JP2015140290A - Break apparatus - Google Patents

Break apparatus Download PDF

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JP2015140290A
JP2015140290A JP2014014770A JP2014014770A JP2015140290A JP 2015140290 A JP2015140290 A JP 2015140290A JP 2014014770 A JP2014014770 A JP 2014014770A JP 2014014770 A JP2014014770 A JP 2014014770A JP 2015140290 A JP2015140290 A JP 2015140290A
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substrate
pressing
receiving
transport
scribe line
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圭介 富永
Keisuke Tominaga
圭介 富永
生芳 高松
Ikuyoshi Takamatsu
生芳 高松
護 秀島
Mamoru Hideshima
護 秀島
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三星ダイヤモンド工業株式会社
Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2014014770A priority Critical patent/JP2015140290A/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Abstract

PROBLEM TO BE SOLVED: To provide a break apparatus capable of breaking an upper first substrate and a lower second substrate along scribe lines formed thereon without turning over a mother substrate.SOLUTION: A break apparatus comprises a conveyor 2 including a conveyance belt 1 for conveying a stuck substrate M placed thereon, a press member 4 which is disposed over the conveyance belt 1 and can move up and down, a first receiving member 12 which comes into contact with the reverse side of the conveyance belt 1, and a press member 8 which is disposed over the conveyance belt 1 upstream from the press member 4 in a substrate conveying direction and can move up and down. The conveyance belt 1 is formed of an elastic raw material which flexes with pressing force of the press member 4, and the first receiving member 12 has an edge 12a on a substrate conveying-direction downstream side formed extending in a direction orthogonal to the substrate conveying direction.

Description

本発明は、貼り合わせ基板をスクライブラインに沿って分断するためのブレイク装置に関する。   The present invention relates to a break device for cutting a bonded substrate along a scribe line.
液晶表示パネル用貼り合わせ基板は、二枚の大面積ガラス基板を使用し、一方の基板上にカラーフィルタを形成して、他方の基板上に液晶を駆動するTFT(Thin Film Transistor)及び端子領域を形成する。そして、これら二枚の基板を貼り合わせて大判のマザー基板を作成し、スクライブ工程並びにブレイク工程を経て、一つ一つの単位表示パネルにブレイク(分断)することにより製品となる液晶表示パネルが切り出される。   The laminated substrate for the liquid crystal display panel uses two large area glass substrates, a color filter is formed on one substrate, and a TFT (Thin Film Transistor) and terminal area for driving the liquid crystal on the other substrate Form. Then, these two substrates are pasted together to create a large mother substrate, and through a scribing process and a breaking process, each unit display panel is broken (divided) into a liquid crystal display panel as a product. It is.
マザー基板をブレイクする手順として、例えば特許文献1で示すものがある。この方法の概要について図6を参照して説明する。
図5(a)に示すように、マザー基板Mをテーブル20上に載置し、上側の第一基板M1の表面にスクライブ予定ラインに沿ってカッターホイール(スクライビングホイールともいう)21を圧接させながら相対移動させることにより、スクライブラインS1を形成する。次いで図5(b)に示すように、マザー基板Mを表裏反転させてクッションシート22上に載せ、第二基板M2上からブレイクバー23を押し付けてマザー基板Mを撓ませることにより、スクライブラインS1の亀裂を厚み方向に浸透させて第一基板M1をスクライブラインS1に沿ってブレイクする。続いて図5(c)に示すように、マザー基板Mの第二基板M2の表面にカッターホイール21でスクライブラインS2を加工する。この後、図5(d)に示すように、マザー基板Mを再度反転させてクッションシート22上に載せ、ブレイクバー23を押し付けて第二基板M2をスクライブラインS2に沿ってブレイクするようにしている。
As a procedure for breaking the mother substrate, for example, there is one disclosed in Patent Document 1. An outline of this method will be described with reference to FIG.
As shown in FIG. 5A, the mother substrate M is placed on the table 20, and a cutter wheel (also referred to as a scribing wheel) 21 is pressed against the surface of the upper first substrate M1 along a planned scribe line. A scribe line S1 is formed by relative movement. Next, as shown in FIG. 5 (b), the mother substrate M is turned upside down and placed on the cushion sheet 22, and the break bar 23 is pressed from the second substrate M2 to bend the mother substrate M, thereby forming the scribe line S1. The first substrate M1 is broken along the scribe line S1 by infiltrating the cracks in the thickness direction. Subsequently, as shown in FIG. 5C, the scribe line S <b> 2 is processed by the cutter wheel 21 on the surface of the second substrate M <b> 2 of the mother substrate M. Thereafter, as shown in FIG. 5 (d), the mother substrate M is inverted again and placed on the cushion sheet 22, and the break bar 23 is pressed to break the second substrate M2 along the scribe line S2. Yes.
また別の方法として、先にマザー基板の第一基板並びに第二基板の両方にスクライブラインを形成した後、当該スクライブラインに沿ってブレイクする方法がある。
この方法では、図6(a)に示すように、マザー基板Mをテーブル20上に載置し、第一基板M1の表面にカッターホイール21でスクライブラインS1を形成する。次いで、図6(b)に示すように、マザー基板Mを表裏反転させて上記同様にカッターホイール21で第二基板M2にスクライブラインS2を形成する。この後、図6(c)に示すように、マザー基板Mをクッションシート22上に載せ、第二基板M2上からブレイクバー23を押し付けることによりマザー基板Mを撓ませて、第一基板M1のスクライブラインS1の亀裂を厚み方向に浸透させて当該スクライブラインS1から第一基板M1をブレイクする。続いて図6(d)に示すように、マザー基板Mを反転させて第一基板M1上から上記同様にブレイクバー23を押し付けることにより、第二基板M2をスクライブラインS2に沿ってブレイクする。
As another method, there is a method in which a scribe line is first formed on both the first substrate and the second substrate of the mother substrate and then a break is made along the scribe line.
In this method, as shown in FIG. 6A, a mother substrate M is placed on a table 20, and a scribe line S1 is formed by a cutter wheel 21 on the surface of the first substrate M1. Next, as shown in FIG. 6B, the mother substrate M is turned upside down, and the scribe line S2 is formed on the second substrate M2 by the cutter wheel 21 in the same manner as described above. Thereafter, as shown in FIG. 6C, the mother substrate M is placed on the cushion sheet 22, and the mother substrate M is bent by pressing the break bar 23 from the second substrate M2, so that the first substrate M1 The crack of the scribe line S1 is penetrated in the thickness direction, and the first substrate M1 is broken from the scribe line S1. Subsequently, as shown in FIG. 6D, the mother substrate M is reversed and the break bar 23 is pressed from the first substrate M1 in the same manner as described above, thereby breaking the second substrate M2 along the scribe line S2.
特開2002−103295号公報JP 2002-103295 A
上記したマザー基板のブレイク工程では、何れの場合も一方の基板をブレイクバーでブレイクした後に、マザー基板を反転させて反対側の基板をブレイクする工程、すなわち、マザー基板を表裏反転させる動作を必要としている。
しかし、このような基板の反転動作は基板を反転させるための機構を必要とし、装置が大掛かりになるとともに装置コストも高くなる。加えて、反転動作に時間がかかるとともに、反転動作中にマザー基板を傷つけるリスクも発生して生産性が低下するといった問題点もあった。
そこで、本発明の目的は、マザー基板を表裏反転させることなく第一基板及び第二基板に形成されたスクライブラインをブレイクすることができるブレイク装置を提供することにある。
In the break process of the mother board described above, in any case, after breaking one of the boards with a break bar, the mother board is reversed and the opposite board is broken, that is, the mother board needs to be reversed. It is said.
However, such a substrate reversal operation requires a mechanism for reversing the substrate, which increases the size of the apparatus and increases the cost of the apparatus. In addition, the reversing operation takes time, and there is also a problem that the risk of damaging the mother substrate during the reversing operation is generated and productivity is lowered.
Therefore, an object of the present invention is to provide a breaking device that can break the scribe lines formed on the first substrate and the second substrate without inverting the mother substrate.
上記課題を解決するためになされた本発明のブレイク装置は、それぞれの表面にスクライブラインが形成された第一基板と第二基板とが貼り合わされた貼り合わせ基板を、前記スクライブラインに沿ってブレイクするブレイク装置であって、前記貼り合わせ基板を載置して上流から下流に搬送する搬送帯を備えたコンベアと、前記搬送帯の上方に配置された昇降可能な押圧部材と、前記搬送帯の裏面に接触する第一受け部材と、前記押圧部材よりも基板搬送方向上流側で前記搬送帯の上方に配置された昇降可能な押さえ部材とからなり、前記搬送帯は、前記押圧部材の押し付け力によって撓むことができる弾力性のある素材で形成され、前記第一受け部材の基板搬送方向下流側の端縁が、基板搬送方向に対して直交する方向に延伸して形成されている構成とした。   The breaking device of the present invention made to solve the above-described problems is a method of breaking a bonded substrate in which a first substrate having a scribe line formed on each surface and a second substrate are bonded together along the scribe line. A breaker that includes a conveyor band that carries the bonded substrate and conveys the substrate from upstream to downstream; a pressing member that can be moved up and down disposed above the conveyance band; and The first receiving member that contacts the back surface and a pressing member that can be moved up and down and disposed above the transport band on the upstream side in the substrate transport direction with respect to the pressing member, the transport band is a pressing force of the press member Formed by an elastic material that can be bent by the substrate, and the edge of the first receiving member on the downstream side in the substrate transport direction is formed by extending in a direction perpendicular to the substrate transport direction. It was Configurations.
本発明によれば、分断すべきスクライブラインの上方から押圧部材を貼り合わせ基板に押し付けて、貼り合わせ基板を搬送帯もろとも下方に撓ませることにより、下側基板のスクライブラインをブレイクすることができる。また、受け部材から上側基板のスクライブラインが離れた位置で、貼り合わせ基板の先頭部分の上面を押圧部材で押し付けて、貼り合わせ基板を外側に折り曲げるように撓ませることにより、上側基板に形成したスクライブラインに沿ってブレイクすることができる。
このように本発明では、貼り合わせ基板を搬送帯に載置した姿勢のまま表裏反転させることなく、上側基板のスクライブライン及び下側基板のスクライブラインをブレイクすることが可能となり、従来のような貼り合わせ基板を反転させるための工程を省略することができて装置全体をコンパクトに構成でき、装置コストの低減化を図ることができる。加えて、反転させるための時間を必要とせずタクト時間を短縮でき、生産性を向上させることができるといった効果がある。
According to the present invention, it is possible to break the scribe line of the lower substrate by pressing the pressing member against the bonded substrate from above the scribe line to be divided and bending the bonded substrate downward along with the transport band. it can. In addition, at the position where the scribe line of the upper substrate is separated from the receiving member, the upper surface of the top portion of the bonded substrate is pressed with a pressing member, and the bonded substrate is bent to be bent outward, thereby forming the upper substrate. Break along the scribe line.
Thus, in the present invention, it is possible to break the scribe line of the upper substrate and the scribe line of the lower substrate without turning the front and back in the posture in which the bonded substrate is placed on the transport belt, The process for inverting the bonded substrate can be omitted, the entire apparatus can be configured compactly, and the apparatus cost can be reduced. In addition, there is an effect that tact time can be shortened without requiring time for inversion, and productivity can be improved.
本発明において、前記押圧部材は前記基板搬送方向に沿って移動可能に形成されている構成とするのがよい。
これにより、貼り合わせ基板の上側基板のスクライブラインと下側基板のスクライブラインを同一の押圧部材でブレイクすることができ、装置の簡略化を図ることができる。
In the present invention, the pressing member may be configured to be movable along the substrate transport direction.
Thereby, the scribe line of the upper substrate of the bonded substrate and the scribe line of the lower substrate can be broken by the same pressing member, and the apparatus can be simplified.
また、本発明において、前記第一受け部材との間に間隔をあけて、前記搬送帯の裏面に接触する第二受け部材を前記第一受け部材と平行に設けた構成とするのがよい。
これにより、貼り合わせ基板の下側基板のスクライブラインをブレイクする際に、第一受け部材と第二受け部材の間で貼り合わせ基板を容易に撓ませることができ、確実にブレイクすることが可能となる。
Moreover, in this invention, it is good to set it as the structure which provided the 2nd receiving member in contact with the back surface of the said conveyance belt in parallel with the said 1st receiving member at intervals between said 1st receiving members.
As a result, when the scribe line of the lower substrate of the bonded substrate is broken, the bonded substrate can be easily bent between the first receiving member and the second receiving member, and the break can be reliably performed. It becomes.
本発明に係るブレイク装置の一例を示す概略的な斜視図。1 is a schematic perspective view showing an example of a break device according to the present invention. 図1のブレイク装置を側面視した説明図。Explanatory drawing which looked at the breaking apparatus of FIG. 1 from the side. 図1のブレイク装置の動作を示す説明図。Explanatory drawing which shows operation | movement of the breaking apparatus of FIG. 本発明に係る別実施例のブレイク装置を側面視した説明図。Explanatory drawing which looked at the break apparatus of another Example which concerns on this invention from the side. 従来のブレイク手段の一例を示す説明図。Explanatory drawing which shows an example of the conventional break means. 従来のブレイク手段の別の一例を示す説明図。Explanatory drawing which shows another example of the conventional break means.
以下において、本発明のブレイク装置の詳細を、図1〜3に基づいて説明する。
本発明のブレイク装置でブレイクされる液晶表示パネル用貼り合わせマザー基板Mは、第一基板M1と第二基板M2とが貼り合わされ、第一基板M1の表面に第一スクライブラインS1が、第二基板M2の表面に第二スクライブラインS2が前工程のスクライブ工程で予め形成されている。この貼り合わせマザー基板Mを、ここでは単に「マザー基板M」という。
Below, the detail of the breaking apparatus of this invention is demonstrated based on FIGS.
In the bonded mother substrate M for a liquid crystal display panel to be broken by the breaking device of the present invention, the first substrate M1 and the second substrate M2 are bonded together, and the first scribe line S1 is formed on the surface of the first substrate M1. A second scribe line S2 is previously formed on the surface of the substrate M2 in the scribe process of the previous process. Here, the bonded mother substrate M is simply referred to as “mother substrate M”.
ブレイク装置Aは、マザー基板Mを載置して上流から下流に、すなわち、図1、2のY方向に搬送する搬送帯(ベルト)1を備えたコンベア2を備えている。搬送帯1は複数の輪体3…によって無端状に張設されており、コンピュータの制御部で制御されたモータ(図示略)によって駆動される。   The breaking device A includes a conveyor 2 having a transport belt (belt) 1 on which a mother substrate M is placed and transported from upstream to downstream, that is, in the Y direction in FIGS. The transport band 1 is stretched endlessly by a plurality of rings 3 and is driven by a motor (not shown) controlled by a control unit of a computer.
搬送帯1の上側の部分、すなわち、マザー基板Mを載置してY方向に移動する送り側搬送帯部1aの中間位置で、その上方側に押圧部材4が昇降可能に配置されている。押圧部材4は、長尺板状のブレイクバーで形成され、図示したように先端が厚み方向の断面において山状に形成されている。また、押圧部材4は搬送帯1の基板搬送方向に対して直交する方向に沿って延伸され、門型のブリッジ5の水平なビーム(横梁)6に流体シリンダ7によって昇降できるように取り付けられている。ブリッジ5は搬送帯1の基板搬送方向、すなわち、Y方向に移動調整できるように装置のフレーム13に取り付けられており、これにより、押圧部材4の昇降位置をY方向に移動できるように形成されている。   The pressing member 4 is disposed so as to be movable up and down at an upper portion of the transport band 1, that is, at an intermediate position of the feed-side transport band 1a on which the mother substrate M is placed and moves in the Y direction. The pressing member 4 is formed of a long plate-like break bar, and the tip is formed in a mountain shape in the cross section in the thickness direction as shown in the figure. The pressing member 4 extends along a direction orthogonal to the substrate transport direction of the transport band 1 and is attached to a horizontal beam (lateral beam) 6 of the portal bridge 5 so as to be moved up and down by a fluid cylinder 7. Yes. The bridge 5 is attached to the frame 13 of the apparatus so that it can be moved and adjusted in the substrate transfer direction of the transfer band 1, that is, in the Y direction. ing.
さらに、押圧部材4より基板搬送方向上流側の送り側搬送帯部1aの上方には、押さえ部材8が配置されている。押さえ部材8は長尺の板材で形成され、下端面が平らに形成されている。また、押さえ部材8は押圧部材4に対して平行な姿勢で配置され、門型のブリッジ9の水平なビーム10にシリンダ11によって昇降できるように取り付けられている。   Further, a pressing member 8 is disposed above the feed side transport band 1a upstream of the pressing member 4 in the substrate transport direction. The pressing member 8 is formed of a long plate material, and the lower end surface is formed flat. The pressing member 8 is arranged in a posture parallel to the pressing member 4, and is attached to the horizontal beam 10 of the portal bridge 9 so as to be lifted and lowered by the cylinder 11.
また、送り側搬送帯部1aの裏側には、当該搬送帯部1aの一部を受ける第一受け部材12が設けられている。この第一受け部材12は、基板搬送方向上流側から下流側に向かって延び、終端は送り側搬送帯部1aの中間部位となっている。そして、この端縁12aが基板搬送方向に対して直交する方向に沿って形成されている。この第一受け部材12は、送り側搬送帯部1aの下方への弛みを防ぐ受け板としての機能も兼ねている。   Moreover, the 1st receiving member 12 which receives a part of the said conveyance belt | band | zone part 1a is provided in the back side of the sending side conveyance belt | band | zone part 1a. The first receiving member 12 extends from the upstream side in the substrate transport direction toward the downstream side, and the end is an intermediate portion of the feed-side transport band 1a. And this edge 12a is formed along the direction orthogonal to a board | substrate conveyance direction. The first receiving member 12 also functions as a receiving plate that prevents the feeding side transport band 1a from being slackened downward.
搬送帯1は、コンベアベルトとしての強度を備えながら、押圧部材4の押し付け力によって弾力的に撓むことが可能な弾性材料で形成されている。その材質として具体的には、天然ゴムや合成ゴム、或いは適度な弾力性を有する合成樹脂を用いることができる。   The conveyance band 1 is formed of an elastic material that can be flexibly bent by the pressing force of the pressing member 4 while having strength as a conveyor belt. Specifically, natural rubber, synthetic rubber, or a synthetic resin having appropriate elasticity can be used as the material.
上記の構成において、図2に示すように、押圧部材4を、第一受け部材12の端縁12aより少し基板搬送方向上流側に寄った第一押圧位置に配置する。この状態で、マザー基板MのスクライブラインS1、S2が搬送帯1の搬送方向に対して直交する方向に延在した状態で、かつ、第一基板M1を上側にした状態でマザー基板Mを送り側搬送帯部1a上に載置し、上流側から下流側(Y方向)に搬送する。そして、ブレイクすべきスクライブラインS2が押圧部材4の昇降位置に来た時に搬送帯1を停止させる。これらの位置検出は位置検出センサ(図示略)によって行われる。
そして、図3(a)に示すように、押圧部材4を下降させて第1受け部材12上で第一基板M1の表面を押圧することにより、マザー基板Mを送り側搬送帯部1aに押し付けて下方に撓ませる。これにより、第二スクライブラインS2の亀裂を基板厚み方向に浸透させて、第二基板M2を第二クライブラインS2に沿ってブレイクする。
次いで、図3(b)に示すように、コンベア2を駆動して、マザー基板MのスクライブラインS1が第一受け部材12の端縁12aより少し下流側になる位置までマザー基板Mを移動させる。また、押圧部材4を基板搬送方向下流側に移動させて、マザー基板Mの搬送方向側の先端部上方で昇降する第二押圧位置に配置する。同時に、押さえ部材8を下降させてマザー基板Mの表面に軽く接触させ、マザー基板Mの浮き上がりを防いでおく。この状態で、押圧部材4を下降させてマザー基板Mの先端を押圧し、マザー基板Mを搬送帯1とともにスクライブラインS1から外側へ折り曲げるように撓ませる。これにより、第一基板M1の第一スクライブラインS1の亀裂を基板厚み方向に浸透させて、第一基板M1を第一スクライブラインS1に沿ってブレイクする。この後、押圧部材4はもとの第一押圧位置に復帰し、上記同様に順次後続のスクライブラインS1、S2がブレイクされる。
In the above configuration, as shown in FIG. 2, the pressing member 4 is disposed at a first pressing position that is slightly closer to the upstream side in the substrate transport direction than the edge 12 a of the first receiving member 12. In this state, the mother substrate M is sent with the scribe lines S1 and S2 of the mother substrate M extending in a direction orthogonal to the transport direction of the transport band 1 and with the first substrate M1 facing upward. It is placed on the side transport band 1a and transported from the upstream side to the downstream side (Y direction). When the scribe line S <b> 2 to be broken comes to the raising / lowering position of the pressing member 4, the transport band 1 is stopped. These position detections are performed by a position detection sensor (not shown).
Then, as shown in FIG. 3A, the pressing member 4 is lowered to press the surface of the first substrate M1 on the first receiving member 12, thereby pressing the mother substrate M against the feeding-side transport band 1a. And bend down. As a result, the cracks in the second scribe line S2 are permeated in the substrate thickness direction, and the second substrate M2 is broken along the second scribe line S2.
Next, as shown in FIG. 3B, the conveyor 2 is driven to move the mother substrate M to a position where the scribe line S <b> 1 of the mother substrate M is slightly downstream from the edge 12 a of the first receiving member 12. . Further, the pressing member 4 is moved to the downstream side in the substrate transport direction, and is arranged at a second pressing position that moves up and down above the tip of the mother substrate M on the transport direction side. At the same time, the pressing member 8 is lowered to lightly contact the surface of the mother substrate M to prevent the mother substrate M from being lifted. In this state, the pressing member 4 is lowered to press the tip of the mother substrate M, and the mother substrate M is bent together with the transport band 1 so as to be bent outward from the scribe line S1. Thereby, the crack of the first scribe line S1 of the first substrate M1 is penetrated in the substrate thickness direction, and the first substrate M1 is broken along the first scribe line S1. Thereafter, the pressing member 4 returns to the original first pressing position, and the subsequent scribe lines S1 and S2 are sequentially broken in the same manner as described above.
マザー基板Mのブレイクすべきスクライブラインが押圧部材4の第一押圧位置に送られて来た時にコンベア2が停止する動作やその位置で押圧部材4が昇降する動作、また、その後押圧部材4が第二押圧位置に移動して昇降する動作及び押圧部材4がもとの第一押圧位置に復帰する動作は、装置に付帯するコンピュータで構成される制御部(図示略)によって行われる。   The operation of stopping the conveyor 2 when the scribe line to be broken of the mother board M is sent to the first pressing position of the pressing member 4, the operation of raising and lowering the pressing member 4 at that position, and the pressing member 4 thereafter The operation of moving up and down by moving to the second pressing position and the operation of returning the pressing member 4 to the original first pressing position are performed by a control unit (not shown) configured by a computer attached to the apparatus.
図4は本発明の別の実施例を示す。
この実施例では、第一受け部材12との間に所定の間隔をあけて、送り側搬送帯部1aの下面を受ける長尺棒状の第二受け部材12’が前記第一受け部材12と平行に設けられている。上記の間隔は、左右の受け部材12、12’との間でマザー基板Mを搬送帯部1aとともに下方に撓ませることが可能な寸法で設定されている。
マザー基板Mをブレイクする場合、まず押圧部材4を左右の受け部材12、12’の中間位置にセットする。そしてマザー基板MのスクライブラインS1、S2が搬送帯1の搬送方向に対して直交する方向に延在した状態で、かつ、第一基板M1を上側にした状態でマザー基板Mを送り側搬送帯部1a上に載置して上流から下流に搬送し、ブレイクすべきスクライブラインS2が押圧部材4の第一押圧位置に来た時に搬送帯1を停止させる。
そして、押圧部材4を下降させて第一基板M1の表面を押し付けてマザー基板Mを左右の受け部材12、12’の間で送り側搬送帯部1aとともに下方に撓ませる。これにより、第二スクライブラインS2の亀裂を基板厚み方向に浸透させて第二基板M2を第二クライブラインS2に沿ってブレイクする。
次いで、図4(b)に示すように、コンベアを駆動して、マザー基板MをスクライブラインS1が第二受け部材12’を超える位置まで搬送して停止させる。同時に、押圧部材4を基板搬送方向下流側に移動させて、マザー基板Mの搬送方向側の先端部上面で昇降する第二押圧位置に配置する。また、押さえ部材8を下降させてマザー基板Mの表面に軽く接触させ、マザー基板Mの浮き上がりを防いでおく。この状態で、押圧部材4を下降させてマザー基板Mの先端を押圧し、マザー基板MをスクライブラインS1から外側に折り曲げるように撓ませる。これにより、第一基板M1の第一スクライブラインS1の亀裂を基板厚み方向に浸透させて第一基板M1を第一スクライブラインS1に沿ってブレイクする。これら一連の動作は、装置に付帯するコンピュータで構成される制御部(図示略)によって行われる。
この実施例によれば、第二基板M2のスクライブラインS2をブレイクする際に、左右の第一受け部材12と第二受け部材12’の間でマザー基板Mを容易に撓ませることができ、確実にブレイクすることが可能となる。
FIG. 4 shows another embodiment of the present invention.
In this embodiment, a long bar-shaped second receiving member 12 ′ receiving the lower surface of the feeding-side transport band 1 a is parallel to the first receiving member 12 with a predetermined interval between the first receiving member 12 and the first receiving member 12. Is provided. The interval is set to a dimension that allows the mother board M to be bent downward together with the transport band 1a between the left and right receiving members 12, 12 ′.
When breaking the mother board M, first, the pressing member 4 is set at an intermediate position between the left and right receiving members 12, 12 ′. Then, the mother substrate M is placed in the state where the scribe lines S1 and S2 of the mother substrate M extend in a direction orthogonal to the transport direction of the transport band 1 and the first substrate M1 is on the upper side. The belt 1 is placed on the part 1a and conveyed from upstream to downstream, and the conveyance band 1 is stopped when the scribe line S2 to be broken reaches the first pressing position of the pressing member 4.
Then, the pressing member 4 is lowered to press the surface of the first substrate M1, and the mother substrate M is bent downward together with the feeding-side transport band 1a between the left and right receiving members 12, 12 ′. Thereby, the crack of 2nd scribe line S2 is osmose | permeated to a board | substrate thickness direction, and the 2nd board | substrate M2 is broken along 2nd scribe line S2.
Next, as shown in FIG. 4B, the conveyor is driven, and the mother board M is conveyed to a position where the scribe line S1 exceeds the second receiving member 12 ′ and stopped. At the same time, the pressing member 4 is moved to the downstream side in the substrate transport direction, and is arranged at the second pressing position that moves up and down on the top surface of the tip portion on the transport direction side of the mother substrate M. Further, the presser member 8 is lowered and lightly brought into contact with the surface of the mother substrate M to prevent the mother substrate M from being lifted up. In this state, the pressing member 4 is lowered to press the tip of the mother substrate M, and the mother substrate M is bent so as to be bent outward from the scribe line S1. Thereby, the crack of the 1st scribe line S1 of the 1st board | substrate M1 is osmose | permeated to a board | substrate thickness direction, and the 1st board | substrate M1 is broken along 1st scribe line S1. These series of operations are performed by a control unit (not shown) configured by a computer attached to the apparatus.
According to this embodiment, when breaking the scribe line S2 of the second substrate M2, the mother substrate M can be easily bent between the left and right first receiving members 12 and the second receiving member 12 ′, It becomes possible to break reliably.
以上のように本発明では、マザー基板Mを搬送帯1に載置した姿勢のまま表裏反転させることなく、第一基板M1の第一スクライブラインS1及び第二基板M2の第二スクライブラインS2をブレイクすることができる。これにより、従来のようなマザー基板を反転させるための機構を省略できて装置全体をコンパクトに構成することができ、コストの低減化を図ることができる。加えて、反転させるための時間を必要とせずタクト時間を短縮でき、生産性を向上させることが可能となる。   As described above, in the present invention, the first scribe line S1 of the first substrate M1 and the second scribe line S2 of the second substrate M2 are not reversed while maintaining the posture in which the mother substrate M is placed on the transport band 1. Can break. As a result, the conventional mechanism for reversing the mother substrate can be omitted, the entire apparatus can be made compact, and the cost can be reduced. In addition, the tact time can be shortened without requiring time for inversion, and productivity can be improved.
上記実施例においては、押圧部材4を第一押圧位置と第二押圧位置に移動できるようにして、第一スクライブラインS1と第二スクライブラインS2の両方を同一の押圧部材でブレイクできるようにしたが、これに換えて、第一押圧位置と第二押圧位置の両方にそれぞれ押圧部材を配置して構成するようにしてもよい。   In the above embodiment, the pressing member 4 can be moved to the first pressing position and the second pressing position, and both the first scribe line S1 and the second scribe line S2 can be broken by the same pressing member. However, instead of this, the pressing members may be arranged at both the first pressing position and the second pressing position, respectively.
以上、本発明の代表的な実施例について説明したが、本発明は必ずしも上記の実施例構造のみに特定されるものではない。例えば押圧部材4は、長尺板状のブレイクバーに替えて、マザー基板の表面を押圧しながら転動するローラであってもよい。その他本発明では、その目的を達成し、請求の範囲を逸脱しない範囲内で適宜修正、変更することが可能である。   As mentioned above, although the typical Example of this invention was described, this invention is not necessarily limited only to said Example structure. For example, the pressing member 4 may be a roller that rolls while pressing the surface of the mother substrate, instead of a long plate-like break bar. Others The present invention can be appropriately modified and changed within the scope of achieving the object and without departing from the scope of the claims.
本発明は、液晶表示パネル用貼り合わせ基板をブレイクするブレイク装置に適用することができる。   The present invention can be applied to a break device that breaks a bonded substrate for a liquid crystal display panel.
A ブレイク装置
M マザー基板
M1 第一基板
M2 第二基板
S1 第一基板のスクライブライン
S2 第二基板のスクライブライン
1 搬送帯
1a 送り側搬送帯部
2 コンベア
4 押圧部材
8 押さえ部材
12 第一受け部材
12’ 第二受け部材
A Break device M Mother substrate M1 First substrate M2 Second substrate S1 First substrate scribe line S2 Second substrate scribe line 1 Conveying band 1a Feeding side conveying band 2 Conveyor 4 Pressing member 8 Holding member 12 First receiving member 12 'Second receiving member

Claims (5)

  1. それぞれの表面にスクライブラインが形成された第一基板と第二基板とが貼り合わされた貼り合わせ基板を、前記スクライブラインに沿ってブレイクするブレイク装置であって、
    前記貼り合わせ基板を載置して上流から下流に搬送する搬送帯を備えたコンベアと、
    前記搬送帯の上方に配置された昇降可能な押圧部材と、
    前記搬送帯の裏面に接触する第一受け部材と、
    前記押圧部材よりも基板搬送方向上流側で前記搬送帯の上方に配置された昇降可能な押さえ部材とからなり、
    前記搬送帯は、前記押圧部材の押し付け力によって撓むことができる弾力性のある素材で形成され、
    前記第一受け部材の基板搬送方向下流側の端縁が、基板搬送方向に対して直交する方向に延伸して形成されていることを特徴とするブレイク装置。
    A breaking device for breaking a bonded substrate in which a first substrate and a second substrate having a scribe line formed on each surface are bonded together along the scribe line,
    A conveyor provided with a transport band for placing the bonded substrate and transporting the substrate from upstream to downstream;
    A pressing member capable of moving up and down disposed above the transport belt;
    A first receiving member in contact with the back surface of the transport band;
    It consists of a pressing member that can be moved up and down arranged above the transport band on the upstream side in the substrate transport direction than the pressing member,
    The transport band is formed of an elastic material that can be bent by the pressing force of the pressing member,
    A break device characterized in that an edge of the first receiving member on the downstream side in the substrate transport direction is formed by extending in a direction orthogonal to the substrate transport direction.
  2. 前記押圧部材が、前記基板搬送方向に沿って移動可能に形成されている請求項1に記載のブレイク装置。 The break device according to claim 1, wherein the pressing member is formed to be movable along the substrate transport direction.
  3. 前記第一受け部材が、前記搬送帯の裏面を支持する受け板である請求項1または請求項2に記載のブレイク装置。 The break device according to claim 1, wherein the first receiving member is a receiving plate that supports a back surface of the transport belt.
  4. 前記押圧部材が長尺のブレイクバーで形成され、前記基板搬送方向に対して直交する方向に沿って延設されている請求項1〜請求項3のいずれかに記載のブレイク装置。 The break device according to any one of claims 1 to 3, wherein the pressing member is formed of a long break bar and extends along a direction orthogonal to the substrate transport direction.
  5. 前記第一受け部材との間に間隔をあけて、前記搬送帯の裏面に接触する第二受け部材が前記第一受け部材と平行に設けられている請求項1〜請求項4のいずれかに記載のブレイク装置。 The second receiving member that is in contact with the back surface of the transport band with a space between the first receiving member and the first receiving member is provided in parallel with the first receiving member. Breaking device as described.
JP2014014770A 2014-01-29 2014-01-29 Break apparatus Pending JP2015140290A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105643721A (en) * 2016-02-17 2016-06-08 珠海迈科智能科技股份有限公司 PCBA board separation device
KR20170125806A (en) * 2014-12-16 2017-11-15 렌즈 테크놀로지 (창사) 컴퍼니 리미티드 Forming method for curved class

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170125806A (en) * 2014-12-16 2017-11-15 렌즈 테크놀로지 (창사) 컴퍼니 리미티드 Forming method for curved class
KR102025686B1 (en) 2014-12-16 2019-09-26 렌즈 테크놀로지 (창사) 컴퍼니 리미티드 Forming method for curved class
CN105643721A (en) * 2016-02-17 2016-06-08 珠海迈科智能科技股份有限公司 PCBA board separation device

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