JP2015140290A - Break apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a break apparatus capable of breaking an upper first substrate and a lower second substrate along scribe lines formed thereon without turning over a mother substrate.SOLUTION: A break apparatus comprises a conveyor 2 including a conveyance belt 1 for conveying a stuck substrate M placed thereon, a press member 4 which is disposed over the conveyance belt 1 and can move up and down, a first receiving member 12 which comes into contact with the reverse side of the conveyance belt 1, and a press member 8 which is disposed over the conveyance belt 1 upstream from the press member 4 in a substrate conveying direction and can move up and down. The conveyance belt 1 is formed of an elastic raw material which flexes with pressing force of the press member 4, and the first receiving member 12 has an edge 12a on a substrate conveying-direction downstream side formed extending in a direction orthogonal to the substrate conveying direction.

Description

  The present invention relates to a break device for cutting a bonded substrate along a scribe line.

  The laminated substrate for the liquid crystal display panel uses two large area glass substrates, a color filter is formed on one substrate, and a TFT (Thin Film Transistor) and terminal area for driving the liquid crystal on the other substrate Form. Then, these two substrates are pasted together to create a large mother substrate, and through a scribing process and a breaking process, each unit display panel is broken (divided) into a liquid crystal display panel as a product. It is.

As a procedure for breaking the mother substrate, for example, there is one disclosed in Patent Document 1. An outline of this method will be described with reference to FIG.
As shown in FIG. 5A, the mother substrate M is placed on the table 20, and a cutter wheel (also referred to as a scribing wheel) 21 is pressed against the surface of the upper first substrate M1 along a planned scribe line. A scribe line S1 is formed by relative movement. Next, as shown in FIG. 5 (b), the mother substrate M is turned upside down and placed on the cushion sheet 22, and the break bar 23 is pressed from the second substrate M2 to bend the mother substrate M, thereby forming the scribe line S1. The first substrate M1 is broken along the scribe line S1 by infiltrating the cracks in the thickness direction. Subsequently, as shown in FIG. 5C, the scribe line S <b> 2 is processed by the cutter wheel 21 on the surface of the second substrate M <b> 2 of the mother substrate M. Thereafter, as shown in FIG. 5 (d), the mother substrate M is inverted again and placed on the cushion sheet 22, and the break bar 23 is pressed to break the second substrate M2 along the scribe line S2. Yes.

As another method, there is a method in which a scribe line is first formed on both the first substrate and the second substrate of the mother substrate and then a break is made along the scribe line.
In this method, as shown in FIG. 6A, a mother substrate M is placed on a table 20, and a scribe line S1 is formed by a cutter wheel 21 on the surface of the first substrate M1. Next, as shown in FIG. 6B, the mother substrate M is turned upside down, and the scribe line S2 is formed on the second substrate M2 by the cutter wheel 21 in the same manner as described above. Thereafter, as shown in FIG. 6C, the mother substrate M is placed on the cushion sheet 22, and the mother substrate M is bent by pressing the break bar 23 from the second substrate M2, so that the first substrate M1 The crack of the scribe line S1 is penetrated in the thickness direction, and the first substrate M1 is broken from the scribe line S1. Subsequently, as shown in FIG. 6D, the mother substrate M is reversed and the break bar 23 is pressed from the first substrate M1 in the same manner as described above, thereby breaking the second substrate M2 along the scribe line S2.

JP 2002-103295 A

In the break process of the mother board described above, in any case, after breaking one of the boards with a break bar, the mother board is reversed and the opposite board is broken, that is, the mother board needs to be reversed. It is said.
However, such a substrate reversal operation requires a mechanism for reversing the substrate, which increases the size of the apparatus and increases the cost of the apparatus. In addition, the reversing operation takes time, and there is also a problem that the risk of damaging the mother substrate during the reversing operation is generated and productivity is lowered.
Therefore, an object of the present invention is to provide a breaking device that can break the scribe lines formed on the first substrate and the second substrate without inverting the mother substrate.

  The breaking device of the present invention made to solve the above-described problems is a method of breaking a bonded substrate in which a first substrate having a scribe line formed on each surface and a second substrate are bonded together along the scribe line. A breaker that includes a conveyor band that carries the bonded substrate and conveys the substrate from upstream to downstream; a pressing member that can be moved up and down disposed above the conveyance band; and The first receiving member that contacts the back surface and a pressing member that can be moved up and down and disposed above the transport band on the upstream side in the substrate transport direction with respect to the pressing member, the transport band is a pressing force of the press member Formed by an elastic material that can be bent by the substrate, and the edge of the first receiving member on the downstream side in the substrate transport direction is formed by extending in a direction perpendicular to the substrate transport direction. It was Configurations.

According to the present invention, it is possible to break the scribe line of the lower substrate by pressing the pressing member against the bonded substrate from above the scribe line to be divided and bending the bonded substrate downward along with the transport band. it can. In addition, at the position where the scribe line of the upper substrate is separated from the receiving member, the upper surface of the top portion of the bonded substrate is pressed with a pressing member, and the bonded substrate is bent to be bent outward, thereby forming the upper substrate. Break along the scribe line.
Thus, in the present invention, it is possible to break the scribe line of the upper substrate and the scribe line of the lower substrate without turning the front and back in the posture in which the bonded substrate is placed on the transport belt, The process for inverting the bonded substrate can be omitted, the entire apparatus can be configured compactly, and the apparatus cost can be reduced. In addition, there is an effect that tact time can be shortened without requiring time for inversion, and productivity can be improved.

In the present invention, the pressing member may be configured to be movable along the substrate transport direction.
Thereby, the scribe line of the upper substrate of the bonded substrate and the scribe line of the lower substrate can be broken by the same pressing member, and the apparatus can be simplified.

Moreover, in this invention, it is good to set it as the structure which provided the 2nd receiving member in contact with the back surface of the said conveyance belt in parallel with the said 1st receiving member at intervals between said 1st receiving members.
As a result, when the scribe line of the lower substrate of the bonded substrate is broken, the bonded substrate can be easily bent between the first receiving member and the second receiving member, and the break can be reliably performed. It becomes.

1 is a schematic perspective view showing an example of a break device according to the present invention. Explanatory drawing which looked at the breaking apparatus of FIG. 1 from the side. Explanatory drawing which shows operation | movement of the breaking apparatus of FIG. Explanatory drawing which looked at the break apparatus of another Example which concerns on this invention from the side. Explanatory drawing which shows an example of the conventional break means. Explanatory drawing which shows another example of the conventional break means.

Below, the detail of the breaking apparatus of this invention is demonstrated based on FIGS.
In the bonded mother substrate M for a liquid crystal display panel to be broken by the breaking device of the present invention, the first substrate M1 and the second substrate M2 are bonded together, and the first scribe line S1 is formed on the surface of the first substrate M1. A second scribe line S2 is previously formed on the surface of the substrate M2 in the scribe process of the previous process. Here, the bonded mother substrate M is simply referred to as “mother substrate M”.

  The breaking device A includes a conveyor 2 having a transport belt (belt) 1 on which a mother substrate M is placed and transported from upstream to downstream, that is, in the Y direction in FIGS. The transport band 1 is stretched endlessly by a plurality of rings 3 and is driven by a motor (not shown) controlled by a control unit of a computer.

  The pressing member 4 is disposed so as to be movable up and down at an upper portion of the transport band 1, that is, at an intermediate position of the feed-side transport band 1a on which the mother substrate M is placed and moves in the Y direction. The pressing member 4 is formed of a long plate-like break bar, and the tip is formed in a mountain shape in the cross section in the thickness direction as shown in the figure. The pressing member 4 extends along a direction orthogonal to the substrate transport direction of the transport band 1 and is attached to a horizontal beam (lateral beam) 6 of the portal bridge 5 so as to be moved up and down by a fluid cylinder 7. Yes. The bridge 5 is attached to the frame 13 of the apparatus so that it can be moved and adjusted in the substrate transfer direction of the transfer band 1, that is, in the Y direction. ing.

  Further, a pressing member 8 is disposed above the feed side transport band 1a upstream of the pressing member 4 in the substrate transport direction. The pressing member 8 is formed of a long plate material, and the lower end surface is formed flat. The pressing member 8 is arranged in a posture parallel to the pressing member 4, and is attached to the horizontal beam 10 of the portal bridge 9 so as to be lifted and lowered by the cylinder 11.

  Moreover, the 1st receiving member 12 which receives a part of the said conveyance belt | band | zone part 1a is provided in the back side of the sending side conveyance belt | band | zone part 1a. The first receiving member 12 extends from the upstream side in the substrate transport direction toward the downstream side, and the end is an intermediate portion of the feed-side transport band 1a. And this edge 12a is formed along the direction orthogonal to a board | substrate conveyance direction. The first receiving member 12 also functions as a receiving plate that prevents the feeding side transport band 1a from being slackened downward.

  The conveyance band 1 is formed of an elastic material that can be flexibly bent by the pressing force of the pressing member 4 while having strength as a conveyor belt. Specifically, natural rubber, synthetic rubber, or a synthetic resin having appropriate elasticity can be used as the material.

In the above configuration, as shown in FIG. 2, the pressing member 4 is disposed at a first pressing position that is slightly closer to the upstream side in the substrate transport direction than the edge 12 a of the first receiving member 12. In this state, the mother substrate M is sent with the scribe lines S1 and S2 of the mother substrate M extending in a direction orthogonal to the transport direction of the transport band 1 and with the first substrate M1 facing upward. It is placed on the side transport band 1a and transported from the upstream side to the downstream side (Y direction). When the scribe line S <b> 2 to be broken comes to the raising / lowering position of the pressing member 4, the transport band 1 is stopped. These position detections are performed by a position detection sensor (not shown).
Then, as shown in FIG. 3A, the pressing member 4 is lowered to press the surface of the first substrate M1 on the first receiving member 12, thereby pressing the mother substrate M against the feeding-side transport band 1a. And bend down. As a result, the cracks in the second scribe line S2 are permeated in the substrate thickness direction, and the second substrate M2 is broken along the second scribe line S2.
Next, as shown in FIG. 3B, the conveyor 2 is driven to move the mother substrate M to a position where the scribe line S <b> 1 of the mother substrate M is slightly downstream from the edge 12 a of the first receiving member 12. . Further, the pressing member 4 is moved to the downstream side in the substrate transport direction, and is arranged at a second pressing position that moves up and down above the tip of the mother substrate M on the transport direction side. At the same time, the pressing member 8 is lowered to lightly contact the surface of the mother substrate M to prevent the mother substrate M from being lifted. In this state, the pressing member 4 is lowered to press the tip of the mother substrate M, and the mother substrate M is bent together with the transport band 1 so as to be bent outward from the scribe line S1. Thereby, the crack of the first scribe line S1 of the first substrate M1 is penetrated in the substrate thickness direction, and the first substrate M1 is broken along the first scribe line S1. Thereafter, the pressing member 4 returns to the original first pressing position, and the subsequent scribe lines S1 and S2 are sequentially broken in the same manner as described above.

  The operation of stopping the conveyor 2 when the scribe line to be broken of the mother board M is sent to the first pressing position of the pressing member 4, the operation of raising and lowering the pressing member 4 at that position, and the pressing member 4 thereafter The operation of moving up and down by moving to the second pressing position and the operation of returning the pressing member 4 to the original first pressing position are performed by a control unit (not shown) configured by a computer attached to the apparatus.

FIG. 4 shows another embodiment of the present invention.
In this embodiment, a long bar-shaped second receiving member 12 ′ receiving the lower surface of the feeding-side transport band 1 a is parallel to the first receiving member 12 with a predetermined interval between the first receiving member 12 and the first receiving member 12. Is provided. The interval is set to a dimension that allows the mother board M to be bent downward together with the transport band 1a between the left and right receiving members 12, 12 ′.
When breaking the mother board M, first, the pressing member 4 is set at an intermediate position between the left and right receiving members 12, 12 ′. Then, the mother substrate M is placed in the state where the scribe lines S1 and S2 of the mother substrate M extend in a direction orthogonal to the transport direction of the transport band 1 and the first substrate M1 is on the upper side. The belt 1 is placed on the part 1a and conveyed from upstream to downstream, and the conveyance band 1 is stopped when the scribe line S2 to be broken reaches the first pressing position of the pressing member 4.
Then, the pressing member 4 is lowered to press the surface of the first substrate M1, and the mother substrate M is bent downward together with the feeding-side transport band 1a between the left and right receiving members 12, 12 ′. Thereby, the crack of 2nd scribe line S2 is osmose | permeated to a board | substrate thickness direction, and the 2nd board | substrate M2 is broken along 2nd scribe line S2.
Next, as shown in FIG. 4B, the conveyor is driven, and the mother board M is conveyed to a position where the scribe line S1 exceeds the second receiving member 12 ′ and stopped. At the same time, the pressing member 4 is moved to the downstream side in the substrate transport direction, and is arranged at the second pressing position that moves up and down on the top surface of the tip portion on the transport direction side of the mother substrate M. Further, the presser member 8 is lowered and lightly brought into contact with the surface of the mother substrate M to prevent the mother substrate M from being lifted up. In this state, the pressing member 4 is lowered to press the tip of the mother substrate M, and the mother substrate M is bent so as to be bent outward from the scribe line S1. Thereby, the crack of the 1st scribe line S1 of the 1st board | substrate M1 is osmose | permeated to a board | substrate thickness direction, and the 1st board | substrate M1 is broken along 1st scribe line S1. These series of operations are performed by a control unit (not shown) configured by a computer attached to the apparatus.
According to this embodiment, when breaking the scribe line S2 of the second substrate M2, the mother substrate M can be easily bent between the left and right first receiving members 12 and the second receiving member 12 ′, It becomes possible to break reliably.

  As described above, in the present invention, the first scribe line S1 of the first substrate M1 and the second scribe line S2 of the second substrate M2 are not reversed while maintaining the posture in which the mother substrate M is placed on the transport band 1. Can break. As a result, the conventional mechanism for reversing the mother substrate can be omitted, the entire apparatus can be made compact, and the cost can be reduced. In addition, the tact time can be shortened without requiring time for inversion, and productivity can be improved.

  In the above embodiment, the pressing member 4 can be moved to the first pressing position and the second pressing position, and both the first scribe line S1 and the second scribe line S2 can be broken by the same pressing member. However, instead of this, the pressing members may be arranged at both the first pressing position and the second pressing position, respectively.

  As mentioned above, although the typical Example of this invention was described, this invention is not necessarily limited only to said Example structure. For example, the pressing member 4 may be a roller that rolls while pressing the surface of the mother substrate, instead of a long plate-like break bar. Others The present invention can be appropriately modified and changed within the scope of achieving the object and without departing from the scope of the claims.

  The present invention can be applied to a break device that breaks a bonded substrate for a liquid crystal display panel.

A Break device M Mother substrate M1 First substrate M2 Second substrate S1 First substrate scribe line S2 Second substrate scribe line 1 Conveying band 1a Feeding side conveying band 2 Conveyor 4 Pressing member 8 Holding member 12 First receiving member 12 'Second receiving member

Claims (5)

A breaking device for breaking a bonded substrate in which a first substrate and a second substrate having a scribe line formed on each surface are bonded together along the scribe line,
A conveyor provided with a transport band for placing the bonded substrate and transporting the substrate from upstream to downstream;
A pressing member capable of moving up and down disposed above the transport belt;
A first receiving member in contact with the back surface of the transport band;
It consists of a pressing member that can be moved up and down arranged above the transport band on the upstream side in the substrate transport direction than the pressing member,
The transport band is formed of an elastic material that can be bent by the pressing force of the pressing member,
A break device characterized in that an edge of the first receiving member on the downstream side in the substrate transport direction is formed by extending in a direction orthogonal to the substrate transport direction. The break device according to claim 1, wherein the pressing member is formed to be movable along the substrate transport direction. The break device according to claim 1, wherein the first receiving member is a receiving plate that supports a back surface of the transport belt. The break device according to any one of claims 1 to 3, wherein the pressing member is formed of a long break bar and extends along a direction orthogonal to the substrate transport direction. The second receiving member that is in contact with the back surface of the transport band with a space between the first receiving member and the first receiving member is provided in parallel with the first receiving member. Breaking device as described.

Images