TW201805253A - Dicing device for laminated substrate - Google Patents

Abstract

The present invention provides a dicing device for a laminated substrate capable of dicing all scribe lines with high efficiency without having to reverse the mother substrate. A dicing device D for a laminated substrate M is provided, wherein the laminated substrate M comprises a first substrate 1 and a second substrate 2 and is formed with scribe lines on two sides, the dicing device D dices the laminated substrate M along the scribe lines and comprising: a conveying mechanism 3 for conveying the laminated substrate M; a dicing rod 4 for pressing the substrate M from the upper surface of the first substrate 1; and a support member 5 located below the dicing rod 4 and spaced apart from the substrate M for supporting the lower surface of the substrate M; by pressing the dicing rod 4 against the first substrate 1 along the scribe lines formed on the first substrate 1, and using the support member 5 to support the second substrate 2, the scribe lines of the second substrate 2 can be cut, and at the same time the scribe lines for of the first substrate 1 formed on the front and back sides of the aforementioned scribe lines can be cut.

Description

Breaking device for laminating substrate

The present invention relates to a breaking device for breaking scribe lines (cutting grooves) on both sides of a bonded substrate formed by bonding a fragile material substrate, and more particularly, to a bonding substrate with a thinner plate. Breaking device. In addition, the present invention relates to a breaking device for breaking when a unit substrate is obtained from a bonded substrate so as to form a terminal area for external connection around a periphery of the unit substrate. The breaking device of the present invention is used for processing a unit display panel such as a liquid crystal display panel.

In the manufacture of liquid crystal display panels, two large-area glass substrates are used, a color filter (CF) is formed on one substrate, and a thin film transistor (TFT) and a thin film transistor (TFT) for driving the liquid crystal are formed on the other substrate. Terminal area for external connections. Then, the CF-side substrate on which the color filter is formed and the TFT-side substrate on which the TFT and the terminal region are formed are bonded and sealed with a liquid crystal to form a mother substrate. Then, the mother substrate is divided into individual display panels. Since the terminal area is an area where a signal line is connected between the TFT and an external device, the terminal area must be exposed. Therefore, when the mother substrate is divided into unit display panels, the portion of the CF-side substrate opposite to the terminal region is divided along the outer end of the terminal region (that is, the periphery of the unit display panel), and from the terminal The width (terminal width) required to install the signal line is cut off as the end material outside the area. A substrate processing system or a substrate processing method for processing a scribe line on a mother substrate and dividing the substrate from the scribe line is disclosed in Patent Document 1 or Patent Document 2 and the like. According to Patent Document 1, first, as shown in FIG. 7 (a), the TFT-side substrate 11 of the mother substrate 10 is placed on the upper side and the CF-side substrate 12 is placed on the platform (outside of the figure). The TFT-side substrate 11 is scribed to process scribe lines 14.... Next, as shown in Figs. 7 (b) and 7 (c), the mother substrate 10 is turned over and placed on the buffer sheet 15, and the breaking rod 16 is pressed against the CF side from the position directly above the score line 14. The substrate 12 is separated from the scribe lines 14... Then, as shown in FIG. 7 (d), the scribe lines 17... After that, as shown in FIG. 7 (e), the mother substrate 10 is turned over again and placed on the buffer sheet 15. As shown in FIG. 7 (f), the breaking rod 16 is pressed from a position directly above the scribe line 17. Abuts the TFT-side substrate 11 and breaks the scribe lines 17.... After that, the end material portion shown by hatching in the mother substrate 10 is removed, and as shown in FIG. 7 (g), it becomes a unit display panel having a terminal region T where a part of the TFT-side substrate 11 is partially exposed. In addition, Patent Literature 2 discloses the following breaking method as a prior art. First, as shown in FIG. 8 (a), a scribe line 19 is formed on the A side of the mother substrate 20 formed by bonding the A side and the B side by the cutter wheel 18. Next, as shown in FIG. 8 (b), the mother substrate 20 is inverted and placed on the buffer sheet 23, the breaking rod 21 is pressed from the B surface toward the scribe line 19, and the scribe line 19 is broken. Then, as shown in FIG. 8 (c), a scribe line 22 is formed on the upwardly facing plane B at a position that is offset from the scribe line 19 by the width of the terminal region. Next, as shown in FIG. 8 (d), the mother substrate 20 is turned over again and placed on the buffer sheet 23, the breaking bar 21 is pressed from the A surface toward the scribe line 22, and the scribe line 22 is broken. After that, the mother substrate 20 is pulled apart from the cut-off portion to the left and right to become a unit display panel having a terminal area. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2003-131185 [Patent Document 2] Japanese Patent Laid-Open No. 2002-103295

[Problems to be Solved by the Invention] As described above, in the previous method, when the scribe lines of the TFT-side substrate and the CF-side substrate separately formed on the mother substrate are divided, the mother substrate must be inverted every time. It is necessary to perform a substrate reversing device for reversing the mother substrate. Therefore, not only the problem that the breaking device becomes large and the equipment cost becomes high, but also the problem that the time required for breaking becomes longer and the productivity is lowered. In addition, in recent years, it is required to reduce the thickness of a substrate to be processed. As an example, a bonded substrate formed by bonding a substrate having a thickness of 0.2 mm is used, and a bonded substrate formed by bonding a substrate having a very thin plate thickness of 0.05 mm to 0.15 mm is further studied. However, since a thin bonded substrate having a thickness of 0.2 mm or less is easily bent, it is difficult to turn it over and break it piece by piece. Therefore, the present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a bonding device for a bonded substrate that can efficiently break all the scribe lines without inverting the mother substrate. [Technical means to solve the problem] In order to achieve the above object, the present invention adopts the following technical means. That is, the present invention relates to a cutting device for bonding substrates, which is a bonding substrate formed by bonding a first substrate and a second substrate, and a scribe line for breaking is formed on both sides, and the bonding substrate is arranged along the bonding substrate. The above-mentioned scribe-breaker includes: a conveying mechanism that conveys the bonded substrate; a breaking rod that presses the bonded substrate from an upper surface of the first substrate; and a support member that is located across the bonded substrate. The lower surface of the breaking bar supports the lower surface of the bonding substrate; the breaking bar is pressed against the first substrate along the breaking line formed on the first substrate, and the support is used. The component supports the second substrate, and cuts off the second substrate with a scribe line, and also cuts off the first substrate formed on the front and back surfaces of the scribe line with a scribe line. [Effects of the Invention] Since the present invention has the above-mentioned configuration, when dividing each of the first substrate and the second substrate with a scribing line, the mother substrate does not need to be inverted every time, and the mother substrate can be separated. It is placed continuously on the conveying mechanism by a breaking rod. Thereby, the time required for breaking can be shortened to improve productivity, and a device for inverting the substrate is not required, so that the breaking device can be lightweight and miniaturized, and the cost of equipment can be reduced. In the above-mentioned invention, in addition to the above-mentioned breaking scribe line, the bonding substrate on which the terminal region forming scribe line is formed adjacent to the second substrate scribe line may be divided. In the device, the support member includes a pair of left and right support knives supported near the left and right of the terminal region forming scribe line of the second substrate, and the supporting knives are formed as follows: In the center of the supporting knife, the distance between the adjacent cutting line and a supporting knife becomes smaller than the width of the terminal area. Thereby, the scribe lines for forming the terminal area can be cut off by pressing the breaking bar from the upper surface of the first substrate in the same manner as the scribe lines for breaking. Therefore, all the scribe lines can be made without flipping the substrate. Continuously cut, which can improve the productivity of the unit display panel including the terminal area.

An embodiment of the cutting device for bonding substrates according to the present invention will be described based on the drawings. The breaking device of the present invention is used together with a scoring device. In other words, the mother substrate to be processed is transferred to the cutting device by processing a scribing (cutting groove) on the surface of each of the first substrate and the second substrate that are bonded together using a scoring device. The scoring device is not shown, and a well-known scoring device using a cutter wheel or a laser beam can be used. In addition, a device that is transferred from the scoring device to the breaking device can be performed by using a transfer device using a well-known conveyor. FIG. 1 (a) is a plan view showing an example of a mother substrate M to be processed by the cutting device of the present invention, and FIG. 1 (b) is a perspective view thereof. The mother substrate M has a substrate structure in which a first substrate 1 and a second substrate 2 are bonded together. Here, the first substrate 1 is a TFT-side substrate, and the second substrate 2 is a CF-side substrate. The thickness of each substrate of the mother substrate M is preferably 0.05 mm to 0.2 mm, and more preferably 0.15 mm or less. Hereinafter, the following description will be made of the case where the 9-unit display panel U in which three rows are respectively arranged in the X direction and the Y direction is cut out from the mother substrate M, as shown in FIG. 1 (d), and displayed in each cut-out unit One of the four periphery of the panel U forms an external connection terminal region T. On the surface of the first substrate 1 of the mother substrate M, there are formed a scribe line S1 for division in the X direction and a scribe line S2 for division in the Y direction for cutting the mother substrate M into nine pieces. In addition, as shown in FIG. 1 (b), on the surface of the second substrate 2, the front and back sides of the scribe lines S1 and S2 of the first substrate 1 are also formed with X-direction dividing scribe lines S1 'and Y-direction. Break line S2 '. Further, on the second substrate, a scribe line S1 for breaking in the X direction is formed with a scribe line S3 for forming a terminal region T. The interval between the breaking scribe line S1 'and the terminal area forming scribe line S3 and the width L (see FIG. 1 (d)) of the terminal area T of the unit display panel U finally cut out are the same. The width L of the terminal region T in this embodiment is set to 2 mm. The mother substrate M on which the respective scribe lines are formed as described above is transported to the breaking device D of the present invention in the breaking step. As shown in FIGS. 2 to 5, the breaking device D includes a transfer mechanism 3 that transfers the mother substrate M from upstream to downstream (in the direction of the arrow in FIG. 3), and a breaking rod 4 that is arranged in the middle of the transfer mechanism 3. And pressing the surface of the first substrate 1 of the mother substrate M; and a supporting member 5 which supports the lower surface of the second substrate 2 of the mother substrate M at a position facing downward from the breaking rod 4. The transport mechanism 3 transports the mother substrate M such that the scribe line to be divided becomes a direction orthogonal to the direction of travel, and includes front and rear conveyors 3a and 3b. A separating bar 4 and a supporting member 5 are arranged between the front and rear conveyors 3a and 3b. The breaking bar 4 is formed of a plate-like material extending in the extending direction of the scribe line of the mother substrate M to be broken, and is held on the cross beam 4b via a lifting mechanism 4a such as a hydraulic cylinder. In addition, by controlling the lifting mechanism 4a using a computer (not shown), the lifting stroke of the breaking rod 4 can be controlled to adjust the pressing force on the mother substrate M. As shown in the enlarged view of FIG. 5, the support member 5 includes a pair of left and right support knives 5 a and 5 a disposed below the breaking rod 4. The support knives 5a and 5a are formed in such a manner that any one of the scribe lines S1 ', S2', and S3 to be broken is carried by the mother substrate M to the second substrate 2 by the conveyor 3a. When it is directly under 4, it supports the vicinity of the left and right of the scribe line. In addition, it is formed as follows: a scribe line is formed below the second substrate 2 to be broken, for example, the terminal area forming scribe line S3 shown in FIG. 5 (b) comes to the center of the left and right supporting blades 5a, 5a. At this time, the interval L1 between the scribe line S3 and a supporting blade is smaller than the width L of the terminal region. Thereby, the left and right supporting knives 5a and 5a can be supported while being surely abutted against the second substrate 2 on both sides. In this embodiment, the interval between the support blades 5a and 5a is set to 3 mm. Next, the breaking sequence of the mother substrate M using the breaking device D of the present invention will be described. First, the mother substrate M shown in FIG. 1 is placed on the conveyance such that the first substrate 1 is on the upper side and the scribe lines S2 and S2 'in the Y direction are orthogonal to the conveyance direction of the conveyance mechanism 3. Agency 3. Then, the mother substrate M is transferred in the direction of the breaking rod 4 by the transfer mechanism 3. When the first breaking scribe lines S2 and S2 ′ reach below the breaking bar 4 as shown in FIG. 3 (a), the transport mechanism 3 is stopped, the breaking bar 4 is lowered, and the first substrate 1 is pressed. Thereby, as shown in the enlarged view of FIG. 5 (a), the mother substrate M is bent downward between the left and right supporting blades 5a, 5a, and the division of the second substrate 2 is divided by the scribe line S2 ', and Since the plate thickness is thin, the breaking line formed on the first substrate 1 is also broken with a scribe line S2 in a state where a “notch” does not occur. Then, the next division line is divided in the same order. Then, the mother substrate M is cut along the dividing scribe lines S2 and S2 'to form a rectangular strip-shaped substrate M1 in which three unit display panels U are arranged as shown in FIG. 1 (c). Furthermore, in the above-mentioned cutting step, since the scribe line S2 'for severing the second substrate 2 is located on the front and back of the scribe line S2 of the first substrate 1, and the thickness of each of the substrates 1 and 2 is relatively thin, it is 0.05 to 0.15 mm, so by pressing the breaking rod 4 from the upper surface of the first substrate 1, the two scribe lines S2 and S2 'can be broken at the same time. In addition, according to an experiment by the inventors, when the breaking rod 4 is pressed, the bending amount W of the mother substrate M between the left and right supporting blades 5a and 5a is 10 μm as shown in FIG. 5 (a). When the pressing force of the breaking rod 4 is set to ～ 50 μm, the breaking result becomes the most neat breaking surface without “notch”, and the breaking can be effectively performed. Thereafter, as shown in FIG. 4 (a), the belt-shaped mother substrate M1 is placed on the conveyance mechanism 3 and is conveyed in the direction of the breaking bar 4. In this case, the component scribe lines S1, S1 'and the terminal area formation scribe line S3 are placed in a state where the first substrate 1 is on the upper side in a direction orthogonal to the conveying direction of the transport mechanism 3. Then, as shown in FIG. 4 (b), when the first terminal area forming scribe line S3 formed on the second substrate 2 is located below the breaking bar 4, the transport mechanism 3 is stopped, the breaking bar 4 is lowered, and Press the first substrate 1. As a result, as shown in FIG. 5 (b), the mother substrate M1 is bent downward between the left and right supporting blades 5 a and 5 a to divide the terminal region forming line S3 formed on the second substrate 2. At this time, since the distance L1 between the scribe line S3 of the terminal area formation and one of the left and right supporting blades 5a, 5a is smaller than the width L of the terminal area, the terminal areas can be reliably supported by the left and right supporting blades 5a, 5a. The left and right sides of the formation scribe line S3 bend the mother substrate between the left and right supporting blades 5a and 5a. Next, as shown in FIG. 4 (b), the mother substrate M1 is transported by the transport mechanism 3 until the next breaking line S1, S1 'is located below the breaking bar 4, and then the breaking bar 4 is lowered and pressed. First substrate 1. Thereby, as shown in the enlarged view of FIG. 5 (c), the mother substrate M1 is bent downward between the left and right supporting blades 5a, 5a, and the division of the second substrate 2 is divided by the scribe line S1 ', and at the same time, The division formed on the first substrate 1 is divided by a scribe line S1. At the time of the above-mentioned breaking, the distance L1 between the cutting scribe lines S1, S1 'and a supporting blade 5a is formed to be smaller than the width L of the terminal region as described above, so the left and right supporting blades 5a, 5a do not cross to the adjacent The terminal region formation scribe line S3 can support and break only the scribe lines S1 and S1 '. Therefore, the adjacent terminal region formation scribe line S3 cannot be divided at the same time by mistake. Then, as shown in FIG. 4 (c), the mother substrate M1 is transferred so that the terminal area forming scribe line S3 formed near the breaking scribe line S1 ′ is located below the breaking bar 4 and the breaking is performed. The rod 4 presses the surface of the first substrate 1 to thereby divide the terminal region formation scribe line S3. Further, the mother substrate M1 is sequentially conveyed, and the remaining scribe lines S1, S1 'for division and the scribe line S3 for terminal region formation are divided. With respect to the strip-shaped mother substrate M1 obtained by the above-mentioned breaking, the unit display panel U is pulled apart along the breaking lines S1, S1 ', and the end material shown by the hatched line in FIG. 4 (d) is removed Section E. Thereby, as shown in FIG. 1 (d), the first substrate 1, that is, the unit display panel U having the terminal region T with a part of the TFT-side substrate exposed, can be processed. As described above, in this embodiment, by pressing the breaking rod 4 from the surface of the first substrate 1, the breaking of the first substrate 1 can be broken by a scribe line, and at the same time, the breaking portion 4 will be formed on the cutting portion. The division of the second substrate 2 on the front and back sides of the scribe line is performed by scribe lines. Therefore, it is not necessary to perform the operation of turning the mother substrate M every time when the scribe lines of the first substrate 1 and the second substrate 2 are broken as before. Thereby, there is no need for a device for inverting the substrate, and light-weight miniaturization and cost reduction of the breaking device can be realized. In addition, the scribe lines for forming the terminal region formed on the second substrate 2 are also divided by pressing the breaking bar 4 from the upper surface of the first substrate 1, so that all scribes can be performed continuously without inverting the substrate. Division. This can reduce the time required for the breaking operation and improve productivity. As mentioned above, although the typical embodiment of this invention was described, this invention is not necessarily limited to the said embodiment. For example, as shown in FIG. 6, the support member 5 disposed below the breaking rod 4 may be a pair of left and right platforms 5 b and 5 b arranged in a gap space instead of the pair of support blades 5 a and 5 a. In this case, the interval between the left and right platforms 5b, 5b is formed to be the same length as the interval between the support blades 5a, 5a as described above. As the transfer mechanism 3 that transfers the mother substrate M from the upstream to the downstream, an adsorption robot (not shown) including an air adsorption tray can be used. In addition, the present invention can be appropriately modified and changed within a range that achieves the above-mentioned object without departing from the gist of the invention. The breaking method using the breaking device is summarized. (a) A method for cutting a bonded substrate, which is formed by dividing lines on the two sides of a bonded substrate formed by bonding a first substrate having a thickness of 0.05 to 0.2 mm to a second substrate, and transporting the above using A transfer mechanism of a bonded substrate, a breaking rod that presses the bonded substrate from the upper surface of the first substrate, and a support member that is positioned below the breaking rod and supports the lower surface of the bonded substrate via the bonded substrate, The severing bar is pressed against the first substrate along the scoring line formed on the first substrate, and the second substrate is supported by the support member, thereby scoring the severing of the second substrate. The line is cut, and at the same time, the cut of the first substrate formed on the front and back of the scribe is cut with a scribe. (b) The method for breaking a bonded substrate as described above, in addition to forming the scribe line for breaking, forming a scribe line for forming a terminal area on the second substrate, and using a pair of left and right supports formed as follows The blade serves as the above-mentioned support member, that is, when the scribe line for breaking the second substrate is located at the center between the left and right support blades, the interval between the terminal area forming scribe line and a support blade becomes smaller than the width of the terminal area. The terminal region formation is divided by the scribe line directly above the surface of the first substrate with the breaking bar and the support member supports the second substrate directly above the scribe line. (c) The cutting method of the bonded substrate as described above, which alternately divides the scribe line for severing and the scribe line for the terminal area. [Industrial Applicability] The breaking device of the present invention can be used as a breaking device for breaking a scribe line formed on both sides of a bonded substrate.

1‧‧‧ the first substrate
2‧‧‧ second substrate
3‧‧‧ transfer agency
3a, 3b‧‧‧ conveyor
4‧‧‧ breaking rod
4a‧‧‧Lifting mechanism
4b‧‧‧ beam
5‧‧‧ support member
5a‧‧‧Support knife
5b‧‧‧Support knife
10‧‧‧ Motherboard
11‧‧‧TFT side substrate
12‧‧‧CF side substrate
13‧‧‧knife wheel
14‧‧‧ crossed
15‧‧‧ buffer sheet
16‧‧‧ breaking rod
17‧‧‧ crossed
D‧‧‧ breaking device
E‧‧‧End material section
L‧‧‧Width
L1‧‧‧ interval
M‧‧‧Motherboard
M1‧‧‧ Ribbon Motherboard
S1, S1'‧‧‧ break line
S2, S2'‧‧‧ break line
S3‧‧‧Terminal area formation
T‧‧‧Terminal area
U‧‧‧Unit display panel
W‧‧‧ Bending amount

FIGS. 1 (a) to (d) are explanatory diagrams showing an example of a mother substrate that is divided by the apparatus of the present invention. Fig. 2 is a plan view schematically showing an example of a breaking device of the present invention. 3 (a) and 3 (b) are explanatory diagrams showing an example of a breaking device and a breaking step of the present invention. 4 (a)-(d) are explanatory diagrams of a breaking device similar to FIG. 5 (a)-(c) are enlarged explanatory diagrams showing a part of the breaking rod and the supporting member. Fig. 6 is a sectional view showing another embodiment of the supporting member. 7 (a) to 7 (g) are explanatory diagrams showing a disconnecting device of a conventional bonded substrate. 8 (a) to 8 (d) are explanatory diagrams showing another example of a conventional disconnecting device for bonding substrates.

1‧‧‧ the first substrate

2‧‧‧ second substrate

3‧‧‧ transfer agency

3a‧‧‧Conveyor

3b‧‧‧ conveyor

4‧‧‧ breaking rod

4a‧‧‧Lifting mechanism

4b‧‧‧ beam

5‧‧‧ support member

D‧‧‧ breaking device

E‧‧‧End material section

M1‧‧‧ Ribbon Motherboard

S1, S1'‧‧‧ break line

S3‧‧‧Terminal area formation

U‧‧‧Unit display panel

Claims (2)

A cutting device for laminating substrates is a laminating substrate formed by laminating a first substrate and a second substrate and forming scribe lines for severing on both sides. The breaking device includes a conveying mechanism for conveying the bonded substrate, a breaking rod for pressing the bonded substrate from the upper surface of the first substrate, and a support member located at the cutting through the bonded substrate. The lower surface of the bonding substrate is supported below the rod; the breaking rod is pressed against the entire width of the first substrate by the scribe line formed on the first substrate, and the support is used. The component supports the second substrate, and cuts off the second substrate with a scribe line, and also cuts off the first substrate formed on the front and back surfaces of the scribe line with a scribe line. For example, the breaking device for bonded substrates according to claim 1, wherein the supporting member includes a pair of left and right supporting knives, and the bending amount of the second substrate when the bonded substrate is pressed by the breaking rod is equal to the supporting knives. The pressing force of the above-mentioned breaking rod is set so that the interval becomes 10 μm to 50 μm.