TWI777780B - Film supply device and pre-peeling machine - Google Patents

Abstract

The present invention provides a film supply device and a pre-peeling machine. The pre-peeling machine includes a machine body, a plurality of rollers rollably assembled to the machine body, and a pre-peeling member that is fixed to the machine body. The rollers jointly define a transportation path, and the pre-peeling member has a turning edge located at the transportation path. The rollers are configured to enable a carrying sheet adhered with films to move along the transportation path, and the turning edge is configured to allow two parts of the carrying sheet respectively arranged at two opposite sides thereof to have a turning angle that is less than 180 degrees, so that a part of the films adjacent to the turning edge can separate from the carrying sheet one by one after passing through the turning edge at different time points.

Description

Film supply device and pre-stripping machine

The invention relates to a film supply device, in particular to a film supply device and a pre-stripping machine that can peel off and supply films one by one.

In the existing film supply mechanism, a plurality of film sheets are arranged on a carrier sheet, so as to provide a catcher to directly remove the film sheets from the carrier sheet. However, the existing film supply mechanisms are all directed towards improving the extractor so as to facilitate the extractor to remove the film from the carrier sheet more conveniently, but the improvement of the extractor has gradually encountered a bottleneck.

Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

The embodiments of the present invention provide a film supply device and a pre-stripping machine, which can effectively improve the defects that may occur in the existing film supply mechanism.

An embodiment of the present invention discloses a film supply device, which includes: a machine body; a material module, which is detachably erected on the machine body; wherein, the material module includes a carrier sheet and an attachment a plurality of diaphragms on the carrier sheet; a plurality of rollers, which are rotatably mounted on the machine body, and a plurality of the rollers together define a conveying path; wherein, the carrier sheet can be and a pre-stripping piece fixed on the machine body; wherein, the pre-stripping piece has a turning edge located on the conveying path; wherein, when the plurality of rollers drive the When the carrier sheet moves along the conveying path, two parts of the carrier sheet located on opposite sides of the turning edge respectively form a turning angle of less than 180 degrees, so that many parts adjacent to the turning edge are formed. Each of the film sheets passes through the turning edge at different time points and is separated from the carrier sheet one by one.

The embodiment of the present invention also discloses a pre-stripping machine, which includes: a machine body; a plurality of rollers, which are rotatably mounted on the machine body, and the plurality of the rollers jointly define a conveying path; and a pre-stripping piece fixed on the machine body, and the pre-stripping piece has a turning edge on the conveying path; wherein, a plurality of the rollers can be used for attaching a plurality of films A carrier sheet of the sheet moves along the conveying path, and the turning edge can be used to form a turning angle of less than 180 degrees between the two parts of the carrier sheet on opposite sides thereof, so that the adjacent The plurality of films of the turning edge pass through the turning edge at different time points and are separated from the carrier sheet one by one.

To sum up, in the film supply device and the pre-stripping machine disclosed in the embodiments of the present invention, the pre-stripping member can be provided with the turning edge, so that the plurality of membranes can be removed one by one. The carrier sheet is separated, thereby effectively improving its operation efficiency.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

The following are specific examples to illustrate the embodiments of the "film supply device and pre-stripping machine" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[Example 1]

Please refer to FIG. 1 to FIG. 7 , which are Embodiment 1 of the present invention. As shown in FIG. 1 , the present embodiment discloses a wafer lamination equipment 1000 , which includes a circulating workstation S and a plurality of devices D corresponding to the circulating workstation S. Wherein, the circulating workstation S is provided with a plurality of stations S' on an annular path, and the circulating workstation S includes a plurality of extractors S1 moving along the annular path, any one of which is The extractor S1 can pass through a plurality of the stations S' one by one along the circular path.

In this embodiment, the annular path is annular, the number of the extractors S1 is not less than the number of the stations S', and the extractors S1 can be respectively A plurality of the stations S' are operated synchronously, so as to improve the overall operation performance of the chip attaching apparatus 1000, but the present invention is not limited thereto.

In more detail, each of the stations S' is, for example, a work area, and a plurality of the stations S' have different but associated roles and different area areas from each other. Wherein, the multiple stations S' mentioned in this embodiment sequentially include a film taking station S100, a film alignment station S200, a lamination station S300, and a wafer confirmation station on the annular path. S400, a check station S500, a reject station S600, and a good product station S700, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the order of the plurality of stations S' can be adjusted according to requirements (eg, the order of the reject station S600 and the good station S700 are reversed) .

Furthermore, a plurality of the devices D in this embodiment include a film supply device 100 corresponding to the film taking station S100, a film alignment device 200 corresponding to the film alignment station S200, The position corresponds to a wafer pickup device 300 of the bonding station S300, the position corresponds to a wafer verification device 400 of the wafer verification station S400, the position corresponds to an inspection device 500 of the inspection station S500, and the position corresponds to A waste storage device 600 of the waste station S600 and a good product storage device 700 corresponding to the position of the good product station S700, but the present invention is not limited thereto.

For example, in other embodiments not shown in the present invention, some of the multiple stations S' (eg, the film alignment station S200, the wafer confirmation station S400, the inspection station S500) , the reject station S600, and the good product station S700) and its corresponding device D (eg: the film alignment device 200, the wafer confirmation device 400, the inspection device 500, the reject device The storage device 600 and the good product storage device 700) can be reduced according to design requirements; alternatively, the wafer attaching device 1000 can also add new sites and corresponding devices according to design requirements.

In order to facilitate the understanding of the specific operation of the wafer attaching apparatus 1000 in this embodiment, the function and purpose of each of the devices D and their corresponding stations S' will be described below, and a plurality of the extractors will be described below. The operation process of S1 is the same, so the drawings of this embodiment only describe the operation of one of the extractors S1, but the present invention is not limited thereto.

Wherein, as shown in FIG. 1 , the film supply device 100 can continuously supply the film 21 for capture by any of the capture devices S1; that is, the film capture station S100 passes through its position Corresponding to the film supply device 100 , any one of the extractors S1 for moving to the film taking station S100 can extract one of the film sheets 21 from the film supply device 100 .

Furthermore, as shown in FIGS. 2A and 2B , the film alignment device 200 is located downstream of the film supply device 100 , and the film alignment station S200 corresponds to the film alignment device 200 by its position, Any one of the extractors S1 for moving to the film alignment station S200 can use the film alignment device 200 to align the captured film 21 . More specifically, the film alignment device 200 in this embodiment may be a bottom camera for detecting the relative position between the capture device S1 and the captured film 21 , so as to facilitate the subsequent wafer bonding operation.

As shown in FIG. 3A to FIG. 3D , the wafer capture device 300 is located downstream of the film alignment device 200 (or the film supply device 100 ), and the wafer capture device 300 is used to capture a wafer C, and aligning the captured wafer C. Furthermore, the bonding station S300 corresponds to the wafer capture device 300 by its position, so that any one of the capturers S1 moved to the bonding station S300 can capture all the captured wafers. The film 21 is attached to the wafer C captured by the wafer capturing device 300 .

More specifically, the wafer extraction device 300 in this embodiment includes a wafer carrier 301 loaded with a plurality of the wafers C, a bonding seat 302 corresponding to the wafer carrier 301 , A transfer device 303 movably located between the wafer carrier 301 and the bonding seat 302 , and a top camera 304 corresponding to the bonding seat 302 . The transfer device 303 can transport one of the wafers C from the wafer carrier 301 to the bonding seat 302 , and the top camera 304 is used to detect the bonding seat 302 The relative position between the wafer C and the wafer C thereon, and the bonding seat 302 can be used to move the wafer C to the position below the extractor S1 of the bonding station S300.

In this embodiment, the abutment seat 302 includes two abutment parts 3021 corresponding to the transfer unit 303 and the extractor S1 respectively, and the transfer unit 303 can attach a The wafer C is disposed on one of the bonding portions 3021 . Wherein, when the bonding seat 302 rotates one of the bonding portions 3021 and the wafer C carried by it to below the extractor S1, the position of the other bonding portion 3021 corresponds to the position of the other bonding portion 3021. The transfer device 303 is used for the transfer device 303 to transfer another of the wafers C thereon, so as to improve the overall work efficiency of the wafer extraction device 300 .

Accordingly, the relative position between the extractor S1 and the diaphragm 21, and the relative position between the bonding seat 302 and the chip C have been accurately measured, so as to facilitate the The picker S1 can precisely fit the film 21 picked up by the picker S1 to a predetermined position of the wafer C in the bonding station S300 .

Furthermore, when any one of the extractors S1 passes through the lamination station S300, it can transport the extracted film 21 and the attached wafer C to the next station. S', so that the wafer attaching apparatus 1000 can quickly connect different stations S' (or different devices D) in series through the extractor S1, thereby effectively lifting the wafer The overall work efficiency of the lamination device 1000.

In other words, the extractor S1 can move through the film supply device 100 , the film alignment device 200 , and the wafer extracting device 300 in sequence; wherein, the extractor S1 can move through the film supply device 300 . The device 100 captures one of the film sheets 21 , and can use the film alignment device 200 to align the captured film sheet 21 , and can align the captured film sheet 21 The wafer C and the film 21 attached to each other can be transported (toward the subsequent station S') to be attached to the wafer C captured by the wafer extraction device 300 .

It should be noted that, the wafer attaching device 1000 may be downstream of the bonding station S300 or the wafer pickup device 300 , and the wafer C can be captured by the film 21 and the attached wafer C. The conveying function of the fetcher S1 is matched with the design requirements, and corresponding stations or devices can be selectively added accordingly, which is not limited to what is contained in this embodiment.

As shown in FIG. 4A and FIG. 4B , the wafer confirmation device 400 is located downstream of the wafer extraction device 300 in this embodiment, and when any of the extraction devices S1 passes through the bonding station S300 , which can transport the captured film 21 and the attached wafer C to the wafer confirmation station S400 , so as to pass the wafer confirmation device 400 to the wafer C attached to the film 21 . The wafer C is subjected to a wafer confirmation operation.

In more detail, the wafer verification device 400 may be a bottom-side optical detector in this embodiment, which is used to detect the wafer 21 attached to the diaphragm 21 through an automated optical inspection (Automated Optical Inspection, AOI) process. The position of the bottom side of the wafer C is detected, or whether the film 21 is actually attached to the wafer C (ie, the wafer confirmation operation), but the present invention is not limited to this. It should be noted that, during the detection process of the wafer verification device 400, the extractor S1 keeps extracting the film 21, and the film 21 keeps sticking to the wafer C, so as to facilitate the Promptly enter the next said station S' (or the next said device D).

As shown in FIGS. 5A to 5D , the inspection device 500 is located downstream of the wafer confirmation device 400 , and when any one of the extractors S1 passes through the wafer confirmation station S400 , it can transport the extracted The film 21 and the attached wafer C are sent to the inspection station S500 for performing an inspection operation of the film 21 and the attached wafer C by the inspection device 500 .

More specifically, the inspection device 500 in this embodiment includes an inspection base 501 and a top-side optical detector 502 corresponding to the inspection base 501 . Wherein, the position of the inspection base 501 is rotatably corresponding to the top-side optical detector 502 and the extractor S1 located at the inspection station S500, and the extractor S1 can extract the The diaphragm 21 and the attached wafer C are arranged on the inspection seat 501 .

When the inspection stand 501 rotates the wafer C and the diaphragm 21 it carries to be below the top-side optical detector 502, the top-side optical detector 502 can then pass the automatic optical inspection ( According to the AOI) process, the relative position detection (ie, the inspection operation) is performed by the wafer C and the top side of the diaphragm 21 . Furthermore, after the top sides of the wafer C and the diaphragm 21 pass the inspection operation, the inspection base 501 can rotate the wafer C and the diaphragm 21 that have passed the inspection operation to the desired position. Below the extractor S1, the extractor S1 extracts the film 21 and the attached chip C.

It should be noted that, during the inspection process performed by the inspection device 500, the diaphragm 21 and the wafer C are separated from the extractor S1 and placed in the inspection device 500, and the inspection ends. Afterwards, it is transported to the next station S' (or the next device D) by the extractor S1.

As shown in FIG. 6 and FIG. 7 , both the waste storage device 600 and the good product storage device 700 are located downstream of the inspection device 500 , and the good product storage device 700 is located in the waste product in this embodiment. downstream of the storage device 600, but the present invention is not limited thereto. Wherein, any one of the extractors S1 is selectively moved to one of the reject storage device 600 and the good product storage device 700 according to the determination results of the wafer verification operation and the inspection operation.

More specifically, as shown in FIG. 6 , when the film 21 captured by any of the capture devices S1 and the attached wafer C are in the process of the wafer confirmation operation or the inspection operation When it is determined to be unqualified, it can be transported to the waste station S600 for storage by the waste storage device 600 . Or, as shown in FIG. 7 , when the film 21 captured by any of the capture devices S1 and the attached wafer C are determined during the wafer confirmation operation and the inspection operation When it is qualified, it can be transported (by skipping the reject station S600 ) to the good product station S700 for storage by the good product storage device 700 .

In this embodiment, as shown in FIG. 6 , the waste storage device 600 is, for example, a waste tray, which is used for any of the extractors S1 moving to the waste station S600 to be able to extract the waste. The diaphragm 21 and the attached wafer C are arranged on it. Wherein, the waste tray can be moved, so that the waste tray part located under the extractor S1 can maintain enough space to accommodate the film 21 and the attached wafer. C.

Furthermore, as shown in FIG. 7 , the good product storage device 700 includes a plurality of loading elements 701 and a packaging module 702 corresponding to at least one of the loading elements. Wherein, a plurality of the loading parts 701 can pass through the good product station S700 one by one, so as to receive (from the extractor S1 located in the good product station S700 ) the diaphragms 21 judged to be qualified and stick them together In this embodiment, a plurality of the loading members 701 may be disposed on a turntable, so as to pass through the good product station S700 one by one through the rotation of the turntable. Furthermore, the packaging module 702 can receive the film 21 and the attached chip C one by one from the plurality of loading elements 701 .

[Example 2]

Please refer to FIG. 8 to FIG. 11 , which is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated. The structure of the membrane device 100 in this embodiment is roughly described as follows:

As shown in FIG. 8 and FIG. 9A , the film supply device 100 includes a machine body 1 , a material module 2 detachably erected on the machine body 1 , and rotatably installed on the machine A plurality of rollers 3 of the main body 1 and a pre-stripping member 4 fixed to the machine main body 1 . The machine body 1 , the plurality of rollers 3 , and the pre-stripping member 4 are collectively referred to as a pre-stripping machine 10 in this embodiment, and the pre-stripping machine 10 Although it is described as being matched with the material module 2, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the pre-stripping machine 10 can be used alone (eg, sold) or used in combination with other components.

A plurality of the rollers 3 together define a conveying path P, the material module 2 includes a carrier sheet 22 and a plurality of film sheets 21 attached to the carrier sheet 22, and the carrier sheet 22 Can move on the conveying path P (that is, a plurality of the rollers 3 can be used to move the carrier sheet 22 along the conveying path P), and the pre-stripping member 4 has a A turning edge 41 on the conveying path P.

Further, when a plurality of the rollers 3 drive the carrier sheet 22 to move along the conveying path P, the two parts 221 of the carrier sheet 22 located on opposite sides of the turning edge 41 respectively A turning angle α1 smaller than 180 degrees is formed (or in other words, the turning edge 41 can be used to form the turning angle α1 for the two parts 221 of the carrier sheet 22 ), so that the adjacent The plurality of film sheets 21 of the turning edge 41 pass through the turning edge 41 at different time points and are separated from the carrier sheet 22 one by one.

In this embodiment, the turning angle α1 is described as being less than 90 degrees (eg, 70 degrees to 85 degrees), but the present invention is not limited thereto. Furthermore, the film feeding device 100 is provided with the turning edge 41 on the pre-peeling member 4 , so as to facilitate the separation of the plurality of film sheets 21 from the carrier sheet 22 one by one, thereby effectively improving the operation thereof. efficiency, and can be further used to provide capture by any of the capture devices S1 moved to the film capture station S100, so as to improve the overall operation performance.

More specifically, the material module 2 includes a retractor 23 and a retractor 24 used in cooperation with each other in this embodiment, and both the retractor 23 and the retractor 24 are Installed on the machine body 1 . Wherein, the unwinder 23 is located at the starting point of the conveying path P, the carrier sheet 22 and a plurality of the film sheets 21 are wound around the unwinder 23, and the unwinder 23 is used for conveying The carrier sheet 22 and a plurality of the film sheets 21 are sent to the conveying path P. Furthermore, the retractor 24 is located at the end of the conveying path P, and the retractor 23 is used to retract the carrier sheet 22 that has moved past the turning edge 41 .

Further, as shown in FIG. 8 and FIG. 9A , the film supply device 100 (or the pre-stripping machine 10 ) in this embodiment may further include an image mounted on the machine body 1 A capture device 5, and the position of the image capture device 5 corresponds to the conveying path P and is located upstream of the turning edge 41, for capturing a plurality of the films 21 moving past the turning edge location before 41.

Furthermore, as shown in FIG. 8 to FIG. 9C , any one of the capturing devices S1 moves to the film capturing station S100 for capturing a film position of the film sheet 21 may remain unchanged, and all The machine body 1 includes a traverse mechanism 11 capable of moving the pre-stripping member 4 and at least part of the material module 2 . For example, the traverse mechanism 11 may be composed of a plurality of linear rails (eg, an XY axis slide table), so as to make the unwinder 23 , the carrier sheet 22 , and a plurality of the film sheets 21, and the pre-stripping member 4 can move on a plane.

In this embodiment, the plurality of diaphragms 21 separated from the carrier sheet 22 one by one through the turning edge 41 can be moved one by one according to the image capture device 5 through the traverse mechanism 11 . to the film removal position. Accordingly, the position information of the plurality of diaphragms 21 obtained by the traverse mechanism 11 through the image capture device 5 can not only effectively eliminate the arrangement of the plurality of diaphragms 21 on the carrier sheet 22 It helps to maintain the film capture position of any one of the extractors S1 unchanged, thereby significantly improving the efficiency of each extractor S1 in extracting the film 21 and precision.

In addition, in other embodiments not shown in the present invention, the position of the film captured by the film 21 by the capture device S1 can be changed according to the image capture device 5, so that the capture The picker S1 can be moved to just above the film sheet 21 that is separated from the carrier sheet 22 and to be picked up, so that the film supply device 100 does not need to be provided with the traverse mechanism 11 .

It should be noted that, in order to enable the plurality of film sheets 21 to be smoothly separated from the carrier sheet 22 one by one at the turning edge 41 , the plurality of film sheets 21 , the conveying path P, and the The corresponding relationship between the turning edges 41 preferably meets the following conditions, but the present invention is not limited thereto.

Wherein, a plurality of the film sheets 21 are arranged in multiple rows along an arrangement direction R that is not parallel to the conveying path P, and the turning edge 41 and the arrangement direction R form an acute angle α2. As shown in FIG. 9A , the arrangement direction R is perpendicular to the conveying path P, and the acute angle α2 is between 3 degrees and 30 degrees. Furthermore, the turning edge 41 is not perpendicular to the conveying path P, and the turning edge 41 and the conveying path P may form an included angle α3 between 45 degrees and 60 degrees.

It should be noted that the above-mentioned conditions satisfying the acute angle α2 and the included angle α3 may appear in FIG. 9A at the same time in this embodiment (for example, the acute angle α2 is 30 degrees, and the included angle α3 is 60 degrees) ), but the above-mentioned conditions satisfying the acute angle α2 and the included angle α3 may also appear in different embodiments, which are not limited in the present invention. For example, as shown in FIG. 10 , under the condition that the turning edge 41 is not perpendicular to the conveying path P, and that the included angle α3 is between 45 degrees and 60 degrees, the arrangement direction R may be non-perpendicular to the conveying path P. perpendicular to the conveying path P.

Furthermore, in the configuration shown in FIGS. 9A and 10 , the turning edge 41 is not perpendicular to the conveying path P, but the present invention is not limited thereto. For example, as shown in FIG. 11 , the arrangement direction R may be non-perpendicular to the conveying path P, and the acute angle α2 is preferably between 30 degrees and 45 degrees; under the above conditions, the The turning edge 41 may be perpendicular to the conveying path P. As shown in FIG.

Furthermore, the film supply device 100 (or the pre-stripping machine 10 ) may further include a tension adjustment mechanism 6 installed on the machine body 1 , and the position of the tension adjustment mechanism 6 corresponds to the position of the tension adjustment mechanism 6 . The conveying path P is located downstream of the turning edge 41 to maintain the same tension value of the two portions 221 of the carrier sheet 22 .

[Technical effects of the embodiments of the present invention]

To sum up, the wafer lamination equipment disclosed in the embodiments of the present invention is designed through the matching design of a plurality of the devices and the extractor, so that the extractor can convey the film and attach the film at the same time. The said chip can quickly connect different said devices in series, thereby effectively improving the overall work efficiency.

Furthermore, through the relative position between the extractor and the film, and the relative position between the bonding seat and the wafer, both in the film alignment station and the film attaching station It is accurately measured, so that the extractor can accurately attach the captured film to the predetermined position of the wafer in the attaching station.

In addition, in the film supply device and the pre-peeling machine disclosed in the embodiments of the present invention, the pre-peeling member can be provided with the turning edge, so that the plurality of film sheets can be separated from the carrier sheet one by one. separation, thereby effectively improving its operational efficiency, and can be further used to provide a capture device for capture.

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

1000: Wafer Lamination Equipment D: device 100: Film supply device 10: Pre-stripping machine 1: Machine body 11: Traverse mechanism 2: Material module 21: Diaphragm 22: Carrier sheet 221: Parts 23: Rewinder 24: Retractor 3: Roller 4: Pre-stripped pieces 41: Turning Edges 5: Image grabber 6: Tension adjustment mechanism 200: Membrane alignment device 300: Chip Capture Device 301: Wafer carrier 302: Fitting seat 3021: Fitting Department 303:Transfer 304: Top Camera 400: Wafer Confirmation Device 500: Inspection device 501: Inspection Seat 502: Topside Optical Detector 600: Waste storage device 700: Good product storage device 701: Loading Piece 702: Packaging Module S: Circulation workstation S1: Fetcher S': site S100: Film removal station S200: Film Alignment Station S300: Fitting Station S400: Wafer Confirmation Station S500: Checkpoint S600: Scrap Station S700: Liangpin Station C: wafer P: conveying path R: Arrangement direction α1: turning angle α2: acute angle α3: included angle

FIG. 1 is a schematic top view of a wafer lamination device according to Embodiment 1 of the present invention.

FIG. 2A is a schematic diagram of subsequent operations in FIG. 1 .

FIG. 2B is a schematic side view of the wafer lamination equipment at the film alignment station.

FIG. 3A is a schematic diagram of subsequent operations of FIG. 2A .

FIG. 3B is a schematic side view (1) of the wafer sticking equipment at the bonding station.

FIG. 3C is a schematic side view (2) of the wafer sticking equipment at the bonding station.

FIG. 3D is a schematic side view (3) of the wafer sticking equipment at the bonding station.

FIG. 4A is a schematic diagram of subsequent operations of FIG. 3A .

FIG. 4B is a schematic side view of the wafer sticking equipment at the wafer verification station.

FIG. 5A is a schematic diagram of subsequent operations of FIG. 4A .

FIG. 5B is a schematic side view (1) of the wafer sticking equipment at the inspection station.

FIG. 5C is a schematic side view (2) of the wafer sticking equipment at the inspection station.

FIG. 5D is a schematic side view (3) of the wafer sticking equipment at the inspection station.

FIG. 6 is a schematic diagram of subsequent operations of FIG. 5A .

FIG. 7 is a schematic diagram of subsequent operations of FIG. 5A .

FIG. 8 is a schematic diagram of the wafer lamination device according to the second embodiment of the present invention corresponding to the film taking station.

FIG. 9A is a partial top schematic view of FIG. 8 .

FIG. 9B is a schematic diagram of subsequent operations of FIG. 9A .

FIG. 9C is a schematic diagram of subsequent operations of FIG. 9B .

FIG. 10 is a schematic diagram of another aspect of FIG. 9A .

FIG. 11 is a schematic diagram of another aspect of FIG. 9A .

100: Film supply device

10: Pre-stripping machine

1: Machine body

11: Traverse mechanism

2: Material module

21: Diaphragm

22: Carrier sheet

221: Parts

23: Rewinder

24: Retractor

3: Roller

4: Pre-stripped pieces

5: Image grabber

6: Tension adjustment mechanism

S1: Fetcher

S100: Film removal station

P: conveying path

α1: turning angle

Claims (11)

A film supply device, comprising: a machine body; A material module module is detachably erected on the machine body; wherein, the material module module includes a carrier sheet and a plurality of diaphragms attached to the carrier sheet; a plurality of rollers, rotatably mounted on the machine body, and a plurality of the rollers together define a conveying path; wherein, the carrier sheet can move on the conveying path; and a pre-stripping piece fixed on the machine body; wherein, the pre-stripping piece has a turning edge on the conveying path; Wherein, when a plurality of the rollers drive the carrier sheet to move along the conveying path, two parts of the carrier sheet respectively located on opposite sides of the turning edge are formed with a rotation of less than 180 degrees. The angle is folded, so that a plurality of the membrane sheets adjacent to the turning edge pass through the turning edge at different time points and separate from the carrier sheet one by one. The film supply device according to claim 1, wherein a plurality of the film sheets are arranged in a plurality of rows along an arrangement direction that is not parallel to the conveying path, and the turning edge and the arrangement direction form an acute angle . The film supply device according to claim 2, wherein the arrangement direction is perpendicular to the conveying path, and the acute angle is between 3 degrees and 30 degrees. The film supply device according to claim 2, wherein the arrangement direction is not perpendicular to the conveying path, and the acute angle is between 30 degrees and 45 degrees. The film supply device according to claim 2, wherein the turning edge is not perpendicular to the conveying path, and the turning edge and the conveying path form an included angle ranging from 45 degrees to 60 degrees. The film supply device according to claim 1, wherein the film supply device includes an image capture device mounted on the machine body, and the position of the image capture device corresponds to the conveying path and It is located upstream of the turning edge, and is used to capture a plurality of positions of the diaphragms before moving past the turning edge. The film supply device according to claim 6, wherein the machine body includes a traverse mechanism capable of moving the pre-stripping member and at least part of the material module; A plurality of the film sheets separated from the carrier sheet one by one can be moved to the film taking position one by one according to the image capture device through the traversing mechanism. The film supply device according to claim 1, wherein the film supply device includes a tension adjustment mechanism mounted on the machine body, and the tension adjustment mechanism is located in a position corresponding to the conveying path and located at the position of the tension adjustment mechanism. downstream of the turning edge, so as to maintain the same tension value of the two parts of the carrier sheet. The film supply device according to claim 1, wherein the material module comprises: an unwinder installed on the machine body and located at the starting point of the conveying path, the carrier sheet and a plurality of the film sheets are wound on the unwinder, and the unwinder is used to transport the the carrier sheet and a plurality of the film sheets to the conveying path; and A retractor is installed on the machine body and is located at the end of the conveying path, and the retractor is used for retracting the carrier sheet that moves past the turning edge. A pre-stripping machine, comprising: a machine body; a plurality of rollers, rotatably mounted on the machine body and a plurality of the rollers together define a conveying path; and a pre-stripping piece fixed on the machine body, and the pre-stripping piece has a turning edge on the conveying path; Wherein, a plurality of the rollers can be used to move a carrier sheet attached with a plurality of film sheets along the conveying path, and the turning edge can be used to make the carrier sheet on opposite sides thereof move The two parts of the inflection edge are formed with a turning angle less than 180 degrees, so that a plurality of the membrane sheets adjacent to the turning edge pass through the turning edge at different time points and separate from the carrier sheet one by one. The pre-stripping machine of claim 10, wherein the turning edge is not perpendicular to the conveying path, and the turning edge and the conveying path form an included angle ranging from 45 degrees to 60 degrees.

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