CN111633852A - Edge removing processing method of wafer chip and dicing saw applied by same - Google Patents
Edge removing processing method of wafer chip and dicing saw applied by same Download PDFInfo
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- CN111633852A CN111633852A CN202010515294.7A CN202010515294A CN111633852A CN 111633852 A CN111633852 A CN 111633852A CN 202010515294 A CN202010515294 A CN 202010515294A CN 111633852 A CN111633852 A CN 111633852A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses an edge-removing processing method of a wafer chip and a dicing saw applied by the same, wherein the outer edge of the back surface of the wafer chip is defined as an outer edge ring of the wafer chip to be edge-removed, the method comprises the steps of calculating and generating an annular cutting track corresponding to the outer edge ring of the wafer chip based on the position coordinates of the outer edge ring of the wafer chip by a vision alignment system of the dicing saw, taking the annular cutting track as a target cutting track, and finally trimming and cutting the wafer chip by a cutting tool of the dicing saw according to the target cutting track, so that the separation of the outer edge of the back of the wafer chip from the wafer chip is realized, the whole trimming processing process is convenient and efficient, and after the wafer chip after the trimming processing enters the normal scribing and cutting process, the phenomenon of material flying in the scribing and cutting process is reliably avoided, a plurality of problems caused by the material flying are finally avoided, and the method is suitable for large-scale popularization and application in the field of wafer cutting and processing.
Description
Technical Field
The invention relates to the technical field of cutting processing of semiconductor wafer chips, in particular to an edge removing processing method of a wafer chip, and further relates to a dicing saw applied to the edge removing processing method.
Background
In recent years, the trend of wafer chips is to increase the outer diameter and reduce the thickness, the process flow of chip fabrication is becoming more and more diversified, and the processing requirement for dicing saw is becoming higher and higher. Among them, because of the installation requirement in the specific glue coating process, the edge part (usually in the range of 2-3mm) of the outer circle of the back of the wafer chip is in a suspended and unfixed state relative to the blue film or the UV film, which may cause some technical problems for the subsequent dicing process of the dicing saw:
the traditional cutting method of the dicing saw is to stick a layer of blue film or UV film on the back of a wafer chip, then cut and subdivide the wafer chip according to a preset cutting channel on the front of the wafer chip by a grinding wheel blade which runs at a high speed, so that the wafer chip is divided into independent devices or chip particles.
Therefore, the applicant wishes to seek technical solutions to solve the above technical problems.
Disclosure of Invention
In view of the above, an object of the present invention is to provide an edge-removing method for a wafer chip and a dicing saw applied thereto, in which an annular cutting track is creatively determined according to an outer edge of a back surface of the wafer chip and is used as a target cutting track, and finally the wafer chip is edge-removed and cut according to the target cutting track by a cutting tool of the dicing saw, so that the outer edge of the back surface of the wafer chip is separated from the wafer chip, the entire edge-removing process is convenient and efficient, and after the wafer chip after the edge-removing process enters a normal dicing and cutting process, a material flying phenomenon in the dicing and cutting process is reliably avoided.
The technical scheme adopted by the invention is as follows:
the back of the wafer chip is fixedly attached to a protective film through an adhesive layer, and the protective film is laid on a cutting platform of a dicing saw; the cutting platform is fixedly arranged on a motor capable of rotating forward and backward for realizing clockwise or anticlockwise rotation, and the outer edge of the back of the wafer chip and the adhesive layer have a suspension space; the trimming processing method comprises the following operation steps:
s10), defining the outer edge of the back side of the wafer chip with the suspension space between the outer edge and the adhesive layer as a wafer chip outer edge ring to be edged, and identifying and recording at least 2 point position coordinates of the wafer chip outer edge ring through a vision alignment system of the dicing saw;
s20), calculating and generating an annular cutting track corresponding to the wafer chip outer edge ring by the vision alignment system of the dicing saw based on the point position coordinates;
s30), taking the annular cutting track as a target cutting track, aligning by adopting a vision alignment system, driving the cutting platform to rotate clockwise or anticlockwise, and simultaneously performing edge removing and cutting on the wafer chip according to the target cutting track by using a cutting tool of a dicing saw;
s40), separating the outer edge ring of the wafer chip from the wafer chip to finish the trimming of the wafer chip, wherein no suspension space exists between the outer edge of the back of the wafer chip which is finished with the trimming and the adhesive layer.
Preferably, after the trimming processing of the wafer chip is completed, a normal scribing and cutting procedure is performed, so that the phenomenon of material flying in the scribing and cutting procedure is avoided.
Preferably, in step S10), at least 4 point position coordinates distributed in a circle shape of the wafer chip outer edge ring are identified and recorded by a vision alignment system of the dicing saw, and the circle center is the coincidence of the wafer chip centers.
Preferably, the suspension distance ranges from 2 mm to 3 mm.
Preferably, the cutting tool is a grinding wheel blade.
Preferably, the dicing saw comprises a cutting platform fixedly mounted on a motor capable of rotating forward and backward, a vision alignment system and a cutting tool positioned above the cutting platform, wherein a protective film is laid on the cutting platform under negative pressure, the protective film is fixedly attached to a wafer chip through an adhesive layer, and the outer edge of the back surface of the wafer chip and the adhesive layer have a suspended space; and defining the outer edge of the back side of the wafer chip with the suspended distance from the adhesive layer as an outer edge ring of the wafer chip to be edged, and separating the outer edge ring of the wafer chip from the wafer chip by the dicing saw by adopting the edging method.
Preferably, after the trimming processing of the wafer chip is completed, a normal scribing and cutting procedure is performed, so that the phenomenon of material flying in the scribing and cutting procedure is avoided.
Preferably, the protective film is a blue film or a UV film.
Preferably, the cutting platform is connected with a vacuum negative pressure source to realize the negative pressure laying effect on the protective film.
The invention creatively defines the outer edge of the back of the wafer chip as the outer edge ring of the wafer chip to be edged, calculates and generates an annular cutting track corresponding to the outer edge ring of the wafer chip based on the point position coordinate of the outer edge ring of the wafer chip by a vision alignment system of a dicing saw, takes the annular cutting track as a target cutting track, and finally carries out edging and cutting on the wafer chip by a cutting tool of the dicing saw according to the target cutting track, finally realizes the separation of the outer edge of the back of the wafer chip from the wafer chip, is convenient and efficient in the whole edging process, reliably avoids the occurrence of material flying in the scribing and cutting process after the wafer chip after edging process enters the normal scribing and cutting process, finally avoids a plurality of problems caused by material flying, and is suitable for scale popularization and application in the field of wafer cutting and processing.
Drawings
FIG. 1 is a block diagram of the steps of a method for trimming a wafer chip according to an embodiment of the present invention;
FIG. 2 is a schematic view of a mounting structure of a wafer chip on a dicing platform according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of the wafer chip after the identification and recording of the midpoint position coordinate in step S10) according to the embodiment of the present invention;
fig. 4 is a schematic structural diagram of a working process of performing step S30) on a wafer chip according to an embodiment of the present invention;
fig. 5 is a schematic diagram of the wafer chip completing step S40) according to the embodiment of the invention.
Detailed Description
The embodiment of the invention discloses an edge removing processing method of a wafer chip, wherein the back surface of the wafer chip is fixedly attached to a protective film through an adhesive layer, and the protective film is laid on a cutting platform of a dicing saw; the cutting platform is fixedly arranged on a motor capable of rotating forward and backward for realizing clockwise or anticlockwise rotation, and the outer edge of the back of the wafer chip and the adhesive layer have a suspension space; the trimming processing method comprises the following operation steps: s10), defining the outer edge of the back side of the wafer chip with the suspension space between the wafer chip and the adhesive layer as a wafer chip outer edge ring to be edged, and identifying and recording at least 2 point position coordinates of the wafer chip outer edge ring through a vision alignment system of a dicing saw; s20), calculating and generating an annular cutting track corresponding to the outer edge ring of the wafer chip by a vision alignment system of the dicing saw based on the point position coordinates; s30), taking the annular cutting track as a target cutting track, aligning by adopting a vision alignment system, driving the cutting platform to rotate clockwise or anticlockwise, and simultaneously trimming and cutting the wafer chip by using a cutting tool of the dicing saw according to the target cutting track; s40), separating the outer edge ring of the wafer chip from the wafer chip, finishing the trimming processing of the wafer chip, and leaving no suspension space between the outer edge of the back surface of the wafer chip which is finished with the trimming processing and the adhesive layer.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 2, the present embodiment provides a dicing saw, including a cutting platform 1 fixedly mounted on a motor (not shown in the drawings, specifically a well-known stepping motor) capable of rotating in forward and reverse directions, a vision alignment system (not shown in the drawings), and a cutting tool located above the cutting platform 1, wherein a protective film 2 is laid on the cutting platform 1 under negative pressure, the protective film 2 is fixedly attached to a wafer chip 4 through an adhesive layer 3, and a suspension gap 4a is formed between the outer edge of the back side of the wafer chip 4 and the adhesive layer 3; defining the outer edge of the back side of the wafer chip 4 with the suspension space 4a with the adhesive layer 3 as a wafer chip outer edge ring 4b to be edged, and separating the wafer chip outer edge ring 4b from the wafer chip 4 by a dicing saw by adopting the edging method described in the embodiment;
after the trimming processing of the wafer chip 4 is finished, entering a normal scribing and cutting procedure, and avoiding the occurrence of material flying in the scribing and cutting procedure; particularly preferably, in the present embodiment, the cutting tool employs a grinding wheel blade 5 that can rotate at high speed; the protective film 2 is a blue film or a UV film or other protective films with similar protective effects; the cutting platform 1 is connected with a vacuum negative pressure source (specifically, a vacuum pump can be adopted) to realize the negative pressure laying effect on the protective film 2;
referring to fig. 1 in combination with fig. 2, a method for trimming a wafer chip 4 includes the following steps:
s10), defining the outer edge of the back side of the wafer chip 4 with the suspension space 4a between the wafer chip and the adhesive layer 3 as a wafer chip outer edge ring 4b to be edged, and identifying and recording at least 2 point position coordinates of the wafer chip outer edge ring 4b through a vision alignment system of a dicing saw; specifically, as shown in fig. 3, in step S10), the coordinates 61, 62, 63, 64 of the positions of the 4 circumferentially distributed point positions of the wafer chip outer edge ring 4b are identified and recorded by the vision alignment system of the dicing saw, and the circumferential centers are the centers of the wafer chips and coincide; in other embodiments, other numbers of point position coordinates distributed in a circumferential shape may be selected and recorded, as long as it is ensured that the annular dicing track 7 corresponding to the wafer chip outer edge ring 4b can be calculated and generated in the subsequent step S20), which is not particularly limited in this embodiment;
s20), calculating and generating an annular cutting track 7 corresponding to the wafer chip outer edge ring 4b by the vision alignment system of the dicing saw based on the point position coordinates;
s30), please refer to fig. 4, the circular cutting track 7 is used as a target cutting track and aligned by a vision alignment system, the cutting platform 1 is driven by a motor to rotate clockwise, and the wafer chip 4 is cut by the grinding wheel blade 5 of the dicing saw according to the target cutting track; of course, in other embodiments, the cutting platform 1 may be driven by the motor to rotate counterclockwise, and the trimming cutting effect similar to the clockwise rotation may also be obtained;
s40), please refer to fig. 5, separating the outer edge ring 4b of the wafer chip from the wafer chip 4, completing the trimming of the wafer chip 4, wherein there is no suspension space between the outer edge of the back side of the wafer chip 4c and the adhesive layer 3; this step S40) is when implementing specifically, stop the negative pressure supply, take off protective film 2 from cutting platform 1, then put protective film 2 and the above-mentioned wafer chip 4c that laminates as an organic whole and accomplish the edging processing with viscose layer 3 on arbitrary horizontal platform face together, then slowly manually tear protective film 2 off, until protective film 2 finishes all, wafer chip outer fringe ring 4b and the wafer chip 4c of edging processing freely separate, obtain the wafer chip 4c of edging processing, can get into normal scribing cutting process after the edging processing of wafer chip 4 finishes, avoid taking place the flash phenomenon in the scribing cutting process.
In the embodiment, the outer edge of the back of the wafer chip is creatively defined as the outer edge ring 4b of the wafer chip to be trimmed, the annular cutting track 7 corresponding to the outer edge ring 4b of the wafer chip is generated by a vision alignment system of the dicing saw based on the point position coordinate of the outer edge ring 4b of the wafer chip, the annular cutting track 7 is used as a target cutting track, and finally the wafer chip 4 is trimmed and cut by the grinding wheel blade 5 of the dicing saw according to the target cutting track, so that the wafer chip 4c which is trimmed and obtained by separating the outer edge 4b of the back of the wafer chip from the wafer chip 4 is finally realized, the whole trimming process is convenient and efficient, and after the wafer chip 4c which is trimmed and processed enters a normal scribing and cutting process, the phenomenon of material flying in the scribing and cutting process is reliably avoided, and a plurality of problems caused by the flying material are finally avoided, is suitable for scale popularization and application in the field of wafer cutting and processing.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. The back of the wafer chip is fixedly attached to a protective film through an adhesive layer, and the protective film is laid on a cutting platform of a dicing saw; the cutting platform is fixedly arranged on a motor capable of rotating forward and backward for realizing clockwise or anticlockwise rotation, and the outer edge of the back of the wafer chip and the adhesive layer have a suspension space; the trimming processing method is characterized by comprising the following operation steps:
s10), defining the outer edge of the back side of the wafer chip with the suspension space between the outer edge and the adhesive layer as a wafer chip outer edge ring to be edged, and identifying and recording at least 2 point position coordinates of the wafer chip outer edge ring through a vision alignment system of the dicing saw;
s20), calculating and generating an annular cutting track corresponding to the wafer chip outer edge ring by the vision alignment system of the dicing saw based on the point position coordinates;
s30), taking the annular cutting track as a target cutting track, aligning by adopting a vision alignment system, driving the cutting platform to rotate clockwise or anticlockwise, and simultaneously performing edge removing and cutting on the wafer chip according to the target cutting track by using a cutting tool of a dicing saw;
s40), separating the outer edge ring of the wafer chip from the wafer chip to finish the trimming of the wafer chip, wherein no suspension space exists between the outer edge of the back of the wafer chip which is finished with the trimming and the adhesive layer.
2. The method according to claim 1, wherein a normal dicing and cutting process is performed after the trimming process of the wafer chip is completed, so as to avoid a material flying phenomenon in the dicing and cutting process.
3. The method as claimed in claim 1, wherein in step S10), at least 4 coordinates of the positions of the circumferential points of the outer edge ring of the wafer chip are recorded by the vision alignment system of the dicing saw, and the circumferential centers are coincident with the center of the wafer chip.
4. The method as claimed in claim 1, wherein the suspension distance is in a range of 2-3 mm.
5. The method as claimed in claim 1, wherein the cutting tool is a grinding wheel blade.
6. A dicing saw comprises a cutting platform, a vision alignment system and a cutting tool, wherein the cutting platform is fixedly installed on a motor capable of rotating in the forward and reverse directions, the cutting tool is positioned above the cutting platform, a protective film is paved on the cutting platform under negative pressure, the protective film is fixedly attached to a wafer chip through an adhesive layer, and the outer edge of the back face of the wafer chip and the adhesive layer have a suspended space; the method is characterized in that the outer edge of the back surface of the wafer chip with a suspension space with the adhesive layer is defined as an outer edge ring of the wafer chip to be edged, and the wafer scribing machine separates the outer edge ring of the wafer chip from the wafer chip by adopting the edging processing method according to one of claims 1 to 5.
7. The dicing saw according to claim 6, wherein after the trimming process of the wafer chip is completed, a normal dicing and cutting process is performed to avoid a material flying phenomenon in the dicing and cutting process.
8. The dicing saw of claim 6, wherein the protective film is a blue film or a UV film.
9. The dicing saw of claim 6, wherein the cutting platform is connected to a vacuum negative pressure source to achieve a negative pressure laying effect on the protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/130730 WO2021208440A1 (en) | 2020-04-16 | 2020-11-23 | Edge-removing machining method for wafer chip, and scribing machine using same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2020102974988 | 2020-04-16 | ||
| CN202010297498 | 2020-04-16 |
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| CN111633852A true CN111633852A (en) | 2020-09-08 |
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| CN202010515294.7A Pending CN111633852A (en) | 2020-04-16 | 2020-06-09 | Edge removing processing method of wafer chip and dicing saw applied by same |
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| WO (1) | WO2021208440A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021208440A1 (en) * | 2020-04-16 | 2021-10-21 | 江苏京创先进电子科技有限公司 | Edge-removing machining method for wafer chip, and scribing machine using same |
| CN114582780A (en) * | 2022-03-01 | 2022-06-03 | 江苏京创先进电子科技有限公司 | Method and device for removing ring of Taiko wafer |
| CN116674101A (en) * | 2023-08-03 | 2023-09-01 | 江苏京创先进电子科技有限公司 | Wafer circular cutting method, system and equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114178628B (en) * | 2022-02-14 | 2022-05-13 | 沈阳和研科技有限公司 | Rapid modification method for full-automatic scribing machine |
| CN117524914B (en) * | 2024-01-04 | 2024-04-12 | 华羿微电子股份有限公司 | Processing method and equipment for blind sealing wafer |
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Also Published As
| Publication number | Publication date |
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| WO2021208440A1 (en) | 2021-10-21 |
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