五、發明說明（1) 【發明領域】 本發明係有關於一種陶瓷基板之分斷方法〔a dividing method of ceramic substrate〕，特別係有關 於一種覆晶封裝之矩陣陶瓷基板之分斷方法。 【先前技術】 在半^體封裝領域中’習知運用於承載半導體晶片 二 senucorulu^r chlp〕之電路基板〔circuit b〇ard〕 有以FR4〔 ％乳樹脂玻璃纖維布〕或^樹脂 :Brr]le=Jr:zlne resin，雙順 丁㈣^V. Description of the Invention (1) [Field of the Invention] The present invention relates to a dividing method of ceramic substrate, and particularly relates to a dividing method of a matrix ceramic substrate of a flip chip package. [Previous technology] In the field of half-body packaging, the circuit board [circuit b〇ard] used to carry semiconductor wafers senucorulu ^ r chlp] has FR4 [% latex glass fiber cloth] or ^ resin: Brr ] le = Jr: zlne resin, Shuangshun Ding㈣ ^
Mg〇、M2〇3、Sl02A_ =板或者是由含有 板，如堇青石〔c〇rdieriten=燒形成之陶竟基 較低之介電常數〔dielecf ·〕寺，其中由於陶竟基板具有 晶片〔石夕〕之間具有較小差Γ1; C〇nStant〕以及與半導體 質封裝之場合，陶变基板;;f熱膨脹係數，在要求高品 carrier〕，如覆晶封裝、為較佳之晶片載體〔chip 為了能一次多個生產「1P 一Chip packaM〕等。 之陶瓷基板係多個矩陣排封裝處理〕，封裝半導體晶片 之板材，在封裝製程最後^而一體成形地形成於一大面積 有堅硬易碎之特性，以刀進行分斷，然而陶瓷基板係具 碎，且具有耗損刀具及八^切割會導致陶瓷基板之不當破 關於陶瓷基板之分；$率低士缺點。 法，其中一種為日本公法，目丽已有多種習用之方 「陶瓷基板之分割方法好許公報案特開平1 1 - 1 0 6 3 6號 」’如第及7b圖所示，其將一陶Mg〇, M203, Sl02A_ = plate or a plate containing a plate such as cordierite [c〇rdieriten = sintered ceramic substrate with a lower dielectric constant [dielecf ·] temple, where the ceramic substrate has a wafer [ Shi Xi] has a small difference between Γ1; C〇nStant] and ceramic substrates in the case of semiconductor packaging; f coefficient of thermal expansion, where high-quality carriers are required], such as flip-chip packaging, is a better wafer carrier [ Chip In order to produce "1P-Chip packaM" multiple times at a time, ceramic substrates are packaged in multiple matrix rows], and the plates that encapsulate semiconductor wafers are integrated and formed on a large area at the end of the packaging process. The characteristics of broken are cut with a knife. However, the ceramic substrate is broken, and it has the loss of the cutter and the ^^ cutting will cause the ceramic substrate to be improperly broken. About the ceramic substrate, the low rate is the disadvantage. One of them is Japan. In public law, Mu Li has used a variety of methods "The method of dividing ceramic substrates is good. Xu Gazette No. 1 1-1 0 6 3 6" 'as shown in Figures 7 and 7b, it will be a pottery
五、發明說明（2) 瓷基板61放置於一硬橡膠層62，其中陶瓷基板61具有分離 縫64之表面係朝向該硬橡膠層62 ’並以一硬橡膠體63撞擊 陶竟基板61 ’使其沿分離縫64分斷，但該硬橡膠層62為一 平面使反向施力點不明顯且過於接近正向之硬橡膠體63撞 擊點，導致陶瓷基板61不易斷裂或須施以一較大撞擊力 量’使得陶竟基板61之分斷截面相當不平整，甚至會有破 損’並且若是該陶瓷基板61已結合有半導體晶片或焊球 〔solder bal 1〕則易於傷害該封装钍 另-種陶竞基板之分斷方法係揭;f於日本公開特許公 報案㈣平7-4〇 2 9 6號「陶究基板之分割方法及分割用^ 具」’如第8a及8b圖所示，其係將_具有分離缝74之 基板Π以左夾具72與右夾具73固定夾持陶竟基板71之兩 側，並在陶瓷基板71對應於具有分離缝74表面之另一 上方以一絞鏈樞接左夾具72虚古杰且7<5 奢美被71，相頌“夾具3，以供施力扳斷陶 ί = 頁先左右央持才能分斷’使得效率較差，且 =竞基板7】欲分斷之尺寸不同，則必須製作特定之央 【發明目的及概要】 本發明之主要目的在於提供一 法，利用一膠帶黏貼固定陶瓷美拓> ^基板之分斷方 π，使陶£基板沿分離縫分冑，達到… 曲该膠 瓷基板、+整及清潔地分斷 ：快速分斷陶 功效。 j充丞板夂不知傷陶瓷基板之 本發明之次—目的在 — 、扣供一種覆日日封裝結構之製造 第6頁 五、發明說明（3) 過程’其中複數個覆晶封裝結構係以一陶瓷基板為載體， 利用一膠帶黏貼固定陶瓷基板之具有晶片之一表面，再彎 曲該膠帶’使陶瓷基板沿分離縫分斷，達到一次大量快速 分斷陶瓷基板、平整及清潔地分斷陶瓷基板以及不損傷覆 晶封裝結構之功效。 依本發明之陶瓷基板之分斷方法，其至少包含有： 提供一陶瓷基板，其具有第一表面、第二表面及複數個分 離縫； 以膠帶固定陶瓷基板之第一表面；及 彎曲該膠帶’使陶瓷基板沿複數個分離縫分斷。 【發明詳細說明】 請參閱所附圖式，本發明將列舉以下之實施例說明： 如第1至5圖所示，其係為本發明之第一具體實施例之 陶竟基板之分斷方法，當然本發明之陶瓷基板之分斷方法 亦可運用於覆晶封裝結構之製造過程，如第1圖所示，其 係為一陶曼基板10之第二表面12俯視圖，首先提供一陶瓷 基板10 ’如由MgO ' A1 203、Si02及B203…等陶瓷原料形成 之共k陶究基板〔如堇青石〔c〇rdierite〕〕，習知該陶 資> 基板10係包含有單層或多層之電路圖案〔circui1： pattern〕 ’該陶瓷基板1〇具有第一表面丨〗、第二表面12 及複數個晶片載體13〔chip carrier〕〔如第2圖所 不〕’其中該複數個晶片載體1 3係用以承載晶片2 0而可供 形成一封裝單位〔package uni t〕，在該複數個晶片載體 13之周邊形成有複數個溝槽狀並呈縱向或橫向之分離縫V. Description of the invention (2) The porcelain substrate 61 is placed on a hard rubber layer 62, wherein the surface of the ceramic substrate 61 with the separation slit 64 faces the hard rubber layer 62 'and hits the ceramic substrate 61' with a hard rubber body 63. It is broken along the separation gap 64, but the hard rubber layer 62 is a plane so that the reverse force application point is not obvious and is too close to the impact point of the hard rubber body 63 in the forward direction, which makes the ceramic substrate 61 difficult to break or requires a comparative application. The large impact force 'makes the broken cross section of the ceramic substrate 61 quite uneven and even damaged', and if the ceramic substrate 61 has a semiconductor wafer or solder ball [solder bal 1] combined, it is easy to damage the package. The cutting method of the Tao Jing substrate is disclosed; f in the Japanese Patent Application Publication No. 7-4 0206 96 "the division method and division of the ceramic substrate" as shown in Figures 8a and 8b, It is to fix the substrate with separation gap 74 on both sides of the ceramic substrate 71 with the left fixture 72 and the right fixture 73, and use a hinge on the other side of the ceramic substrate 71 corresponding to the surface with the separation gap 74. Pivot left fixture 72 Xu Gujie and 7 < 5 extravagant beauty 71 Fixture 3 for applying force to break the pottery. = The page must be held by the left and right sides to break off, which makes it inefficient, and = the base plate. 7] If the size of the break is different, a specific center must be made. [Objective and summary of the invention] The main object of the present invention is to provide a method for fixing ceramic metopo by using an adhesive tape, and the ceramic substrate is divided along the separation seam, so that the ceramic ceramic substrate can be rectified and cleaned. Ground breaking: fast break the pottery effect. The second invention of this invention is to charge the ceramic substrate without knowing how to damage the ceramic substrate. The purpose is to deduct the manufacturing of a packaging structure that can be used every day. Page 6 V. Description of the invention (3) Process 'Among them, a plurality of flip-chip packaging structures use a ceramic substrate as a carrier, and use a tape to fix and fix one surface of a ceramic substrate with a wafer, and then bend the tape.' The ceramic substrate is broken along the separation gap to achieve a large number of rapid breaks. The effect of the ceramic substrate, cutting the ceramic substrate flatly and cleanly, and not damaging the flip-chip packaging structure. According to the method for breaking the ceramic substrate of the present invention, it at least includes: providing a ceramic substrate, It has a first surface, a second surface, and a plurality of separation seams; the first surface of the ceramic substrate is fixed with an adhesive tape; and the tape is bent to make the ceramic substrate break along the plurality of separation seams. [Detailed description of the invention] Please refer to the attached drawings The invention will enumerate the following embodiments: As shown in Figures 1 to 5, it is the method of breaking the ceramic substrate of the first embodiment of the present invention, and of course the breaking of the ceramic substrate of the present invention The method can also be applied to the manufacturing process of a flip-chip package structure. As shown in FIG. 1, it is a top view of the second surface 12 of a Taurman substrate 10. First, a ceramic substrate 10 ′ is provided, such as MgO ′ A1 203, Si02. And B203 ... and other ceramic substrates [such as cordierite [c〇rdierite]], known ceramic materials> substrate 10 contains a single layer or multilayer circuit pattern [circui1: pattern] 'this The ceramic substrate 10 has a first surface, a second surface 12 and a plurality of chip carriers 13 [chip carrier] [not shown in FIG. 2]. 'The plurality of chip carriers 1 3 are used to carry wafers 20 and Available to form a letter Unit] [package uni t, a plurality of trenches are formed and shaped as a longitudinal or lateral separation of the plurality of slits at the periphery of the wafer carrier 13
第7頁 五、發明說明（4) 1 4，在本實施例中，如第2圖所示，分離縫1 4係形成於該 陶瓷基板10之第一表面11與第二表面12，並且每一晶片栽 體13在陶瓷基板10之第二表面12形成有複數個連接墊131 〔connecting pad〕，該連接墊131係電性導通於陶兗基 板ίο之第·~~表面丨1之對應連接塾〔圖未續"出〕，用以接植 焊球30〔solder ball〕。 之後’如第2圖所示，對應於該複數個晶片載體丨3在 該陶瓷基板10之第一表面11上覆晶結合〔flip_chip mounting〕有複數個晶片20，以複數個凸塊21〔bump〕， 如金等導電焊料，機械結合並電性連接陶瓷基板1〇之第— 表面11，並較佳地每一晶片20以一底墊材22〔underfiH material〕密封保護該複數個凸塊21。 -接著，如第3圖所示，對應於該複數個晶片載體13在 Z究基板1 G之第二表面！ 2接植有複數個焊球3()，如錯錫合 金等焊料’而得到複數個覆晶封I结構〔fHp_chip ST 每一覆晶封裝結構之晶片載體13係仍未 刀斷而/一體成形地形成於—陶瓷基板1〇。 向提:後膜H4圖所不’在陶究基板1〇之第一表面11方 係具有第一表面41及第二表面 斷之封裝結構，利用附該複數個未分 Α Μη々％ l 第一表面41黏貼固定該陶瓷 二構“膠下圖所示’將該陶曼基板1〇與膠帶4° ii:= 方式利用至少-傳動輪5〇帶動使 ’、 、仏頂壓桿51時，彎曲膠帶40 ’使膠帶40不 五 '發明說明(5)^^ -----—_- _ 側美=膠Γ之黏附力向下拉扯在頂 斷裂，較佳地，縱向地第一 4 f該陶瓷基板10沿分離縫14 離縫1 4，使陶咨其二八久4曲膠帶40 ,分斷縱向之分 膠帶40，分斷俨二為條狀，再橫向地第二次彎曲 刀斷検向之分離縫14，佶:把1n \ 之封裝體，以+ A ^ ^ θ 使陶是基板1 0分斷為個別 斷，因此，使分離縫14平整地完全分 速分斷陶垄ί 陶瓷基板之分斷方法具有一次大量快 究基板之功β \ 刀斷陶是基板及不損傷陶 成之複，依本發明之陶究基板之分斷方法所形 運。覆晶封裝結構係黏附於膠帶，易於儲玫及搬 種方法，5』之陶瓷基板之分斷方法’彎曲膠帶4〇係有多 刀杰a在第二具體實施例中，如第6圖所示，膠帶4〇不 移動而是移動頂壓桿51，膠帶4〇使其呈 陶瓷基板10之分斷。 典狀V致 者為Ϊ本^明之保護範圍當視後附之申請專利範圍所界定 ~阁1壬何熟知此項技藝者，在不脫離本發明之精神和 ;圍内所作之任何變化與料，均屬於本發明之和5. Explanation of the invention on page 7 (4) 1 4. In this embodiment, as shown in FIG. 2, the separation slits 14 are formed on the first surface 11 and the second surface 12 of the ceramic substrate 10, and each A wafer carrier 13 has a plurality of connecting pads 131 (connecting pads) formed on the second surface 12 of the ceramic substrate 10, and the connecting pads 131 are electrically connected to the corresponding connections on the first surface of the ceramic substrate and the first surface.塾 [not shown in the picture], it is used to receive solder ball 30 [solder ball]. Afterwards', as shown in FIG. 2, corresponding to the plurality of wafer carriers 3, there are a plurality of wafers 20 on the first surface 11 of the ceramic substrate 10 [flip_chip mounting], and a plurality of bumps 21 [bump ], Such as conductive solder such as gold, mechanically and electrically connect the first surface 11 of the ceramic substrate 10, and preferably each wafer 20 is sealed with an underfiH material 22 to protect the plurality of bumps 21 . -Next, as shown in FIG. 3, corresponding to the plurality of wafer carriers 13 on the second surface of the Z substrate 1 G! 2 Implanted with a plurality of solder balls 3 (), such as the solder of the wrong tin alloy, etc., to obtain a plurality of flip-chip packages I structure [fHp_chip ST The chip carrier 13 of each flip-chip package structure has not been cut off / integrated. The ground is formed on the ceramic substrate 10. To mention: the rear film H4 does not have a packaging structure with a first surface 41 and a second surface on the first surface 11 of the ceramic substrate 10, using the plurality of undivided ΑΜη々% l One surface 41 adheres and fixes the ceramic dual structure. “The glue is shown in the figure below” when the Taoman substrate 10 and the tape are 4 ° ii: = when at least-the driving wheel 50 is used to drive the lever 51, Bending the adhesive tape 40 'make the adhesive tape 40 five' Description of the invention (5) ^^ ----- -_- _ The side of the adhesive force = the adhesive Γ is pulled down and broken at the top, preferably, longitudinally first 4 f The ceramic substrate 10 is separated from the slit 14 along the separation slit 14 to make Tao Ziqi bend the tape 40, cut the longitudinal tape 40, cut the second tape into a strip shape, and then bend the knife horizontally for a second time. Break the slit 14 in the direction of 検, 佶: The 1n \ package is broken with + A ^ ^ θ to break the ceramic substrate 10 into individual breaks. Therefore, the separation slit 14 is used to break the Tao ridge flatly and completely. ί The ceramic substrate cutting method has a large amount of work to quickly study the substrate at a time. \ The knife-breaking ceramic is a complex of the substrate and the ceramic that does not damage the ceramic. It is shaped according to the cutting method of the ceramic substrate of the present invention. The crystal packaging structure is adhered to the tape, which is easy to store roses and transfer methods. The method of “5” of the ceramic substrate breaking method, “the bending tape 4” is a multi-knife. In the second embodiment, as shown in FIG. 6 The adhesive tape 40 does not move but moves the pressing rod 51, and the adhesive tape 40 makes the ceramic substrate 10 broken. The code V is for the protection scope of the copy ^ Ming, which is defined by the scope of the attached patent ~ Anyone who is familiar with this art will not depart from the spirit and scope of the present invention; any changes and materials made within the scope belong to the sum of the present invention
cl 圖式簡單說明 【圖式說明 第4 圖 第5 圖 第6圖 第7a圖 第7b圖 第8 a圖 第8b圖 【圖號說 10 陶瓷基板 11 第一表面 1 31連接墊 :—陶瓷基板之第二表面俯視圖； :—陶瓷基板結合有複數個晶片之截面示意圖； 一結合有複數個晶片之陶瓷基板接植複數個焊球 之截面示意圖； 明之陶£基板之分斷方法，以一膠帶黏貼 是基板之截面示意圖； =^，明之陶瓷基板之分斷方法，將該黏貼有陶 膠帶行經一不平面軌道之截面示意圖； 動使該j之陶瓷基板之分斷方法，以一頂壓桿作 面示^圖貼有陶瓷基板之膠帶呈不水平彎曲之截 曰本公開姓4 板之分宅i ^ Ϊ公報案特開平11- 1 0636號 曰本公開特;工」之示意圖-； 板之分割方=Α報案特開平Π- 1 0 6 36號 曰本公開特义^不思圖二’· 板之分割方^ Α報'案特開平7-40296號「陶瓷基 曰本公開特許ί::用治具」《示意圖一；及 板之分9太、+ &案特開平7-40296號「陶瓷基 明】 方法及分割用治具」之示意圖二。 陶瓷基 陶瓷基 12 n _ * 珩'—表面 η 分離縫 13 曰曰 片載體cl Schematic description [Schematic description 4th figure 5th figure 6th figure 7a figure 7b figure 8a figure 8b figure [picture number 10 ceramic substrate 11 first surface 1 31 connection pad:-ceramic substrate Top view of the second surface;:-cross-sectional schematic diagram of a ceramic substrate combined with a plurality of wafers; a cross-sectional schematic diagram of a ceramic substrate combined with a plurality of wafers grafted with a plurality of solder balls; the method of breaking the substrate, using a tape Adhesion is a schematic cross-sectional view of the substrate; = ^, the cutting method of the ceramic substrate of Ming, which is a schematic cross-sectional view of the ceramic tape pasted through an uneven track; the cutting method of the ceramic substrate of j is actuated by a pressing rod As shown in the figure ^ The tape with the ceramic substrate attached is not horizontally curved. The name of this publication is 4 panels. The house is divided into two parts. ^ Ϊ Gazette No. 11-1636, which is a schematic diagram of this publication; The division side = Α report case Kaikai Π-1 0 6 36 said the special meaning of this publication ^ do not think of Figure 2 '· the division of the board ^ Announcement case case Kaikai No. 7-40296 "ceramic-based publication license ί :: Using Fixtures "" Schematic Diagram 1; and Board Points 9 Tai, + & am p; Case No. 7-40296 "Ceramics-Based Method" and Schematic Diagram 2 of the Method and Segmentation Fixture. Ceramic substrate Ceramic substrate 12 n _ * 珩 '—surface η separation slit 13
第11頁 圖式簡單說明 20 晶 片 21 凸 塊 22 底墊材 30 焊 球 40 膠 帶 41 第 —-* 表 面 42 第二表面 50 傳 動 輪 51 頂 壓 桿 61 陶 瓷 基 板 62 硬 橡 膠 層 63 硬橡膠體 64 分 離 縫 71 陶 瓷 基 板 72 左 夾 具 73 右夾具 74 分 離 缝 75 鉸 鏈Brief description of drawings on page 11 20 wafers 21 bumps 22 backing material 30 solder ball 40 tape 41 first- * surface 42 second surface 50 driving wheel 51 jacking rod 61 ceramic substrate 62 hard rubber layer 63 hard rubber body 64 Separation slit 71 Ceramic substrate 72 Left clamp 73 Right clamp 74 Separation slit 75 Hinge