TWI661920B - Breaking method and breaking device for composite substrate - Google Patents

Abstract

The invention provides a cutting method and a cutting device capable of reliably and efficiently cutting a composite substrate in a state without cutting residue.

The present invention is a method for dividing a composite substrate W. The composite substrate W is formed on one side of a substrate body 1 containing a brittle material with an adhesive layer 2 formed thereon, and a resin layer 3 is formed on the surface of the substrate body 1. Scribe line S; and the cutting method of the composite substrate W includes: a first cutting step, which is attached to the adhesive tape 5 by setting the substrate body 1 of the composite substrate W as a lower side, and breaking the breaking rod 8 From the upper surface of the resin layer 3, it is pressed against the scribe line S, and the blade edge of the breaking lever 8 is cut into the resin layer 3 and the adhesive layer 2 while being pressed in, and the substrate body 1 is bent downward and along the scribe line S The substrate body 1 is broken; and a second breaking step is performed in the first breaking step by setting the adhesive tape 5 to the upper side and pressing and rolling the roller 13 over the entire width of the upper surface of the composite substrate W. The breaking line L of the middle warp is bent again to break the remaining portion of the breaking.

Description

Breaking method and breaking device for composite substrate

The present invention relates to a cutting method and a cutting device for a composite substrate in which a resin layer such as a silicone resin is formed on one side of a substrate body containing a brittle material such as glass or ceramic with an adhesive layer interposed therebetween.

It has been known from the past that a plurality of scribe lines are formed in advance on a composite substrate using a cutting wheel (also referred to as a scribing wheel) or a dicing saw, and thereafter, an external force is applied to bend the substrate. A method of taking out a unit product such as a wafer by dividing along a scribe line is disclosed in, for example, Patent Document 1 or Patent Document 2.

FIG. 1 is a diagram for explaining the generality of a composite substrate W on which one surface of a substrate body 1 including a fragile material such as glass or ceramics having a circuit pattern formed on or inside thereof is formed with a resin layer 3 such as a silicone resin through an adhesive layer 2 Diagram of the breaking method.

As shown in FIG. 1 (b), the cutting wheel 4 is pressed against the substrate body 1 of the composite substrate W along a predetermined scribe line and rolled while processing a scribe line S including cracks of a limited depth. Further, as shown in FIG. 1 (c), the composite substrate W is attached to the cutting ring 10 (refer to FIG. 2) and has an elastic tape 5 with the substrate body 1 facing downward, and placed on On platform 6.

A pair of supporting knives 7 and 7 are formed on the platform 6 across the scribe line S and supporting the lower surface of the composite substrate W at its left and right positions.之 刀尖 的 分 断 杆 8。 The cutting edge of the blade 8.

As shown in FIG. 1 (d), the breaking rod 8 is cut into the resin layer 3 and pressed in, First, the resin layer 3 and the adhesive layer 2 are separated, and then the composite substrate W is bent by further pressing, so that the substrate body 1 is also separated from the scribe line S.

In the case where a groove 9 is formed in the resin layer 3 by a cutter or the like as shown in FIG. 1 (f), the adhesive layer 2 is broken by pressing the breaking lever 8 into the groove 9, and at the same time, The composite substrate W is bent, and the substrate body 1 is also cut off from the scribe line S.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-131216

[Patent Document 2] Japanese Patent Laid-Open No. 2011-212963

In order to be able to cut these layers, the breaking lever 8 for breaking the resin layer 3 and the bonding layer 2 needs a sharp blade with a sharpened tip. However, the breaking lever 8 not only breaks the resin layer 3 and the adhesive layer 2, but also presses the substrate body 1 to bend after these breaking, and breaks along the previously processed scribe line S. Therefore, when breaking the substrate, Burden a heavier load. Therefore, if the angle of the tool tip is too small, damage such as knife damage or breakage may occur. Therefore, the limit of the tool tip angle is about 10 degrees.

However, the bonding layer 2 of the composite substrate W has ductility even if the layer itself is thin. Therefore, even if the blade angle of the breaking rod 8 is sharply formed to a limit of 10 degrees, there is still a pressing force by the breaking rod 8 Unable to break. In addition, depending on the case, a part of the resin layer 3 may be cut off and left in some cases other than the case where it is cut by a cutter. If the partial disconnection is generated in this way, it will cause disadvantages in the next step in the streamlining operation and cause anomalies.

Therefore, the present invention seeks to solve the foregoing problems, and an object thereof is to provide a novel cutting method capable of reliably and efficiently cutting a composite substrate in a state where no cutting remains.

In order to achieve the above object, the following technical method is proposed in the present invention. That is, the breaking method of the present invention is a breaking method of a composite substrate. A resin layer such as a silicone resin is formed on one side of a substrate body containing a brittle material through a bonding layer, and the substrate is formed on the substrate. A plurality of scribe lines are formed on the surface of the main body at specific intervals; and the method for cutting the composite substrate includes: a first cutting step, which is performed by setting the substrate body of the composite substrate to a lower side; The composite substrate is affixed to an elastic tape, and the cutting bar with an acute-angled blade point is pressed from the upper surface of the resin layer of the composite substrate toward the above-mentioned scribe line, and the blade side of the cutting bar is cut into the above The resin layer and the adhesive layer are pushed in on one side, and the substrate body is bent downward, and the cracks of the scribe lines are penetrated in the thickness direction to separate the substrate body; and a second breaking step, which is performed by When the above-mentioned tape is set to the upper side, the roller is rolled while pressing against the entire width of the upper surface of the composite substrate, and the breaking line broken in the first breaking step is bent again. The remaining portion having a breaking of breaking.

In the present invention, the tip angle of the breaking lever used in the first breaking step is preferably set to 10 to 50 degrees. In addition, the present invention is suitable for the division of a composite substrate: the substrate body of the composite substrate is glass or ceramic, and the resin layer is a silicone or a laminated material of a solder resist and silicone.

Further, in the present invention, as the breaking device for performing the second breaking step, the following breaking device can be used. The breaking device includes a platform on which the above-mentioned composite substrate is placed, and a gate beam, which The rails are arranged across the platform; the rails are arranged on both sides of the platform, and in a plane including the surface of the platform, when the extension direction of the beam is set to the X direction, it is orthogonal to the X direction. The Y direction extends and restricts the relative movement direction of the beam relative to the platform; a driving mechanism that drives the beam to relatively move along the track relative to the platform; a roller that extends in the X axis direction, And the axis extending in the X-axis direction is A rotation shaft is rotatably held on the beam; an adjusting device for adjusting the position of the roller relative to the beam; and a pressing member for suppressing the roller from floating upward.

According to the present invention, in the second scribing step, by pressing and rolling of the roller, the cutting residual portion of the adhesive layer or the resin layer generated in the first cutting step can be surely cut, and continuous continuous cutting can be avoided. The exception in the next step. In addition, even if the adhesive layer or the resin layer is not completely cut in the first first cutting step, it can be cut again by pressing and rolling of the roller in the second cutting step, so there is no need to make the first cut. The tip of the breaking lever used in the breaking step becomes too sharp, thereby not only ensuring the strength of the breaking lever, but also extending the service life.

Furthermore, in the second breaking step, the roll is rolled while pressing against the entire width of the upper surface of the composite substrate, so that the broken portion of the composite substrate is continuously bent and broken. The advantage of shortening the production time.

1‧‧‧ substrate body

2‧‧‧ Adjacent layer

3‧‧‧ resin layer

4‧‧‧ cutting wheel

5‧‧‧Tape

6‧‧‧ platform

7‧‧‧ support knife

8‧‧‧ Breaking lever

9‧‧‧ slot

10‧‧‧ cutting ring

11‧‧‧platform

12‧‧‧Beam (an example of a door beam)

13‧‧‧roller

14‧‧‧Adjustment screw (an example of an adjustment device)

15‧‧‧Pressing member

16‧‧‧Adjustment screw (an example of an adjustment device)

17‧‧‧ Gasket

18‧‧‧ track

A‧‧‧Second breaking device

L‧‧‧ Disconnection

S‧‧‧ crossed

W‧‧‧ composite substrate

X‧‧‧ direction

Y‧‧‧ direction

θ‧‧‧ opening angle

1 (a) to (f) are explanatory diagrams showing a method for cutting a composite substrate to be cut.

FIG. 2 is a perspective view showing a state where the composite substrate is attached to the dicing tape.

FIG. 3 is a sectional view of FIG. 2.

Fig. 4 is an overall perspective view showing a second breaking device.

Fig. 5 is a partially enlarged sectional view showing a roller pressing member of the second breaking device.

FIG. 6 is a cross-sectional view showing a platform mounting state of the composite substrate in the second breaking step.

FIG. 7 is a partially enlarged sectional view of FIG. 6.

Fig. 8 is a sectional view showing the operation of the second breaking step.

Fig. 9 is a schematic diagram illustrating the relationship between the diameter of a roll and the quality of a section.

10 (a)-(c) are explanatory diagrams of the opening angle θ in the depth direction of the break line caused by the bending of the substrate.

Hereinafter, details of the breaking method and the breaking device of the present invention will be described in detail based on a drawing showing an embodiment.

The composition of the composite substrate W to be the object of the present invention is the same as that of the composite substrate W shown in FIG. 1 (a), and it is formed of a laminated body. The laminated system will have an electronic circuit pattern formed on the upper surface or inside (not shown). The substrate body 1 containing a brittle material such as glass or ceramic and a resin layer 3 such as silicone are laminated with a layer 2 therebetween. There is also a case where the resin layer 3 is a laminated body of silicone and a solder resist. The total thickness of the composite substrate W is about 0.1 to 1.0 mm. In addition, as shown in FIG. 1 (b), a plurality of scribe lines S are formed by a predetermined distance between the cutting wheel 4 and the surface of the substrate body 1 in a prior scoring step.

In the cutting method of the present invention, for the composite substrate W on which the scribe line S is formed on the substrate body 1, first, a cutting step (first step shown in FIG. 1 (c) to (f)) is performed in the same order Breaking step).

That is, as shown in FIG. 1 (c) and FIGS. 2 and 3, the composite substrate W processed with the scribe line S is attached with the substrate body 1 facing downward to an adhesive tape supported by the cutting ring 10 and having elasticity. 5 and placed on the platform 6 of the first breaking device.

On the platform 6 of the first breaking device, a pair of supporting blades 7 and 7 are arranged across the scribe line S to support the lower surface of the composite substrate W at its left and right positions, and the composite substrate W is opposite to the scribe line S Above the part, a separating lever 8 having a blade tip having a blade angle of 10 to 50 degrees, preferably 15 to 25 degrees, for example, an acute angle of 20 degrees is arranged. As shown in FIG. 1 (d), the breaking rod 8 is cut into the resin layer 3 and the adhesive layer 2 while being pushed in, and the substrate body 1 is bent downward, so that the crack of the scribe line S penetrates in the thickness direction, The substrate body 1 is broken. In addition, a cushion sheet (not shown) may be used instead of the pair of support blades 7 and 7.

With this first breaking step, the composite substrate W is broken along the scribe line S, but as described above It is stated that, in the first breaking step, a breaking residue as shown in FIG. 1 (e) may be generated in the adhesive layer 2 or a part of the resin layer 3 as appropriate.

In the present invention, following the first breaking step, a second breaking step described below is performed, and the above-mentioned breaking residual portion is completely broken.

Fig. 4 is a perspective view showing an example of a second breaking device for performing a second breaking step.

The second breaking device A includes a platform 11 on which the composite substrate W supported by the cutting ring 10 is placed, and a gate beam 12 is provided across the platform 11. The beam 12 is provided so as to be movable along left and right rails 18, 18 extending in the Y direction, and is driven by a driving mechanism (not shown).

Furthermore, in the above-mentioned embodiment, the beam 12 is moved by the driving mechanism, but the beam may be fixed on the platform on the contrary, so that the platform moves along the track.

Furthermore, the roller 13 extending horizontally in the X direction is rotatably held by the beam 12. The roller 13 is formed of a hard resin such as iron, aluminum, and acrylic having a diameter of 5 to 20 mm, and is formed to have a length capable of pressing at least the entire width of the composite substrate W to be broken. In this embodiment, an iron material with a diameter of 10 mm is used. In addition, as described below, the diameter of the roller 13 is preferably selected based on the distance between adjacent scribe lines S (that is, the width of the unit substrate) and the thickness of the composite substrate W.

The rollers 13 are held at the left and right ends of the beam 12 via adjustment screws 14, and can be attached to the left and right ends of the beam 12 by adjusting the adjustment screws 14 with respect to the vertical position of the beam 12. Further, as shown in FIG. 5, the roller 13 is suppressed from floating upward by a pressing member 15 that can be adjusted up and down at its intermediate position. In addition, the upper and lower adjustment of the pressing member 15 can be performed by the adjustment screw 16.

After the first breaking step, as shown in FIGS. 6 and 7, the composite substrate W is placed on the second breaking state with the tape 5 of the cutting ring 10 attached with the composite substrate W set to the upper side.装置 A 的 平台 11。 The platform 11 of the device A. At this time, the elastic spacer 17 is laid on the composite substrate in advance. The surface below W. The gasket 17 is preferably a foamed resin such as rubber or sponge.

Then, the roller 13 is rolled while being pressed against the upper surface of the composite substrate W, and as shown in FIG. 8, the breaking line L just cut by the first breaking step is bent again, and then The cutting residue of the layer 2 or the resin layer 3 is completely broken. The relative position or pressing force of the roller 13 with respect to the composite substrate W can be adjusted by the adjustment screw 14 according to the thickness or composition material of the composite substrate W. The unit substrates that have been divided into individual pieces are taken out while being attached to the adhesive tape 5.

As described above, according to the present invention, in the second scoring step, by pressing and rolling of the roller 13, the cutting residual portion of the bonding layer 2 or the resin layer 3 generated in the first cutting step can be surely divided. To prevent the anomaly in the next step in a row. In addition, even if the next layer 2 or the resin layer 3 is not completely cut in the first first cutting step, it can be cut again by pressing and rolling of the roller 13 in the second cutting step, so there is no need to make The cutting edge of the breaking lever 8 used in the first breaking step is sharpened too sharply. Therefore, there is also an advantage that not only the strength of the breaking lever 8 can be ensured, but also the service life can be extended.

(Selection of roller diameter)

In the above-mentioned embodiment, the roller 13 having a diameter of 10 mm is used to divide and form the composite substrate W having the scribe lines S dividing the individual product wafers on the substrate.

However, when the distance between adjacent scribe lines S (that is, the width of a unit substrate) or a plurality of composite substrates W having different substrate thicknesses is cut by the same roller 13, there is a substrate body after the break. (Glass) 1 The composite substrate W in which the breakage occurred. Therefore, the inventors conducted experiments to study the countermeasures to prevent the substrate body 1 from being damaged, and found that the selection of the roll diameter is important.

That is, the following experiment was performed: a breaking device having a diameter of 5 mm to 20 mm was prepared for the roll 13, and the width of the adjacent scribe line S (that is, the size of the product wafer) was 1 mm to 3.5 mm, and the plate thickness was 0.8 mm to 1 mm (Glass substrate 0.5mm, resin layer 0.3mm ~ 0.5mm) Composite substrate W.

For example, if a composite substrate with a width of 1.5 mm, a glass substrate with a thickness of 0.5 mm, and a resin layer with a thickness of 0.45 mm is to be separated, the glass substrate is broken when the roll diameter is 10 mm, but when the roll is 10 mm in diameter, When the diameter is 15 mm, it can be appropriately cut. On the other hand, when the roll diameter was set to 20 mm, the glass substrate was not damaged, but a breakage remained (the resin layer was in a state where it was not separated).

Fig. 10 is a schematic diagram for explaining the relationship between the diameter of a roll and the quality of a section.

The cause of the above-mentioned problems has been studied. As a result, if the roll diameter of the roll 13 is too small (Fig. 10 (a)), the composite substrate W is greatly bent during rolling, and it will become a separator after breaking. The glass substrate bodies 1 collide and break. On the other hand, it can be seen that if the roll diameter is too large (FIG. 10 (c)), the amount of bending of the composite substrate W during rolling may be insufficient, and the resin layer 3 may not be separated. From this, it can be seen that as long as the appropriate roller diameter is set among these (FIG. 10 (b)), the divided glass substrate bodies 1 can be separated from the resin layer 3 without contacting each other. Therefore, appropriate rollers exist. Range of diameters.

Therefore, by selecting the value of the diameter of the roller 13 to be smaller than the diameter of the unbroken broken line after rolling, and larger than the diameter of the breakage caused by the collision of the separators after rolling, high quality and reproducibility can be achieved. Breaks well.

Since the range of the appropriate roll diameter varies depending on the distance between adjacent scribe lines or the thickness of the substrate, it is ideal to perform experiments for each substrate of the processing object in advance to determine the range of roll diameter that can be appropriately processed. In addition, a composite substrate using a product wafer with a size of 1 mm to 3.5 mm and a plate thickness of 0.8 mm to 1 mm (a glass substrate of 0.5 mm and a resin layer of 0.3 mm to 0.5 mm) is used within this range, as long as 12 mm is used. A roller with a roller diameter of ~ 18mm can be cut with good quality.

In addition, the inventors repeated the experiment in order to be able to objectively determine the range of the diameter of the roll that can perform high-quality breaking. In other words, the bending of the substrate when the roller rolls and passes through the scribing line is dynamically photographed, and based on the image, it is measured as shown in FIG. The maximum angle of the opening angle θ in the depth direction of the break line L generated by the substrate W bending.

As a result, it was found that as long as the opening angle θ is set to 5 ° <θ <15 °, high-quality cutting can be performed without causing damage to the substrate or without separation of the resin layer (residual cutting).

The representative embodiments of the present invention have been described above, but the present invention is not necessarily limited to the structure of the above embodiments, and can be appropriately modified within the scope of achieving the purpose of the invention without departing from the scope of patent application. ,change.

[Industrial availability]

The present invention can be preferably used for breaking a composite substrate in which a resin layer such as a silicone resin is formed on one side of a substrate body containing a brittle material such as glass or ceramic with an adhesive layer interposed therebetween.

Claims (11)

A cutting method of a composite substrate is formed by forming a resin layer such as a silicone resin on one side of a substrate body containing a brittle material through an adhesive layer, and forming a plurality of lines on the surface of the substrate body at specific intervals. A method for cutting a composite substrate of a wire, and includes a first breaking step of attaching the composite substrate to an elastic tape with the substrate body of the composite substrate set to a lower side, and Press the cutting bar with an acute-angled blade tip from the upper surface of the resin layer of the composite substrate toward the above-mentioned scribe line, and cut the blade end of the cutting bar into the resin layer and the adhesive layer, and press The substrate body is bent downward to allow the cracks of the scribe line to penetrate in the thickness direction to divide the substrate body; and a second breaking step, in which a roller is compounded with the tape being set on the upper side. The entire width of the upper surface of the substrate is rolled while pressing against the other side, so that the breaking line broken in the first breaking step is bent again, and the remaining portion is broken. For example, the cutting method of the composite substrate according to the item 1, wherein the blade angle of the breaking lever used in the first breaking step is 10 to 50 degrees. According to the breaking method of claim 1 or 2, wherein the substrate body of the composite substrate is glass or ceramic, and the resin layer is a silicone or a laminated material of a solder resist and silicone. If the breaking method of item 1 or 2 is requested, wherein the diameter of the above-mentioned roller to be used in the above-mentioned second breaking step is selected to be smaller than the diameter of the breaking line that causes the resin layer to not separate after rolling, and is larger than the separation due to rolling A range of diameters at which the substrates collide with each other to cause damage to the substrate body. If the breaking method of item 1 or 2 is requested, wherein the diameter of the above-mentioned roller to be used in the above-mentioned second breaking step is selected as the opening angle in the depth direction of the breaking line caused by the bending of the substrate during rolling is greater than 5 degrees and less than 15 degrees. A breaking device is a breaking device for performing the second breaking step of the breaking method as in claim 1, and includes: a platform on which the above-mentioned composite substrate is placed; and a door beam that crosses the above The way of platform is set; the track is set on both sides of the platform, and in the plane including the surface of the platform in the case where the extension direction of the beam is set to the X direction, along the Y that is a right angle to the X direction Direction, and restrict the relative movement direction of the beam relative to the platform; a driving mechanism that drives the beam to relatively move along the track relative to the platform; a roller that extends in the X-axis direction, and An axis extending in the X-axis direction is a rotation axis and is rotatably held on the beam; an adjusting device for adjusting the position of the roller relative to the beam; and a pressing member for inhibiting the roller from being upwardly moved. It rises. A breaking device includes: a platform on which a base plate is placed; a gate beam that is disposed across the platform; and a track that is disposed on both sides of the platform and in a plane including the surface of the platform When the extension direction of the beam is set to the X direction, it extends in the Y direction which is a right angle direction with respect to the X direction, and limits the relative movement direction of the beam with respect to the platform; a driving mechanism that drives the beam to It is relatively moved along the above-mentioned track relative to the platform; the roller extends along the X-axis direction and is freely held on the beam with the axis extending in the X-axis direction as a rotation axis; the adjusting device, which is used for Adjusting the upper and lower positions of the roller relative to the beam; and a pressing member for suppressing the roller from floating upward. The breaking device of claim 6 or 7, wherein the roller is held by adjusting screws functioning as the adjusting device, and the adjusting screws are installed at the left and right ends of the beam, and further, at the center of the beam. The position is provided with a pressing member which can be adjusted up and down, and the pressing member suppresses floating of the roller by pressing the roller. If the breaking device of item 6 or 7 is requested, the diameter of the roller is 12mm ~ 18mm. The breaking device according to claim 6 or 7, wherein the driving mechanism moves the beam along the track. The breaking device according to claim 6 or 7, wherein the driving mechanism moves the platform along the track.