JP5831119B2 - Glass substrate cleaving apparatus, glass substrate cleaving method, and glass substrate manufacturing method - Google Patents

Description

  The present invention relates to a glass substrate cleaving apparatus, a glass substrate cleaving method, and a glass substrate manufacturing method.

  The glass substrate is suitably used for a flat panel display such as a liquid crystal panel or a plasma display panel. Such a glass substrate is produced by cleaving a relatively large glass substrate (also referred to as “mother glass substrate”) formed by a float method or an overflow method into a predetermined size. Typically, the cleaving of the glass substrate is to apply impact or bending stress along the scribe line after forming the scribe line (dividing line) on the glass substrate or while forming the scribe line on the glass substrate. (For example, refer to Patent Document 1).

  Patent Document 1 discloses a break unit that divides a glass substrate with two break blades. In the break unit of Patent Document 1, in order to divide the glass substrate, a force is applied so as to bend both ends of the glass substrate starting from the break blade. Moreover, the break unit of patent document 1 is provided with the upper duct and the lower duct, and the fall of the quality of a glass substrate is suppressed by attracting | sucking the glass powder (cullet) produced by the parting.

JP 2011-026136 A

  However, in the cleaving (dividing) method disclosed in Patent Document 1, it may be necessary to apply a relatively strong force in the thickness direction of the glass substrate in order to cleave the glass substrate. In this case, the glass powder (cullet) may be scattered violently and the quality of the produced glass substrate may be deteriorated. Further, when cleaving with a relatively strong force, the quality of the glass substrate may be deteriorated due to the rough surface of the glass substrate, or a cleaving failure may occur.

  The present invention has been made in view of the above problems, and its purpose is to provide a glass substrate cleaving apparatus and a glass substrate cleaving that can cleave the glass substrate even if the force applied in the thickness direction of the glass substrate is relatively weak. It is in providing a method and a glass substrate preparation method.

  A glass substrate cleaving apparatus according to the present invention includes a folding member that applies a force to the first main surface of a glass substrate having a first main surface and a second main surface on which a scribe line is formed, and the glass substrate. A tensile stress applying member for applying a tensile stress, and the split member applies a force to the first main surface of the glass substrate in a state where a tensile stress is applied to the glass substrate by the tensile stress applying member. By doing so, the glass substrate is cleaved.

  In one embodiment, the tensile stress applying member includes at least one pressing member having a first side portion and a second side portion, and the at least one pressing member is the first main surface of the glass substrate or the A tensile stress is applied to the second main surface.

  In one embodiment, the first side portion and the second side portion of the at least one pressing member are in contact with the first main surface or the second main surface of the glass substrate at an acute angle.

  In one embodiment, the folding member is connected to the at least one pressing member.

  In one embodiment, the at least one pressing member includes a first pressing member in which the first side portion and the second side portion are in contact with the first main surface of the glass substrate at an acute angle, and the first side. And a second pressing member in contact with the second main surface of the glass substrate at an acute angle.

  In one embodiment, a suction port is attached to the front second pressing member.

  In one embodiment, the folding member applies force to two regions sandwiching a line corresponding to the scribe line in the first main surface of the glass substrate.

  The glass substrate cleaving method according to the present invention includes a step of preparing a glass substrate having a first main surface and a second main surface on which a scribe line is formed, a step of applying tensile stress to the glass substrate, and the glass And cleaving the glass substrate by applying a force to the first main surface of the glass substrate with the tensile stress applied to the substrate.

  A glass substrate production method according to the present invention is a glass substrate production method for cleaving a mother glass substrate to produce a glass substrate, wherein the mother glass has a first main surface and a second main surface on which scribe lines are formed. Preparing a substrate; applying a tensile stress to the mother glass substrate; applying a force to the first main surface of the mother glass substrate in a state where the tensile stress is applied to the mother glass substrate; And a step of taking out the glass substrate produced by cleaving the mother glass substrate.

  According to the present invention, the glass substrate can be cleaved even if the force applied in the thickness direction of the glass substrate is relatively weak. For this reason, the deterioration of the quality of the glass substrate accompanying the scattering of glass powder (cullet), the roughness of the fractured surface, or the cleaving failure can be suppressed.

It is a mimetic diagram of an embodiment of a glass substrate cleaving device by the present invention. (A)-(c) is a schematic diagram which shows embodiment of the glass substrate cutting method by this invention. (A) And (b) is the typical perspective view and sectional drawing of the press member in the glass substrate cleaving apparatus of this embodiment, respectively. (A)-(c) is a schematic diagram for demonstrating the glass substrate cutting method in the glass substrate cutting apparatus of this embodiment provided with the press member shown in FIG. (A) And (b) is the typical perspective view and sectional drawing of the press member in the glass substrate cleaving apparatus of this embodiment, respectively. (A)-(c) is a schematic diagram for demonstrating the glass substrate cutting method in the glass substrate cutting apparatus of this embodiment provided with the press member shown in FIG. (A)-(c) is a schematic diagram for demonstrating the glass substrate cutting method in the glass substrate cutting apparatus of this embodiment. (A) And (b) is a schematic diagram of the press member in the glass substrate cleaving apparatus of this embodiment. It is a typical perspective view of the press member in the glass substrate cutting apparatus of this embodiment. (A) And (b) is a typical perspective view of the press member in the glass substrate cleaving apparatus of this embodiment. (A) is a schematic diagram of the folding member in the glass substrate cleaving apparatus of this embodiment, (b) is a schematic diagram of the glass substrate cleaving apparatus provided with the folding member of (a). It is a schematic diagram of the glass substrate cleaving apparatus of this embodiment. It is a schematic diagram of the glass substrate cleaving apparatus of this embodiment.

  Hereinafter, embodiments of a glass substrate cutting device, a glass substrate cutting method, and a glass substrate manufacturing method according to the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments.

  In FIG. 1, the schematic diagram of the glass substrate cleaving apparatus 100 of this embodiment is shown. The glass substrate cleaving apparatus 100 includes a folding member 10 and a tensile stress applying member 20. The glass substrate cleaving apparatus 100 cleaves the glass substrate G having the main surfaces Ga and Gb. Grooves extending substantially linearly are formed as scribe lines S on the main surface Gb of the glass substrate G. In FIG. 1, the scribe line S is indicated by a one-dot broken line. Typically, when a cross section perpendicular to the extending direction of the scribe line S is viewed, the scribe line S has a V shape or a U shape.

  In FIG. 1, a line S ′ corresponding to (facing) the scribe line S in the main surface Ga of the glass substrate G is indicated by a dotted line. The scribe line S is formed in a groove shape, whereas the line S ′ is not provided with a groove. In the present specification, the main surface Ga may be described as the first main surface Ga, and the main surface Gb may be described as the second main surface Gb.

  The folding member 10 applies force to the first main surface Ga of the glass substrate G. Typically, the folding member 10 applies a force on or in the vicinity of the line S ′ of the first main surface Ga of the glass substrate G. When the folding member 10 applies force to the main surface Ga of the glass substrate G, bending stress is generated in the vicinity of the scribe line S.

  The tensile stress applying member 20 applies a tensile stress that pulls the glass substrate G in the surface direction. Typically, the tensile stress imparting member 20 imparts to the glass substrate G tensile stress that acts in a plane direction orthogonal to the direction in which the scribe line S extends.

  In the glass substrate cleaving apparatus 100 of the present embodiment, the folding member 10 applies a force to the main surface Ga of the glass substrate G in a state where the tensile stress applying member 20 pulls the glass substrate G. When the bending member 10 applies a force to the main surface Ga of the glass substrate G and a bending stress is generated in the vicinity of the scribe line S, the glass substrate G is applied with a tensile stress acting in the surface direction. Even if the force applied in the thickness direction of the glass substrate G by the folding member 10 is relatively weak, the glass substrate G can be cleaved. For this reason, scattering of the glass powder generated when the glass substrate G is cleaved can be suppressed, and the quality of the cleaved surface can be improved and cleaving defects can be suppressed.

  In FIG. 1, the folding member 10 is arranged on the first main surface Ga side of the glass substrate G, whereas the tensile stress applying member 20 is arranged on the second main surface Gb side of the glass substrate G. However, as will be described later, the tensile stress applying member 20 may be disposed on the main surface Ga side of the glass substrate G, or the tensile stress applying member 20 is the main surface of the glass substrate G. It may be arranged on both sides of Ga and Gb. For example, the tensile stress applying member 20 may be in contact with at least one of the main surfaces Ga and Gb of the glass substrate G and apply tensile stress in a surface direction perpendicular to the direction in which the scribe line S extends. . Alternatively, the tensile stress applying member 20 may be disposed at the side end of the glass substrate G.

  Here, with reference to FIG. 2, the glass substrate cutting method of this embodiment is demonstrated.

  First, a glass substrate G is prepared as shown in FIG. The glass substrate G has main surfaces Ga and Gb, and a scribe line S is formed on the main surface Gb.

  Next, as shown in FIG. 2B, tensile stress is applied in the surface direction of the glass substrate G. At this time, it is preferable that the tensile stress is applied substantially evenly in the plane direction substantially orthogonal to the direction in which the scribe line S extends with respect to the line S ′ or the scribe line S or the vicinity thereof on the glass substrate G.

  Next, as shown in FIG. 2C, force is applied to the main surface Ga of the glass substrate G by the folding member 10 in a state where tensile stress is applied to the glass substrate G. Thereby, a bending stress is generated in the vicinity of the scribe line S of the glass substrate G, and the glass substrate G is cleaved. In this embodiment, the glass substrate G is used as the mother glass substrate, and a glass substrate smaller than the mother glass substrate G can be taken out from the mother glass substrate G by cleaving the mother glass substrate G.

  The tensile stress applying member 20 may apply tensile stress over the entire line S ′ or scribe line S provided on the glass substrate G. Alternatively, the tensile stress applying member 20 may apply tensile stress to a part of the line S ′ or the scribe line S provided on the glass substrate G. However, it is preferable that the tensile stress applying member 20 applies a tensile stress over the entire line S ′ or the scribe line S of the glass substrate G.

  With reference to FIG. 3, an example of the tensile stress provision member used for the glass substrate cleaving apparatus 100 of this embodiment is demonstrated. Here, the pressing member 22 is used as the tensile stress applying member 20. FIG. 3A shows a schematic perspective view of the pressing member 22, and FIG. 3B shows a schematic cross-sectional view of the pressing member 22. The pressing member 22 has a shape extending in the longitudinal direction. The pressing member 22 is preferably formed from a material having a relatively high elastic modulus.

  The pressing member 22 has a bottom portion 22s0 and side portions 22s1 and 22s2 that are continuous from the bottom portion 22s0. In this specification, the side part 22s1 may be described as a first side part 22s1, and the side part 22s2 may be described as a second side part 22s2.

  When the cross section along the direction orthogonal to the longitudinal direction of the pressing member 22 is viewed, the angle θ1 formed by the bottom 22s0 and the first side 22s1 is an obtuse angle, and the angle θ2 formed by the bottom 22s0 and the second side 22s2. Is obtuse. For this reason, the distance between the side portion 22s1 and the side portion 22s2 of the pressing member 22 increases as the distance from the bottom portion 22s0 increases.

  For example, the pressing member 22 shown in FIG. 3 applies a tensile stress to the main surface Gb of the glass substrate G. Hereinafter, with reference to FIG. 4, the glass substrate cutting method using the pressing member 22 shown in FIG. 3 will be described.

  As shown in FIG. 4A, the folding member 10 is arranged so as to face the pressing member 22 through the glass substrate G. The folding member 10 is disposed on the main surface Ga side of the glass substrate G, and the pressing member 22 is disposed on the main surface Gb side of the glass substrate G. Here, the folding member 10 is shown in a bar shape.

  As shown in FIG. 4B, the pressing member 22 moves straight (moves) with respect to the glass substrate G so as to be in contact with the main surface Gb of the glass substrate G. The pressing member 22 is disposed with respect to the glass substrate G so that the longitudinal direction of the pressing member 22 is parallel to the scribe line S. The side portions 22 s 1 and 22 s 2 of the pressing member 22 are disposed on both sides of the scribe line S, and the pressing member 22 straddles the scribe line S. The side portion 22s1 of the pressing member 22 is in contact with the acute angle φ1 with respect to the main surface Gb of the glass substrate G, and the side portion 22s2 of the pressing member 22 is in contact with the acute angle φ2 with respect to the main surface Gb of the glass substrate G. By pressing the pressing member 22 against the glass substrate G, the side portions 22s1 and 22s2 are deformed so as to expand, whereby a tensile stress is applied to the glass substrate G in the surface direction.

  Next, as illustrated in FIG. 4C, the folding member 10 applies a force to the main surface Ga of the glass substrate G in a state where the pressing member 22 applies a tensile stress to the glass substrate G. Thereby, the cleaving of the glass substrate G is performed. Here, the pressing member 22 presses the glass substrate G so as to come into contact with the main surface Gb of the glass substrate G, whereby the pressing member 22 applies the scribe line S together with the tensile stress in the surface direction. It also gives the force in the direction of spreading.

  3 and 4, the bottom portion 22s0 is provided and the side portions 22s1 and 22s2 are connected via the bottom portion 22s0. However, the present embodiment is not limited to this. The pressing member 22 is not provided with the bottom portion 22s0, and the side portions 22s1 and 22s2 may be directly connected.

  3 and 4, the pressing member 22 presses the main surface Gb of the glass substrate G, and the pressing member 22 is the folding member 10 that applies force to the main surface Ga of the glass substrate G. Although provided separately, this embodiment is not limited to this. The pressing member 22 may be connected to the folding member 10.

  Here, the pressing member 22 connected to the folding member 10 will be described with reference to FIG. FIG. 5A shows a schematic perspective view of the pressing member 22 used in the glass substrate cleaving apparatus 100 of this embodiment, and FIG. 5B shows a schematic sectional view of the pressing member 22. The pressing member 22 has a bottom portion 22s0 and side portions 22s1 and 22s2 that are continuous from the bottom portion 22s0. Here, the pressing member 22 is connected to the folding member 10. For example, the folding member 10 is attached to the bottom 22 s 0 of the pressing member 22. The folding member 10 and the pressing member 22 may be integrally formed. In this pressing member 22, the height to the tip of the side portion 22s1 and the side portion 22s2 with respect to the bottom portion 22s0 is larger than the height to the tip of the split member 10 with respect to the bottom portion 22s0.

  For example, the pressing member 22 shown in FIG. 5 applies tensile stress to the main surface Ga of the glass substrate G. Here, with reference to FIG. 6, the glass substrate cutting method using the press member 22 shown in FIG. 5 is demonstrated.

  As shown in FIG. 6A, the connected folding member 10 and the pressing member 22 are disposed on the main surface Ga side of the glass substrate G. In addition, it is preferable that force is applied to the main surface Gb of the glass substrate G almost evenly over the entire surface. For example, although not shown here, the main surface Gb of the glass substrate G is in contact with a substantially flat surface (wall or floor) that extends substantially parallel to the main surface Gb, and this flat surface includes a scribe line. It is preferable that a recess or a hole is provided corresponding to S and the vicinity thereof.

  As shown in FIG. 6B, the pressing member 22 moves forward (moves) with respect to the glass substrate G so as to be in contact with the main surface Ga of the glass substrate G. The moving direction is, for example, the normal direction of the main surface of the bottom 22s0 of the pressing member 22. The side portions 22s1 and 22s2 of the pressing member 22 are located on both sides of the line S 'of the glass substrate G, and the pressing member 22 straddles the line S'. The side 22s1 of the pressing member 22 is in contact with the acute angle φ1 with respect to the main surface Ga of the glass substrate G, and the side 22s2 of the pressing member 22 is in contact with the acute angle φ2 with respect to the main surface Ga of the glass substrate G. At this time, the folding member 10 is not in contact with the main surface Ga of the glass substrate G. When the pressing member 22 contacts the main surface Ga of the glass substrate G, a tensile stress in the surface direction is applied to the main surface Ga of the glass substrate G.

  Next, as shown in FIG. 6C, when the pressing member 22 further advances, the side portions 22s1 and 22s2 of the pressing member 22 are deformed, and the folding member connected to the pressing member 22 along with this deformation. 10 contacts the glass substrate G. In a state where the tensile stress in the surface direction is applied to the glass substrate G by the pressing member 22, the folding member 10 applies a force to the main surface Ga of the glass substrate G, whereby the glass substrate G is cleaved.

  Although the pressing member 22 shown in FIGS. 5 and 6 is connected to the folding member 10, the present embodiment is not limited to this. The pressing member 22 may be provided separately from the folding member 10. For example, a hole may be provided in the bottom portion 22 s 0 of the pressing member 22, and the folding member 10 may be disposed so as to penetrate the hole of the bottom portion 22 s 0 of the pressing member 22. In this case, the force applied to the glass substrate G by the folding member 10 and the pressing member 22 can be individually controlled.

  In the glass substrate cleaving apparatus 100 described above with reference to FIGS. 4 and 6, the pressing member 22 presses one of the main surfaces Ga and Gb of the glass substrate G, but the present embodiment is not limited to this. The pressing member 22 may press both the main surfaces Ga and Gb of the glass substrate G.

  With reference to FIG. 7, the glass substrate cutting method by the glass substrate cutting apparatus 100 of this embodiment is demonstrated. The glass substrate cleaving apparatus 100 includes, as the tensile stress applying member 20, a pressing member 22A that applies tensile stress to the main surface Ga of the glass substrate G, and a pressing member 22B that applies tensile stress to the main surface Gb of the glass substrate G. have. Also here, the folding member 10 is connected to the pressing member 22A.

  As shown in FIG. 7A, the folding member 10 and the pressing member 22A connected to each other are arranged to face the pressing member 22B with the glass substrate G interposed therebetween. The split member 10 and the pressing member 22A are disposed on the main surface Ga side of the glass substrate G, and the pressing member 22B is disposed on the main surface Gb side of the glass substrate G.

  As shown in FIG. 7B, the pressing member 22 </ b> A advances (moves) with respect to the glass substrate G so that the pressing member 22 </ b> A contacts the main surface Ga of the glass substrate G, and the pressing member 22 </ b> B contacts the main surface Gb of the glass substrate G. It advances (moves) with respect to the glass substrate G so that it contacts. The side portions 22as1 and 22as2 of the pressing member 22A are located on both sides of the line S 'of the glass substrate G, and the pressing member 22A straddles the line S'. At this time, the folding member 10 does not contact the main surface Ga of the glass substrate G. When the pressing member 22 </ b> A comes into contact with the main surface Ga of the glass substrate G, a tensile stress in the surface direction is applied to the main surface Ga of the glass substrate G. Further, the side portions 22bs1 and 22bs2 of the pressing member 22B are located on both sides of the scribe line S of the glass substrate G, and the pressing member 22B straddles the scribe line S. When the pressing member 22 </ b> B comes into contact with the main surface Gb of the glass substrate G, a tensile stress in the surface direction is applied to the main surface Gb of the glass substrate G.

  As shown in FIG. 7C, when the pressing member 22A further advances, the side portions 22as1 and 22as2 of the pressing member 22A are deformed, and the folding member 10 connected to the pressing member 22A is made of glass by this deformation. Contact the substrate G. The folding member 10 applies a force to the main surface Ga of the glass substrate G in a state in which a tensile stress in the surface direction is applied to the glass substrate G, whereby the glass substrate G is cleaved.

  In the glass substrate cleaving apparatus 100 shown in FIG. 7, the pressing members 22A and 22B have the same shape, and the pressing members 22A and 22B have a tensile stress substantially equal to the main surfaces Ga and Gb of the glass substrate G. Although given, this embodiment is not limited to this. The tensile stress applied to the main surfaces Ga and Gb of the glass substrate G may be different.

  In addition, although the pressing member 22 shown in FIGS. 3-7 was comprised from the single member, the pressing member 22 may be comprised from several members.

  With reference to FIG. 8, the pressing member 22 in the glass substrate cutting apparatus 100 of this embodiment is demonstrated. FIG. 8A shows a schematic cross-sectional view of the pressing member 22. The pressing member 22 includes a support member 22t and elastic members 22u1 and 22u2 attached to the support member 22t. The support member 22t has a bottom portion 22t0 and side portions 22t1 and 22t2. An elastic member 22u1 is attached to the side portion 22t1, and an elastic member 22u2 is attached to the side portion 22t2. For example, the support member 22t is formed from a relatively hard material.

  The side portion 22s1 of the pressing member 22 includes a side portion 22t1 of the support member 22t and an elastic member 22u1. Further, the side portion 22s2 of the pressing member 22 includes a side portion 22t2 of the support member 22t and an elastic member 22u2. Thus, by disposing the elastic members 22u1 and 22u2 at the tips of the side portions 22s1 and 22s2 of the pressing member 22, the material of the support member 22t can be selected relatively freely. Although FIG. 8A shows the pressing member 22, as shown in FIG. 8B, the folding member 10 is added to the pressing member 22 having the support member 22t and the elastic members 22u1, 22u2. May be connected.

  Further, a suction port is attached to the pressing member 22, and glass powder generated when the glass substrate G is cleaved may be sucked.

  In FIG. 9, the schematic diagram of the press member 22 used in the glass substrate cutting apparatus 100 of this embodiment is shown. For example, the suction port 22v is provided in the bottom 22s0 of the pressing member 22. Although not shown here, the suction port 22v is connected to a suction member via a flexible hose. Thus, by attaching the suction port 22v to the pressing member 22, the glass powder generated when the glass substrate G is cleaved can be sucked, and the deterioration of quality can be further suppressed.

  In the glass substrate cleaving apparatus 100 shown in FIG. 7, the pressing member 22 </ b> A that applies tensile stress to the main surface Ga of the glass substrate G and the pressing member 22 </ b> B that applies tensile stress to the main surface Gb of the glass substrate G are used. The suction port 22v shown in FIG. 9 may be attached to each. Thus, when applying tensile stress to both the main surfaces Ga and Gb of the glass substrate G, the scattering of the glass powder is particularly likely to occur on the main surface Gb side of the glass substrate G. It is preferable to attach the suction port 22v to the pressing member 22B that applies tensile stress to the surface Gb.

  3 to 9, the side surface located at the end portion along the longitudinal direction of the pressing member 22 is shown to be opened, but the present embodiment is not limited to this.

  FIG. 10A shows a schematic diagram of the pressing member 22 used in the glass substrate cleaving apparatus 100 of the present embodiment. The pressing member 22 includes side portions 22 s 3 and 22 s 4 located at the end portions along the longitudinal direction of the pressing member 22 in addition to the bottom portion 22 s 0 and the side portions 22 s 1 and 22 s 2. Here, the pressing member 22 includes five surfaces defined by the bottom portion 22s0 and the side portions 22s1, 22s2, 22s3, and 22s4.

  The pressing member 22 shown in FIG. 10A is provided with side portions 22s1, 22s2, 22s3 and 22s4 so as to surround the bottom portion 22s0. Thus, the pressing member 22 may have a casing shape with the bottom 22s0 as the bottom.

  The side portions 22s3 and 22s4 are preferably formed from a material having a high elastic modulus. Here, the heights of the side portions 22s3 and 22s4 with respect to the bottom portion 22s0 of the pressing member 22 are substantially equal to the heights of the side portions 22s1 and 22s2.

  Further, the pressing member 22 shown in FIG. 10A is provided with a suction port 22v at the bottom 22s0. When the pressing member 22 presses the glass substrate G, a space blocked from the outside is formed by the pressing member 22 and the glass substrate G, whereby suction efficiency can be improved.

  The length of the pressing member 22 in the longitudinal direction is preferably larger than the length of the glass substrate G. However, the length of the pressing member 22 in the longitudinal direction may be smaller than the length of the glass substrate G. In this case, as shown in FIG. 10B, the height of the side portions 22s3, 22s4 with respect to the bottom portion 22s0 of the pressing member 22 is smaller than the height of the side portions 22s1, 22s2, and the side portion of the pressing member 22 When 22s1 and 22s2 are in contact with the glass substrate G, the side portions 22s3 and 22s3 of the pressing member 22 are preferably not in contact with the glass substrate G. Although only the pressing member 22 is illustrated in FIGS. 10A and 10B, the folding member 10 may be connected to the pressing member 22.

  As described above, the folding member 10 applies force to the line S ′ in the main surface Ga of the glass substrate G and the vicinity thereof. However, the folding member 10 may apply force to the vicinity thereof without applying force to the line S ′ of the main surface Ga of the glass substrate G.

  FIG. 11A shows a schematic diagram of the folding member 10 used in the glass substrate cutting apparatus 100 of the present embodiment. The folding member 10 has protrusions 10a1 and 10a2.

  In FIG.11 (b), the schematic diagram of the glass substrate G cleaving apparatus 100 provided with the folding member 10 shown to Fig.11 (a) is shown. Although not shown in FIG. 11B, the protrusions 10a1 and 10a2 extend in parallel with the direction in which the line S ′ extends. In this case, the protrusions 10a1 and 10a2 of the folding member 10 are in contact with two regions sandwiching the line S ′ of the main surface Ga of the glass substrate G, and the folding member 10 is formed on the main surface Ga of the glass substrate G. A force is applied to two regions sandwiching the line S ′. Thus, when the folding member 10 has the protrusions 10a1 and 10a2, even if the contact point between the folding member 10 and the glass substrate G may be slightly shifted, the force in the direction in which the scribe line S is expanded. Can be given almost evenly.

  The cleaving of the glass substrate G may be performed while being held by a holding member. For example, the holding member may hold the glass substrate G in the horizontal direction or hold it in the vertical direction. Hereinafter, a more specific example of the glass substrate cleaving apparatus 100 of this embodiment will be described with reference to FIGS. 12 and 13.

  In FIG. 12, the schematic diagram of the glass substrate cleaving apparatus 100 of this embodiment is shown. The glass substrate cleaving apparatus 100 shown in FIG. 12 includes a folding member 10, a pressing member 22A, and a pressing member 22B. The pressing members 22A and 22B are arranged to face each other with the glass substrate G interposed therebetween, and the folding member 10 is connected to the pressing member 22A.

  Each of the pressing members 22A and 22B includes a casing-shaped support member 22t and an elastic member 22u. In FIG. 12, the side portions located at the end portions along the longitudinal direction of the pressing members 22 </ b> A and 22 </ b> B are omitted to avoid the drawing from becoming excessively complicated.

  Elastic members 22u are attached to the tips of the side portions 22s1 and 22s2 of the pressing members 22A and 22B, respectively. For example, lip rubber having a hardness of 90 degrees and a thickness of 1 to 3 mm is used as the elastic member 22u. The lip rubber 22u is screwed to the support member 22t, for example.

  In the pressing member 22A, the distance between the tip of the side portion 22s1 and the tip of the side portion 22s2 is about 60 mm to 80 mm. The width (the length in the direction perpendicular to the direction in which the line S ′ or the scribe line S extends) of the bottom 22s0 of the pressing member 22A is 30 mm to 40 mm. Further, the heights of the ends (elastic members 22u) of the side portions 22s1, 22s2 of the pressing member 22A with respect to the bottom portion 22s0 of the pressing member 22A are 100 mm, and the heights of the side portions 22s1, 22s2 of the pressing member 22A are folded. It is about 2 mm larger than the height of the split member 10. The pressing member 22A is provided with a suction port 22v. Here, the pressing members 22A and 22B have the same shape.

  The pressing members 22A and 22B are supported by a linear guide so as to be movable along the normal direction of the main surfaces Ga and Gb of the glass substrate G. The pressing members 22 </ b> A and 22 </ b> B move by the driving force of the moving member 40. By the moving member 40, the pressing members 22A and 22B move in the linear direction. For example, the moving member 40 may be an air cylinder or a drive unit using a combination of an electric motor and a ball screw. Alternatively, the moving member 40 may be a combined system of an air cylinder and an electric motor and a ball screw drive unit. For example, when the moving member 40 is a combined system of an air cylinder and an electric motor and a ball screw drive unit, the pressing members 22A and 22B are moved by the air cylinder until the elastic member 22u contacts the glass substrate G, and then You may press with an electric motor. Or, conversely, first, the pressing members 22A and 22B may be moved by an electric motor until the elastic member 22u contacts the glass substrate G, and then the pressing members 22A and 22B may be moved by an air cylinder.

  In the glass substrate cutting apparatus 100 shown in FIG. 12, the glass substrate G is held by the holding member 30. For example, the holding member 30 clamps the vicinity of the upper end of the glass substrate G and holds the glass substrate G so as to be suspended. The glass substrate G is transported while being suspended in the vertical (vertical) direction.

  For example, one side of the glass substrate G exceeds 2 m. The length of the pressing members 22A and 22B in the longitudinal direction is longer than that of the glass substrate G. Thereby, when the glass substrate G is cleaved, it is possible to suppress the split section from being displaced from the scribe line S.

  The cleaving of the glass substrate G is performed as follows. First, the glass substrate G on which the scribe line S is formed is conveyed to the glass substrate cleaving apparatus 100. For example, after the scribe line S is formed by a scribe device (not shown), the glass substrate G is conveyed to the glass substrate cleaving device 100 by the conveyance device while being held by the holding member 30.

  Next, the positions of the folding member 10 and the glass substrate G are aligned so as to align with a line S ′ (not shown in FIG. 12) corresponding to the scribe line S of the glass substrate G. Next, the pressing members 22A and 22B advance with respect to the glass substrate G until the elastic members 22u of the pressing members 22A and 22B come into contact with each other. When the elastic members 22u of the pressing members 22A and 22B are in contact, the folding member 10 is not in contact with the glass substrate G. Thereafter, when the pressing members 22A and 22B further move forward with respect to the glass substrate G, tensile stress is generated in the plane direction perpendicular to the line S ′ and the scribe line S of the glass substrate G. After the pressing members 22A and 22B are in contact with the glass substrate G by the propelling force of the moving member 40, the elastic member 22u is deformed so as to open outward, whereby a tensile stress is generated in the vicinity of the scribe line S of the glass substrate G. .

  Thereafter, when the pressing members 22A and 22B are moved so as to approach the glass substrate G, the folding member 10 comes into contact with the line S ′ of the main surface Ga of the glass substrate G and its vicinity, and the glass substrate extends over the line S ′. A force is applied to the main surface Ga of G. At this time, tensile stress is applied to the glass substrate G by the pressing members 22A and 22B, and the glass substrate G is cleaved with a relatively weak force.

  In addition, at least when cleaving, it is possible to suppress scattering of glass powder generated when cleaving the glass substrate G by performing suction on the space covered with the pressing members 22A and 22B via the suction port 22v. .

  In addition, in the glass substrate cutting apparatus 100 shown in FIG. 12, the glass substrate G was hold | maintained and conveyed in the suspended state, However, This embodiment is not limited to this. The glass substrate G may be hold | maintained and conveyed so that the normal line of main surface Ga and Gb follows a perpendicular direction.

  In FIG. 13, the schematic diagram of the glass substrate cleaving apparatus 100 of this embodiment is shown. The glass substrate cleaving apparatus 100 shown in FIG. 13 has the same configuration as that of the glass substrate cleaving apparatus 100 described above with reference to FIG. 12 except for the orientation of the glass substrate G and the configuration related thereto. In order to avoid this, duplicate descriptions are omitted.

  In the glass substrate cleaving apparatus 100 shown in FIG. 13, the normal lines of the main surfaces Ga and Gb of the glass substrate G face the vertical direction, and the glass substrate G is conveyed in the horizontal direction. Here, a roller conveyor is used as the holding member 30 that holds the glass substrate G. The roller conveyor 30 holds the glass substrate G and is also used for transporting the glass substrate G.

  Typically, before the glass substrate G is conveyed to the glass substrate cleaving apparatus 100, a scribe line S is formed on the lower surface of the glass substrate G in a scribe forming apparatus (not shown). For this reason, the main surface Ga of the glass substrate G faces upward, and the main surface Gb of the glass substrate G faces downward.

  In the glass substrate cleaving apparatus 100 shown in FIGS. 12 and 13, the lengths of the pressing members 22A and 22B are larger than the length of the glass substrate G, and the glass substrate G is cleaved at one time. It is not limited to this. The cleaving of the glass substrate G may be performed gradually along the scribe line S (or line S ′). Further, when the glass substrate G is cleaved gradually, the tensile stress applying member 20 may apply tensile stress to the vicinity of the region to which the force is applied by the folding member 10 in the glass substrate G. However, when the glass substrate G is relatively large, the cleaving of the glass substrate G is preferably performed at a time rather than gradually progressing for each region.

  In the above description with reference to FIGS. 12 and 13, the glass substrate G is cleaved in a state where the glass substrate G is held so as to be transportable, but the present embodiment is not limited to this. The cleaving of the glass substrate G may be performed in a state where it is not held by the holding member. For example, the glass substrate G may be cleaved in a state where the glass substrate G is arranged on a flat surface, and may be conveyed by a separately provided conveyance unit after cleaving.

  In the above description with reference to FIGS. 3 to 13, the pressing member 22 has been described as an example of the tensile stress applying member 20, but the present embodiment is not limited to this. For example, the tensile stress applying member 20 may apply the tensile stress by clamping and pulling the end of the glass substrate G. For example, the tension applying member 20 applies a tensile stress in the surface direction by clamping and pulling one side and the other side of the glass substrate G in the direction in which the scribe line S extends. Also good.

  Further, in the above description, the folding member 10 is shown in a rod shape, but the present embodiment is not limited to this. The folding member 10 may have a roller shape. For example, on the main surface Gb of the glass substrate G, two rollers arranged so as to straddle the line S move parallel to the line S while applying a force to the main surface Gb of the glass substrate G. In the main surface Ga of G, one roller may move along the line S ′ while applying a force to the main surface Ga of the glass substrate G.

  ADVANTAGE OF THE INVENTION According to this invention, scattering of the glass powder generated at the time of cleaving a glass substrate can be suppressed. Thus, the glass substrate obtained by cleaving the mother glass substrate is suitably used for a flat panel display such as a liquid crystal panel or a plasma display panel.

DESCRIPTION OF SYMBOLS 10 Folding member 20 Tensile stress giving member 100 Glass substrate cutting device

Claims (6)

A folding member for applying a force to the first main surface of the glass substrate having the first main surface and the second main surface on which the scribe line is formed;
A tensile stress applying member that applies tensile stress to the glass substrate;
The tensile stress applying member is
A first pressing member having a first side portion and a second side portion and applying a tensile stress to the first main surface;
A second pressing member having a first side portion and a second side portion and applying tensile stress to the second main surface
Including
In the first pressing member, the first side portion and the second side portion are in contact with the first main surface of the glass substrate at an acute angle,
In the second pressing member, the first side portion and the second side portion are in contact with the second main surface of the glass substrate at an acute angle,
The breaking member cleaves the glass substrate by applying a force to the first main surface of the glass substrate in a state where tensile stress is applied to the glass substrate by the tensile stress applying member. Cleaving device. The bend-breaking member is connected to the first pressing member, a glass substrate breaking apparatus according to claim 1. Before SL in the second pressing member, the suction port is attached, the glass substrate breaking apparatus according to claim 1 or 2. The glass substrate according to any one of claims 1 to 3 , wherein the folding member applies force to two regions sandwiching a line corresponding to the scribe line in the first main surface of the glass substrate. Cleaving device. Preparing a glass substrate having a first main surface and a second main surface on which scribe lines are formed;
Preparing a first pressing member having a first side and a second side;
Preparing a second pressing member having a first side and a second side;
The first side portion and the second side portion of the first pressing member are in contact with the first main surface of the glass substrate at an acute angle, and the first side portion and the second side of the second pressing member. Applying a tensile stress to the glass substrate such that the portion is in contact with the second main surface of the glass substrate at an acute angle ;
And cleaving the glass substrate by applying a force to the first main surface of the glass substrate with the tensile stress applied to the glass substrate. A glass substrate production method for cleaving a mother glass substrate to produce a glass substrate,
Preparing a mother glass substrate having a first main surface and a second main surface on which scribe lines are formed;
Preparing a first pressing member having a first side and a second side;
Preparing a second pressing member having a first side and a second side;
The first side part and the second side part of the first pressing member are in contact with the first main surface of the mother glass substrate at an acute angle, and the first side part and the second side of the second pressing member. Applying a tensile stress to the mother glass substrate such that the side portion is in contact with the second main surface of the mother glass substrate at an acute angle ;
A step of removing a glass substrate produced by cleaving the mother glass substrate by applying a force to the first main surface of the mother glass substrate in a state where the tensile stress is applied to the mother glass substrate. A glass substrate manufacturing method.

Images