TWI472495B - Breaking device - Google Patents
Breaking device Download PDFInfo
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- TWI472495B TWI472495B TW100145926A TW100145926A TWI472495B TW I472495 B TWI472495 B TW I472495B TW 100145926 A TW100145926 A TW 100145926A TW 100145926 A TW100145926 A TW 100145926A TW I472495 B TWI472495 B TW I472495B
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- Prior art keywords
- rod body
- brittle material
- material substrate
- breaking
- skirts
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- 239000000758 substrate Substances 0.000 claims description 55
- 239000000463 material Substances 0.000 claims description 41
- 238000002788 crimping Methods 0.000 claims 1
- 238000009751 slip forming Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 7
- 230000005489 elastic deformation Effects 0.000 description 5
- 229920001875 Ebonite Polymers 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000143476 Bidens Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/04—Severing by squeezing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
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- Engineering & Computer Science (AREA)
- Forests & Forestry (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Description
本發明係關於玻璃基板、半導體基板等脆性材料基板之折斷裝置，進一步詳言之，係關於將在前製程形成有劃線(切槽)之基板，沿該劃線加以分斷之折斷裝置。The present invention relates to a breaking device for a brittle material substrate such as a glass substrate or a semiconductor substrate. More specifically, the present invention relates to a breaking device in which a substrate having a scribe line (grooving) is formed in a preceding process and is separated along the scribe line.
於將玻璃等脆性材料基板加以分斷之加工中，以使用刀輪(cutter wheel、亦稱scribing wheel)等之槽加工用工具、或照射雷射光束以於基板表面形成劃線(scribe line)，之後，沿著該劃線施加外力使基板彎曲以折斷(分斷)之方法較為人知，例如專利文獻1及專利文獻2中已有所揭露。In the process of dividing a brittle material substrate such as glass, a groove processing tool such as a cutter wheel (also called a scribing wheel) or a laser beam is irradiated to form a scribe line on the surface of the substrate. Then, a method of applying an external force along the scribe line to bend the substrate to break (break) is known, and is disclosed, for example, in Patent Document 1 and Patent Document 2.
圖6係顯示習知脆性材料基板通常之折斷方法程序的圖。Fig. 6 is a view showing a procedure of a conventional breaking method of a conventional brittle material substrate.
首先，如圖6(a)所示，將脆性材料基板W裝載於劃線裝置之裝載台20上，於其表面使用刀輪21形成劃線S。First, as shown in FIG. 6(a), the brittle material substrate W is placed on the loading table 20 of the scribing device, and the scribing line S is formed on the surface thereof using the cutter wheel 21.
其次，如圖6(b)所示，將脆性材料基板W裝載於鋪有彈性體緩衝片23之折斷裝置之裝載台22上。此時，係將脆性材料基板W反轉成形成有劃線S之表面(表面側)朝向緩衝片23、而相反側之表面(背面側)為上面。Next, as shown in FIG. 6(b), the brittle material substrate W is placed on the loading table 22 of the breaking device on which the elastic buffer sheet 23 is laid. At this time, the brittle material substrate W is reversed so that the surface (surface side) on which the scribe line S is formed faces the buffer sheet 23, and the surface (back surface side) on the opposite side is the upper surface.
接著，從朝下之劃線S之背面上方，降下一沿著劃線S延伸之長條板狀折斷桿24從脆性材料基板W之相反側按壓，藉由使脆性材料基板W在緩衝片23上略彎曲成V字形，據以使劃線S(裂痕)滲透於深度方向。據此，如圖6(c)所示，脆性材料基板W即沿著劃線S被折斷。Next, from the upper side of the back surface of the downward scribe line S, the elongated plate-shaped breaking bar 24 extending along the scribe line S is pressed from the opposite side of the brittle material substrate W, and the brittle material substrate W is placed on the buffer sheet 23 The upper portion is slightly bent into a V shape, so that the scribe line S (crack) penetrates in the depth direction. As a result, as shown in FIG. 6(c), the brittle material substrate W is broken along the scribe line S.
先行技術文獻Advanced technical literature
[專利文獻1] 日本專利第3787489號公報[Patent Document 1] Japanese Patent No. 3787489
[專利文獻2] 特開平10-330125號公報[Patent Document 2] Japanese Patent Laid-Open No. Hei 10-330125
根據該習知方法，如圖6(c)所示，在使用折斷桿24使脆性材料基板W彎曲成V字形加以分段時，會有左右基板之相鄰上端緣部分25彼此擠壓干涉而形成小缺口等受損之情形。當產生此種缺口時，即便是非常小的缺口，亦會因該處而誘使在折斷後之基板表面產生裂紋等，成為產生瑕疵品之重要原因。此外，當因缺口而產生之微小片殘留在緩衝片23時，於進行次一折斷時，有可能造成脆性材料基板W之損傷。尤其是在脆性材料基板W表面形成有微細電子電路之情形時，即有可能產生切斷電子電路等之重大不良影響。According to the conventional method, as shown in FIG. 6(c), when the brittle material substrate W is bent into a V shape by the breaking lever 24, the adjacent upper end edge portions 25 of the left and right substrates are pressed against each other. A situation in which a small gap or the like is formed is damaged. When such a notch is formed, even if it is a very small gap, cracks or the like may be induced on the surface of the substrate after the breakage, which is an important cause of defective products. Further, when the minute pieces due to the notch remain in the buffer sheet 23, the brittle material substrate W may be damaged when the next break occurs. In particular, when a fine electronic circuit is formed on the surface of the brittle material substrate W, there is a possibility that a significant adverse effect such as cutting off an electronic circuit may occur.
因此，本發明之目的在提供一種在使脆性材料基板彎曲成V字形加以分斷時可阻止分斷端面彼此干涉、且得到沒有缺口之整齊分斷端面的新穎折斷裝置。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a novel breaking device which can prevent the breaking end faces from interfering with each other when the brittle material substrate is bent into a V-shape to be cut, and which can obtain a neatly divided end face without a notch.
為解決上述課題而為之本發明之折斷裝置，係對脆性材料基板從形成有劃線之表面側相反側之背面側朝向該劃線壓接折斷桿，據以使該基板彎成V字形後進行沿該劃線之分斷，其特徵在於：該折斷桿，係由以長條硬質構件形成且於按壓方前端具備前端抵接部之桿本體、與由較桿本體柔軟之彈性構件形成且以夾著該前端抵接部彼此成對之方式安裝在該桿本體之左右裙片構成；該左右裙片傾斜形成為越接近前端越從該桿本體往外側擴張，且其前端較該前端抵接部突出於按壓方向側。In order to solve the above-mentioned problems, the breaking device of the present invention is configured such that the brittle material substrate is pressed against the scribe line from the back side opposite to the side on which the scribe line is formed, and the substrate is bent into a V shape. The breaking line is formed by a rod body formed of a long rigid member and having a front end abutting portion at a front end of the pressing portion, and an elastic member which is softer than the rod body and The left and right skirts are attached to the left and right side of the rod body so as to be paired with each other; the left and right skirts are inclined so as to be extended outward from the rod body as the front end is closer to the front end, and the front end thereof is closer to the front end than the front end The joint protrudes from the pressing direction side.
根據本發明，在壓接折斷桿以使脆性材料基板彎曲成V字形後加以分斷時，因左右裙片之彈性變形，脆性材料基板即受到從劃線向左右分離之方向之力(增壓)，由於此力，在分斷之同時脆性材料基板之左右分斷面被拉開而無分斷面彼此干涉之情形，獲得無缺口之整齊分斷面之效果。According to the present invention, when the breakage bar is crimped to bend the brittle material substrate into a V shape, the brittle material substrate is subjected to the force of the direction of separation from the scribe line to the left and right due to the elastic deformation of the left and right skirt pieces. Because of this force, the left and right cross-sections of the brittle material substrate are pulled apart without interference of the cross-sections at the same time, and the effect of the undivided uniform cross-section is obtained.
上述左右裙片較佳係形成為沿桿本體長度方向隔著間隔分割為複數個。如此，裙片即易於變形，能使力量集中於抵接部分以賦予橫方向之力。Preferably, the left and right skirts are formed to be divided into a plurality of intervals along the longitudinal direction of the rod body. In this way, the skirt is easily deformed, and the force can be concentrated on the abutting portion to impart a force in the lateral direction.
又，亦可將左右裙片沿桿本體長度方向連續長長的形成。如此，即能沿著劃線均勻的賦予橫方向之力。Further, the left and right skirts may be formed continuously in the longitudinal direction of the rod body. In this way, the force in the lateral direction can be uniformly distributed along the scribe line.
本發明中，較佳係於左右裙片之外側面形成有沿桿本體長度方向之槽。In the present invention, it is preferable that the outer side surfaces of the left and right skirts are formed with grooves along the longitudinal direction of the rod body.
如此，當裙片抵接於基板而被按壓時能在槽的部分彎曲，即使裙片材質之硬度較高、或是相當厚的彈性樹脂，亦能容易的彈性變形。此外，藉由彎曲動作，能對基板有效的作用於水平方向拉開之力。Thus, when the skirt piece is pressed against the substrate and pressed, it can be bent at the portion of the groove, and even if the material of the skirt piece has a high hardness or a relatively thick elastic resin, it can be easily elastically deformed. Further, by the bending operation, it is possible to effectively act on the substrate in the horizontal direction.
以下，根據圖之揭示詳細說明本發明之折斷裝置。Hereinafter, the breaking device of the present invention will be described in detail based on the disclosure of the drawings.
圖1係顯示本發明之折斷裝置之一例的立體圖，圖2係顯示於折斷裝置之一折斷桿例的立體圖，圖3係用以說明折斷桿之動作的剖面圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing an example of a breaking device of the present invention, Fig. 2 is a perspective view showing an example of a breaking bar of a breaking device, and Fig. 3 is a cross-sectional view for explaining the action of the breaking bar.
折斷裝置A，具備裝載待分斷之脆性材料基板W(例如玻璃基板)的裝載台1。此裝載台1可沿水平軌道2,2移動於Y方向，被藉由馬達M旋轉之螺栓3驅動。又，裝載台1可藉由內裝馬達之驅動部4在水平面內旋動。The breaking device A includes a loading table 1 on which a brittle material substrate W (for example, a glass substrate) to be separated is loaded. This loading table 1 is movable in the Y direction along the horizontal rails 2, 2 and is driven by the bolts 3 which are rotated by the motor M. Further, the loading table 1 can be rotated in the horizontal plane by the driving portion 4 of the built-in motor.
裝載台1具備將裝載於其上脆性材料基板W保持於定位置之保持手段。本實施例中，作為此保持手段，設有於裝載台1開口之多數個小的空氣吸附孔1a，藉由來自此空氣吸附孔1a之空氣吸引吸附保持脆性材料基板W。又，除此之外，亦可以用來抵接脆性材料基板W端面以進行定位之塊體(block)或銷(pin)作為保持手段。The loading table 1 is provided with holding means for holding the brittle material substrate W placed thereon at a predetermined position. In the present embodiment, as the holding means, a plurality of small air suction holes 1a opened in the loading table 1 are provided, and the brittle material substrate W is sucked and held by the air from the air suction holes 1a. Further, in addition to this, a block or pin for abutting the end surface of the brittle material substrate W may be used as a holding means.
具備夾著裝載台1設置之兩側的支承柱5,5與延伸於X方向之橫架6的橋7，係跨在裝載台21設置。於此橫架6透過軸10將折斷桿保持可昇降，藉由汽缸11進行昇降。A bridge 7 having a support post 5, 5 sandwiching both sides of the loading table 1 and a cross frame 6 extending in the X direction is provided across the loading table 21. The cross frame 6 maintains the break lever through the shaft 10 to be raised and lowered, and is lifted and lowered by the cylinder 11.
折斷桿(brake bar)B，如圖2及圖3所示，具備配合形成於折斷對象基板W之劃線S之長度延伸於水平方向之長條狀桿本體8。桿本體8係以硬質構件(例如厚的硬質橡膠製)形成，被軸10支承，而能以軸10於按壓基板W之方向昇降。又，折斷桿B之下端側，於按壓方向(向下方向)之前端形成有用以與基板W抵接之前端抵接部8a。前端抵接部8a係將前端之剖面作成三角形而成尖銳突出，形成稜線，而能沿劃線S有效的傳遞按壓力。當然，只要能有效的傳遞按壓力之形狀的話，前端抵接部8a之形狀並無特別限定。例如，前端抵接部8a之剖面可以是半圓形。此外，若折斷對象是如貼合基板般之表面、背面皆需進行按壓之情形時，由於前端抵接部8a抵接之面亦形成有劃線，因此在此種情形時，可作成開叉(二股)之前端抵接部以避開劃線S進行按壓。As shown in FIG. 2 and FIG. 3, the brake bar B has an elongated rod main body 8 extending in the horizontal direction so as to extend in the length of the scribe line S formed on the fracture target substrate W. The rod main body 8 is formed of a hard member (for example, a thick hard rubber) and is supported by the shaft 10 so as to be movable up and down in the direction in which the shaft 10 is pressed. Further, the lower end side of the breaking lever B is formed at the front end in the pressing direction (downward direction) to form a front end abutting portion 8a for abutting against the substrate W. The front end abutting portion 8a is formed by sharply protruding a cross section of the front end to form a ridge line, and can effectively transmit a pressing force along the scribe line S. Needless to say, the shape of the distal end abutting portion 8a is not particularly limited as long as the shape of the pressing force can be effectively transmitted. For example, the cross section of the front end abutting portion 8a may be semicircular. In addition, when the object to be broken is pressed such that the surface and the back surface of the substrate are pressed, since the surface abutting on the front end abutting portion 8a is also formed with a scribe line, in this case, a slit can be made. (Two strands) The front end abutting portion is pressed to avoid the scribing line S.
於桿本體8之側面，具備於中央夾著前端抵接部8a彼此成對、以較桿本體8柔軟之彈性構件形成之左右一對的裙片9,9。具體而言，雖係與桿本體8同樣的使用硬質橡膠，但將其厚度作薄以作為增加了柔軟性之彈性構件。如此，藉由相同硬質橡膠之使用，可將桿本體8與裙片9一體成形。當然，亦可使用育桿本體8不同之柔軟材料以對裙片9,9賦予柔軟性。On the side surface of the rod main body 8, a pair of left and right skirts 9, 9 which are formed by an elastic member which is paired with the front end abutting portion 8a and which is softer than the rod main body 8 are provided. Specifically, although hard rubber is used similarly to the rod main body 8, the thickness is made thin as an elastic member which increases flexibility. Thus, the rod body 8 can be integrally formed with the skirt piece 9 by the use of the same hard rubber. Of course, it is also possible to use different soft materials of the rod body 8 to impart softness to the skirts 9, 9.
此左右一對之裙片9,9係傾斜形成為越接近前端(下端)、越從桿本體8向外擴張，且其前端部9a較桿本體8a之前端抵接部8a更突出於下方。又，為了使裙片9,9之彈性變形更為容易，於裙片9,9之外側面設有沿桿本體8之長度方向之槽9b。The pair of right and left skirts 9, 9 are inclined so as to be closer to the front end (lower end), and are more outwardly expanded from the lever body 8, and the front end portion 9a protrudes downward from the front end abutting portion 8a of the lever main body 8a. Further, in order to make the elastic deformation of the skirts 9, 9 easier, the grooves 9b along the longitudinal direction of the rod body 8 are provided on the outer sides of the skirts 9, 9.
進一步的，於本實施例中，如圖2所示，左右裙片9,9係形成為沿著桿本體8之長度方向隔著間隔、例如分割為四個。此等被分割為四個之裙片9’係形成為與連結板部9d連結成一體。Further, in the present embodiment, as shown in FIG. 2, the left and right skirts 9, 9 are formed so as to be divided into four at intervals along the longitudinal direction of the lever body 8, for example. These skirt pieces 9' divided into four are formed integrally with the connecting plate portion 9d.
又，如圖1所示，安裝有用以檢測脆性材料基板W之位置的攝影機12、與顯示攝影機14拍攝之影像的監視器13。以攝影機12拍攝設在裝載台1上之脆性材料基板W之角隅部表面之位置特定用對準標記，據以檢測脆性材料基板W之位置。若對準標記是位於基準設定位置的話，即開始折斷作業。但若對準標記相對基準設定位置有偏差的話，則檢測該偏差量，一邊觀察監視器之影像、一邊以手作業、或使脆性材料基板W在裝載台1上移動以修正該偏差。Further, as shown in FIG. 1, a camera 12 for detecting the position of the brittle material substrate W and a monitor 13 for displaying an image captured by the camera 14 are mounted. The positional specific alignment mark on the surface of the corner portion of the brittle material substrate W provided on the loading table 1 is photographed by the camera 12, whereby the position of the brittle material substrate W is detected. If the alignment mark is at the reference setting position, the breaking operation starts. However, if the alignment mark is deviated from the reference setting position, the amount of deviation is detected, and while the image of the monitor is observed, the hand is operated or the brittle material substrate W is moved on the loading table 1 to correct the deviation.
接著，說明此折斷裝置之動作。Next, the operation of the breaking device will be described.
在脆性材料基板W已於前段之劃線步驟中形成劃線(切槽)S，如圖1所示，以此劃線S與折斷桿B之長度方向一致之方式將基板W透過緩衝片14裝載於裝載台1。此時，係將脆性材料基板W之形成有劃線S之面(表面側)朝向緩衝片14側，使相反側之面(背面側)成為上面。A scribe line (grooving) S is formed in the scribing step of the brittle material substrate W in the preceding stage. As shown in FIG. 1, the substrate W is transmitted through the buffer sheet 14 so that the scribe line S coincides with the longitudinal direction of the breaking rod B. Loaded on the loading platform 1. At this time, the surface (surface side) on which the scribe line S is formed on the brittle material substrate W faces the buffer sheet 14 side, and the surface (back surface side) on the opposite side becomes the upper surface.
其次，如圖3(a)所示，移動裝載台1將其配置在脆性材料基板W待分斷之劃線S緊挨在折斷桿B之前端抵接部8a之正下方。Next, as shown in FIG. 3(a), the moving loading table 1 is disposed on the brittle material substrate W, and the scribe line S to be broken is immediately below the front end abutting portion 8a of the breaking lever B.
接著，如圖3(b)所示降下折斷桿B，首先左右裙片9,9之前端部9a,9a於劃線S上方接觸其左右兩側部分。當折斷桿B進一步降下時，裙片9,9即往箭頭方向彈性變形，此彈性變形之力量作用於使脆性材料基板W從劃線S分離之方向。Next, as shown in Fig. 3 (b), the breaking lever B is lowered, and first, the front end portions 9a, 9a of the left and right skirts 9, 9 are in contact with the left and right side portions above the scribe line S. When the breaking lever B is further lowered, the skirts 9, 9 are elastically deformed in the direction of the arrow, and the force of the elastic deformation acts on the direction in which the brittle material substrate W is separated from the scribe line S.
在此狀態下進一步使折斷桿B降下時，桿本體8之前端抵接部8a即按壓脆性材料基板W，使脆性材料基板W贊緩衝片14上彎曲成V字形。如此，劃線S(裂痕)即往深度方向滲透，如圖3(c)所示，從劃線S將脆性材料基板W折斷。When the breaking lever B is further lowered in this state, the front end abutting portion 8a of the lever main body 8 presses the brittle material substrate W, and the brittle material substrate W is bent into a V shape. Thus, the scribe line S (crack) penetrates in the depth direction, and as shown in FIG. 3(c), the brittle material substrate W is broken from the scribe line S.
於此分斷時，脆性材料基板W因裙片9,9之彈性變形而承受從劃線S分離方向之力(增壓)，因此與分斷之同時晶圓WW之左右分斷端面被拉開，不會產生端面彼此接觸等之干涉。如此，即不會產生缺口等之損傷、獲得端面強度優異之分斷面。At the time of the breaking, the brittle material substrate W receives the force (pressurization) from the direction in which the scribing S is separated due to the elastic deformation of the skirts 9, 9, so that the left and right broken end faces of the wafer WW are pulled at the same time as the breaking. It does not interfere with the contact of the end faces with each other. In this way, damage such as a notch is not generated, and a cross-section having excellent end face strength is obtained.
又，將桿本體8對脆性材料基板W之按壓力設定為與使用習知折斷桿之按壓力相同程度，即能實現與現行同等之折斷處理。Further, the pressing force of the rod main body 8 to the brittle material substrate W is set to be the same as the pressing force of the conventional breaking rod, that is, the breaking processing equivalent to the current one can be realized.
因裙片9,9之彈性變形產生之往左右之分離拉力，係由裙片9,9之材料及厚度、形狀所決定。因此，若係高硬度之硬質橡膠等之情形時，如上實施例等所示，較佳是於裙片9,9之外側面設置沿桿本體8長度方向之槽9b、或再加上將裙片9,9形成為沿桿本體8之長度方向隔著間隔分割為複數個，以更易於彈性變形。The separation force from the left and right sides due to the elastic deformation of the skirts 9, 9 is determined by the material, thickness and shape of the skirts 9, 9. Therefore, in the case of a hard rubber or the like having a high hardness, as shown in the above embodiment and the like, it is preferable to provide a groove 9b along the longitudinal direction of the rod body 8 on the outer side of the skirts 9, 9 or a skirt. The sheets 9, 9 are formed to be divided into a plurality of intervals along the longitudinal direction of the rod main body 8 so as to be more easily elastically deformed.
又，裙片9對桿本體8之安裝方法只要是配置成能產生往左右分離方向之力即可，因此所分割之複數裙片不僅可安裝成沿長度方向左右並列，亦可沿長度方向左右交錯的安裝。Moreover, the method of attaching the skirt 9 to the lever body 8 is only required to be arranged to generate a force in the direction of separation from the left and right. Therefore, the divided plurality of skirts can be installed not only in the longitudinal direction but also in the longitudinal direction. Interlaced installation.
此外，視裙片9,9之材料，如圖4所示，可將上述左右裙片9,9沿桿本體8之長度方向連續長長的形成，或亦可省略上述槽9b。Further, as shown in Fig. 4, the left and right skirts 9, 9 may be formed continuously along the longitudinal direction of the rod body 8, or the grooves 9b may be omitted.
上述實施例中，雖顯示了個別作成上述左右裙片9,9將其安裝於桿本體8之例，但亦可如圖5所示，將左右裙片9,9透過連結部9c加以連帶形成為一體。In the above embodiment, although the left and right skirts 9 and 9 are separately attached to the lever body 8, the left and right skirts 9, 9 may be formed by the connecting portion 9c as shown in Fig. 5. As one.
以上，雖針對本發明之代表性實施例作了說明，但本發明並不限定於上述實施例之構成。例如，亦可作成將裙片9,9以能裝拆之方式安裝於折斷桿B之桿本體8，視脆性材料基板W之種類換裝彈力不同之裙片、或不需要裙片時則從桿本體8卸下。除此之外，本發明可在達成其目的且不脫離申請專利範圍之範圍內，適當的進行各種修正、變更。Although the representative embodiments of the present invention have been described above, the present invention is not limited to the configurations of the above embodiments. For example, it is also possible to attach the skirts 9, 9 to the rod body 8 of the breaking rod B in a detachable manner, depending on the type of the brittle material substrate W, or to replace the skirt with different elastic force, or when the skirt is not required The lever body 8 is removed. In addition, the present invention can be variously modified and changed as appropriate within the scope of the invention without departing from the scope of the invention.
產業上之可利用性Industrial availability
本發明可適用於沿著劃線分斷玻璃基板、半導體基板、薄膜太陽電池等脆性材料之折斷裝置。The present invention is applicable to a breaking device for breaking a brittle material such as a glass substrate, a semiconductor substrate, or a thin film solar cell along a scribe line.
1、20、22‧‧‧裝載台1, 20, 22‧‧‧ loading station
1a‧‧‧空氣吸附孔1a‧‧‧Air adsorption hole
5‧‧‧支承柱5‧‧‧Support column
6‧‧‧橫架6‧‧‧ transverse frame
7‧‧‧橋部7‧‧ ‧Bridge
8‧‧‧桿本體8‧‧‧ rod body
8a‧‧‧桿本體之前端抵接部8a‧‧‧ Front end abutment of the rod body
9、9’‧‧‧裙片9, 9'‧‧‧ skirt
9a‧‧‧裙片前端9a‧‧‧ skirt front end
9b‧‧‧裙片之槽9b‧‧‧Slots of skirts
9c‧‧‧連結部9c‧‧‧Connecting Department
9d‧‧‧連結板部9d‧‧‧Link Board
10‧‧‧軸10‧‧‧Axis
11‧‧‧汽缸11‧‧‧ cylinder
12‧‧‧攝影機12‧‧‧ camera
13‧‧‧監視器13‧‧‧Monitor
21‧‧‧刀輪21‧‧‧Cutter wheel
23‧‧‧緩衝片23‧‧‧buffer
A‧‧‧折斷裝置A‧‧‧Fracture device
B、24‧‧‧折斷桿B, 24‧‧‧ broken rod
S‧‧‧劃線S‧‧‧
W‧‧‧脆性材料基板W‧‧‧Battery material substrate
圖1係顯示本發明之折斷裝置之一例的立體圖。Fig. 1 is a perspective view showing an example of a breaking device of the present invention.
圖2係顯示於折斷裝置之一折斷桿例的立體圖。Fig. 2 is a perspective view showing an example of a breaking lever of one of the breaking devices.
圖3係用以說明折斷桿之動作的剖面圖。Fig. 3 is a cross-sectional view for explaining the action of the breaking lever.
圖4係顯示於折斷桿之裙片之其他實施例的立體圖。Figure 4 is a perspective view of another embodiment of the skirt shown in the break bar.
圖5係顯示於折斷桿之裙片之再一實施例的立體圖。Figure 5 is a perspective view of still another embodiment of the skirt of the break bar.
圖6係顯示習知一般折斷方法的圖。Figure 6 is a diagram showing a conventional general breaking method.
B．．．折斷桿B. . . Broken rod
8．．．桿本體8. . . Rod body
9．．．裙片9. . . Skirt
9a．．．裙片前端9a. . . Skirt front end
10．．．軸10. . . axis
Claims (4)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2011084778A JP5210409B2 (en) | 2011-04-06 | 2011-04-06 | Break device |
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| TW201242918A TW201242918A (en) | 2012-11-01 |
| TWI472495B true TWI472495B (en) | 2015-02-11 |
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| TW100145926A TWI472495B (en) | 2011-04-06 | 2011-12-13 | Breaking device |
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| JP (1) | JP5210409B2 (en) |
| KR (1) | KR101323675B1 (en) |
| CN (1) | CN102729346B (en) |
| TW (1) | TWI472495B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI690401B (en) * | 2015-06-02 | 2020-04-11 | 日商三星鑽石工業股份有限公司 | Breaking device, breaking system and breaking unit |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5831119B2 (en) * | 2011-10-17 | 2015-12-09 | 日本電気硝子株式会社 | Glass substrate cleaving apparatus, glass substrate cleaving method, and glass substrate manufacturing method |
| TWI491572B (en) * | 2013-09-06 | 2015-07-11 | Taiwan Mitsuboshi Diamond Ind Co Ltd | Breaking apparatus and method for glass substrate |
| JP6243699B2 (en) * | 2013-10-25 | 2017-12-06 | 三星ダイヤモンド工業株式会社 | Fragment material substrate cutting device |
| JP6289949B2 (en) * | 2014-03-18 | 2018-03-07 | 三星ダイヤモンド工業株式会社 | Break device |
| JP6290010B2 (en) * | 2014-06-09 | 2018-03-07 | 株式会社ディスコ | Wafer dividing method |
| JP2016184650A (en) * | 2015-03-26 | 2016-10-20 | 三星ダイヤモンド工業株式会社 | Break device |
| JP6569330B2 (en) * | 2015-06-29 | 2019-09-04 | 三星ダイヤモンド工業株式会社 | Break device |
| JP6665020B2 (en) * | 2016-05-10 | 2020-03-13 | 株式会社ディスコ | Split tools and how to use them |
| JP2019038238A (en) | 2017-08-29 | 2019-03-14 | 三星ダイヤモンド工業株式会社 | Break device |
| JP2019038237A (en) | 2017-08-29 | 2019-03-14 | 三星ダイヤモンド工業株式会社 | Break device |
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| JP4768114B2 (en) * | 2000-11-24 | 2011-09-07 | Ｎｅｃ液晶テクノロジー株式会社 | Liquid crystal display panel cutting apparatus and liquid crystal display panel cutting method |
| JP2006245263A (en) * | 2005-03-03 | 2006-09-14 | Sony Corp | Substrate break apparatus and method, and semiconductor device |
| EP1886782A1 (en) * | 2005-05-30 | 2008-02-13 | Mitsuboshi Diamond Industrial Co., Ltd. | Device and method for cutting off substrate of fragile material |
| JP5376282B2 (en) * | 2008-03-25 | 2013-12-25 | 日本電気硝子株式会社 | Glass plate folding method and glass plate folding device |
| JP5193141B2 (en) * | 2009-07-21 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | Break unit and break method |
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- 2011-04-06 JP JP2011084778A patent/JP5210409B2/en active Active
- 2011-12-13 TW TW100145926A patent/TWI472495B/en not_active IP Right Cessation
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| CN1496799A (en) * | 2002-10-11 | 2004-05-19 | 三星钻石工业股份有限公司 | Cutting method of prittle material base plate, its devive and processing device |
| JP2011025410A (en) * | 2009-07-21 | 2011-02-10 | Mitsuboshi Diamond Industrial Co Ltd | Break bar and breaking method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI690401B (en) * | 2015-06-02 | 2020-04-11 | 日商三星鑽石工業股份有限公司 | Breaking device, breaking system and breaking unit |
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| Publication number | Publication date |
|---|---|
| KR101323675B1 (en) | 2013-10-30 |
| KR20120114150A (en) | 2012-10-16 |
| JP2012218247A (en) | 2012-11-12 |
| CN102729346B (en) | 2015-01-28 |
| JP5210409B2 (en) | 2013-06-12 |
| TW201242918A (en) | 2012-11-01 |
| CN102729346A (en) | 2012-10-17 |
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