TW201515799A - Splitting method and splitting device for brittle material substrate - Google Patents

Abstract

The present invention provides a splitting method and a splitting device for substrates, which allow for efficiently splitting a brittle material substrate having a resin or metal front surface layer without using a splitting bar having a sharp cutting tip. The present invention provides a splitting method for splitting a substrate W. The substrate W comprises a substrate body 1 having an upper surface on which a front surface layer 2 is laminated. The substrate body 1 has a lower surface in which a plurality of scribing lines S is formed. The splitting method comprises: a substrate body splitting step, in which a splitting bar 7 is pressed down on a top surface of the front surface layer 2 in a direction toward the scribing lines S so as to have the substrate W deflected downward to split only the substrate body 1 along the scribing lines S; and a front surface layer breaking step, in which a pressing member 8 is pressed from the substrate body 1 side towards the scribing lines to break the front surface layer 2.

Description

Breaking method of brittle material substrate and breaking device

The present invention relates to a substrate in which a resin layer such as a ruthenium resin (an oxime) is formed on one surface of a substrate main body including a brittle material such as glass or ceramic, and the substrate is cut along a scribe line (grooving) formed on the substrate main body. The breaking method and the breaking device.

Previously, it has been known to form a plurality of scribe lines in advance using a cutting wheel (also referred to as a scribing wheel) or a dicing saw or the like on a brittle material substrate, and then apply an external force to deflect the substrate to scribe the substrate along the scribe line. By dividing, a unit product such as a wafer (for example, Patent Document 1, Patent Document 2, etc.) is manufactured.

When the bending moment is applied to the brittle material substrate along the scribe line to break the substrate, in order to effectively generate the bending moment, the breaking is often performed by the three-point bending method shown in the above-mentioned patent document or the like.

8 is a view for explaining the breaking of a brittle material substrate such as an aluminum substrate or a LTCC substrate (low temperature co-fired ceramics substrate) in which a resin layer is laminated on one surface of a substrate main body by a three-point bending method. A diagram showing the general breaking steps of a unit product.

The brittle material substrate W (hereinafter simply referred to as "substrate") is attached to the elastic adhesive film 21 supported by the dicing ring 20, which is formed of a circuit pattern ceramic or the like on the surface or inside. A front layer 2 such as a thin tantalum resin is laminated on the front surface of the substrate main body 1. On the lower surface of the substrate main body 1, a plurality of scribe lines S are formed in the previous step.

Aligning one of the lower surfaces of the support substrate W at its left and right positions across the scribe line S The blades 22 and 22 are provided with a breaking lever 23 above the portion of the substrate W with respect to the scribe line S. By pressing the breaking lever 23 against the substrate W as shown in FIG. 8(b), the substrate W is deflected and the substrate W is divided along the scribe line S. At this time, the front end layer 2, which is first pressed by the cutting edge 23 of the tip end (the surface in contact with the substrate), is firstly broken by the cutting edge of the breaking rod 23, and then further The substrate W is deflected to deflect the substrate W from the scribe line S.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-131216

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2011-212963

The breaking lever 23 used in the breaking is to break the front layer 2, and it is necessary to make the sharp edge of the sharp end sharp (for example, the cutting edge angle is 30 degrees). However, the breaking lever 23 not only breaks the front layer 2, but also presses the substrate main body 1 to separate the substrate main body 1 from the scribe line S, so that it is subjected to a large load when the substrate is separated. Therefore, if the blade tip of the breaking lever is an acute angle, it is liable to cause wear or a blade gap to shorten the service life. Further, chips are generated when the front layer 2 is separated, thereby causing deterioration in quality or occurrence of defective products.

Further, as a method of dividing the front layer 2, there is a method of dividing by using laser light.

However, in the case of using laser light, the peripheral portion of the break line may be modified or deformed by the heat of the laser light, and sometimes the heat may penetrate into the substrate main body 1 and the circuit pattern of the substrate main body. Brought adverse effects. In particular, there is a problem in the case of forming a substrate of a front layer by using a resin material which is easily affected by heat.

Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a novel breaking method and a breaking device which can efficiently break a brittle material substrate having a resin or a metal front layer.

In order to achieve the above object, the following technical methods are employed in the present invention. That is, the breaking method of the present invention is a method for separating a brittle material substrate having a front surface layer of a resin or a metal on a surface layer of the substrate body, and a specific surface on the lower surface of the substrate body A plurality of scribe lines are formed between the distances, and the breaking method includes: a substrate main body breaking step, wherein the brittle material substrate is pressed toward the scribe line by pressing the breaking rod from the upper surface of the front layer of the brittle material substrate toward the scribe line Deviating downward so that the crack of the scribe line penetrates in the thickness direction, and only the substrate body is separated along the scribe line; and the front layer rupture step is performed by pressing the pressing member from the substrate main body side of the brittle material substrate The front layer is broken by scribing.

Further, the breaking device of the present invention according to another aspect is a substrate breaking device for breaking a brittle material substrate having a resin or a metal front layer on a surface layer of the substrate body, and The lower surface of the substrate body is formed with a plurality of scribe lines at a specific interval, and the substrate breaking device includes: a platform on which the brittle material substrate is placed; and a breaking step of the substrate main body breaking step and a front layer breaking step a pressing member that is formed to be lifted and lowered with respect to the substrate placed on the platform; and the substrate main body breaking step is configured by the breaking rod to form the cutting edge of the breaking rod at an arc or an obtuse angle When the brittle material substrate is pressed downward from the upper surface of the brittle material substrate, the substrate body is separated along the scribe line, but the blade edge of the breaking rod does not enter the front layer. .

According to the present invention, the resin layer is retained in the substrate main body breaking step, and only the substrate main body is separated along the scribe line, and the resin layer is broken by the tensile stress in the subsequent front layer rupture step, and thus the breaking step is performed. The breaking rod used in the middle does not need to be used to break the sharp edge of the resin layer. Therefore, the tip of the breaking rod can form a cutting edge with a circular arc or an obtuse angle so as not to enter the front layer, thereby prolonging the service life. Moreover, it is possible to prevent the generation of chips in the case where the sharp edge of the breaking rod is broken, thereby suppressing the production of defective products caused by the chips. A high quality unit substrate is produced and obtained.

In the present invention, the cutting member for dividing the substrate main body and the pressing member for the front layer breaking step may be formed by different breaking bars and pressing members, and the pressing members for the front layer breaking step may be arranged in parallel with each other. A plurality of unit pressing members are formed, and the unit pressing members are formed to be simultaneously pressed toward the plurality of lines.

Thereby, by pressing the pressing member once by the front layer breaking step, the front layer can be simultaneously broken into a part of the number of unit pressing members, and the working time can be shortened.

1‧‧‧Substrate body

2‧‧‧ front layer

3‧‧‧ platform

4‧‧‧ horizontal orbit

5‧‧‧ Screw shaft

6‧‧‧Rotary drive department

7, 23‧‧ ‧ broken rod

7a‧‧‧ cutting edge

8‧‧‧Present layer breaking step with pressing parts

9a, 9b‧‧‧ bridge body

10a, 10b‧‧‧ beams (horizontal stack)

11a, 11b‧‧‧ hydraulic cylinder

12, 20‧‧‧ cutting ring

13‧‧‧Cut tape

14‧‧‧buffer

15‧‧‧Present layer breaking step with pressing parts

15a, 15b, 15c‧‧‧ unit press parts

17, 22‧‧‧ support blade

21‧‧‧Adhesive film

A‧‧‧ breaking device

K‧‧‧ crack

L‧‧‧ Pressing position of the pressing part

M‧‧ motor

R‧‧‧ radius of curvature

S‧‧‧

W‧‧‧Substrate

W1‧‧‧Unit products

X, Y‧‧ direction

FIGS. 1(a) and 1(b) are explanatory views showing a breaking process of a substrate to be processed.

Fig. 2 is a schematic perspective view showing an example of a substrate cutting device of the present invention.

Fig. 3 is a perspective view showing a state in which a substrate of a breaking object is attached to a dicing tape.

4(a) and 4(b) are explanatory views showing the step of dividing the substrate main body of the present invention.

5(a) to 5(c) are explanatory views showing a step of rupturing the front layer of the present invention.

6(a) and 6(b) are explanatory views showing another embodiment of Fig. 5.

Fig. 7 is an explanatory view showing another embodiment of the breaking method of the present invention.

8(a) and 8(b) are explanatory views showing a prior art substrate breaking method.

Hereinafter, details of the breaking method and the breaking device of the present invention will be described in detail based on the drawings showing one embodiment. Fig. 1 is a view showing an aluminum substrate W which is an example of a processing object. An electronic circuit pattern (not shown) is formed on the inside or the upper surface of the substrate body 1 of the substrate W, and a front layer 2 of a thinner base resin or the like is formed on the positive surface layer of the substrate W. Further, on the lower surface of the substrate main body 1, a plurality of stripes S in the X-Y direction intersecting each other are formed at a predetermined interval in the scribing step of the previous stage.

The substrate W is separated along all the scribe lines S by the breaking device A of the present invention described below, thereby manufacturing the wafer-shaped unit product W1 shown in Fig. 1(b).

Fig. 2 is a perspective view showing an example of the breaking device A of the present invention.

The breaking device A has a stage 3 on which the substrate W is placed and held. The platform 3 is movable in the Y direction along the horizontal rail 4 and is driven by a screw shaft 5 which is rotated by a motor M. Further, the platform 3 can be rotated in a horizontal plane by the rotary drive unit 6 of the built-in motor.

Further, above the stage 3, the elongated plate-shaped substrate main body breaking step breaking lever 7 and the front layer breaking step pressing member 8 are held at intervals in the Y direction and held on the respective bridge bodies 9a, 9b. .

Each of the bridge bodies 9a and 9b is formed so as to straddle the platform 3, and the board main body breaking step breaking lever 7 and the front layer breaking step pressing member 8 are respectively moved up and down toward the platform 3 by the hydraulic cylinders 11a and 11b. The method is mounted on each of the beams (horizontal stacks) 10a, 10b extending horizontally in the X direction.

The substrate main body breaking step is formed by the blade edge 7a at the lower end of the breaking rod 7 in an arc shape having a radius of curvature of the following degree, that is, in the substrate main body breaking step described below, when the front layer 2 of the substrate W is pressed Never enter the front layer 2. Further, the lower layer of the pressing member 8 for the front layer breaking step may be formed into a gentle curved surface so as not to damage the substrate main body 1 when the substrate W is pressed in the step of breaking the front layer.

When the substrate W is separated, as shown in FIG. 3, the substrate W is attached to the dicing tape 13 having elastic adhesiveness supported by the dicing ring 12 so that the scribe line S is downward. Then, as shown in FIG. 4(a), the dicing tape 13 to which the substrate W is attached is placed on the stage 3 held by the breaking device via a buffer sheet 14 such as rubber. At this time, as shown in the figure, the substrate W is placed such that the surface on which the scribe line S of the substrate W is formed is on the lower side.

Then, as shown in FIG. 4(b), the breaking rod 7 is lowered toward the scribe line S from above the substrate W and pressed against the substrate W, so that the scribe line S is deflected on the buffer sheet 14 so that the scribe line S is The crack penetrates in the thickness direction to break the substrate main body 1 (substrate main body breaking step).

In the substrate main body breaking step, the substrate main body 1 is separated along the scribing line S by press-fitting of the breaking rod 7, but the cutting edge 7a of the breaking rod 7 is formed so as not to enter the front layer The degree of curvature within the radius of 2 is such that the front layer 2 is not broken. Further, as the blade tip shape, the radius of curvature R of the arc of the blade edge 7a is set to 0.025 to 5 mm.

After all the scribe lines S are separated by the above-described substrate main body breaking step, as shown in FIG. 5( a ), the substrate W and the dicing tape 13 are reversed together so that the front layer 2 is on the lower side. The front layer breaking step is pressed against the substrate main body 1 toward the scribe line S by the pressing member 8 above the substrate main body 1, and the substrate W is deflected while being developed downward. As a result, as shown by the arrow in FIG. 5( b ), the front layer 2 is biased so as to be torn by the tensile stress in the left-right direction with the press-in position L of the pressing member 8 as a direction of the arrow. Crack K is generated in 2 . The crack K is further pressed by the pressing member 8, and penetrates in the thickness direction as shown in Fig. 5(c) to break the front layer 2 (front layer breaking step).

Therefore, in the front layer breaking step, the pressing member 8 is required to cause the crack K to be generated, and is sufficiently moved downward to a depth position at which the crack K is further penetrated and broken.

In this manner, the front layer 2 is broken at a portion with respect to all the scribe lines S, and is cut into the unit substrate W1 shown in Fig. 1(b) in a state of being attached to the dicing tape 13.

As described above, according to the present invention, the resin layer 2 is left in the substrate main body breaking step, and only the substrate main body 1 is separated along the scribe line S, and the resin layer is stretched by the tensile stress in the subsequent front layer rupture step. 2 is broken, so the breaking rod 7 used in the breaking step does not need to be used to cut the sharp edge of the resin layer 2. Therefore, the blade edge 7a of the breaking lever 7 can be formed into a circular arc or an obtuse angle to extend the service life. Further, it is possible to eliminate the occurrence of chips in the case where the front layer is cut by the sharp edge of the sharp breaking lever, thereby suppressing the occurrence of defective products due to chips and obtaining a high-quality unit substrate.

In the above embodiment, the step of breaking the substrate main body of the substrate main body 1 and the step of breaking the front layer of the front layer 2 are performed by using the different breaking bars 7 and the pressing members 8, respectively, but the front layer breaking step may be omitted. The pressing portion 8 is used to perform the subsequent front layer breaking step using the breaking lever 7 for the substrate main body breaking step.

(Another embodiment)

Fig. 6 is a view showing an embodiment in which the front layer breaking step is performed by using different breaking members in place of the breaking lever 7 in the above-described substrate main body breaking step.

The front layer breaking step pressing member 15 in this embodiment includes a plurality of, for example, three unit pressing members 15a, 15b, and 15c. The unit pressing members 15a, 15b, and 15c are arranged side by side so as to be parallel to each other, and are attached to the common holding member 16 so as to be simultaneously movable up and down. As shown in FIG. 6(a), the unit pressing members 15a, 15b, and 15c are spaced apart from each other by a plurality of strips formed on the substrate main body 1 and five parallel stitches S in the present embodiment. And configuration.

Thereby, as shown in FIG. 6(b), when the unit pressing members 15a, 15b, and 15c are pressed from the upper side of the substrate main body 1 toward the scribe line S, the respective portions are separated in the previous substrate main body breaking step. The scribe line S is a node, and the substrate main body 1 is jagged with the front layer 2 in a zigzag manner. Thus, as in the case of the above embodiment, the front layer 2 is broken by tensile stress at a portion adjacent to the scribe line S. Therefore, in this embodiment, only the front layer breaking step is pressed once by the pressing member 15, and the front layer 2 can be broken along the five scribe lines S at one time, whereby the working time can be shortened.

Further, in the above-described embodiment, the front layer 2 is separated by the zigzag deflection of the front layer 2 by the single operation of the unit pressing members 15a, 15b, and 15c, but the front layer 2 can be separated by two operations. Ground the front layer 2. In this case, the odd-numbered scribe lines are pressed in the first breaking operation, and the even-numbered scribe lines are pressed in the second breaking operation, whereby the front layer 2 can be reliably separated.

Further, in the above embodiment, the buffer sheet 14 is laid on the lower surface of the substrate W, and the substrate W is deflected by the pressing of the breaking member 7 and the front layer breaking step pressing member 8, but the buffer sheet 14 may be replaced. On the other hand, as shown in FIG. 7, the support blade 17, 17 is supported by one of the substrates W via the scribe line S.

The representative embodiments of the present invention have been described above, but the present invention may not necessarily Only the embodiments of the above are constructed. For example, the above-described dicing tape 13 can also be omitted.

Further, in the present invention, in order to achieve the object, modifications and changes can be appropriately made without departing from the scope of the invention.

[Industrial availability]

The present invention can be preferably used for the division of a substrate including a brittle material such as an aluminum substrate having a thin resin or a metal front layer on the front surface, and an LTCC substrate.

1‧‧‧Substrate body

2‧‧‧ front layer

3‧‧‧ platform

8‧‧‧Present layer breaking step with pressing parts

13‧‧‧Cut tape

14‧‧‧buffer

K‧‧‧ crack

L‧‧‧ Pressing position of the pressing part

S‧‧‧

W‧‧‧Substrate

Claims (4)

A method for breaking a brittle material substrate, which is a method for breaking a brittle material substrate, wherein the brittle material substrate has a front layer of a resin or a metal on a surface layer of the substrate body, and a lower surface of the substrate body Forming a plurality of scribe lines at a specific interval, and the breaking method includes: a substrate main body breaking step of pressing the breaking rod from the upper surface of the front layer of the brittle material substrate toward the scribe line to make the brittle material The substrate is deflected downward so that the crack of the scribe line penetrates in the thickness direction, and only the substrate body is separated along the scribe line; and the front layer rupture step is performed by pressing the member from the substrate main body side of the brittle material substrate The front layer is fractured by pressing the scribing line. The breaking method of the brittle material substrate according to claim 1, wherein the cutting edge of the breaking rod for the substrate main body breaking step is formed by a circular arc or an obtuse angle, and the cutting edge of the breaking rod is pressed when the breaking rod is pressed. Will not enter the above front layer. A breaking device for a brittle material substrate, which is a substrate breaking device for breaking a brittle material substrate, wherein the brittle material substrate has a resin or metal front layer on a surface area of the substrate body, and a lower surface of the substrate body Forming a plurality of scribe lines at a specific distance, and the breaking device includes: a platform on which the brittle material substrate is placed; and a breaking member for the substrate main body breaking step and a pressing member for the front layer breaking step, etc. Forming the lifting and lowering relative to the substrate placed on the platform; and the step of dividing the substrate body by the breaking rod to form the cutting edge of the breaking rod with a circular arc or an obtuse angle so as to be opposite to the front layer When the brittle material substrate is pressed from above and the brittle material substrate is deflected downward, the substrate body is separated along the scribe line, but the blade edge of the breaking rod does not enter the front layer. A breaking device for a brittle material substrate according to claim 3, comprising: a platform on which the substrate for holding the brittle material is placed; and a buffer sheet interposed between the platform and the substrate of the brittle material.