TWI694975B - Breaking device for bonding substrate - Google Patents

Abstract

The invention provides a cutting device for a bonded substrate that can efficiently divide all scribing lines without inverting the mother substrate. A cutting device D for bonding a substrate M. The bonding substrate M includes a first substrate 1 and a second substrate 2 and has scribe lines for cutting formed on both sides. The cutting device D is for bonding the substrate M It is divided along the above-mentioned scribe line and includes: a conveying mechanism 3 which conveys the bonded substrate M; a breaking bar 4 which presses the substrate M from the upper surface of the first substrate 1; and a support member 5 which interposes the substrate M Located below the breaking bar 4 and supporting the lower surface of the substrate M; the breaking bar 4 is pressed against the first substrate 1 along the dividing line formed on the first substrate 1 and the supporting member 5 is used to support the first The second substrate 2 divides the second substrate 2 with a scribe line, and also divides the first substrate 1 formed on the front and back surfaces of the scribe line with a scribe line.

Description

Breaking device for bonding substrate

The present invention relates to a breaking device for breaking a scribe line (cutting groove) formed on two sides of a bonded substrate formed by bonding a brittle material substrate, in particular to a thin laminated substrate Breaking device. In addition, the present invention relates to a breaking device for breaking in such a manner that a terminal area for external connection is formed around the unit substrate when the unit substrate is obtained from the bonded substrate. The breaking device of the present invention is used for processing unit display panels such as liquid crystal display panels.

In the manufacture of liquid crystal display panels, two large-area glass substrates are used, a color filter CF (Color Filter) is formed on one substrate, and a thin film transistor TFT (Thin Film Transistor) driving liquid crystal is formed on the other substrate and Terminal area for external connection. Then, the CF side substrate on which the color filter is formed and the TFT side substrate on which the TFT and the terminal area are formed are laminated and sealed with liquid crystal to form a mother substrate, which is then divided into unit-by-unit display panels. Since the terminal area is the area where the signal line is connected between the TFT and the external device, the terminal area must be exposed. Therefore, when the mother substrate is divided into unit display panels, the portion of the CF side substrate facing the terminal area is divided along the outer end of the terminal area (ie, the periphery of the unit display panel), and the terminal At the outer end of the area, the width (terminal width) required for installing the signal line is cut off as the end material. A substrate processing system or substrate processing method for processing a scribe line on a mother substrate and cutting the substrate from the scribe line has been disclosed in Patent Document 1 or Patent Document 2 and the like. According to Patent Document 1, first, as shown in FIG. 7( a ), the TFT side substrate 11 of the mother substrate 10 is placed on the upper side, and the CF side substrate 12 is placed on the lower side. The TFT side substrate 11 is scribed to process scribe lines 14. Next, as shown in FIGS. 7(b) and 7(c), the mother substrate 10 is turned over and placed on the buffer sheet 15, and the breaking bar 16 is pressed against the CF side from the position directly above the scribe line 14 The substrate 12 breaks the scribe line 14... Then, as shown in FIG. 7(d), the scribe line 17 is processed by the cutter wheel 13 on the upward CF-side substrate 12. After that, as shown in FIG. 7(e), the mother substrate 10 is turned over again and placed on the buffer sheet 15, as shown in FIG. 7(f), the breaking bar 16 is pressed from the position directly above the scribe line 17 Against the TFT side substrate 11, the scribe line 17... is broken. After that, the end material portion shown by hatching in the mother substrate 10 is removed, and as shown in FIG. 7(g), it becomes a unit display panel having a terminal area T where a part of the TFT side substrate 11 is exposed. In addition, Patent Document 2 discloses the following dividing method as a prior art. First, as shown in FIG. 8( a ), a scribing line 19 is formed on the A surface of the mother substrate 20 formed by bonding the A surface and the B surface by the cutter wheel 18. Next, as shown in FIG. 8(b), the mother substrate 20 is turned over and placed on the buffer sheet 23, the breaking bar 21 is pressed from the B surface toward the scribe line 19, and the scribe line 19 is divided. Next, as shown in FIG. 8(c), on the upward B surface, a scribe line 22 is formed at a position that is offset from the scribe line 19 by only the width of the terminal area. Next, as shown in FIG. 8( d ), the mother substrate 20 is turned over again and placed on the buffer sheet 23, the breaking bar 21 is pressed against the scribe line 22 from the A surface, and the scribe line 22 is divided. After that, the mother substrate 20 is pulled left and right from the above-mentioned divided portion to become a unit display panel having a terminal area. [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2003-131185 [Patent Literature 2] Japanese Patent Laid-Open No. 2002-103295

[Problems to be Solved by the Invention] As described above, in the previous method, since the scribing lines of the TFT side substrate and the CF side substrate respectively formed on the mother substrate are broken, the mother substrate must be turned over every time. To do this, a substrate reversing device for reversing the mother substrate is required. Therefore, there is a problem that not only the size of the breaking device becomes large and the equipment cost becomes high, but also the time required for breaking becomes long and the productivity decreases. In addition, in recent years, it has been required to reduce the thickness of the substrate to be processed. As an example, a bonded substrate formed by bonding a substrate with a thickness of 0.2 mm is used, and a bonded substrate formed by bonding a very thin substrate with a thickness of 0.05 mm to 0.15 mm is further studied. However, since a thin bonded substrate with a thickness of 0.2 mm or less is easily bent, it is difficult to turn it over and break it piece by piece. Therefore, in view of the above problems, the present invention aims to provide a cutting device for a bonded substrate that can efficiently divide all scribing lines without inverting the mother substrate. [Technical Means for Solving the Problem] In order to achieve the above object, the present invention adopts the following technical means. That is, the present invention is a cutting device for bonding substrates, which is a bonding substrate formed by bonding a first substrate and a second substrate and having scribe lines for cutting formed on both sides, along the bonding substrate The above-mentioned scriber, and includes: a conveying mechanism that conveys the bonded substrate; a breaking bar that presses the bonded substrate from the upper surface of the first substrate; and a support member that is positioned across the bonded substrate The lower part of the breaking bar supports the lower surface of the bonding substrate; the breaking bar is pressed against the first substrate along the breaking scribe line formed on the first substrate, and the support is used The member supports the second substrate, divides the second substrate with a scribe line, and also divides the first substrate formed on the front and back surfaces of the scribe line with a scribe line. [Effects of the Invention] Since the present invention is configured as described above, it is not necessary to invert the mother substrate every time when dividing the first substrate and the second substrate by scribe lines, and the mother substrate can be used In the posture of the transport mechanism, a breaking bar is used for continuous breaking. Thereby, the time required for breaking can be shortened, productivity can be improved, and a device for inverting the substrate is not required, so that the breaking device can be made light-weight and compact, and the equipment cost can be reduced. In the above invention, it is also possible to divide the bonded substrate in which the scribe line for the terminal region is formed adjacent to the scribe line for the second substrate in addition to the scribe line for the break An apparatus, wherein the support member includes a pair of left and right support knives that support the left and right vicinity of the scribe line for forming the terminal region formed on the second substrate, and the support knife is formed as follows: the scribe line for forming in the terminal region comes to the left and right When the center between the supporting knives, the distance between the adjacent dividing line and a supporting knife becomes a size smaller than the width of the terminal area. In this way, the scribe lines for forming the terminal area can be divided by pressing the breaking bar from the upper surface of the first substrate in the same way as the scribe lines for breaking, so all the scribe lines can be removed without inverting the substrate Continuously break, so that the productivity of the unit display panel including the terminal area can be improved.

The embodiment of the breaking device of the bonded substrate of the present invention will be described based on the drawings. The breaking device of the present invention is used with a scoring device. That is, the mother substrate to be processed is transferred to the present breaking device after a scribe line (cut groove) is processed on the surfaces of each of the bonded first substrate and second substrate by a scribing device. The scoring device is not shown, and a well-known scoring device using a cutter wheel or a laser beam can be used. Moreover, the device conveyed from the scoring device to the breaking device can also be carried out using a conveying device using a well-known conveyor. FIG. 1(a) is a plan view showing an example of a mother substrate M to be processed which is cut by the cutting device of the present invention, and FIG. 1(b) is a perspective view thereof. The mother substrate M has a substrate structure in which the first substrate 1 and the second substrate 2 are bonded together. Here, the first substrate 1 is a TFT-side substrate, and the second substrate 2 is a CF-side substrate. In addition, the thickness of each substrate of the mother substrate M is preferably 0.05 mm to 0.2 mm, particularly preferably 0.15 mm or less. In the following, the following cases will be described: from the mother substrate M, there are 9 unit display panels U arranged in three rows in the X direction and the Y direction, as shown in FIG. 1(d), displayed in each unit cut out One of the four peripheries of the panel U forms a terminal area T for external connection. On the surface of the first substrate 1 of the mother substrate M, an X-direction scribe line S1 and a Y-direction scribe line S2 for cutting the mother substrate M into nine are formed. Further, as shown in FIG. 1(b), on the surface of the second substrate 2, on the front and back surfaces of the scribe lines S1, S2 of the first substrate 1, scribe lines S1' for breaking in the X direction and Y directions are also formed S2' is used for breaking. Furthermore, a scribe line S3 for forming a terminal region T for forming the terminal region T is formed on the scribe line S1' for breaking along the X direction on the second substrate. The interval between the scribe line S1' for breaking and the scribe line S3 for forming the terminal area is the same as the width L (see FIG. 1(d)) of the terminal area T of the unit display panel U finally cut out. The width L of the terminal area T in this embodiment is set to 2 mm. The mother substrate M formed with the scribe lines as described above is transferred to the breaking device D of the present invention in the breaking step. As shown in FIGS. 2 to 5, the breaking device D includes: a transport mechanism 3 that transports the mother substrate M from upstream to downstream (the direction of the arrow in FIG. 3 ); a breaking bar 4 that is disposed midway through the transport mechanism 3 , Press the surface of the first substrate 1 of the mother substrate M; and the supporting member 5 that supports the lower surface of the second substrate 2 of the mother substrate M at a position facing downwardly to the breaking bar 4. The transport mechanism 3 transports the mother substrate M in a state where the scribe lines to be broken are orthogonal to the traveling direction, and includes front and rear conveyors 3a and 3b. The breaking bar 4 and the supporting member 5 are arranged between the conveyors 3a, 3b before and after the above. The breaking bar 4 is formed of a plate-shaped material extending in the extending direction of the scribe line to be broken of the mother substrate M, and is held by the beam 4b via a lifting mechanism 4a such as a hydraulic cylinder. Moreover, by controlling the elevating mechanism 4a with a computer (not shown), the elevating stroke of the breaking bar 4 can be controlled to adjust the pressing force on the mother substrate M. As shown in the enlarged view of FIG. 5, the supporting member 5 includes a pair of left and right supporting blades 5 a and 5 a arranged below the breaking bar 4. The support blades 5a, 5a are formed in such a manner that any one of the scribe lines S1', S2', and S3 to be cut that transfers the mother substrate M to the second substrate 2 by the conveyor 3a is located on the breaking bar When it is directly below 4, support the vicinity of the left and right of the above scribe line. Also, it is formed in such a way that a scribe line under the second substrate 2 to be broken, for example, the terminal area forming scribe line S3 shown in FIG. 5(b) comes to the center of the left and right support blades 5a, 5a At this time, the interval L1 between the scribe line S3 and a supporting blade is smaller than the width L of the terminal area. Thereby, the supporting blades 5a, 5a on the left and right sides can be reliably supported in a state where they abut against the second substrate 2 on both sides. In this embodiment, the interval between the support blades 5a and 5a is set to 3 mm. Next, the breaking sequence of the mother substrate M using the breaking device D of the present invention will be described. First, the mother substrate M shown in FIG. 1 is placed on the transport with the first substrate 1 on the upper side and the scribe lines S2 and S2′ in the Y direction being orthogonal to the transport direction of the transport mechanism 3 Agency 3. Then, the transfer mechanism 3 transfers the mother substrate M in the direction of the breaking bar 4. When the first dividing scribe lines S2 and S2' come below the breaking bar 4 as shown in FIG. 3(a), the transport mechanism 3 is stopped, the breaking bar 4 is lowered, and the first substrate 1 is pressed. As a result, as shown in the enlarged view of FIG. 5(a), the mother substrate M is bent downward between the left and right support blades 5a, 5a to divide the second substrate 2 by a scribe line S2′, and at the same time Since the thickness of the board is thin, the breaking formed on the first substrate 1 is also broken by the scribe line S2 without a "notch". Then, the next dividing line is also divided in the same order. Furthermore, the mother substrate M is cut along the scribe lines S2 and S2' for cutting, and becomes a rectangular strip substrate M1 in which three unit display panels U are arranged as shown in FIG. 1(c). Furthermore, in the above-mentioned breaking step, since the scribe line S2' of the second substrate 2 is located on the front and back of the scribe line S2 of the first substrate 1, and the thickness of each substrate 1, 2 is relatively thin, it is 0.05 to 0.15 mm, so by pressing the breaking bar 4 from the upper surface of the first substrate 1, the two scribe lines S2 and S2' can be broken at the same time. According to the experiments of the inventors and others, when the breaking bar 4 is pressed, the bending amount W of the mother substrate M between the left and right support blades 5a, 5a becomes 10 μm as shown in FIG. 5(a). When the pressing force of the breaking bar 4 is set in the mode of ~50 μm, the breaking result becomes the most neat breaking surface without "notches", which can be effectively broken. Thereafter, as shown in FIG. 4( a ), the strip-shaped mother substrate M1 is placed on the transport mechanism 3 and transported toward the breaking bar 4. In this case, the scribe lines S1 and S1 ′ for disconnection and the scribe lines S3 for forming the terminal area are placed in a direction orthogonal to the conveying direction of the transport mechanism 3 in a state where the first substrate 1 is on the upper side. Further, as shown in FIG. 4(b), when the first terminal area forming scribe line S3 formed on the second substrate 2 is located below the breaking bar 4, the transport mechanism 3 is stopped, and the breaking bar 4 is lowered. Press the first substrate 1. As a result, as shown in FIG. 5(b), the mother substrate M1 is bent downward between the left and right support blades 5a, 5a, and the scribe line S3 for forming the terminal region formed on the second substrate 2 is broken. At this time, since the interval L1 between the scribe line S3 for forming the terminal area and one of the supporting blades 5a and 5a on the left and right is formed to be smaller than the width L of the terminal area, the terminal blades 5a and 5a can be used to reliably support the terminal area The left and right sides of the scribe line S3 are formed so that the mother substrate is bent between the left and right support blades 5a and 5a. Then, as shown in FIG. 4(b), the mother board M1 is transported by the transport mechanism 3 until the next breaking scribe lines S1, S1' are positioned below the breaking bar 4, and the breaking bar 4 is lowered and pressed First substrate 1. As a result, as shown in the enlarged view of FIG. 5(c), the mother substrate M1 is bent downward between the left and right support blades 5a, 5a to divide the second substrate 2 by a scribe line S1′, and at the same time The dividing line formed on the first substrate 1 is divided by a scribe line S1. During the above-mentioned breaking, the interval L1 between the dividing scribe lines S1, S1' and a supporting blade 5a is formed to be smaller than the width L of the terminal area as described above, so the left and right supporting blades 5a, 5a are not spanned to adjacent The scribe line S3 for forming the terminal area can support only the scribe lines S1, S1' to break it, so that the scribe line S3 for forming the adjacent terminal area is not erroneously broken at the same time. Then, as shown in FIG. 4(c), the mother substrate M1 is transferred in such a way that the terminal area forming scribe line S3 formed near the scribe line S1' is located below the severing bar 4, and the sever The rod 4 presses the surface of the first substrate 1 to thereby break the scribe line S3 for forming the terminal area. Furthermore, the mother substrate M1 is sequentially transferred, and the remaining dividing scribe lines S1, S1' and the terminal area forming scribe lines S3 are divided. For the strip-shaped mother substrate M1 obtained by the above-mentioned breaking, the unit display panel U is pulled apart along the breaking scribe lines S1, S1', and the end material shown by the hatching in FIG. 4(d) is removed Part E. Thereby, as shown in FIG. 1(d), the first substrate 1, that is, the unit display panel U having the terminal area T where a part of the TFT side substrate is exposed can be processed. As described above, in this embodiment, by pressing the breaking rod 4 from the surface of the first substrate 1, the breaking of the first substrate 1 can be broken with a scribe line, and also formed on the breaking The division of the second substrate 2 on the front and back of the scribing line is divided by the scribing line. Therefore, it is not necessary to perform the operation of turning over the mother substrate M every time when the scribe lines of the first substrate 1 and the second substrate 2 are broken as before. In this way, there is no need for a device for inverting the substrate, and the weight and size of the breaking device and the cost can be reduced. In addition, the scribe lines for forming the terminal area formed on the second substrate 2 are also broken by pressing the breaking bar 4 from the upper surface of the first substrate 1, so that all the scribe lines can be continuously performed without inverting the substrate Off. This can shorten the time required for the breaking operation and improve productivity. The representative embodiments of the present invention have been described above, but the present invention is not necessarily limited to the above embodiments. For example, as shown in FIG. 6, the support member 5 disposed below the breaking bar 4 may be a pair of left and right platforms 5 b and 5 b disposed with an open gap instead of the pair of support blades 5 a and 5 a. In this case, the interval between the left and right platforms 5b, 5b is formed to have the same length as the interval between the support blades 5a, 5a as described above. In addition, as the transport mechanism 3 that transports the mother substrate M from upstream to downstream, an adsorption robot (not shown) including an air adsorption disk can be used. In addition, the present invention can be appropriately modified and changed within the scope of achieving the above-mentioned object without departing from the gist of the invention. In addition, the breaking method using the breaking device is summarized. (a) A method for breaking a bonded substrate, which is to form a scribe line for breaking on both sides of a bonded substrate formed by bonding a first substrate and a second substrate with a thickness of 0.05 to 0.2 mm, using A transport mechanism for the bonded substrate, a breaking bar for pressing the bonded substrate from the upper surface of the first substrate, and a supporting member located below the breaking bar and supporting the lower surface of the bonded substrate via the bonded substrate, The dividing rod is pressed against the first substrate along the dividing line formed on the first substrate, and the second substrate is supported by the support member, thereby dividing the second substrate At the same time, the dividing of the first substrate formed on the front and back of the scribing line is also broken by a scribing line. (b) The method for dividing a bonded substrate as described above, wherein in addition to forming the scribe line for severing, a scribe line for forming a terminal area is formed in the second substrate, and a pair of left and right supports formed as follows are used The blade serves as the above-mentioned supporting member, that is, when the scribe line for breaking the second substrate is located in the center between the left and right supporting blades, the interval between the scribe line for forming the terminal area and a supporting blade becomes a size smaller than the width of the terminal area. Directly above the scribe line for terminal area formation, the surface of the first substrate is pressed by the breaking bar, and the second substrate is supported by the support member, thereby dividing the scribe line for forming the terminal area. (c) The breaking method of the bonded substrate as described above, which alternately divides the scribe line for breaking and the scribe line for the terminal area. [Industrial Applicability] The breaking device of the present invention can be used as a breaking device for breaking scribe lines formed on both sides of a bonded substrate.

1‧‧‧The first substrate 2‧‧‧Second substrate 3‧‧‧Transport organization 3a, 3b‧‧‧ conveyor 4‧‧‧ breaking rod 4a‧‧‧lifting mechanism 4b‧‧‧beam 5‧‧‧Supporting member 5a‧‧‧Support knife 5b‧‧‧Support knife 10‧‧‧ Mother board 11‧‧‧TFT side substrate 12‧‧‧CF side substrate 13‧‧‧Cutter wheel 14‧‧‧ crossed 15‧‧‧buffer sheet 16‧‧‧Breaking rod 17‧‧‧ crossed D‧‧‧Breaking device E‧‧‧End material part L‧‧‧Width L1‧‧‧Interval M‧‧‧ Motherboard M1‧‧‧ Ribbon mother substrate S1, S1'‧‧‧broken line S2, S2'‧‧‧broken line S3 Marking for the formation of the terminal area T‧‧‧terminal area U‧‧‧Unit display panel W‧‧‧Bending

1(a) to (d) are explanatory diagrams showing an example of a mother substrate that is divided by the device of the present invention. 2 is a plan view schematically showing an example of the breaking device of the present invention. 3(a) and (b) are explanatory diagrams showing an example of a breaking device and a breaking procedure of the present invention. 4(a) to (d) are explanatory diagrams of the breaking device similar to FIG. 3. 5(a) to (c) are partially enlarged explanatory views showing the breaking bar and the supporting member. 6 is a cross-sectional view showing another embodiment of the support member. 7(a) to (g) are explanatory diagrams showing the conventional breaking device of the bonded substrate. 8(a) to (d) are explanatory diagrams showing another example of the conventional breaking device of the bonded substrate.

1‧‧‧The first substrate

2‧‧‧Second substrate

3‧‧‧Transport organization

3a‧‧‧Conveyor

3b‧‧‧Conveyor

4‧‧‧ breaking rod

4a‧‧‧lifting mechanism

4b‧‧‧beam

5‧‧‧Supporting member

D‧‧‧Breaking device

E‧‧‧End material part

M1‧‧‧ Ribbon mother substrate

S1, S1'‧‧‧broken line

S3 Marking for the formation of the terminal area

U‧‧‧Unit display panel

Claims (2)

A breaking device for laminating substrates, which is a laminated substrate formed by laminating a first substrate with a thickness of 0.05 mm to 0.2 mm and a second substrate and forming a scribe line for breaking on both sides. Breaking the bonded substrate along the scribe line, and includes: a transport mechanism that transports the bonded substrate; a breaking bar that presses the bonded substrate from the upper surface of the first substrate; and a support member, which Positioned below the breaking bar via the bonding substrate, supporting the lower surface of the bonding board; aligning the breaking bar to the first substrate by following the breaking scribe line formed on the first substrate The entire width is pressed, and the second substrate is supported by the support member, and the division of the second substrate is divided by a scribe line, and the first substrate formed on the front and back sides of the scribe line is also divided Broken off with a crossed line. The device for breaking a bonded substrate according to claim 1, wherein the support member includes a pair of left and right support knives, and the bending amount of the second substrate when the bonded substrate is pressed by the breaking bar is above the left and right support knives The pressing force of the breaking bar is set so that the interval becomes 10 μm to 50 μm.

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