WO2016084407A1

WO2016084407A1 - Sorting device

Info

Publication number: WO2016084407A1
Application number: PCT/JP2015/064561
Authority: WO
Inventors: 日出夫南
Original assignee: 上野精機株式会社
Priority date: 2014-11-28
Filing date: 2015-05-21
Publication date: 2016-06-02
Also published as: JP2016103574A; JP5892669B1

Abstract

Provided is a sorting device that sorts two ranks of chips onto two wafer sheets, and that efficiently attaches the chips at the correct position. This sorting device has: a support device 100 that supports a wafer sheet Da to which a wafer W is attached; a holding device 200 that selectively picks up, on the basis of rank, chips S that have been separated from each other by expansion of the wafer sheet Da; transport devices 300 that transport the chips S; measurement devices 400 that measure deviation in the posture of the chips S; a correction device 500 that corrects the posture of the chips S; a first collection device 600 that supports a wafer sheet Db to which chips S of a first type of rank are attached; a second collection device 700 that supports a wafer sheet Dc to which chips S of another type of rank are attached; a holding device 200 that attaches the chips S, divided into the ranks, to the wafer sheets Db, Dc; and an auto-loader 5A that sequentially replaces the wafer sheet Da after all of the two types of ranks of chips S have been picked up from the wafer sheet Da.

Description

Classification device

The present invention relates to a classification apparatus that selectively picks up individual chips from a wafer attached to a wafer sheet.

In the semiconductor manufacturing process, a wafer pasting process and a dicing process are performed. The wafer sticking step is a step of sticking the wafer before being cut into individual pieces to a wafer sheet having adhesiveness on the surface and sticking it to the ring. The dicing process is a process of dividing the wafer attached to the wafer sheet into individual semiconductor elements by cutting. Such individual semiconductor elements are hereinafter referred to as chips.

Each chip included in the wafer is subjected to a probe inspection in which electrical characteristics are inspected by a stylus in advance, and the control device holds information regarding the non-defective and defective products of each chip and the position thereof. ing. Information obtained by such probe inspection is called map data.

In addition, for each chip, an appearance inspection based on an image captured by an imaging unit such as a camera may be performed. When an appearance inspection is performed in addition to the probe inspection, a combination of the probe inspection result and the appearance inspection result may be referred to as map data.

Based on such map data, the pick-up device picks up only non-defective chips and performs the attaching process, mounting process or taping process. The pasting step is a step of pasting non-defective chips picked up by the pick-up device to the stretched wafer sheet by the pasting device in order to manage and ship in units of wafer sheets.

The mounting process is a process of picking up individual chips in order and bonding them to a lead frame or a substrate. The taping step is a step of sticking the picked-up chip to the tape.

JP 2006-13012 A

In the case of an apparatus that replaces a non-defective chip picked up from a wafer sheet with a wafer sheet, the wafer sheet from which the non-defective chip is picked up is stretched so as to be easily picked up. Further, the wafer sheet to which the non-defective chip is attached is also stretched so as to be easily attached. Such stretching is called expanding. The affixing device affixes chips to the expanded wafer sheet at regular intervals.

In general, an apparatus for performing such replacement is provided with one unit for holding a wafer sheet, one on the pickup side and one on the attachment side. That is, there is a one-to-one relationship between the wafer sheet on the pickup side and the attachment side. An apparatus has also been proposed in which processing is speeded up by attaching chips to a plurality of wafer sheets in parallel. However, in this case as well, a plurality of one-to-one pairs on the pickup side and the pasting side are provided.

The inspection result of each chip includes rank information indicating the degree of quality, not just two types of information, that is, non-defective or defective. When the pickup side and the pasting side are one-to-one devices as described above, a chip of a specific rank is obtained by picking up and pasting any one type of chips based on the rank information. Can be collected.

However, when it is desired to collect chips having different ranks for each wafer sheet, the following problems arise.
(1) If there is no chip of the rank from the wafer sheet picking up a chip of one specific type, it is necessary to replace the wafer sheet. Further, when the wafer sheet on the pasting side is filled with a specific type of rank of chips, it is necessary to replace the pasting side with a new wafer sheet.

Then, after the collection of chips of a specific one type of rank is completed, when a chip of another type of rank is pasted, the pasting side is replaced with a new wafer sheet, and the pickup side is A specific one type of rank chip has been picked up, but another one type of rank chip needs to be replaced with a remaining wafer sheet. That is, every time the rank of the chip to be picked up is changed, the wafer sheet needs to be exchanged, and the exchange frequency increases and it takes time, so the processing efficiency is poor.

In order to deal with this, a plurality of one-to-one replacement devices on the pickup side and the attachment side are provided, and in parallel with the replacement of a specific one-type rank chip, another one-type rank chip is attached. It is also possible to make a replacement. However, in this case, the apparatus becomes large as a whole, and the arrangement space may be limited depending on the type of the conveying apparatus that conveys the chip from the pickup side to the affixing side, which may make installation difficult. . For example, when using a conveyor device by rotation, it is difficult to arrange each processing device so that there is no interference around the conveyor device. Even if it can be arranged, a processing device having another function is added. I can't.

(2) In addition, the wafer sheet needs to be expanded for pick-up and pasting. Since expansion and contraction are repeated for replacement, it is preferable to reduce the number of replacements from the viewpoint of pick-up and pasting accuracy. In particular, it is desirable not to replace the wafer sheet on the pasting side until the wafer sheet is full in order to prevent misalignment due to expansion and contraction. For this reason, when the pickup side and the pasting side are one-to-one devices, the pick-up side picks up chips with different ranks, exchanges them before the pasting side is full, and collects chips with different ranks for each wafer sheet. I could n’t.

(3) Further, since the posture of the chip picked up from the expanding / contracting wafer sheet is not constant, when pasted on the wafer sheet in the picked-up posture, the posture of the stuck chip may not be aligned.

The present invention has been proposed in order to solve the above-described problems of the prior art, and the purpose thereof is to classify the two rank chips into two wafer sheets and efficiently place them in an accurate position. It is to provide a classification device to be pasted.

In order to achieve the above object, the classification device of the present invention has the following configuration.
(1) A wafer in which chips having different ranks indicating the degree of quality are mixed is affixed and a wafer sheet in which the chips are separated into pieces by dicing is supported, and the wafer sheet supported by the support apparatus is extended. A pickup device that selectively picks up the chips separated by the rank based on the rank, a transfer device that transfers the chips picked up by the pickup device in a transfer path of a circular orbit, and the transfer device A measuring device that measures the posture deviation of the chip to be corrected, a correction device that is disposed in the vicinity of the conveyance path and corrects the posture of the chip based on the posture deviation measured by the measurement device; and Of the chips that are arranged in the wake of the correction device in the vicinity and whose posture is corrected by the correction device, 1 A first collecting device that supports a wafer sheet to which a chip of a rank of affixed is attached, and a chip that is disposed downstream of the first collecting device in the vicinity of the transfer path and whose posture is corrected by the correcting device Among the above, the second collection device that supports the wafer sheet to which the other one type of chip is attached, and the chips conveyed by the conveyance device are the wafer sheet of the first collection device and the second collection device. The wafer sheet of the collecting device is attached to the wafer sheet in a corresponding rank and the wafer sheet of the support device is picked up after all of the two rank chips are picked up from the wafer sheet of the support device. And an exchange device for sequentially exchanging the wafer sheets before picking up.

(2) The two types of ranks may be the two types of ranks having the largest number in the number distribution of chips in the same wafer by rank.

(3) The transport device transports the chip in an intermittent operation with a predetermined pitch, and the sticking device is in the intermittent operation in a state where the number of the specific one rank and the other one rank is the same. At the stop timing, a chip may be attached to either the wafer sheet of the first collection device or the wafer sheet of the second collection device.

(4) The pickup device and the sticking device are holding devices that hold a tip at a tip, the transport device includes a rotating body that rotates intermittently at a predetermined pitch, and a plurality of the holding devices are configured to rotate the rotation device. The plurality of holding devices provided on the body may be arranged at positions where tips are aligned at equal intervals corresponding to the predetermined pitch on the transport path.

(5) A holding device that comes to a position corresponding to the first collecting device and a holding device that comes to a position corresponding to the second collecting device simultaneously hold chips of the same rank in the pickup. Also good.

(6) a coordinate detection unit that detects position coordinates of a wafer sheet of the first collection device and a chip attached to the wafer sheet of the second collection device, the first collection device, and the second collection device The collection device may adjust the chip attachment position based on the coordinates of the attached chip detected by the coordinate detection unit.

(7) The measurement device includes a pre-measurement unit that measures a posture deviation of the chip upstream of the correction device in the transport path and a post-measurement unit that measures a posture shift of the chip downstream of the correction device in the transport path. The correction device corrects the posture of the chip based on the posture deviation measured by the pre-measurement unit, and the first collection device and the second collection device are configured to perform the post-measurement. The posture of the chip may be corrected based on the posture deviation measured by the unit.

(8) An imaging unit that captures an image of a chip divided into individual pieces while moving relative to the wafer sheet based on coordinate data by extending the wafer sheet supported by the support device; Based on the image data captured by the unit, a reference chip with a specific mark is found among the chips in the wafer, and the coordinate data of the reference chip is determined based on the coordinate data for the relative movement of the imaging unit. An image obtained by capturing each chip while the image capturing unit moves relative to the wafer sheet based on the reference detection unit that performs the reference detection process to be identified, and the reference chip coordinate data and the relative position information of each chip in the wafer. Identify the coordinate data of each chip based on the data and the coordinate data for relative movement of the imaging unit A scanning unit that performs a scanning process, and the pickup device moves relative to the wafer sheet based on the coordinate data of each chip specified by the scanning unit and the rank information of each chip. However, the chip may be selectively picked up.

According to the present invention, the posture of the chip is corrected by the correction device after the pickup and before the attachment, and the two rank chips are attached to the wafer sheet of the first collection device and the wafer sheet of the second collection device. Therefore, two different ranks of chips can be accurately attached in parallel to the two wafer sheets without exchanging the wafer sheet on the attachment side. Further, by exchanging the wafer sheet on the pickup side until one of the two wafer sheets is full, it is not necessary to replace the two wafer sheets during the pasting.

The simplified top view which shows the structure of the classification device used for 1st Embodiment The side view which shows the support apparatus in embodiment The top view which shows the structure of the ring in embodiment, and the wafer sheet affixed on this Simplified side view showing an autoloader in an embodiment A side view (a) and a top view (b) of a correction device in an embodiment are shown. A side view showing the 1st collection device and the 2nd collection device in an embodiment The block diagram which shows the structure of the control apparatus in embodiment The flowchart which shows the whole process of embodiment Explanatory drawing which shows the whole process of embodiment A flowchart showing batch scan processing of an embodiment Explanatory drawing which shows the positioning process to the target chip | tip of embodiment Explanatory drawing which shows the area | region of the scanning process of embodiment Explanatory diagram showing the number distribution of chips by rank Explanatory drawing which shows the order of the rank of the chip which a holding device picks up and affixes Explanatory drawing which shows the order of the rank of the chip which a holding device picks up and affixes Explanatory drawing which shows the order of the rank of the chip which a holding device picks up and affixes Explanatory drawing which shows the order of the rank of the chip which a holding device picks up and affixes Simplified side view showing another embodiment in which the pickup device and the sticking device are separated. Simplified side view showing another embodiment in which the pickup device and the sticking device are separated.

Embodiments of the present invention will be described with reference to the drawings.
1. First Embodiment This embodiment is a classification device that classifies chips picked up from wafer sheets and ranks them on two wafer sheets. This embodiment can also be regarded as a transfer device for transferring chips from a wafer sheet to a wafer sheet.
[A. Chip]
The chip applied to the present embodiment is a component used for an electrical product, and examples thereof include a semiconductor element and a resistor or capacitor other than the semiconductor element. Examples of the semiconductor element include discrete semiconductors such as transistors, diodes, LEDs, capacitors, and thyristors, and integrated circuits such as ICs and LSIs.

[B. data]
Next, various data used in this embodiment are as follows.
[1. Map data]
The map data includes chip discrimination information and chip position information. The chip distinction information is information that distinguishes the chips according to a predetermined standard. This distinction information includes rank information obtained by classifying chips in accordance with the degree of quality of the chips obtained by a quality inspection performed in advance in the previous process. This rank is divided into a plurality of grades. The quality inspection includes at least one of a probe inspection and an appearance inspection.

Further, the discrimination information includes information for discriminating between a chip to be a product (product chip) and other chips. In particular, the distinction information of the present embodiment includes information indicating that it is a reference chip. The reference chip is a chip with a mark (reference mark) that can be identified from the appearance in order to be a reference for the position of the product chip on the wafer. In addition, the reference chip should just be provided with the aspect which can be identified from an external appearance.

Further, the chip position information is relative position information in the row direction and the column direction of each chip viewed from the reference point on the wafer.

Specifically, the map data includes information indicating which row and column each chip hits, information indicating which rank of A to D, etc. if it is a product chip, and a reference chip. It can be expressed as raster data consisting of the indicated information.

Furthermore, in the map data, an area in which each reference chip guarantees the position of the chip on the wafer is set. That is, the entire area of the wafer is divided into a plurality of guaranteed areas, and a reference chip is set for each guaranteed area. The position of each reference chip can be used as a reference for the position of the chip in the guaranteed area to which each reference chip belongs.

[2. Coordinate data]
The coordinate data is position information of each chip when a wafer sheet is set in the apparatus. In the present embodiment, an imaging unit, a pickup device, etc., which will be described later, are positioned based on this coordinate data. The imaging unit and the pickup device may be moved relative to the wafer. In this embodiment, as will be described later, this relative movement is realized by moving a ring moving mechanism in which a wafer ring to which a wafer sheet is attached is set. The coordinate data can be acquired as coordinate values (x, y, θ) of encoder information of the ring moving mechanism described later.

[C. Classification device]
Next, the classification device 1 of the present embodiment will be described with reference to FIGS. As shown in FIGS. 1 and 7, the classification device 1 includes a support device 100, an autoloader 5A, a holding device 200, a transport device 300, a measurement device 400, a correction device 500, a first collection device 600, an autoloader 5B, and a second device. Collecting device 700, autoloader 5C and control device 800.

[1. Support device]
The support device 100 is a device that supports a wafer sheet Da to which a wafer W in which chips S having different ranks indicating quality levels are mixed is attached and the chips S are separated into individual pieces by dicing. As shown in FIG. 2, the support device 100 includes a ring moving mechanism 2A, an expanding mechanism 3A, and a separating mechanism 4A.

(Ring moving mechanism)
The ring moving mechanism 2A is a device that moves the wafer ring Ra mounted on the ring holder 21 in a predetermined direction.

The wafer ring Ra is a plate-like member that holds and holds the wafer sheet Da so that a circular hole formed inside is covered as shown in FIG. A wafer W is attached to the wafer sheet Da. The wafer W is cut into a plurality of chips S by dicing.

The ring moving mechanism 2A is provided so that the ring holder 21 can be positioned in the X-axis direction and the Y-axis direction along a guide rail (not shown). The ring moving mechanism 2A is provided so that the ring holder 21 can be positioned in the θ direction by a belt, a pulley, and the like that transmit a driving force of a motor (not shown).

(Expanding mechanism)
The expanding mechanism 3A is a mechanism that creates a gap between the individual chips S by extending the wafer sheet Da. The expanding mechanism 3 A has a cylindrical tensile portion 31. The tension portion 31 is configured to stretch the wafer sheet Da as follows. First, one end of the cylinder of the tension portion 31 is pressed against the opposite side of the wafer W on the wafer sheet Da from the back of the wafer ring Ra.

Then, the pulling portion 31 moves so as to protrude to the front side of the wafer ring Ra with the wafer sheet Da interposed between the outer periphery thereof and the inner periphery of the circular hole of the wafer ring Ra. As a result, the wafer sheet Da is stretched by a force in a direction from the inside to the outside of the circle surrounding the wafer W. In order to realize such an operation, the tension portion 31 is provided so as to be able to advance and retreat by a cylinder or the like (not shown).

(Separation mechanism)
The separation mechanism 4A is a device that separates the chips S from the wafer sheet Da. The separation mechanism 4A has pins 41a facing the chip S with the wafer sheet Da interposed therebetween. This pin 41a is provided so as to be movable in a direction in which the tip S that has come to the opposite position is pressed via the wafer sheet Da by the tip as the ring moving mechanism 2A moves.

[2. Autoloader 5A]
The autoloader 5 A is an exchange device that exchanges the wafer sheet Da in the support device 100. In the present embodiment, the autoloader 5A, after all the two types of chips S are picked up from the wafer sheet Da, the picked-up wafer sheet Da is used as the wafer sheet Da from which the two types of chips S are not picked up. Replace sequentially. More specifically, the autoloader 5A stores a plurality of wafer rings Ra holding the wafer sheet Da to which the wafer W is attached in a cassette, and attaches and removes the wafer ring Ra to and from the ring moving mechanism 2A. The autoloader 5A includes, for example, a housing part 110 and a ring transport mechanism 120 as shown in FIG.

(Container)
The accommodating part 110 is an apparatus that accommodates a plurality of wafer rings Ra. The accommodating part 110 is arrange | positioned on the opposite side to the sticking surface of the chip | tip S in the wafer sheet Da set to 2 A of ring moving mechanisms. The accommodating part 110 has the supply magazine 111 and the raising / lowering apparatus which is not shown in figure.

The supply magazine 111 stores a plurality of horizontal wafer rings Ra stacked between a pair of side walls. The plurality of wafer rings Ra are supported at intervals in the vertical direction by guides provided on the side walls.

The lifting device is a mechanism that lifts and lowers the supply magazine 111. For example, it can be constituted by a vertical ball screw rotated by a drive source, a vertical guide rail, or the like.

In the supply magazine 111, the storage position of the wafer ring Ra at a desired level is positioned at the loading / unloading position by the lifting device. The number of wafer rings Ra that can be stored in the supply magazine 111 can be about 10 to 20, but is not limited to a specific number.

(Ring transport mechanism)
The ring transport mechanism 120 is a device that takes out the wafer ring Ra accommodated in the accommodating portion 110, transfers it to the ring moving mechanism 2A, receives the wafer ring Ra from the ring moving mechanism 2A, and returns it to the accommodating portion 110. As shown in FIG. 4, the ring transport mechanism 120 moves the wafer ring Ra in and out of the supply magazine 111 at the loading / unloading position of the storage unit 110.

More specifically, the ring transport mechanism 120 slides and removes the wafer ring Ra from the supply magazine 111 and accommodates the wafer ring Ra in the supply magazine 111 by sliding it horizontally. Further, the ring transport mechanism 120 supplies the wafer ring Ra to the link moving mechanism 2A by vertically inserting the wafer ring Ra into the opening from below, and takes out the wafer ring Ra from the ring moving mechanism 2A by vertically sliding the wafer ring Ra.

For this reason, the ring transport mechanism 120 has a clamp 121 and a fork 122. A pair of clamps 121 are provided corresponding to two opposite edges of the wafer ring Ra. The fork 122 is a member provided on each clamp 121 and having two teeth arranged in parallel. The clamp 121 clamps and releases the wafer ring Ra by moving the fork 122 closer to and away from the fork 122.

Although not shown, the ring transport mechanism 120 has a rotation mechanism that displaces the clamp 121 between a horizontal direction facing the supply magazine 111 and a vertical position facing the ring moving mechanism 2A. Although not shown, the ring transport mechanism 120 includes an advance / retreat mechanism that advances and retracts the clamp 121 toward the supply magazine 111 and advances and retracts toward the ring moving mechanism 2A.

When the clamp 121 is in the horizontal direction, one end of the clamp 121 is opposed to the carry-in / carry-out position of the storage unit 110. When the clamp 121 is in the vertical direction, one end of the clamp 121 faces the ring moving mechanism 2A.

[3. Holding device]
The holding device 200 is a device that holds the chip S at the tip. The holding device 200 is a pickup device that selectively picks up the chips S divided into individual pieces based on the ranks when the wafer sheet supported by the support device 100 is stretched. In addition, the holding device 200 attaches the chips S transferred by the transfer device 300 to the wafer sheet Db of the first collection device 600 and the wafer sheet Dc of the second collection device 700, which will be described later, in a rank. Device. That is, the holding device 200 is a device having functions of both a pickup device and a sticking device.

The holding device 200 has a suction nozzle 210, for example. The suction nozzle 210 is a hollow cylinder having an opening at the tip of the nozzle, the tip of the nozzle is directed outward in the radial direction of the table, and the inside of the nozzle communicates with a pneumatic circuit of a vacuum generator via a tube. The suction nozzle 210 sucks the chip S by generating a negative pressure by a vacuum generator, and detaches the chip S by generating a vacuum or generating a positive pressure.

Also, the holding device 200 includes

imaging units

60a, 60b, and 60c as shown in FIGS. The imaging unit 60a is a mechanism that captures images of the wafer sheet Da and the chip S of the support device 100 as illustrated in FIG. The imaging unit 60a includes a camera 61a and an optical system member 62a. The camera 61a is an apparatus that images the chip S on the wafer sheet Da and outputs image data. The optical system member 62a is a prism that changes the direction of the optical axis so that an image of one surface of the chip S on the wafer sheet Da is guided to the camera 61a.

The imaging unit 60b is a mechanism that captures images of the wafer sheet Db and the chip S of the first collection device 600, which will be described later, as shown in FIG. The imaging unit 60b includes a camera 61b and an optical system member 62b. The camera 61b is a device that images the chip S on the wafer sheet Db and outputs image data. The optical system member 62b is a prism that changes the direction of the optical axis so as to guide the image of the wafer sheet Db to the camera 61b.

The imaging unit 60c is a mechanism that captures images of the wafer sheet Dc and the chip S of the second collection device 700 described later, as shown in FIG. The imaging unit 60c includes a camera 61c and an optical system member 62c. The camera 61c is a device that images the chip S on the wafer sheet Dc and outputs image data. The optical system member 62c is a prism that changes the direction of the optical axis so as to guide the image of the wafer sheet Dc to the camera 61c.

[4. Transport device]
The transport device 300 is a device that transports the chip S picked up by the holding device 200 on a transport path T of a circular orbit.

The transport apparatus 300 includes a rotating body 310. The rotating body 310 is a member that intermittently rotates at a predetermined pitch. The rotating body 310 has a shape such as a disk or a star that expands radially around one point. The rotating body 310 is arranged in the horizontal direction, and the radiation center is supported by a rotating shaft of a motor (not shown). This motor is controlled to rotate the rotating body 310 intermittently.

A plurality of holding devices 200 are provided on the rotating body 310. The holding device 200 is disposed at a position where the tips are aligned on the transport path T at regular intervals corresponding to a predetermined pitch. A plurality of holding devices 200 are provided at the same distance from the circumferentially spaced position formed by the rotation of the rotating body 310 and the radial center of the rotating body 310. The tips of the plurality of holding devices 200 protrude outward and are arranged at equal intervals on a circular orbit conveyance path T that follows as the rotating body 310 rotates.

The conveyance path T is a circular orbit followed by the tip of the holding device 200 that intermittently rotates with the rotating body 310 by a predetermined angle. That is, the chip S moves along the circular orbit by rotating the rotating body 310 while holding the chip S by the holding device 200. The pitch of the intermittent rotation of the rotating body 310 is equal to the arrangement interval of the holding device 200. The plurality of holding devices 200 follow a common movement track and sequentially stop at a common stop position.

The rotating body 310 and the holding device 200 as described above are configured as a rotary pickup. The holding device 200 can advance and retract along the radial direction of the rotating body 310, in other words, along a line extending outward from the center of the rotating body 310. Further, an advance / retreat drive device (not shown) that gives a propelling force to advance and retreat with respect to the holding device 200 is arranged at several stop points of the holding device 200. Some stop points are the pickup point K shown in FIG. 2 and the pasting points N1 and N2 shown in FIG.

The holding device 200 stopped at the pickup point K faces the surface of the wafer sheet Da of the first support device 100 so that the advancing and retreating directions are orthogonal to each other. Then, the tip S positioned at the tip of the holding device 200 by the ring moving mechanism 2 A and pushed out by the separation mechanism 4 A becomes the suction target of the suction nozzle 210. On the other hand, the holding device 200 stopped at the pasting points N1 and N2 is opposed to the surfaces of wafer sheets Db and Dc, which will be described later, so that the advancing and retreating directions are perpendicular to each other. And the location of wafer sheet Db, Dc positioned at the front-end | tip of the holding | maintenance apparatus 200 by the

ring moving mechanism

2B, 2C mentioned later becomes an attachment location of the chip S.

[5. Measuring device]
The measuring device 400 is a device that measures the posture deviation of the chip S conveyed by the conveying device 300. As illustrated in FIG. 1, the measurement device 400 includes a front measurement unit 40A and a rear measurement unit 40B. The pre-measurement unit 40A is a component that measures the positional deviation of the chip S upstream of the correction device 500 in the transport path T. The post-measurement unit 40B is a component that measures the posture deviation of the chip S downstream of the correction device 500 in the transport path T. The upstream is the side that passes first in the conveying direction of the chip S indicated by the arrow in FIG. 1, and the downstream is the side that passes later.

The pre-measurement unit 40A and the post-measurement unit 40B take an image of the chip S held by the holding device 200, and perform image processing to generate a position shift of the chip S, that is, a position shift represented by the XY axis direction and a direction shift represented by the θ axis rotation. To detect. That is, the pre-measurement unit 40A and the post-measurement unit 40B include an imaging device that captures an image of the chip S and an arithmetic device that detects an orientation shift of the chip S by image processing. The posture includes a position and a direction.

The attitude shift is a positional shift and a direction shift from the holding reference point in the holding device 200. The reference point is, for example, the center point of the suction region of the suction nozzle 210. The XY axis direction refers to the direction in which the suction surface of the chip S expands. The detection result of the measuring device 400 is output as information indicating the amount of positional deviation of the chip S in the X-axis direction, the amount of positional deviation in the Y-axis direction, and the amount of positional deviation in the θ-axis direction. A direction orthogonal to the suction surface of the chip S is referred to as a Z-axis direction. As described above, the holding device 200 that moves forward and backward in the radial direction of the rotating body 310 moves the tip S forward and backward in the Z-axis direction.

The pre-measurement unit 40A performs the above measurement at the stop position on the upstream side of the correction device 500 in the transport path T before correction by the correction device 500. The post-measurement unit 40B performs the above measurement on the downstream side of the correction device 500 in the transport path T, after correction by the correction device 500, and before collection by the first collection device 600 and the second collection device 700.

[6. Correction device]
The correction device 500 is a device that is disposed in the vicinity of the transport path T and corrects the posture of the chip S based on the posture deviation measured by the measurement device 400. The correction device 500 refers to the information on the positional deviation amount and the direction deviation amount, and moves the chip S in the XY-axis direction and rotates it around the θ axis so as to eliminate the positional deviation of the chip S. Thus, the posture of the chip S is corrected.

FIG. 5 shows a detailed configuration of the correction device 500. 5A is a side view and FIG. 5B is a plan view. The correction device 500 includes a collet 51 and a gantry 52 provided on the base B. The base B is set up in the vertical direction on the classification device 1. The gantry 52 is equipped with a Z-axis moving mechanism 55 that moves the collet 51 in the Z-axis direction. The collet 51 is mounted on the gantry 52 via the Z-axis moving mechanism 55.

The gantry 52 includes an X-axis moving mechanism 53 and a Y-axis moving mechanism 54 configured by sliders that slide on the rail, and is movable in the X-axis and Y-axis directions. Further, the gantry 52 is equipped with a θ-axis rotating mechanism 56 that rotates the collet 51 around the θ-axis by a belt drive.

The collet 51 is a substantially cone formed of rubber or metal. The vertex of the collet 51 is a flat surface. The chip S is placed on the flat surface of the collet 51. The collet 51 is formed with an internal passage leading to a flat surface, and the internal passage communicates with a pneumatic circuit of a negative pressure generating device such as a vacuum pump or an ejector. By generating a negative pressure in the pneumatic circuit, the collet 51 holds the chip S on a flat surface, and detaches the chip S by a vacuum break or air release.

The Z-axis moving mechanism 55 includes a cam mechanism 6, a voice coil motor 7, and

compression springs

8 and 55b. The cam mechanism 6 moves the support frame 55a movable in the Z-axis direction in the Z-axis direction by urging the cam follower 6a fixed thereto according to the rotation of the cylindrical cam 6b. The boil coil motor 7 and the compression spring 55b are fixed to the support frame 55a, and the collet 51 is moved toward the holding device 200 in the Z-axis according to the Z-axis movement of the support frame 55a. The compression spring 8 moves the collet 51 in the direction away from the holding device 200 in the Z axis. The voice coil motor 7 absorbs an excessive load applied to the chip S sandwiched between the collet 51 and the suction nozzle 210 and applies a predetermined load to the chip S.

The voice coil motor 7 generates a counter thrust that antagonizes the load applied to the coil bobbin 71 at the same time as driving the collet 51 by the cam mechanism 6 to rise along the Z-axis direction. The counter thrust antagonizes the load applied to the coil bobbin 71 in a situation where the collet 51 does not reach the chip S. The load applied to the coil bobbin 71 is a difference in urging force between the compression spring 8 and the compression spring 55b.

Therefore, the coil bobbin 71 maintains the relative positional relationship with the voice coil motor 7 when it does not reach the chip S, and when it reaches the chip S, the chip S when it tries to advance further. It is defeated by the load received from and retracts along the Z-axis direction so as to be buried in the voice coil motor 7. That is, the voice coil motor 7 absorbs an excessive load generated in the chip S when the chip S and the collet 51 come into contact with each other and further advance.

The delivery of the chip S between the holding device 200 and the correction device 500 is performed as follows. When the chip S is delivered to the correction device 500, the holding device 200 is not protruded. Instead, the collet 51 of the correction device 500 is protruded in the Z-axis direction, approaches the holding device 200, picks up the chip S by itself, and performs the suction by the negative pressure while releasing the suction of the holding device 200.

Then, the correction device 500 moves the collet 51 in the Z-axis direction away from the holding device 200 to overlap the retreat and re-projection while retreating the chip S from the holding device 200, thereby moving the collet 51 left and right. The posture of the chip S is corrected by moving it in the (XY axis direction) and further rotating the collet 51 by θ. Further, the collet 51 approaches the holding device 200 due to re-projection in the Z-axis direction, and the suction is released when the holding device 200 starts sucking.

[7. First collection device]
The first collection device 600 basically has the same configuration as the support device 100. That is, the first collection device 600 also includes a ring moving mechanism 2B, an expanding mechanism 3B, and an autoloader 5B other than the separation mechanism. The ring moving mechanism 2B has a wafer ring Rb that holds and holds the wafer sheet Db. There may be a member that supports the back surface of the wafer sheet Db. The autoloader 5B is an exchange device similar to the autoloader 5A. That is, the autoloader 5 B also includes the storage unit 110 and the ring transport mechanism 120.

[9. Second collection device]
The second collection device 700 is basically configured similarly to the support device 100. That is, the second collection device 700 also includes a ring moving mechanism 2C, an expanding mechanism 3C, and an autoloader 5C other than the separation mechanism. The ring moving mechanism 2C has a wafer ring Rc that holds the wafer sheet Dc. There may be a member that supports the back surface of the wafer sheet Dc. The autoloader 5C is also an exchange device similar to the autoloader 5A. That is, the autoloader 5 C also includes the storage unit 110 and the ring transport mechanism 120.

The first collection device 600 and the second collection device 700 adjust the attachment position of the chip S based on the coordinates of the attached chip S detected by the coordinate detection unit 18 described later. Further, the first collection device 600 and the second collection device 700 can also correct the posture of the chip S based on the posture deviation measured by the post-measurement unit 40B.

The support device 100, the measurement device 400, the correction device 500, the first collection device 600, and the second collection device 700 are arranged in the vicinity of the conveyance path T around the conveyance device 300. From the upstream in the conveying direction of the chip S, the support device 100, the front measurement unit 40A of the measurement device 400, the correction device 500, the rear measurement unit 40B of the measurement device 400, the first collection device 600, and the second collection device 700 are arranged in this order. It is arranged. The support device 100 is opposed to the first collection device 600, and the correction device 500 is opposed to the second collection device 700. Thus, the space around the transfer device 300 is effectively used to realize the accurate parallel bonding of the two types of ranks S.

[10. Control device]
Next, the configuration of the control device 800 that controls each of the above devices will be described with reference to the block diagram of FIG. The control device 800 includes a mechanism control unit 11, a reference detection unit 12, a scan unit 13, a reference inspection unit 14, a pickup instruction unit 15, a correction instruction unit 16, a paste instruction unit 17, a coordinate detection unit 18, and a storage unit 19.

The mechanism control unit 11 is a processing unit that controls each mechanism and the operation of each unit. In particular, the imaging by the

imaging units

60a, 60b, and 60c and the capture of the image data are performed in accordance with the scanning of the

ring moving mechanisms

2A, 2B, and 2C based on the encoder information. This is done by relative movement on Dc.

The reference detection unit 12 is a processing unit that performs a reference detection process of detecting coordinate data of a reference chip among the dicing chips S attached to the wafer sheet Da of the first support device 100. In this reference detection process, based on the image data picked up by the image pickup unit 60a, a reference chip by collation with a reference mark registered in advance is found, and encoder information of the ring moving mechanism 2A is acquired as coordinate data thereof. Is done.

The scanning unit 13 is a processing unit that performs a scanning process for detecting coordinate data of all the chips S attached to the wafer sheet Da in the first support device 100. The coordinate data of the chip S is detected by the imaging unit 60a positioned on the chip S by the ring moving mechanism 2A obtaining the image data by imaging the chip S and using the encoder information of the ring moving mechanism 2A as the coordinate data. It is done by acquiring. Here, all the chips S here are product chips, and are ranked in advance as described above.

Before the reference detection process, the wafer attached to the wafer sheet Da is diced. The expanding mechanism 3A extends the wafer sheet Da, so that a gap is formed between the individual chips S so that the holding device 200 as a pickup device can easily pick up. Since this extension is performed by the wafer ring Ra and the pulling portion 31 described above, it is performed by a force by which the wafer sheet Da is pulled from the inside of the circle surrounding the wafer W to the outside.

The reference inspection unit 14 scans the ring moving mechanism 2A and starts the reference chip as a starting point, and after a predetermined amount of scanning processing of the chip S is performed, the reference inspection unit 14 returns to the reference chip at the starting point, and the coordinate data matches (the deviation occurs). It is a processing unit that checks whether or not. As will be described later, various modes are conceivable as to how much the scan amount returns to the reference chip.

The pickup instruction unit 15 is a processing unit that instructs the chip S to be picked up by the holding device 200 by controlling the support device 100 and the holding device 200 based on a preset pickup criterion. The pickup reference includes the rank of the chip S picked up by the holding device 200 and the order of picking up. As the rank of the chip S to be picked up, any two kinds of ranks are used. This is preferably set to two ranks having the largest number in the number distribution of chips S in the same wafer W by rank. For example, rank A and rank B are assumed. More preferably, in the normal distribution of the number of chips S, two ranks closest to the median can be considered. These two types are usually the top two types with the better quality. In addition, after picking up two types of ranks S and then picking up more, it is only necessary to select the two ranks with the largest number of remaining chips S. That is, the two types of ranks having the largest number may be selected from the chips S remaining in the same wafer W.

As the order of picking up, it is conceivable to simply pick up the chips S of two types in the order adjacent to each other in each row direction or each column direction. Although it may be picked up in only one direction in each row or column, it is more efficient to pick up in both the forward path and the return path.

Further, the holding device 200 is one of the wafer sheet Db of the first collection device 600 and the wafer sheet Dc of the second collection device 700 at the stop timing in the intermittent operation when the two types of ranks are the same number. It is more desirable to attach the chip S to the substrate. That is, it is preferable that at least one of the holding device 200 that has come to the position facing the wafer sheet Db and the holding device 200 that has come to the position facing the wafer sheet Dc at the same time picks up the chip S so as to stick. .

Note that the rank of the picked-up chip S and the identification information of each holding device 200 are associated with each other and stored in the storage unit 19. A specific example of such a pickup will be described later.

The correction instruction unit 16 is a processing unit that instructs the correction device 500 to correct the posture deviation of the chip S based on the posture deviation of the chip S detected by the front measurement unit 40A of the measurement device 400. The correction instruction unit 16 calculates the movement amount of the chip S in the XY-axis direction and the rotation amount in the θ-axis direction for eliminating the posture deviation, and instructs the correction device 500 to operate with this movement amount and rotation amount. To do. Further, the correction instruction unit 16 applies to the

ring moving mechanisms

2B and 2C in the first collection device 600 and the second collection device 700 based on the posture deviation of the chip S detected by the rear measurement unit 40B of the measurement device 400. It is also possible to instruct correction of the positional deviation of the chip S. In other words, the correction instruction unit 16 calculates the movement amount of the

ring moving mechanisms

2B and 2C for eliminating the posture deviation in the XY-axis direction and the rotation amount in the θ-axis direction, Instruct the moving

mechanisms

2B and 2C.

The sticking instruction unit 17 is a processing unit that supports the sticking of the chip S to the holding device 200. Whether the sticking support unit 17 sticks the chip S to the wafer sheets Db and Dc by the advancing and retreating operation with respect to the holding device 200 that has come to a position facing the first collecting device 600 and the second collecting device 700. Instruct whether or not. This instruction is based on the rank information of the chip S associated with the identification information of each holding device 200. For example, the paste instructing unit 17 issues a paste instruction when the rank S chip S comes to the first collection device 600, but issues a paste instruction when the rank A chip S comes. Without passing through. Conversely, when a rank A chip S arrives at the second collection device 700, a sticking instruction is issued, but when a rank B chip S has already been pasted and the holding device 200 is empty. Pass through.

The coordinate detection unit 18 is a processing unit that detects the position coordinates of the chips S attached to the wafer sheet Db of the first collection device 600 and the wafer sheet Dc of the second collection device 700. The position coordinates are acquired from the encoder information of the

ring moving mechanisms

2B and 2C together with the imaging by the

imaging units

60b and 60c.

The storage unit 19 is a processing unit that stores various types of information necessary for the present embodiment. Various types of information include the map data and the coordinate data. The information stored in the storage unit 19 also includes image data for determining a reference mark by collating with captured image data, and various settings such as a scanning path reference by the scanning unit 13. Further, the above-described pickup reference and posture deviation are also included in the information stored in the storage unit 19.

Furthermore, an input unit 81 and an output unit 82 are connected to the control device 800. The input unit 81 is a processing unit for inputting information necessary for processing of each unit, selecting a process, and inputting an instruction. The input unit 81 includes input devices that can be used now or in the future, such as an operation panel, a touch panel, a switch, a keyboard, and a mouse.

The output unit 82 is a processing unit that outputs information such as an interface for operation, various data, images, processing results, and alarms. The output unit 82 includes any output device that can be used now or in the future, such as a display device, a printer, a speaker, a buzzer, and a lamp.

All or part of the control device 800 can be realized by controlling the computer with a predetermined program. The program in this case realizes the processing of each unit as described above by physically utilizing computer hardware including a CPU. A method, a program, and a recording medium storing the program for executing the processing of each unit described above are also one aspect of the present invention.

How to set the range to be processed by hardware and the range to be processed by software including a program is not limited to a specific mode. For example, any of the above-described units can be configured as a circuit that realizes each process.

Further, as the storage unit 19, any storage medium that can be used now or in the future can be used. A register or the like used for calculation can also be regarded as the storage unit 19. The mode of storage includes not only a mode in which memory is stored for a long time but also a mode in which data is temporarily stored for processing and deleted or updated in a short time. Further, all or a part of each processing unit, storage unit 19, input unit 81, and output unit 82 constituting the control device 800 can be configured as a part of each of the above devices, or can be connected via a network. It can also be configured by a computer.

Furthermore, various data in the process can be appropriately output (displayed, printed out, etc.) to the output unit 82 so that the operator can visually recognize the data. For example, map data, coordinate data, captured image data, results of reference detection processing, scan processing and reference inspection processing, pickup criteria, posture deviation, etc. may be displayed and printed out and used for processing confirmation.

[D. Action]
An example of the operation of the present embodiment as described above will be described with reference to FIGS. Each mechanism and each part described above are controlled so that the mechanism control unit 11, the pickup instruction unit 15, the correction instruction unit 16, and the sticking instruction unit 17 perform the operations described below.

[1. Overall processing]
First, the overall processing of the classification apparatus 1 will be described with reference to the flowchart of FIG. Note that the flowchart of FIG. 8 has a portion that focuses only on the processing flow of one chip S. However, also at this time, processes such as pick-up, posture correction, and pasting are performed on the plurality of other chips S in parallel.

The autoloader 5A sets the wafer ring Ra on which the chip S is picked up on the ring moving mechanism 2A of the support device 100 (step S101). Further, the autoloader 5B and the autoloader 5C set the wafer rings Rb and Rc to which the chips S are attached to the

ring moving mechanisms

2B and 2C of the first collection device 600 and the second collection device 700, respectively.

As will be described later, the control device 800 controls each unit to perform a collective scan on the chips S attached to the wafer sheet Da of the support device 100 (step S102). Then, the holding device 200 picks up the two types of chips S (step S103). In the present embodiment, for example, in the number distribution of chips S in the same wafer W by rank, the two types of chips S of ranks A and B that are closest to the median are picked up as the chips S of the indicated rank. Thereafter, the transfer device 300 intermittently moves the chip S picked up by the holding device 200 along the transfer path T of the circular orbit together with the holding device 200.

The pre-measurement unit 40A of the measurement device 400 measures the posture deviation of the chip S in the transport path T (Step S104). The correction device 500 corrects the posture of the chip S based on the posture deviation measured by the measurement device 400 (step S105). The rear measurement unit 40B of the measurement device 400 confirms the posture of the chip S whose posture has been corrected (step S106).

When the rank B chip S comes to the first collection device 600 (NO in step S107), the holding device 200 attaches the rank B chip S to the wafer sheet Db (step S108). If the rank A chip S has arrived at the first collection device 600 (YES in step S107), the holding device 200 passes without being pasted (step S109). When the rank A chip S comes to the second collection device 700, the holding device 200 attaches the rank A chip S to the wafer sheet Dc (step S110).

The chips S of the instruction ranks A and B remain on the support device 100 (YES in step S111), and the wafer sheet Db of the first collection device 600 or the wafer sheet Dc of the second collection device 700 is full. If not (NO in step S112), the processing after the pickup of the chip S is continued (steps S103 to S111). In order to be full, it is sufficient that at least a sufficient number of chips S as a product are attached. For example, it includes a state in which the number set in advance as a product is pasted or a state in which the number is pasted in a region previously determined as a product. An area that can be physically attached may remain.

When the chips S of the instruction ranks A and B do not remain in the support device 100 (NO in step S111) and the unprocessed wafer ring Ra remains in the storage unit 110 (YES in step S113), once. After stopping the transfer device 300, the autoloader 5A replaces the next wafer ring Ra (step S114). Then, processing after the batch scan of the chip S is performed (steps S102 to S111).

When the wafer sheet Db of the first collection device 600 or the wafer sheet Dc of the second collection device 700 is full (YES in step S112), after the transfer device 300 is temporarily stopped, the

autoloader

5B or 5C is full. The wafer ring Rb or the wafer ring Rc that is the new one is replaced (step S115). Then, the transfer device 300 is operated to continue the processing after the pickup of the chip S (steps S103 to S111).

When the unprocessed wafer ring Ra does not remain in the storage unit 110 (NO in step S113), the process is terminated.

[2. Processing of each part]
Next, the processing of each part of the classification device 1 will be described with reference to the explanatory diagram of FIG. 9 in addition to FIG. 1 to FIG. In the following description, (1) to (11) correspond to (1) to (11) in FIG. First, as a premise, a wafer sheet Da to which a wafer W is stuck is attached to a plurality of wafer rings Ra housed in the autoloader 5A. These wafers W are divided into chips S by dicing. For each chip S, a probe test is performed in advance, and map data as a result of the test is stored in the storage unit 19. In this map data, each chip S is classified into ranks A to D according to the quality level of the inspection result. The map data also includes reference chip data (indicated by R) as described above. On the other hand, wafer sheets Db and Dc are attached to the plurality of wafer rings Rb and Rc stored in the

autoloaders

5B and 5C.

(1) Setting of Wafer Sheet with Chip The support device 100, that is, the autoloader 5A on the pickup side, stores a plurality of wafer rings Ra to which the wafer sheet Da to which the chip S is attached is attached. The autoloader 5A takes out one wafer ring Ra and sets it on the ring moving mechanism 2A. The expanding mechanism 3A opens the gap between the chips S by extending the wafer sheet Da.

(2) Setting of Empty Wafer Sheet On the other hand, the first collection device 600 and the second collection device 700, that is, the

autoloaders

5B and 5C on the pasting side, are attached with the wafer sheets Db and Dc to which the chip S is not pasted. A plurality of wafer rings Rb and Rc are accommodated. The

autoloaders

5B and 5C take out the wafer rings one by one and set them on the

ring moving mechanisms

2B and 2C. The expanding

mechanisms

3B and 3C extend the wafer sheets Db and Dc.

(3) Batch Scan By repeating reference detection, scanning, and reference inspection, which will be described later, each chip S is imaged by the imaging unit 60a, and coordinate data of each chip S is acquired by the scanning unit 13. The scanning unit 13 stores the coordinate data of each chip S in the storage unit 19 in association with the map data.

(4) Pickup The holding device 200 moves the chip S while the ring moving mechanism 2A scans the holding device 200 so as to sequentially position the chips S based on the coordinate data of each chip S acquired by the scanning process. Pick up. This pickup is performed only for chips S of a specific rank based on the map data. In the present embodiment, two types of chips S are picked up in accordance with the above pickup criteria. Further, the holding device 200 picks up the chips S in the order in which the chips S are attached as will be described later.

The example of FIG. 9 is the case where the chips S of ranks A and B are picked up. First, the start end rank A or rank B chip S is positioned with respect to the holding device 200 based on the coordinate data at the time of scanning. After this is picked up by the holding device 200, the next rank A or rank B chip S is moved to the target. At this time, chips S and reference chips other than the target rank are not picked up even if moved to the coordinates.

In the control device 800, the picked-up information for the picked-up chip S is recorded in the map data. In addition, when the chip S is positioned at a position where the chip S exists, including when picking up, if the position of the chip S based on the image data captured by the imaging unit 60a is shifted, the result of measuring the shift Is fed back to correct the coordinate data of the next chip S. It is possible to increase the speed by positioning only on the chip S to be picked up based on the coordinate data, or to ensure the accuracy by positioning and correcting each chip S.

(5) Chip Transfer The chip S picked up by the holding device 200 is transferred along the transfer path T of the circular orbit according to the intermittent rotation of the rotating body 310 of the transfer device 300. The holding device 200 moves the chip S while repeating the movement and the stop at the stop position.

(6) Measurement of posture deviation When the chip S being conveyed is stopped at a position facing the front measurement unit 40A, the front measurement unit 40A performs photographing and measurement of the posture deviation while being held by the holding device 200. The

(7) Correction of Attitude Deviation After the chip S on which the attitude deviation is measured is stopped at a position facing the correction apparatus 500, the chip S is transferred from the holding device 200 to the correction apparatus 500, and the attitude deviation is corrected. Returned to the holding device 200. That is, the correction device 500 moves and rotates the chip S based on the amount of movement in the XY axis direction and the amount of rotation in the θ axis direction calculated by the correction instruction unit 16 based on the attitude deviation.

(8) Posture Correction Posture Correction Further, the post-measurement unit 40B performs photographing and posture shift measurement for the corrected chip S stopped at a position facing the post-measurement unit 40B. Since this chip S is after being corrected by the correction device 500, there is no or very little posture deviation remaining.

(9) Chip Affixing The specific rank of chips S that have been transported to the first collection device 600 and stopped at a position facing the wafer sheet Db are affixed to the wafer sheet Db as the holding device 200 advances and retreats. It is done. At this time, the ring moving mechanism 2 B operates so that the wafer sheet Db that has been stretched is sequentially attached from the start end of the attaching region. For example, scanning is performed on a plurality of parallel scanning lines set from the start end of the pasting region to the opposite end thereof, and pasting is performed at the time of reciprocation. Thereby, chips S of a specific rank are collected on one wafer sheet Db. In the present embodiment, B-ranked chips S are collected. Note that the movement calculated by the correction instruction unit 16 is corrected so that, for example, when the posture deviation detected by the post-measurement unit 40B exceeds a threshold value set in the storage unit 19 in advance, the posture deviation is corrected. The amount of movement and the amount of rotation of the ring moving mechanism 2B are corrected by the amount and the amount of rotation.

Further, the pasted chip S is imaged by the imaging unit 60b, and the coordinate data for each chip S is stored in the storage unit 19. The coordinate data can be acquired as coordinate values (x, y, θ) of the encoder information of the ring moving mechanism 2B. This coordinate data is referred to when the next chip S is pasted, and the ring moving mechanism 2B adjusts the amount of movement and the amount of rotation so that it can be pasted accurately next to the chip S pasted last time.

The chips S of a specific rank that have been transported to the second collection device 700 and stopped at a position facing the wafer sheet Dc are attached to the wafer sheet Dc as the holding device 200 advances and retreats. In the present embodiment, chips A of rank A are collected. The pasting operation, posture deviation correcting operation, coordinate data storage, and the like are the same as those of the first collection device 600 described above.

(10) Storage of Pickup-side Wafer Sheet The autoloader 5A removes the wafer ring Ra attached with the wafer sheet Da after selectively picking up the chips S from the ring moving mechanism 2A and stores the wafer ring Ra in the storage unit 110 again. To do. The wafer sheet Da is in a state (chip missing state) in which chips S of a specific rank are missing and chips S of other ranks remain. For example, the wafer ring Ra of the wafer sheet Da from which only the chips S of ranks A and B have been removed is accommodated in the accommodating portion 110 and replaced with the next wafer ring Ra.

(11) Storing the wafer sheet on the affixing side The ring transport mechanism 120 of the autoloader 5B removes the wafer ring Rb on which the wafer sheet Db on which specific one-rank chips S are collected from the ring moving mechanism 2B. Then, it is stored again in the storage unit 110. If there is a wafer ring Rb to be attached next, the ring transport mechanism 120 takes out the next wafer ring Rb and transfers it to the ring moving mechanism 2B. Similarly, the autoloader 5C removes the wafer ring Rc to which the wafer sheet Dc on which the specific one-ranked chips S are collected is attached from the ring moving mechanism 2C and stores the wafer ring Rc in the storage unit 110 again. Further, the wafer ring Rc to be attached next is transferred to the ring moving mechanism 2C.

[3. Batch scan]
Next, batch scanning before pickup according to the present embodiment will be described with reference to a flowchart of FIG. 10 and explanatory diagrams of FIGS.
(Reference detection processing)
For the chip S on the wafer sheet Da set in the ring moving mechanism 2A, the reference detection unit 12 starts a reference detection process (step S01). First, the ring moving mechanism 2A scans to a position estimated to be a position where the reference chip exists based on, for example, map data. You may scan exhaustively from the chip | tip S of the edge part of the wafer W. FIG.

Then, the reference detection unit 12 checks whether or not a reference chip exists by collating image data captured by the imaging unit 60a during scanning with a reference mark registered in advance (YES in Step S02) (Step S02). SNO is determined.

When the reference detection unit 12 finds a reference chip by collation (YES in step S02), the reference detection unit 12 acquires coordinate data of the found reference chip based on the encoder information of the ring moving mechanism 2A, and the reference chip in the map data The information is stored in the storage unit 19 in association with the position information (step S03).

(Scan process)
Next, the scanning unit 13 starts a scanning process (step S04). First, based on the coordinate data of the found reference chip and the positional information of each chip S with respect to the reference chip in the guaranteed area in the map data, the ring moving mechanism 2A can be covered so that all the chips S in the guaranteed area can be covered. The target chip S is sequentially imaged by operating so as to move at a predetermined pitch (step S05). The predetermined pitch is, for example, a horizontal pitch set in advance for the ring moving mechanism 2A as one row and a vertical pitch set as one row.

Here, when the target chip S exists (YES in step S06), the process of specifying the coordinate data will be described with reference to FIG. In this case, scanning and imaging are performed while positioning the target chip S so as to be within a predetermined imaging region. That is, when the target chip S is imaged for the first time, as shown in FIG. 11A, a rectangular image that is set in advance on any of the eight chips S around the target chip S is captured. It is assumed that there is a part that does not fit in the region F. Then, as shown in FIG. 11B, the ring moving mechanism 2A performs an alignment operation so that the outer edge side of the eight chips S coincides with the rectangular imaging region. The alignment pitch is, for example, a finer pitch than the pitch set for one column and one row. The alignment is also performed when there is a deviation in the θ direction.

After the alignment operation, the scanning unit 13 obtains the center of each of the nine chips S included in the rectangular imaging area by detecting corners or four sides. Then, the scanning unit 13 obtains the coordinate data of the centers of the nine chips S based on the encoder value of the ring moving mechanism 2A, and associates it with the position information of each corresponding chip S of the map data in the storage unit 19. Store (step S07, FIG. 11C). Then, a scanned flag is set for each chip S (step S08). Such a coordinate data specifying method can also be applied when specifying the coordinate data of the reference chip and the surrounding chip S.

If there is no chip S that should exist on the map data due to dropping from the wafer sheet Da (NO in step S06), the coordinate data cannot be acquired. However, the scanned flag is set (step S08).

This scanning process is continued until a part of the guaranteed area of the reference chip (hereinafter referred to as a partial area) is covered (NO in step S09, steps S05 to 08). That is, as shown in FIG. 11D, the third chip S is moved as the target chip S, and the processes of FIGS. 11A to 11D are repeated.

For example, as shown in FIG. 12A, the upper left partial area Ex1 of the reference chip RS1 in the guarantee area E1 is divided into a lower left partial area Ex2, an upper right partial area Ex3, and a lower right partial area Ex4. Shall. The partial area can be defined based on the coordinate data of the reference chip, the data indicating the guaranteed area of the map data (which defines the limit of scanning), and the reference setting of the scanning path.

For example, the following criteria (a) to (d) may be selectively combined as the scanning path criteria for covering the chips S in such a partial region. FIG. 12B shows an example of routes (a) to (d) in the partial region Ex1. However, the method to cover is not limited to this.

(A) When the product chip S exists in the X-axis direction or the Y-axis direction as viewed from the reference chip, the product chip S moves in the existing direction.
(B) When there is no product chip S in the moving direction, the product chip S moves to a position where the product chip S exists in the axial direction orthogonal to the moving direction.
(C) Move to the same X coordinate or Y coordinate as the reference chip.
(D) When there is no chip S that has not been imaged in the partial area in the X-axis direction and the Y-axis direction from the reference chip, the process returns to the reference chip.

Furthermore, the criteria of (c) and (d) can be set as shown in (e) and (f) below. An example of this is shown in FIG.
(E) Move to the X or Y coordinate before the reference chip.
(F) When there are no chips S in the partial area in the X-axis direction or the Y-axis direction from the reference chip, the remaining chips S are imaged while returning to the reference chip. When this method is adopted, there is no duplication of the route (d) passing through the already scanned route, and efficient scanning becomes possible.

When the scanning of the partial area is completed and the reference chip is returned (YES in step S09), the reference inspection unit 14 performs the reference inspection (step S10). That is, the ring moving mechanism 2A returns the imaging position by the imaging unit 60a to the reference chip. Then, it is determined whether there is any deviation between the coordinate data of the reference chip stored in the storage unit 19 and the coordinate data based on the encoder information of the ring moving mechanism 2A when returning to the reference chip.

If the coordinate data are different, an error has occurred (YES in step S11), and the coordinate data of the reference chip is updated with the coordinate data based on the encoder information of the ring moving mechanism 2A when returning to the reference chip. Then, based on the new coordinate data, the scan result of the partial area is cleared, and the same partial area is scanned again (steps S04 to 09). When this error occurs, the operator is notified by causing the output unit 82 to output an alarm sound, displaying a screen notifying the occurrence of the error, or the like. The reference chip, the partial area, or the guaranteed area where the error has occurred may be displayed on the screen.

If the coordinate data match, the scan results so far are determined to be correct (NO in step S11). If the scan in the guarantee area is not completed (NO in step S12), the scan of other partial areas in the guarantee area is performed based on the coordinate data of the same reference chip (steps S05 to S11). . For example, the partial areas Ex2, Ex3, and Ex4 in FIG. 12 are sequentially scanned.

If the scanned flag is set for the chip S in the guaranteed area and the scanning is completed (YES in step S12), if the scanning of all areas is not completed (NO in step S13), the next reference chip is set. Based on this, the guaranteed area of the reference chip is scanned (steps S01 to S12).

That is, the ring moving mechanism 2A moves the imaging area of the imaging unit 60a based on the coordinate data of the scanned reference chip and the position information of the reference chip of the map data so that the moving distance becomes the shortest, Discovery of the next reference chip, acquisition of coordinate data, and scanning processing are performed.

For example, the scan process is performed on the guarantee area E2 of the reference chip RS2, the guarantee area E4 of the reference chip RS3, and the guarantee area E3 of the reference chip RS4 of FIG.

When the scanning of all the areas has been completed (YES in step S13), the processing for specifying the coordinate data of the chip S is terminated. Even if the wafer sheet Da has already been picked up with the two ranks of chips S, the remaining chips S are picked up with the two ranks of chips S and classified into two wafer sheets Db and Dc. Can be pasted.

[E. Pickup and pasting example]
In the classification device 1 as described above, an example of the rank of the chip S on which the plurality of holding devices 200 are picked up and pasted according to the pickup standard will be described below with reference to FIGS. 14 to 17 show a simplified form in which the holding device 200 holding the chips S by intermittent rotation of the transfer device 300 is attached to the wafer sheets Db and Dc. In the figure, the black chip S is rank A, and the white chip S is rank B. However, in the holding device 200, only half of the attachment side is shown, and the half of the pickup side is not shown. For convenience, each holding device 200 is numbered as identification information.

In the present embodiment, as described above, the chip S closest to the median of ranks A and B is picked up. As for the number distribution by rank after the luminance measurement test for LEDs and the like, the one close to the median is often the top two ranks of quality. For example, as shown in FIG. 13, when ranks A to D are in order of good quality, the number of rank A and rank B is larger than the number of other ranks.

In this embodiment, first, the rank A and rank B chips S affixed to the wafer sheet Da can be picked up in a reciprocating manner in the order in which they are arranged in rows or columns. In this case, it is not particularly determined which holding device 200 picks up the rank A chip S or the rank B chip S. Even in this case, if the number of ranks A and B is approximate, the speed at which the wafer sheets Db and Dc are full can be approximated. However, if the chip S to be attached to the wafer sheets Db and Dc does not exist and the number of cases where the wafer sheets Db and Dc are full is increased, there is a delay in the attaching speed until the wafer sheets Db and Dc become full.

For example, in FIG. 14A, even when the number 5 holding device 200 does not attach the rank A chip S to the wafer sheet Db, the number 1 holding device 200 removes the rank A chip S from the wafer. Affixed to the sheet Dc. In FIG. 14B, even when the second holding device 200 does not attach the chip S to the wafer sheet Dc, the sixth holding device 200 attaches the rank B chip S to the wafer sheet Db. Attached. However, in FIG. 14C, both the third holding device 200 and the seventh holding device 200 cannot perform the pasting. For this reason, at this timing, the sheet is fed without being pasted.

In order to cope with this, as shown in FIG. 15A, for example, as a pickup reference, the holding device 200 that is located at a position facing the wafer sheet Db of the first collection device 600, and at the same time the second device It is conceivable that the holding device 200 at a position facing the wafer sheet Dc of the collecting device 700 always picks up chips S of different ranks. In this way, the half holding device 200 can be attached to the wafer sheets Db and Dc at the same time. However, the subsequent half of the holding devices 200 are idle fed. That is, as shown in FIG. 15 (A), after the first to ninth holding devices 200 are attached together, as shown in FIG. 15 (B), the fifth to 13th holding devices 200. After the idle feed, as shown in FIG. 15C, the first and ninth to sixteenth holding devices 200 perform the pasting simultaneously. In this case, since the same number of the two ranks of chips S can be pasted while the transfer device 300 makes one round, the speed at which the wafer sheets Db and Dc become full can be more approximated. However, since the time during which the idle feeding continues is long, it may affect the accuracy of attaching to the wafer sheets Db and Dc.

Therefore, when the two ranks of chips S are in the same number, the chips S are attached to either the wafer sheet Da of the first collection device 600 or the wafer sheet Db of the second collection device 700 at the stop timing in the intermittent operation. It is desirable to attach. That is, for each intermittent rotation of the transfer device 300 by one pitch, the rank B chip S is attached to the wafer sheet Db of the first collection device 600 and the rank A of the wafer A is collected to the wafer sheet Dc of the second collection device 700. Pickup is performed so that one of the attachments of the chip S is always performed.

For example, as shown in FIG. 16A, as a pick-up reference, the holding device 200 facing the wafer sheet Db of the first collection device 600 and the wafer sheet Dc of the second collection device 700 always has the same rank chip. Pick up to be S. That is, chips S of the same rank are picked up for each number obtained by subtracting 1 from the number of holding devices 200 from the first collecting device 600 to the second collecting device 700. This is because, when the wafer sheet Db of the first collection device 600 and the wafer sheet Dc of the second collection device 700 are arranged in the tangential direction perpendicular to the conveyance path T of the circular orbit, the chips of the same rank every time 90 ° is advanced. S will be picked up.

In FIG. 16A, even when the first holding device 200 does not attach the chip S to the wafer sheet Dc, the fifth holding device 200 attaches the rank B chip S to the wafer sheet Db. ing. In FIG. 16B, even if the sixth holding device 200 does not attach the rank A chip S to the wafer sheet Db, the second holding device 200 applies the rank A chip S to the wafer sheet. Affixed to Dc. Further, in FIG. 16C, even if the third holding device 200 does not attach the chip S to the wafer sheet Dc, the seventh holding device 200 applies the rank B chip S to the wafer sheet Db. Paste. For this reason, there is no timing for feeding the first collection device 600 and the second collection device 700 without pasting them. Therefore, it is possible to prevent a reduction in the bonding speed until the wafer sheets Db and Dc are full. Further, since the attaching timing and the interval between them are short and constant, it is easy to maintain the attaching accuracy of the wafer sheets Db and Dc.

In the example of FIG. 16, each holding device 200 alternately holds the chip S of rank A and the chip S of rank B. However, as shown in FIGS. 17A, 17B, and 17C, if chips S of the same rank are picked up every 90 °, even if the chips S of a plurality of ranks are included. Good.

In any of the above embodiments, only one rank S of the chips S of the two ranks S to be picked up is already picked up on the wafer sheet Da of the support device 100, and the other rank of the chips S. In the state in which the wafer sheets remain, it is desirable to reduce the time difference at which the wafer sheets Db and Dc are full as much as possible by continuously picking up only the chips S of the other rank.

[F. effect]
This embodiment as described above can obtain the following effects.
(1) The classification device 1 includes a support device 100 that supports a wafer sheet Da on which a wafer W in which chips S having different ranks indicating quality levels are mixed is attached and the chips S are separated into individual pieces by dicing, and a support device. The holding device 200 that selectively picks up the chips S separated by the expansion of the wafer sheet Da supported by 100 based on the rank, and the chips S picked up by the holding device 200 are conveyed in a circular orbit. A transport apparatus 300 that transports the path T is included.

Then, the classification device 1 is disposed in the vicinity of the conveyance path T and the measurement device 400 that measures the posture deviation of the chip S conveyed by the conveyance device 300, and based on the posture deviation measured by the measurement device 400. A correction device 500 that corrects the posture of the chip S is provided. Further, in the present embodiment, a wafer that is disposed downstream of the correction device 500 in the vicinity of the transport path T and to which one type of chip S is attached among the chips S whose posture is corrected by the correction device 500. The first collection device 600 that supports the sheet Db and the other one of the chips S that are disposed downstream of the first collection device 600 in the vicinity of the conveyance path T and whose posture is corrected by the correction device 500. The second collection device 700 that supports the wafer sheet Dc to which the chips S of different ranks are attached, and the chips S conveyed by the conveyance device 300 are used as the wafer sheet Db and the second collection of the first collection device 600. The holding device 200 is attached to the wafer sheet Dc of the apparatus 700 in a corresponding rank.

Further, the classification device 1 does not pick up the picked-up wafer sheet Da after the two types of chips S are picked up from the wafer sheet Da of the support device 100. An exchange device for sequentially exchanging wafer sheets is provided.

For this reason, the posture of the chip S is corrected by the correction device 500 after the pickup and before the attachment, and the two ranks of chips S are the wafer sheet Db of the first collection device 600 and the wafer sheet Dc of the second collection device 700. Since the wafer sheets Db and Dc on the attachment side are not exchanged, the two different ranks of chips S are attached to the two wafer sheets Db and Dc in an accurate and efficient manner. be able to.

Further, by exchanging the wafer sheet Da on the pickup side until one of the two wafer sheets Db and Dc is full, it is not necessary to exchange the two wafer sheets Db and Dc in the middle of pasting.

Furthermore, since only one support device 100 is required on the pickup side, it can be arranged with a margin in the space around the rotary type conveyance device 300. For this reason, in this embodiment, a measuring device and a correction device can be added and arranged.

(2) The two types of ranks are the two types of ranks having the largest number in the number distribution of the chips S in the same wafer W by rank.
For this reason, the number of exchanges of the wafer sheet Da can be reduced, and the production efficiency of the bonded wafer sheets Db and Dc can be increased. If the numbers of the two types of chips S are approximate, the time for filling both the wafer sheets Db and Dc with the chips S can be approximated. In this case, after one side becomes full, the time to wait until the other becomes full is reduced, and even if the wafer sheets Db and Dc are replaced at the same time, there is little time loss. For example, in the number distribution by rank in the same wafer W, the two types of ranks closest to the median may have a larger number than the other ranks, and the number of both may be approximated. Therefore, by classifying and attaching the two types of ranks of chips S to the wafer sheets Db and Dc, it is possible to approximate the time for filling both the wafer sheets Db and Dc with the chips S.

(3) The transport device 300 transports the chip S in an intermittent operation with a predetermined pitch, and the sticking device has a stop timing in the intermittent operation in the same number of specific one type of rank and the other one type of rank. Then, the chip S is attached to one of the wafer sheet Db of the first collection device 600 and the wafer sheet Dc of the second collection device 700.

For this reason, since the chip S is always attached to either one of the wafer sheets Db and Dc at each stop timing, the timing of feeding the sheet S without being attached is reduced as much as possible, and the bonding speed is increased. Delay can be prevented.

(4) The pickup device and the sticking device are the holding device 200 that holds the chip S at the tip, the transport device 300 includes a rotating body 310 that rotates intermittently at a predetermined pitch, and the plurality of holding devices 200 rotate. The plurality of holding devices 200 provided on the body 310 are arranged at positions where the tips are arranged on the transport path T at equal intervals corresponding to a predetermined pitch.

For this reason, since the pick-up and pasting can be performed by the holding device 200 that intermittently moves with the rotation of the rotating body 310, the device configuration can be simplified.

(5) The holding device 200 that comes to the position corresponding to the first collecting device 600 and the holding device 200 that comes to the position corresponding to the second collecting device 700 at the same time pick up the chips S of the same rank in the pickup. Hold.

(6) It has the coordinate detection part 18 which detects the position coordinate of the chip | tip S affixed on the wafer sheet Db of the 1st collection apparatus 600, and the wafer sheet Dc of the 2nd collection apparatus 700, and the 1st collection apparatus 600 and the second collection device 700 correct the pasting position of the chip S based on the coordinates of the pasted chip S detected by the coordinate detection unit 18.

For this reason, it is possible to correct the positional deviation that occurs during the sequential pasting of the chips S and to perform accurate pasting.

(7) The measuring device 400 includes a pre-measurement unit 40A that measures the posture deviation of the chip S upstream of the correction device 500, and a post-measurement unit 40B that measures the posture deviation of the chip S downstream of the correction device 500. Then, the correction device 500 corrects the posture of the chip S based on the posture deviation measured by the front measurement unit 40A, and the first collection device 600 and the second collection device 700 are measured by the rear measurement unit 40B. The posture of the chip S is corrected based on the posture deviation.

For this reason, a slight misalignment after correcting the misalignment at the time of pickup can be corrected by the correcting device 500 at the time of pasting, so that more accurate pasting can be executed.

(8) When the wafer sheet Da supported by the support device 100 is expanded, the imaging unit 60a that captures images of the chips S divided into pieces while moving relative to the wafer sheet Da based on the coordinate data. Based on the image data captured by the imaging unit 60a, a reference chip with a specific mark is found among the chips S in the wafer W, and based on the coordinate data for the relative movement of the imaging unit 60a, The reference detection unit 12 that performs reference detection processing for specifying the coordinate data of the reference chip, and the imaging unit 60a with respect to the wafer sheet Da on the basis of the reference chip coordinate data and the relative position information of each chip S in the wafer W. Image data obtained by imaging each chip S with relative movement and coordinate data for the relative movement of the imaging unit 60a. And a scanning unit 13 that performs a scanning process for specifying the coordinate data of each chip S based on the data, and the holding device 200 includes the coordinate data of each chip S specified by the scan unit 13 and each chip. Based on the rank information of S, the chip S is selectively picked up while moving relative to the wafer sheet Da.

For this reason, the coordinate data of each chip S can be obtained accurately by performing a collective scan based on the reference chip with respect to the chip S in the expanded wafer before picking up. For this reason, even if there is a movement of the chip S due to expansion, a dropout of the chip S, etc., the individual chips S can be accurately picked up based on the acquired coordinate data. Accordingly, even if the pickup-side wafer sheet Da is replaced and expanded while the two-ranked chips S are classified and pasted to the first collecting device 600 and the second collecting device 700, A desired chip S can be accurately picked up.

Especially, it is possible to accurately collect and replace specific two rank chips S. Thereby, the rank is determined for each of the wafer sheets Db and Dc, and product management becomes easy. In particular, in the past, in the case of a wafer sheet in which the tooth S has been removed by picking up one rank of chips S, an accurate pick-up can be achieved simply by moving it with a feed operation set at a pitch from the reference chip. There wasn't. However, in the present embodiment, the chips S of the other rank can be accurately picked up based on the accurate coordinate data of each chip S. The portion of the tooth missing where the chip S has been picked up can be moved without picking up, whereby efficient and high-speed processing can be performed.

(9) Reference inspection processing for inspecting whether the reference chip coordinate data by the reference detection processing is correct based on the image data captured by the imaging unit 60a and the coordinate data for the relative movement of the imaging unit 60a A reference inspection unit 14 is provided.

Therefore, during the collective scan, a reference check is performed to check whether the coordinate data of the reference chip is correct. If there is an error, the chip S scan process is performed again. Therefore, even if the wafer W has a large amount of minute chips S, coordinate data obtained by the entire scan can be obtained accurately.

(10) A reference chip is set for each of a plurality of guaranteed areas that divide the wafer W, and the scan unit 13 performs a scanning process based on the reference chip for each guaranteed area of the reference chip.

For this reason, since a plurality of reference chips are set and the scan process is performed separately for each reference chip guaranteed area, the distance of the chip S from the reference chip serving as a reference is shortened, and the deviation can be suppressed.

(11) Regardless of the presence or absence of the chip S, the scanning unit 13 sets a flag indicating that the scanning process has been completed for each chip S, and performs the scanning process until there is no more scanned chip S.

For this reason, the chip S that should be present in the map data is dropped from the wafer sheet, and the scanning process is continued by setting a scanned flag even at a position where the coordinate data cannot be obtained. It can be determined that there is no S. Therefore, efficient movement and high-speed processing can be performed by moving the portion without picking up.

(12) The imaging unit 60a relatively moves in units of a plurality of chips S, and the scanning unit 13 specifies coordinate data for each of the plurality of chips S included in the image data captured by the imaging unit 60a.

For this reason, since coordinate data can be acquired for a plurality of chips S together, high-speed scanning processing can be realized.

(13) The relative movement path of the imaging unit 60a is set to minimize the overlap.
For this reason, if no overlap occurs in the scan path, it is possible to save the extra movement time and realize a high-speed scan process.

(14) The distance of relative movement from the imaging position of the reference chip of the imaging unit 60a to the imaging position of another reference chip is set to be the shortest.
For this reason, high-speed processing can be realized by shortening the moving distance between the reference chips as much as possible.

(15) A reference chip is set for each of a plurality of guaranteed areas that divide the wafer W, the scan unit 13 performs a scan process based on the reference chip for each guaranteed area of the reference chip, and the reference inspection unit 14 A reference inspection is performed for each guarantee area.

(16) The scan unit 13 performs a scan process based on the reference chip for each partial region obtained by dividing the guaranteed region into a plurality of regions, and the reference inspection unit 14 performs a reference inspection for each partial region.
For this reason, the accuracy of the position of the chip S can be ensured by performing the reference inspection for each guarantee area.

When the result of the reference inspection process is not correct, an output unit 82 for notifying the outside is provided.

(17) Each time the wafer sheet to be picked up is changed, the wafer sheet is stretched.

If there is an error as a result of the reference inspection, the output unit 82 notifies this, so the operator can know the occurrence of an abnormality and can respond quickly. For example, when the frequency of notification is high, it is preferable to stop the device early. Moreover, if an error location can be identified, it can be used for adjustment of the apparatus.

2. Other Embodiments The present invention is not limited to the above embodiments.
(1) In the above embodiment, the pickup device and the sticking device are configured as the common holding device 200. However, the pickup device and the sticking device may be configured independently. Such an example will be described with reference to FIGS. 18 and 19 do not display the first collection device 600 and the second collection device 700 separately, but it is actually assumed that they are arranged as shown in FIG. .

First, as shown in FIG. 18, the pickup device 32 is a device that selectively picks up the chips S divided into individual pieces based on the rank when the wafer sheet Da supported by the support device 100 is extended. It is. The pickup device 32 is performed while moving relative to the wafer sheet Da based on the coordinate data of each chip S specified by the scanning unit 13.

The pickup device 32 has a holding portion 32a. The holding unit 32 a is a device that receives the chip S from the wafer sheet Da by passing between the wafer sheet Da and the transfer device 300 and passes it to the transfer device 300. The holding part 32a may be plural or singular. FIG. 18 shows an example using a four-way cross arm in which the four holding portions 32a are formed in a cross shape. The configuration of the holding unit 32a is basically the same as that of the holding device 200 described above. That is, the holding part 32a is configured by a suction nozzle provided so as to be able to advance and retract in the radial direction from the center of rotation. The suction nozzle sucks the chip S into the suction hole at the tip by generation of negative pressure by a vacuum generator (not shown), and detaches the chip S from the suction hole at the tip by vacuum break or generation of positive pressure.

The pickup device 32 is intermittently rotated by 90 ° about the center of the cross formed by the holding portion 32a by a driving source (not shown). Thereby, the tip of each holding part 32a is positioned at the pick-up position of the chip S of the wafer sheet Da and the delivery position of the chip S to the transfer device 300 described later. In the case of the quadruple cross arm, one holding portion 32a sequentially comes to the pickup position of the chip S of the wafer sheet Da. At the same time, another one holding portion 32a comes to a position where the chip S is delivered to the holding portion 32a of the transfer device 300 described later.

The single holding unit 32a may be configured to reciprocate between the pickup position of the wafer sheet Da and the transfer position of the chip S to the transfer device 300. For example, as shown in FIG. 19, one holding portion 32a may be configured to reciprocate by 90 °. The number of the plurality of holding portions 32a is arbitrary. For example, you may comprise as an 8 series arm.

The transfer device 300 is a device that transfers the chip S picked up by the pickup device 32 on a transfer path T of a circular orbit. The transport apparatus 300 includes a rotating body 310 as in the above embodiment. However, the rotating body 310 of the present embodiment is provided with a plurality of holding portions 22. The holding unit 22 has the same configuration as that of the holding device 200 described above. However, the holding part 22 is attached to the lower surface of the rotating body 310 at regular intervals along a circumference concentric with the rotating body 310. The holding unit 22 receives and holds the chip S from the holding unit 32a of the pickup device 32 at the delivery position. And the chip | tip S is conveyed in the circumferential direction by rotating the rotary body 310. FIG. The arrangement interval of the holding portions 22 is equal to the rotation angle of one pitch of the rotator 310.

The holding unit 22 is configured by a suction nozzle provided on the lower surface of the rotating body 310 so as to be movable back and forth in the vertical direction. The suction nozzle sucks the chip S into the suction hole at the tip by generation of negative pressure by a vacuum generator (not shown), and detaches the chip S from the suction hole at the tip by vacuum break or generation of positive pressure.

The sticking device 33 is a device for sticking the chips S transported by the transport device 300 to the wafer sheet Db of the first collecting device 600 and the wafer sheet Dc of the second collecting device 700 in a corresponding rank. It is. The sticking device 33 is provided corresponding to each of the first collecting device 600 and the second collecting device 700. The sticking device 33 has a holding portion 33 a similar to the holding portion 32 a of the pickup device 32.

For example, as shown in FIG. 18, a plurality of holding portions 33a that rotate intermittently can be used, or as shown in FIG. 19, a holding portion 33a that can reciprocate can be used. According to such an operation, the tip of the holding unit 33a is received at the receiving position facing the holding unit 22 of the transfer device 300, and receives the chip S from the holding unit 22, and is attached at the bonding position facing the wafer sheet Db and the wafer sheet Dc. The chip S is attached to the wafer sheet Db and the wafer sheet Dc.

(2) In the above embodiment, a unique batch scan is used as the pickup method. Accordingly, even if the wafer sheet Da has a variation in the position of the chip S due to expansion and contraction, accurate pickup can be performed. Therefore, even if the exchange frequency of the wafer sheet Da increases, the accuracy of pickup and pasting can be increased. There is an advantage that it can be maintained. However, the pickup method is not limited to this, and any technology that can be used at present or in the future can be applied.

(3) In the above embodiment, the transport path T is a horizontal circular orbit, but may be a vertical circular orbit. For example, as the configuration in which the transport device 300 is vertically raised, the support device 100, the transport device 300, the measurement device 400, the correction device 500, the first collection device 600, and the second collection device 700 are arranged around the support device 100. May be. The pitch of intermittent rotation, the number of stop positions, the number of holding devices, the number of holding units, and the like of the transfer device 300 are not limited to those exemplified in the above embodiment. The measuring apparatus 400 may omit the post-measurement unit 40B.

(4) A reference chip, a partial area or a guarantee area where an error has occurred, an error frequency, and the like are recorded by the storage unit 19 and output by the output unit 82 to analyze an area where an error is likely to occur. May be useful.

(5) The number and position of reference chips, the number and range of guaranteed areas corresponding thereto, and the number and range of partial areas can be freely set as long as the scanning process can be performed comprehensively. If these numbers are large, there is an advantage that the range of scan processing re-executed due to the occurrence of an error is reduced. If these numbers are small, the number of reference inspections is small, and if there are few errors, the speed can be increased. Therefore, it is sufficient to make an appropriate setting based on the balance between the two. By setting a partial area, the number of reference inspections increases, and the range of scan re-execution due to the occurrence of an error decreases, but by setting only a guaranteed area without setting a partial area, there should be fewer errors Therefore, the processing speed can be increased.

(6) The wafer sheet, the imaging unit, and the pickup device may be in a relative moving relationship. For this reason, the wafer ring to which the wafer sheet is stuck may be fixed by the ring support mechanism, and the relative movement may be realized by the moving mechanism (scanning mechanism) of the imaging unit and the pickup device. The coordinate data in this case can be acquired as coordinate values (x, y, θ) of the encoder information of the moving mechanism.

(7) The storage unit for storing the wafer ring and the ring transport mechanism for setting the wafer ring in the ring moving mechanism are not limited to those exemplified in the above embodiment, and any known technique can be applied. Further, a discharge device for discharging the ring from the ring moving mechanism may be provided. As the holding device and the holding unit, any technique capable of holding a chip can be applied. For example, an electrostatic chuck, a Bernoulli chuck, a mechanical chuck, or the like may be applied in addition to the suction nozzle.

(8) The above embodiment is an exemplification, and various omissions, replacements, and changes can be made without departing from the scope of the present invention. These embodiments and modifications thereof are included in the invention described in the scope of claims and the equivalents thereof.

1

Classification device

2A, 2B, 2C

Ring moving mechanism

3A, 3B, 3C Expanding mechanism

4A Separating mechanism

5A, 5B, 5C Autoloader 6 Cam mechanism

6a Cam follower

6b Cylindrical cam 7

Boil coil motor

8, 55b Compression spring 11 Mechanism controller 12 Reference Detection unit 13 Scan unit 14 Reference inspection unit 16 Correction instruction unit 17 Pasting instruction unit 18 Coordinate detection unit 19 Storage unit 21

Ring holder

22, 32a, 33a Holding unit 31 Pull unit 32 Pickup device 33 Pasting device 40A Pre-measurement unit 40B Post measurement Portion 41a Pin 51 Collet 52 Base 53 X-axis moving mechanism 54 Y-axis moving mechanism 55 Z-axis moving mechanism 55a Support frame 56 θ-

axis rotating mechanisms

60a, 60b,

60c Imaging units

61a, 61b,

61c Cameras

62a, 62b, 62c Optical system Member 71 Coil bobbin 8 Input unit 82 Output unit 100 Support device 110 Storage unit 111 Supply magazine 120 Ring transport mechanism 121 Clamp 122 Fork 200 Holding device 210 Suction nozzle 300 Transport device 310 Rotating body 400 Measuring device 600 First collection device 700 Second collection device 800 Control device Da, Db, Dc Wafer sheet Ra, Rb, Rc Wafer ring B Base S Chip T Transport path W Wafer

Claims

A support device that supports a wafer sheet in which chips having different ranks indicating the degree of quality are mixed, and the chips are separated into pieces by dicing;
A pick-up device that selectively picks up the chips separated by stretching the wafer sheet supported by the support device based on the rank;
A transfer device for transferring the chips picked up by the pickup device in a transfer path of a circular orbit,
A measuring device for measuring the positional deviation of the chips conveyed by the conveying device;
A correction device that is disposed in the vicinity of the conveyance path and corrects the posture of the chip based on the posture deviation measured by the measurement device;
A first collecting device that is disposed downstream of the correction device in the vicinity of the transport path and supports a wafer sheet to which a chip of one type is attached among the chips whose postures are corrected by the correction device. When,
A wafer sheet, which is disposed downstream of the first collection device in the vicinity of the conveyance path and has a posture corrected by the correction device, supports a wafer sheet to which another type of rank chip is attached. A second collection device;
A sticking device for attaching the chips transported by the transporting device to the wafer sheet of the first collecting device and the wafer sheet of the second collecting device in a corresponding rank;
An exchange device for sequentially exchanging the picked-up wafer sheet to a wafer sheet from which the two kinds of rank chips are not picked up after all the two kinds of rank chips are picked up from the wafer sheet of the support device;
A classification apparatus comprising:
2. The classification apparatus according to claim 1, wherein the two kinds of ranks are two kinds of ranks having the largest number in the number distribution of chips in the same wafer.
The transport device transports the chip in an intermittent operation at a predetermined pitch,
In the state where the number of the specific one type of rank and the other type of the same number of ranks is the same, the sticking device is configured to stop the wafer sheet of the first collection device and the second collection device at the stop timing in the intermittent operation. 3. The classification apparatus according to claim 1, wherein a chip is attached to any one of the wafer sheets.
The pickup device and the sticking device are holding devices that hold a chip at the tip,
The transport device has a rotating body that rotates intermittently at a predetermined pitch,
The plurality of holding devices are provided on the rotating body,
The plurality of holding devices are arranged at positions where their tips are arranged at equal intervals corresponding to the predetermined pitch on the transport path. Classification device.
A holding device that comes to a position corresponding to the first collecting device and a holding device that comes to a position corresponding to the second collecting device at the same time hold chips of the same rank in the pickup. The classification device according to claim 4.
A coordinate detection unit that detects position coordinates of chips attached to the wafer sheet of the first collection device and the wafer sheet of the second collection device;
The first collection device and the second collection device adjust a chip attachment position based on the coordinates of a pasted chip detected by the coordinate detection unit. The classification device according to any one of 1 to 5.
The measuring device is
A pre-measuring unit that measures a positional deviation of the chip upstream of the correction device in the transport path;
A post-measuring unit that measures the positional deviation of the chip downstream of the correction device in the transport path;
Have
The correction device corrects the posture of the chip based on the posture deviation measured by the previous measurement unit,
7. The chip collecting apparatus according to claim 1, wherein the first collecting device and the second collecting device correct the posture of the chip based on the posture deviation measured by the post-measurement unit. Classification device according to.
An image pickup unit that picks up an image of a chip divided into individual pieces while moving relative to the wafer sheet based on coordinate data by extending the wafer sheet supported by the support device;
Based on the image data captured by the imaging unit, a reference chip with a specific mark is found among the chips in the wafer, and the coordinates of the reference chip are based on the coordinate data for the relative movement of the imaging unit. A reference detection unit for performing a reference detection process for identifying data;
With reference to the coordinate data of the reference chip and the relative position information of each chip in the wafer, the image pickup unit picks up each chip while moving relative to the wafer sheet, and the image pickup unit moves relative to the wafer sheet. Based on the coordinate data, a scanning unit that performs a scanning process that identifies the coordinate data of each chip,
Have
The pickup device selectively picks up a chip while moving relative to a wafer sheet based on the coordinate data of each chip specified by the scan unit and rank information of each chip. The classification device according to any one of claims 1 to 7.