TWI619684B - Breaking device - Google Patents

Breaking device Download PDF

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Publication number
TWI619684B
TWI619684B TW105127618A TW105127618A TWI619684B TW I619684 B TWI619684 B TW I619684B TW 105127618 A TW105127618 A TW 105127618A TW 105127618 A TW105127618 A TW 105127618A TW I619684 B TWI619684 B TW I619684B
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TW
Taiwan
Prior art keywords
substrate
area
support member
breaking
impact
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Application number
TW105127618A
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Chinese (zh)
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TW201720767A (en
Inventor
Yoshitaka Nishio
Kiyoshi Takamatsu
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Mitsuboshi Diamond Ind Co Ltd
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Priority to JP2015237304A priority Critical patent/JP6716900B2/en
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201720767A publication Critical patent/TW201720767A/en
Application granted granted Critical
Publication of TWI619684B publication Critical patent/TWI619684B/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools

Abstract

本發明提供一種在對貼合基板進行分斷時,能夠在不使基板表背面反轉之下沿刻劃線有效率地且確實地進行分斷之分斷裝置。 The invention provides a cutting device capable of efficiently and reliably cutting along a scribe line without inverting the front and back surfaces of a substrate when cutting a bonded substrate.

該分斷裝置具備衝擊構件8,該衝擊構件8係在以基板M之刻劃線S1、S2為邊界之一方區域為第一區域、另一方區域為第二區域時,在以第一支承構件5支承第一區域並且使第二區域從第一支承構件突出之狀態下,對第二區域從上方撞擊以沿刻劃線S1、S2將第二區域從第一區域切離。 This breaking device is provided with an impact member 8. When one of the areas is bordered by the scribe lines S1 and S2 of the substrate M as the first area and the other area is the second area, the first support member is used. 5 With the first region supported and the second region protruding from the first support member, the second region is impacted from above to cut off the second region from the first region along the scribe lines S1 and S2.

Description

分斷裝置 Breaking device

本發明係關於一種用於對脆性材料基板沿刻劃線進行分斷之分斷裝置。本發明尤其是關於適合於對如液晶顯示器面板般貼合二片玻璃基板而成之貼合基板,沿分別形成於基板表背面兩面之刻劃線進行分斷的分斷裝置。 The invention relates to a cutting device for cutting a brittle material substrate along a scribe line. In particular, the present invention relates to a cutting device suitable for cutting a bonded substrate formed by bonding two glass substrates, such as a liquid crystal display panel, along the scribe lines formed on the front and back surfaces of the substrate.

在製造液晶顯示器面板時,係將二片大面積之玻璃基板、亦即將形成有驅動液晶之薄膜電晶體TFT(Thin Film Transistor)等電子元件之玻璃基板、與形成有對向電極之玻璃基板加以貼合而形成大片的貼合基板。然後,藉由將該大片貼合基板經由刻劃步驟及裂斷步驟分斷成一個個的單位顯示面板,以切出作為製品之單位基板(參照專利文獻1、專利文獻2)。 When manufacturing a liquid crystal display panel, two large-area glass substrates, that is, a glass substrate on which electronic components such as a thin film transistor (TFT) for driving liquid crystal are formed, and a glass substrate on which a counter electrode is formed Bonding to form a large bonded substrate. Then, the large bonded substrate is divided into individual unit display panels through a scribing step and a breaking step to cut out a unit substrate as a product (see Patent Documents 1 and 2).

圖9係顯示下述專利文獻等中所揭示之貼合基板之分斷方法的圖。 FIG. 9 is a diagram showing a method for cutting a bonded substrate disclosed in the following patent documents and the like.

首先,如圖9(a)所示,使刀輪(亦稱刻劃輪)K沿刻劃預定線一邊壓接於貼合基板M上側之第一基板1之表面、一邊相對移動,藉此形成第一刻劃線S1。接著如圖9(b)所示,使貼合基板M表背面反轉,從上方以裂斷棒20按壓使基板M往下方撓曲,藉此使刻劃線S1之龜裂往厚度方向浸透以使第一基板1沿刻劃線S1裂斷。接著如圖9(c)所示,利用刀輪K在貼合基板M之第二基板2之表面加工第二刻劃線S2。之後,如圖9(d)所示,使貼合基 板M再次反轉並以裂斷棒20按壓,藉此使第二基板2沿第二刻劃線S2裂斷。 First, as shown in FIG. 9 (a), a cutter wheel (also referred to as a scribe wheel) K is relatively moved along the predetermined scribe line while being pressed against the surface of the first substrate 1 on the upper side of the bonded substrate M, thereby A first score line S1 is formed. Next, as shown in FIG. 9 (b), the front and back surfaces of the bonded substrate M are reversed, and the substrate M is pressed downward by pressing the breaking rod 20 from above to deflect the substrate M downward, so that the crack of the scribe line S1 penetrates in the thickness direction. The first substrate 1 is broken along the scribe line S1. Next, as shown in FIG. 9 (c), a second scribe line S2 is processed on the surface of the second substrate 2 to which the substrate M is bonded by the cutter wheel K. Thereafter, as shown in FIG. 9 (d), the bonding substrate is made The plate M is reversed again and pressed with the breaking rod 20, thereby breaking the second substrate 2 along the second score line S2.

又,作為另一分斷方法有圖10所示之方法。亦即,如圖10(a)所示,使刀輪K、K一邊壓接貼合基板M之上下兩面、一邊相對移動,藉此在第一基板1與第二基板2之表面同時加工出第一刻劃線S1與第二刻劃線S2。接著如圖10(b)所示,將裂斷棒20從上方按壓於貼合基板M以使基板M往下方撓曲,藉此使下側之第二基板2之刻劃線S2之龜裂往厚度方向浸透以使第二基板2沿刻劃線S2裂斷。接著如圖10(c)所示,使貼合基板M表背面反轉,從上方以裂斷棒20按壓以使基板M撓曲,藉此使第一基板1沿第一刻劃線S1裂斷。 As another breaking method, there is a method shown in FIG. 10. That is, as shown in FIG. 10 (a), the cutter wheels K and K are moved relative to each other while pressing the upper and lower surfaces of the bonded substrate M, thereby processing the surfaces of the first substrate 1 and the second substrate 2 simultaneously. The first score line S1 and the second score line S2. Next, as shown in FIG. 10 (b), the breaking rod 20 is pressed against the bonding substrate M from above to deflect the substrate M downward, thereby cracking the scribe line S2 of the second substrate 2 on the lower side. It penetrates in the thickness direction so that the second substrate 2 is broken along the scribe line S2. Next, as shown in FIG. 10 (c), the front and back surfaces of the bonded substrate M are reversed, and the breaking substrate 20 is pressed from above to deflect the substrate M, thereby cracking the first substrate 1 along the first score line S1. Off.

專利文獻1:日本特開2002-103295號公報 Patent Document 1: Japanese Patent Application Laid-Open No. 2002-103295

專利文獻2:日本特開2006-137641號公報 Patent Document 2: Japanese Patent Application Laid-Open No. 2006-137641

上述習知的貼合基板之分斷方法中,無論是哪種情形,均必須進行在以裂斷棒等使一方之基板裂斷後,將基板反轉以對相反側之基板進行裂斷之步驟、亦即使貼合基板表背面反轉之操作。 In the conventional method for separating bonded substrates, in either case, it is necessary to perform a step of inverting the substrate to break the substrate on the opposite side after the one substrate is broken by a breaking rod or the like. 、 Even if the operation of laminating the front and back of the substrate is laminated.

然而,如上述之基板之反轉操作,必須有用以使基板反轉之機構而使裝置大型化並且亦使裝置成本提高。除此之外,由於反轉操作耗費時間,且亦有反轉操作中傷及基板之風險,因此亦存在有生產性降低之問題。 However, as described above, the substrate reversing operation must have a mechanism for reversing the substrate to increase the size of the device and increase the cost of the device. In addition, since the reversing operation takes time, and there is also a risk of damaging the substrate during the reversing operation, there is also a problem of reduced productivity.

因此,本發明有鑑於上述課題,其目的在提供一種在對貼合基板進行分斷時,能夠在不使基板表背面反轉之情形下,使第一基板及第二基板沿刻劃線一次且確實地分斷之分斷裝置。 Therefore, the present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a method for enabling the first substrate and the second substrate to be scribed along the scribe line once without breaking the front and back surfaces of the substrate when the bonded substrate is divided. A breaking device that reliably breaks.

為了達成上述目的,本發明中提出如以下的技術性手段。亦即,本發明之分斷裝置,係沿著形成於表面之刻劃線進行基板之分斷,具備衝擊構件,該衝擊構件係在以該刻劃線為邊界之該基板之一方區域為第一區域、另一方區域為第二區域時,在以第一支承構件支承該第一區域並且使該第二區域從該第一支承構件突出之狀態下,從上方撞擊該第二區域以沿該刻劃線將該第二區域從該第一區域切離。 In order to achieve the above object, the present invention proposes the following technical means. That is, the cutting device of the present invention is for cutting a substrate along a scribe line formed on a surface, and is provided with an impact member. The impact member is located in a region of the substrate with the scribe line as a boundary. When one area and the other area are the second area, in a state where the first area is supported by the first support member and the second area protrudes from the first support member, the second area is hit from above to follow the The scribe line cuts the second region from the first region.

本發明之分斷裝置,係使衝擊構件撞擊待分斷之基板表面以在基板產生剪力,因此能夠將單板之脆性材料基板或貼合基板沿刻劃線確實地加以分斷。尤其是在待分斷之基板係由第一基板與第二基板構成之貼合基板的情形時,可利用衝擊構件一次的下降將第一基板與第二基板沿刻劃線一次的加以分斷。藉此,能夠省略基板之表背面反轉操作而謀求分斷作業效率化與裝置精簡化,並且亦能夠消除在反轉操作中傷及基板之風險,該基板之表背面反轉操作係指在對一方之基板之刻劃線進行裂斷後,使基板反轉,再對另一方之基板之刻劃線進行裂斷。 The breaking device of the present invention causes the impact member to hit the surface of the substrate to be broken to generate a shear force on the substrate. Therefore, the brittle material substrate or the bonded substrate of the single plate can be reliably broken along the score line. Especially in the case where the substrate to be separated is a bonded substrate composed of a first substrate and a second substrate, the first substrate and the second substrate can be divided once along the scribe line by using the lowering of the impact member once. . In this way, it is possible to omit the reversing operation of the front and back surfaces of the substrate, to achieve the efficiency of severing operations and simplify the device, and to eliminate the risk of damaging the substrate during the reversing operation. After the scribe line of one substrate is split, the substrate is reversed, and then the scribe line of the other substrate is split.

上述發明中,該衝擊構件所進行之撞擊,以藉由該衝擊構件之自由落下進行較佳。如此,無需使用複雜之機構,即能藉由衝擊構件本身之重量容易地獲得貼合基板之分斷所需之剪力。 In the above invention, the impact by the impact member is preferably performed by the free fall of the impact member. In this way, without using a complicated mechanism, the shear force required for breaking the bonded substrate can be easily obtained by the weight of the impact member itself.

此外,上述發明中,以具備在該衝擊構件進行撞擊時,從上方按壓該第一區域以阻止該第一區域翹起之按壓構件較佳。如此,能夠在衝擊構件進行撞擊時阻止第一區域部分翹起以良好精度進行分斷。 Further, in the above invention, it is preferable to include a pressing member that presses the first region from above to prevent the first region from rising when the impact member strikes. In this way, it is possible to prevent the first region from being partially warped when the impact member strikes, and to perform the division with good accuracy.

A‧‧‧分斷裝置 A‧‧‧ breaking device

M‧‧‧貼合基板 M‧‧‧ Laminated substrate

S1‧‧‧第一刻劃線 S1‧‧‧The first score line

S2‧‧‧第二刻劃線 S2‧‧‧Second Engraving

1‧‧‧第一基板 1‧‧‧ the first substrate

2‧‧‧第二基板 2‧‧‧ second substrate

4‧‧‧止擋件 4‧‧‧stop

5‧‧‧第一支承構件 5‧‧‧first support member

6‧‧‧第二支承構件 6‧‧‧second support member

8‧‧‧衝擊構件 8‧‧‧ Impact member

11‧‧‧按壓構件 11‧‧‧Pressing member

圖1,係概略性地顯示本發明之分斷裝置的側視圖。 FIG. 1 is a side view schematically showing a breaking device of the present invention.

圖2,係顯示圖1之分斷裝置之要部的立體圖。 FIG. 2 is a perspective view showing a main part of the breaking device of FIG. 1. FIG.

圖3,係顯示圖1之分斷裝置進行之分斷步驟之第一階段的說明圖。 FIG. 3 is an explanatory diagram showing the first stage of the breaking step performed by the breaking device of FIG. 1. FIG.

圖4,係顯示圖1之分斷裝置進行之分斷步驟之第二階段的說明圖。 FIG. 4 is an explanatory diagram showing the second stage of the breaking step performed by the breaking device of FIG. 1. FIG.

圖5,係顯示圖1之分斷裝置進行之分斷步驟之第三階段的說明圖。 FIG. 5 is an explanatory diagram showing the third stage of the breaking step performed by the breaking device of FIG. 1. FIG.

圖6,係顯示圖1之分斷裝置進行之分斷步驟之第四階段的說明圖。 FIG. 6 is an explanatory diagram showing the fourth stage of the breaking step performed by the breaking device of FIG. 1. FIG.

圖7,係顯示作為分斷對象之貼合基板之一例的俯視圖與剖面圖。 FIG. 7 is a plan view and a cross-sectional view showing an example of a bonding substrate to be cut.

圖8,係顯示分斷後之條狀基板及單位基板的俯視圖。 FIG. 8 is a plan view showing the strip substrate and the unit substrate after the division.

圖9,係顯示習知的貼合基板之分斷方法之一例的說明圖。 FIG. 9 is an explanatory diagram showing an example of a conventional method for cutting a bonded substrate.

圖10,係顯示習知的貼合基板之分斷方法之另一例的說明圖。 FIG. 10 is an explanatory diagram showing another example of a conventional method for cutting a bonded substrate.

根據圖1~8說明本發明之分斷裝置之實施例。圖7,係顯示作為本發明分斷裝置之分斷對象的貼合基板之一例,(a)為俯視圖,(b)為剖面圖。貼合基板M,係貼合上側之第一基板1與下側之第二基板2而構成。於俯視觀察下在相同位置分別在第一基板1之表面沿X-Y方向形成第一刻劃線S1,在第二基板2之表面沿X-Y方向形成第二刻劃線S2。藉由該等刻劃線S1、S2將作為複數個單位基板M1之區域區分成格子狀。 An embodiment of the breaking device of the present invention will be described with reference to Figs. FIG. 7 shows an example of a bonded substrate as a cutting target of the cutting device of the present invention, in which (a) is a plan view and (b) is a cross-sectional view. The bonded substrate M is configured by bonding the first substrate 1 on the upper side and the second substrate 2 on the lower side. A first score line S1 is formed on the surface of the first substrate 1 along the X-Y direction at the same position in a plan view, and a second score line S2 is formed on the surface of the second substrate 2 along the X-Y direction. The areas as the plurality of unit substrates M1 are divided into a grid shape by the scribed lines S1 and S2.

本發明之分斷裝置A,具備相對上下移動之第一支承構件5與第二支承構件6。本實施例中,第一支承構件5及第二支承構件6係以輸送帶構成,第一支承構件5為上游側,第二支承構件6為下游側,從上游側之第一支承構件5朝向下游側之第二支承構件6搬送待分斷之貼合基板M。 The breaking device A of the present invention includes a first support member 5 and a second support member 6 that move relatively up and down. In this embodiment, the first support member 5 and the second support member 6 are constituted by a conveyor belt. The first support member 5 is an upstream side, the second support member 6 is a downstream side, and the first support member 5 faces from the upstream side. The second support member 6 on the downstream side conveys the bonded substrate M to be separated.

第一支承構件5與第二支承構件6,於水平狀態下配置在彼此接近之位置,第二支承構件6可從此位置藉由汽缸7等之升降機構往下方移動。 The first support member 5 and the second support member 6 are arranged at positions close to each other in a horizontal state, and the second support member 6 can be moved downward from this position by a lifting mechanism such as a cylinder 7 or the like.

在第二支承構件6之上方,在靠近第一支承構件5之位置設有衝擊構件8。衝擊構件8係於輸送帶寬度方向長長地形成,且形成為可從以繩索9吊起的位置沿導件10藉由本身重量而垂直自由落下。此外,在第一支承構件5之上方,在靠近第二支承構件6之位置,設有用以阻止分斷時基板M翹起之按壓構件11。在該按壓構件11及衝擊構件8之下面,黏貼有用以在與基板M接觸時防止對基板M表面造成傷痕之胺甲酸乙酯(urethane)等軟質片材11a、8a。 Above the second support member 6, an impact member 8 is provided near the first support member 5. The impact member 8 is formed long in the width direction of the conveyor belt, and is formed so as to be able to fall vertically along the guide 10 from its position suspended by the rope 9 by its own weight. Further, a pressing member 11 is provided above the first support member 5 and near the second support member 6 to prevent the substrate M from being lifted up during breaking. Under the pressing member 11 and the impact member 8, soft sheets 11a, 8a such as urethane, which are used to prevent the surface of the substrate M from coming into contact with the substrate M, are attached.

進一步地,設有限制衝擊構件8之落下衝程的止擋件4。此止擋件4,配置在夾著第二支承構件6之左右兩側部分,被固定於分斷裝置A之機架(未圖示)。此外,與止擋件4抵接之抵接片8b,形成與衝擊構件8相連。該止擋件4,其功能為在下述之分斷步驟中,防止衝擊構件8接觸已被衝擊構件8切離並掉落至第二支承構件6上之基板M1、M2。 Further, a stopper 4 is provided to limit the falling stroke of the impact member 8. This stopper 4 is arranged on the left and right side portions of the second support member 6 and is fixed to a frame (not shown) of the breaking device A. In addition, the contact piece 8 b that abuts against the stopper 4 is connected to the impact member 8. The stopper 4 has a function of preventing the impact member 8 from contacting the substrates M1 and M2 that have been cut off by the impact member 8 and dropped onto the second support member 6 in the following breaking step.

接下來,針對分斷裝置A之動作進行說明。 Next, the operation of the breaking device A will be described.

將已於先行的刻劃步驟預先加工出第一、第二刻劃線S1、S2的貼合基板M,以任一刻劃線、例如X方向之刻劃線沿著輸送帶寬度方向之方式載置於第一支承構件5,並朝向下游側之第二支承構件6進行搬送(參照圖1~3)。然後,如圖4所示,在最初的刻劃線S1、S2移動至稍微離開第一支承構件5之位置時,使貼合基板M之搬送停止。此時,以貼合基板M之刻劃線S1、S2為分界,將由第一支承構件5支承之區域稱為第一區域,由第 二支承構件6支承之區域稱為第二區域。 The bonded substrate M having the first and second scribe lines S1 and S2 processed in advance in the preceding scribe step is loaded in a manner such that the scribe line in the X direction is along the width direction of the conveyor belt It is placed on the first support member 5 and is conveyed toward the second support member 6 on the downstream side (see FIGS. 1 to 3). Then, as shown in FIG. 4, when the first scribe lines S1 and S2 are moved to a position slightly apart from the first support member 5, the transfer of the bonded substrate M is stopped. At this time, with the scribe lines S1 and S2 of the bonded substrate M as a boundary, a region supported by the first support member 5 is referred to as a first region, and The area supported by the two support members 6 is referred to as a second area.

接著,如圖5、6所示,使按壓構件11下降並輕輕接觸貼合基板M之第一區域的表面。於此狀態下,使衝擊構件8從上方之待機位置自由落下時,藉由自由落下之撞擊產生之剪(shear)力,貼合基板M上下之刻劃線S1、S2同時裂斷,使第二區域從第一區域分離而成為如圖8(a)所示之條狀基板M1。此時,由於貼合基板M之第一區域仍被按壓構件11按壓,因此能夠防止分斷時之第一區域部分的翹起。 Next, as shown in FIGS. 5 and 6, the pressing member 11 is lowered and lightly contacts the surface of the first region of the bonding substrate M. In this state, when the impact member 8 is allowed to fall freely from the upper standby position, the scribe lines S1 and S2 on the upper and lower sides of the substrate M are simultaneously broken by the shear force generated by the free fall impact, so that the first The two regions are separated from the first region to form a strip-shaped substrate M1 as shown in FIG. 8 (a). At this time, since the first region of the bonded substrate M is still pressed by the pressing member 11, it is possible to prevent the first region portion from being warped at the time of breaking.

以此方式依序沿X方向之刻劃線將貼合基板M分斷成條狀基板M1之後,以此條狀基板M1之Y方向之刻劃線沿著輸送帶寬度方向之方式將條狀基板M1載置於第一支承構件5,以與上述同樣之方式,藉由衝擊構件8將條狀基板M1依序沿刻劃線分斷,切出如圖8(b)所示之單位基板M2。 In this way, the bonded substrate M is divided into strip-shaped substrates M1 in order along the scribe lines in the X direction, and then the strips are formed in such a manner that the scribe lines in the Y-direction of the strip substrate M1 are along the width direction of the conveyor The substrate M1 is placed on the first support member 5, and the strip substrate M1 is sequentially divided along the scribe line by the impact member 8 in the same manner as described above, and the unit substrate shown in FIG. 8 (b) is cut out. M2.

視作為分斷對象之貼合基板M之材料及厚度,將分斷時之第二支承構件6之下降行程L1、以及衝擊構件8之本身重量及落下衝程L2設定為適當之值。例如,在貼合基板M之第一基板1及第二基板2為厚度0.2~0.4mm之玻璃板的情形時,較佳為將第二支承構件6之下降行程L1設為4~10mm,將衝擊構件8之下降衝程L2設為3~9mm。此外,較佳為將衝擊構件8落下至最下端時之與第二支承構件6上之第二區域的間隔L3設為1~5mm。 Depending on the material and thickness of the bonding substrate M that is the object of breaking, the descending stroke L1 of the second support member 6 at the time of breaking, the weight of the impact member 8 and the falling stroke L2 are set to appropriate values. For example, when the first substrate 1 and the second substrate 2 to which the substrate M is bonded are glass plates having a thickness of 0.2 to 0.4 mm, it is preferable to set the descending stroke L1 of the second support member 6 to 4 to 10 mm, and The down stroke L2 of the impact member 8 is set to 3 to 9 mm. In addition, it is preferable that the interval L3 between the impact member 8 and the second region on the second support member 6 when the impact member 8 is dropped to the lowermost end is 1 to 5 mm.

如上所述,由於係藉由衝擊構件8自由落下並撞擊而產生之剪力使貼合基板M分斷,因此能夠省略在將一方之基板之刻劃線裂斷後使基板反轉以對另一方之基板之刻劃線進行裂斷之繁雜的基板反轉操作,而 藉由衝擊構件之一次的落下,使第一基板1與第二基板2沿刻劃線S1、S2一次分斷。藉此,能夠謀求分斷作業效率化與裝置精簡化,並且亦能解決反轉操作中傷及基板之風險。 As described above, since the bonded substrate M is broken by the shear force generated by the impact member 8 falling freely and impacting, it is possible to omit the substrate to be reversed after the scribe line of one substrate is broken to reverse the other substrate. Scribe line of the substrate to perform the complicated substrate reversal operation of cracking, and The first substrate 1 and the second substrate 2 are cut off along the scribe lines S1 and S2 by one drop of the impact member. With this, it is possible to achieve efficiency of the breaking operation and streamline the device, and also to solve the risk of damaging the substrate in the reverse operation.

此外,藉由衝擊構件8切離後成為條狀基板M1或單位基板M2之第二區域,在掉落至第二支承構件6上後,利用第二支承構件6依序往下游側搬送,藉此,能夠以流暢作業連續地進行貼合基板M之分斷步驟。 In addition, the second region of the strip substrate M1 or the unit substrate M2 after being cut off by the impact member 8 is dropped on the second support member 6 and then sequentially transferred to the downstream side by the second support member 6 to borrow This makes it possible to continuously perform the cutting step of the bonded substrate M with a smooth operation.

本發明,雖在上述實施例中,藉由衝擊構件8以本身重量產生之自由落下撞擊貼合基板M而產生對基板M之剪力,但只要能產生與其同等之剪力,則亦可例如以如衝壓機般之機械性手段使衝擊構件8下降。 In the present invention, although in the above-mentioned embodiment, the shear force on the substrate M is generated by the free fall of the impact member 8 with its own weight to strike the bonded substrate M, as long as it can generate the equivalent shear force, for example, The impact member 8 is lowered by a mechanical means such as a press.

以上雖針對本發明之代表性的實施例進行了說明,但本發明並不特定於上述實施形態。例如,上述實施例中,雖係以貼合第一基板與第二基板而成之貼合基板作為分斷對象進行說明,但當然亦可適用於單板之脆性材料基板之分斷。 As mentioned above, although the typical embodiment of this invention was described, this invention is not limited to the said embodiment. For example, in the above-mentioned embodiment, although the bonded substrate formed by bonding the first substrate and the second substrate is used as the breaking object, it is of course applicable to the cutting of a brittle material substrate of a single plate.

本發明之分斷裝置,可在對大片脆性材料基板沿刻劃線進行分斷以切出單位基板時利用之。 The cutting device of the present invention can be used when cutting a large piece of a brittle material substrate along a scribe line to cut out a unit substrate.

Claims (3)

一種分斷裝置,係沿著形成於表面之刻劃線進行貼合基板之分斷,其特徵在於:具備衝擊構件,該衝擊構件係在以該刻劃線為邊界之該貼合基板之一方區域為第一區域、另一方區域為第二區域時,在以第一支承構件支承該第一區域並且使該第二區域從該第一支承構件突出之狀態下,對該第二區域從上方撞擊以沿該刻劃線將該第二區域從該第一區域切離。A breaking device for breaking a bonded substrate along a scribe line formed on the surface, characterized in that an impact member is provided on one side of the bonded substrate with the scribe line as a boundary When the area is the first area and the other area is the second area, in a state where the first area is supported by the first support member and the second area protrudes from the first support member, the second area is viewed from above Impact to cut the second area away from the first area along the score line. 如申請專利範圍第1項之分斷裝置,其中,使用該衝擊構件之撞擊,係藉由該衝擊構件之自由落下進行。The breaking device according to item 1 of the patent application scope, wherein the impact using the impact member is performed by the free fall of the impact member. 如申請專利範圍第1或2項之分斷裝置,其具備按壓構件,該按壓構件係在使用該衝擊構件之撞擊時,從上方按壓該第一區域以阻止該第一區域翹起。For example, the breaking device according to item 1 or 2 of the patent application includes a pressing member that presses the first area from above to prevent the first area from being lifted when impacted by the impact member.
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