CN117038548B

CN117038548B - Wafer slicing device and wafer detection method

Info

Publication number: CN117038548B
Application number: CN202311291517.6A
Authority: CN
Inventors: 石刚; 胡飞; 张军; 姜超; 陈国炜
Original assignee: Ningxia Jinghuan New Material Technology Co ltd; Inner Mongolia Jinghuan Electronic Materials Co ltd
Current assignee: Ningxia Jinghuan New Material Technology Co ltd; Inner Mongolia Jinghuan Electronic Materials Co ltd
Priority date: 2023-10-08
Filing date: 2023-10-08
Publication date: 2024-02-13
Anticipated expiration: 2043-10-08
Also published as: CN117038548A

Abstract

The invention relates to a wafer slicing device and a wafer detection method, wherein the wafer slicing device comprises: the wafer separating device comprises a carrying platform, a wafer separating device and a wafer separating device, wherein a material area for accommodating and abutting wafers to be separated is arranged on the carrying platform, and one side of the material area, which is far away from the carrying platform, is provided with an opening; an adsorption member for adsorbing the wafer and taking out the separated wafer through the opening; the wafer cassette is arranged on the carrying platform and is provided with an accommodating chamber with an opening; the transfer piece is arranged on the carrying platform and faces the opening of the accommodating chamber and is used for transferring the wafer to the accommodating chamber; and the operating unit is connected to the carrier and comprises an operating body and a transfer component, the adsorption component is arranged on the transfer component, and the transfer component is movably arranged on the operating body and is used for transferring the wafer to the transfer component. The wafer slicing device can automatically slice and transfer the separated wafers into the accommodating chamber of the wafer cassette to replace manual operation.

Description

Wafer slicing device and wafer detection method

Technical Field

The present invention relates to the field of wafer production technology, and in particular, to a wafer dicing apparatus and a wafer inspection method.

Background

In the preparation of some wafers, it is necessary to anneal the wafer to relieve the stress of the wafer. In annealing, a plurality of wafers are stacked and annealed, and after annealing, the stacked wafers are separated from each other to perform inspection, processing, and packaging, and this process is called dicing. After slicing, the wafers are plugged into the accommodating chamber of the wafer cassette one by one so as to facilitate the post-process, and at present, the operation and the slicing process are completed manually. However, there are many uncertainties in manual operation, and errors are likely to occur to damage the wafer. Therefore, it is necessary to design a wafer dicing apparatus for automatically dicing and transferring the diced wafers into the chamber of the cassette.

Disclosure of Invention

Based on this, it is necessary to provide a wafer dicing apparatus capable of automatically dicing and automatically transferring the divided wafers into the chamber of the cassette instead of manual operation, in view of the above-described problems.

In order to solve the problems, the invention provides the following technical scheme:

a wafer dicing apparatus comprising:

the wafer slicing device comprises a carrying platform, a wafer loading device and a wafer loading device, wherein a material area for accommodating and abutting wafers to be sliced is arranged on the carrying platform, and an opening is formed in one side, away from the carrying platform, of the material area;

an adsorption member for adsorbing the wafer and taking out the separated wafer through the opening;

the wafer cassette is arranged on the carrying platform and is provided with an opening containing chamber;

the transfer piece is arranged on the carrying platform and faces the opening of the accommodating chamber and is used for transferring the wafer to the accommodating chamber; and

The handling unit is connected to the carrier, the handling unit comprises a handling body and a transfer component, the adsorption component is arranged on the transfer component, and the transfer component is movably arranged on the handling body and used for transferring the wafer to the transfer component.

The invention has at least the following beneficial effects:

the stacking wafers can be placed in the material area and abutted against the material area, then the adsorption piece sucks the top wafer and lifts the top wafer up, the top wafer is subjected to upward force, and the lower wafer is subjected to downward friction force because the lower wafer of the top wafer is abutted against the top wafer, so that the adsorption piece is continuously moved upwards, and the top wafer and the lower wafer are separated under the action of force, so that automatic slicing is realized. The above operations are repeatedly performed so that the wafers can be separated one by one.

And, the separated wafers can be transferred to the transfer member by moving the suction member, and the separated wafers enter the chamber of the cassette through the transfer member. Thus, the wafer slicing device can automatically transfer the separated wafers into the accommodating chamber of the wafer cassette.

In one embodiment, the included angle between the chamber of the cassette and the plane of the stage is a first acute angle; the included angle between the transfer surface of the transfer piece for transferring the wafer and the plane of the carrying platform is a second acute angle, and the first acute angle is equal to the second acute angle.

The wafer placed in the middle rotating piece can slide into the accommodating chamber along the inclined middle rotating surface under the action of self gravity, and the wafer in each accommodating chamber can slide to the lowest position of the accommodating chamber, so that the alignment of the positions of the wafers can be ensured, and the regular stacking of the wafers is realized.

In one embodiment, the transfer assembly comprises a movable part movably arranged on the control body and a connecting part movably connected with the movable part, the adsorption part is arranged on the connecting part, the control unit further comprises an auxiliary posture adjusting part arranged on the control body, and the auxiliary posture adjusting part is positioned on a movable path of the connecting part so as to press against the connecting part and force the connecting part to move relative to the movable part to change the posture of the connecting part when the connecting part moves to the auxiliary posture adjusting part.

The arrangement can adjust the posture of the wafer adsorbed by the adsorption piece so as to adjust the included angle between the wafer and the plane of the carrying platform to a first angle, thereby enabling the wafer to be parallel to the middle rotating surface.

In one embodiment, the transferring assembly further comprises an elastic piece, the elastic piece is arranged on the movable piece, the connecting piece is arranged on the elastic piece, and the auxiliary posture adjusting piece abuts against the connecting piece to deform the elastic piece when the connecting piece moves to the auxiliary posture adjusting piece.

By the arrangement, the wafer slicing device can finish the adjustment of the wafer posture in a smaller space.

In one embodiment, the top side of the connector is curved.

After the connecting piece contacts the auxiliary posture adjusting piece, the deformation degree of the elastic piece is continuously increased along with the continuous approach of the connecting piece to the auxiliary posture adjusting piece, so that the posture of the wafer can be adjusted.

In one embodiment, the cassette and/or the transfer member may be disposed on the carrier in a liftable manner; and the wafer cassette and/or the transfer member is/are horizontally movably arranged on the carrying platform.

This arrangement facilitates alignment of the transfer surface with the opening of the chamber to slide the wafer from the transfer surface into the chamber.

In one embodiment, the transferring member is provided with a pushing member, and the pushing member extends from the transferring member toward the cassette.

So arranged, the wafer on the transfer surface can be pushed into the chamber by the pushing member.

In one embodiment, the wafer slicing device further comprises a plurality of abutting pieces, the abutting pieces are circumferentially and alternately arranged on the carrying platform and enclose the carrying platform to form a material area, at least one of the abutting pieces is provided with an air jet, and the air jet faces the material area.

By the arrangement, the stacked wafers can be placed in the material area and supported by the plurality of abutting pieces, the air jet is used for jetting the stacked wafers, so that the adhesion relationship between the adjacent wafers can be destroyed, the adhesion degree between the adjacent wafers is reduced, and the two adjacent wafers can be separated conveniently. Then the adsorption piece sucks the top wafer and lifts the top wafer up, the top wafer is subjected to upward force, and because the wafer below the top wafer is abutted by the abutting piece, the wafer below the top wafer is subjected to downward friction force, the adsorption piece is continuously moved upwards, and the top wafer and the wafer below are separated under the action of the force. The above operations are repeatedly performed so that the wafers can be separated one by one. In the process of slicing by using the wafer slicing device, gas sprayed from the gas spraying ports 21 is sprayed between the top wafer and the adjacent lower wafer, so that the top wafer is supported, and the top wafer and the adjacent wafers are prevented from being damaged due to collision or extrusion of the top wafer with the adjacent wafers.

In one embodiment, at least one side of the abutting piece facing the material area is convexly provided with an elastic protruding part.

In this way, in the step of lifting the suction member to separate the top wafer from the lower wafer, the peripheral surface of the lower wafer may be scratched by the elastic protrusions, so that the lower wafer is subjected to a downward force, and the top wafer is assisted to be separated from the lower wafer.

In one embodiment, the interference member is a rod member, and the gas nozzle is disposed along an axial direction of the interference member.

By the arrangement, the peripheral surfaces of the wafers can be sprayed by the air spraying openings, so that the adhesion relationship between the adjacent wafers can be destroyed.

In one embodiment, the wafer dicing device further comprises a detection unit arranged on the carrying platform, the detection unit comprises a supporting piece and at least two cameras, the supporting piece comprises a hollow supporting platform, the cameras face the supporting platform, at least one camera is located below the supporting platform, and at least one camera is located above the supporting platform.

The camera below the supporting table can shoot the bottom surface of the wafer through the through holes in the supporting table, and the camera above the supporting table can shoot the top surface of the wafer, so that whether the front surface and the back surface of the wafer are good or not can be detected according to the images shot by the cameras.

In one embodiment, the detecting unit further comprises a gesture adjusting member, the gesture adjusting member is movably arranged on the carrying platform, and the supporting platform is located on the moving path of the gesture adjusting member.

The wafer is inclined by lifting one side of the wafer by moving the posture adjusting member toward the support table, so that the wafer is in the inclined second posture. In the first posture and the second posture, cameras below the supporting table and above the supporting table are used for respectively shooting the bottom surface and the top surface of the wafer, so that the bottom surface image and the top surface image of the wafer in the first posture and the bottom surface image and the top surface image of the wafer in the second posture can be obtained. This corresponds to polishing the wafer with the lamp belt at two different angles and acquiring images of the front and back surfaces of the wafer in these two states, respectively, thereby preventing the omission of part defects and scratches on the wafer surface.

In one embodiment, the posture adjusting member is located below the supporting table, and the posture adjusting member includes a first telescopic shaft which is lifted relative to the carrying table.

The invention also provides a wafer detection method which is used for the wafer slicing device and comprises the following steps:

placing the separated wafer on a supporting table horizontally so that the wafer is in a first posture;

shooting the top surface and the bottom surface of the wafer by using a camera to acquire a bottom surface image and a top surface image of the wafer in a first posture;

obliquely placing the wafer on a supporting table so that the wafer is in a second posture;

and shooting the top surface and the bottom surface of the wafer by using a camera to acquire a bottom surface image and a top surface image of the wafer in the second posture.

The wafer inspection method simulates the manual inspection of the wafer surface, namely: changing the posture of the wafer, and observing the surface of the wafer under different postures. Therefore, partial defects and scratches on the surface of the wafer can be prevented from being ignored, the detection precision is improved, the subsequent step of manually detecting the surface of the wafer is reduced, the process of preparing the wafer is simplified, and the process of preparing the wafer is optimized.

Drawings

FIG. 1 is an isometric view of a wafer dicing apparatus according to an embodiment of the invention;

FIG. 2 is an enlarged schematic view of FIG. 1 at A;

FIG. 3 is a schematic view illustrating the positional relationship of three abutting members in the embodiment shown in FIG. 1;

FIG. 4 is a schematic view of a stack of wafers received within the material section of the wafer dicing apparatus of FIG. 1;

FIG. 5 is a schematic structural view of the detecting unit and the posture adjusting member in the embodiment shown in FIG. 1;

FIG. 6 is a schematic view of the wafer dicing apparatus of FIG. 1 in another view, wherein the wafer is not placed on the supporting table;

FIG. 7 is a schematic view of a wafer laying-out apparatus of FIG. 1 with a wafer in a first position;

FIG. 8 is an isometric view of a wafer dicing apparatus according to another embodiment of the invention, wherein a shield is added to the embodiment of FIG. 8 as compared to the embodiment of FIG. 1;

FIG. 9 is a schematic view of a wafer dicing apparatus shown in FIG. 1 with a wafer tilted, wherein one side of the wafer is lifted by a first telescopic shaft, and the wafer is in a second posture;

FIG. 10 is a schematic diagram showing the positional relationship of a portion of the structure of the embodiment shown in FIG. 1;

FIG. 11 is a top view of the wafer dicing apparatus of FIG. 1;

FIG. 12 is a front view of the wafer dicing apparatus of FIG. 1;

FIG. 13 is a left side view of the wafer dicing apparatus of FIG. 1;

FIG. 14 is a schematic diagram showing the connection of a portion of the structure of the embodiment shown in FIG. 1;

fig. 15 is a schematic diagram showing the positional relationship of a part of the structure in the embodiment shown in fig. 1.

Reference numerals:

1. a carrier; 11. a notch;

2. a contact member; 21. an air jet; 22. an elastic protruding portion;

3. an absorbing member;

4. a material zone; 41. an opening;

5. a detection unit; 51. a support; 511. a support table; 5111. a receiving groove; 512. a first bracket; 52. a camera; 53. a second bracket; 54. a protective cover;

6. a posture adjusting piece; 61. a first telescopic shaft; 62. a first base;

7. a cassette; 71. a housing;

8. a transfer member; 81. a transfer surface;

9. a manipulation unit; 90. a transfer assembly; 91. a manipulation body; 911. a rotating electric machine; 92. a movable member; 93. an elastic member; 94. a connecting piece; 95. an auxiliary posture adjusting piece;

100. a pushing member; 101. a second telescopic shaft; 102. a second seat body; 103. a mounting plate; 104. a clamping plate; 105. wedge blocks; 106. a rotating roller; 107. a lifting table; 1071. a base; 1072. a platform; 108. a straight line cylinder; 109. a finger cylinder; 1091. clamping jaw.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Referring to fig. 1 and 2, the present invention firstly provides a wafer dicing apparatus, which can be used for separating a semiconductor wafer (e.g. silicon wafer, silicon carbide wafer) from a non-semiconductor wafer (e.g. sapphire wafer, ceramic wafer), comprising a carrier 1, a supporting member 2 and an adsorbing member 3.

Referring to fig. 1 in combination with fig. 2 and 3, a plurality of abutting members 2 are provided, and the plurality of abutting members 2 are circumferentially and alternately arranged on the carrying platform 1 and form a material area 4 together with the carrying platform 1. Referring to fig. 4, the material section 4 is for receiving and abutting a stack of wafers to be singulated. The material section 4 has an opening 41 on the side facing away from the carrier 1, through which opening 41 a stack of wafers can be placed in the material section 4 and the individual wafers separated off can be removed through the opening 41. After being placed in the material area 4, the stacked wafers are held together by the plurality of holding members 2. Wherein, be equipped with jet 21 on at least one conflict piece 2, jet 21 is towards material district 4, utilizes jet 21 to jet to the outer peripheral face of pile wafer, just can destroy the adhesion relation between the adjacent wafer, reduces the adhesion degree between the adjacent wafer to separate two adjacent wafers.

Referring to fig. 1 and 2, the adsorbing member 3 is movably disposed on the carrier 1, and when the wafer is sliced, the adsorbing member 3 enters the material area 4 from the opening 41 or the gap between two adjacent abutting members 2 and adsorbs the top wafer in the stack of wafers. When the subsequent wafer is split, the adsorption piece 3 moves upwards, the top wafer is subjected to upward force, and because the wafer below the top wafer is abutted by the abutting piece 2, the wafer below the top wafer is subjected to downward friction force, the adsorption piece 3 is continuously moved upwards, and the top wafer and the wafer below the top wafer are separated under the action of force, so that automatic wafer splitting is realized. The stacked wafers can be separated one by repeatedly performing the above operations. In the process of slicing by using the wafer slicing device, gas sprayed from the gas spraying ports 21 is sprayed between the top wafer and the adjacent lower wafer, so that the top wafer is supported, and the top wafer and the adjacent wafers are prevented from being damaged due to collision or extrusion of the top wafer with the adjacent wafers.

In summary, the wafer dicing device is applied to dicing as follows:

first, a stack of stacked wafers is placed in the material section 4 so that the stacked wafers are commonly abutted by the plurality of abutting pieces 2, as shown in fig. 4.

Next, the stack of wafers is sprayed with air through the air nozzle 21 to break the adhesion relationship between the adjacent wafers.

Then, the top surface of the top wafer is sucked by the suction member 3;

finally, the suction member 3 is lifted to separate the top wafer from the lower wafer.

The stacked wafers can be separated one by repeating the above steps.

It should be noted that, when three or more wafers remain in the stack, the "top wafer" refers to the uppermost wafer; when only two wafers remain in the stack, the "top wafer" refers to the wafer above; when only one wafer remains in the stack, the term "top wafer" refers to the wafer.

Referring to fig. 1 and 2, a notch 11 is provided on a portion of the carrier 1 near the material area 4, and the notch 11 completely penetrates the carrier 1 along the plumb direction and penetrates one side of the carrier 1 along the horizontal direction and extends to the lower portion of the material area 4. The provision of the notch 11 facilitates manual or robotic handling during placement of the stack of wafers in the material section 4.

Specifically, in some embodiments, the suction member 3 is a suction nozzle and communicates with a vacuum generator. When the vacuum generator works, negative pressure is formed on the bottom surface of the adsorption piece 3, and the adsorption piece 3 adsorbs the top wafer through the negative pressure. The vacuum generator may be provided on the carrier 1, or on other structures on the wafer dicing apparatus, or on the ground. Of course, in other embodiments, the suction member 3 may be a suction cup, and the suction member 3 may be in communication with a vacuum pump. The present invention is not particularly limited in the structure of the adsorbing member 3 and the means for generating negative pressure communicating therewith.

Referring to fig. 1 and 2, in some embodiments, the wafer slicing apparatus includes a handling unit 9 connected to the stage 1, and the handling unit 9 is used to handle the movement of the suction member 3, so that the suction member 3 moves to the top wafer to suck the top wafer, and the suction member 3 moves upward to separate the top wafer from the stacked wafers. The manipulation unit 9 may employ a robot, and the user may determine the number of translation arms and rotation arms of the robot employed as needed. Of course, the manipulation unit 9 may be composed of a sliding pair and a rotating pair. The present invention does not particularly limit the structure of the manipulation unit 9.

Referring to fig. 1, 2 and 3, the three supporting members 2 are provided, and the three supporting members 2 are rods and uniformly stand on the carrier 1 along the circumferential direction. In other embodiments, four or more interference members 2 may be provided, or only two may be provided. In some embodiments, in which only two contact members 2 are provided, at least one contact member 2 is rounded on the side facing the material zone 4 and is adapted to the outer circumferential surface of the wafers, so that the contact members 2 are stably brought into contact with the stack of wafers.

Referring to fig. 3, one side of one of the abutting pieces 2 facing the material area 4 is convexly provided with an elastic protrusion 22. Thus, in the step of lifting the suction member 3 to separate the tip wafer from the lower wafer, the outer peripheral surface of the lower wafer can be scratched by the elastic protrusions 22 to subject the lower wafer to a downward force, helping the separation of the tip wafer from the lower wafer. Of course, in other embodiments, the elastic protruding portions 22 may be protruding on the sides of the plurality of abutting pieces 2 facing the material area 4.

Referring to fig. 3, the abutting member 2 is provided with a plurality of elastic protrusions 22, and the elastic protrusions 22 are spaced along the plumb direction, so that in the step of lifting the absorbing member 3 to separate the top wafer from the lower wafer, the plurality of elastic protrusions 22 scrape the plurality of lower wafers, thereby better helping the separation of the top wafer from the lower wafer. In other embodiments, only one elastic protrusion 22 may be provided on the abutting member 2 near the stage 1 to scrape the bottom wafer among the stacked wafers.

In some embodiments, the spacing between adjacent two resilient protrusions 22 is greater than the wafer thickness and less than twice the wafer thickness. Thus, in the step of lifting the suction member 3 to separate the top wafer from the lower wafer, some wafers can be switched between the two states of contacting the elastic convex portion 22 and disengaging the elastic convex portion 22, and there is a bumpy process, which is advantageous in breaking the stuck relationship between the adjacent wafers.

Referring to fig. 3, the gas nozzles 21 are disposed along the axial direction of the interference member 2. Thus, the outer peripheral surfaces of the plurality of wafers can be injected with the gas injection ports 21, thereby breaking the adhesion relationship between the plurality of sets of adjacent wafers.

Referring to fig. 2, in order to better break the adhesion between adjacent wafers, gas nozzles 21 are provided on both of the abutting members 2. Of course, in other embodiments, the air nozzles 21 may be provided on more than two or on one of the interference members 2.

In the embodiment shown in fig. 1, in order to achieve the air injection of the air injection port 21, a cavity is axially provided inside the interference member 2 provided with the air injection port 21, and the cavity is communicated with an air source. The air source can be a compressed air system or an air compressor. The air supply line can be connected with the interference piece 2 through a quick plug so as to be communicated with the cavity in the interference piece 2.

It can be understood that the size of the air nozzle 21 directly affects the pressure of the air ejected from the air nozzle 21, so that a plurality of types of interference pieces 2 can be manufactured, the sizes of the air nozzle 21 on the interference pieces 2 with different specifications are different, and a user can select the interference piece 2 with the proper specification to be mounted on the carrier 1 according to the requirement for slicing the wafer with the specific specification.

In the embodiment shown in fig. 1, a plurality of mounting positions for mounting the abutting members 2 are disposed on the carrier 1, the abutting members 2 are detachably mounted on the carrier 1 through the mounting positions, and the abutting members 2 are mounted on different mounting positions, so that the size of the material area 4 can be adjusted to accommodate and abut against wafers of different specifications. Specifically, a through hole matched with the abutting piece 2 is formed in each mounting position, and the abutting piece 2 is inserted into the through hole.

After separating the wafers from the stack of wafers, it is necessary to check whether the front and back sides of the separated wafers (i.e., the top and bottom sides of the wafers) are good.

Referring to fig. 5 in combination with fig. 2, the wafer slicing apparatus further includes a detecting unit 5 disposed on the carrier 1, the detecting unit 5 includes a supporting member 51, the supporting member 51 includes a supporting table 511 and a first bracket 512, the first bracket 512 is fixedly disposed on or integrally formed with the carrier 1, and the supporting table 511 is fixedly disposed on or integrally formed with the first bracket 512. The support base 511 has a hollow structure, in other words, a through hole is provided in the support base 511.

In contrast to fig. 6 and 7, the suction member 3 places the separated wafer flat on the support table 511 under the manipulation of the manipulation unit 9 so that the wafer is in the first posture. Referring to fig. 5, the inspection unit 5 further includes two cameras 52 facing the support 511, wherein one camera 52 is located below the support 511 to photograph the bottom surface of the wafer through the through hole on the support 511, and the other camera 52 is located above the support 511 to photograph the top surface of the wafer, so that whether the front and back surfaces of the wafer are good can be inspected according to the images photographed by the two cameras 52. Of course, in other embodiments, three or more cameras 52 may be provided facing the support 511 to capture the wafer from multiple angles, but at least one camera 52 is located below the support 511 and at least one camera 52 is located above the support 511.

Referring to fig. 5, the camera 52 is fixed to the carrier 1 through a second bracket 53. In contrast to fig. 6 and 8, in some embodiments, the detection unit 5 further includes a hollow protection cover 54, the protection cover 54 is provided on the stage 1, and the camera 52 located below the support stage 511 is provided in the protection cover 54. The shield 54 can block the air flow emitted from the air nozzle 21 to prevent the camera 52 located below the support table 511 from being unstable in imaging due to disturbance of the air flow, and can prevent impurities in the external environment from being blown onto the lens of the camera 52 located below the support table 511.

In the embodiment shown in fig. 8, the protection cover 54 is a hollow cylinder, and the bottom side of the protection cover 54 is attached to the carrier 1. Of course, in other embodiments, the shield may be hollow structures of other shapes, such as hollow square columns, hollow hemispheres.

In some embodiments, a lamp strip is provided on the support table 511 for polishing the wafer so that the camera 52 can obtain a good wafer image. The supporting table 511 is provided with a receiving groove 5111 for receiving a wafer, and the receiving groove 5111 is circular.

Some wafers are transparent, and when inspected, polishing the wafer at a fixed angle with the lamp strip ignores some defects and scratches. Referring to fig. 5, to solve this problem, the detecting unit 5 further includes a posture adjusting member 6, the posture adjusting member 6 being movably provided to the stage 1, the support 511 being located on a moving path of the posture adjusting member 6, specifically, a through hole of the support 511 being located on the moving path of the posture adjusting member 6. When the posture adjustment member 6 is moved toward the support base 511, one side of the wafer is lifted up to tilt the wafer, and the wafer is placed in the second tilted posture, as shown in fig. 9. In the first posture and the second posture, the bottom surface and the top surface of the wafer are photographed with the cameras 52 located below the support table 511 and above the support table 511, respectively, so that the bottom surface image and the top surface image of the wafer in the first posture and the bottom surface image and the top surface image of the wafer in the second posture can be obtained. This corresponds to polishing the wafer with the lamp belt at two different angles and acquiring images of the front and back surfaces of the wafer in these two states, respectively, thereby preventing the omission of part defects and scratches on the wafer surface.

It should be noted that this method of inspecting the surface of the wafer simulates the manual inspection of the surface of the wafer, namely: changing the posture of the wafer, and observing the surface of the wafer under different postures. The method can improve the detection precision, reduce the subsequent step of manually detecting the surface of the wafer, simplify the process of wafer preparation and optimize the process of wafer preparation.

Referring to fig. 5, the posture adjusting member 6 is located below the supporting table 511, specifically below the through hole of the supporting table 511, where the posture adjusting member 6 includes a first seat 62 and a first telescopic shaft 61, the first seat 62 is fixedly disposed or integrally formed on the carrier 1, and the first telescopic shaft 61 is lifted and arranged on the first seat 62. Thus, the first telescopic shaft 61 can be lifted up and down relative to the stage 1, and the wafer can be lifted up by the first telescopic shaft 61 through the through hole to be in the second posture. Specifically, the first telescopic shaft 61 may form a sliding connection with the first housing 62 or form a ball screw pair with the first housing 62.

Of course, in other embodiments, the posture adjusting member 6 may be rotatably connected to the stage 1 and moved toward the support table 511 by rotation to lift the wafer.

Referring to fig. 2 and 10, the wafer slicing apparatus further includes a cassette 7 and a transfer member 8, where the cassette 7 and the transfer member 8 are both disposed on the carrier 1. The transfer member 8 is for transferring wafers to the chamber to receive the wafers, and specifically, the cassette 7 has an open chamber 71, and the transfer member 8 is disposed toward the opening of the chamber 71. Thus, the wafer can be placed on the transfer member 8, and then transferred into the chamber 71 from the opening of the transfer member 8 facing the chamber 71.

Referring to fig. 2 and 10, the transfer member 8 has a transfer surface 81 for transferring wafers, and the transfer surface 81 and the chamber 71 of the cassette 7 are inclined with respect to the stage 1. Specifically, the plane of the chamber 71 and the stage 1 has an acute angle of a first acute angle, and the plane of the transfer surface 81 and the stage 1 has an acute angle of a second acute angle, where the first acute angle is equal to the second acute angle. Thereby, the wafers placed on the transfer member 8 can slide into the chambers 71 along the inclined transfer surface 81 by the self-weight force, and the wafers in the respective chambers 71 can slide to the lowest position of the chambers 71, which is advantageous for achieving the orderly stacking of the wafers.

Referring to fig. 11 in combination with fig. 10, a wedge block 105 is provided on the carrier 1, a plurality of rollers 106 are provided in the wedge block 105, the rollers 106 are rotatably connected to the wedge block 105, the outer peripheral surface of the rollers 106 is flush with the inclined surface of the wedge block 105, and the bottom side of the cassette 7 is abutted against the outer peripheral surface of the rollers 106 in a bonding manner. The angle between the inclined surface of the wedge 105 and the plane of the carrier 1 is as follows: when the bottom side of the cassette 7 contacts the wedge 105, the included angle between the chamber 71 and the plane of the stage 1 is a first acute angle. Therefore, when the cassette 7 is replaced, the inclination angle of the chamber 71 can be quickly adjusted to the first acute angle only by abutting the bottom side of the cassette 7 against the outer peripheral surface of the roller 106, thereby realizing quick replacement and installation of the cassette 7. The roller 106 is provided to reduce abrasion of the bottom side of the cassette 7.

Referring to fig. 2 and 10, the transfer member 8 is provided with a pushing member 100, and the pushing member 100 is telescopically arranged from the transfer member 8 toward the cassette 7. Thereby, the wafer on the transfer surface 81 can be pushed into the chamber 71 by the pusher 100.

In the embodiment shown in fig. 10, the pusher member 100 is a balloon-like telescoping member. In other embodiments, the pusher 100 may also be a small telescopic cylinder.

Referring to fig. 2 in combination with fig. 11, 14, 15, the manipulation unit 9 includes a manipulation body 91, a transfer assembly 90, and an auxiliary posture adjustment member 95. The transfer assembly 90 is used for transferring the wafer suctioned by the suction member 3 to the transfer member 8, and includes a movable member 92 and a connecting member 94. The movable member 92 is movably disposed on the manipulating body 91, the connecting member 94 is movably connected to the movable member 92, and the adsorbing member 3 is disposed on the connecting member 94. The auxiliary posture adjusting member 95 is disposed on the manipulating body 91 and is disposed on a moving path of the connecting member 94 so as to force the connecting member 94 to move relative to the moving member 92 to change the posture of the connecting member 94 when the connecting member 94 moves to the auxiliary posture adjusting member 95, thereby adjusting the posture of the adsorbing member 3 and further adjusting the posture of the wafer adsorbed by the adsorbing member 3. After the included angle between the wafer and the plane of the carrier 1 is adjusted to a first angle, the wafer is placed on the transfer surface 81, at this time, the wafer is parallel to the transfer surface 81, and the adsorbing member 3 attaches the wafer to the transfer surface 81 under the operation of the operating device. Then, the means for generating negative pressure in communication with the suction member 3 is stopped, the negative pressure on the bottom surface of the suction member 3 is eliminated, and at this time, the suction member 3 is lifted up, and the wafer is slid into the chamber 71 out of the suction member 3 or pushed into the chamber 71 by the pushing member 100.

Referring to fig. 14, the transfer assembly 90 further includes an elastic member 93, the elastic member 93 is disposed at a bottom end of the movable member 92, the connecting member 94 is disposed at a top end of the elastic member 93, and the auxiliary posture adjusting member 95 abuts against the connecting member 94 when the connecting member 94 moves to the auxiliary posture adjusting member 95 so as to deform the elastic member 93, so that the connecting member 94 moves relative to the movable member 92 to change the posture of the connecting member 94, and further adjust the posture of the wafer adsorbed by the adsorbing member 3. By providing the elastic member 93, the wafer dicing apparatus can complete the adjustment of the wafer posture in a small space.

Referring to fig. 15, the top side of the connector 94 is curved. Therefore, in the process that the connecting piece 94 continuously approaches the auxiliary posture adjusting piece 95, the lower part of the top side of the connecting piece 94 is contacted with the auxiliary posture adjusting piece 95, then the contact position of the connecting piece 94 and the auxiliary posture adjusting piece 95 gradually moves upwards along the top side of the connecting piece 94, the elastic piece 93 is gradually deformed, the deformation degree is continuously increased, and the posture of the wafer can be adjusted. In the embodiment shown in fig. 15, the bottom side of the auxiliary posture adjustment member 95 is also provided in a curved shape, which can function as the top side of the connection member 94. In other embodiments, one of the top side of the connector 94 and the bottom side of the auxiliary pose adjuster 95 is provided in a curved shape.

Of course, in other embodiments, the connector 94 may be rotatably coupled to the moveable member 92. Illustratively, the top and bottom sides of the connection 94 are curved, and the handling unit 9 further comprises a reset element provided with the carrier 1, which reset element is also located in the path of movement of the connection 94. In the process that the connecting piece 94 continuously approaches the auxiliary posture adjusting piece 95, the lower part of the top side of the connecting piece 94 is contacted with the auxiliary posture adjusting piece 95, then the position where the connecting piece 94 is contacted with the auxiliary posture adjusting piece 95 gradually moves upwards along the top side of the connecting piece 94, and the connecting piece 94 continuously rotates relative to the movable piece 92, so that the posture of the connecting piece 94 can be changed, and the posture of a wafer can be adjusted. During the process that the connecting piece 94 leaves the auxiliary posture adjusting piece 95 to return, the upper position of the bottom side of the connecting piece 94 is contacted with the reset piece first, then the contact position of the connecting piece 94 and the reset piece gradually moves downwards along the bottom side of the connecting piece 94, so that the connecting piece 94 can continuously rotate in the opposite direction relative to the movable piece 92, and the original posture is returned, and the next wafer is taken out by the suction piece 3 conveniently. In these embodiments, the connection 94 and the moveable member 92 may be rotatably coupled via gears or pulleys.

Referring to fig. 1 and 12, the wafer slicing apparatus further includes a lifting table 107, a base 1071 of the lifting table 107 is fixedly disposed on the carrier 1, and the handling body 91 is disposed through the carrier 1 and is fixedly disposed on a platform 1072 of the lifting table 107. Thereby, the lifting table 107 can drive the manipulating body 91 to lift, and further drive the connecting member 94 and the auxiliary posture adjusting member 95 to lift synchronously. Thus, after the wafer is parallel to the transfer surface 81, the lift table 107 drives the connection member 94 and the auxiliary posture adjustment member 95 to descend synchronously, so that the wafer sucked by the suction member 3 can be placed on the transfer surface 81 while maintaining the posture of the wafer.

Referring to fig. 1, 12 and 15, the manipulating body 91 includes a rotating motor 911, the movable member 92 is fixedly disposed on an output shaft of the rotating motor 911, and driven by the output shaft of the rotating motor 911, the movable member 92 can rotate to drive the connecting member 94 to rotate towards the auxiliary gesture adjusting member 95, so as to force the elastic member 93 to deform. Of course, in other embodiments, the manipulating body 91 may also include a linear motor, the movable member 92 is fixedly disposed on an output shaft of the linear motor, and the movable member 92 can move under the driving of the output shaft of the linear motor to drive the connecting member 94 to move towards the auxiliary gesture adjusting member 95, so as to force the elastic member 93 to deform.

In some embodiments, to facilitate alignment of the transfer surface 81 with the opening of the chamber 71 to slide wafers from the transfer surface 81 into the chamber 71, at least one of the cassette 7 and the transfer member 8 is liftably disposed on the stage 1, and at least one of the cassette 7 and the transfer member 8 is horizontally movably disposed on the stage 1.

Referring to fig. 10 in combination with fig. 2, the wafer dicing apparatus includes a second telescopic shaft 101 and a second housing 102. The transfer member 8 is fixedly arranged on or integrally formed with the second telescopic shaft 101, the second telescopic shaft 101 is arranged on the second seat body 102 in a lifting manner, and the second seat body 102 is fixedly arranged on or integrally formed with the carrying platform 1. The second telescopic shaft 101 may form a sliding connection with the second seat 102 or form a ball screw pair with the second seat 102. This facilitates adjustment of the intermediate surface 81 to a position aligned with the opening of the chamber 71. Of course, in other embodiments, the second telescopic shaft 101 and the second seat 102 may be disposed below the cassette 7, and the cassette 7 may be fixedly disposed on or integrally formed with the second telescopic shaft 101.

Referring to fig. 1, 11 and 13, the wafer dicing apparatus includes a straight air cylinder 108 and a finger air cylinder 109. The cylinder body of the straight line cylinder 108 is fixedly arranged on the carrying platform 1, the cylinder body of the finger cylinder 109 is fixedly arranged on the piston rod of the straight line cylinder 108, and the wafer cassette 7 is connected with the clamping jaw 1091 of the finger cylinder 109. On the one hand, this can move the cassette 7 horizontally to align the chamber 71 with the transfer surface 81; on the other hand, the cassette 7 may be shaken by the straight cylinder 108 and the finger cylinder 109 to ensure that wafers are stacked neatly.

Referring to fig. 11 in combination with fig. 13, the wafer slicing apparatus further includes a mounting plate 103, the mounting plate 103 is fixedly disposed on a clamping jaw 1091 of the finger cylinder 109, a plurality of clamping plates 104 are disposed on the mounting plate 103, two adjacent clamping plates 104 are divided into a group, and each group of clamping plates 104 clamps one cassette 7. Thus, the plurality of pod cartridges 7 can be connected to the clamping jaw 1091 of the finger cylinder 109 via the clamping plate 104 and the mounting plate 103.

In other embodiments, a linear reciprocating sliding table may be disposed on the carrier 1, and the transfer member 8 is fixedly disposed on a slider of the linear reciprocating sliding table, so that the transfer member 8 can also move horizontally.

It is worth mentioning that the wafer slicing device provided by the invention can finish slicing, detecting, transferring and storing wafers in a smaller space, and adjust the posture of the wafers in the transferring process so as to match with the transfer piece to realize storing of the wafers.

The invention further provides a wafer detection method for the wafer slicing device, which comprises the following steps:

placing the separated wafer flat on a support table 511 to place the wafer in a first posture;

shooting the top and bottom surfaces of the wafer with a camera 52 to obtain bottom and top surface images of the wafer in a first posture;

placing the wafer obliquely on the support table 511 so that the wafer is in the second posture;

the top and bottom surfaces of the wafer are photographed by the camera 52 to acquire bottom and top surface images of the wafer in the second posture.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims

1. A wafer dicing apparatus, comprising:

the wafer slicing device comprises a carrying platform (1), wherein a material area (4) for accommodating and abutting wafers to be sliced is arranged on the carrying platform (1), and an opening (41) is formed in one side, away from the carrying platform (1), of the material area (4);

an adsorbing member (3) for adsorbing the wafer and taking out the separated wafer through the opening (41);

a cassette (7) provided on the stage (1) and having an open chamber (71);

a transfer member (8) provided on the stage (1) and facing the opening of the chamber (71) for transferring the wafer to the chamber (71); and

The handling unit (9) is connected to the carrying platform (1), the handling unit (9) comprises a handling body (91) and a transferring assembly (90), the adsorbing member (3) is arranged on the transferring assembly (90), and the transferring assembly (90) is movably arranged on the handling body (91) and is used for transferring wafers to the transferring member (8).

2. Wafer dicing apparatus according to claim 1, characterized in that the chamber (71) of the cassette (7) has an angle with the plane of the carrier (1) of a first acute angle; the included angle between a transfer surface (81) of the transfer piece (8) for transferring the wafer and the plane of the carrying platform (1) is a second acute angle, and the first acute angle is equal to the second acute angle.

3. Wafer dicing apparatus according to claim 2, characterized in that the transfer assembly (90) comprises a movable member (92) movably provided to the handling body (91) and a connecting member (94) movably connected to the movable member (92), the suction member (3) is provided to the connecting member (94), the handling unit (9) further comprises an auxiliary posture adjustment member (95) provided to the handling body (91), the auxiliary posture adjustment member (95) is located on a movable path of the connecting member (94) so as to press against the connecting member (94) and force the connecting member (94) to move relative to the movable member (92) to change a posture of the connecting member (94) when the connecting member (94) moves to the auxiliary posture adjustment member (95).

4. A wafer dicing apparatus according to claim 3, wherein the transfer member (90) further comprises an elastic member (93), the elastic member (93) is provided to the movable member (92), the connecting member (94) is provided to the elastic member (93), and the auxiliary posture adjusting member (95) presses the connecting member (94) to deform the elastic member (93) when the connecting member (94) moves to the auxiliary posture adjusting member (95).

5. Wafer dicing apparatus according to claim 4, characterized in that the top side of the connection member (94) is curved.

6. Wafer dicing apparatus according to claim 1, characterized in that the transfer member (8) is provided with a pushing member (100), and the pushing member (100) is telescopically arranged from the transfer member (8) towards the cassette (7).

7. Wafer dicing apparatus according to claim 1, characterized in that the wafer dicing apparatus further comprises a plurality of abutting members (2), the plurality of abutting members (2) are circumferentially and alternately arranged on the carrier (1) and form a material area (4) around the carrier (1), wherein at least one abutting member (2) is provided with an air nozzle (21), and the air nozzle (21) faces the material area (4).

8. Wafer dicing apparatus according to claim 7, characterized in that at least one side of the interference member (2) facing the material area (4) is convexly provided with an elastic protrusion (22).

9. Wafer dicing apparatus according to claim 7, characterized in that the interference member (2) is a rod member, and the gas ejection port (21) is provided along the axial direction of the interference member (2).

10. Wafer dicing device according to claim 1, characterized in that it further comprises a detection unit (5) provided to the carrier (1), the detection unit (5) comprising a support (51) and at least two cameras (52), the support (51) comprising a hollow support table (511), the cameras (52) being directed towards the support table (511) and at least one of the cameras (52) being located below the support table (511), at least one of the cameras (52) being located above the support table (511).

11. Wafer dicing apparatus according to claim 10, characterized in that the detecting unit (5) further comprises a posture adjusting member (6), the posture adjusting member (6) being movably provided to the carrier (1), the support table (511) being located on a moving path of the posture adjusting member (6).

12. A wafer inspection method for a wafer dicing apparatus according to claim 10 or claim 11, comprising the steps of:

placing the separated wafer on a support table (511) to place the wafer in a first posture;

shooting the top surface and the bottom surface of the wafer by using a camera (52) to acquire a bottom surface image and a top surface image of the wafer in a first posture;

placing the wafer obliquely on a supporting table (511) so that the wafer is in a second posture;

the top and bottom surfaces of the wafer are photographed with a camera (52) to acquire bottom and top surface images of the wafer in the second posture.