TW201334053A - Method for dividing substrate into chips and device thereof - Google Patents

Abstract

This invention is performed by pressing against a back surface of a wafer held by a frame via an adhesive tape by using an extension plate, to stretch the adhesive tape in a radial direction; dividing a wafer W into chips; irradiating the wafer W with light from a light source while the adhesive tape is stretched in the radial direction; detecting optical transmission through gaps between the divided chips by a camera, to detect whether there is a divided line or not in accordance with a detection result. If a failure in the division is detected, another process from dividing to detecting is repeated.

Description

Substrate dicing method and substrate dicing device using the same

The present invention relates to a substrate dicing method for subdividing a plurality of substrates, such as a semiconductor wafer, a circuit board, or an LED (Light Emitting Diode), which are adhered to a ring frame by an adhesive tape, into a small piece (wafer) with high precision A substrate dicing apparatus using this method.

Regarding the substrate, the semiconductor wafer is taken as an example to perform the processing described below. A general semiconductor wafer (hereinafter simply referred to as "wafer") is a circuit pattern in which a plurality of elements are formed on the surface thereof. Then, attach a protective tape to the surface to protect it. In the back grinding step, the wafer whose surface is protected by the protective tape is ground or polished from the back surface to have a desired thickness. Before the protective tape is peeled off from the thinned wafer and transported to the cutting step, in order to reinforce the wafer, the wafer is adhered to the ring frame by the support adhesive tape (cut tape).

The wafer conveyed to the dicing step is formed by a plurality of rip-off preparation lines formed by a diamond needle or a diamond blade from a circuit pattern surface along a scribe line corresponding to a boundary line between the semiconductor wafers.

Then, the wafer is pressed and rolled on the wafer by the rupture roller, and the wafer is divided into small pieces (wafers) along the rupture reserve line (refer to Japanese Laid-Open Patent Publication No. Hei 8-236484).

After the cutting step, the adhesive tape for the support is stretched in the radial direction of the substrate in the die bonding step. That is, the wafer is divided into individual wafers by the elongation of the adhesive tape. At this point, it is known that the segmentation is bad. Therefore, it is necessary to avoid the wafer in which the defective portion is divided to perform the bonding process, and thus the problem of poor work efficiency occurs.

Further, in recent years, in order to facilitate the division of the substrate into small pieces such as LEDs, it has been conventionally possible to use a substrate or the like for cutting a blade, which is not preferable because the wafer is damaged. Further, the percentage of the wafer obtained amount with respect to the abrasion of the substrate due to polishing becomes low.

Therefore, it is proposed to perform a stealth dicing in which the focus of the laser is aligned with the modified region of the substrate, and cracks are generated from the inside of the substrate toward the front and back surfaces, and preliminary splitting is performed.

However, since the invisible cutting is difficult to visually recognize the state in which the division has been performed, it is impossible to detect the division failure until the adhesive tape for support is stretched until the substrate is completely divided in the bonding step. Therefore, there is a problem that it is impossible to carry the substrate which has not been subjected to the division failure into the bonding step. Further, the division failure includes a division line interrupter, or a case where the division line is not completely formed and the pitch width is widened, or a narrower distance than a predetermined division line is obtained.

The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a substrate dicing method capable of eliminating a substrate division defect and carrying out a substrate of a good product to the next step, and a substrate dicing apparatus using the same.

In order to achieve such an object, the present invention adopts the configuration shown below.

That is, the present invention is a substrate singulation method for inspecting a substrate which has been subjected to a division process by being adhered to a frame by an adhesive tape for support, and the method is characterized by comprising: In the dividing step, the adhesive tape is stretched in the radial direction by the expansion member, and the substrate is divided into small pieces. In the irradiation step, the adhesive tape is stretched in the radial direction by the expansion member, and the light is irradiated from the light projector toward the substrate. a detecting step of detecting light from the light projector by an optical sensor via a substrate; and an inspection step of checking whether the substrate has a dividing line according to an inspection result of the optical sensor; detecting the dividing in the checking step In the case of a bad situation, the steps from the dividing step to the checking step are repeated.

According to the method, the adhesive tape is stretched in the radial direction by the expansion member, so that the gap of the dividing line of the substrate which has been subjected to the dicing process is expanded and divided into small pieces. The light that is irradiated toward the substrate in a state where the adhesive tape is stretched changes in strength due to transmission and reflection of light in the gap and the small portion. That is, it is possible to determine whether or not the substrate is defective in division depending on the change in light intensity. When it is found that the division is defective in the inspection result, by repeating the steps from the division step to the inspection step, the plurality of sheets having no division defects remaining on the frame can be accommodated in the container and transported to the next joining step. Therefore, it is not necessary to perform the inspection of the division failure in the joining step, and it is possible to concentrate only on the assembly processing of the small pieces.

Further, in the detecting step and the checking step, for example, the dividing line is detected and discriminated as shown below.

First, the transmitted light transmitted through the dividing line of the substrate is detected by an optical sensor, and the dividing line is discriminated based on the presence or absence of transmitted light. In other words, the portion that does not transmit light can be discriminated as a defective segmentation.

Secondly, the reflected light from the substrate surface is detected by an optical sensor, and the presence or absence of the dividing line is determined in accordance with the intensity of the reflected light detected by the optical sensor. In other words, since the light that is incident on the dividing line is transmitted or scattered, the intensity of the reflected light is weaker than that of the back surface that is irradiated to the small piece. Therefore, the divided portion and the undivided portion can be discriminated based on the intensity change of the reflected light. Further, since the division of the substrate is divided into a lattice shape, the portion where the lattice-shaped division line is interrupted or the portion where the lattice interval is changed can be specified as the division failure. For example, by using the reference image and the measurement image, the pattern alignment can be poorly specified.

Thirdly, the temperature of the substrate heated by the infrared ray irradiated toward the substrate is detected by an optical sensor, and the presence or absence of the dividing line is determined based on the change in the temperature distribution of the substrate. In other words, in the case of a semiconductor wafer, the transmission of infrared rays is hindered by vapor deposition of metal or the like, and heat is easily stored. In the case of the dividing line, since infrared rays pass, it is difficult to store heat. Therefore, a temperature difference occurs between the small piece portion and the dividing line, and the presence or absence of the dividing line can be determined based on the temperature change. Further, since the dividing line is in the form of a grid, the portion where the dividing line is interrupted or the portion where the grid interval is changed can be specified as a division failure.

Further, in the above-described first to third methods, a transmissive plate or an elastic sheet can be used as the expansion member. In other words, the light passing through the gap of the dividing line is further transmitted through the expansion member to the back side. Therefore, the difference in the detection intensity of the light of the reflecting portion and the transmitting portion becomes large, and it is easy to specify the divided portion and the undivided portion. Here, the elastic piece can also be mounted on a liftable light projector. That is, the light projector is lowered, and the substrate is pressed to sandwich the elastic sheet.

Further, in the second method, it is preferable to use a roller having a smaller width than the substrate in the expansion member. In other words, in the dividing step, the light is irradiated from the light projector so as to track the position of the roller on which the substrate is moved while moving, and the reflected light that moves in accordance with the movement of the roller is detected. In other words, the division and inspection of the substrate can be performed simultaneously in the dividing step. Therefore, it is possible to improve the processing efficiency more than the examiner after the splitting process.

Moreover, in order to achieve such an object, the present invention adopts the configuration shown below.

That is, a substrate dicing apparatus for dicing a substrate held in a frame by an adhesive tape for support, the apparatus comprising: a first holding mechanism for holding the frame; and a dividing mechanism having a substrate is formed by radially stretching an adhesive tape to divide the first expansion member of the substrate; a second holding mechanism holding a frame for holding the divided substrate; and an expansion mechanism having a tensile bond in a radial direction of the substrate a second expansion member of the belt; the light projector is configured to emit light toward the substrate in a state in which the second expansion member stretches the adhesive tape in the radial direction; and the optical sensor detects light from the light projector via the substrate; the inspection unit According to the inspection result of the optical sensor, the presence or absence of the dividing line of the substrate is checked; and the control unit repeats the dividing process and the inspection when the inspection unit detects the division failure.

According to this configuration, after the substrate is divided by stretching the adhesive tape by the first expansion member, the division defect of the dividing line can be inspected while the adhesive tape is stretched by the second expansion member. That is, the dividing process and the inspection can be performed in individual steps. Therefore, the above first to third methods can be suitably carried out.

Further, in order to achieve such an object, the present invention adopts the configuration shown below.

That is, a substrate dicing apparatus for dicing a substrate held in a frame by an adhesive tape for support, the device comprising: a first holding mechanism for holding the frame; and a roller having a ratio of the substrate a width having a smaller width and stretching the adhesive tape while stretching the adhesive tape in the radial direction of the substrate; the light projector is irradiated with light from the opposite side of the rolling surface of the roller toward the substrate; the optical sensor is detected The reflected light from the substrate surface; the inspection unit checks whether the substrate has a dividing line in response to the detection result of the optical sensor; and the control unit controls the position of the roller that moves while the substrate is being pressed while tracking When the light is irradiated from the light projector and the reflected light that has moved along with the movement of the roller is detected by the optical sensor, when the inspection unit detects the division failure, the portion where the roller pair division is defective is repeatedly pressed and rolled and inspected.

According to this configuration, the substrate can be inspected while being divided by a roller at the same time.

* In order to explain the invention, several forms that are considered appropriate are shown, but it should be understood that the invention is not limited to the configuration and countermeasures as illustrated.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The apparatus of the present embodiment will be described by taking as an example a case where the mounting device of the semiconductor wafer (hereinafter simply referred to as "wafer") includes the substrate dicing apparatus of the present invention. Moreover, the substrate processed by the apparatus of the embodiment is described by taking a wafer which is cracked from the modified region toward both sides by laser irradiation, and a wafer having a lattice-shaped cut line is formed as an example. Therefore, on the surface, the scribe line is not formed by the conventional polishing. In addition, in order to protect the circuit surface and make the wafer rigid, the protective tape is adhered to the surface of the wafer. The protective tape is made of an ultraviolet-curable adhesive tape, but may be a non-ultraviolet-curing pressure-sensitive adhesive tape.

Fig. 1 is a plan view showing the overall configuration of the mounting device.

The mounting order of the mounting apparatus 1 includes a frame supply unit 2, a first transport mechanism 3, a mounting unit 4, a second transport mechanism 5, a third transport mechanism 6, a peeling unit 7, and a fourth transport mechanism 8. The ultraviolet irradiation unit 9, the fifth conveyance mechanism 10, the division unit 11, the sixth conveyance mechanism 12, the inspection unit 13, the seventh conveyance mechanism 14, and the frame collection unit 15.

As shown in FIG. 2, the frame supply unit 2 arranges the accommodating portion 16 for the annular frame f. The accommodating portion 16 includes a vertical rail 17 that is coupled to the apparatus frame and a lifting platform 19 that is lifted and lowered by the screw feed along the vertical rail 17 by the motor 18. Therefore, the frame supply unit 2 is constructed such that the frame f is placed on the elevating table 19 and fed at a pitch to ascend and descend. Further, the frame collecting unit 15 is also configured in the same manner as the frame supplying unit 2.

As shown in FIGS. 3 and 4, the first transport mechanism 3 is a movable table 21 that horizontally moves left and right along the guide rail 20, and an arm 23 that moves up and down along the vertical rail 22 that is fixedly fixed to the movable table 21, and The adsorption portion 24 attached to the front end side of the arm 23 is constituted by an aligner 25.

The adsorption unit 24 has a plurality of adsorption pads 27 which are pressed downward by the elastic body below the divided plate 26. The adsorption pad 27 adsorbs the surface of the holding frame f. Further, the adsorption pad 27 is provided as a frame f that can adsorb and hold different sizes.

The aligner 25 has an engaging pin 29 which is erected downwardly below the plate 28 which is slidably adjustable in the radial direction of the frame f. The engaging pin 29 is engaged with the alignment mark of the notch for positioning of the frame f.

As shown in FIG. 5, the mounting unit 4 includes a holding table 30, a tape supply unit 31, an adhesive unit 32, a separation belt collecting unit 33, a peeling unit 34, a tape cutting mechanism 35, a tape collecting unit 36, and the like.

The holding table 30 is composed of a frame holding portion 37 that holds the ring shape of the frame f and a wafer holding portion 38 that holds the wafer W so as to be movable up and down.

The tape supply unit 31 is loaded with a wide strip of adhesive tape (cut tape) DT to successively discharge the adhesive tape DT.

The pasting unit 32 includes a nip roller 41 that holds the adhesive tape DT to which the separation tape S is attached, and a movable frame 40 that is movable along the guide rail 39. The peeling member 42 folds the separation tape S back from the adhesive tape DT. Peeling; the lifting roller 43 cooperates with the peeling member 42 and holds the adhesive tape DT; the adhesive roller 44 pushes the adhesive tape drawn from the front end of the peeling member 42 and adheres to the frame f and the wafer W; The nip roller 45 of the belt S is separated.

The peeling unit 34 is constructed to move along the same guide rail 39 as the pasting unit 32, and the adhesive tape DT is not taken up after being cut and collected.

The belt cutting mechanism 35 has a cutting unit 46 that is coupled to a support arm 47 that extends in the radial direction at a lower end of the front end of the arm that can be supported by the movable table that can be lifted and lowered along the longitudinal rail. The cutting unit 46 mounts the cutting edge 48 of the rounded blade with the blade tip downward to be idling. Further, the other support arm 47 has a roller that presses the cutting portion in accordance with the rotation of the cutting blade 48. The cutting unit 46 is rotatable about the same axis as the holding table 30. Further, the cutting unit 46 can adjust the radius of rotation by the support arm 47.

Referring back to Fig. 1, the second transport mechanism 5 is configured such that the first transport mechanism 3 omits the aligner 25, moves horizontally left and right along the guide rail 49, and ascends and descends along the vertical rail.

The third transport mechanism 6 has a reversing unit 51 that moves horizontally left and right along the guide rail 50. The reversing unit 51, as shown in Figs. 6 and 7 , is rotatable about a horizontal support shaft r by a rotary actuator 55 along a lifting platform 54 that is vertically movable up and down fixed to the vertical rail 53 of the movable table 52. The rotating receiving frame 56 is mounted in a cantilever shape, and the base portion and the front end portion of the receiving frame 56 are respectively provided with jaws 57 rotatable about the fulcrum s.

As shown in Fig. 8, the peeling unit 7 is composed of a movable frame 58 and a peeling table 59 which is laid on the upper portion of the apparatus frame and horizontally moved along the guide rails, and the peeling table 59 holds the mounting frame. MF. Further, the movable frame 58 includes a tape supply unit 60 and a winding shaft 63. The tape supply unit 60 winds the peeling tape t which is narrower than the diameter of the wafer W, and the winding shaft 63 is wound from the tape supply. The portion 60 is guided to the blade-shaped peeling member 62 by the guide roller 61 and folded back and peeled off the adhesive tape DT. Further, the peeling table 59 is set to have a smaller diameter than the outer shape of the frame f.

As shown in FIGS. 1 and 9 , the fourth transport mechanism 8 has an inverting unit 65 that horizontally moves left and right along the guide rail 64 . The reversing unit 65 is attached to the elevating table 68 which is movable up and down along the vertical rail 67 fixed to the movable table 66, and is mounted in a cantilever manner to the receiving frame 70 which is rotatable about the horizontal support shaft r by the rotary actuator 69. The adsorption portion 71 having a plurality of adsorption pads is attached to the front end portion of the receiving frame 70, and the adsorption pad is biased downward by the elastic body.

The ultraviolet irradiation unit 9 is configured such that a light source 72 is disposed in a container formed on the side surface of the opening into which the mounting frame f can be inserted, and a cold filter or the like is appropriately disposed between the light source 72 and the wafer W. The light source 72 uses a plurality of ultraviolet bulbs, ultraviolet LEDs, or the like in order to uniformly irradiate ultraviolet rays on the back side of the mounting frame M.

The fifth transport mechanism 10 omits the configuration of the aligner 25 from the first transport mechanism 3, and moves horizontally to the right and left along the guide rail 73 shown in Fig. 1, and ascends and descends along the vertical rail. Further, the fifth transport mechanism 10 has the same inverting unit 65 as the fourth transport mechanism 8.

The elevating table 111 that receives the mounting frame MF whose circuit face is facing downward is provided below the fifth transport mechanism 10. The lifting table 111 has a rail 112 that holds the left and right of the frame f.

The transport mechanism 121 is provided to grip one end of the mounting frame MF on the elevating table 111 at a set position on the lower side of the elevating table 111, and then passes between the rails 112 and is transported to the inside of the ultraviolet ray irradiation unit 9. The transport mechanism 121 is an upper portion of the movable table 123 that moves horizontally along the right and left sides of the guide rail 122, and has a fixed receiving piece and a holding piece 124 that is opened and closed by the cylinder.

The dividing unit 11 includes a holding table 74 and a spread roller 75 as shown in FIGS. 10 and 11. The holding table 74 is composed of a frame holding portion 76 that holds the frame f and a wafer holding portion 77 for holding the wafer on the surface of the elastic body such as a sponge. Further, it has a clamp 108 for holding both ends of the frame f. Further, the dividing unit 11 corresponds to the dividing mechanism of the present invention, and the expanding roller 75 corresponds to the first expanding member.

The expansion roller 75 is set to be smaller than the diameter of the wafer W. Further, the expansion roller 75 is moved forward and backward along the ball shaft 115 coupled to the rotation shaft of the motor M by the forward and reverse rotation of the motor M. Further, the movable table 116 having the expansion roller 75 is coupled to the belt 119 by the slide engagement portion, and the cough belt 119 is wound around the drive pulley 117 and the idle pulley 118. Therefore, by the forward and reverse rotation of the belt 119, the movable table moves horizontally left and right.

That is, the expansion roller 75 can be moved up and down, and each time the pressing and rolling of the wafer back from the one end to the other end of the wafer W is completed, the film is horizontally moved at a predetermined pitch, and the back surface of the wafer is pushed while being reversed. . In other words, the expansion roller 75 is configured to gradually divide and press the roll toward the back surface of the wafer.

The inspection unit 13 is constituted by a holding table 78, an expansion unit 79, a light source 80, and a camera 81 as shown in Figs. 12 to 14 . Further, the inspection unit 13 corresponds to the inspection unit of the present invention, the expansion unit 79 corresponds to the expansion mechanism of the present invention, the light source 80 corresponds to the light projector of the present invention, and the camera 81 corresponds to the optical sensor of the present invention.

The holding table 78 is formed into a door shape. That is, the ring-shaped table 82 of the adsorption holding frame f and the pair of movable frames 83 that support both ends of the table 82 are formed. The movable frame 83 is horizontally moved by the drive mechanism along the pair of guide rails 84 from the receiving position of the mounting frame MF to the inspection position.

The expansion unit 79 includes a holding plate 85 that is cut into the shape of the wafer W, and a stepping motor 87 that lifts and lowers the transparent expansion plate 86 and the holding plate 85 at the opening portion of the holding plate 85. The expanded plate 86 is made of a resin such as polycarbonate or a material having permeability such as glass. Further, the expansion plate 86 corresponds to the second expansion member of the present invention.

The light source 80 and the camera 81 are arranged to face each other across the expansion plate 86. Further, the light source 80 and the camera 81 are provided at the distal ends of the second movable tables 89a and 89b which are movable forward and backward of the first movable table 88 which is movable to the left and right, and are configured to be able to maintain the relative orientation of each other while facing each other. Move on the ground.

The first movable table 88 is moved left and right along the guide rails laid on the horizontal frame 90 provided on the base of the apparatus. That is, as shown in Fig. 14, the drive pulley 93 is driven by the motor 92 provided on one end side of the guide rail, and the idler pulley 94 is axially supported on the other end side of the guide rail. The slide engagement portion of the first movable table 88 is coupled to a belt 95 that is wound around the drive pulley 93 and the idler pulley 94. Therefore, the first movable table 88 is moved left and right by the forward and reverse of the belt 95.

As shown in Fig. 13, the second movable tables 89a and 89b move forward and backward along the guide rails 98a and 98b, respectively. The guide rails 98a and 98b are laid up and down in the front of the first movable table 88 in a cantilever manner. A pair of support arms 97a, 97b. That is, the drive shaft 99 coupled to the motor 100 provided on the base end side of the guide rail 98a and passing through the two support arms 97a, 97b provided above and below is axially supported by the drive pulleys 101a, 101b, and on the front side of the two support arms 97a, 97b Each of the side shaft idlers 102a, 102b. The sliding engagement portions 104a, 104b of the respective support arms 97a, 97b are wound around the drive pulley The belts 103a and 103b of the respective groups of the groups of the idlers 102a and 102b are coupled to each other. Therefore, the second movable tables 89a and 89b are moved forward and backward by the forward and reverse of the belts 103a and 103b.

Further, as the light source 80, in order to reliably transmit light through a minute cutting line, it is preferable that the directivity is excellent. For example, a predetermined wavelength such as a red LED is used.

As shown in FIG. 1, the seventh transport mechanism 14 is provided with a pair of holding arms 105 that are close to each other in the width direction of the peeling table 59, and is configured by a movable table that can move forward and backward along the guide rails 106.

Next, an operation of the loop of the mounting frame MF by the inspection process to the recovery mounting frame MF using the apparatus of this embodiment will be described based on the flowchart shown in Fig. 15 and Figs. 16 to 25.

The wafer W having the protective tape P adhered to the surface after the ultraviolet irradiation treatment is transported to the mounting unit 4 by the transfer arm having the suction plate at the tip end, and the circuit is placed face down and placed on the holding table. 30. The wafer W is held and held by the holding table 30.

The first transport mechanism 3 sucks the holding frame f and transports it to the mounting unit 4 after the aligner 25 is aligned with the frame f. The frame f is placed and held on the holding table 30.

As shown in Fig. 16 and Fig. 17, with the movement of the pasting unit 32, the adhesive tape DT is taken out while the predetermined tension is applied from the tape supply unit 31, and the separation tape S is peeled off by the peeling member 42, and is extracted in the same manner as the drawing speed. The separation belt S is gradually wound and recovered to the separation belt recovery portion 33.

When the peeling member 42 reaches the tape-attaching position on the one end side of the frame f, the adhesive roller 44 is lowered, and the adhesive tape DT is pressed while rolling toward the other end, and the adhesive tape DT is gradually adhered to the wafer f and the wafer W.

When the pasting unit 32 reaches the end point, each of the nip rollers 41, 45 and the lifting roller 43 holds the adhesive tape DT and the separation tape S, respectively. Then, as shown in Fig. 18, the cutting unit 46 at the upper standby position is lowered to the cutting position, and the adhesive tape DT is cut along the shape of the frame f.

The cutting unit 46 that completes the cutting of the adhesive tape DT returns to the upper standby position. Next, after the nip rollers 41, 45 and the like are gripped by the adhesive tape DT, the peeling unit 34 is operated. As shown in Fig. 19, the peeling unit 34 winds up and collects the removed adhesive tape while moving (step S1).

The mounting frame MF produced by the second transport mechanism 5 adsorbs the back surface and is transported to the delivery position of the third transport mechanism 6. The mounting frame MF is temporarily placed on a holding table (not shown). The third transport mechanism 6 sucks and holds the mounting frame MF, and reverses the mounting frame MF upside down by the reversing unit 51, and then transports it to the peeling unit 7.

The mounting frame MF is placed on the peeling table 59 by the third transport mechanism 6 with the circuit surface facing up.

In the mounting frame MF on the peeling table 59, the holding frame f is sucked from the circuit surface side by the fourth transport mechanism 8, and the circuit surface is reversed downward by the inverting unit 65. In this state, it moves to the lower side of the 5th conveyance mechanism 10. The fifth transport mechanism 10 sucks the holding frame f from the back side of the wafer W, and receives the mounting frame MF from the fourth transport mechanism 8.

The fifth transport mechanism 10 transports the mounting frame MF to the dividing unit 11. The fifth transport mechanism 10 that has reached the dividing unit 11 places the mounting frame MF on the holding table 74 with the circuit surface facing downward. When the clamp plate 108 clamps the frame f on the holding table 74, as shown in Fig. 20, The surface of the wafer W is divided into wafers by repeating the reciprocating rolling of the expansion roller 75 at a predetermined pressing force (step S2).

Further, since the wafer W of the present embodiment adheres to the hard protective tape P in order to protect the surface and has rigidity, the extension of the adhesive tape DT is suppressed. In other words, as in the bonding step, the adhesive tape DT is extended in a state where the protective tape P is not adhered, and the interval between the wafers is narrowed compared to the case where the interval between the wafers is enlarged. That is, the belt base material undergoes structural deformation or component deformation with respect to the extension of the adhesive tape DT in the joining step, and the adhesive tape DT is extended by the expansion treatment without the deformation of the component of the adhesive tape DT. Therefore, it is not necessary to deform and deform the component of the adhesive tape DT after the extension to carry out the mounting frame MF produced from the apparatus. In other words, the adhesive tape DT after the extension is maintained in a state of being imparted with uniform tension.

When the dividing process of the wafer W is completed, the expansion roller 75 is retracted from the traveling path of the sixth transport mechanism 12. Then, the mounting frame MF is transported to the inspection unit 13 while still holding the back surface by the sixth transport mechanism 12.

The sixth transport mechanism 12 mounts the mounting frame MF, which still has the circuit surface facing downward, on the holding table 78 that is placed at the delivery position. The holding table 78 is moved to the inspection position while still holding the holding frame MF.

When the table 78 is held at the inspection position, as shown in FIGS. 21 and 22, as the holding table 78 is lowered, the expansion plate 86 is also lowered, and the back surface of the wafer W is pressed. By the pressing and stretching to the extent that the components of the adhesive tape DT and the protective tape P are not deformed, as shown in Fig. 23, which enlarges the circle portion of the two-point chain line of Fig. 22, the wafer W is divided into The wafer, the light passes through the dividing line. In the present embodiment, the gap between the wafers set to be pressed is 0.5 mm. In this state, one side makes the light source 80 The front and rear images of the front and back are taken while the camera 81 is fed at a predetermined pitch on the left and right sides (step S3). Further, this step corresponds to an example of the detection step of the present invention.

In the present embodiment, as shown in Fig. 24, the wafer W is divided into 21 measurement blocks, and each measurement block is taken. Further, the size of the measurement block is appropriately changed in accordance with the field of view of the camera 81 or the detection intensity of the transmitted light.

The captured image signal is transmitted to the control unit 110. The control unit 110 performs, for example, binarization processing based on the video signal of each measurement block, and creates a measurement image of the wafer shape including the division line (step S4).

Then, the matching reference image of the grid-shaped dividing line and the pattern of the measurement image are processed (step S5). By the pattern matching processing, the following two types of discrimination processing are performed. In other words, it is determined whether or not the "street inspection" of the division line is interrupted, and the "pitch inspection" of the wafer in which the wafer W is divided into a predetermined size (width) based on the division line. In the pattern matching process, as shown in FIG. 24, the image of the wafer W of the good product is a measurement image of the transmitted light having a lattice shape in which the dividing lines are formed at equal intervals without interruption. The image of the inspection result is displayed on a monitor equipped inside or outside the device.

The mounting frame MF of the determined good product is conveyed by the peeling unit 7 in a path opposite to the order of the conveyance path.

For example, in the case where the division line is interrupted according to the street inspection, as shown on the left side of Fig. 25, the addition of the symbol "+" indicates the start position and the end position of the interruption of the division line. At the same time, "X side is displayed on the screen. To: NG". According to the interval check, for example, the pitch of the dividing line is obtained in units of pixels, and it is checked whether it is divided into a predetermined pitch by comparison with a predetermined reference value. As a result of the inspection, in the case where no pitch error occurred, as shown on the right side of Fig. 25, measurement images in which the pitches were not equally spaced were obtained. At the same time, "Y direction: NG" is displayed on the screen. Then, it is also determined whether or not the number of detections (count values) of the division failure has reached a predetermined number of times (step S6). When the count value is within a predetermined number of times, the mounting frame MF in which the division failure is detected is sent back to the dividing unit 11 in the reverse order of the conveyance path, and the division processing is performed.

The mounting frame MF that has been divided and processed is transported to the inspection unit 13 and inspected. When the division failure is detected, the re-inspection and division processing of the predetermined number of times are performed.

If the division failure is not detected within the predetermined number of times, it is sent to the peeling unit 7 as a good product. On the other hand, when the detection of the division failure exceeds the predetermined number of times, a notification sound is generated, and the mounting frame MF is determined to be defective (step S7). At this time, information such as the position where the defect occurred, the lot number, and the processing number are recorded in a memory device such as a memory. The mounting frame MF of the defective product may be recovered at this time, or may be recovered without performing the peeling treatment of the protective tape P, or may be recovered together with the good product after the peeling treatment.

The mounting frame MF sent back to the peeling unit 7 is placed on the peeling table 59 with the circuit surface facing downward. When the mounting frame MF is adsorbed and held by the peeling table 59, the peeling member 62 is gradually adhered from the one end of the wafer W toward the other end, and the peeling tape t which is folded back by the peeling member 62 is wound in synchronization with the sticking speed. Thereby, the protective tape P is integrally peeled off from the surface of the wafer W (step S8).

When the peeling process of the protective tape P is completed, the mounting frame MF on the peeling table 59 is sucked and held by the fourth transport mechanism 8 from the circuit surface side, and then the circuit surface is reversed downward by the inverting unit 65. In this state, it moves to the lower side of the 5th conveyance mechanism 10. The fifth transport mechanism 10 sucks the holding frame f from the back side of the wafer W, and receives the mounting frame MF from the fourth transport mechanism 8. At the same time, the fourth transport mechanism 8 after the desorption is retracted to the side of the peeling unit 7.

The fifth transport mechanism 10 mounts the mounting frame MF on the elevating table 111 that is stopped at a predetermined position after being lifted.

The lifting platform 111 is lowered to a predetermined position and then stopped. Next, the transport mechanism 121 is moved, and one end of the mounting frame MF on the lift table 111 is gripped and moved in this state, and the mounting frame MF is transported into the ultraviolet irradiation unit.

The mounting frame MF conveyed to the ultraviolet irradiation unit 9 is still held by the transport mechanism 121, and is irradiated with ultraviolet rays from the back side. By the ultraviolet irradiation treatment, the adhesive of the adhesive tape DT becomes hard, and the adhesive force is lowered or disappeared (step S9).

When the ultraviolet irradiation treatment is completed, the transport mechanism 121 is retracted, and the mounting frame MF is placed on the lift table.

The lifting platform 111 is raised to the delivery position of the fifth transport mechanism 10. When the fifth transport mechanism 10 sucks and holds the mounting frame MF with the circuit surface facing downward, the elevating table 111 is lowered. Then, the fourth transport mechanism 8 moves to the lower side of the fifth transport mechanism 10, sucks the frame f on the circuit surface side, and receives the mounting frame MF from the fifth transport mechanism 10. The fourth transport mechanism 8 transports the mounting frame MF to the peeling table 59, and places the circuit surface up on the peeling table 59.

The mounting frame MF after the completion of the ultraviolet irradiation process is lifted and held by the holding arm 105 of the seventh transport mechanism 14 from both ends of the frame f beyond which the peeling table 59 is exceeded, and is transported to the frame collecting portion 15. The mounting frame MF is housed in the case of the frame collecting unit 15 (step S10).

At this time, it is determined whether or not the number of stored sheets has reached a predetermined number of sheets (step S11). As a result of the determination, if the predetermined number of sheets has not been reached, the processed mounting frame MF is continuously stored in the cassette currently in use. If the predetermined number of sheets is reached, the cassette is carried out of the apparatus (step S12).

The action of the above one loop ends, and the same action is repeated later.

According to the apparatus of this embodiment, the division failure at the time of the cutting process can be detected in the same step of producing the mounting frame MF. When the division failure is detected, in order to eliminate the division failure, the division processing and the inspection are repeated a predetermined number of times, and the defective and defective products can be distinguished with high precision, and only the good product can be carried out to the next step such as the joining step.

Further, since the protective tape P is still adhered to the surface of the wafer W, the adhesive tape DT is not subjected to component destruction or component deformation as in the bonding process. Therefore, the component recovery of the adhesive tape DT is not performed, and the wafer DT is held in the mounting frame MF of the frame f by the adhesive tape DT to which the appropriate tension is applied, and is carried out to the next step.

The present invention can also be carried out in other forms than those described above, and several aspects are listed below.

(1) In the inspection unit 13 of the embodiment, the division failure is detected by the transmitted light, but the division failure may be detected based on the intensity change of the reflected light.

For example, as shown in Fig. 26, the light source 80, the camera 81, and the beam splitter 127 are provided on the movable table 126 which is movable forward, backward, left, and right on the apparatus base. That is, the light is vertically radiated from the light source 80 to the upper wafer surface, and the light is totally totally reflected by the wafer circle, and the reflected light is returned to the same optical path as the irradiation light. After the beam splitter 127 changes the optical path of the reflected light to a right angle direction, the reflected light is detected by the camera 81.

Alternatively, as shown in Fig. 27, the light may be irradiated from the elevating table 111 toward the wafer back surface from the oblique direction, and the reflected light from the back surface may be detected by the camera 81.

Further, the configuration in which the light is vertically irradiated on the back surface of the wafer can effectively utilize the light totally reflected on the back surface of the wafer. Moreover, it is also easy to set the position at which the camera 81 receives the reflected light.

(2) In the inspection unit 13 of this embodiment, red light is irradiated on the back surface of the wafer, but infrared rays may be used, and after detecting the temperature of the wafer W by the thermal sensor, the division is determined based on the distribution of temperature changes. bad. For example, the portion of the dividing line appears to have a lower temperature than the wafer portion because of the formation of the gap. Therefore, the interruption portion of the grid-shaped dividing line showing the low temperature can be determined as the division failure.

(3) In this embodiment, the dividing unit 11 and the inspection unit 13 are separately provided, but the dividing unit 11 may be used to divide the wafer W while checking.

For example, as shown in FIG. 28 or FIG. 29, the frame f is adsorbed and held by the holding table 78 of the inspection unit 13, and whenever the pressing of the wafer back from one end of the wafer W to the other end is completed, The predetermined spacing moves horizontally and pushes on one side while repeating the reversal. With the movement of the expansion roller 75 The manner of dynamic synchronization causes the light source 80, the beam splitter 127, and the camera 81 to move, and the vertical light is continuously irradiated from the light source 80 directly below the expansion roller 75. At this time, the reflected light totally reflected from the back surface of the wafer is changed by the beam splitter, and then detected by the camera 81.

The detection signal is transmitted to the control unit 110 as in the embodiment, and the control unit 110 sequentially performs the discrimination processing of the division failure. When the division failure is detected, the entire surface of the wafer or only the defective area is selected by the expansion roller 75 and scrolled, and the division processing and inspection are performed again.

According to this configuration, the processing speed is improved as compared with the apparatus of this embodiment.

(4) It is also possible to discriminate the segmentation defect from the measurement image obtained by one shot and the reference image from the field of view of the entire income of the camera.

(5) In the apparatus of this embodiment, the protective tape P is adhered to the circuit surface of the wafer W, and the dividing process and the inspection are performed. However, after the ultraviolet irradiation process, the mounting frame MF may be returned to the peeling unit 7 and After the protective tape P is peeled off from the wafer W, division processing and inspection are performed. In this case, as shown in FIG. 11, the protective pad 125 is traversed so as to straddle the supply roller 113 and the winding roller 114 which are opposed to each other via the holding table 74. That is, the protective pad 125 may be laid on the surface of the wafer holding portion 77 of the dividing unit 11, and the wafer W having the circuit surface facing downward may be placed thereon.

(6) In the expansion unit 79 of the apparatus of this embodiment, in order to detect the division failure of the wafer W, the transparent plate 86 is made of transparent resin or glass, but is not limited to these hard members. That is, an elastic sheet can also be used instead of the hard member. As the elastic sheet, for example, an elastic sheet produced by filling a silicone bag with a silicone bag or an adhesive sheet which is cured by ultraviolet rays can be used. Flexible sheets and the like. These elastic sheets and the expansion plate 86 of the apparatus of the embodiment are not limited to being transparent, and may be colored or clouded as long as the light from the light source is not blocked.

Therefore, it is also possible to form an elastic piece having the same shape as that of the expansion plate 86 used in the apparatus of this embodiment, instead of the expansion plate 86, the elastic piece is attached to the apparatus of the embodiment and used.

The size of the elastic sheet is not necessarily larger than the size of the wafer W, and may be smaller than the wafer W. For example, as shown in Fig. 30, the elastic piece 86A may be attached to the front surface of the illuminating device 80A having a smaller size than the wafer W.

In the case of this configuration, the illuminating device 80A is configured to be movable up and down and to move forward and backward. Therefore, as shown in Fig. 31, while the illuminating device 80A is reciprocating back and forth and moving in the lateral direction, the illuminating device 80A is lowered to a predetermined height, and the pressing of the wafer W in units of squares is repeated (longitudinal 3× Horizontal 3 = 9 squares), the entire surface of the wafer W is inspected.

Since the elastic piece 86A is elastically deformed to absorb some step difference, even if the ring frame f is exceeded, the wafer W is pushed, and the portion where the division is poor can be divided again.

Further, in a case where the entire surface of the wafer W is received in the field of view of the camera 81, the camera 81 may be fixedly arranged.

In the case where the entire surface of the wafer W cannot be received in the field of view of the camera 81, as shown in Fig. 32, the camera 81 can be moved in synchronization with the movement of the illumination device 80A.

The present invention can be implemented in other specific forms without departing from the spirit and scope of the invention. Therefore, the scope of the invention is not to be construed as a limitation.

1‧‧‧Installation device

2‧‧‧Box Supply Department

3‧‧‧1st transport mechanism

4‧‧‧Installation unit

5‧‧‧2th transport mechanism

6‧‧‧3rd transport mechanism

7‧‧‧ peeling unit

8‧‧‧4th transport mechanism

9‧‧‧UV irradiation unit

10‧‧‧5th handling agency

11‧‧‧Dividing unit

12‧‧‧6th handling agency

13‧‧‧Check unit

14‧‧‧7th handling agency

15‧‧‧Box Recycling Department

30‧‧‧Keep the workbench

49‧‧‧rails

50‧‧‧rails

51‧‧‧Reversal unit

64‧‧‧rails

73‧‧‧rails

105‧‧‧ Keeping the arm

106‧‧‧rails

W‧‧‧ wafer

F‧‧‧ box

DT‧‧‧ adhesive tape

Fig. 1 is a plan view showing the overall configuration of an embodiment apparatus.

Fig. 2 is a front view of the frame supply unit.

Fig. 3 is a plan view of the first transport mechanism.

Fig. 4 is a front view of the first transport mechanism.

Figure 5 is a front elevational view showing the mounting unit.

Fig. 6 is a plan view of the third transport mechanism.

Fig. 7 is a front view of the third transport mechanism.

Figure 8 is a front view of the stripping unit.

Fig. 9 is a front elevational view showing the fourth transport mechanism, the fifth transport mechanism, and the ultraviolet irradiation unit.

Figure 10 is a plan view of the dividing unit.

Figure 11 is a front view of the dividing unit.

Figure 12 is a plan view of the inspection unit.

Figure 13 is a front view of the inspection unit.

Figure 14 is a side view of the inspection unit.

Figure 15 is a flow chart showing the processing flow of the embodiment apparatus.

Fig. 16 to Fig. 19 are diagrams for explaining the operation of the mounting unit.

Fig. 20 is a view for explaining the operation of the dividing unit.

21 to 22 are diagrams illustrating the operation of the inspection unit.

Fig. 23 is a view showing a state in which transmitted light is detected.

Fig. 24 is a view showing a measurement image of a good product.

Fig. 25 is a view showing a measurement image of a defective product.

Fig. 26 is a front elevational view showing a modification of the inspection unit.

Figure 27 is a front elevational view showing a modification of the inspection unit.

Fig. 28 is a front elevational view showing a modification of the inspection unit.

Figure 29 is a front elevational view showing a modification of the inspection unit.

Figure 30 is a front elevational view showing a modification of the inspection unit.

31 to 32 are views for explaining the operation of the inspection unit of the modification.

Claims (17)

A substrate dicing method for examining a substrate dicing method of a substrate adhered and held in a frame by an adhesive tape for support, the method comprising the steps of: dividing: the bonding by the expansion member The tape is stretched in the radial direction to divide the substrate into small pieces; in the irradiating step, the adhesive tape is radially stretched by the expansion member, and the light is irradiated from the light projector toward the substrate; the detecting step is performed by the substrate The optical sensor detects the light from the light projector; and the checking step is to check whether the substrate has a dividing line according to the inspection result of the optical sensor; and in the checking step, the segmentation failure is detected, and the segmentation is repeated. Steps to the steps of the inspection step. The substrate singulation method according to the first aspect of the invention, wherein the detecting step detects the transmitted light transmitted through the dividing line of the substrate by the optical sensor; and the checking step determines whether the dividing line is present or not based on the presence or absence of the transmitted light. The substrate singulation method of claim 1, wherein the detecting step detects the reflected light from the substrate surface by using an optical sensor; the checking step is based on the intensity of the reflected light detected by the optical sensor. Determine whether there is a dividing line. The substrate singulation method of claim 1, wherein the illuminating step is to irradiate the infrared ray from the illuminator toward the substrate; the detecting step is to detect the temperature of the substrate heated by the infrared ray by using an optical sensor; the checking step is based on the substrate The change in the temperature distribution determines whether or not there is a dividing line. The substrate singulation method of claim 1, wherein the expansion member has a permeable plate; and the illuminating step presses the plate against the substrate and stretches the adhesive tape. The substrate singulation method of claim 1, wherein the expansion member has a permeable elastic sheet; and the illuminating step presses the elastic sheet against the substrate and stretches the adhesive tape. The substrate dicing method according to claim 6, wherein the elastic sheet is attached to the light projector, and the light projector is lowered, whereby the substrate is pressed and stretched with the elastic sheet interposed therebetween. The substrate singulation method of claim 3, wherein the expansion member is a roller having a smaller width than the substrate; and the illuminating step irradiates light from the light projector in such a manner as to track a position of a roller that moves on one side of the substrate; This detecting step detects reflected light that moves in accordance with the movement of the roller. A substrate singulation apparatus is a substrate singulation apparatus for dicing a substrate which is adhered and held in a frame by an adhesive tape for support, and the apparatus comprises the following components: The first holding means for holding the frame; the dividing means has a first expanding member that stretches the adhesive tape in the radial direction of the substrate to divide the substrate; and the second holding means holds the substrate for holding the divided a expansion mechanism having a second expansion member that stretches an adhesive tape in a radial direction of the substrate; and a light projector that emits light toward the substrate while the adhesive tape is stretched in the radial direction by the second expansion member. The optical sensor detects light from the light projector via a substrate; the inspection unit checks whether the substrate has a dividing line according to the inspection result of the optical sensor; and the control unit is controlled by the inspection unit When the division is poor, the division processing and inspection are repeated. The substrate singulation apparatus of claim 9, wherein the first expansion member presses a plate of the substrate. The substrate singulation apparatus of claim 9, wherein the first expansion member is constituted by a holding table and a roller, and the holding table is covered by an elastic material holding the substrate surface, the roller system having The width of the substrate is smaller and the surface on the opposite side of the substrate holding surface is pressed. The control unit causes the roller to roll again only for the portion where the division is defective. The substrate singulation apparatus of claim 9, wherein the second expansion member has a transparent plate; and the light projector and the optical sensor are disposed to face each other with the substrate and the second expansion member interposed therebetween; It is configured to detect light passing through the dividing line of the substrate by an optical sensor. The substrate singulation apparatus of claim 9, wherein the second expansion member has a transparent elastic plate; and the light projector and the optical sensor are disposed opposite to each other by sandwiching the substrate and the second expansion member. And configured to detect light passing through the dividing line of the substrate by an optical sensor. The substrate singulation apparatus of claim 13, wherein the elastic plate is mounted on the light projector and constructed to be movable up and down. The substrate singulation apparatus of claim 9, wherein the optical sensor detects reflected light from the surface of the substrate; the inspection portion is constructed to correspond to the intensity of the reflected light detected by the optical sensor. Discriminate the dividing line. The substrate singulation apparatus of claim 9, wherein the light projector is configured to illuminate infrared light toward the substrate; the optical sensor detects a temperature of the substrate heated by the infrared ray; and the inspection portion is constructed according to a temperature distribution of the substrate The change determines whether there is a dividing line. A substrate dicing apparatus is a substrate dicing apparatus for dicing a substrate which is adhered and held in a frame by an adhesive tape for support, the apparatus comprising the following structure: a first holding mechanism for holding the frame; a roller; Having a width smaller than the width of the substrate and pressing the substrate while stretching the adhesive tape in the radial direction of the substrate; the light projector is irradiated with light from the opposite side of the rolling surface of the roller; a sensor that detects reflected light from the surface of the substrate; and an inspection unit that checks whether the substrate has a dividing line in response to the detection result of the optical sensor; and the control unit moves the substrate while the tracking side is pressed The position of the roller is irradiated with light from the light projector, and the reflected light that has moved along with the movement of the roller is detected by the optical sensor. When the inspection unit detects the division failure, the roller is re-segmented in the portion where the division is defective. Push to scroll and check.