JPS6388405U - - Google Patents
Info
- Publication number
- JPS6388405U JPS6388405U JP18391886U JP18391886U JPS6388405U JP S6388405 U JPS6388405 U JP S6388405U JP 18391886 U JP18391886 U JP 18391886U JP 18391886 U JP18391886 U JP 18391886U JP S6388405 U JPS6388405 U JP S6388405U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pellet
- pellets
- passing
- divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は、本考案に係るウエハ分割装置の使用
態様を示す断面図、第２図は、従来の分割装置の
使用態様を示す断面図である。
１１…ウエハ、１２…ペレツト、１４，１６…
テープ、１５…切溝、１８，１９…ローラ。
FIG. 1 is a sectional view showing how a wafer dividing apparatus according to the present invention is used, and FIG. 2 is a sectional view showing how a conventional dividing apparatus is used. 11... Wafer, 12... Pellet, 14, 16...
Tape, 15...kerf, 18, 19...roller.
Claims (1)
にテープを付設し、且つ、ペレツト間表面に切溝
を形成したウエハを通過させることにより、各ペ
レツトを分割するようにしたことを特徴とするウ
エハ分割装置。 Each pellet is divided by passing between a pair of eccentrically fixed rollers a wafer with tape attached to both the front and back sides and a groove formed on the surface between the pellets. Wafer dividing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18391886U JPS6388405U (en) | 1986-11-28 | 1986-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18391886U JPS6388405U (en) | 1986-11-28 | 1986-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6388405U true JPS6388405U (en) | 1988-06-08 |
Family
ID=31131097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18391886U Pending JPS6388405U (en) | 1986-11-28 | 1986-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6388405U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167839A (en) * | 1989-11-28 | 1991-07-19 | Nec Kansai Ltd | Dicing method |
| JP2012038867A (en) * | 2010-08-05 | 2012-02-23 | Disco Abrasive Syst Ltd | Dividing method |
| JP2017041525A (en) * | 2015-08-19 | 2017-02-23 | 株式会社ディスコ | Wafer division method |
| JP2019069611A (en) * | 2014-08-21 | 2019-05-09 | 三星ダイヤモンド工業株式会社 | Break device |
-
1986
- 1986-11-28 JP JP18391886U patent/JPS6388405U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167839A (en) * | 1989-11-28 | 1991-07-19 | Nec Kansai Ltd | Dicing method |
| JP2012038867A (en) * | 2010-08-05 | 2012-02-23 | Disco Abrasive Syst Ltd | Dividing method |
| JP2019069611A (en) * | 2014-08-21 | 2019-05-09 | 三星ダイヤモンド工業株式会社 | Break device |
| JP2017041525A (en) * | 2015-08-19 | 2017-02-23 | 株式会社ディスコ | Wafer division method |
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