processes. A substrate containing a TFT, a scanning electrode, a signal electrode, and a pixel electrode is referred to as a TFT substrate (also referred to as an AM substrate), and a substrate containing a color filter is referred to as a counter substrate. A substrate at a stage after the substrates are affixed and filled with liquid crystals on the two substrates. The liquid crystal mother glass substrate 120 is a substrate (mother bonding substrate) at a stage after bonding a TFT substrate (mother TFT substrate) before division and a counter substrate (mother counter substrate) before division. Therefore, the divided bonded substrate becomes a liquid crystal glass substrate 121 (bonded substrate). In addition, the liquid crystal glass substrate 121 is filled with liquid crystal, and the liquid crystal injection port is sealed, so that the electrode on the edge of the substrate can be connected to a flat cable to form a liquid crystal panel. In order to make clear the positioning method of the embodiment in the foregoing liquid crystal panel manufacturing process, it will be further explained. In order to obtain a plurality of liquid crystal glass substrates 121 from one liquid crystal mother glass substrate 120, a plurality of division processes are required. The division process is distinguished according to which part of the liquid crystal panel the scribe line of the substrate or the division plane is located on. For example, (A) the process of dividing the liquid crystal mother glass substrate 120, which is a large-sized bonded substrate for gang printing, into liquid crystal glass substrates 121 of a predetermined shape, and (B) the process of dividing into multiple The process of exposing the liquid crystal injection port, (C) the process of taking out the electrode part. The order of the foregoing processes need not be determined in advance here, but there are at least (A) (B) processes in this embodiment. In the process of (A), as long as the scribe lines S are formed in a cross-scribe pattern on the liquid crystal mother glass substrate 120, a plurality of division processes are required. 27 Wood paper scale is applicable to China National Standard (CNS) A4 (210 X 297 mm) ----------- ^ ----- I ---- Order ------- -ί Please read the precautions on the back before filling this page) 559620 V. Description of the Invention (yw) Figure 25 shows the division method of the liquid crystal mother glass substrate 120 containing this division process. This dividing method includes a cassette loader, (2) a first substrate conveying device, (3) a first scribing device, (4) a second scribing device, and (5) a second substrate conveying. Device, (6) the first division device, and C7) the second division device, and a plurality of liquid crystal glass substrates 121 are manufactured through these devices. Therefore, these division processes are called liquid crystal mother glass substrate automatic division production lines. In Fig. 25, a cassette loader 122 is used to store and hold a plurality of liquid crystal mother glass substrates 120 in a cassette. The feeding robot R1 is used to take out the liquid crystal mother glass substrate 120 from the cassette of the cassette loader 122 and transfer it to the first substrate transfer device 123. The first substrate transfer device 123 is used to position the liquid crystal mother glass substrate 120 supplied by the feeding robot R1 at a predetermined position on the product table. This positioning is performed by pressing the end faces of the liquid crystal mother glass substrate 120 perpendicular to each other against the positioning pins. The transfer robot R2 is used to transfer the liquid crystal mother glass substrate 120 placed on the product table to a predetermined position of the first scribing device 124. In the liquid crystal mother glass substrate 120, the mother TFT substrate is referred to as 120a, and the mother counter substrate is referred to as 120b. In addition, as in Examples 1 and 2, the processed surface of the substrate was regarded as a plane parallel to the (x, y) plane. The first scribing device 124 forms, for example, scribe lines si parallel to the X-axis or y-axis directions of the mother opposing substrate 120b. Therefore, the division method described in the conventional example is used here. The transfer robot R3 removes the liquid crystal mother glass substrate 120 on which the score line S1 is formed from the first scribing device 124, turns the top and bottom surfaces of the liquid crystal mother glass substrate 120, and delivers the transfer robot R4. The handling robot R4 is used to convert the liquid after turning over. The size of the private paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 public love) " ~ ----------; ---- ------ Order --------- Line (Please read the precautions on the back before filling this page) 559620 A7 __B7_ V. Description of the invention (/)) The mother glass substrate 120 is transported to the second A predetermined position of the scribing device 125. The second scribing device 125 is used to form the score lines S2 parallel to the X-axis or y-axis directions of the mother TFT 120a, respectively. The positions and lengths (drawing data) of these score lines S2 and S2 are controlled by a control CPU (not shown). The liquid crystal mother glass substrate 120 formed with score lines on both sides is transferred to the second substrate transfer device 126 by the transfer robot R5. The second substrate transfer device 126 is used to position the liquid crystal mother glass substrate 120 supplied by the transfer robot R5 at a predetermined position. The transfer robot R6 is used to transfer the liquid crystal mother glass substrate 120 placed on the second substrate transfer device 126 to a predetermined position of the first dividing device 127. Since the first division device 127 and the second division device 128 are the same as those of the first or second embodiment, the description of the structure is omitted. The first dividing device 127 is used to press and fix the liquid crystal mother glass substrate 120 straddling and placed on the first product table 127a and the second product table 127b, and to make one product table move toward + z direction and < Rotation in the direction, or as shown in FIG. 11, the two product tables are simultaneously rotated in the same direction, so that the liquid crystal mother glass substrate 120 is divided into long bars. The transfer robot R7 is used to take the liquid crystal mother glass substrate 120 divided into long strips from the product table 127b and position it at a predetermined position of the second dividing device 128, that is, to position it across the two product tables 128a and 128b. The second dividing device 128 divides the liquid crystal mother glass substrate 120. The substrate obtained here becomes a liquid crystal glass substrate 121 having a conventional shape. These liquid crystal glass substrates 121 are transferred by the transfer robot R8 to the third substrate transfer device 129, and are then brought into the next liquid crystal panel manufacturing process. 29 Wood paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page) -ϋ ϋ ϋ ϋ n ί n ^ OJ * I n ϋ (559620 A7 _ B7_ V. Explanation of the invention) As for the segmentation method of the embodiment having the above process, it is compared with the conventional segmentation method and explained. Fig. 26 is a process diagram when the liquid crystal mother glass substrate 120 is divided using a conventional dividing device. Fig. 27 is a process diagram when the liquid crystal mother glass substrate 120 is divided using the dividing device of the present invention. Among them, FIG. 26 does not match the number of division processes in FIG. 25 because the division process represents one situation. According to the conventional dividing device system, a scribe line S is formed on one side of the glass plate 1 according to the method not shown in FIG. 2, and the dividing rod 4 is pressed on the other side of the glass plate 1 to bend the glass plate 1 so that The glass plate 1 is divided. Further, according to the method shown in Fig. 3, the glass sheet is bent so that the tensile stress acts on the portion where the score line S is formed, and the glass sheet 1 is divided. If such a separating device is used, the processes shown in (b) to (g) shown in Fig. 26 are required for the division of the laminated glass substrate. That is, the mother TFT substrate 120a of the liquid crystal mother glass substrate 120 shown in FIG. 26 (a) is placed thereon, and a scribe line S1 is drawn on the mother TFT substrate 120a using a dividing device as shown in (b). Next, as shown in (c) ', the liquid crystal mother glass substrate 120 is inverted using a reversing device. Then, as shown in (d) ', the dividing rod is pressed tightly on the mother opposing substrate 120b, and vertical cracks progress on the mother TFT substrate 120a to divide the mother TFT substrate 120a. Next, the liquid crystal mother glass substrate 120 'is scribed with a score line S2 on the mother opposite substrate 120b using a scribing device as shown in FIG. Then, the liquid crystal mother glass substrate 120 is turned again as shown in (f) by using a turning device. Next, as shown in (g), the upper TFT substrate 120a is pressed against the dividing rod ', and a vertical crack progresses on the mother opposing substrate 120b. Secondly, “Make the liquid crystal mother glass substrate 120 to the left and right, as shown in the figure, the liquid crystal mother glass substrate 30 can be used. The paper size of the paper conforms to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ------- ---— 1® ^ -------- Order --------- line (please read the precautions on the back before filling this page) 559620 A7 ^ _B7_. __ 5. Description of the invention ( > f) 120 is divided into a plurality of liquid crystal glass substrates 121. However, this method requires two substrate inversion processes. However, if the dividing device of this embodiment 1 or 2 is used, only the processes of (b) to (b) of FIG. 27 are required for the liquid crystal mother glass substrate 120. That is, the mother opposing substrate 120b of the liquid crystal mother glass substrate 120 shown in FIG. 27 (a) is placed thereon, and the mother opposing substrate 120b is drawn using the first scribing device 124 of FIG. 25 as shown in (b).上 刻 线 S1. Next, as shown in (c), the liquid crystal mother glass substrate 120 is turned using a turning device. Then, as shown in (d), the second scribe device 125 is used to scribe the scribe line S2 on the mother TFT substrate 120a. Then, the liquid crystal mother glass substrate 120 with engraved lines on both sides is set in the first dividing device 127 of FIG. 25, and one product stage is rotated upward and downward, as shown in (e) and (f) on the mother TFT. For the substrate 120a and the mother-opposing substrate 120b, the vertical cracks progress toward the thickness direction of the substrate and pass through each substrate. Therefore, so-called cracks occur. Then, the liquid crystal mother glass substrate 120 is separated from left to right, and the divided liquid crystal glass substrate 121 is obtained as shown in (g). According to this method, the substrate turning process only needs to be performed once. The above process is a case where the liquid crystal mother glass substrate 120 is divided into, for example, a long shape. As illustrated in FIG. 25, in the case where the scribe lines are formed in a grid shape on the liquid crystal mother glass substrate 120, and the liquid crystal glass substrate 121 is divided into small-sized shapes, the process difference between FIG. 26 and FIG. 27 becomes larger. According to the dividing method of this embodiment, not only the dividing surface of the substrate is smoothed, but also the process of reversing the substrate can be omitted. (Embodiment 7) Next, a division method according to Embodiment 7 of the present invention will be described. The paper size of this example applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

559620 A7 _____B7____ 5. Description of the Invention (々Ο) The method of dividing a brittle material substrate is a method of dividing a liquid crystal mother glass substrate 130 into a plurality of liquid crystal glass substrates 131 as shown in FIG. 28. A mother substrate including a TFT, a scan electrode, a signal electrode, and a pixel electrode is referred to as a mother counter substrate. The liquid crystal mother glass substrate 130 is a substrate obtained by bonding a mother counter substrate 130b and a mother TFT substrate 130a with a sealant 132. Fig. 29 is a structural diagram of a liquid crystal mother glass substrate automatic division production line, which is not suitable for a method of dividing the liquid crystal mother glass substrate 130. This dividing method includes (1) a cassette loader, (2) a first substrate conveying device, (3) a scribing device, a first dividing device, a second substrate conveying device, a second dividing device, ( 7) A third substrate transfer device, in which a plurality of liquid crystal glass substrates 131 are manufactured through these devices. In Fig. 29, the cassette loader 133 of (1) is used to store and hold a plurality of liquid crystal mother glass substrates 130 in the cassette. The feeding robot R1 is used to take out a plurality of liquid crystal mother glass substrates 130 from the cassettes of the cassette loader 133 and transfer them to the first substrate transfer device 134 as shown in FIG. The first substrate transfer device 134 is used to position the transferred liquid crystal mother glass substrate 130 at a predetermined position on the product table. The transfer robot R2 is used to transfer the liquid crystal mother glass substrate 130 placed on the product table to a predetermined position of the scribing device 135 of (3). This scribing device 135 is used to form a score line S1 on the upper surface of the mother opposing substrate 130b as shown in FIG. The transfer robot R3 is used to remove the liquid crystal mother glass substrate 130 formed with the score line S1 from the scribing device 135 and transfer it to a predetermined position of the first dividing device 136 of (4). For the first segmentation device 136 applied in the implementation of 32 wood paper standard applicable Chinese National Standard (CNS) A4 specification (210 X 297 mm) ---------- ^ -------- Order- -------- Line (please read the notes on the back before filling this page) 559620 A7 __ B7___ V. Description of the invention (V) (Please read the notes on the back before filling this page) Example 1 ~ 5 Illustrated dividing device. FIG. 29 shows a case where the dividing device of Example 1 or 2 is applied. A liquid crystal mother glass substrate 130 is placed across the first product stage 136a and the second product stage 136b, and the liquid crystal mother glass substrate 130 is placed thereon. The surface is tightly pressed and fixed, so that one product table is rotated or both product tables are rotated at the same time, so that the liquid crystal mother glass substrate 130 is divided into long bars. The transfer robot R4 is used to take out the liquid crystal mother glass substrate 130 divided into long strips and place it on the product table of the second substrate transfer device 137 of (5). The transfer robot R5 is used to transfer the long liquid crystal mother glass substrate 130 into a predetermined position of the second dividing device 138 of (6). The second dividing device 138 divides the liquid crystal mother glass substrate 130 into a predetermined shape to obtain a plurality of liquid crystal glass substrates 131. The divided liquid crystal glass substrate 131 is transferred by the transfer robot R6 to the third substrate transfer device 139, and is then brought into the next liquid crystal panel manufacturing process. The division device described in the first to fifth embodiments is applied as a second division device. In this division method, the flip device of the liquid crystal mother glass substrate 130 is not required, and only one scribing device as shown in FIG. 29 (3) is sufficient. (Embodiment 8) Next, a division method according to Embodiment 8 of the present invention will be described. The method for dividing a brittle material substrate of this embodiment is characterized by using a double-sided scribing device. In addition, the liquid crystal mother glass substrate 140 of this embodiment is different from the mother glass substrate 130 of Embodiment 7. The scribe lines S are not formed in advance on the mother TFT glass substrate and on the mother opposed substrate. Figure 30 is a composition diagram of a liquid crystal mother glass substrate automatic segmentation production line. Table 33 Applies to Chinese National Standard (CNS) A4 specifications (210 X 297 mm). 559620 A7 ^ _ B7 _—_ V. Description of the invention (f) This method of dividing the liquid crystal mother glass substrate Η0. This division method includes (1) a cassette loader 142, (2) a first substrate conveying device 143, (3) a first double-side scribing device 144, (4) a second substrate conveying device 147, and (5) a 1 dividing device 148, (6) third substrate conveying device 149, (7) second double-sided scribing device 150, fourth substrate conveying device 153, (9) second dividing device 154, (10) fifth substrate conveying The device 155 and the plurality of liquid crystal glass substrates 141 are manufactured through these devices. The feeding robot R1, the conveying robots R2 to R7, and the substrate conveying devices 143, 147, 149, 153, and 155 have the same functions as those shown in Embodiments 6 and 7, and therefore descriptions thereof are omitted. The first two-side scribing device 144 includes a plurality of product tables 145a and 145b, a scribing head base 146a provided in the center of the device, and an underline scribing head 146b movably held on the scribing head base 146a. After the liquid crystal mother glass substrate 140 is moved to the portion of the scribing head 146a by the product table 145a, a portion of the upper and lower surfaces of the liquid crystal mother glass substrate 140 will remain in a bridged state in the processing area. The scribing head 146b scans the bridge portion to scribble the upper and lower sides. As described in the conventional example, the scribing device is made of a wheel blade made of superhard metal or diamond, and a scribing device using laser light. The wheel-shaped knife-type scribing device is that two wheel-shaped knives press the two surfaces of the liquid crystal mother glass substrate 140 simultaneously and rotate (rotate) on them, and simultaneously form score lines S1 and S2. The laser scribing device uses a laser scribing system to scan the two surfaces of the liquid crystal mother glass substrate 140 while irradiating two beam spots, and simultaneously performs spot cooling using a refrigerant following the irradiated portion. Hereby 34 (Please read the notes on the back before filling this page)

The size of the clothing paper is in accordance with the Chinese National Standard (CNS) A4 (210 X 297 mm) 559620 A7 _____B7___ 5. The description of the invention (M) is used to perform blind scribing using the thermal deformation of glass materials. The structure of the second double-side scribing device 150 is also the same as that of the first double-side scribing device 144. The first division device 148 and the second division device 154 are used to divide the substrate such that the scribe lines S formed on both surfaces of the liquid crystal mother glass substrate 140 are divided. As described in the first or second embodiment, there is also a device that divides the left and right product tables so that their intervals are non-parallel, and rotates at least one of the left and right product tables. In Fig. 30, a first dividing device 148 is used in this type of dividing device, and the case where the intervals between the product tables 148a and 148b are non-parallel is shown. The first division device 148 and the second division device 154 include devices using other methods. As described in Example 5, two product tables on which the liquid crystal mother glass substrate 140 is placed and fixed, and one of the product tables is held by the parallel link mechanism shown in Figs. In addition, there is also a method in which the product table is rotated and divided by using an axis located at a position away from the score line as a rotation axis when the substrate is divided. In this case, the interval between the product tables 148a and 148b and the interval between the product tables 154a and 154b are flat as shown in FIG. 30. According to the dividing method of this embodiment, it is not necessary to flip the top and bottom of the mother glass substrate 140 In the process, it is not necessary to install a substrate turning device, and the installation area of the liquid crystal mother glass substrate dividing production line can be reduced. Industrial application possibility According to the brittle material substrate dividing device of the present case, because of a mechanism, when the substrate is divided, the division force will act on one end of the score line on the substrate where the scribing is completed, so the division of the substrate will be from the score line. One side of the paper progressed to the other 35 in order. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love). (Please read the precautions on the back before filling this page.) -------- Order -丨 丨 丨-. 559620 A7 ______ B7 ^ __ 5. Description of the invention (riding) 'One end side, so that the end face of the substrate is smooth. In addition, the division force applied is much smaller than that of the conventional division method, and the division device can be miniaturized. In addition, according to the method for dividing a brittle material substrate in the present case, in the process of dividing a liquid crystal mother glass substrate into a plurality of liquid crystal glass substrates, the two sides of the liquid crystal mother glass substrate can be divided in one process without turning over the substrate. Therefore, the number of reversal processes of substrate division is reduced. [Brief description of the drawings] FIG. 1 shows the state of vertical cracks when the glass plate is scribed. Fig. 2 is a perspective view of the main structure of a conventional dividing device using a dividing lever. Fig. 3 is a perspective view of the main structure of a conventional dividing device using a rotation of a product table to perform division. FIG. 4 is a perspective view of the entire configuration of the dividing device according to the first embodiment of the present invention. FIG. 5 is an exploded perspective view of the entire configuration of the dividing device of the first embodiment. FIG. 6 shows a state where a substrate is arranged on a product table of a dividing device. Fig. 7 is a cross-sectional view of a main configuration of a score line portion of the dividing device of the first embodiment. FIG. 8 shows a modification example of the substrate during division. Fig. 9 is a sectional view showing a divided state of a substrate in the dividing device of the first embodiment. Fig. 10 is a plan view showing a divided state of a substrate in the dividing device of the first embodiment. 36 Wood paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

-· N n 1 ϋ i_l ϋ a δ, · I ί n ϋ n I 559620 A7 ____B7______ V. Description of the invention (;) 〇 FIG. 11 is a perspective view of the overall configuration of the dividing device according to the second embodiment of the present invention. FIG. 12 is an exploded perspective view showing the overall configuration of the splitting device of the second embodiment. FIG. 13 is a cross-sectional view of a main structure of a score line portion of a splitting device of Embodiment 2. FIG. Fig. 14 is a sectional view showing a divided state of the substrate in the dividing device of the second embodiment. Fig. 15 is a partially cutaway perspective view of a main structure of a dividing device according to a third embodiment of the present invention. Fig. 16 is a plan view showing a state where a glass plate is placed on a product table in the dividing device of the third embodiment. FIG. 17 shows the operation during division in the division device of the third embodiment. FIG. 18 is an enlarged sectional view showing a layer structure of a liquid crystal panel. Fig. 19 is a partially cutaway perspective view of a main structure of a dividing device according to a fourth embodiment of the present invention. FIG. 20 is a side view of a main structure of a dividing device according to Embodiment 5 of the present invention. Fig. 21 is a perspective view showing a state where a glass plate is placed on a product table in the dividing device of the fifth embodiment. Fig. 22 is a side view showing the operation when the glass plate is divided in the dividing device of the fifth embodiment. Fig. 23 is a side view showing the movement of the product table after the glass plate is divided in the dividing device of the fifth embodiment. Fig. 24 is a side view showing the operation when the glass sheet is moved after the glass sheet is divided in the dividing device of the fifth embodiment. Fig. 25 is an explanatory diagram of an automatic dividing line of a liquid crystal mother glass substrate, showing an example of a method for dividing a brittle material substrate in Embodiment 3 of the present invention. 37 Wood paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) 1® ^ ------- —Order ----- ---- · A7 559620 __B7 ___ V. Description of the invention (;) W) Figure 26 is a process diagram showing a conventional method for dividing a brittle material substrate. FIG. 27 is a process diagram showing an example of the division method in Embodiment 6. FIG. Fig. 28 is a sectional view of a liquid crystal mother glass substrate used in the division method of Example 7 of the present invention. Fig. 29 is an explanatory view of an automatic dividing line of a liquid crystal mother glass substrate, showing an example of a method for dividing a brittle material substrate in the seventh embodiment. Fig. 30 is an explanatory diagram of an automatic dividing line of a liquid crystal mother glass substrate, showing an example of a method for dividing a brittle material substrate in Embodiment 8 of the present invention. [Symbol description] 11 Sliding table 12 Tilt table 13 First product table 14 Second product table 15a 1st clamp rod 16a 2nd clamp rod G Substrate S engraving line_ 38 Fortunately, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling this page)

Claims (1)

  1. A8B8C8D8 559620 6. Scope of patent application 1. A device for dividing a brittle material substrate, which is characterized in that it has first and second product tables, and at least one side of the brittle material forming a score line is placed on the board. The line is located between the two product tables. The first product clamp unit shall treat the edge of the first product table opposite to the second product table as the first edge, and the first product table facing the first product table. When the edge of the 2 product table is used as the second edge, the part of the brittle material substrate located on the first edge is tightly pressed and fixed; the second product clamp unit is for the part of the brittle material substrate located on the second edge. Tightening and fixing; a sliding mechanism, which applies a preload in a right-angle direction to the engraved line of the brittle material substrate, so that the first product table and the first product clamping unit are retracted from the engraved line together; a tilting mechanism The tilting axis parallel to the engraved line of the brittle material substrate is used as the rotation axis, so that the aforementioned second product table and the second product clamping unit can be rotated together; and a rotation control unit, which controls the aforementioned tilting mechanism to The second product table and the second product clamp unit are rotated; the first product table and the second product table are arranged so that the opposing edges of the two product tables are not parallel; the tilting axis of the second product table is from the brittle material The scribe line of the substrate will be within the thickness of the substrate. 2. The device for dividing a brittle material substrate according to item 1 of the scope of the patent application, wherein the first product clamp unit has a first clamp lever that presses the vicinity of the score line of the brittle material substrate, and the second product clamp unit has Press J; paper size applies Chinese National Standard (CNS) A4 specification (210 X 2971 Gongchu 0 " (Please read the precautions on the back before filling in this page) Order-Line 丨 ·-559620 Rhyme C8 D8 VI 、 Scope of patent application (please read the precautions on the back before writing this page) The second clamp rod near the engraving line of the aforementioned brittle material substrate; when the second product table rotates, the second clamp rod will be regarded as the The substrate part near the line exerts a shearing force application point to produce the effect. 3. For example, the device for dividing a brittle material substrate according to item 1 of the patent application range, wherein the tilting shaft of the second product table is located on the brittle material substrate. And the center below. 4. A device for dividing a brittle material substrate, characterized in that: it has first and second product tables, and the brittle material substrate on which at least one side forms a score line is placed. The line is located between the two product tables. The first product clamp unit shall treat the edge of the first product table opposite to the second product table as the first edge, and the first product table facing the first product table. When the edge of the 2 product table is used as the second edge, the part of the brittle material substrate located on the first edge is tightly pressed and fixed; the line 2 product clamp unit is for the brittle material substrate located on the second edge. Partially press and fix; The first tilting mechanism uses the tilting axis parallel to the engraved line of the brittle material substrate as the rotation axis, so that the first product table and the product clamp unit can rotate together; the second tilting mechanism , Using the tilting axis parallel to the engraved line of the brittle material substrate as the rotation axis, the second product table and the second product clamping unit can be rotated together; and a rotation control unit to control the first and second tilting mechanisms to Rotate the first product table and the first product clamp unit, and the second product table and the second product clamp unit; The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 559620 as ___ D8 6. The scope of the patent application states that the first product table and the second product table are arranged so that the opposing edges of the two product tables are not parallel; the tilting axis of the first product table is located on the upper side of the substrate near the engraved line of the brittle material substrate. The tilting axis of the second product table is located on the lower side of the substrate near the engraved line of the brittle material substrate. 5. If the device for dividing a brittle material substrate according to item 4 of the patent application, 'wherein the first product clamp unit is The first clamping rod is pressed against the brittle material substrate and near the score line, and the second product clamping unit is provided with the second clamping rod near the score line of the brittle material substrate; when the first product table or After the product table is rotated, the first clamping rod or the second clamping rod acts as a point of application of a shearing force and a pulling force to the substrate portion near the score line. 6. For the device for dividing a brittle material substrate according to item 4 of the scope of patent application, the tilting axis of the aforementioned first product table and the tilting axis of the aforementioned second product table are located symmetrically from the center of the thickness of the aforementioned brittle material substrate. Its location. 7. —A device for dividing a brittle material substrate, which is fixed on the product table divided into two and fixes the scribed brittle material substrate on it, and rotates at least one product table to divide the aforementioned brittle material substrate; it is characterized by: The rotation center axis of the product table has a predetermined angle with respect to the scribe direction of the brittle material substrate. 8. As for the device for dividing a brittle material substrate according to item 7 of the scope of patent application, the aforementioned product table uses two support columns arranged in a direction at a predetermined angle with respect to the direction of the scribe line to swing it. Way is supported. ______ ^ _ Use Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) 、 口 线 乂 559620 Jaw __ VI. Patent application scope (please read first (Notes on the back are reproduced on this page.) 9. If the device for dividing a brittle material substrate in item 8 of the scope of the patent application, a third support column is provided to support the aforementioned product table at three points, and further support is provided for the support. Column lifting mechanism. 10. —A device for dividing a brittle material substrate, which is divided into two product tables to fix the scribed brittle material substrate, and at least one of the product tables is rotated to divide the aforementioned brittle material substrate; it is characterized by: At least one product table is provided with 6 telescopic arms, at least a part of which is non-parallel; universal joints are provided at both ends of the arms, and the product table and one end of the arms are connected at a free angle ; And a control section that controls the length of each of the aforementioned arms to control the position of one of the aforementioned product tables. 11. A method for dividing a fragile material substrate, which is a method for dividing a fragile material substrate dividing device for patent application No. 10; characterized in that the position of the aforementioned product table is controlled to a same plane through a predetermined interval, and a pre-formed The brittle material substrate of the line is fixed on the product table in accordance with the interval between the product tables; the product table of the one side is not parallel to the score line formed on the brittle material substrate and is not on the same plane as the score line The upper rotation axis rotates, thereby dividing the aforementioned brittle material substrate along the score line. 12. —A method for dividing a brittle material substrate, which is to divide a mother bonded substrate formed by bonding two brittle material substrates, and obtain a plurality of small bonded substrates from here; it is characterized by having the following steps: ______4_ —- This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) A8B8C8D8 559620 6. Scope of patent application (1) Use the first scribing device to form at a predetermined position on the surface of one of the substrates of the aforementioned mother laminated substrate Scribe line S1; (2) Use a second scribing device to form a scribe line S2 on the surface of the other substrate of the mother bonding substrate and in the same direction as the scribe line S1; and (3) form scribe lines SI on both sides, The aforementioned mother bonded substrate of S2 is fixed to two product tables of the dividing device, and at least one of the aforementioned product tables is rotated to 'divide the mother bonded substrate by applying tensile or shear stress to the score lines SI and S2. Into plural blocks. 13. If the method for dividing a brittle material substrate according to item 12 of the patent application range is provided between the foregoing step (1) and the foregoing step (2), a reversing device is provided for reversing the scribe surface of the aforementioned mother bonded substrate. 14. For the method of dividing a brittle material substrate according to item 12 of the patent application, wherein the dividing device of step (3) is the dividing device of item 1 or 4 of the patent application. 15. —A method for dividing a fragile material substrate is to divide a mother bonded substrate formed by bonding a first fragile material substrate on which a score line is not formed and a second fragile material substrate on which a score line S2 is formed in advance. Here are obtained a plurality of small bonded substrates; characterized in having the following steps: (1) using a scribing device, forming a score line S1 on the surface of the aforementioned first brittle material substrate and in the same direction as the aforementioned score line S2; and (2) Fix the aforementioned mother bonded substrate with scribe lines SI and S2 on both sides to the two product tables of the dividing device, and rotate at least one of the product tables, thereby applying tensile stress to the scribe lines SI and S2 or The mother bonded substrate is divided into a plurality of pieces by shear stress. $ Paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 male cage) (Please read the precautions on the back before filling this page) • 1T line A8 destroyed D8 559620 6. Scope of patent application 16_If you apply for patent scope The method for dividing a brittle material substrate according to item 15, wherein the dividing device of the aforementioned step (2) is the dividing device of any one of items 1 to 10 of the scope of patent application. 17. —A method of dividing a brittle material substrate, which is to divide a mother bonded substrate formed by laminating a first brittle material substrate and a second brittle material substrate that are not formed with scribe lines, and obtain a plurality of small patches from here. It is characterized by having the following steps = (1) using a double-sided scribing device to simultaneously form score lines SI, S2 on the surfaces of the aforementioned first and second brittle material substrates; and (2) forming score lines SI on both sides The aforementioned mother bonding substrate of S2 is fixed to two product tables of the dividing device, at least one of the aforementioned product tables is rotated, and the tensile bonding or shearing stress is applied to the score lines SI and S2, so that the mother bonding substrate is applied. Split into plural blocks. 18. For a method for dividing a brittle material substrate according to item 17 of the patent application, wherein the dividing device of step (2) is a device for applying item 1 or 4 of the patent application. 19. For example, the method for dividing a brittle material substrate according to item 17 of the patent application, wherein the two-sided dividing device of the aforementioned step (1) is to fix the aforementioned mother bonded substrate, and a super-hard metal or diamond wheel knife is used for alignment. The surfaces of the first and second brittle material substrates are scribed. 20. The method for dividing a brittle material substrate according to item 17 of the scope of the patent application, wherein the two-sided dividing device of the aforementioned step (1) fixes the mother bonding substrate and utilizes the surfaces of the first and second brittle material substrates. Laser beams are used for heating and refrigerants are used for local cooling. This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 public dreams) (Please read the precautions on the back before writing this page)
TW91114128A 2001-06-28 2002-06-27 Device and method for breaking fragile material substrate TW559620B (en)

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