TWI643826B - Breaking device and breaking method - Google Patents

Breaking device and breaking method Download PDF

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Publication number
TWI643826B
TWI643826B TW104100584A TW104100584A TWI643826B TW I643826 B TWI643826 B TW I643826B TW 104100584 A TW104100584 A TW 104100584A TW 104100584 A TW104100584 A TW 104100584A TW I643826 B TWI643826 B TW I643826B
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Taiwan
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substrate
support member
breaking
belt
brittle material
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TW104100584A
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Chinese (zh)
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TW201536701A (en
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富永圭介
高松生芳
秀島護
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日商三星鑽石工業股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00Severing by means other than cutting; Apparatus therefor
    • B26F3/002Precutting and tensioning or breaking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Abstract

本發明之課題在於消除因於上游側搬送皮帶與下游側搬送皮帶之間分斷基板而產生之問題。 An object of the present invention is to eliminate the problems caused by the substrate being separated between the upstream-side conveyance belt and the downstream-side conveyance belt.

分斷裝置1具備:搬送皮帶2、第1至第4支持構件4、5、7、8、以及第1及第2分斷桿3、6。搬送皮帶2具有可撓性。第1分斷桿3、與第1及第2支持構件4、5配置於載置面21之上方。第2分斷桿6、與第3及第4支持構件7、8配置於載置面21之下方。第3支持構件7隔著搬送皮帶2配置於第1支持構件4下。第4支持構件8隔著搬送皮帶2配置於第2支持構件5下。 The breaking device 1 includes a conveying belt 2, first to fourth supporting members 4, 5, 7, 8, and first and second breaking bars 3, 6. The conveyance belt 2 has flexibility. The first breaking lever 3 and the first and second supporting members 4 and 5 are arranged above the mounting surface 21. The second breaking lever 6 and the third and fourth supporting members 7 and 8 are arranged below the mounting surface 21. The third support member 7 is disposed under the first support member 4 via the conveyance belt 2. The fourth support member 8 is disposed under the second support member 5 via the conveyance belt 2.

Description

分斷裝置及分斷方法 Breaking device and breaking method

本發明係關於一種分斷裝置。 The invention relates to a breaking device.

一般而言,分斷脆性材料基板之方法首先利用刻劃裝置於脆性材料基板形成刻劃線。然後,利用分斷裝置按壓脆性材料基板來使脆性材料基板撓曲。該結果為,脆性材料基板被沿著刻劃線分斷。該分斷裝置係設置於上游側搬送皮帶與下游側搬送皮帶之間(參照專利文獻1)。而且,分斷裝置係以上述方法分斷跨及上游側搬送皮帶與下游側搬送皮帶而配置之脆性材料基板。 Generally speaking, the method of breaking a substrate of a brittle material first uses a scoring device to form a score line on the substrate of the brittle material. Then, the brittle material substrate is pressed by the breaking device to deflect the brittle material substrate. As a result, the brittle material substrate was divided along the score line. This breaking device is provided between the upstream conveying belt and the downstream conveying belt (see Patent Document 1). In addition, the breaking device is a brittle material substrate that is arranged across the upstream and downstream conveying belts and the downstream conveying belt by the above-mentioned method.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2012-126580號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2012-126580

若如上述分斷裝置般,於上游側搬送皮帶與下游側搬送皮帶之間分斷脆性材料基板,則會產生各種問題。例如,於分斷後之脆性材料基板之尺寸較小之情形時,會產生掉落到上游側搬送皮帶與下游側搬送皮帶之間之問題。 When the fragile material substrate is cut between the upstream-side conveyance belt and the downstream-side conveyance belt like the above-mentioned cutting device, various problems occur. For example, when the size of the brittle material substrate after breaking is small, a problem arises that it falls between the upstream-side conveying belt and the downstream-side conveying belt.

本發明之問題在於消除因於上游側搬送皮帶與下游側搬送皮帶之間分斷基板而產生之問題。 The problem of the present invention is to eliminate the problems caused by cutting off the substrate between the upstream-side conveyance belt and the downstream-side conveyance belt.

本發明之第1方面之分斷裝置沿著刻劃線分斷形成有刻劃線之脆性材料基板。該分斷裝置具備搬送皮帶、第1及第2支持構件、第1分斷桿、第3及第4支持構件、以及第2分斷桿。搬送皮帶具有供載置基板之載置面。搬送皮帶以搬送基板之方式構成。搬送皮帶具有可撓性。第1及第2支持構件於載置面之上方沿著搬送皮帶之搬送方向配置。第1及第2支持構件係構成為可升降。第1分斷桿配置於載置面之上方。第1分斷桿配置於第1支持構件與第2支持構件之間。第1分斷桿係構成為可升降。第3及第4支持構件於載置面之下方沿著搬送方向配置。第3及第4支持構件係構成為可升降。第2分斷桿配置於載置面之下方。第2分斷桿配置於第3支持構件與第4支持構件之間。第2分斷桿係構成為可升降。第3支持構件隔著搬送皮帶配置於第1支持構件下。 第4支持構件隔著搬送皮帶配置於第2支持構件下。 The cutting device according to the first aspect of the present invention cuts a brittle material substrate formed with a scribe line along the scribe line. This breaking device includes a conveying belt, first and second supporting members, a first breaking lever, third and fourth supporting members, and a second breaking lever. The transfer belt has a mounting surface on which a substrate is mounted. The transfer belt is configured to transfer a substrate. The carrying belt is flexible. The first and second supporting members are arranged above the mounting surface in the conveying direction of the conveying belt. The first and second support members are configured to be liftable. The first breaking lever is arranged above the mounting surface. The first breaking lever is disposed between the first support member and the second support member. The first breaking lever system is configured to be liftable. The 3rd and 4th support members are arrange | positioned along the conveyance direction below the mounting surface. The third and fourth support members are configured to be movable up and down. The second breaking lever is arranged below the mounting surface. The second breaking lever is disposed between the third support member and the fourth support member. The second breaking lever system is configured to be liftable. The third support member is disposed under the first support member via the transport belt. The fourth support member is disposed under the second support member via the transport belt.

根據本發明,例如可利用如下之方法分斷基板。首先,以自下方支持搬送皮帶之方式使第3及第4支持構件向上方移動。其次,以利用第1分斷桿將基板向下方按壓之方式,使第1分斷桿向下方移動。由於搬送皮帶具有可撓性,因此基板可與搬送皮帶共同撓曲。 According to the present invention, for example, the substrate can be separated by the following method. First, the third and fourth support members are moved upward to support the conveyance belt from below. Next, the first breaking lever is moved downward by pressing the substrate downward with the first breaking lever. Since the transfer belt is flexible, the substrate can be flexed together with the transfer belt.

該結果為基板被沿著刻劃線分斷。 As a result, the substrate was divided along the score line.

又,本發明亦能夠以如下之方式分斷基板。首先,以自上方支持基板之方式使第1及第2支持構件向下方移動。其次,使第2分斷桿向上方移動。藉此,第2分斷桿隔著搬送皮帶將基板向上方按壓。該結果為基板與搬送皮帶撓曲,從而基板被沿著刻劃線分斷。 In addition, the present invention can also divide the substrate in the following manner. First, the first and second supporting members are moved downward to support the substrate from above. Next, the second breaking lever is moved upward. Thereby, the 2nd breaking lever presses a board | substrate upwards via the conveyance belt. As a result, the substrate and the conveyance belt were flexed, and the substrate was cut along the scribe line.

如上所述,於本發明中,為了分斷基板,不需要上游側搬送皮帶與下游側搬送皮帶之間隙。因此,可消除因於上游側搬送皮帶與下游側搬送皮帶之間隙分斷基板而產生之問題。 As described above, in the present invention, in order to separate the substrate, there is no need for a gap between the upstream-side conveyance belt and the downstream-side conveyance belt. Therefore, it is possible to eliminate the problem caused by the substrate being cut off due to the gap between the upstream conveying belt and the downstream conveying belt.

又,根據上述本發明,可利用如下方法分斷基板。例如,利用第2支持構件與第4支持構件而自上下方向夾持基板。於該狀態下,使 第1分斷桿向下方移動,利用第1分斷桿來將基板向下方按壓。該結果為,基板與搬送皮帶一起撓曲,從而將基板沿著刻劃線分斷。以上方法例如於基板之端緣與刻劃線之距離較短之情形時有用。 In addition, according to the present invention described above, the substrate can be separated by the following method. For example, the substrate is held in the vertical direction by the second support member and the fourth support member. In this state, make The first breaking lever moves downward, and the substrate is pressed downward by the first breaking lever. As a result, the substrate was flexed together with the transfer belt, and the substrate was divided along the scribe line. The above method is useful, for example, when the distance between the edge of the substrate and the score line is short.

較佳為,基板具有端部與本體部。端部係由刻劃線與基板之端緣而劃定。本體部為除端部以外之部分。第2支持構件與第4支持構件構成為可與搬送皮帶共同夾持本體部。第1分斷桿構成為可將端部向下方按壓。 Preferably, the substrate has an end portion and a main body portion. The end is defined by the scribe line and the edge of the substrate. The body portion is a portion other than the end portion. The second support member and the fourth support member are configured to be capable of holding the body portion together with the conveyance belt. The first breaking lever is configured to be capable of pressing the end portion downward.

較佳為,第1及第2支持構件構成為可沿著搬送方向移動。 Preferably, the first and second supporting members are configured to be movable in the conveying direction.

根據該構成,第1及第2支持構件可於適當之位置上自上方支持基板。 With this configuration, the first and second supporting members can support the substrate from above at an appropriate position.

較佳為,第3及第4支持構件構成為可沿著搬送方向移動。 Preferably, the 3rd and 4th support members are comprised so that it can move to a conveyance direction.

根據該構成,第3及第4支持構件可於適當之位置上自下方支持搬送皮帶。 With this configuration, the third and fourth support members can support the conveyance belt from below at an appropriate position.

本發明之第2方面之分斷方法沿著刻劃線分斷脆性材料基板。再者,脆性材料基板具有利用刻劃線區分開之本體部與端部。該分斷方法包含以下之步驟(a)至(c)。步驟(a)利用具有可撓性之搬送皮帶來搬送基板。步驟(b)逐個利用搬送皮帶夾持本體部。步驟(c)將端部朝向下方按壓,使端部與搬送皮帶共同撓曲。 The cutting method according to the second aspect of the present invention cuts the brittle material substrate along the scribe line. Furthermore, the brittle material substrate has a main body portion and an end portion which are distinguished by scribe lines. This breaking method includes the following steps (a) to (c). In step (a), the substrate is transferred using a flexible transfer belt. In step (b), the main body portion is held one by one by the conveyance belt. In step (c), the end portion is pressed downward, so that the end portion and the conveying belt are flexed together.

根據該方法,藉由使端部與搬送皮帶共同撓曲,而可沿著刻劃線分斷基板。如此,於本發明中,為了分斷基板,不需要上游側搬送皮帶與下游側搬送皮帶之間隙。因此,可消除因於上游側搬送皮帶與下游側搬送皮帶之間隙分斷基板而產生之問題。 According to this method, by flexing the end portion and the conveying belt together, the substrate can be divided along the score line. As described above, in the present invention, in order to separate the substrate, a gap between the upstream-side conveyance belt and the downstream-side conveyance belt is not required. Therefore, it is possible to eliminate the problem caused by the substrate being cut off due to the gap between the upstream conveying belt and the downstream conveying belt.

較佳為,基板為將第1基板與第2基板貼合而成之貼合基板。刻劃線包含第1刻劃線與第2刻劃線。第1刻劃線形成於第1基板。第2刻劃線形成於第2基板。 Preferably, the substrate is a bonded substrate formed by bonding a first substrate and a second substrate. The scribe line includes the first scribe line and the second scribe line. The first score line is formed on the first substrate. The second score line is formed on the second substrate.

較佳為,於步驟(a)中,以第1基板成為上側、第2基板成為下側 之方式配置脆性材料基板,從而搬送脆性材料基板。於步驟(c)中藉由使端部撓曲,而沿著第1刻劃線分斷第1基板。 Preferably, in step (a), the first substrate becomes the upper side and the second substrate becomes the lower side. By disposing the brittle material substrate in this manner, the brittle material substrate is transported. In step (c), the first substrate is divided along the first score line by flexing the end portion.

根據本發明,可消除因於上游側搬送皮帶與下游側搬送皮帶之間隙分斷基板而產生之問題。 According to the present invention, it is possible to eliminate a problem caused by breaking the substrate due to a gap between the upstream-side transport belt and the downstream-side transport belt.

1‧‧‧分斷裝置 1‧‧‧ breaking device

2‧‧‧搬送皮帶 2‧‧‧ transport belt

3‧‧‧第1分斷桿 3‧‧‧ 1st break

4‧‧‧第1支持構件 4‧‧‧ the first supporting member

5‧‧‧第2支持構件 5‧‧‧ 2nd supporting member

6‧‧‧第2分斷桿 6‧‧‧ 2nd break

7‧‧‧第3支持構件 7‧‧‧3rd supporting member

8‧‧‧第4支持構件 8‧‧‧ 4th supporting member

10‧‧‧脆性材料基板 10‧‧‧ Brittle material substrate

11‧‧‧刻劃線 11‧‧‧ scribed

11a‧‧‧第1刻劃線 11a‧‧‧1st scribe

11b‧‧‧第2刻劃線 11b‧‧‧2nd scribe

12‧‧‧端部 12‧‧‧ end

13‧‧‧本體部 13‧‧‧Body

15‧‧‧第1基板 15‧‧‧The first substrate

16‧‧‧第2基板 16‧‧‧ 2nd substrate

21‧‧‧載置面 21‧‧‧mounting surface

22‧‧‧搬送輥 22‧‧‧ transport roller

23‧‧‧搬送皮帶2之載置面21之相反側面 23‧‧‧ Opposite side of the mounting surface 21 of the conveyor belt 2

圖1係分斷裝置之概略圖。 Figure 1 is a schematic diagram of a breaking device.

圖2係分斷裝置之概略圖。 Fig. 2 is a schematic diagram of a breaking device.

圖3係分斷裝置之概略圖。 Fig. 3 is a schematic diagram of a breaking device.

圖4係分斷裝置之概略圖。 Fig. 4 is a schematic diagram of a breaking device.

圖5係分斷裝置之概略圖。 Fig. 5 is a schematic diagram of a breaking device.

圖6係分斷裝置之概略圖。 Fig. 6 is a schematic diagram of a breaking device.

圖7係分斷裝置之概略圖。 Fig. 7 is a schematic diagram of a breaking device.

圖8係分斷裝置之概略圖。 Fig. 8 is a schematic diagram of a breaking device.

圖9係分斷裝置之概略圖。 Fig. 9 is a schematic diagram of a breaking device.

圖10係分斷裝置之概略圖。 Fig. 10 is a schematic diagram of a breaking device.

以下,一面參照圖式,一面對本發明之分斷裝置之實施形態進行說明。圖1係分斷裝置之概略圖。 Hereinafter, an embodiment of the breaking device of the present invention will be described with reference to the drawings. Figure 1 is a schematic diagram of a breaking device.

如圖1所示,分斷裝置1係沿著刻劃線11分斷脆性材料基板10之裝置。於脆性材料基板10形成有刻劃線11。脆性材料基板10具有端部12及本體部13。端部12係利用基板10之端緣14、及刻劃線11而劃定。本體部13係自脆性材料基板10除去端部12以外之部分。再者,本體部13之搬送方向之長度長於端部12。 As shown in FIG. 1, the cutting device 1 is a device for cutting the brittle material substrate 10 along the score line 11. A scribe line 11 is formed on the brittle material substrate 10. The brittle material substrate 10 includes an end portion 12 and a main body portion 13. The end portion 12 is defined by the edge 14 of the substrate 10 and the scribe line 11. The body portion 13 is a portion excluding the end portion 12 from the brittle material substrate 10. The length of the main body portion 13 in the conveying direction is longer than that of the end portion 12.

於本實施形態中,脆性材料基板10為貼合基板。即,脆性材料基板10包含第1基板15與第2基板16。於第1基板15,形成有第1刻劃線 11a,於第2基板16,形成有第2刻劃線11b。刻劃線11包含第1刻劃線11a與第2刻劃線11b。再者,第1刻劃線11a與第2刻劃線11b對向。 In this embodiment, the brittle material substrate 10 is a bonded substrate. That is, the brittle material substrate 10 includes a first substrate 15 and a second substrate 16. A first scribe line is formed on the first substrate 15 11a, a second scribe line 11b is formed on the second substrate 16. The scribe line 11 includes a first scribe line 11a and a second scribe line 11b. The first score line 11a and the second score line 11b face each other.

於第1基板15與第2基板16之間構成例如液晶層。又,脆性材料基板10具有配置於第1基板15與第2基板16之間之密封構件(省略圖示)。利用該密封構件而包圍液晶層。本實施形態中之脆性材料基板10係以第1基板15配置於上側、且第2基板16配置於下側之狀態搬送。 A liquid crystal layer is formed between the first substrate 15 and the second substrate 16, for example. The brittle material substrate 10 includes a sealing member (not shown) disposed between the first substrate 15 and the second substrate 16. The sealing member surrounds the liquid crystal layer. The brittle material substrate 10 in this embodiment is conveyed in a state where the first substrate 15 is disposed on the upper side and the second substrate 16 is disposed on the lower side.

分斷裝置1具備搬送皮帶2、第1分斷桿3、第1支持構件4、第2支持構件5、第2分斷桿6、第3支持構件7、及第4支持構件8。 The breaking device 1 includes a transport belt 2, a first breaking lever 3, a first supporting member 4, a second supporting member 5, a second breaking lever 6, a third supporting member 7, and a fourth supporting member 8.

搬送皮帶2具有供載置基板10之載置面21。搬送皮帶2係以搬送基板之方式構成。又,搬送皮帶2具有可撓性。例如,搬送皮帶2可利用天然橡膠、合成橡膠、布、或合成樹脂等形成。搬送皮帶2係以施加有不鬆弛之程度之張力之狀態設置。 The transfer belt 2 includes a mounting surface 21 on which the substrate 10 is mounted. The transfer belt 2 is configured to transfer a substrate. Moreover, the conveyance belt 2 has flexibility. For example, the conveyance belt 2 can be formed using natural rubber, synthetic rubber, cloth, or synthetic resin. The conveying belt 2 is installed in a state where tension is applied to a degree that does not slacken.

該搬送皮帶2於圖1中逆時針地旋轉。即,於本實施形態中,搬送皮帶2向Y方向(圖1之左方向)搬送基板10。具體而言,搬送皮帶2係利用多個搬送輥22驅動。各搬送輥22係利用馬達驅動。 This conveying belt 2 rotates counterclockwise in FIG. 1. That is, in the present embodiment, the transfer belt 2 transfers the substrate 10 in the Y direction (the left direction in FIG. 1). Specifically, the conveyance belt 2 is driven by a plurality of conveyance rollers 22. Each conveyance roller 22 is driven by a motor.

第1分斷桿3配置於搬送皮帶2之載置面21之上方。第1分斷桿3於搬送方向上配置於第1支持構件4與第2支持構件5之間。 The first breaking lever 3 is arranged above the mounting surface 21 of the conveying belt 2. The first breaking lever 3 is arranged between the first support member 4 and the second support member 5 in the conveying direction.

第1分斷桿3係用來自上方按壓載置於載置面21上之基板10,而沿著刻劃線11分斷基板10之構件。詳細而言,第1分斷桿3以前端部(下端部)按壓基板10。 The first breaking lever 3 is a member that presses the substrate 10 placed on the mounting surface 21 from above and breaks the substrate 10 along the scribe line 11. Specifically, the first breaking lever 3 presses the substrate 10 with a front end portion (lower end portion).

第1分斷桿3之前端部係以朝向前端厚度逐漸變薄之方式構成。 第1分斷桿3沿水平方向且與搬送方向正交之方向延伸。具體而言,第1分斷桿3沿圖1之紙面垂直方向延伸。 The front end part of the 1st breaking lever 3 is comprised so that thickness may become thin gradually toward a front-end | tip. The first breaking lever 3 extends in a horizontal direction and a direction orthogonal to the conveying direction. Specifically, the first breaking lever 3 extends in the vertical direction of the paper surface in FIG. 1.

第1分斷桿3係構成為可升降。即,第1分斷桿3構成為可沿上下方向移動。例如,第1分斷桿3係利用流體氣缸(省略圖示)驅動,且可向上方及下方移動。詳細而言,第1分斷桿3能夠以自上方按壓載置於 載置面21上之基板10之方式向下方移動。又,第1分斷桿3可向上方移動至不接觸載置於載置面21上之基板10之程度。 The first breaking lever 3 is configured to be liftable. That is, the first breaking lever 3 is configured to be movable in the vertical direction. For example, the first breaking lever 3 is driven by a fluid cylinder (not shown) and is movable upward and downward. In detail, the first breaking lever 3 can be placed in a pressing manner from above. The substrate 10 on the mounting surface 21 moves downward. In addition, the first breaking lever 3 can be moved upward so as not to contact the substrate 10 placed on the mounting surface 21.

第1支持構件4係用來支持載置於載置面21上之基板10之構件。 詳細而言,藉由使第1支持構件4之下表面與基板10之上表面接觸,而第1支持構件4支持基板10。 The first support member 4 is a member for supporting the substrate 10 placed on the mounting surface 21. In detail, the first support member 4 supports the substrate 10 by bringing the lower surface of the first support member 4 into contact with the upper surface of the substrate 10.

第1支持構件4配置於搬送皮帶2之載置面21之上方。於本實施形態中,第1支持構件4相對於第1分斷桿3配置於搬送方向上游側。 The first support member 4 is arranged above the mounting surface 21 of the conveyance belt 2. In this embodiment, the first support member 4 is disposed on the upstream side in the conveying direction with respect to the first breaking lever 3.

第1支持構件4係構成為可升降。即,第1支持構件4構成為可沿上下方向移動。例如,第1支持構件4係利用流體氣缸(省略圖示)驅動,且可向上方及下方移動。詳細而言,第1支持構件4能夠以支持載置於載置面21上之基板10之方式向下方移動。又,第1支持構件4可向上方移動至不接觸載置於載置面21上之基板10之程度。 The first support member 4 is configured to be movable up and down. That is, the first support member 4 is configured to be movable in the vertical direction. For example, the first support member 4 is driven by a fluid cylinder (not shown) and is movable upward and downward. Specifically, the first support member 4 can move downward so as to support the substrate 10 placed on the mounting surface 21. In addition, the first supporting member 4 can be moved upward so as not to contact the substrate 10 placed on the mounting surface 21.

第2支持構件5係用來支持載置於載置面21上之基板10之構件。 第2支持構件5配置於載置面21之上方。於本實施形態中,第2支持構件5相對於第1分斷桿3配置於搬送方向下游側。第2支持構件5係構成為可升降。再者,由於第2支持構件5除所配置之位置以外與上述第1支持構件4為相同之構成,因此省略詳細說明。又,第1及第2支持構件4、5構成為可沿著搬送方向移動。即,第1及第2支持構件4、5可向搬送方向上游側移動,或向搬送方向下游側移動。 The second supporting member 5 is a member for supporting the substrate 10 placed on the mounting surface 21. The second support member 5 is disposed above the mounting surface 21. In this embodiment, the second support member 5 is disposed on the downstream side in the conveying direction with respect to the first breaking lever 3. The second support member 5 is configured to be movable up and down. In addition, since the second support member 5 has the same configuration as the first support member 4 except for the position where it is arranged, detailed description is omitted. The first and second support members 4 and 5 are configured to be movable in the conveying direction. That is, the first and second support members 4 and 5 can move toward the upstream side in the conveyance direction, or move toward the downstream side in the conveyance direction.

如上所述,配置於搬送皮帶2之載置面21之上方之第1支持構件4、第1分斷桿3、及第2支持構件5係依此順序配置。於搬送方向上,第1支持構件4與第2支持構件5隔開間隔s配置。 As described above, the first support member 4, the first breaking lever 3, and the second support member 5 arranged above the mounting surface 21 of the transport belt 2 are arranged in this order. In the conveyance direction, the first support member 4 and the second support member 5 are arranged at intervals s.

第2分斷桿6配置於搬送皮帶2之載置面21之下方。第2分斷桿6於搬送方向上配置於第3支持構件7與第4支持構件8之間。 The second breaking lever 6 is arranged below the mounting surface 21 of the conveying belt 2. The second breaking lever 6 is arranged between the third support member 7 and the fourth support member 8 in the conveying direction.

第2分斷桿6係用來自下方按壓載置於載置面21上之基板10,而沿著刻劃線11分斷基板10之構件。詳細而言,第2分斷桿6隔著搬送皮 帶2按壓基板10。再者,第2分斷桿6以前端部(上端部)按壓基板10。 The second breaking lever 6 is a member that presses the substrate 10 placed on the mounting surface 21 from below and breaks the substrate 10 along the scribe line 11. Specifically, the second breaking lever 6 transports the leather across The belt 2 presses the substrate 10. The second breaking lever 6 presses the substrate 10 with a front end portion (upper end portion).

第2分斷桿6之前端部係以朝向前端厚度逐漸變薄之方式構成。 第2分斷桿6沿著水平方向且與搬送方向正交之方向延伸。具體而言,第2分斷桿6沿著圖1之紙面垂直方向延伸。 The front end part of the 2nd breaking lever 6 is comprised so that thickness may become thin gradually toward a front-end | tip. The second breaking lever 6 extends in a horizontal direction and a direction orthogonal to the conveying direction. Specifically, the second breaking lever 6 extends in the vertical direction of the paper surface in FIG. 1.

第2分斷桿6係構成為可升降。即,第2分斷桿6構成為可沿上下方向移動。例如,第2分斷桿6係利用流體氣缸(省略圖示)驅動,且可向上方及下方移動。詳細而言,第2分斷桿6能夠以自下方按壓載置於載置面21上之基板10之方式向上方移動。又,第2分斷桿6可向下方移動至不與搬送皮帶2接觸之程度。 The second breaking lever 6 is configured to be movable up and down. That is, the second breaking lever 6 is configured to be movable in the vertical direction. For example, the second breaking lever 6 is driven by a fluid cylinder (not shown) and is movable upward and downward. Specifically, the second breaking lever 6 can be moved upward by pressing the substrate 10 placed on the mounting surface 21 from below. The second breaking lever 6 can be moved downward so as not to come into contact with the conveyance belt 2.

第3支持構件7係用來自下方支持搬送皮帶2之構件。詳細而言,第3支持構件7藉由支持搬送皮帶2,而支持載置於載置面21上之基板10。再者,藉由使第3支持構件7之上表面與搬送皮帶2之載置面21之相反側面23接觸,而第3支持構件7支持搬送皮帶2。 The third support member 7 is a member that supports the conveyance belt 2 from below. Specifically, the third support member 7 supports the substrate 10 placed on the mounting surface 21 by supporting the transfer belt 2. The upper surface of the third support member 7 is in contact with the side surface 23 opposite to the mounting surface 21 of the conveyance belt 2, and the third support member 7 supports the conveyance belt 2.

第3支持構件7配置於載置面21之下方。又,第3支持構件7相對於第2分斷桿6配置於搬送方向上游側。 The third support member 7 is disposed below the mounting surface 21. The third supporting member 7 is disposed on the upstream side of the second breaking lever 6 in the conveying direction.

第3支持構件7係構成為可升降。即,第3支持構件7構成為可沿著上下方向移動。例如,第3支持構件7係利用流體氣缸(省略圖示)驅動,且可向上方及下方移動。詳細而言,第3支持構件7能夠以支持搬送皮帶2之方式向上方移動。又,第3支持構件7可向下方移動至不與搬送皮帶2接觸之程度。 The third support member 7 is configured to be liftable. That is, the third support member 7 is configured to be movable in the vertical direction. For example, the third support member 7 is driven by a fluid cylinder (not shown) and is movable upward and downward. Specifically, the third support member 7 can be moved upward to support the conveyance belt 2. In addition, the third support member 7 can be moved downward so as not to come into contact with the conveyance belt 2.

第4支持構件8係用來支持搬送皮帶2之構件。第4支持構件8配置於載置面21之下方。又,第4支持構件8相對於第2分斷桿6配置於搬送方向下游側。第4支持構件8係構成為可升降。再者,由於第4支持構件8除所配置之位置以外與上述第3支持構件7為相同之構成,因此省略詳細說明。又,第3及第4支持構件7、8構成為可沿著搬送方向移動。即,第3及第4支持構件7、8可向搬送方向上游側移動,或向搬送 方向下游側移動。 The fourth support member 8 is a member for supporting the conveyance belt 2. The fourth support member 8 is disposed below the mounting surface 21. The fourth support member 8 is disposed on the downstream side of the second breaking lever 6 in the conveying direction. The fourth support member 8 is configured to be movable up and down. In addition, the fourth support member 8 has the same configuration as the third support member 7 except for the position where it is arranged, so detailed description is omitted. Moreover, the 3rd and 4th support members 7 and 8 are comprised so that it can move to a conveyance direction. That is, the 3rd and 4th support members 7 and 8 can move to the upstream side of a conveyance direction, or can move toward the conveyance direction. Move to the downstream side.

如上所述,配置於搬送皮帶2之載置面21之下方之第3支持構件7、第2分斷桿6、及第4支持構件8係依此順序配置。 As described above, the third support member 7, the second breaking lever 6, and the fourth support member 8 arranged below the mounting surface 21 of the conveying belt 2 are arranged in this order.

其次,對使用以上述方式構成之分斷裝置之分斷方法進行說明。再者,基板10之端緣14與刻劃線11之距離小於第1支持構件4與第2支持構件5之間隔s之最小值之一半。例如,基板10之端緣14與刻劃線11之距離為1mm以上且3mm以下左右。再者,所謂間隔s之最小值,係指可利用第1支持構件4與第2支持構件5自上方支持基板10,並利用第2分斷桿6將基板10向上方按壓而沿著刻劃線11分斷基板10之範圍,即第1支持構件4與第2支持構件5最接近時之間隔s。 Next, a breaking method using a breaking device configured as described above will be described. In addition, the distance between the edge 14 of the substrate 10 and the score line 11 is less than half of the minimum value of the interval s between the first support member 4 and the second support member 5. For example, the distance between the edge 14 of the substrate 10 and the score line 11 is about 1 mm to 3 mm. In addition, the minimum value of the interval s means that the substrate 10 can be supported from above by the first support member 4 and the second support member 5, and the substrate 10 is pressed upward by the second breaking lever 6 to follow the scribe. The line 11 divides the range of the substrate 10, that is, the interval s when the first support member 4 and the second support member 5 are closest to each other.

首先,如圖1所示,於搬送皮帶2之載置面21上載置脆性材料基板10。然後,利用搬送皮帶2搬送脆性材料基板10。詳細而言,利用搬送輥22驅動搬送皮帶2,從而搬送脆性材料基板10。 First, as shown in FIG. 1, a brittle material substrate 10 is placed on the placement surface 21 of the conveyance belt 2. Then, the brittle material substrate 10 is transported by the transport belt 2. Specifically, the conveyance belt 2 is driven by the conveyance roller 22 to convey the brittle material substrate 10.

當脆性材料基板10之刻劃線11位於第1分斷桿3之正下方時,停止利用搬送皮帶2搬送脆性材料基板10。然後,如圖2所示,使第3及第4支持構件7、8向上方移動,從而利用第3及第4支持構件7、8自下方支持搬送皮帶2。再者,第4支持構件8隔著搬送皮帶2位於基板10下,但第3支持構件7不隔著搬送皮帶2位於基板10下。 When the scribe line 11 of the brittle material substrate 10 is located directly below the first breaking lever 3, the transport of the brittle material substrate 10 using the transport belt 2 is stopped. Then, as shown in FIG. 2, the third and fourth support members 7 and 8 are moved upward to support the conveyance belt 2 from below using the third and fourth support members 7 and 8. The fourth support member 8 is located under the substrate 10 via the transfer belt 2, but the third support member 7 is not located under the substrate 10 via the transfer belt 2.

其次,如圖3所示,使第1分斷桿3向下方移動。藉此,第1分斷桿3將基板10向下方按壓,從而基板10與搬送皮帶2共同撓曲。再者,第1分斷桿3於刻劃線11上按壓。該結果為,沿著形成於第2基板16之第2刻劃線11b而分斷第2基板16。 Next, as shown in FIG. 3, the first breaking lever 3 is moved downward. Thereby, the first breaking lever 3 presses the substrate 10 downward, so that the substrate 10 and the conveying belt 2 are flexed together. The first breaking lever 3 is pressed on the score line 11. As a result, the second substrate 16 is divided along the second scribe line 11 b formed on the second substrate 16.

其次,再次開始利用搬送皮帶2搬送基板10。詳細而言,使第3及第4支持構件7、8向下方移動,使第1分斷桿3向上方移動後,再次開始利用搬送皮帶2搬送基板10。 Next, the substrate 10 is again transported by the transport belt 2. Specifically, after the third and fourth support members 7 and 8 are moved downward and the first breaking lever 3 is moved upward, the substrate 10 is again transported by the transport belt 2.

如圖4所示,當端部12位於第1分斷桿3之正下方時,停止利用搬 送皮帶2搬送脆性材料基板10。然後,如圖5所示,使第2支持構件5向下方移動,並使第4支持構件8向上方移動。該結果為,基板10被第2支持構件5與第4支持構件8夾持而被支持。具體而言,第2及第4支持構件5、8夾持基板10之本體部13。即,基板10之端部12未被第2及第4支持構件5、8夾持。再者,第2支持構件5與第4支持構件8不僅夾持基板10亦夾持搬送皮帶2。 As shown in FIG. 4, when the end portion 12 is located directly below the first breaking lever 3, The conveying belt 2 conveys the brittle material substrate 10. Then, as shown in FIG. 5, the second support member 5 is moved downward, and the fourth support member 8 is moved upward. As a result, the substrate 10 is supported by being sandwiched between the second support member 5 and the fourth support member 8. Specifically, the second and fourth supporting members 5 and 8 sandwich the body portion 13 of the substrate 10. That is, the end portion 12 of the substrate 10 is not held between the second and fourth support members 5 and 8. The second support member 5 and the fourth support member 8 hold not only the substrate 10 but also the conveyance belt 2.

其次,如圖6所示,使第1分斷桿3向下方移動。藉此,第1分斷桿3將基板10之端部12向下方按壓,而使端部12向下方撓曲。該結果為,沿著形成於第1基板15之第1刻劃線11a分斷第1基板15。 Next, as shown in FIG. 6, the first breaking lever 3 is moved downward. Thereby, the 1st breaking lever 3 presses the edge part 12 of the board | substrate 10 downward, and bends the edge part 12 downward. As a result, the first substrate 15 is divided along the first scribe line 11 a formed on the first substrate 15.

如上所述,分斷裝置1可沿著刻劃線11分斷基板10。又,於基板10之端部12之寬度較窄之情形時,存在無法利用第1支持構件4與第2支持構件5支持基板10之情況。即便於此種情形時,亦可利用上述方法,沿著刻劃線11分斷基板10。 As described above, the cutting device 1 can cut the substrate 10 along the scribe line 11. When the width of the end portion 12 of the substrate 10 is narrow, the substrate 10 may not be supported by the first support member 4 and the second support member 5. That is, when this is convenient, the substrate 10 may be cut along the scribe line 11 by using the method described above.

於基板10之端緣14與刻劃線11之距離大於第1支持構件4與第2支持構件5之間隔s之最小值之一半之情形時,可利用如下之方法分斷第1基板15。 When the distance between the edge 14 of the substrate 10 and the scribe line 11 is larger than one and a half of the minimum value of the interval s between the first support member 4 and the second support member 5, the first substrate 15 can be cut by the following method.

詳細而言,當脆性材料基板10之刻劃線11位於第1分斷桿3之正下方時,停止利用搬送皮帶2搬送脆性材料基板10。然後,如圖7所示,使第3及第4支持構件7、8向上方移動,利用第3及第4支持構件7、8自下方支持搬送皮帶2。此處,較佳為,第3及第4支持構件7、8隔著搬送皮帶2位於基板10下。 Specifically, when the scribe line 11 of the brittle material substrate 10 is located directly below the first breaking lever 3, the transport of the brittle material substrate 10 by the transport belt 2 is stopped. Then, as shown in FIG. 7, the third and fourth support members 7 and 8 are moved upward, and the third and fourth support members 7 and 8 support the conveyance belt 2 from below. Here, it is preferable that the third and fourth support members 7 and 8 are located under the substrate 10 via the transport belt 2.

其次,如圖8所示,使第1分斷桿3向下方移動。藉此,第1分斷桿3將基板10向下方按壓。再者,第1分斷桿3於刻劃線11上按壓。利用該按壓力,而使基板10與搬送皮帶2共同撓曲。該結果為,沿著第2刻劃線11b而分斷第2基板16。 Next, as shown in FIG. 8, the first breaking lever 3 is moved downward. Thereby, the first breaking lever 3 presses the substrate 10 downward. The first breaking lever 3 is pressed on the score line 11. By this pressing force, the substrate 10 and the transfer belt 2 are flexed together. As a result, the second substrate 16 is divided along the second scribe line 11b.

其次,使第3及第4支持構件7、8向下方移動,並使第1分斷桿3 向上方移動。然後,如圖9所示,使第1及第2支持構件4、5向下方移動。藉此,利用第1及第2支持構件4、5自上方支持基板10。 Next, the third and fourth supporting members 7 and 8 are moved downward, and the first breaking lever 3 is moved. Move up. Then, as shown in FIG. 9, the first and second support members 4 and 5 are moved downward. Thereby, the substrate 10 is supported from above by the first and second support members 4 and 5.

其次,如圖10所示,使第2分斷桿6向上方移動。藉此,第2分斷桿6隔著搬送皮帶2將基板10向上方按壓。該結果為,基板10與搬送皮帶2共同撓曲,從而沿著第1刻劃線11a分斷第1基板15。 Next, as shown in FIG. 10, the 2nd breaking lever 6 is moved upward. Thereby, the 2nd breaking lever 6 presses the board | substrate 10 upward through the conveyance belt 2. As a result, the substrate 10 and the conveyance belt 2 are flexed together, and the first substrate 15 is cut along the first score line 11a.

[變化例] [Variation]

以上,對本發明之實施形態進行了說明,但本發明並不限定於該等,於不脫離本發明之主旨之範圍內可進行各種變更。 As mentioned above, although embodiment of this invention was described, this invention is not limited to these, Various changes can be made in the range which does not deviate from the meaning of this invention.

變化例1Variation 1

於上述實施形態中,第1及第3支持構件4、7位於搬送方向之上游側,且第2及第4支持構件5、8位於搬送方向之下游側,但各構件之位置關係並不特別限定於此。例如,亦可使第1及第3支持構件4、7位於搬送方向之下游側,且使第2及第4支持構件5、8位於搬送方向之上游側。 In the above embodiment, the first and third support members 4 and 7 are located upstream of the conveyance direction, and the second and fourth support members 5 and 8 are located downstream of the conveyance direction, but the positional relationship of the components is not particularly Limited to this. For example, the first and third support members 4 and 7 may be positioned on the downstream side in the conveying direction, and the second and fourth support members 5 and 8 may be positioned on the upstream side in the conveying direction.

變化例2Variation 2

於上述實施形態中,脆性材料基板10為貼合基板,但脆性材料基板10並不特別限定於此。 In the above embodiment, the brittle material substrate 10 is a bonded substrate, but the brittle material substrate 10 is not particularly limited to this.

Claims (8)

一種分斷裝置,其係將形成有刻劃線之脆性材料基板沿著上述刻劃線分斷之分斷裝置,且具備:搬送皮帶,其具有供載置上述脆性材料基板之載置面,以搬送上述脆性材料基板之方式構成,且具有可撓性;第1及第2支持構件,其等於上述載置面之上方沿著上述搬送皮帶之搬送方向配置,且構成為可升降;第1分斷桿,其於上述載置面之上方配置於上述第1支持構件與上述第2支持構件之間,且構成為可升降;第3及第4支持構件,其等於上述載置面之下方沿著上述搬送方向配置,且構成為可升降;及第2分斷桿,其於上述載置面之下方配置於上述第3支持構件與上述第4支持構件之間,且構成為可升降;且上述第3支持構件隔著上述搬送皮帶配置於上述第1支持構件之下方,且上述第4支持構件隔著上述搬送皮帶配置於上述第2支持構件之下方。A breaking device is a breaking device that breaks a brittle material substrate formed with a scribe line along the scribe line, and includes a conveying belt having a mounting surface on which the brittle material substrate is placed, It is configured to transport the brittle material substrate and has flexibility; the first and second support members are arranged above the mounting surface along the transport direction of the transport belt, and are configured to be liftable; the first The breaking lever is arranged between the first support member and the second support member above the mounting surface, and is configured to be liftable; the third and fourth support members are equal to the lower portion of the mounting surface. It is arranged along the conveying direction and is configured to be liftable; and a second breaking lever is arranged between the third support member and the fourth support member below the mounting surface and configured to be liftable; The third support member is disposed below the first support member via the transport belt, and the fourth support member is disposed below the second support member via the transport belt. 如請求項1之分斷裝置,其中上述脆性材料基板具有利用上述刻劃線與上述基板之端緣而劃定之端部、及除上述端部以外之本體部,上述第2支持構件與上述第4支持構件構成為可與上述搬送皮帶共同夾持上述本體部,且上述第1分斷桿構成為可將上述端部向下方按壓。The breaking device according to claim 1, wherein the brittle material substrate has an end portion defined by the scribe line and an end edge of the substrate, and a main body portion other than the end portion, the second support member and the The fourth support member is configured to be capable of holding the body portion together with the conveyance belt, and the first breaking lever is configured to be capable of pressing the end portion downward. 如請求項1之分斷裝置,其中上述第1及第2支持構件構成為可沿著上述搬送方向移動。The breaking device according to claim 1, wherein the first and second supporting members are configured to be movable along the conveying direction. 如請求項2之分斷裝置,其中上述第1及第2支持構件構成為可沿著上述搬送方向移動。The breaking device according to claim 2, wherein the first and second supporting members are configured to be movable along the conveying direction. 如請求項1至4中任一項之分斷裝置,其中上述第3及第4支持構件構成為可沿著上述搬送方向移動。The breaking device according to any one of claims 1 to 4, wherein the third and fourth supporting members are configured to be movable in the conveying direction. 一種分斷方法,其係將具有利用刻劃線區分開之本體部與端部之脆性材料基板沿著上述刻劃線分斷之方法,且包含如下步驟:(a)利用具有可撓性之搬送皮帶來搬送上述脆性材料基板;(b)不夾持上述端部,僅將上述本體部連同上述搬送皮帶從上下予以支持並夾持;及(c)將上述端部向下方按壓,使上述端部與上述搬送皮帶共同撓曲。A cutting method is a method for breaking a brittle material substrate having a body portion and an end portion separated by a scribe line along the scribe line, and includes the following steps: (a) using a flexible The carrying belt carries the fragile material substrate; (b) the end portion is not clamped, and only the main body portion and the transport belt are supported and held from above and below; and (c) the end portion is pressed downward to make the above The end portion is flexed together with the transfer belt. 如請求項6之分斷方法,其中上述脆性材料基板係將第1基板與第2基板貼合而成之貼合基板,且上述刻劃線包含形成於第1基板之第1刻劃線、及形成於上述第2基板之第2刻劃線。The cutting method according to claim 6, wherein the brittle material substrate is a bonded substrate formed by bonding a first substrate and a second substrate, and the scribe line includes a first scribe line formed on the first substrate, And a second scribe line formed on the second substrate. 如請求項7之分斷方法,其中於上述步驟(a)中,以上述第1基板成為上側、上述第2基板成為下側之方式配置上述脆性材料基板,而搬送上述脆性材料基板,且於上述步驟(c)中,藉由使上述端部撓曲,而沿著上述第1刻劃線分斷上述第1基板。The cutting method according to claim 7, wherein in the step (a), the brittle material substrate is arranged such that the first substrate becomes the upper side and the second substrate becomes the lower side, and the brittle material substrate is transported, and the In the step (c), the first substrate is divided along the first score line by flexing the end portion.
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