TWI619684B - Breaking device - Google Patents

Abstract

The invention provides a cutting device capable of efficiently and reliably cutting along a scribe line without inverting the front and back surfaces of a substrate when cutting a bonded substrate.

This breaking device is provided with an impact member 8. When one of the areas is bordered by the scribe lines S1 and S2 of the substrate M as the first area and the other area is the second area, the first support member is used. 5 With the first region supported and the second region protruding from the first support member, the second region is impacted from above to cut off the second region from the first region along the scribe lines S1 and S2.

Description

Breaking device

The invention relates to a cutting device for cutting a brittle material substrate along a scribe line. In particular, the present invention relates to a cutting device suitable for cutting a bonded substrate formed by bonding two glass substrates, such as a liquid crystal display panel, along the scribe lines formed on the front and back surfaces of the substrate.

When manufacturing a liquid crystal display panel, two large-area glass substrates, that is, a glass substrate on which electronic components such as a thin film transistor (TFT) for driving liquid crystal are formed, and a glass substrate on which a counter electrode is formed Bonding to form a large bonded substrate. Then, the large bonded substrate is divided into individual unit display panels through a scribing step and a breaking step to cut out a unit substrate as a product (see Patent Documents 1 and 2).

FIG. 9 is a diagram showing a method for cutting a bonded substrate disclosed in the following patent documents and the like.

First, as shown in FIG. 9 (a), a cutter wheel (also referred to as a scribe wheel) K is relatively moved along the predetermined scribe line while being pressed against the surface of the first substrate 1 on the upper side of the bonded substrate M, thereby A first score line S1 is formed. Next, as shown in FIG. 9 (b), the front and back surfaces of the bonded substrate M are reversed, and the substrate M is pressed downward by pressing the breaking rod 20 from above to deflect the substrate M downward, so that the crack of the scribe line S1 penetrates in the thickness direction. The first substrate 1 is broken along the scribe line S1. Next, as shown in FIG. 9 (c), a second scribe line S2 is processed on the surface of the second substrate 2 to which the substrate M is bonded by the cutter wheel K. Thereafter, as shown in FIG. 9 (d), the bonding substrate is made The plate M is reversed again and pressed with the breaking rod 20, thereby breaking the second substrate 2 along the second score line S2.

As another breaking method, there is a method shown in FIG. 10. That is, as shown in FIG. 10 (a), the cutter wheels K and K are moved relative to each other while pressing the upper and lower surfaces of the bonded substrate M, thereby processing the surfaces of the first substrate 1 and the second substrate 2 simultaneously. The first score line S1 and the second score line S2. Next, as shown in FIG. 10 (b), the breaking rod 20 is pressed against the bonding substrate M from above to deflect the substrate M downward, thereby cracking the scribe line S2 of the second substrate 2 on the lower side. It penetrates in the thickness direction so that the second substrate 2 is broken along the scribe line S2. Next, as shown in FIG. 10 (c), the front and back surfaces of the bonded substrate M are reversed, and the breaking substrate 20 is pressed from above to deflect the substrate M, thereby cracking the first substrate 1 along the first score line S1. Off.

Patent Document 1: Japanese Patent Application Laid-Open No. 2002-103295

Patent Document 2: Japanese Patent Application Laid-Open No. 2006-137641

In the conventional method for separating bonded substrates, in either case, it is necessary to perform a step of inverting the substrate to break the substrate on the opposite side after the one substrate is broken by a breaking rod or the like. 、 Even if the operation of laminating the front and back of the substrate is laminated.

However, as described above, the substrate reversing operation must have a mechanism for reversing the substrate to increase the size of the device and increase the cost of the device. In addition, since the reversing operation takes time, and there is also a risk of damaging the substrate during the reversing operation, there is also a problem of reduced productivity.

Therefore, the present invention has been made in view of the above-mentioned problems, and an object thereof is to provide a method for enabling the first substrate and the second substrate to be scribed along the scribe line once without breaking the front and back surfaces of the substrate when the bonded substrate is divided. A breaking device that reliably breaks.

In order to achieve the above object, the present invention proposes the following technical means. That is, the cutting device of the present invention is for cutting a substrate along a scribe line formed on a surface, and is provided with an impact member. The impact member is located in a region of the substrate with the scribe line as a boundary. When one area and the other area are the second area, in a state where the first area is supported by the first support member and the second area protrudes from the first support member, the second area is hit from above to follow the The scribe line cuts the second region from the first region.

The breaking device of the present invention causes the impact member to hit the surface of the substrate to be broken to generate a shear force on the substrate. Therefore, the brittle material substrate or the bonded substrate of the single plate can be reliably broken along the score line. Especially in the case where the substrate to be separated is a bonded substrate composed of a first substrate and a second substrate, the first substrate and the second substrate can be divided once along the scribe line by using the lowering of the impact member once. . In this way, it is possible to omit the reversing operation of the front and back surfaces of the substrate, to achieve the efficiency of severing operations and simplify the device, and to eliminate the risk of damaging the substrate during the reversing operation. After the scribe line of one substrate is split, the substrate is reversed, and then the scribe line of the other substrate is split.

In the above invention, the impact by the impact member is preferably performed by the free fall of the impact member. In this way, without using a complicated mechanism, the shear force required for breaking the bonded substrate can be easily obtained by the weight of the impact member itself.

Further, in the above invention, it is preferable to include a pressing member that presses the first region from above to prevent the first region from rising when the impact member strikes. In this way, it is possible to prevent the first region from being partially warped when the impact member strikes, and to perform the division with good accuracy.

A‧‧‧ breaking device

M‧‧‧ Laminated substrate

S1‧‧‧The first score line

S2‧‧‧Second Engraving

1‧‧‧ the first substrate

2‧‧‧ second substrate

4‧‧‧stop

5‧‧‧first support member

6‧‧‧second support member

8‧‧‧ Impact member

11‧‧‧Pressing member

FIG. 1 is a side view schematically showing a breaking device of the present invention.

FIG. 2 is a perspective view showing a main part of the breaking device of FIG. 1. FIG.

FIG. 3 is an explanatory diagram showing the first stage of the breaking step performed by the breaking device of FIG. 1. FIG.

FIG. 4 is an explanatory diagram showing the second stage of the breaking step performed by the breaking device of FIG. 1. FIG.

FIG. 5 is an explanatory diagram showing the third stage of the breaking step performed by the breaking device of FIG. 1. FIG.

FIG. 6 is an explanatory diagram showing the fourth stage of the breaking step performed by the breaking device of FIG. 1. FIG.

FIG. 7 is a plan view and a cross-sectional view showing an example of a bonding substrate to be cut.

FIG. 8 is a plan view showing the strip substrate and the unit substrate after the division.

FIG. 9 is an explanatory diagram showing an example of a conventional method for cutting a bonded substrate.

FIG. 10 is an explanatory diagram showing another example of a conventional method for cutting a bonded substrate.

An embodiment of the breaking device of the present invention will be described with reference to Figs. FIG. 7 shows an example of a bonded substrate as a cutting target of the cutting device of the present invention, in which (a) is a plan view and (b) is a cross-sectional view. The bonded substrate M is configured by bonding the first substrate 1 on the upper side and the second substrate 2 on the lower side. A first score line S1 is formed on the surface of the first substrate 1 along the X-Y direction at the same position in a plan view, and a second score line S2 is formed on the surface of the second substrate 2 along the X-Y direction. The areas as the plurality of unit substrates M1 are divided into a grid shape by the scribed lines S1 and S2.

The breaking device A of the present invention includes a first support member 5 and a second support member 6 that move relatively up and down. In this embodiment, the first support member 5 and the second support member 6 are constituted by a conveyor belt. The first support member 5 is an upstream side, the second support member 6 is a downstream side, and the first support member 5 faces from the upstream side. The second support member 6 on the downstream side conveys the bonded substrate M to be separated.

The first support member 5 and the second support member 6 are arranged at positions close to each other in a horizontal state, and the second support member 6 can be moved downward from this position by a lifting mechanism such as a cylinder 7 or the like.

Above the second support member 6, an impact member 8 is provided near the first support member 5. The impact member 8 is formed long in the width direction of the conveyor belt, and is formed so as to be able to fall vertically along the guide 10 from its position suspended by the rope 9 by its own weight. Further, a pressing member 11 is provided above the first support member 5 and near the second support member 6 to prevent the substrate M from being lifted up during breaking. Under the pressing member 11 and the impact member 8, soft sheets 11a, 8a such as urethane, which are used to prevent the surface of the substrate M from coming into contact with the substrate M, are attached.

Further, a stopper 4 is provided to limit the falling stroke of the impact member 8. This stopper 4 is arranged on the left and right side portions of the second support member 6 and is fixed to a frame (not shown) of the breaking device A. In addition, the contact piece 8 b that abuts against the stopper 4 is connected to the impact member 8. The stopper 4 has a function of preventing the impact member 8 from contacting the substrates M1 and M2 that have been cut off by the impact member 8 and dropped onto the second support member 6 in the following breaking step.

Next, the operation of the breaking device A will be described.

The bonded substrate M having the first and second scribe lines S1 and S2 processed in advance in the preceding scribe step is loaded in a manner such that the scribe line in the X direction is along the width direction of the conveyor belt It is placed on the first support member 5 and is conveyed toward the second support member 6 on the downstream side (see FIGS. 1 to 3). Then, as shown in FIG. 4, when the first scribe lines S1 and S2 are moved to a position slightly apart from the first support member 5, the transfer of the bonded substrate M is stopped. At this time, with the scribe lines S1 and S2 of the bonded substrate M as a boundary, a region supported by the first support member 5 is referred to as a first region, and The area supported by the two support members 6 is referred to as a second area.

Next, as shown in FIGS. 5 and 6, the pressing member 11 is lowered and lightly contacts the surface of the first region of the bonding substrate M. In this state, when the impact member 8 is allowed to fall freely from the upper standby position, the scribe lines S1 and S2 on the upper and lower sides of the substrate M are simultaneously broken by the shear force generated by the free fall impact, so that the first The two regions are separated from the first region to form a strip-shaped substrate M1 as shown in FIG. 8 (a). At this time, since the first region of the bonded substrate M is still pressed by the pressing member 11, it is possible to prevent the first region portion from being warped at the time of breaking.

In this way, the bonded substrate M is divided into strip-shaped substrates M1 in order along the scribe lines in the X direction, and then the strips are formed in such a manner that the scribe lines in the Y-direction of the strip substrate M1 are along the width direction of the conveyor The substrate M1 is placed on the first support member 5, and the strip substrate M1 is sequentially divided along the scribe line by the impact member 8 in the same manner as described above, and the unit substrate shown in FIG. 8 (b) is cut out. M2.

Depending on the material and thickness of the bonding substrate M that is the object of breaking, the descending stroke L1 of the second support member 6 at the time of breaking, the weight of the impact member 8 and the falling stroke L2 are set to appropriate values. For example, when the first substrate 1 and the second substrate 2 to which the substrate M is bonded are glass plates having a thickness of 0.2 to 0.4 mm, it is preferable to set the descending stroke L1 of the second support member 6 to 4 to 10 mm, and The down stroke L2 of the impact member 8 is set to 3 to 9 mm. In addition, it is preferable that the interval L3 between the impact member 8 and the second region on the second support member 6 when the impact member 8 is dropped to the lowermost end is 1 to 5 mm.

As described above, since the bonded substrate M is broken by the shear force generated by the impact member 8 falling freely and impacting, it is possible to omit the substrate to be reversed after the scribe line of one substrate is broken to reverse the other substrate. Scribe line of the substrate to perform the complicated substrate reversal operation of cracking, and The first substrate 1 and the second substrate 2 are cut off along the scribe lines S1 and S2 by one drop of the impact member. With this, it is possible to achieve efficiency of the breaking operation and streamline the device, and also to solve the risk of damaging the substrate in the reverse operation.

In addition, the second region of the strip substrate M1 or the unit substrate M2 after being cut off by the impact member 8 is dropped on the second support member 6 and then sequentially transferred to the downstream side by the second support member 6 to borrow This makes it possible to continuously perform the cutting step of the bonded substrate M with a smooth operation.

In the present invention, although in the above-mentioned embodiment, the shear force on the substrate M is generated by the free fall of the impact member 8 with its own weight to strike the bonded substrate M, as long as it can generate the equivalent shear force, for example, The impact member 8 is lowered by a mechanical means such as a press.

As mentioned above, although the typical embodiment of this invention was described, this invention is not limited to the said embodiment. For example, in the above-mentioned embodiment, although the bonded substrate formed by bonding the first substrate and the second substrate is used as the breaking object, it is of course applicable to the cutting of a brittle material substrate of a single plate.

The cutting device of the present invention can be used when cutting a large piece of a brittle material substrate along a scribe line to cut out a unit substrate.

Claims (3)

A breaking device for breaking a bonded substrate along a scribe line formed on the surface, characterized in that an impact member is provided on one side of the bonded substrate with the scribe line as a boundary When the area is the first area and the other area is the second area, in a state where the first area is supported by the first support member and the second area protrudes from the first support member, the second area is viewed from above Impact to cut the second area away from the first area along the score line. The breaking device according to item 1 of the patent application scope, wherein the impact using the impact member is performed by the free fall of the impact member. For example, the breaking device according to item 1 or 2 of the patent application includes a pressing member that presses the first area from above to prevent the first area from being lifted when impacted by the impact member.