TWI690401B - Breaking device, breaking system and breaking unit - Google Patents

Abstract

The invention provides a fracturing device, a fracturing system and a fracturing unit capable of fracturing a substrate with a simplified structure.

The breaking device 12 includes two breaking units 12a, and the two breaking units 12a are arranged to face each other across the substrate G1. The two breaking units 12a respectively include a breaking bar 107 extending along the scribe line of the substrate G1, a motor and a ball screw that move the breaking bar 107 toward and away from the substrate G1, and are arranged on The two receiving portions 106a sandwiching the breaking bar 107 and the cylinder 103 that moves the two receiving portions 106a toward and away from the substrate G1.

Description

Breaking device, breaking system and breaking unit

The invention relates to a breaking device, a breaking system and a breaking unit used when breaking a substrate.

In the past, the breaking of the substrate was carried out by forming a scribe line on both sides of the substrate, and applying a predetermined force to the upper and lower surfaces of the substrate to break the scribe line along the formed scribe line.

The following Patent Document 1 describes a cleaving device including: a conveying unit that conveys a substrate from upstream to downstream, and a first cleavage that cleaves a lower substrate along a score line formed below The unit and the second split unit that splits the upper substrate along the scribe line formed on the upper side. Both the first splitting unit and the second splitting unit include a splitting bar and a back-up bar arranged at opposite positions in the up-down direction.

Patent Literature 1: Japanese Patent Laid-Open No. 2014-200940

In the breaking device described in the above-mentioned Patent Document 1, the first breaking unit and the second breaking unit are arranged side by side with a gap in the conveying direction. Therefore, a problem arises in that the device becomes large and the configuration becomes complicated.

In view of the above-mentioned problems, an object of the present invention is to provide a breaking device, a breaking system, and a breaking unit capable of breaking a substrate with a simplified structure.

The first aspect of the present invention relates to a breaking device for breaking the substrate along the scribe lines formed on both sides of the substrate formed by bonding the first substrate and the second substrate. The breaking device of this aspect includes a first breaking unit arranged on the side of the first substrate, and a second breaking unit arranged on the side of the second substrate. The first breaking unit and the second breaking unit are arranged to face each other across the substrate. The first splitting unit and the second splitting unit each include a splitting rod extending along the scribe line, and a first drive to move the splitting rod toward and away from the substrate Part, two receiving parts arranged at a position sandwiching the breaking bar, and a second driving part that moves the two receiving parts toward the substrate and away from the substrate.

According to the splitting device of this aspect, when splitting the first substrate, the two receiving portions of the first splitting unit disposed on the side of the first substrate support the first substrate, and are disposed on the second substrate The breaking rod of the second breaking unit on the side presses the second substrate. On the other hand, when the second substrate is split, the first substrate disposed on the first substrate side is supported by the two receiving portions of the second cleavage unit disposed on the second substrate side supporting the second substrate The breaking bar of the breaking unit presses the first substrate. As described above, according to the splitting device of this aspect, by arranging the first and second splitting units to face the first substrate side and the second substrate side, the first substrate and the second The substrate is broken. According to this, the substrate can be broken with a simplified structure.

In the breaking device of this aspect, the first drive unit may include a motor and a ball screw. By this, the splitting rod can be driven with good accuracy.

In the breaking device of this aspect, the second driving unit may be provided with a cylinder.

In the splitting device of this aspect, the first splitting unit and the second splitting unit may each further include a guide portion for guiding the splitting bar to move in the vertical direction. By this, can It is enough to press the scribing line properly and correctly at the desired angle.

In the splitting device of this aspect, the first driving section can support the splitting bar at multiple locations. By this, since the force from the first driving part is dispersedly transmitted to the breaking rod, the breaking rod can be pressed against the substrate with an equal force as compared with the case where the first driving section supports the breaking rod at one place.

In the splitting device of this aspect, the end of the splitting rod may be formed in a V shape. With this, the substrate can be reliably broken along the scribe line.

In the breaking device of this aspect, the receiving portion may be formed to have a width in the direction transverse to the scribe line in the horizontal direction and gradually narrow as it approaches the substrate. As a result, the contact area of the receiving portion with the substrate is reduced, so that when the other splitting bar is pressed against the substrate, the substrate is easily flexed in a desired shape. According to this, the stress can be appropriately generated near the scribe line of the substrate, and the substrate can be smoothly broken.

A second aspect of the present invention is a fracturing system comprising the above-described fracturing device of the first aspect, and a transfer section that transfers the substrate formed by bonding the first substrate and the second substrate to the fracturing device .

According to the breaking system of this aspect, the same effect as the first aspect described above can be exerted.

The third aspect of the present invention relates to a breaking unit used for breaking the substrate along the scribe lines formed on both sides of the substrate formed by bonding the first substrate and the second substrate. The splitting unit of this aspect includes a splitting rod extending along the scribe line, a first driving portion that moves the splitting rod toward the substrate and away from the substrate, and is disposed to sandwich the split Two receiving portions at the position of the broken rod, and a second driving portion that moves the two receiving portions toward the substrate and away from the substrate.

According to the splitting unit of this aspect, when the splitting units are arranged on the first substrate side and the second substrate side, respectively, and the two splitting units are arranged so as to face each other across the substrate, the first state can be exerted. The same effect.

As described above, according to the present invention, it is possible to provide a breaking device, a breaking system, and a breaking unit capable of breaking a substrate with a simplified structure.

The effects and significance of the present invention will be more clearly understood from the description of the embodiments shown below. However, the embodiments shown below are only an example when implementing the present invention, and the present invention is not limited to the contents described in the following embodiments.

1‧‧‧Fracture system

11, 13, 17, 20 ‧‧‧ Conveying device (transfer section)

14, 15‧‧‧ Transfer Department

12, 18, 21‧‧‧rupture device

12a, 18a, 21a ‧‧‧ split unit (1st split unit, 2nd split unit)

103‧‧‧Cylinder (2nd drive unit)

106a‧‧‧Receiving Department

106d‧‧‧recess (guide part)

107‧‧‧Broken rod

107a‧‧‧End

201‧‧‧Motor (1st drive section)

202‧‧‧Ball screw (1st drive section)

G1, G2‧‧‧ substrate

L1~L5‧‧‧Scribe line

FIG. 1 is a schematic diagram showing the structure of the cleavage system of the embodiment.

FIG. 2 is a diagram showing the sequence of breaking the substrate in the embodiment.

Fig. 3(a) is a side view showing the configuration of the cleaving device of the embodiment; Figs. 3(b) and (c) show the state of the embodiment when the first substrate and the second substrate are cleaved Side view.

4(a) and (b) are cross-sectional views showing the structure of the cleavage unit of the embodiment from the holding member to the substrate side.

Fig. 5 is a cross-sectional view showing the structure of the split unit according to the embodiment.

6(a) and (b) are diagrams showing in detail the operation of breaking the substrate in the embodiment.

7(a) and (b) are schematic diagrams showing the structure of the upstream and downstream cleavage units of the embodiment, respectively.

8(a) and (b) are cross-sectional views showing the structure of the breaking unit of the modification from the holding member to the substrate side.

9(a) to (c) are cross-sectional views showing the structure of the breaking unit of the modified example from the holding member to the substrate side.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure, for convenience of explanation, XYZ axes orthogonal to each other are marked. The X-Y plane is parallel to the horizontal plane, and the positive direction of the Z axis is the vertical upward direction.

FIG. 1 is a schematic diagram showing the structure of the fracturing system 1.

On the upstream side (X-axis negative side) of the rupture system 1, a scoring device (not shown) for forming a scoring line on the substrate G1 is provided. The cleavage system 1 accepts the substrate G1 transferred from the scribing device, generates the substrate G2 by cleaving the substrate G1 along the scribe line, and generates the liquid crystal panel by cleaving the substrate G2 along the scribe line The prototype substrate G3.

The substrate G1 is a mother substrate from which the substrate G3 is cut out, and is composed of a so-called bonded substrate in which the first substrate and the second substrate are bonded to each other. A color filter is formed on the first substrate, and a thin film transistor (TFT) for driving liquid crystal and terminals for external connection are formed on the second substrate. The first substrate and the second substrate are bonded through a sealing material, and liquid crystal is injected into a region formed by the first substrate, the second substrate, and the sealing material. A scribe line is formed along the sealing material on the outer surface of the first substrate and the outer surface of the second substrate. The substrate G1 is transferred from the scribing device to the cleavage system 1 so that the first substrate is located on the lower surface side (Z axis negative side).

The breaking system 1 includes conveying devices 11, 13, 17, 19, 20, 22, breaking devices 12, 18, 21, transfer units 14, 15, guide 16, and inspection device 23. The inspection device 23 includes a transport device 23a.

The conveying device 11 moves the substrate G1 transferred from the upstream scoring device to X The axis is transported in the positive direction. The cleaving device 12 includes a cleaving unit 12a arranged on the first substrate side and the second substrate side of the substrate G1, respectively. The two breaking units 12a are located between the conveying device 11 and the conveying device 13 when viewed from the Z-axis direction. The splitting device 12 splits the substrate G1 to generate the substrate G2 by the two splitting units 12a. The conveying device 13 conveys the generated substrate G2 in the positive direction of the X axis so as to be located at a holding position held by the transfer sections 14 and 15.

The transfer sections 14 and 15 are configured to be movable in the Y-axis direction along the guide 16 extending in the Y-axis direction. The transfer sections 14 and 15 suck the substrate G2 located at the holding position on the transfer device 13 from the upper side and lift it upward. The transfer unit 14 moves the lifted substrate G2 in the positive direction of the Y axis, rotates it by 90 degrees, and places it on the transfer device 17. The transfer unit 15 moves the lifted substrate G2 in the negative direction of the Y axis, rotates it by 90 degrees, and places it on the transfer device 20. The substrate G2 generated from the substrate G1 is alternately conveyed to the conveying devices 17 and 20 by the transfer sections 14 and 15.

The conveying device 17 conveys the substrate G2 in the positive direction of the X axis. The cleaving device 18 includes a cleaving unit 18a arranged on the first substrate side and the second substrate side of the substrate G2, respectively. The two breaking units 18a are located between the conveying device 17 and the conveying device 19 when viewed from the Z-axis direction. The splitting device 18 splits the substrate G2 to generate the substrate G3 by the two splitting units 18a. The conveying device 19 conveys the generated substrate G3 in the positive direction of the X axis.

Similarly, the transport device 20 transports the substrate G2 in the positive X-axis direction. The cleaving device 21 includes a cleaving unit 21a arranged on the first substrate side and the second substrate side of the substrate G2, respectively. The two breaking units 21a are located between the conveying device 20 and the conveying device 22 when viewed from the Z-axis direction. The splitting device 21 splits the substrate G2 to generate the substrate G3 by the two splitting units 21a. The conveying device 22 conveys the generated substrate G3 in the positive direction of the X axis.

The inspection device 23 is obtained by lifting the substrate G3 conveyed by the conveying devices 19 and 22 upward, and checks whether the cleavage by the cleavage devices 18 and 21 is properly and correctly performed. The substrate G3 determined to be appropriate and correct by inspection is transported in the positive X-axis direction by the transport device 23a, and then transported to a device (not shown) that performs polishing and washing in the subsequent stage. In the above manner, the processing of the breaking system 1 is ended.

FIG. 2 is a diagram showing the sequence of generating substrates G2 and G3 from the substrate G1. FIG. 2 is a diagram of the substrates G1 to G3 transported in the fracturing system 1 as viewed from above. In addition, corresponding side views are also displayed for the substrates G2 and G3.

The substrate G1 transported to the breaking system 1 is formed with scoring lines L1 to L5 by an upstream scoring device. The scribe line L1 is formed under the first substrate of the substrate G1 in the Y-axis direction. The scribe line L2 is formed on the upper surface of the second substrate of the substrate G1 in the Y-axis direction. Viewed from the Z-axis direction, the positions of the scribe lines L1 and L2 are the same. The scribe lines L3 and L5 are formed under the first substrate of the substrate G1 in the X-axis direction. The scribe line L4 is formed on the upper surface of the second substrate of the substrate G1 in the X-axis direction. Viewed from the Z-axis direction, the positions of the scribe lines L3 and L4 are the same, and the positions of the scribe lines L3 and L4 are different from the positions of the scribe lines L5.

When the scribe lines L1 and L2 of the substrate G1 are transferred to the breaking position of the breaking device 12, the breaking device 12 causes the first substrate and the second substrate to be broken along the scribe lines L1 and L2, respectively. With this, the substrate G2 is generated. After the generated substrate G2 is transferred to the positive direction of the Y axis and the negative direction of the Y axis by the transfer sections 14 and 15 shown in FIG. 1, it is rotated 90 degrees clockwise as viewed from the Z axis direction and placed on the conveyor装置17,20.

Next, when the scribe line L5 of the substrate G2 is transferred to the rupture position of the rupture device 18, the rupture device 18 breaks the first substrate along the scribe line L5. In addition, when the substrate When the scribe lines L3 and L4 of G2 are transported to the breaking position of the breaking device 18, the first substrate is broken along the scribe line L3 by the breaking device 18, and the second substrate is broken along the scribe line L4 Break. With this, the substrate G3 is generated.

At this time, the portion of the first substrate corresponding to the scribe lines L3 and L5 is removed by breaking the scribe lines L4 and L5. With this, since the notch portion G3a extending in the Y-axis direction is formed on the generated substrate G3, the terminal formed on the second substrate is exposed. In addition, the part of the removed first substrate is dropped from between the conveying devices 17 and 19 immediately after being broken and recovered. Alternatively, the portion of the removed first substrate is transported by the transport device 19 and dropped on the positive side of the X axis of the transport device 19 to be recovered.

Similarly, when the scribe lines L3, L4, L5 of the substrate G2 are transported to the breaking position of the breaking device 21, the breaking device 21 breaks the first substrate along the scribe lines L3, L5, so that The second substrate is broken along the scribe line L4. With this, the substrate G3 is generated.

The inspection device 23 uses a laser displacement sensor to check whether the notch G3a is properly and correctly formed on the generated substrate G3. The substrate G3 determined to be appropriately and correctly formed with the notch G3a is transported to the device located on the downstream side of the cleavage system 1.

FIG. 3(a) is a side view when the cleaving device 12 is viewed from the negative direction of the Y axis.

As described above, the breaking device 12 includes two breaking units 12a. The two breaking units 12a are arranged to face each other through the substrate G1 transported on the conveying device 11, and have a configuration symmetrical to each other with the substrate G1 as a plane of symmetry. The structure of the upper split unit 12a will be described below with reference to FIG. 3(a).

The breaking unit 12a includes a holding member 101, a guide 102, a cylinder 103, a sliding member 104, a holding member 105, a receiving portion 106, and a breaking bar 107.

The holding member 101 is fixedly installed in the fracturing system 1, and holds the guide 102 extending in the Z-axis direction and the cylinder 103 having the rod 103a. The sliding member 104 is configured to be slidable along the guide 102 in the Z-axis direction. The lower end of the rod 103a of the cylinder 103 is provided above the sliding member 104. As the rod 103a of the cylinder 103 moves in the Z-axis direction, the sliding member 104 moves along the guide 102 in the Z-axis direction. The holding member 105 is provided under the sliding member 104, and the accommodating portion 106 is provided under the holding member 105.

A breakage bar 107 extending in the Y-axis direction along the scribe lines L1 and L2 of the substrate G1 is arranged in the housing portion 106. At the lower end of the splitting bar 107, an end 107a extending in the Y-axis direction is formed. The breaking bar 107 is supported by the following mechanism inside the housing 106 so as to be movable in the Z-axis direction. At the lower end of the accommodating portion 106, two receiving portions 106a extending in the Y-axis direction are formed, and the two receiving portions 106a are located at positions sandwiching the breaking bar 107. In addition, the mechanism inside the accommodating portion 106, the breaking bar 107, and the accommodating portion 106 will be described below with reference to FIGS. 4(a) to 5.

3(b) is a side view showing the state when the first substrate on the lower side of the substrate G1 is broken, and FIG. 3(c) is a side view showing the state when the second substrate on the upper side of the substrate G1 is broken.

When the substrate G1 is transported in the positive direction of the X axis, as shown in FIG. 3(a), when the scribe lines L1, L2 are positioned at the end 107a of the breaking bar 107, as shown in FIG. 3(b), Drive the breaking device 12. Specifically, by driving the upper breaking rod 107 downward, the end 107a of the upper breaking rod 107 is pressed against the second substrate. In addition, by driving the lower rod 103a upward, the receiving portion 106a of the lower receiving portion 106 is pressed against the first substrate.

As described above, the end portion 107a is pressed against the scribe line L2 of the second substrate, and the receiving portion 106a is pressed against the first substrate at a position shifted by a predetermined width from the scribe line L1 in the positive X-axis direction and the negative X-axis direction . As a result, the first substrate is broken along the scribe line L1. About the crack of the first substrate It will be described in detail below with reference to FIG. 6(a).

When the first substrate is broken, the position of the substrate G1 does not move, and then, as shown in FIG. 3(c), the breaking device 12 is driven. Specifically, the upper breaking rod 107 is driven upward, and the upper rod 103a is driven downward, whereby the receiving portion 106a of the upper receiving portion 106 is pressed against the second substrate. In addition, the lower rod 103a is driven downward, and the lower breaking rod 107 is driven upward, whereby the end 107a of the lower breaking rod 107 is pressed against the first substrate.

As described above, the end portion 107a is pressed against the scribe line L1 of the first substrate, and the receiving portion 106a is pressed against the position of the second substrate offset from the scribe line L2 by a predetermined width in the positive X-axis direction and the negative X-axis direction . As a result, the second substrate is broken along the scribe line L2. The breakage of the second substrate will be described in detail below with reference to FIG. 6(b).

4(a), (b) and FIG. 5 are cross-sectional views showing the configuration below from the holding member 105 of the upper breaking unit 12a. 4(a) is a cross-sectional view of A1-A2 shown in FIG. 4(b), FIG. 4(b) is a cross-sectional view of B1-B2 shown in FIG. 4(a), and FIG. 5 is a view of FIG. 4(a), ( b) The C1-C2 cross-sectional view shown. The A1-A2 section is a section parallel to the XZ plane, the B1-B2 section is a section parallel to the YZ plane, and the C1-C2 section is a section parallel to the XY plane.

As shown in FIGS. 4( a ), (b) and FIG. 5, the accommodating portion 106 is composed of two wall portions 106 b parallel to the YZ plane and two wall portions 106 c parallel to the XZ plane. As shown in FIGS. 4(a) and (b), the receiving portion 106a is formed at the lower end of the two wall portions 106b. The outer surface of the receiving portion 106a is inclined toward the inner side of the receiving portion 106, whereby the width of the receiving portion 106a in the X-axis direction (the width across the scribe lines L1 and L2 in the horizontal direction) becomes closer to the substrate G1 And narrowing. The lower ends of the two wall portions 106c are located above the lower ends of the receiving portions 106a.

In the space surrounded by the wall portions 106b, 106c, the motor 201, the ball screw 202, the support members 203, 204, and the breaking bar 107 are housed. The motor 201 is provided below the holding member 105. The ball screw 202 is fixed to the rotating shaft of the motor 201. The support member 203 is fixed to the nut of the ball screw 202. The upper end of the support member 204 is fixed below the support member 203. The lower end of the support member 204 is divided into two. The two lower ends of the support member 204 are located at positions separated in the Y-axis direction, and the breakage bar 107 is fixed to the lower end. The side surface of the end portion 107a of the breaking bar 107 is inclined, whereby the width of the end portion 107a in the X-axis direction becomes narrower as it approaches the substrate G1. That is, the end 107a of the breaking bar 107 is formed in a V-shape.

As shown in FIGS. 4(a), (b) and FIG. 5, a concave portion 106d is formed on the inner surface of the wall portion 106c. The recesses 106d of the wall portion 106c on the positive side of the Y axis and the negative side of the Y axis respectively accommodate the ends of the positive side of the breaking bar 107 on the positive side and the negative side of the Y axis.

As shown in FIG. 5, when the width of the substrate G1 in the Y-axis direction is W1, the distance between the inner surface of the wall portion 106c on the positive side of the Y-axis and the inner surface of the wall portion 106c on the negative side of the Y-axis is W2, The interval between the positive Y-axis side surface of the concave portion 106d on the positive Y-axis side and the negative Y-axis side surface of the concave portion 106d on the negative Y-axis side is W3, and the outer side surface of the wall portion 106c on the positive Y-axis side and the negative side of the Y-axis side When the interval between the outer surfaces of the wall portion 106c is W4, the relationship of W1 to W4 is W1<W2<W3<W4. When the width of the breaking bar 107 in the X-axis direction is W5 and the width of the recess 106d in the X-axis direction is W6, the relationship between W5 and W6 is W5<W6.

4 (a) and (b), when the splitting bar 107 is moved downward, the drive motor 201 moves the nut of the ball screw 202 downward. As a result, the supporting members 203 and 204 for supporting the breaking rod 107 move downward, and the breaking rod 107 moves downward. On the other hand, when the splitting bar 107 is moved upward, the driving motor 201 moves the nut of the ball screw 202 upward Direction of movement. As a result, the supporting members 203 and 204 for supporting the breaking rod 107 move upward, and the breaking rod 107 moves upward. At this time, the splitting bar 107 is guided by the concave portion 106d, so that it moves only in the vertical direction.

6(a) and (b) are diagrams showing in detail that the substrate G1 is broken by the receiving portion 106a of the receiving portion 106 and the end portion 107a of the breaking bar 107. 6(a) and (b) are the same A1-A2 cross-sectional views as in FIG. 4(a).

As shown in FIG. 6(a), when breaking the first substrate, the end 107a of the upper breaking bar 107 is pressed against the second substrate, and the receiving portion 106a of the lower receiving portion 106 is pressed against the first Under the substrate. At this time, the first substrate is broken due to the downward bending of the substrate G1. As shown in FIG. 6(b), when the second substrate is broken, the receiving portion 106a of the upper receiving portion 106 is pressed against the second substrate, and the end 107a of the lower breaking bar 107 is pressed against the first Substrate. At this time, the second substrate is broken due to the upward bending of the substrate G1.

The structure of the breaking device 12 and the operation of breaking the substrate G1 with the breaking device 12 have been described above with reference to FIGS. 3(a) to 6(b). The structure of the breaking device 18 and the breaking device 18 The operation of breaking the substrate G2 is also substantially the same, and the structure of the breaking device 21 is also substantially the same as the operation of the breaking device 21 to break the substrate G2.

FIG. 7(a) is a schematic diagram showing the cleaving unit 12a on the upper side of the cleaving device 12, and FIG. 7(b) is a schematic diagram showing the cleaving units 18a and 21a on the upper side of the cleaving device 18. In addition, the breaking devices 18 and 21 have the same configuration.

As shown in FIGS. 7(a) and (b), the breaking units 18a and 21a are different from the breaking unit 12a in that the length of the holding member 105, the accommodating portion 106, and the breaking bar 107 in the Y-axis direction are different. Shorter. The other structures of the breaking units 18a and 21a are the same as those of the breaking unit 12a.

In addition, in the breaking units 18a and 21a, the relationship of the lengths of W1 to W4 shown in FIG. 5 is set to be the same. That is, in FIG. 5, if W1 is the width of the substrate G2 in the Y-axis direction and W2 to W4 are the corresponding lengths of the split units 18a and 21a, the relationship between W1 to W4 and the split unit 12a Same as W1<W2<W3<W4.

In addition, the two breaking units 18a of the breaking device 18 are arranged so as to face each other through the substrate G2, and have a configuration symmetrical to each other with the substrate G2 as a plane of symmetry. Similarly, the two cleaving units 21a of the cleaving device 21 are arranged so as to face each other through the substrate G2, and have a configuration symmetrical to each other with the substrate G2 as a plane of symmetry. Therefore, the cleaving devices 18 and 21 can cleave the substrate G2 similarly to the cleaving device 12.

<Effect of the embodiment>

According to this embodiment, the following effects can be exhibited.

When the first substrates of the substrates G1 and G2 are broken, the two receiving portions 106a of the breaking units 12a, 18a, and 21a arranged on the side of the first substrate support the first substrate, and the second substrates are arranged on the second substrate. The breaking bars 107 of the breaking units 12a, 18a, and 21a on the substrate side are pressed against the second substrate. On the other hand, when the second substrates of the substrates G1 and G2 are broken, the two receiving portions 106a of the cleavage units 12a, 18a, and 21a arranged on the second substrate side support the second substrate. The splitting bar 107 of the splitting units 12a, 18a, and 21a disposed on the first substrate side is pressed against the first substrate. As described above, according to the splitting devices 12, 18, and 21 of the present embodiment, by disposing the two splitting units so as to face the first substrate side and the second substrate side, the first The substrate and the second substrate are broken. According to this, the substrates G1 and G2 can be broken with a simplified structure.

In addition, the driving section for driving the breaking rod 107 in the up-down direction is composed of a motor 201 and a ball screw 202. With this, for example, the splitting bar 107 can be driven with good accuracy compared to the case where the splitting bar 107 is driven in the up and down direction only by the motor 201.

In addition, the breaking units 12a, 18a, and 21a are provided with recesses 106d for guiding the movement of the breaking bar 107 in the vertical direction. Thereby, the breaking rod 107 can be pressed on the scribe line appropriately and accurately at a desired angle, that is, in a direction perpendicular to the substrate.

In addition, the motor 201 and the ball screw 202 support the breaking bar 107 at two places by the support member 204. That is, the support member 204 is fixed to the breaking bar 107 at two places separated in the Y-axis direction. By this, since the force from the motor 201 and the ball screw 202 is dispersedly transmitted to the splitting bar 107, it can be equalized in the Y-axis direction as compared with the case where the support member 204 is fixed to the splitting bar 107 at one place. The force pushes the breaking bar 107 against the substrates G1 and G2.

In addition, the end 107a of the breaking bar 107 is formed in a V shape. With this, the substrates G1 and G2 can be reliably broken along the scribe lines L1 to L5 while pressing the cleavage bar 107 against the substrates G1 and G2.

In addition, the receiving portion 106 a of the breaking device 12 is formed so that the width in the horizontal direction across the scribe lines L1 and L2, that is, the width in the X-axis direction becomes narrower as it approaches the substrate G1. Similarly, the receiving portion 106a of the breaking devices 18 and 21 is formed so that the width in the horizontal direction across the scribe lines L3 to L5, that is, the width in the X-axis direction becomes narrower as it approaches the substrate G2. Thereby, since the contact area of the receiving portion 106a with the substrates G1 and G2 becomes smaller, the substrates G1 and G2 can be easily affected when the other splitting bar 107 opposed to each other in the vertical direction is pressed against the substrates G1 and G2 Deformed desired shape. According to this, it is possible to appropriately generate stress in the vicinity of the scribe lines L1 and L2 of the substrate G1 and the scribe lines L3 to L5 of the substrate G2, and it is possible to smoothly make the substrate G1, G2 are broken.

<Modification>

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments. In addition, the embodiments of the present invention may be variously modified in addition to the above.

For example, in the above embodiments, the substrates G1 and G2 are liquid crystal panels and are formed by bonding the first substrate and the second substrate to each other, but the substrates G1 and G2 are not limited to those shown in the above embodiments. The substrate to be cleaved by the cleaving devices 18 and 21 may be any substrate that can be cleaved along the scribe line.

In addition, in the above embodiment, in the breaking device 12, the two breaking units 12a have the same structure as each other, and in the breaking device 18, the two breaking units 18a have the same structure as each other, and in the breaking device 21 The two split units 21a have the same structure. But it is not limited to this, the two splitting units need not necessarily be of the same composition.

In addition, in the above embodiment, the motor 201 and the ball screw 202 support the splitting bar 107 at two places by the support member 204, but it is not limited to this, and the splitting bar may be supported at more than three places by the support member 204 107. In this case, the support member 204 is fixed to the splitting bar 107 at three or more places separated in the Y-axis direction. In addition, since the breaking devices 18 and 21 have a short length of the breaking bar 107 in the Y-axis direction, the motor 201 and the ball screw 202 can also support the breaking bar 107 at one place by the support member 204.

In addition, in the above embodiment, as shown in FIGS. 4( a) and (b ), the end of the wall portion 106 c on the substrate side is located farther from the substrate than the end of the receiving portion 106 a on the substrate side. However, it is not limited to this. In the Z-axis direction, the end of the wall portion 106c on the substrate side may be connected to the substrate of the receiving portion 106a The ends of the sides are in the same position.

8(a) and (b) are diagrams showing the above configuration. In this modification, in the Z-axis direction, the lower end position of the wall portion 106c is the same as the lower end position of the receiving portion 106a. In addition, in this modification, the C1-C2 cross section is also substantially the same as FIG. 5.

In this modification, when the receiving portion 106a supports the substrate, the end of the wall portion 106c also contacts the substrate. However, when viewed from the Z-axis direction, the area where the wall portion 106c contacts the substrate does not overlap with the area where the other split bar 107 contacts the substrate. Therefore, for example, when the upper receiving portion 106a supports the substrates G1 and G2 and the lower breaking bar 107 is pressed against the substrates G1 and G2, the deflection of the substrates G1 and G2 is not hindered by the lower end of the upper wall portion 106c. With this, the first substrate and the second substrate can be flexed in the same manner as in the above-described embodiment, and the substrates G1 and G2 can be broken.

In addition, in the above-mentioned embodiment, although the receiving portion 106a has the shape shown in FIG. 4(a), it is not limited to this, and may have other shapes. For example, as shown in FIG. 9(a), the inner surface of the receiving portion 106a may also be inclined toward the outer side of the housing portion 106, so that the receiving portion 106a may be formed into a V-shape. In addition, as shown in FIG. 9(b), the outer side surface and the inner side surface of the receiving portion 106a may be formed in an arc shape.

Furthermore, as shown in FIG. 9(c), the receiving portion 106a may be formed in a rectangular shape. In this case, since the contact area of the receiving portion 106a with the substrates G1 and G2 becomes larger, it can be assumed that the substrates G1 and G2 do not take the desired shape when the other splitting bar 107 is pressed against the substrates G1 and G2 Flex. Therefore, as shown in FIGS. 4(a) and 9(a) and (b), it is preferable to form the receiving portion 106a so that the width in the X-axis direction becomes narrower as it approaches the substrates G1 and G2.

In addition, in the above-mentioned embodiment, although the receiving portion 106a is continuously formed at the end portion of the housing portion 106 on the substrate side, it is not limited to this, and the receiving portion 106a may be partially formed. In addition, Although the formation direction of the receiving portion 106a is parallel to the scribe line, it may not be parallel to the scribe line. In addition, although the receiving portion 106a is formed in a linear shape, it may be in a zigzag shape.

The embodiments of the present invention can be appropriately modified in various ways within the scope of the technical idea disclosed in the patent application.

12‧‧‧Breaking device

12a‧‧‧Fracture unit (1st fracture unit, 2nd fracture unit)

101‧‧‧ Retaining member

102‧‧‧Guide

103‧‧‧Cylinder (2nd drive unit)

103a‧‧‧rod

104‧‧‧sliding member

105‧‧‧Retaining member

106‧‧‧ Containment Department

106a‧‧‧Receiving Department

107‧‧‧Broken rod

107a‧‧‧End

G1‧‧‧ substrate

Claims (8)

A splitting device for splitting a substrate along a scribe line formed on both sides of the substrate formed by laminating the first substrate and the second substrate, characterized in that it includes a first split disposed on the side of the first substrate A breaking unit and a second breaking unit arranged on the side of the second substrate; the first breaking unit and the second breaking unit are arranged to face each other across the substrate; the first breaking unit And the second breaking unit, each including: a breaking bar extending along the scribe line, a first driving part that moves the breaking bar toward and away from the substrate, and is disposed on the clamp Two receiving parts at the position of the breaking bar, a second driving part to move the two receiving parts toward and away from the substrate, and to guide the breaking bar up and down A guide that moves in the direction. According to the splitting device of claim 1 of the patent application, the first drive unit includes a motor and a ball screw. For example, in the splitting device of claim 1 or 2, the second drive unit includes a cylinder. For example, the splitting device according to item 1 or 2 of the patent application, wherein the first driving part supports the splitting bar at multiple locations. For example, the splitting device according to item 1 or 2 of the patent application scope, wherein the end of the splitting rod is formed into a V-shape. A breaking device as claimed in item 1 or 2 of the patent application, wherein the receiving portion is formed in such a manner that the width in the direction transverse to the scribe line in the horizontal direction becomes narrower as it approaches the substrate. A fracturing system, characterized by comprising: a fracturing device according to any one of claims 1 to 6; and transferring the substrate formed by bonding the first substrate and the second substrate to the fracturing The transfer part of the device. A breaking unit is used when breaking a substrate along a scribe line formed on both sides of a substrate formed by bonding a first substrate and a second substrate, and is characterized by comprising: extending along the scribe line The splitting bar, the first driving part that moves the splitting bar toward and away from the substrate, the two receiving parts disposed at the position sandwiching the splitting bar, and the two receiving The second drive portion that moves toward the substrate and away from the substrate, and the guide portion that guides the splitting bar to move in the vertical direction.

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