JP2017209933A - Segmentation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a segmentation device capable of surely segmenting a first substrate and a second substrate at once along a scribe line without turning over a bonded substrate.SOLUTION: In a segmentation device 1, an upper conveyor 7A supports an end material G and a unit substrate W at an upstream side in a transfer direction. An impact member 27 collides with the unit substrate W from above and segments the unit substrate W from the end material G along a first scribe line S1 and a second scribe line S2. A second conveyor 9a disposed at a position lower than a receiving member 13 in the vicinity of the downstream side of the receiving member 13 in a transfer direction supports the unit substrate W after segmentation.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cutting apparatus, and more particularly to an apparatus for continuously cutting a bonded substrate.

In general, in the manufacturing process of liquid crystal panels, a large-area bonded glass substrate (mother substrate) is manufactured by patterning a plurality of unit display panels (unit substrates), which are manufacturing units, and then divided into unit display panels. To do. Specifically, using a pair of upper and lower cutter wheels, the mother substrate is simultaneously scribed from two sides in the vertical direction, and then the two sides are simultaneously separated to divide each unit display panel (for example, Patent Documents). 1 and Patent Document 2).
An extra portion is provided between the unit display panels, and these become end materials (cut pieces) after dividing.

JP 2003-131185 A JP 2014-200940 A

In Patent Document 1, after breaking the scribe line on the first surface, it is necessary to reverse the bonded substrate when breaking the scribe line on the second surface. Such a substrate reversal operation requires a mechanism for reversing the substrate, which increases the size of the apparatus and increases the cost of the apparatus.
Also in Patent Document 2, it is necessary to apply a pressing force to the scribe lines formed on each surface from the facing surfaces. In this case, the time required for the break increases, and therefore productivity decreases.

  In view of the above-described problems, the present invention has an object to provide a cutting apparatus capable of cutting the first substrate and the second substrate along the scribe line at once without inverting the bonded substrate. To do.

  Hereinafter, a plurality of modes will be described as means for solving the problems. These aspects can be arbitrarily combined as necessary.

A cutting apparatus according to an aspect of the present invention includes a bonded substrate formed by bonding a first substrate on the upper side and a second substrate on the lower side, a first scribe line formed on the surface of the first substrate, The apparatus divides along a first scribe line on the surface of the second substrate and a second scribe line formed at the same position in plan view.
The cutting device includes a first support member, a second support member, and an impact member.
The first support member supports the first region when one region of the bonded substrate having the first scribe line and the second scribe line as a boundary is the first region and the other region is the second region. The second support member is provided at a position lower than the first support member in the vicinity of the downstream side in the transport direction of the first support member, and supports the second region after the division. The impact member collides with the second region from above and divides the second region from the first region along the first scribe line and the second scribe line.
Note that the “second region” is all or part of a portion of the first region on the upstream side in the transport direction. Further, “support” means supporting from below.
In this apparatus, the first region and the second region can be divided at once and reliably along the scribe line without inverting the bonded substrate. The divided second region is supported by the second support member.

The collision by the impact member may be made by free fall of the impact member.
In this apparatus, since a special mechanism for moving the impact member downward is not required, the structure is simplified.

The cutting device may further include a pressing member. The pressing member may prevent the first region from being lifted by pressing the first region from above when the substrate is divided by the impact member.
In this apparatus, since the pressing member prevents the first region from being lifted up, the substrate is accurately divided by the impact member.

The cutting device may further include a break mechanism. The break mechanism may penetrate the crack of the second scribe line of the second substrate into the entire thickness of the second substrate prior to the division by the impact member.
In this apparatus, when the impact member divides the second region from the first region, the second substrate is reliably divided at the second scribe line.

The impact member collides with the second region from above in a state where the first region with the second region attached to the upstream side in the transport direction is supported by the second support member, so that the first scribe line and the second scribe line The second region may be divided from the first region along the scribe line.
In this apparatus, the impact member divides the second region provided on the upstream side in the transport direction of the first region supported by the second support member from the first region. Therefore, the first region can be obtained as the last product.

  In the cutting apparatus according to the present invention, the first substrate and the second substrate can be cut at once and reliably along the scribe line without inverting the bonded substrate.

The schematic diagram of the cutting device as one Embodiment of this invention. The schematic diagram of a bonded substrate. The block diagram which shows the control structure of a parting apparatus. The flowchart which shows the control operation of a cutting device. The schematic diagram which shows operation | movement of a parting apparatus. The schematic diagram which shows operation | movement of a parting apparatus. The schematic diagram which shows operation | movement of a parting apparatus. The schematic diagram which shows operation | movement of a parting apparatus. The schematic diagram which shows operation | movement of a parting apparatus. The schematic diagram which shows operation | movement of a parting apparatus. The schematic diagram which shows operation | movement of a parting apparatus. The schematic diagram of the break mechanism in 2nd Embodiment.

1. First Embodiment (1) Overall Configuration of Cutting Device A cutting device 1 as an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic view of a cutting apparatus as one embodiment of the present invention. The left-right direction in FIG. 1 is the substrate transport direction, the left side in FIG. 1 is the upstream side in the transport direction, and the right side in FIG. 1 is the downstream side in the transport direction.
The cutting apparatus 1 is an apparatus for manufacturing a plurality of unit substrates W by cutting the bonded substrate M.

  The cutting device 1 has a cutting mechanism 5. The dividing mechanism 5 is a device that applies a force for dividing to the bonded substrate M.

The cutting device 1 has a first conveyor mechanism 7. The 1st conveyor mechanism 7 is an apparatus for conveying the bonding board | substrate M from the left side of FIG. 1 to the right side. The first conveyor mechanism 7 further has a function of supporting and conveying the end material G.
The cutting device 1 has a second conveyor mechanism 9. The second conveyor mechanism 9 is a device for supporting the unit substrate W and further transporting it from the left side of the drawing to the right side of the drawing.

(2) Bonded substrate The bonded substrate M will be described with reference to FIG. FIG. 2 is a schematic view of a bonded substrate.
The bonded substrate M is formed by bonding an upper first substrate M1 and a lower second substrate M2.
In the first substrate M1, the first unit substrate W1 and the first end material G1 are alternately formed, and the first scribe line S1 is formed on the surface of the boundary between them.
In the second substrate M2, the second unit substrate W2 and the second end material G2 are alternately formed, and a second scribe line S2 is formed on the surface of the boundary between them.
As is apparent from the figure, the first scribe line S1 and the second scribe line S2 are formed at the same position in plan view. The combination of the first unit substrate W1 and the second unit substrate W2 is the above-described unit substrate W, and the combination of the first end material G1 and the second end material G2 is the above-mentioned end material G.

(3) Detailed configuration of the cutting device (3-1) First conveyor mechanism The first conveyor mechanism 7 has a first conveyor 7a that extends from the left side to the right side in FIG. The first conveyor 7a is, for example, a belt conveyor.
The first conveyor mechanism 7 has a first conveyor drive mechanism 39 (FIG. 3). The first conveyor 7a is driven by a first conveyor drive mechanism 39 (FIG. 3). The 1st conveyor 7a conveys the bonding board | substrate M from the left side of FIG.

The cutting device 1 has a roller structure 11. The roller structure 11 includes rollers 15 and 17 for moving the first conveyor 7a sent from the upstream in the transport direction to the lower side and further sending it out downstream in the transport direction. The first conveyor 7a is divided into an upper conveyor 7A and a lower conveyor 7B with the rollers 15 and 17 as a boundary. The upper conveyor 7A supports the bonded substrate M as a first support member. The lower conveyor 7B supports the divided end material G as a third support member. Specifically, the lower conveyor 7B is provided at a position lower than the upper conveyor 7A in the vicinity of the upstream side of the upper conveyor 7A in the transport direction and supports the end material G.
As described above, the first conveyor 7a has the upper conveyor 7A and the lower conveyor 7B that operate integrally. As a result, both the drive source and the drive member can be shared, and the number of parts is reduced.

  The cutting device 1 has a receiving member 13. The receiving member 13 supports the bonded substrate M as a first support member. The receiving member 13 is provided close to the downstream side in the transport direction of the upper roller 15. The receiving member 13 has a receiving surface 13 a having the same height as the upper roller 15. The receiving surface 13a has a predetermined length in the transport direction and the depth direction.

(3-2) Dividing Mechanism The dividing mechanism 5 has a main body 25. The main body 25 is a member disposed above the first conveyor 7a. The main body 25 can be moved in the transport direction by a first horizontal driving unit 35 (FIG. 3).
The dividing mechanism 5 has an impact member 27. The impact member 27 is a member that divides the substrate by moving downward. The impact member 27 is disposed on the lower surface of the main body 25 and is a bar-shaped member having a predetermined weight. The impact member 27 is supported by the dropping mechanism 37 (FIG. 3) with respect to the main body 25, and moves downward by its own weight when the supporting state is released by the dropping mechanism 37 (FIG. 3). Thus, since the impact member 27 collides by the free fall of the impact member 27, a special mechanism for moving the impact member 27 downward becomes unnecessary, and the structure is simplified.

The impact member 27 has a first dividing portion 29. The 1st parting part 29 is arrange | positioned in the conveyance direction upstream. The impact member 27 has a second dividing portion 31. The 2nd parting part 31 is arrange | positioned in the conveyance direction downstream.
After the impact member 27 is dropped by the drop mechanism 37, the impact member 27 is lifted to the engagement position by an operator or some means.

  The dividing mechanism 5 has a pressing member 33. The pressing member 33 is a member that presses the substrate when the impact member 27 divides the substrate. The pressing member 33 is disposed on the lower surface of the main body 25 and has a predetermined weight. The pressing member 33 is disposed upstream of the impact member 27 in the transport direction. The pressing member 33 is supported by the dropping mechanism 37 (FIG. 3) with respect to the main body 25, and moves downward by its own weight when the supporting state is released by the dropping mechanism 37. Thus, when the pressing member 33 divides the substrate by the impact member 27, the substrate is pressed from above to prevent the substrate from being lifted, so that the substrate is cut by the impact member 27 accurately.

As shown in FIG. 8, the dividing mechanism 5 includes a second adsorption mechanism 61. The second suction mechanism 61 sucks the unit substrate W.
The dividing mechanism 5 has a second lifting mechanism 63 (FIG. 3). The second lifting mechanism 63 moves the second suction mechanism 61 in the vertical direction with respect to the main body 53.

(3-3) Second Conveyor Mechanism The second conveyor mechanism 9 has a second conveyor 9a that extends from the left side to the right side in FIG. The second conveyor 9a is, for example, a belt conveyor. The 2nd conveyor mechanism 9 has the roller 21 of the conveyance direction upstream end.
The second conveyor 9a is provided as a second supporting member at a position lower than the upper conveyor 7A and / or the receiving member 13 in the vicinity of the downstream side in the transport direction, and supports the divided unit substrate W. Further, the second conveyor 9a conveys the bonded substrate M from the left side to the right side in FIG.
The second conveyor mechanism 9 has a second conveyor drive mechanism 41 (FIG. 3). The second conveyor 9a is driven by the second conveyor drive mechanism 41 (FIG. 3).

  The 2nd conveyor mechanism 9 has the 2nd horizontal direction drive part 43 (FIG. 3). The 2nd horizontal direction drive part 43 is a mechanism which moves the 2nd conveyor 9a to the conveyance direction both sides.

  The height direction position of the second conveyor 9a is intermediate between the height direction positions of the upper conveyor 7A and the lower conveyor 7B. The second conveyor 9a is located near the downstream side in the transport direction of the upper conveyor 7A and positioned above the lower conveyor 7B (FIG. 1), and moves from the receiving position to the downstream side in the transport direction to move away from the upper conveyor 7A. Thus, it is possible to move between the retracted position (FIG. 6) that opens the upper side of the lower conveyor 7B. In this apparatus, the second conveyor 9a is moved to the receiving position in advance when the unit substrate W is divided, and is moved to the retracted position in advance when the end material G is divided. With the above configuration, after dividing, the unit substrate W is supported by the second conveyor 9a, and the end material G is supported by the lower conveyor 7B.

(3-4) Moving Device The cutting device 1 further includes a moving device 51 as shown in FIG. The moving device 51 is a device that moves the unit substrate W placed on the second conveyor 9a to another location.
The moving device 51 has a main body 53. The main body 53 is disposed above the second conveyor 9a in FIG.

The moving device 51 has a third horizontal driving mechanism 55 (FIG. 3). The third horizontal driving mechanism 55 moves the main body 53 in the transport direction.
The moving device 51 has a first suction mechanism 57. The first suction mechanism 57 sucks the unit substrate W.
The moving device 51 has a first lifting mechanism 59 (FIG. 3). The first elevating mechanism 59 moves the first suction mechanism 57 in the vertical direction with respect to the main body 53.

(4) Control configuration of the cutting device The control configuration of the cutting device 1 will be described with reference to FIG. FIG. 3 is a block diagram illustrating a control configuration of the cutting apparatus.
The cutting apparatus 1 has a control unit 71. The control unit 71 includes a processor (eg, CPU), a storage device (eg, ROM, RAM, HDD, SSD, etc.) and various interfaces (eg, A / D converter, D / A converter, communication interface, etc.). It is a computer system. The control unit 71 performs various control operations by executing a program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).
The control unit 71 may be configured by a single processor, but may be configured by a plurality of independent processors for each control.
Some or all of the functions of each element of the control unit 71 may be realized as a program that can be executed by a computer system that constitutes the control unit. In addition, some of the functions of each element of the control unit may be configured by a custom IC.

The control unit 71 includes a first horizontal driving unit 35, a dropping mechanism 37, a second suction mechanism 61, a second lifting mechanism 63, a first conveyor driving mechanism 39, a second conveyor driving mechanism 41, and a second horizontal driving unit. 43, a third horizontal driving mechanism 55, a first suction mechanism 57, and a first lifting mechanism 59 are connected. Thereby, the control part 71 can control operation | movement of said drive part.
Further, although not shown, the controller 71 is connected to a sensor and a switch for detecting the state of the driving unit, the position of the substrate, and the like.

(5) Control operation of the cutting device The control operation of the cutting device 1 will be described with reference to FIGS. FIG. 4 is a flowchart showing the control operation of the cutting apparatus. 5 to 11 are schematic diagrams illustrating the operation of the cutting apparatus.
The control flowchart described below is an example, and each step can be omitted or replaced as necessary. Also, a plurality of steps may be executed simultaneously, or some or all of them may be executed in an overlapping manner.

In step S1, as shown in FIG. 1, the impact member 27 is moved to the unit substrate cutting position. Specifically, the control unit 71 controls the first horizontal driving unit 35 to move the main body 25 to a predetermined position in the transport direction.
In step S2, as shown in FIG. 1, the second conveyor 9a is moved to the unit substrate receiving position. Specifically, the control unit 71 controls the second conveyor drive mechanism 41 to move the second conveyor 9a to the upstream side in the transport direction.

In step S3, as shown in FIG. 1, the bonded substrate M is moved to the unit substrate cutting position. Specifically, the control unit 71 controls the first conveyor drive mechanism 39 to move the bonded substrate M to the unit substrate cutting position.
As a result, the state of FIG. 1 is realized. That is, the unit substrate W of the bonded substrate M is in a position protruding from the receiving member 13 to the downstream side in the transport direction, and the scribe line S coincides with the downstream edge of the receiving member 13 in the transport direction. Further, the upstream end of the second conveyor 9a in the transport direction is located close to the downstream side of the receiving member 13 in the transport direction. Further, the first dividing portion 29 of the impact member 27 is disposed above the upstream portion of the unit substrate W in the transport direction.
Note that steps S1 to S3 may be performed in any order, or may be performed simultaneously.
In step S4, the impact member 27 is lowered as shown in FIG. Specifically, the control unit 71 controls the dropping mechanism 37 so that the impact member 27 falls due to its own weight. As a result, the unit substrate W is divided.

  In the above operation, the end material G and the unit substrate W (first region) on the upstream side in the transport direction are supported by the upper conveyor 7A (first support member). The impact member 27 collides with the unit substrate W (second region) from above, thereby dividing the unit substrate W from the end material G along the first scribe line S1 and the second scribe line S2. The divided unit substrate W (second region) is supported by the second conveyor 9a (second support member). At this time, it is provided at a position lower than the upper conveyor 7A in the vicinity of the downstream side in the transport direction of the upper conveyor 7A. In this case, the end material G and the unit substrate W can be divided at once and reliably along the scribe lines S1 and S2 without inverting the bonded substrate M.

In step S5, as shown in FIG. 6, the second conveyor 9a is moved to the carry-out position. Specifically, the control unit 71 controls the second conveyor drive mechanism 41 to move the second conveyor 9a to the carry-out position.
In step S6, as shown in FIG. 6, the bonded substrate M is moved to the first edge material cutting position. Specifically, the control unit 71 causes the first conveyor drive mechanism 39 to move the bonded substrate M to the first edge material cutting position. As a result, the state of FIG. 6 is realized. That is, the end material G of the bonded substrate M is at a position protruding from the receiving member 13 to the downstream side in the transport direction, and the scribe line S coincides with the downstream edge of the receiving member 13 in the transport direction. Further, the upstream end of the second conveyor 9a in the transport direction is located at a position away from the downstream side of the receiving member 13 in the transport direction. For this reason, the lower conveyor 7 </ b> B is exposed to the upper side in the vicinity of the receiving member 13. Further, the first dividing portion 29 of the impact member 27 is disposed above the end material G.
In FIG. 6, the main body 53 of the moving device 51 is moved above the second conveyor 9 a and the unit substrate W.
Note that steps S5 to S6 may be performed in any order, or may be performed simultaneously.

In step S7, the impact member 27 is lowered as shown in FIG. Specifically, the control unit 71 controls the dropping mechanism 37 so that the impact member 27 falls due to its own weight. As a result, the end material G is divided.
In FIG. 7, the first suction mechanism 57 of the moving device 51 sucks the unit substrate W on the second conveyor 9a.

  In the above operation, the unit substrate W (first region) is supported by the upper conveyor 7A (first support member). The impact member 27 collides with the end material G (second region) from above, thereby dividing the end material G from the unit substrate W along the first scribe line S1 and the second scribe line S2. The divided end material G (second region) is supported by the lower conveyor 7B (third support member). Therefore, the end material G is reliably recovered.

In step S8, it is determined whether or not it is the last unit substrate W. Specifically, the control unit 71 makes the above determination. If it is not the last unit substrate W, the process returns to step S1. Thereafter, the division of the unit substrate W and the division of the end material G are performed alternately.
In step S9, as shown in FIG. 8, the second suction mechanism 61 sucks the last unit substrate W. Specifically, the control unit 71 controls the first horizontal direction drive unit 35 to move the main body 25 in the transport direction, and then controls the first lifting mechanism 59 to lower the first suction mechanism 57. Finally, the last unit substrate W is sucked by the first suction mechanism 57.

In step S10, as shown in FIG. 9, the cutting mechanism 5 carries the bonded substrate M to the second conveyor 9a. Specifically, the control unit 71 controls the first horizontal direction driving unit 35 to move the main body 25 to the downstream side in the transport direction, and controls the second lifting mechanism 63 to control the second suction mechanism 61. Then, the last unit substrate W is placed on the second conveyor 9a.
In step S11, as shown in FIG. 10, the impact member 27 is moved to the second end material cutting position. Specifically, the control unit 71 moves the main body 25 in the transport direction by the control unit 71 controlling the first horizontal direction driving unit 35. As a result, the second dividing portion 31 of the impact member 27 is disposed above the end material G.
In FIG. 10, the main body 53 of the moving device 51 is moved above the second conveyor 9a and the unit substrate W.

In step S12, as shown in FIG. 11, the impact member 27 descends and the end material G is cut. Specifically, the control unit 71 controls the dropping mechanism 37 so that the impact member 27 falls due to its own weight. As a result, the end material G is divided.
In FIG. 11, the first suction mechanism 57 of the moving device 51 is lowered to hold the last unit substrate W. This prevents the last unit substrate W from being lifted. As a result, substrate cutting by the impact member 27 is accurately performed.

  As described above, the impact member 27 is in a state where the unit substrate W (first region) with the end material G (second region) attached to the upstream side in the transport direction is supported by the second conveyor 9a. The end material G is divided from the unit substrate W along the first scribe line S1 and the second scribe line S2 by colliding with the end material G from above. As a result, the unit substrate W can be obtained as the last product.

2. Second Embodiment The cutting device may further include a break mechanism. The break mechanism permeates a crack of the second scribe line of the second substrate through the entire thickness of the second substrate prior to division by the impact member.
In this apparatus, when the impact member divides the second region from the first region, the second substrate is reliably divided at the second scribe line.

Hereinafter, the break mechanism 101 will be described with reference to FIG. FIG. 12 is a schematic diagram of a break mechanism in the second embodiment.
The break mechanism 101 is a device that performs a break for allowing the crack of the second scribe line S2 of the second substrate M2 to penetrate the entire plate thickness of the second substrate M2. The break mechanism 101 includes a first transport unit 102, a support table 104, a break unit 105, and a second transport unit 106 in order from the upstream.

The 1st conveyance unit 102 is an apparatus for conveying the bonding board | substrate M mounted on the conveyance surface 121 toward a downstream, for example, is a belt conveyor.
The break unit 105 includes a break bar 151 and a backup bar 152. The break bar 151 and the backup bar 152 are arranged at positions facing each other through the conveyance path of the bonded substrate M. The break bar 151 is disposed below the conveyance path, and the backup bar 152 is disposed below the conveyance path.

  The break bar 151 extends in a direction parallel to the transport surface 121 of the first transport unit 102 and perpendicular to the transport direction. The upper portion of the break bar 151 is formed in a triangular prism shape extending in a direction parallel to the transport surface 121 and perpendicular to the transport direction, and has a tapered shape that becomes thinner toward the tip (upper end). The ridge line portion at the tip of the break bar 151 is a pressing portion 151a that comes into contact with the bonded substrate M during the break operation. The break bar 151 is installed to be movable up and down between the operating position and the non-operating position, and the pressing portion 151 a presses the bonded substrate M at the operating position.

  The backup bar 152 extends along the longitudinal direction of the break bar 151. The backup bar 152 has two lower portions, and each lower portion has a triangular prism shape extending in a direction parallel to the transport surface 121 and perpendicular to the transport direction, and has a tapered shape that becomes thinner toward the tip (lower end). . Two ridge line portions at each tip of the backup bar 152 are support portions 152 a and 152 b that are in contact with the bonded substrate M. Each of the support portions 152a and 152b extends along the longitudinal direction of the pressing portion 151a. Each support part 152a, 152b extends at a predetermined interval from each other. And the press part 151a is arrange | positioned in the position which opposes between each support part 152a, 152b through the conveyance path of the bonding board | substrate M. As shown in FIG.

  The support table 104 is on the upstream side of the break unit 105 in the transport direction, and is a table for supporting the bonded substrate M. A support surface 141 that is the upper surface of the support table 104 is positioned at the same height as the transport surface 121 of the first transport unit 102 and the transport surface 161 of the second transport unit 106.

  The second transport unit 106 transports the bonded substrate M placed on the transport surface 161 toward the downstream side.

Next, the operation of the break mechanism 101 will be described.
First, the bonded substrate M on which the scribe lines S are formed on both surfaces by a scribe device (not shown) is placed on the transport surface 121 of the first transport unit 102. The first transport unit 102 transports the bonded substrate M. Specifically, the first transport unit 102 transports the bonded substrate M to the downstream side, and the scribe lines S1 and S2 on the downstream side of the bonded substrate M are below the pressing portion 151a of the break bar 151 in the break unit 105. If it is located in, the 1st conveyance unit 102 stops conveyance.

In this state, the break unit 105 operates. Specifically, the break bar 151 of the break unit 105 rises to the operating position, and the pressing portion 151a presses the bonded substrate M along the scribe line S2 from the second substrate M2 side. Thereby, the crack of the second substrate M2 and the second scribe line S2 penetrates the entire thickness of the second substrate M2. During the break operation, the bonded substrate M is supported from above by the support portions 152 a and 152 b of the backup bar 152.
In addition, as another example, in addition to the above-described embodiment, using the same apparatus as the break unit 105, the crack of the first scribe line S1 of the bonded substrate M is made to the entire thickness of the first substrate M1. It may be infiltrated.

3. Other Embodiments Although a plurality of embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. In particular, a plurality of embodiments and modifications described in this specification can be arbitrarily combined as necessary.
(1) The impact member may be lowered by a drive mechanism.
(2) The pressing member 33 may be omitted.
(3) The mechanism and operation for unloading the unit substrate W may be realized by a mechanism and operation other than the moving device 51.

  The present invention can be widely applied to an apparatus for continuously cutting a bonded substrate.

1: Cutting device 5: Cutting mechanism 7: First conveyor mechanism 7A: Upper conveyor 7B: Lower conveyor 7a: First conveyor 9: Second conveyor mechanism 9a: Second conveyor 13: Receiving member 13a: Receiving surface 25: Main body 27: Impact member 33: Pressing member 35: First horizontal driving unit 37: Drop mechanism 39: First conveyor driving mechanism 41: Second conveyor driving mechanism 43: Second horizontal driving unit 51: Moving device 53: Main body 55 : Third horizontal direction drive mechanism 57: first suction mechanism 59: first lifting mechanism 61: second suction mechanism 63: second lifting mechanism 71: controller

Claims (5)

A bonded substrate formed by bonding an upper first substrate and a lower second substrate to each other, a first scribe line formed on the surface of the first substrate, and the first on the surface of the second substrate. A cutting device for cutting along a scribe line and a second scribe line formed at the same position in plan view,
When one region of the bonded substrate with the first scribe line and the second scribe line as a boundary is a first region and the other region is a second region,
A first support member that supports the first region, and a second member that is provided at a position lower than the first support member in the vicinity of the downstream side in the transport direction of the first support member and supports the second region after the division. A support member,
An impact member that collides with the second region from above and divides the second region from the first region along the first scribe line and the second scribe line;
Cutting device equipped with.   The cutting apparatus according to claim 1, wherein the collision by the impact member is performed by free fall of the impact member.   The cutting apparatus according to claim 1, further comprising a pressing member that presses the first region from above to prevent the first region from being lifted when the substrate is divided by the impact member.   The break mechanism for penetrating the crack of the second scribe line of the second substrate to the entire plate thickness of the second substrate prior to the division by the impact member. The cutting device according to the above.   The impact member collides with the second region from above in a state where the first region with the second region on the upstream side in the transport direction is supported by the second support member. The cutting device according to any one of claims 1 to 4, wherein the second region is divided from the first region along one scribe line and the second scribe line.

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