JP2013149932A - Substrate fragmentation method and substrate fragmentation device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To deliver a non-defective substrate to the next step, by eliminating defective segmentation of a substrate subjected to fragmentation.SOLUTION: The rear surface of a wafer W held on a frame f by using an adhesive tape DT is pressed by an expansion plate and the adhesive tape DT is stretched in the radial direction thus segmenting the wafer W into chips. Light is irradiated from a light source 80 toward the wafer W while stretching the adhesive tape DT in the radial direction, the transmitted light passing through the gap between the segmented chips is then detected by means of a camera, and presence or absence of a segmentation line is inspected depending on the detection results. When defective segmentation is detected by inspection, operation is repeated from the segmentation step to the inspection step.

Description

  The present invention relates to a substrate fragmentation method for accurately subdividing various substrates such as a semiconductor wafer, a circuit substrate, and an LED (Light Emitting Diode), which are adhered and held on a ring-shaped frame via an adhesive tape, into small pieces (chips), and the present invention The present invention relates to a substrate fragmentation apparatus using the above.

  Taking a semiconductor wafer as an example of the substrate, the following processing is performed. A general semiconductor wafer (hereinafter simply referred to as “wafer”) has a circuit pattern of a large number of elements formed on the surface thereof. Thereafter, a protective tape is applied to the surface for protection. The wafer whose surface is protected is ground or polished from the back surface in a back grinding process to a desired thickness. Before the protective tape is peeled off from the thinned wafer and conveyed to the dicing process, the wafer is bonded and held to a ring-shaped frame via a supporting adhesive tape (dicing tape) in order to reinforce the wafer.

  On the wafer transferred to the dicing process, a plurality of breaking preliminary lines are formed in a lattice shape by diamond needles or diamond blades along a scribe line corresponding to a boundary line between semiconductor chips from the circuit pattern surface.

Then, the wafer is divided into small pieces (chips) along the preliminary breaking line by pressing and rolling the breaking roller onto the wafer (see Patent Document 1).
JP-A-8-236484

  After the dicing process, the supporting adhesive tape is stretched in the radial direction of the substrate in the bonding process. That is, the wafer is divided into chips by the extension of the adhesive tape. Only when this is the case, it can be seen that there is a division failure. Therefore, it is necessary to perform the bonding process while avoiding the chip of the defective part, resulting in a disadvantage that the work efficiency is poor.

  Further, in recent years, dicing by substrate grinding using a blade or the like as in the prior art is not preferable because the chip is damaged because of dividing the substrate into small pieces such as LEDs. Moreover, the ratio of the chip share to the abrasion of the substrate due to grinding is low.

  Therefore, stealth dicing has been proposed and implemented in which a laser is focused on the modified region of the substrate and a crack is generated from the inside of the substrate toward the front and back surfaces to preliminarily divide the substrate.

  However, since stealth dicing makes it difficult to visually recognize the pre-divided state from the appearance, it is impossible to detect a division failure until the supporting adhesive tape is stretched in the bonding process to completely divide the substrate. Therefore, there is a problem in that only a substrate that does not cause a division failure cannot be carried into the bonding process. In addition, the dividing failure includes a case where the dividing line is interrupted, a case where the dividing line is not completely formed, a pitch becomes wide, or a pitch failure that becomes narrower than a prescribed dividing line.

  SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances. A substrate fragmentation method capable of eliminating a defective substrate separation and carrying out a non-defective substrate to the next process, and substrate fragmentation using the same. The main purpose is to provide a device.

In order to achieve such an object, the present invention has the following configuration.
That is, the present invention is a substrate fragmentation method for inspecting a substrate subjected to dicing treatment that is adhered and held in a frame via a supporting adhesive tape,
A dividing process in which the adhesive tape is stretched in a radial direction by an expansion member to divide the substrate into small pieces,
An irradiation process of irradiating light from the projector toward the substrate while stretching the adhesive tape in the radial direction by the expansion member;
A detection process in which light from the projector is detected by an optical sensor through a substrate;
An inspection process for inspecting the presence or absence of a dividing line of the substrate according to the detection result of the optical sensor;
When a division failure is detected in the inspection process, the process from the division process to the inspection process is repeated.

  (Operation / Effect) According to this method, by extending the adhesive tape in the radial direction with the expansion member, the gap of the dividing line of the substrate that has been previously diced is expanded and divided into small pieces. The light irradiated toward the substrate in a state where the adhesive tape is stretched changes in intensity between the gap and the fragmented portion. That is, it is possible to determine the presence or absence of a division failure of the substrate according to a change in light intensity. If a division failure is found in the inspection result, by repeating the inspection process from the division process again, it is possible to accommodate a plurality of substrates holding the substrates without the division failure in the frame and transport them to the next bonding step. Therefore, it is possible to devote only to the mounting process of the small piece without inspecting for a division defect in the bonding process.

  In the detection process and the inspection process, for example, the dividing line is detected and determined as follows.

  First, the transmitted light transmitted through the dividing line of the substrate is detected by an optical sensor, and the dividing line is determined based on the presence or absence of the transmitted light. That is, it is possible to determine a portion where light is not transmitted as a division failure.

  Second, the reflected light from the substrate surface is detected by an optical sensor, and the presence or absence of a dividing line is determined according to the intensity of the reflected light detected by the optical sensor. That is, since the light irradiated to the dividing line is transmitted or irregularly reflected, the intensity of the reflected light is weaker than that of the back surface that has been fragmented. Therefore, the divided portion and the undivided portion can be discriminated based on the intensity change of the reflected light. Further, since the division of the substrate is divided in a lattice shape, a portion where the lattice-shaped separation line is interrupted or a portion where the lattice interval is changed can be specified as a separation failure. For example, it is possible to specify the division failure by pattern matching using the reference image and the measurement image.

  Third, the temperature of the substrate heated by infrared rays irradiated toward the substrate is detected by an optical sensor, and the presence / absence of a dividing line is determined based on a change in the temperature distribution of the substrate. In other words, in the case of a semiconductor wafer, heat is likely to accumulate because the transmission of infrared rays is hindered by metal deposition or the like. Since infrared rays pass through the dividing line, heat is unlikely to accumulate. Therefore, a temperature difference occurs between the small piece portion and the dividing line, and the presence or absence of the dividing line can be determined by the temperature change. Moreover, since the dividing line has a lattice shape, it is possible to specify a part where the parting line is interrupted or a part where the lattice spacing is changed as a parting defect.

  In the first to third methods, a permeable plate or an elastic sheet can be used as the expansion member. That is, the light that has passed through the gap between the dividing lines is further transmitted through the expansion member and emitted to the back surface side. Therefore, the difference in the detection intensity of light between the reflection portion and the transmission portion becomes large, and it becomes easy to specify the divided portion and the unseparated portion. Here, the elastic sheet may be attached to a projector that can be raised and lowered. That is, the projector is lowered and the substrate is pressed through the elastic sheet.

  In the second method, it is preferable to use a roller smaller than the width of the substrate as the expansion member. That is, light is emitted from the light projector so as to follow the position of the roller that moves while pressing the substrate in the cutting process, and the reflected light that moves as the roller moves is detected. In other words, the substrate can be divided and inspected simultaneously in the dividing process. Therefore, the processing efficiency can be improved as compared with the case where the inspection is performed after the dividing process.

  The present invention has the following configuration in order to achieve such an object.

That is, a substrate fragmentation device for fragmenting a substrate adhered and held in a frame via a supporting adhesive tape,
A first holding mechanism for holding the frame;
A cutting mechanism comprising a first expansion member that stretches the adhesive tape in the radial direction of the substrate and divides the substrate;
A second holding mechanism for holding a frame holding the substrate after the division;
An expansion mechanism including a second expansion member that stretches the adhesive tape in the radial direction of the substrate; and a projector that irradiates light toward the substrate in a state where the adhesive tape is stretched in the radial direction by the second expansion member;
An optical sensor for detecting light from the projector through a substrate;
An inspection unit for inspecting the presence or absence of a dividing line of the substrate according to a detection result of the optical sensor;
When the inspection unit detects a division failure, a control unit that repeats the division process and inspection,
It is provided with.

  (Operation / Effect) According to this configuration, after the adhesive tape is stretched by the first expansion member to divide the substrate, it is possible to inspect the dividing line in the dividing line in a state where the adhesive tape is stretched by the second expansion member. . That is, the dividing process and the inspection can be performed in separate processes. Therefore, the first to third methods can be suitably implemented.

  Furthermore, in order to achieve such an object, the present invention has the following configuration.

That is, a substrate fragmentation device for fragmenting a substrate adhered and held in a frame via a supporting adhesive tape,
A first holding mechanism for holding the frame;
A roller smaller than the width of the substrate that presses and rolls the substrate while stretching the adhesive tape in the radial direction of the substrate;
A projector that emits light toward the substrate from the side opposite to the rolling surface of the roller;
An optical sensor for detecting reflected light from the substrate surface;
An inspection unit for inspecting the presence or absence of a dividing line of the substrate according to a detection result of the optical sensor;
While irradiating light from a projector to follow the position of a roller that moves while pressing the substrate, the reflected light that moves with the movement of the roller is detected by an optical sensor,
When the inspection unit detects a division failure, the control unit repeats the inspection by pressing and rolling the roller again to the part of the division failure, and
It is provided with.

  (Operation / Effect) According to this configuration, the inspection can be performed simultaneously while the substrate is divided by the roller.

  According to the substrate fragmentation method and the substrate fragmentation apparatus using the same according to the present invention, it is possible to accurately detect the separation failure after the dicing process and to perform the separation by repeating the separation process and the inspection of the undivided portion. A substrate having no defect can be carried out to the next process.

It is a top view which shows the whole structure of an Example apparatus. It is a front view of a frame supply part. It is a top view of a 1st conveyance mechanism. It is a front view of a 1st conveyance mechanism. It is a front view of a mount unit. It is a top view of a 3rd conveyance mechanism. It is a front view of a 3rd conveyance mechanism. It is a front view of a peeling unit. It is a front view of a 4th conveyance mechanism, a 5th conveyance mechanism, and an ultraviolet irradiation unit. It is a top view of a parting unit. It is a front view of a dividing unit. It is a top view of an inspection unit. It is a front view of an inspection unit. It is a side view of an inspection unit. It is a flowchart which shows the flow of a process of an Example apparatus. It is a figure explaining operation | movement of a mount unit. It is a figure explaining operation | movement of a mount unit. It is a figure explaining operation | movement of a mount unit. It is a figure explaining operation | movement of a mount unit. It is a figure explaining operation | movement of a parting unit. It is a figure explaining operation | movement of a test | inspection unit. It is a figure explaining operation | movement of a test | inspection unit. It is a figure which shows the state which detects transmitted light. It is a figure which shows the measurement image by which the quality determination was carried out. It is a figure which shows the measurement image by which the inferior goods determination was carried out. It is a front view which shows the modification of an inspection unit. It is a front view which shows the modification of an inspection unit. It is a front view which shows the modification of an inspection unit. It is a front view which shows the modification of an inspection unit. It is a front view which shows the modification of an inspection unit. It is a figure explaining operation | movement of a test | inspection unit. It is a figure explaining operation | movement of a test | inspection unit.

  Embodiments of the present invention will be described below with reference to the drawings. The apparatus according to the present embodiment will be described by taking as an example the case where the substrate fragmentation apparatus of the present invention is included in a mounting apparatus for a semiconductor wafer (hereinafter simply referred to as “wafer”). Further, the substrate handled in the embodiment apparatus will be described by taking as an example a wafer in which cracks are generated from the modified region to both sides by a laser and lattice-shaped dicing lines are formed. Therefore, a scribe line by conventional grinding is not formed on the surface. A protective tape is attached to the wafer surface in order to provide protection and rigidity of the circuit surface. As the protective tape, an ultraviolet curable adhesive tape is used, but a non-ultraviolet curable pressure sensitive adhesive tape may be used.

  FIG. 1 shows a plan view of the overall configuration of the mounting apparatus.

  The mounting apparatus 1 includes a frame supply unit 2, a first transport mechanism 3, a mount unit 4, a second transport mechanism 5, a third transport mechanism 6, a peeling unit 7, a fourth transport mechanism 8, and ultraviolet irradiation in the order of transport of processing steps. A unit 9, a fifth transport mechanism 10, a cutting unit 11, a sixth transport mechanism 12, an inspection unit 13, a seventh transport mechanism 14, and a frame collection unit 15 are provided.

  In the frame supply unit 2, a ring-shaped frame f is provided with a storage unit 16 as shown in FIG. The storage unit 16 includes a vertical rail 17 connected and fixed to the apparatus frame, and a lifting platform 19 that is screwed up and down by a motor 18 along the vertical rail 17. Therefore, the frame supply unit 2 is configured to place the frame f on the lifting platform 19 and move it up and down by pitch feed. The frame collection unit 15 has the same configuration as the frame supply unit 2.

  As shown in FIGS. 3 and 4, the first transport mechanism 3 includes a movable table 21 that moves horizontally along the guide rail 20 and an arm that moves up and down along a vertical rail 22 that is erected and fixed to the movable table 21. 23 and an adsorbing portion 24 and an aligner 25 mounted on the distal end side of the arm 23.

  The suction part 24 includes a plurality of suction pads 27 urged downward via elastic bodies on the lower surface of the divided plate 26. That is, the suction pad 27 sucks and holds the surface of the frame f. The suction pad 27 is arranged so that the frames f of different sizes can be sucked and held.

  The aligner 25 includes an engagement pin 29 erected downward on the lower surface of the plate 28 that is slidably adjustable in the radial direction of the frame f. The engagement pin 29 engages with an alignment mark that is a notch for positioning the frame f.

  As shown in FIG. 5, the mount unit 4 includes a holding table 30, a tape supply unit 31, a pasting unit 32, a separator collection unit 33, a peeling unit 34, a tape cutting mechanism 35, a tape collection unit 36, and the like.

  The holding table 30 includes an annular frame holding portion 37 that holds the frame f, and a vertically movable wafer holding portion 38 that holds the wafer W.

  The tape supply unit 31 is loaded with a roll-adhesive wide adhesive tape (dicing tape) DT, and feeds out the adhesive tape DT.

  The affixing unit 32 includes a nip roller 41 that holds the adhesive tape DT with the separator S attached to a movable frame 40 that is movable along the guide rail 39, a peeling member 42 that folds the separator S off and peels it from the adhesive tape DT, A lift roller 43 that grips the adhesive tape DT in cooperation with the member 42, a sticking roller 44 that presses the adhesive tape fed from the tip of the peeling member 42, and affixes the frame f and the wafer W, and a nip roller 45 that grips the separator S. It has.

  The peeling unit 34 is configured to wind up and collect unnecessary adhesive tape DT after cutting while moving along the same guide rail 39 as the sticking unit 32.

  The tape cutting mechanism 35 includes a cutter unit 46 via a support arm 47 that extends in a radial direction at a lower end of an arm that is cantilevered from a movable base that can be moved up and down along a vertical frame. The cutter unit 46 is mounted with a round cutter blade 48 whose blade edge is directed downward so that it can rotate freely. Further, the other support arm 47 is provided with a roller that presses the cutting portion following the turning of the cutter blade 48. The cutter unit 46 can rotate around the coaxial axis with the holding table 30. The cutter unit 46 can adjust the turning radius via the support arm 47.

  The second transport mechanism 5 has a configuration in which the aligner 25 is omitted from the first transport mechanism 3. The second transport mechanism 5 moves horizontally along the guide rail 49 and moves up and down along the vertical rail.

  The third transport mechanism 6 includes a reversing unit 51 that horizontally moves along the guide rail 50. As shown in FIGS. 6 and 7, the reversing unit 51 is rotated around a horizontal support shaft r by a rotary actuator 55 on a lifting platform 54 that can be moved up and down along a vertical rail 53 that is erected and fixed to a movable platform 52. A possible receiving frame 56 is mounted in a cantilever manner, and chuck claws 57 are provided at the base portion and the distal end portion of the receiving frame 56 so as to be rotatable around the support shaft s.

  As shown in FIG. 8, the peeling unit 7 includes a movable frame 58 that is laid on the upper part of the apparatus frame and moves horizontally along the guide rail, and a peeling table 59 that holds the mount frame MF. Further, the movable frame 58 is guided to the knife-edge peeling member 62 via the guide roller 61 from the tape supply unit 60 and the tape supply unit 60 in which the release tape t narrower than the diameter of the wafer W is wound. And a take-up shaft 63 for winding the peeled adhesive tape DT. The peeling table 59 is set to have a smaller diameter than the outer shape of the frame f.

  As shown in FIGS. 1 and 9, the fourth transport mechanism 8 includes a reversing unit 65 that horizontally moves along the guide rail 64. The reversing unit 65 has a lifting frame 68 that can be moved up and down along a vertical rail 67 that is erected and fixed to a movable table 66, and a receiving frame 70 that can be rotated around a horizontal support shaft r by a rotary actuator 69 in a cantilever shape. It is installed. A suction part 71 having a plurality of suction pads urged downward by an elastic body is attached to the tip of the receiving frame 70.

  The ultraviolet irradiation unit 9 is configured such that a cold filter or the like is appropriately disposed between the light source 72 and the light source 72 and the wafer W in a container in which an opening into which the mount frame f can be inserted is formed on the side surface. As the light source 72, a plurality of ultraviolet lamps, ultraviolet LEDs, and the like are used so that the back surface of the mount frame M is uniformly irradiated with ultraviolet rays.

  The fifth transport mechanism 10 has a configuration in which the aligner 25 is omitted from the first transport mechanism 3. The fifth transport mechanism 10 moves horizontally along the guide rail 73 and moves up and down along the vertical rail. The fifth transport mechanism 10 includes a reversing unit 65 having the same configuration as that of the fourth transport mechanism 8.

  Below the fifth transport mechanism 10, a lifting platform 111 for receiving a mount frame MF whose circuit surface faces downward is provided. The elevator 111 includes a pair of rails 112 that hold the left and right sides of the frame f.

  A transport mechanism 121 is provided that grips one end of the mount frame MF on the lift platform 111 at a set position below the lift platform 111 and transports it between the rails 112 and into the ultraviolet irradiation unit 9. The transport mechanism 121 includes a fixed receiving piece and a chuck piece 124 that is opened and closed by a cylinder on an upper part of a movable base 123 that moves horizontally along the guide rail 122.

  As shown in FIGS. 10 and 11, the cutting unit 11 includes a holding table 74 and an expansion roller 75. The holding table 74 includes a frame holding unit 76 that holds the frame f and a wafer holding unit 77 for holding a wafer whose surface is covered with an elastic body such as sponge. In addition, a clamp 108 that holds both ends of the frame f is provided. The dividing unit 11 corresponds to a dividing mechanism of the present invention, and the expansion roller 75 corresponds to a first expansion member.

  The expansion roller 75 is set to be shorter than the diameter of the wafer W. The expansion roller 75 moves back and forth along the ball shaft 115 connected to the rotation shaft of the motor M by forward / reverse driving of the motor M. In addition, the movable base 116 provided with the expansion roller 75 has a slide engagement portion 120 connected to a belt 119 wound around a drive pulley 117 and an idle pulley 118. Therefore, the movable base is moved horizontally by the forward / reverse rotation of the belt 119.

  That is, the expansion roller 75 can be moved up and down, and moves horizontally at a predetermined pitch every time pressing and rolling from one end of the wafer W to the other end of the wafer W is completed. In other words, the expansion roller 75 is configured to press and roll by dividing the back surface of the wafer.

  As shown in FIGS. 12 to 14, the inspection unit 13 includes a holding table 78, an expansion unit 79, a light source 80, and a camera 81. The inspection unit 13 corresponds to an inspection unit of the present invention, the expansion unit 79 corresponds to an expansion mechanism, the light source 80 corresponds to a projector, and the camera 81 corresponds to an optical sensor.

  The holding table 78 has a gate shape. That is, it is composed of an annular stage 82 that holds the frame f by suction and a pair of movable frames 83 that support both ends of the stage 82. The movable frame 83 is horizontally moved from the receiving position of the mount frame MF to the inspection position along the pair of guide rails 84 by the driving mechanism.

  The extension unit 79 includes a holding plate 85 cut out in the shape of the wafer W, a transparent extension plate 86 in an opening portion of the holding plate 85, and a pulse motor 87 that raises and lowers the holding plate 85. The expansion plate 86 is made of a transparent material such as a resin such as polycarbonate or glass. The expansion plate 86 corresponds to the second expansion member of the present invention.

  The light source 80 and the camera 81 are disposed to face each other with the expansion plate 86 interposed therebetween. Further, the light source 80 and the camera 81 are arranged at the front ends of second movable bases 89a and 89b that are provided in the first movable base 88 that can move left and right, and that are front and rear, left and right while maintaining a state of facing each other. It is configured to be movable.

  The first movable base 88 moves to the left and right along guide rails laid on a horizontal frame 90 provided on the apparatus base. That is, as shown in FIG. 14, a drive pulley 93 that is driven forward and backward by a motor 92 arranged on one end side of the guide rail is pivotally supported, and an idle pulley 94 is pivotally supported on the other end side. . A slide engagement portion 96 of the first movable base 88 is connected to a belt 95 wound around the drive pulley 93 and the idle pulley 94. Therefore, the first movable base 88 is moved left and right by the forward and reverse rotation of the belt 95.

  As shown in FIG. 13, the second movable bases 89a and 89b are guide rails 98a and 98b laid on the upper surfaces of a pair of support arms 97a and 97b supported in a cantilevered manner at the top and bottom of the first movable base 88, respectively. Each moves back and forth along 98b. That is, the drive pulleys 101a and 101b are pivotally supported by the drive shaft 100 that is connected to the motor 99 provided on the base end side of the guide rail 98a and penetrates the both support arms 97a and 97b provided vertically, and the both support arms 97a. , 97b, the idle pulleys 102a, 102b are pivotally supported. The slide engagement portions 104a and 104b of the support arms 97a and 97b are connected to belts 103a and 103b wound around the sets of the drive pulleys 101a and 101b and the idle pulleys 102a and 102b, respectively. Therefore, the second movable bases 89a and 89b are moved back and forth by forward and reverse rotation of the belts 103a and 103b.

  The light source 80 is preferably a light source having excellent directivity in order to reliably transmit light through a minute dicing line. For example, a red LED having a predetermined wavelength is used.

  As shown in FIG. 1, the seventh transport mechanism 14 includes a pair of holding arms 105 that are close to each other in the width direction of the peeling table 59, and is configured by a movable table that moves back and forth along the guide rail 106.

  Next, a one-round operation from the creation of the mount frame MF to the recovery of the mount frame MF through the inspection process using the above-described embodiment apparatus will be described with reference to the flowchart shown in FIG. 15 and FIGS. 16 to 25.

  The wafer W with the UV-irradiated protective tape P attached to the front surface is transferred to the mount unit 4 with the entire back surface being sucked and held by a transfer arm having a suction plate at the tip, with the circuit surface facing downward. And placed on the holding table 30. The wafer W is sucked and held by the holding table 30.

  The first transport mechanism 3 aligns the frame f with the aligner 25, sucks and holds the frame f, and transports it to the mount unit 4. The frame f is placed and held on the holding table 30.

  As shown in FIGS. 16 and 17, the adhesive tape DT is fed out while a predetermined tension is applied from the tape supply unit 31 as the sticking unit 32 moves, and the separator S is peeled off by the peeling member 42. In synchronism with this, the separator S is wound up and collected by the separator collecting unit 33.

  When the peeling member 42 reaches the tape application position on one end side of the frame f, the application roller 44 is lowered, and the adhesive tape DT extends over the frame f and the wafer W while rolling to the other end while pressing the adhesive tape DT. Paste.

  When the sticking unit 32 reaches the end, the nip rollers 41 and 45 and the elevating roller 43 grip the adhesive tape DT and the separator S, respectively. Thereafter, as shown in FIG. 18, the cutter unit 46 at the upper standby position is lowered to the cutting position, and the adhesive tape DT is cut along the frame shape.

  After the cutting of the adhesive tape DT is completed, the cutter unit 46 returns to the upper standby position, and then the gripping of the adhesive tape DT by the nip rollers 41 and 45 is released, and the peeling unit 34 is operated. As shown in FIG. 19, the peeling unit 34 winds and collects unnecessary adhesive tape cut out while moving (step S1).

  The created mount frame MF is sucked on the back surface by the second transport mechanism 5 and transported to the delivery position of the third transport mechanism 6. The mount frame MF is temporarily placed on a holding table (not shown). The third transport mechanism 6 sucks and holds the mount frame MF, reverses the mount frame MF upside down by the reversing unit 51, and transports it to the peeling unit 7.

  The mount frame MF is placed on the peeling table 59 with the circuit surface facing upward by the third transport mechanism 6.

  The mount frame MF on the peeling table 59 attracts and holds the frame f from the circuit surface side by the fourth transport mechanism 8, and the circuit surface is inverted again downward by the reversing unit 65. In this state, it moves to below the fifth transport mechanism 10. The fifth transport mechanism 10 sucks and holds the frame f from the back surface side of the wafer W and receives the mount frame MF from the fourth transport mechanism 8.

  The fifth transport mechanism 10 transports the mount frame MF to the cutting unit 11. The fifth transport mechanism 10 that has reached the dividing unit 11 places the mount frame MF on the holding table 74 with the circuit surface facing downward. When the frame f is clamped on the holding table 74 by the clamp 108, the wafer W is divided into chips while repeating the reciprocating rolling of the expansion roller 75 with a predetermined pressing force as shown in FIG. 20 (step S2).

  In addition, since the hard protective tape P is affixed on the wafer W of this embodiment in order to provide surface protection and rigidity, stretching of the adhesive tape DT is suppressed. That is, the gap between the chips becomes narrower than when the adhesive tape DT is stretched and the distance between the chips is expanded in a state where the protective tape P is not attached as in the bonding process. That is, in the stretching of the adhesive tape DT by the bonding process, the tape base material is destroyed or deformed, but in the expansion process, the adhesive tape DT is stretched with a pressure that does not reach the composition deformation of the adhesive tape DT. . Therefore, it is not necessary to restore the composition deformation of the stretched adhesive tape DT before carrying out the mount frame MF created from the apparatus. In other words, the stretched pressure-sensitive adhesive tape DT is kept in a uniform tension state.

  When the dividing process to the wafer W is completed, the expansion roller 75 is retracted from the path of the sixth transport mechanism 12. Thereafter, the mount frame MF is transported to the inspection unit 13 while the back surface is sucked and held by the sixth transport mechanism 12.

  The sixth transport mechanism 12 places the mount frame MF with the circuit surface facing downward on the holding table 78 waiting at the position for delivery. The holding table 78 moves to the inspection position while holding the mount frame MF by suction.

  When the holding table 78 reaches the inspection position, as shown in FIGS. 21 and 22, the extension plate 86 is lowered with the lowering of the holding table 78 and presses the back surface of the wafer W. As shown in FIG. 23, the wafer W is divided into chips as shown in FIG. 23, which is stretched to such an extent that the pressure does not reach the compositional deformation of the adhesive tape DT and the protective tape P due to the pressing. Light passes through the line. In this embodiment, the gap between the chips due to pressing is set to 0.5 mm. In this state, the rear image is taken while the light source 80 and the camera 81 are fed forward, backward, left and right by a predetermined pitch (step S3). Note that this step corresponds to the detection process of the present invention.

  In this embodiment, as shown in FIG. 24, the wafer W is divided into 21 measurement blocks, and imaging is performed for each measurement block. The size of the measurement block is appropriately changed depending on the field of view of the camera 81 and the detected intensity of transmitted light.

  The captured image signal is transmitted to the control unit 110. Based on the image signal of each measurement block, the control unit 110 performs a binarization process, for example, and creates a wafer shape measurement image including a dividing line (step S4).

  Thereafter, a pattern matching process is performed between the reference image of the non-defective product on which the grid-like dividing line appears and the measurement image (step S5). The following two discrimination processes are performed by the pattern matching process. That is, “street inspection” for determining whether or not the dividing line is interrupted and “pitch inspection” for determining whether or not the wafer W is divided into chips of a predetermined size (width) according to the dividing line are performed. In the pattern matching processing, an image of a non-defective wafer W is a measurement image in which lattice-shaped transmitted light in which dividing lines are formed at equal intervals without any interruption is detected as shown in FIG. An image of the inspection result is displayed on a monitor provided inside or outside the apparatus.

  The mount frame MF that has been determined to be non-defective is transported to the peeling unit 7 in a reverse path opposite to the transport path.

  For example, when a break of the dividing line is detected by the street inspection, as shown on the left side of FIG. 25, the start position and the end position of the break of the dividing line are each indicated by a plus mark “+”. At the same time, “X direction: NG” is displayed on the screen. By the pitch inspection, for example, the pitch of the dividing line is obtained in units of pixels, and it is inspected whether the dividing line is divided according to a predetermined pitch by comparison with a predetermined reference value. If a pitch error has occurred as a result of the inspection, as shown on the right side of FIG. 25, each pitch is a measurement image that is not equal. At the same time, “Y direction: NG” is displayed on the screen. Thereafter, it is also determined whether or not the number of detections (count value) of the division failure has reached a specified number (step S6). If the count value is within the specified number, the cloak frame MF in which the division failure is detected is returned to the division unit 11 in the reverse route to the conveyance route, and the division process is performed again.

  The re-divided mount frame MF is transported again to the inspection unit 13 and re-inspected. When a division failure is detected, re-inspection and division processing are performed a predetermined number of times.

  If no division failure is detected within the specified number of times, the product is returned to the peeling unit 7 as a non-defective product. When the detection of the division failure exceeds the specified number, a notification sound is emitted and the mount frame MF is determined as a defective product (step S7). At this time, information such as the position where the defect has occurred, the lot number, and the process number is recorded in a storage device such as a memory. The defective mount frame MF may be recovered at that time, or may be recovered without the protective tape P being peeled off, or may be peeled off and recovered together with the non-defective product.

  The mount frame MF returned to the peeling unit 7 is placed on the peeling table 59 with the circuit surface facing upward. When the mount frame MF is sucked and held on the peeling table 59, the peeling tape 62 is attached from one end of the wafer W to the other end by the peeling member 62, and the peeling member 62 is folded by the peeling member 62 in synchronization with the sticking speed. The protective tape P is integrated and peeled from the surface of the wafer W by winding the release tape t to be converted (step S8).

  When the peeling process of the protective tape P is completed, the mount frame MF on the peeling table 59 holds the frame f by suction from the circuit surface side by the fourth transport mechanism 8, and the circuit surface is again reversed downward by the reversing unit 65. The In this state, it moves to below the fifth transport mechanism 10. The fifth transport mechanism 10 sucks and holds the frame f from the back surface side of the wafer W and receives the mount frame MF from the fourth transport mechanism 8. At the same time, the fourth transport mechanism 8 that has released the suction retracts to the peeling unit 7 side.

  The fifth transport mechanism 10 places the mount frame f on the lifting platform 111 that has been raised and stopped at a predetermined position.

  The elevator 111 is lowered to a predetermined position and stopped. Next, the transport mechanism 121 moves to grip one end of the mount frame MF on the lifting platform 111 and moves as it is to transport the mount frame MF into the ultraviolet irradiation unit.

  The mount frame MF conveyed to the ultraviolet irradiation unit 9 is irradiated with ultraviolet rays from the back side while being held by the conveyance mechanism 121. The pressure-sensitive adhesive of the pressure-sensitive adhesive tape DT is cured by the ultraviolet irradiation treatment, and the adhesive force is reduced or reduced (step S9).

  When the ultraviolet irradiation process is completed, the transport mechanism 121 moves backward to place the mount frame MF on the lifting platform.

  The elevator 111 is raised to the delivery position of the fifth transport mechanism 10. When the fifth transport mechanism 10 sucks and holds the mount frame MF with the circuit surface facing downward, the lifting platform 111 is lowered. Thereafter, the fourth transport mechanism 8 moves below the fifth transport mechanism 10, attracts the frame f on the circuit surface side, and receives the mount frame MF from the fifth transport mechanism 10. The fourth transport mechanism 8 transports the mount frame MF to the peeling table 59 and places it on the peeling table 59 with the circuit surface facing upward.

  The mount frame MF that has been subjected to the ultraviolet irradiation process is lifted and held by the holding arms 105 of the seventh transfer mechanism 14 at both ends of the frame f that protrudes from the peeling table 59, and is transferred to the frame collection unit 15. The mount frame MF is stored in the cassette of the frame collection unit 15 (step S10).

  At this time, it is determined whether or not the stored number has reached a predetermined number (step S11). If the predetermined number has not been reached as a result of the determination, the processed mount frame MF is continuously stored in the cassette currently in use. If the predetermined number has been reached, the cassette is carried out of the apparatus (step S12).

  This completes one round of operation, and thereafter the same operation is repeated.

  According to the above-described embodiment apparatus, it is possible to detect a division failure during the dicing process in the same process in which the mount frame MF is created. If a split failure is detected, the split process and inspection are repeated a specified number of times so that the split failure is resolved. The regeneration of the split failure and the defective product are accurately separated, and only the non-defective product is the next process such as the bonding process. Can be carried out to

  In addition, since the separation process is performed with the protective tape P attached to the surface of the wafer W, the adhesive tape DT is not destroyed or deformed as in the bonding process. Therefore, the mount frame MF in which the chip is held on the frame f can be carried out to the next process through the adhesive tape DT to which an appropriate tension is applied without performing the composition restoration of the adhesive tape DT.

  The present invention can be implemented in forms other than those described above, some of which are listed below.

  (1) In the inspection unit 13 of the above embodiment, the division failure is detected using the transmitted light. However, the division failure may be detected based on the intensity change of the reflected light.

  For example, as shown in FIG. 26, a light source 80, a camera 81, and a beam splitter 112 are arranged on a movable base 111 that can move back and forth and right and left on the apparatus base. That is, light is emitted from the light source 80 perpendicularly to the upper wafer surface and totally reflected vertically by the wafer surface to return the reflected light to the same optical path as the irradiated light. The optical path of the reflected light is changed in a right angle direction by the beam splitter 112, and the reflected light is detected by the camera 81.

  Alternatively, as shown in FIG. 27, the light may be irradiated from the oblique direction toward the back surface of the wafer from the movable table 111, and reflected light from the back surface may be detected by the camera 81.

  Note that the configuration in which light is irradiated perpendicularly to the back surface of the wafer can effectively use the light totally reflected on the back surface of the wafer. In addition, it is easy to set the position at which the reflected light is received by the camera 81.

  (2) In the inspection unit 13 of the above embodiment, the rear surface of the wafer is irradiated with red light. However, the infrared sensor is used to detect the temperature of the wafer W with a thermosensor, and based on the distribution of the temperature change, the separation failure May be determined. For example, since the gap is formed in the part of the dividing line, the temperature appears lower than the chip part. Therefore, the part where the grid-like parting line displayed at a low temperature is interrupted can be determined as a parting defect.

  (3) In the above embodiment, the dividing unit 11 and the inspection unit 13 are provided separately. However, the inspection may be performed while the wafer W is divided by the dividing unit 11.

  For example, as shown in FIGS. 28 and 29, the frame f is sucked and held on the holding table 78 of the inspection unit 13, and at a predetermined pitch every time the rolling of the wafer W from one end to the other end is completed. Move horizontally and press the backside of the wafer while repeating inversion. The light source 80, the beam splitter 111, and the camera 81 are moved in synchronization with the movement of the expansion roller 75, and vertical light is continuously emitted from the light source 80 directly below the expansion roller 75. At this time, the reflected light that is totally reflected from the back surface of the wafer is changed by the beam splitter, and detected by the camera 81.

  The detection signal is transmitted to the control unit 110 in the same manner as in the above embodiment, and the control unit 110 sequentially executes a process for determining a division failure. When a division failure is detected, the expansion roller 75 selects and rolls only the entire wafer surface or the region with the division failure, and performs the division process and inspection again at the same time.

  With this configuration, the processing speed is improved as compared with the above-described embodiment apparatus.

  (4) You may discriminate | determine a division defect from the measurement image acquired by one imaging | photography, and the reference | standard image, putting the whole in the visual field of a camera.

  (5) In the above-described embodiment apparatus, the separation process and the inspection were performed with the protective tape P applied to the circuit surface of the wafer W. However, after the ultraviolet irradiation process, the mount frame MF is returned to the peeling unit 7, The separation process and the inspection may be performed after the protective tape P is peeled off from the wafer W. In this case, as shown in FIG. 11, the protective liner 113 is bridged across the supply roll 111 and the take-up roll 112 that are arranged to face each other with the holding table 74 interposed therebetween. That is, the protective liner 113 may be laid on the surface of the wafer holding unit 77 of the cutting unit 11 and the wafer W with the circuit surface facing downward may be placed thereon.

  (6) In the expansion unit 79 of the above-described embodiment apparatus, a transparent resin or glass is used for the expansion plate 86 in order to detect a division failure of the wafer W, but it is not limited to these hard members. That is, an elastic sheet may be used instead of the hard member. As the elastic sheet, for example, an elastic sheet prepared by filling a transparent bag with silicon gel, or an elastic sheet obtained by curing an ultraviolet curable adhesive sheet can be used. These elastic sheets and the expansion plate 86 of the above-described embodiment apparatus are not limited to being transparent, and may be colored or cloudy as long as the light from the light source is not blocked.

  Therefore, an elastic sheet having the same shape as the expansion plate 86 used in the above-described embodiment apparatus can be created, and the elastic sheet can be mounted on the above-described embodiment apparatus and used instead of the expansion plate 86.

  The size of the elastic sheet need not be larger than the size of the wafer W and may be smaller than the wafer W. For example, as illustrated in FIG. 30, the elastic sheet 86 </ b> A may be mounted on the front surface of the illumination device 80 </ b> A having a size smaller than the wafer W.

  In the case of this configuration, the lighting device 80A is configured to be movable up and down and back and forth and to the left and right. Therefore, as shown in FIG. 31, while the illuminating device 80A is reciprocated back and forth and shifted in the lateral direction, the illuminating device 80A is lowered to a predetermined height to repeatedly press the wafer W in units of blocks (vertical 3). X 3 × 9 blocks), the entire surface of the wafer W is inspected.

  Since the elastic sheet 86A can be elastically deformed to absorb a certain level difference, even if it protrudes to the ring frame f, the wafer W can be pressed to re-divide the part where the division is poor.

  If the entire surface of the wafer W is within the field of view of the camera 81, the camera 81 may be fixedly arranged.

  If the field of view of the camera 81 does not fit on the entire surface of the wafer W, as shown in FIG. 32, the camera 81 may be moved in synchronization with the movement of the illumination device 80A.

DESCRIPTION OF SYMBOLS 3 ... 1st conveyance mechanism 4 ... Mount unit 5 ... 2nd conveyance mechanism 6 ... 3rd conveyance mechanism 7 ... Peeling unit 8 ... 4th conveyance mechanism 9 ... Ultraviolet irradiation unit 10 ... 5th conveyance mechanism 11 ... Dividing unit 12 ... 1st 6 transport mechanism 13 ... inspection unit 78 ... holding table 79 ... expansion unit 80 ... light source 81 ... camera 110 ... control unit
f ... Frame DT ... Adhesive tape MF ... Mount frame W ... Semiconductor wafer

Claims (17)

A substrate fragmentation method for inspecting a substrate bonded and held in a frame via a supporting adhesive tape,
A dividing process in which the adhesive tape is stretched in a radial direction by an expansion member to divide the substrate into small pieces,
An irradiation process of irradiating light from the projector toward the substrate while stretching the adhesive tape in the radial direction by the expansion member;
A detection process in which light from the projector is detected by an optical sensor through a substrate;
An inspection process for inspecting the presence or absence of a dividing line of the substrate according to the detection result of the optical sensor;
A substrate fragmentation method comprising repeating the steps from the dividing process to the inspecting process when a dividing defect is detected in the inspecting process. The substrate fragmentation method according to claim 1,
In the detection process, the optical sensor detects transmitted light that has passed through the dividing line of the substrate,
In the inspection step, the presence or absence of a dividing line is determined based on the presence or absence of transmitted light. The substrate fragmentation method according to claim 1,
In the detection process, reflected light from the substrate surface is detected by an optical sensor,
In the inspection process, the presence or absence of a dividing line is determined according to the intensity of reflected light detected by an optical sensor. The substrate fragmentation method according to claim 1,
The irradiation process irradiates infrared rays from the projector toward the substrate,
In the detection process, the temperature of the substrate heated by infrared rays is detected by an optical sensor,
In the inspection process, the presence or absence of a dividing line is determined based on a change in temperature distribution of the substrate. The substrate fragmentation method according to any one of claims 1 to 4,
The expansion member is a permeable plate,
In the irradiation process, the plate is pressed against the substrate to stretch the adhesive tape. The substrate fragmentation method according to any one of claims 1 to 4,
The expansion member is an elastic sheet having permeability,
In the irradiation process, the elastic sheet is pressed against the substrate to stretch the adhesive tape. The substrate fragmentation method according to claim 6,
A substrate fragmentation method comprising: mounting the elastic sheet on a projector, and lowering the projector to press the substrate through the elastic sheet and stretch the adhesive tape. The substrate fragmentation method according to claim 3,
The expansion member is a roller smaller than the width of the substrate,
The irradiation process irradiates light from a projector by following the position of a roller that moves while pressing the substrate,
In the detection process, the reflected light that moves as the roller moves is detected. A substrate fragmentation device for fragmenting a substrate bonded and held in a frame via a supporting adhesive tape,
A first holding mechanism for holding the frame;
A cutting mechanism comprising a first expansion member that stretches the adhesive tape in the radial direction of the substrate and divides the substrate;
A second holding mechanism for holding a frame holding the substrate after the division;
An expansion mechanism including a second expansion member that stretches the adhesive tape in the radial direction of the substrate; and a projector that irradiates light toward the substrate in a state where the adhesive tape is stretched in the radial direction by the second expansion member;
An optical sensor for detecting light from the projector through a substrate;
An inspection unit for inspecting the presence or absence of a dividing line of the substrate according to a detection result of the optical sensor;
When the inspection unit detects a division failure, a control unit that repeats the division process and inspection,
A substrate fragmentation device comprising: The substrate fragmentation device according to claim 9, wherein
The first expansion member is a plate that presses the substrate. The substrate fragmentation device according to claim 9, wherein
The first expansion member includes a holding table covered with an elastic material that holds the substrate surface;
It is composed of a roller smaller than the width of the substrate that presses the surface opposite to the substrate holding surface,
The said control part presses and rolls the said roller again only to the part which the division defect generate | occur | produced. The board | substrate fragmentation apparatus characterized by the above-mentioned. The substrate fragmentation device according to any one of claims 9 to 11,
The second expansion member is a permeable plate,
A projector and an optical sensor are arranged opposite to each other with the substrate and the second expansion member interposed therebetween,
A substrate fragmentation device characterized in that light passing through a cutting line of the substrate is detected by an optical sensor. The substrate fragmentation device according to any one of claims 9 to 11,
The second expansion member is an elastic sheet having permeability,
A projector and an optical sensor are arranged opposite to each other with the substrate and the second expansion member interposed therebetween,
A substrate fragmentation device characterized in that light passing through a cutting line of the substrate is detected by an optical sensor. The substrate fragmentation device according to claim 13,
The substrate shredding device characterized in that the elastic sheet is attached to the light projector so as to be movable up and down. The substrate fragmentation device according to any one of claims 9 to 11,
The optical sensor detects reflected light from the substrate surface,
A substrate fragmentation device, wherein the inspection unit is configured to determine a dividing line according to the intensity of reflected light detected by an optical sensor. The substrate fragmentation device according to any one of claims 9 to 11,
The projector irradiates infrared rays toward the substrate,
The optical sensor detects the temperature of the substrate heated by infrared rays,
A substrate fragmentation apparatus, wherein the inspection unit is configured to determine the presence or absence of a dividing line based on a change in temperature distribution of the substrate. A substrate fragmentation device for fragmenting a substrate bonded and held in a frame via a supporting adhesive tape,
A first holding mechanism for holding the frame;
A roller smaller than the width of the substrate that presses and rolls the substrate while stretching the adhesive tape in the radial direction of the substrate;
A projector that emits light toward the substrate from the side opposite to the rolling surface of the roller;
An optical sensor for detecting reflected light from the substrate surface;
An inspection unit for inspecting the presence or absence of a dividing line of the substrate according to a detection result of the optical sensor;
While irradiating light from the projector following the position of the roller that moves while pressing the substrate, the reflected light that moves with the movement of the roller is detected by an optical sensor,
When the inspection unit detects a division failure, the control unit repeats the inspection by pressing and rolling the roller again to the part of the division failure, and
A substrate fragmentation device comprising:

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