JP4227811B2 - Manufacturing method of ceramic wiring board and ceramic fired product dividing apparatus - Google Patents

Manufacturing method of ceramic wiring board and ceramic fired product dividing apparatus Download PDF

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Publication number
JP4227811B2
JP4227811B2 JP2003007656A JP2003007656A JP4227811B2 JP 4227811 B2 JP4227811 B2 JP 4227811B2 JP 2003007656 A JP2003007656 A JP 2003007656A JP 2003007656 A JP2003007656 A JP 2003007656A JP 4227811 B2 JP4227811 B2 JP 4227811B2
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Japan
Prior art keywords
ceramic
fired product
ceramic fired
support surface
dividing
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JP2004216742A (en
Inventor
祐司 住田
陽介 森田
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日本特殊陶業株式会社
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention divides a ceramic fired product formed as a work for taking a plurality of ceramic wiring boards along a dividing groove formed at the boundary of each ceramic wiring board. Ceramic wiring board manufacturing method and ceramic fired product dividing apparatus It is about.
[0002]
[Prior art]
In the production of a ceramic wiring board represented by an IC package, a multi-piece work board is produced by making a large number of ceramic wiring boards in a lattice shape, and the work board is divided into individual ceramic wiring boards after firing. The method is generally adopted (see FIG. 8). In the work substrate before firing, a dividing groove is formed by a cutting blade at a position that becomes a boundary between the ceramic wiring substrates. As a dividing device for folding the ceramic fired product along the dividing groove, for example, there is a device shown below.
[0003]
The dividing device described in the following Patent Document 1 passes between a pressing roller and an eccentric roller, which are arranged by shifting the axis of each other, with the ceramic fired product sandwiched between a pair of belts, A shearing force in the substrate thickness direction is applied to the ceramic fired product via each belt, and thereby the ceramic fired product is divided along the dividing grooves.
[0004]
Further, the dividing device described in Patent Document 2 below realizes an operation closer to a manual operation. Specifically, the ceramic fired product is sandwiched between the bending chuck and the fixed chuck, and the ceramic chucking product is divided along the dividing groove by slightly turning the bending chuck around the dividing groove. is there. Since the ceramic chuck product feeding mechanism is provided on the fixed chuck side, the above operation can be performed intermittently.
[0005]
[Patent Document 1]
JP-A-6-120367
[Patent Document 2]
JP 2001-210931 A
[0006]
[Problems to be solved by the invention]
The splitting device described in the above-mentioned Patent Document 1 is designed for each product so that the pressure applied to the presser roller, the relative position between the presser roller and the eccentric roller, the conveyance speed, etc. are optimized before starting actual production. It needs to be adjusted. This adjustment is extremely important to prevent the occurrence of division failures such as cracks and chipping in the product part, and further occurrence of undivided products, but even if optimization is performed, The fact is that it does not completely prevent the occurrence of division failures.
[0007]
Moreover, although the apparatus described in Patent Document 2 is excellent in that divisional defects hardly occur, it requires a servo mechanism or the like for realizing high-precision positioning, which increases costs. I can't escape. Further, unlike the push splitting type splitting device described in Patent Document 1, it is not possible to employ continuous conveyance, so that the productivity is naturally lowered.
[0008]
Accordingly, the present invention provides a division that can reduce the occurrence of division defects while maintaining high productivity in dividing a ceramic fired product configured as a work substrate with a plurality of ceramic wiring boards along the division grooves. It is an object of the present invention to provide a method and a dividing device, and further to provide a method for manufacturing a ceramic wiring board using the dividing device.
[0009]
[Means for solving the problems and actions / effects]
In order to solve the above-described problems, the present invention divides a ceramic fired product formed as a work substrate by taking a plurality of ceramic wiring boards along the dividing grooves. And manufacture ceramic wiring board The ceramic fired product is placed on a transport belt that moves on the support surface, and the ceramic fired product is transported while being pressed by the pressing mechanism toward the support surface, and the transport direction is more than the support surface. Downstream, so that at least a part is upward when viewed from the support surface Made of hard material By installing a riding section, and by causing the leading portion of the ceramic fired product protruding from the support surface along with the conveyance to ride on the conveyance belt, and applying a shearing force in the thickness direction of the substrate to the dividing groove, The fired product shall be divided. By the buffer mechanism connected to the riding section, It is characterized in that the ride-up portion is submerged elastically in a direction that relaxes the bending of the ceramic fired product.
[0010]
In the above-described method of the present invention, the leading portion of the ceramic fired product in the transport direction is ridden on the riding part, while the entire ceramic fired product is prevented from being lifted by the pressing mechanism on the support surface on the rear side in the transport direction. A shearing force is imparted to the ceramic fired product. At this time, the riding-up portion is elastically sunk in a direction that relaxes the bending of the ceramic fired product so that it is difficult to cause a division failure. According to this configuration, since the crack occurs after waiting for the position where the shearing force in the substrate thickness direction concentrates on the dividing groove, the ceramic fired product can be accurately divided along the dividing groove. In particular, the amount of deformation of the ceramic fired product can be kept small until the ceramic fired product is transported to the position where the shearing force is applied to the dividing groove by elastically sinking the run-up part on which the top part of the ceramic fired product rides. Is possible. Therefore, it is possible to suppress the occurrence of defective division such as breakage of the product portion, and high productivity can be realized.
[0011]
Specifically, in the riding section Connected A buffer mechanism is connected, and this buffer mechanism is connected to the riding section. Subduction amount when a certain load is applied Can be adjusted according to the type of the ceramic wiring board. According to this, the sinking amount is set according to the size and strength of the product. In other words, conventionally, when there is a change in the design of the product to be divided, it has been dealt with by adjusting the position of the roller, but this can be dealt with by adjusting the buffer mechanism. In addition, even when viewed as a whole method, a structure that divides by continuous conveyance can be adopted, so that high productivity can be realized.
[0012]
Moreover, it is preferable that the riding portion includes an inclined surface inclined at a certain angle with respect to the support surface, and the leading portion of the ceramic fired product is mounted on the inclined surface. Since the inclination of the inclined surface with respect to the support surface is constant, the ceramic fired product can run smoothly, and it is ensured that unreasonable stress is applied to the ceramic fired product, coupled with the sinking of the riding part elastically. To prevent. In addition, this inclined surface does not require angle adjustment for each product, and thus contributes to shortening the time for adjusting the device before production.
[0013]
Moreover, the ceramic fired product is sandwiched between the conveying belt and the pressure belt that is driven in synchronization, and the ceramic fired product is pressed while pressing at least one region of the ceramic wiring board toward the support surface via the pressure belt. Transport. When pressing the ceramic fired product with a roller as in the conventional method, it is thought that the pressing position forms a line, but the above method is a surface presser, so when the top part of the ceramic fired product rides on the riding part In addition, it is possible to more reliably suppress the ceramic fired product from being lifted from the support surface, thereby preventing the occurrence of defective division.
[0014]
The ceramic fired product dividing apparatus of the present invention is an apparatus for dividing a ceramic fired product formed as a work substrate by taking a plurality of ceramic wiring boards along the dividing groove, and the ceramic fired product is placed thereon. Conveyor belt, a support base having a support surface on which the conveyor belt moves, a pressing mechanism for pressing the ceramic fired product against the support base without hindering the conveyance, and a ceramic protruding from the support surface during the conveyance The top of the baked product rides with the conveyor belt, and at least a part is located above the support surface. Made of hard material The riding part and a buffer mechanism that elastically sinks the riding part in a direction that relaxes the bending of the ceramic fired article when the leading portion of the ceramic fired article rides with the conveyor belt.
[0015]
The dividing device of the present invention is configured to prevent the ceramic fired product from being lifted from the support surface on the rear side in the transport direction, while the transport belt leading portion of the ceramic fired product is placed on the riding portion together with the transport belt. ing. Thereby, forces opposite to each other act on the ceramic fired product before and after in the conveying direction. And while maintaining this state, when the ceramic fired product is advanced together with the conveyor belt, and the shearing force in the substrate thickness direction works on the split groove having a low bending strength, the ceramic fired product is moved along the split groove. It is a mechanism of breaking.
[0016]
In particular, the present invention is characterized in that a shock-absorbing mechanism that elastically sinks the ride-up portion is provided. According to this buffering mechanism, the amount of deformation of the ceramic fired product can be kept small while the leading portion rides on the riding portion by sinking the riding portion. That is, the occurrence of division failures can be suppressed.
[0017]
In a preferred aspect, the riding-up portion has an inclined surface that is adjacent to the support base on the downstream side in the transport direction and is inclined toward the ceramic fired product with respect to the support surface. The dividing device is configured such that the leading portion of the ceramic fired product protruding from the support surface rides on the inclined surface together with the conveying belt. In this way, the ceramic fired product can be smoothly carried on, and it is possible to reliably prevent excessive stress from being applied to the ceramic fired product in combination with the effect of the above-described buffer mechanism sinking the angle unit. In addition, the inclined surface does not need to be adjusted for each product, and thus contributes to shortening the time for adjusting the device before production.
[0018]
Moreover, it is desirable that the buffer mechanism is configured to be able to change the amount of sinking when a certain load is applied to the riding section. This makes it easier to adjust the device when there is a change in the design of the product to be divided. Specifically, a hydraulic actuator or a pneumatic actuator can be employed as the buffer mechanism.
[0019]
The pressing mechanism can include a pressing belt that is driven in synchronization with the transport belt, and a pressing base that makes surface contact with the pressing belt and presses the ceramic fired product toward the support surface. The structure of pressing the ceramic fired product with the conventional roller is considered to form a line at the pressing position, but the above structure is a surface presser, so when the top part of the ceramic fired product rides on the riding part, the ceramic fired product It can suppress more reliably that the whole floats from a support surface. Further, combined with the effect of suppressing the bending of the leading portion of the ceramic fired product protruding from the support surface by the buffer mechanism, the division failure is less likely to occur.
[0020]
When pressing the ceramic fired product moving on the support surface, the end of the pressing position by the press base in the conveying direction of the ceramic fired product is preferably matched with the end of the support surface. According to this configuration, when the split groove arrives at the end of the support surface, the split groove is just separated from the range in which the pressing force of the pressing base acts, and cracks occur along the split groove. . That is, it is possible to obtain the necessary and sufficient effect of suppressing the entire ceramic fired product from lifting from the support surface by the surface pressing.
[0021]
In addition Of ceramic wiring board Manufacturing Includes a step of producing a ceramic fired product in which a plurality of ceramic wiring boards are integrally formed with a dividing groove as a boundary, and a step of dividing the ceramic fired product into individual ceramic wiring boards using the above-described dividing apparatus. I am .
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a schematic side view of a main part of a ceramic firing product dividing apparatus 100 according to the present invention. The dividing apparatus 100 includes a conveyor belt 16 on which a ceramic fired product W2 configured as a work substrate for taking a plurality of ceramic wiring boards 1 is placed, and a support base 10 having a support surface 10p on which the conveyor belt 16 slides. The pressing mechanism 15 that presses the ceramic fired product W2 toward the support base 10 within a range that does not hinder the transport, and the ceramic fired product W2 is adjacent to the support base 10 on the downstream side in the transport direction and to the support surface 10p. It is configured to include an angle unit 18 (riding portion) having an inclined surface 18p inclined at a certain angle on the arrangement side, and a buffer mechanism 20 to which the angle unit 18 is connected. The pressing mechanism 15 includes a pressing base 12 and a pressing belt 14. A part of the angle unit 18 protrudes upward (vertically upward) from the support surface 10p.
[0023]
The support base 10 is arranged so that the support surface 10p, which is the upper surface thereof, substantially coincides horizontally. The pressing base 12 is arranged vertically above the support base 10 so that the pressing surface 12p, which is the lower surface thereof, is substantially parallel to the upper surface 10p of the support base 10. The conveying belt 16 and the pressing belt 14 are guided in a gap formed by the support surface 10p and the pressing surface 12p. The space between the conveyor belt 16 and the pressing belt 14 is adjusted to the thickness of the ceramic wiring board 1 to be obtained. The ceramic fired product W2 is sandwiched between the transport belt 16 and the pressing belt 14 so that the divided grooves 31 that partition the individual ceramic wiring boards 1 are orthogonal to the transport direction. In addition, although illustration is abbreviate | omitted, the carrying-in apparatus which guides the ceramic sintered product W2 between the conveyance belt 16 and the press belt 14 in the one end side (right side in a figure) in a conveyance direction is provided, and the other end side ( On the left side in the figure, a recovery device for the ceramic wiring board 1 obtained by the division is provided.
[0024]
The conveying belt 16 is wound around pulleys 17a, 17b and 17c, and the pressing belt 14 is wound around pulleys 13a and 13b. Each pulley is driven by an actuator (not shown) such as a motor (not shown). By controlling the number of rotations of the pulley by controlling the actuator, the conveying belt 16 and the pressing belt 14 are driven (synchronously driven) at the same speed. Thereby, the ceramic fired product W2 disposed between the belts 16 and 14 is transported in the horizontal direction, and the leading portion protruding from the support surface 10p rides on the inclined surface 18p corresponding to the upper surface of the angle unit 18 together with the transport belt 16. On the rear side, the pressing base 12 prevents the ceramic fired product W2 from being lifted. However, when a shearing force in the substrate thickness direction is applied to the dividing groove 31 along with the conveyance, the ceramic fired product W2 is divided. It breaks along the groove 31. While the ceramic fired product W2 is subjected to division, the driving speed of the conveyor belt 16 and the pressing belt 14 is kept constant, that is, a configuration in which division is performed by continuous conveyance is adopted, thereby realizing high productivity. it can.
[0025]
FIG. 8 shows a schematic diagram of a ceramic fired product subjected to division. As shown in the above figure, the ceramic fired product W1 is configured as a multi-piece work substrate in which a large number of ceramic wiring substrates 1 are integrally formed. In this ceramic fired product W1, dividing grooves 31 for obtaining individual ceramic wiring boards 1 are formed in a lattice shape. While removing the ear | edge part 30 of such a large-sized ceramic fired product W1, the strip-shaped ceramic fired product W2 is folded, and this is arranged in a line on the conveyance belt 16 of the dividing apparatus 100. However, when the strip-shaped ceramic fired product W2 is obtained from the large-sized ceramic fired product W1, the dividing device 100 can also be used.
[0026]
Returning to FIG. 1, the details will be described. The ceramic fired product W2 sandwiched between the belts 16 and 14 is conveyed while being pressed toward the support surface 10p by the pressing base 12 via the pressing belt 14. As shown in FIG. 1, since the pressing base 12 is in surface contact with the pressing belt 14, pressure equalization is applied to a portion of the ceramic fired product W <b> 2 located in a region immediately below the pressing surface 12 p. It will be. If a roller is used as in the prior art, pressure equalization cannot be applied over a wide range, but in the case of the present invention, this is possible because the pressing belt 14 itself is pressed. Therefore, when the top portion of the ceramic fired product W2 rides on the inclined surface 18p, it is possible to reliably prevent the ceramic fired product W2 from floating from the support surface 10p, thereby preventing the occurrence of defective division. In addition, the separation distance between the support base 10 and the pressing base 12 is adjusted to such an extent that the conveyance is allowed but the ceramic fired product W2 is prevented from being lifted. Specifically, it can be proposed to set the thickness substantially equal to the thickness of the ceramic wiring board 1. Moreover, since the conveyance belt 16 and the pressing belt 14 are made of a hard and wear-resistant resin such as polyurethane, this also contributes to smooth conveyance.
[0027]
For example, carbon steel harder than stainless steel can be used for the support base 10 and the press base 12 (the standard of hardness depends on Vickers hardness). If the support base 10 and the press base 12 are made of a soft material, irregularities and scratches are generated on the surfaces thereof, the slipping property of the transport belt 16 and the press belt 14 is reduced, and the belt itself is damaged. It is because there is a fear of letting it go. More preferably, at least a portion that forms the support surface 10p and a portion that forms the pressing surface 12p may be subjected to a surface treatment for reducing friction with the belts 16 and 14. Then, the ceramic fired product W2 can be transported more smoothly, the belts 16 and 14 are less likely to be damaged, the life of the belt is extended, and the time spent for maintenance of the dividing device 100 is extended. Can be reduced.
[0028]
The surface treatment as described above can be, for example, electrolytic or electroless plating treatment. According to the plating treatment, a smooth surface can be formed relatively easily and inexpensively. Specifically, Ni plating treatment can be shown as a preferred example. Such a surface treatment is also effective for the angle unit 18 described later.
[0029]
Further referring to the pressing base 12, as shown in FIG. 1, the length of the pressing surface 12p in contact with the pressing belt 14 in the conveying direction of the ceramic fired product W2 is larger than that of the unit ceramic wiring board 1. It is configured as follows. If the length of the pressing surface 12p is gradually shortened, a sufficient pressing action cannot be obtained gradually. Therefore, the pressing base 12 has a pressing force so that at least the whole of the ceramic wiring substrate 1 on the rear side across the dividing groove 31 and the ceramic wiring substrate 1 that is about to be divided is pressed toward the support surface 10p. It is necessary to ensure the width of the surface 12p. In the present embodiment, the length d1 of the pressing surface 12p in the transport direction has a length for pressing the plurality of connected ceramic wiring boards 1 simultaneously. In addition, when the direction parallel to the support surface 10p and orthogonal to the conveyance direction is the width direction, it is obvious that the width of the pressing surface 12p is adjusted to be sufficiently wider than the width of the ceramic fired product W2.
[0030]
Further, the end of the pressing surface 12p in the conveying direction of the ceramic fired product W2 coincides with the end of the support surface 10p. That is, the end of the pressing base 12 coincides with the end of the support base 10. This means that, for the ceramic fired product W2, protruding from the support surface 10p and deviating from a region where pressure equalization is applied from the pressing base 12 are substantially equivalent. That is, when the dividing groove 31 arrives at the end of the support surface 10p, the pressing force toward the support surface 10p suddenly decreases, and the ceramic fired product W2 is reliably divided.
[0031]
In addition, the opposing surfaces (the pressing surface 12p and the supporting surface 10p) of the support base 10 and the pressing base 12 are maintained in parallel, and an elevating mechanism for adjusting the parallel distance between the supporting base 10 and the pressing base 12 is provided. Can do. A specific example is shown in FIG. As shown in this example, the elevating mechanism 21 includes an elevating cylinder 62 fixedly attached to the frame 66 of the dividing device 100 and a connecting member 64 (which transmits the reciprocating motion of the elevating cylinder 62 to the support base 10 ( The following is represented by a connecting rod). The elevating cylinder 62 includes a stopper 60 that prevents the pressing base 12 from being too close to the support base 10 by limiting the movable range of the connecting rod 64. The stopper 60 is an adjustment nut that is screwed into a screw portion 61 formed on the connecting rod 64. By adjusting the position of the adjusting nut 60 in the screw portion 61, the limit movable position of the connecting rod 64 in the axial direction can be adjusted. In the example of FIG. 2, a position where the distance W between the lower end of the adjustment nut 60 and the upper end of the lifting cylinder is exactly zero is the limit movable position of the connecting rod 64. Even if the distance W becomes zero, the pressure from the lifting cylinder 62 continues to be applied to the pressing base 12. By operating or adjusting the elevating mechanism 21 as described above, the pressing base 12 and the support base 10 relatively approach / separate. As a result, it is possible to quickly cope with ceramic fired articles W2 having various thicknesses. It is also conceivable that a lifting mechanism is configured by attaching a stopper such as a bolt and a nut between the pressing base 12 and the support base 10.
[0032]
Next, as shown in FIG. 3, in the dividing device 100, an angle θ between the support surface 10 p and the surface on which the leading portion of the ceramic fired product W <b> 2 that protrudes from the support surface 10 p rides with the conveyor belt 16 is formed. 2 Is an inclined surface 18p (the upper surface of the angle unit 18). Since the inclined surface 18p does not require angle adjustment for each product, it contributes to shortening the time for adjusting the device before production.
[0033]
Inclination θ of the inclined surface 18p with respect to the support surface 10p 2 That is, the angle formed by the inclined surface 18p and the horizontal can be determined according to at least one of the cutting angle and the groove width of the divided groove 31 formed in the ceramic fired product W2 (, W1). FIG. 4 shows a state in which the ceramic fired product W <b> 2 is divided into individual ceramic wiring boards 1 along the division grooves 31. As shown in the upper diagram of FIG. 4, the cutting angle θ of the dividing groove 31 1 Although it depends on the type of product, it is adjusted to about 5 °, for example. When the ceramic fired product W2 is mounted on the inclined surface 18p, a crack is generated along the dividing groove 31 as shown in the lower diagram of FIG. At this time, if the angle of the inclined surface 18 p is too large, the ceramic wiring boards 1 and 1 adjacent to each other are brought into contact with each other at the peripheral portion of the dividing groove 31 and an excessive stress is applied to the peripheral portion of the dividing groove 31. Cracks will occur. This defect is caused by (cutting angle θ of dividing groove 31 1 )> (An angle θ of the inclined surface 18p with respect to the support surface 10p) 2 ), And can be prevented. However, if the angle of the inclined surface 18p is too small, the shearing force is insufficient and an undivided product may be generated. Therefore, in an optimal form, the inclination of the inclined surface 18p with respect to the support surface 10p, that is, the angle between the inclined surface 18p and the horizontal is set within a range of 3 ° to 10 °. Cut angle θ of dividing groove 31 1 As shown in FIG. 5, in the cross section in the substrate thickness direction, the angle can be an angle formed by a set of line segments connecting the bottom of the dividing groove 31 and the opening edge. Based on the above idea, the angle of the inclined surface 18p is always maintained in an appropriate range even if the type of the ceramic fired product W2 (, W1) to be divided is changed. In addition, based on the preset inclination angle of the inclined surface 18p, the cutting angle θ of the dividing groove 31 1 It is also possible to calculate back.
[0034]
Further, regarding the angle unit 18 that forms the inclined surface 18p, it is desirable that at least the portion forming the inclined surface 18p is made of, for example, carbon steel harder than stainless steel. When the portion forming the inclined surface 18p is made of a soft material, unevenness and scratches are likely to occur on the inclined surface 18p, the slipping property of the conveying belt 16 is reduced, and the stress is suddenly applied to the ceramic fired product W2. This is because it is easy to invite a division failure. Further, as described above, a surface treatment such as a plating treatment may be performed on the portion forming the inclined surface 18p.
[0035]
In terms of preventing sudden stress from being applied to the ceramic fired product W2, for example, a thin film made of a resin such as polypropylene is overlaid on the conveyor belt 16, and the ceramic fired product W2 is placed on the film. It is desirable to adopt a method of placing and dividing the. This is because when the divided waste generated in accordance with the division accumulates on the conveyor belt 16, it is predicted that the accumulated divided waste causes the stress applied to the ceramic fired product W2 to vary, resulting in division failure. For example, if such a resin film is provided so as to be fed out from the feeding roller and overlapped with the conveyor belt 16, work time for exchanging the resin film can be saved, and productivity is not lowered.
[0036]
Next, as shown in FIG. 1, the angle unit 18 includes an angle (inclination angle θ) formed by the inclined surface 18p and the support surface 10p when the leading portion of the ceramic fired product W2 and the conveyor belt 16 ride on the inclined surface 18p. 2 ) Is kept constant, and is connected to a buffer mechanism 20 that moves the inclined surface 18p in a direction that relaxes the bending of the leading portion of the ceramic fired product W2. FIG. 6 is a schematic diagram showing the bending suppression effect of the ceramic wiring board 1 by the buffer mechanism 20.
[0037]
First, as shown in FIG. 6 (stage 1), the ceramic fired product W2 is discharged together with the pressing belt 14 and the conveying belt 16 from between the support base 10 and the pressing base 12. As the conveyance proceeds, the leading portion of the ceramic fired product W2 rides on the inclined surface 18p, and at the same time, the angle unit 18 descends (see stage 2). Thereby, since the bending deformation amount of the ceramic fired product W2 is kept small, the product portion does not break. When the dividing groove 31 coincides with the edge of the support surface 10p, a break occurs along the dividing groove 31, and the angle unit 18 returns to the original height (see step 3).
[0038]
By the way, it is desirable that the buffer mechanism 20 is configured to be able to change a sinking amount (displacement amount) when a certain load is applied to the angle unit 18. That is, the elastic force applied to the angle unit 18 by the buffer mechanism 20 can be adjusted. According to this, the apparatus adjustment when the design of the product to be divided is changed can be performed more easily and quickly. In the present embodiment, the pressure of the buffer mechanism 20 is adjusted according to the thickness of the ceramic fired product W2. Specifically, a hydraulic actuator such as a hydraulic cylinder or a pneumatic actuator such as a pneumatic cylinder can be suitably used for the buffer mechanism 20. With regard to these actuators, for example, a microcomputer (elastic force setting means) may be used so that the setting of the elastic force can be switched according to the product to be divided.
[0039]
In the present embodiment, the angle unit 18 sinks vertically downward. However, in order to obtain a higher bending suppression effect, for example, the angle unit 18 sinks in a direction perpendicular to the inclined surface 18p. The buffer mechanism 20 may be arranged in
[0040]
Examples of the ceramic wiring board 1 to be divided by the dividing apparatus 100 of the present invention include a semiconductor element package and a CSP (Chip Size Package). A concept in which at least one of a resistor, a capacitor, and an inductor is integrated into a module to form a module is also included in the concept of the ceramic wiring substrate 1. Also, multilayer capacitors, coils, LC filters, noise filters, ceramic filters, SAW filters, antenna switch modules, diplexers, duplexers, couplers (directional couplers), couplers with low-pass filters, chip resistors, thermistors, dielectric antennas Ceramic electronic parts such as balun (balance-unbalance conversion element), mixer module board, PLL module board, VCO (voltage controlled oscillator), TCXO (temperature compensated crystal oscillator) are also included in the concept of the ceramic wiring board 1 It is.
[0041]
Hereinafter, a method for manufacturing the ceramic wiring substrate 1 will be described. As shown in FIG. 7, first, a ceramic green sheet 50 to be an insulating layer is prepared. The ceramic green sheet 50 is formed into a sheet by a molding method such as a doctor blade method by mixing and kneading additives, such as a solvent, a binder, a plasticizer, a peptizer, and a wetting agent, with the raw material ceramic powder of the insulating layer. It is a thing. In a predetermined position of the ceramic green sheet 50, a wiring through-hole VA having a predetermined shape is formed by laser or punching.
[0042]
Hereinafter, a method for manufacturing the ceramic wiring substrate 1 will be described. As shown in FIG. 7, first, a ceramic green sheet 50 to be an insulating layer is prepared ((1) green sheet forming step). The ceramic green sheet 50 is formed into a sheet by a molding method such as a doctor blade method by mixing and kneading additives, such as a solvent, a binder, a plasticizer, a peptizer, and a wetting agent, with the raw material ceramic powder of the insulating layer. It is a thing. A predetermined shape of the wiring through-hole VA is formed at a predetermined position of the ceramic green sheet 50 by laser or punching ((2) via formation step).
[0043]
Next, the conductor paste 55 is filled into the through holes VA for wiring of the ceramic green sheet 50 ((3) conductor paste filling step). Then, a wiring pattern 51 (including a pattern of the element when a thick film circuit element is formed) is formed on the ceramic green sheet 50 ((4) wiring pattern forming step). The wiring pattern 51 can be formed by a known screen printing method using a metal powder paste. When the formation of the wiring pattern 51 and the filling of the conductor paste 55 are completed in this way, another ceramic green sheet 52 is overlaid thereon. Further, by repeating the process of laminating the pattern printing / ceramic green sheets 54, 56, and 58 ((5) laminating process), an unfired ceramic laminated body 200 is obtained.
[0044]
Next, along the planned dividing line S of the ceramic laminate 200, the dividing grooves 31 are formed in a lattice shape by the cutting blades 59 from both main surface sides ((6) dividing groove forming step). In the present embodiment, an example in which the ceramic laminate 200 is formed as a five-layer plate is shown, and the cutting depth of the dividing groove 31 is set to reach about one ceramic green sheet to be laminated. By firing the ceramic laminate 200 having the dividing grooves 31 as described above, the large-sized ceramic fired product W1 shown in FIG. 8 can be obtained ((7) firing step). In addition, when the baking process includes a plurality of baking processes including temporary baking and main baking, it is also possible to form the dividing grooves 31 after the temporary baking.
[0045]
The ceramic fired product W1 produced as described above is subjected to a known process (not shown) such as a plating process, and the ear portion 30 is removed and folded into a strip-shaped ceramic fired product W2. Then, by supplying the strip-shaped ceramic fired product W2 onto the conveying belt 16 of the dividing device 100, the individual ceramic wiring board 1 can be obtained on the downstream side in the conveying direction ((8) dividing step).
[0046]
Since the dividing apparatus 100 in FIG. 1 shows an optimum mode, it is obvious that another type of dividing apparatus can be provided by selecting a significant configuration of the apparatus. That is, the invention is not limited to the embodiment shown in FIG.
[Brief description of the drawings]
FIG. 1 is a schematic side view of an essential part of a ceramic fired product dividing apparatus according to the present invention.
FIG. 2 is a schematic diagram of an elevating mechanism provided in the dividing device of FIG.
FIG. 3 is a partially enlarged schematic view of the dividing device in FIG. 1;
FIG. 4 is an explanatory diagram showing the relationship between the angle of the inclined surface with respect to the support surface and the cut angle of the dividing groove.
FIG. 5 is an explanatory view showing a method for defining a cut angle of a dividing groove.
FIG. 6 is a schematic diagram showing a bending suppression effect of a ceramic wiring board by a buffer mechanism.
FIG. 7 is a process explanatory diagram illustrating a method for manufacturing a ceramic wiring board.
FIG. 8 is a schematic diagram of a ceramic fired product.
[Explanation of symbols]
1 Ceramic wiring board
10 Support base
10p support surface
12 Press base
12p pressing surface
14 Press belt
15 Pressing mechanism
16 Conveyor belt
18 Angle unit (riding part)
18p inclined surface
20 Hydraulic cylinder (buffer mechanism)
21 Lifting mechanism
31 Dividing groove
100 dividing device
W1, W2 Ceramic fired products

Claims (10)

  1. A method of manufacturing a ceramic wiring board by dividing a ceramic fired product configured as a work substrate by taking a plurality of ceramic wiring boards along a dividing groove, wherein the ceramic fired product is placed on a conveyor belt moving on a support surface. The ceramic fired product is placed and conveyed while being pressed by the pressing mechanism toward the support surface, and at least a part of the ceramic fired product is located on the downstream side in the conveyance direction from the support surface when viewed from the support surface. The board is made of a hard material, and the leading portion of the ceramic fired product that protrudes from the support surface along with the conveyance is carried along with the conveyance belt. wherein by applying the dividing grooves, shall divide the ceramic baked product, by that time, the buffer mechanism connected to the extended part of, In a direction to relax the bending of the serial ceramic sintered product, the production method of the ceramic wiring board, characterized in that so as to sink the riding portion elastically.
  2. The method for manufacturing a ceramic wiring board according to claim 1, wherein the buffer mechanism connected to the riding section adjusts a sinking amount when a certain load is applied to the riding section according to the type of the ceramic wiring board .
  3. 3. The ceramic wiring board according to claim 1, wherein the climbing portion includes an inclined surface that is inclined at a certain angle with respect to the support surface, and a leading portion of the ceramic fired product is mounted on the inclined surface. Manufacturing method .
  4. The ceramic fired product is sandwiched between the conveying belt and a pressure belt that is driven in synchronization, and at least one region of the ceramic wiring board is pressed toward the support surface through the pressure belt while pressing the region. The method for manufacturing a ceramic wiring board according to claim 1, wherein a ceramic fired product is conveyed.
  5. A device for dividing a ceramic fired product formed as a work substrate by taking a plurality of ceramic wiring boards along a dividing groove,
    A conveyor belt on which the ceramic fired product is placed;
    A support base having a support surface on which the conveyor belt moves; and
    A pressing mechanism that presses the ceramic fired product toward the support base without hindering conveyance;
    Beginning of protruding from the supporting surface along with the conveying said ceramic baked product moves onto each of the conveyor belt, and at least a portion ride is made of a hard material located above viewed from the support surface portion,
    A buffer mechanism that elastically sinks the riding-up portion in a direction that relaxes the bending of the ceramic fired product when the top portion of the ceramic fired product rides on the entire conveyor belt;
    A ceramic fired product dividing apparatus comprising:
  6.   The riding section has an inclined surface that is adjacent to the support base on the downstream side in the conveying direction and is inclined to the ceramic fired product side with respect to the support surface, and the leading portion of the ceramic fired product protruding from the support surface 6. The apparatus for dividing a fired ceramic product according to claim 5, wherein the portion is configured to run on the inclined surface together with the conveyor belt.
  7.   7. The ceramic fired product dividing apparatus according to claim 5, wherein the buffer mechanism is configured to be able to change a sinking amount when a certain load is applied to the riding-up portion.
  8.   8. The ceramic fired product dividing apparatus according to claim 5, wherein the buffer mechanism is a hydraulic actuator or a pneumatic actuator.
  9.   The said pressing mechanism is comprised including the pressing belt driven synchronously with the said conveyance belt, and the press base which presses the said ceramic sintered product toward the said support surface in surface contact with the pressing belt. 9. The ceramic fired product dividing apparatus according to any one of 5 to 8.
  10.   The apparatus for dividing a ceramic fired product according to claim 9, wherein an end of a pressing position by the press base in a conveying direction of the ceramic fired product is coincident with an end of the support surface.
JP2003007656A 2003-01-15 2003-01-15 Manufacturing method of ceramic wiring board and ceramic fired product dividing apparatus Active JP4227811B2 (en)

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JP5508133B2 (en) * 2010-05-19 2014-05-28 株式会社ディスコ Plate-shaped material dividing device
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