CN115072046A

CN115072046A - Screening apparatus

Info

Publication number: CN115072046A
Application number: CN202210508312.8A
Authority: CN
Inventors: 冯白华; 陈绍锋
Original assignee: Shenzhen Sunyilg Intelligent Equipment Co ltd
Current assignee: Shenzhen Sunyilg Intelligent Equipment Co ltd
Priority date: 2022-05-11
Filing date: 2022-05-11
Publication date: 2022-09-20
Also published as: CN115892589A; CN115743720B; CN115743720A; CN115892589B

Abstract

The application provides screening equipment for screening chips, wherein the chips are provided with surfaces to be tested, and the surfaces to be tested are provided with at least two bonding pads; the screening apparatus comprises: the device comprises a pretreatment device, a chip loading device and a chip unloading device, wherein the pretreatment device is used for adjusting chips which are arranged irregularly and have uncertain directions into a state that bonding pads face downwards and at least two bonding pads are distributed according to preset positions and sequentially loading; the performance detection device is used for detecting the performance of the chip after pretreatment; the film sticking device is used for sequentially sticking the chips with qualified performance on the film; and the conveying device is used for conveying the chips among the pretreatment device, the performance detection device and the film sticking device. The screening equipment can screen out the chips with the same performance, improves the yield of electronic products, enables the chips to be loaded in a film pasting mode, is compatible with production equipment of the electronic products, and improves the loading efficiency of the chips.

Description

Screening apparatus

Technical Field

The application belongs to the technical field of semiconductors, and more specifically relates to a screening installation.

Background

The wafer is a carrier of the chips, and after a certain number of chips are etched on the wafer by full utilization, the wafer is cut into a block of chips. The performance of a chip is generally represented by parameters such as luminous intensity, current or voltage, and even if the performance of chips cut from the same wafer is not completely the same. If the chips after the wafer cutting are directly sent to a manufacturer for use, the yield of the manufactured electronic products is low.

Disclosure of Invention

An object of the embodiment of the application is to provide a screening installation to solve the technical problem that the different influences of chip performance among the prior art electronic product yields are low.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: the utility model provides a screening installation for the screening of chip, the chip has the face that awaits measuring, the face that awaits measuring has two at least pads, screening installation includes:

the pretreatment device is used for adjusting the chips which are arranged irregularly and have uncertain directions into a state that the bonding pads face downwards and at least two bonding pads are distributed according to preset positions, and sequentially feeding;

the performance detection device is used for detecting the performance of the chip after pretreatment;

the film sticking device is used for sequentially sticking the chips with qualified performance on the film;

and the conveying device is used for conveying the chips among the pretreatment device, the performance detection device and the film sticking device.

In one possible design, the preprocessing device includes:

a direction adjusting unit for adjusting the chips which are randomly arranged and have uncertain directions to a state that the bonding pads face downwards and sequentially arranging the chips;

the position adjusting unit is used for adjusting each bonding pad of the chip to a preset position;

the conveying device is used for conveying the chip of the direction adjusting unit to the position adjusting unit.

In one possible design, the direction adjustment unit comprises a vibrating disk.

In one possible design, the direction adjustment unit further includes:

the direction detection unit is used for detecting whether the chip output on the vibration disk is downward in a bonding pad;

and the material returning unit is used for returning the chip with the bonding pad not facing downwards to the direction adjusting unit according to the detection result of the direction detecting unit.

In a possible design, the preprocessing device further includes a position detection unit, where the position detection unit is configured to detect whether each of the pads of the chip is at a preset position;

the position adjusting unit is electrically connected with the position detecting unit and used for adjusting the position of the chip according to the detection result of the position detecting unit.

In one possible design, the position adjusting unit includes a rotating structure, and the rotating structure is configured to rotate the chip to rotate each of the pads of the chip to a preset position.

In a possible design, the position adjusting unit further includes a correcting mechanism, the correcting mechanism is configured to correct the position of the chip, and the rotating mechanism is configured to rotate the chip after the chip is corrected.

In one possible design, the centering mechanism comprises a centering driving structure and at least two positioning blocks; the at least two positioning blocks are respectively connected with the output end of the centering driving structure and can be driven by the centering driving structure to mutually approach to abut against and center the chip or mutually depart from to loosen the chip; the rotating structure is connected with the positioning block or the swing driving structure.

In one possible design, the yaw-drive structure includes:

the linear mechanism is used for outputting linear motion;

and the motion conversion mechanism is connected with the output end of the linear mechanism and is used for converting linear motion into motion of the positioning blocks approaching to or departing from each other.

In one possible design, the linear mechanism includes:

a centering drive;

the eccentric wheel is sleeved on the central shaft of the swing driving piece;

the follower is abutted with the outer contour of the eccentric wheel and can be driven by the eccentric wheel to move in a straight line, and the follower is connected with the motion conversion mechanism.

In one possible design, the linear mechanism further comprises a linear reset member, one end of which is fixed and the other end of which is connected to the follower and is used for the linear reset of the follower.

In one possible design, the motion conversion mechanism comprises at least two oscillating members and at least two oscillating return members; the at least two positioning blocks are respectively arranged on the at least two swinging pieces; one end of the swinging reset piece is fixed, and the other end of the swinging reset piece is connected with the swinging piece; the at least two swinging pieces can swing under the driving of the follower respectively to drive the positioning blocks to be away from each other, and the swinging resetting pieces can drive the swinging pieces to reset one by one to enable the positioning blocks to be close to each other.

In one possible design, the motion conversion mechanism further comprises a top rod and at least two rotating shafts; one end of the ejector rod is connected with the follower, and the outer diameter of the other end of the ejector rod is gradually increased along the direction close to the follower; the at least two rotating shafts are respectively abutted against different positions on the periphery of the other end of the ejector rod, and the swinging pieces are correspondingly arranged on the rotating shafts one by one; when the push rod is driven to move away from the direction of the follower, the push rod can push the rotating shafts to rotate so as to drive the swinging pieces to swing.

In a possible design, the straightening mechanism further comprises a straightening frame and a sleeve, the sleeve is sleeved outside the ejector rod and connected with the ejector rod, and the sleeve is rotatably arranged on the straightening frame; the output end of the rotating structure is connected with the sleeve and used for driving the sleeve, the ejector rod, the rotating shaft, the swinging piece, the positioning block and the chip to rotate.

In a possible design, the pretreatment device further includes a separation unit, the separation unit is disposed at an output end of the direction adjustment unit, and the separation unit is configured to receive and separate the chip conveyed by the direction adjustment unit.

In one possible design, the separating unit separates the adjacent chips by receiving one chip at a time, which is fed from the direction adjusting unit.

In one possible design, the separation unit comprises a separation driving structure, a receiving part and a detection part; the receiving part is provided with a receiving groove for accommodating the chip, and the detecting part is used for detecting whether the chip is received in the receiving groove; the separation driving structure is used for driving the receiving part to be in butt joint with the output end of the direction adjusting unit and driving the receiving part to reset after the detection part detects the chip from the receiving groove.

In one possible design, an adsorbing member is arranged at an output port of the direction adjusting unit, and the adsorbing member is electrically connected with the detecting member; the adsorption piece is used for adsorbing the chip positioned at the output port, and the adsorption piece is used for loosening the chip when the material receiving piece is in butt joint with the output port, and sucking the next chip after the chip enters the material receiving groove.

In one possible design, the performance testing apparatus includes a circuit board, at least two probes, and a limiting member; the limiting piece is provided with at least two positioning holes, and the at least two probes are respectively inserted into the at least two positioning holes in a one-to-one corresponding manner; one ends of the at least two probes are respectively and electrically connected with the circuit board, and the other ends of the at least two probes are respectively in one-to-one correspondence to be abutted against the at least two bonding pads of the chip.

In a possible design, the screening apparatus further includes a fine-tuning device, and the fine-tuning device is configured to fine-tune a position of the chip that is qualified by the performance detection device for subsequent film attachment.

In one possible design, the fine adjustment device includes a fine adjustment driving structure and at least two abutting members, and the fine adjustment driving structure is used for respectively driving the at least two abutting members to respectively move to be close to each other to abut against and finely adjust the chip or move away from each other to loosen the chip.

In one possible design, the abutting pieces have abutting surfaces, and each abutting surface of at least two abutting pieces is used for abutting against a peripheral surface of the chip respectively so as to finely adjust the position of the chip.

In one possible design, the fine adjustment driving structure comprises a fine adjustment driving part, a rotating part and at least two matching parts; the at least two matching pieces are respectively abutted against the peripheral wall of the rotating piece, and the at least two abutting pieces are respectively connected with the at least two matching pieces; the rotating piece can be driven to rotate by the fine adjustment driving piece to push the matching pieces to approach or move away from each other.

In one possible design, the cross section of the rotating part is square, and four corner arcs of the rotating part are arranged; the fine adjustment device comprises four abutting connection pieces and four matching pieces, and the matching pieces are rollers; the four rollers respectively abut against four side edges of the rotating part in the initial state, and the four rollers respectively abut against four corner positions of the rotating part after the rotating part rotates.

In one possible design, the conveying device includes a suction nozzle for sucking the chip to allow the fine adjustment device to perform fine adjustment on the position of the chip.

In one possible design, the screening apparatus further includes a waste recovery device, and the waste recovery device is configured to recover the chips that are detected to be unqualified by the performance detection device.

In a possible design, conveyor includes carousel and a plurality of suction nozzle, and is a plurality of the suction nozzle along circumference distribute in proper order in a week of carousel, preceding processing apparatus performance detection device reaches pad pasting device along circumference distribute in the carousel periphery, the carousel is used for driving a plurality of the suction nozzle is rotatory in order to carry out the transportation of chip.

In a possible design, the conveying device includes a suction nozzle, the film pasting device includes a film pasting driving structure and a film, the film is mounted on the film pasting driving structure, and the film pasting driving structure is used for driving the film to move so that the suction nozzle pastes the chip on different positions of the film.

In one possible design, a peripheral edge of the diaphragm is provided with a diaphragm ring for tensioning the diaphragm;

the film sticking device also comprises a film sticking seat, a convex ring and a tensioning driving piece, wherein the film ring, the convex ring and the tensioning driving piece are all arranged on the film sticking seat; the convex ring is arranged right below the diaphragm, and the tensioning driving part is used for driving the convex ring and/or the diaphragm to move so that the convex ring is tightly abutted against the periphery of the diaphragm to tension the diaphragm.

In one possible design, the screening apparatus further includes a film supply device and a film feeding device, the film supply device is configured to provide an empty film sheet, the film feeding device is configured to convey the empty film sheet to the film sticking device, and the film feeding device is further configured to convey a finished film sheet with a chip stuck thereon to the film supply device.

The application provides a screening installation's beneficial effect lies in: the screening installation that this application embodiment provided, its setting through preceding processing apparatus for the chip can be with the pad down and two at least pads according to the state material loading of predetermineeing the position distribution, thereby do benefit to the detection of performance detection device to the chip performance, it improves to detect the convenience, detection efficiency improves, correspondingly it improves to detect the precision, and then improved screening installation and screening efficiency to the chip, and the chip after the screening is used in the electronic product, make the yields of electronic product high. Through the setting of pad pasting device, make the qualified chip of capability test can be pasted in proper order and locate on the diaphragm, it is also that qualified chip provides the producer with the form of pad pasting, the producer can directly be applicable to current electronic product's production facility, this application is through testing the chip is single, then carry numerous qualified chips for the producer with the mode of pad pasting, the producer seamless use in current electronic product's production facility, the suitability is higher, the electronic product of making simultaneously can not become the defective products because the chip is unqualified, the yields of electronic product has been improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic top view of a screening apparatus provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a surface to be tested of a chip;

FIG. 3 is a schematic structural view of the conveying apparatus in FIG. 1;

FIG. 4 is a schematic structural diagram of the direction adjustment unit in FIG. 1;

FIG. 5 is a schematic view of the separation unit of FIG. 1;

FIG. 6 is an enlarged view of a portion A of FIG. 5;

FIG. 7 is a schematic structural diagram of the position detecting unit shown in FIG. 1;

FIG. 8 is a perspective view of the position adjustment unit of FIG. 1;

FIG. 9 is a schematic cross-sectional view of the position adjustment unit of FIG. 8;

FIG. 10 is a schematic structural view of the centering mechanism of FIG. 9;

FIG. 11 is a top view of the squaring mechanism of FIG. 8;

FIG. 12 is a schematic view of the structure of the performance testing apparatus shown in FIG. 1;

FIG. 13 is a schematic view of the fine tuning apparatus shown in FIG. 1;

FIG. 14 is a schematic longitudinal cross-sectional view of the fine tuning device of FIG. 13;

FIG. 15 is a cross-sectional view of the fine tuning device of FIG. 13;

FIG. 16 is a schematic view of the waste recycling apparatus of FIG. 1;

FIG. 17 is a schematic structural view of the film sticking device in FIG. 1;

FIG. 18 is an assembled view of the film holder, the protruding ring and the film of FIG. 17;

FIG. 19 is a schematic view of the structure of the film supplying apparatus in FIG. 1;

fig. 20 is a schematic structural view of the film feeding apparatus in fig. 1.

Wherein, in the figures, the respective reference numerals:

1. a conveying device; 11. a turntable; 12. a suction nozzle; 13. a lifting mechanism;

2. a direction adjusting unit; 21. a vibrating pan; 22. a direction detection unit; 23. a material returning unit; 24. a conveying track; 25. an adsorbing member;

3. a separation unit; 31. separating the drive structure; 311. separating the driving member; 312. an eccentric disc; 313. a connecting shaft; 314. a connecting seat; 32. a receiving seat; 33. receiving a material part; 331. a material receiving groove; 34. a detection member;

4. a position detection unit; 41. a CCD camera; 42. a mirror; 43. a light source;

5. a position adjustment unit; 51. a rotating structure; 511. a rotary drive member; 512. a drive belt structure; 5121. a pulley; 52. a straightening mechanism; 521. a linear mechanism; 5211. a centering drive; 5212. an eccentric wheel; 5213. a follower; 5214. a linear restoring member; 5215. an eccentric bearing; 522. a motion conversion mechanism; 5221. a top rod; 5222. a rotating shaft; 5223. a swinging member; 5224. a swinging reset member; 5225. positioning a block; 5226. a second limiting surface; 523. a frame is arranged; 524. a support block; 5241. a first limiting surface; 525. a sleeve; 526. a mounting seat;

6. a performance detection device; 61. a probe; 62. a limiting member; 621. positioning holes; 63. a positioning member;

7. a fine adjustment device; 71. fine tuning the driving structure; 711. finely adjusting the driving piece; 712. a rotating member; 713. a mating member; 72. an abutting member; 721. an abutting surface; 73. a fine adjustment seat; 731. a guide surface; 74. a sensor; 75. a connecting member;

8. a waste recovery device; 81. a conduit; 82. a recovery box;

9. a film pasting device; 91. a film sticking driving structure; 911. a film pasting driving piece; 912. a first direction conveying group; 913. a second directional transport assembly; 92. a film pasting seat; 93. a convex ring; 94. tensioning the drive member; 95. a membrane disc; 951. a membrane; 952. a membrane ring; 96. a mounting structure; 961. a slot; 97. a support structure;

10. a film supply device; 101. a film supply drive structure; 102. a membrane cabinet; 1021. a film groove;

110. a film feeding device; 111. a mold frame; 112. a horizontal conveying structure; 113. a clamping jaw;

200. a chip; 201. a surface to be measured; 202. and a bonding pad.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

The inventor has developed a chip testing and sorting apparatus (application No. 201921884209.3) which detects and sorts the performance of chips, and when the apparatus is used, the chips with the same performance are used in the corresponding electronic products, so as to ensure the yield of the electronic products.

However, such a test sorting apparatus has two disadvantages: 1. the classified chips are all collected in a material receiving box; for a chip with a small size, when an electronic product is manufactured, the feeding of the chip is very strict, if the feeding is directly performed through a material receiving box, the feeding is incompatible with production equipment of the electronic product, a manufacturer needs to design a sleeve feeding assembly aiming at the feeding of the chip, and finally the feeding of the chip is slow, and the production equipment of the electronic product has a complex structure and is high in cost. 2. The test sorting device is generally used for sorting chips under the condition that the performances of the chips are various, but the test sorting device cannot be used for screening only one chip with the same performance, or the test sorting device can cause waste of equipment cost and waste of various electric drives when being used for screening one chip with the same performance.

In this regard, the inventors have developed a screening apparatus.

Referring to fig. 1, a screening apparatus provided in an embodiment of the present application will now be described. The screening device is used for screening the chips 200, and particularly screens the chips 200 qualified in the performance test. The performance of the chip 200 may refer to optical performance or electrical performance.

In this embodiment, the screening apparatus is mainly used to test the electrical properties of the chips 200 cut from the same wafer and screen out the chips 200 with qualified electrical properties for standby. The electrical properties of the chip 200 include current and voltage. It is understood that in other embodiments of the present application, the incoming material of the screening apparatus may also be chips 200 with similar performance cut from different wafers, and is not limited herein.

Referring to fig. 2, the chip 200 has a surface 201 to be tested, the side to be tested has at least two pads 202, when the electrical performance of the chip 200 needs to be tested, the pads 202 of the chip 200 generally need to be downward, and when the chip 200 has at least two pads 202, the pads 202 need to be distributed according to a preset position, for example, in this embodiment, the positions of the pads 202 in fig. 2 need to be distributed, so that the pads 202 correspond to the probes 61 of the performance testing device 6 one to one, and the test of the chip 200 is accurate.

For example, referring to fig. 2, the chip 200 has four pads 202, and when the detection is performed, the largest pad 202 needs to be located at the lower left corner, and the predetermined position of the chip 200 is that the largest pad 202 is located at the lower left corner. When the largest pad 202 is not located at the lower left corner, the position of the chip 200 needs to be rotationally adjusted so that the largest pad 202 is located at the lower left corner.

Referring to fig. 1, the screening apparatus includes a pre-processing device, a performance detecting device 6, a film sticking device 9, and a conveying device 1. The pretreatment device is used for adjusting the chips 200 which are randomly arranged and have uncertain directions into a state that the bonding pads 202 face downwards and at least two bonding pads 202 are distributed according to preset positions, and sequentially feeding; the performance detection device 6 is used for detecting the performance of the chip 200 after pretreatment; the film sticking device 9 is used for sequentially sticking the chips 200 with qualified performance on the film 951; the transport device 1 is used for transporting the chips 200 among the pretreatment device, the performance detection device 6, and the film sticking device 9.

The screening device of the application, the incoming material can be a regular square chip 200, such as shown in fig. 2; the chip 200 may also be an irregular chip, such as a polygonal chip with a cross section of a triangle, a pentagon, a hexagon, or the like, or a truncated cone, which is not limited herein.

In addition, the die 200 may be randomly arranged, and the die 200 may have the pad 202 facing upward, the pad 202 facing left, or the pad 202 facing right, etc., that is, there is no requirement for feeding the die 200. After the pre-processing device, however, each chip 200 will have the pads 202 facing downward and the pads 202 distributed according to the preset positions and arranged in sequence for loading.

The screening device that this application embodiment provided, its setting through preceding processing apparatus, make chip 200 can be with pad 202 down and two at least pads 202 according to the state material loading of presetting the position distribution, thereby do benefit to the detection of performance detection device 6 to chip 200 performance, it improves to detect the convenience, detection efficiency improves, correspondingly, it improves to detect the precision, and then improved screening equipment to chip 200's screening precision and screening efficiency, and the chip after the screening is used in the electronic product, make the yields of electronic product high. Through the setting of pad pasting device 9 for chip 200 that performance test is qualified can be pasted in proper order and locate on diaphragm 951, and also qualified chip 200 provides the producer with the form of pad pasting promptly, and carry the producer spare through the mode of pad pasting after cutting into the chip with the wafer, this is the chip material loading mode that electronic product's production facility has been compatible, has become the national standard, and the producer can be directly suitable for current electronic product's production facility. This application is through testing the chip singly, then carries numerous qualified chips for the producer with the mode of pad pasting, and the producer seamless uses in current electronic product's production facility, and the suitability is higher, and the electronic product of making simultaneously can not become the defective products because the chip is unqualified, has improved electronic product's yields, also makes electronic product's production facility simple structure and with low costs simultaneously. In addition, this application can be used for selecting a chip that the performance is the same, can be applicable to the screening of the chip that most of through same batch wafer cutting come out, and its range of application is wider, and the cost is lower.

In one embodiment, referring to fig. 1 and fig. 3, the conveying device 1 includes a rotating disc 11 and a plurality of suction nozzles 12, the suction nozzles 12 are sequentially distributed around the rotating disc 11 along a circumferential direction, the pretreatment device, the performance detection device 6 and the film sticking device 9 are distributed around the rotating disc 11 along the circumferential direction, and the rotating disc 11 is used for driving the suction nozzles 12 to rotate to transport the chip 200. The conveying device 1 of the embodiment enables the pretreatment process, the performance detection process and the film sticking process of the chip 200 to be sequentially performed without back and forth conveying through the arrangement of the rotary table 11 and the plurality of suction nozzles 12, thereby improving the screening efficiency of the chip 200. In addition, through distributing pretreatment device, performance detection device 6 and pad pasting device 9 in carousel 11 periphery along circumference, the space that the individual screening installation that can significantly reduce took.

Referring to fig. 3, the conveying device 1 further includes a lifting mechanism 13, the lifting mechanism 13 is connected to the turntable 11, the lifting mechanism 13 is used for driving the turntable 11 and the plurality of suction nozzles 12 to be lifted synchronously, for example, when the conveying device 1 needs to transport the chip 200, each suction nozzle 12 needs to be lowered to suck the chip 200, then the chip 200 needs to be lifted and transported, and then the chip 200 needs to be released.

In one embodiment, referring to fig. 1, the preprocessing apparatus includes a direction adjusting unit 2 and a position adjusting unit 5. The direction adjusting unit 2 is configured to adjust the chips 200 that are randomly arranged and have an indefinite direction to a state in which the pads face downward, and to arrange them in sequence; the position adjusting unit 5 is configured to adjust each pad of the chip 200 to a preset position; the conveying device 1 is used to convey the chip 200 of the direction adjusting unit 2 to the position adjusting unit 5.

Preferably, the above direction adjustment unit 2 includes a vibration plate 21. Specifically, a pulse electromagnet is arranged below the hopper of the vibration disc 21, so that the hopper can vibrate in the vertical direction, and the inclined spring piece drives the hopper to do torsional vibration around the vertical axis of the hopper. The chips in the hopper are subjected to such vibration and rise along the spiral track. During the lifting process, the chips 200 can automatically enter the assembly or processing position in a uniform state through a series of rail screening or posture changes according to the assembly or processing requirements. Finally, the disordered chips 200 are automatically, orderly, directionally and regularly arranged and accurately conveyed to the next process through vibration, namely, the chips 200 are orderly and regularly loaded in a state that the bonding pads 202 face downwards, and the disordered chips 200 are high in working efficiency and simple in structure. It will be appreciated that in other embodiments of the present application, the above-mentioned direction adjustment unit 2 may also adopt other structures similar to the principle of the vibrating disk 21, such as a centrifugal disk with a regular guide rail.

In one embodiment, referring to fig. 4, the screening apparatus further includes a direction detecting unit 22 and a material returning unit 23. The direction detection unit 22 is arranged at the output end of the vibration disk 21 and is used for detecting whether the chip 200 output on the vibration disk 21 is downward in a bonding pad manner; the unloading unit 23 is electrically connected to the direction detecting unit 22, and the unloading unit 23 is configured to unload the chip 200 whose pad is not facing downward to the vibration plate 21 according to a detection result of the direction detecting unit 22. Although the vibrating plate 21 can output most of the output chips 200 with the pads facing downward, it cannot be guaranteed that all the chips 200 are output with the pads facing downward, and the arrangement of the direction detecting unit 22 and the material returning unit 23 can prevent the chips 200 with the pads facing upward from being also conveyed to the position adjusting unit 5 and the performance detecting device 6, thereby reducing invalid conditions of performance detection of the chips 200 and improving performance detection efficiency of the chips 200.

Specifically, a conveying track 24 may be disposed at an output end of the vibrating tray 21, and the direction detecting unit 22 and the material returning unit 23 are disposed on the conveying track 24, so as to facilitate the detection and conveying of the direction of the chip 200. In addition, the number of the direction detecting unit 22 and the material discharging unit 23 may be one or more.

The direction detection unit 22 may be of an optical fiber detection structure, that is, the optical fiber principle is used to detect whether the pad of the chip 200 is facing downwards. It is understood that, in other embodiments of the present application, the direction detection unit 22 may also detect the direction by using an image technology, which is not limited herein.

The material discharging unit 23 may be a blowing unit, that is, a vibration that blows gas to the chip 200 without the bonding pad facing downward. It should be understood that in other embodiments of the present application, the above-mentioned material returning unit 23 may also be a straight line pushing structure, or may be sucked by the suction nozzle 12 and fed into the vibration tray 21, which is not limited herein.

In one embodiment, referring to fig. 1, the pre-processing apparatus further includes a separating unit 3, the separating unit 3 is disposed at an output end of the direction adjusting unit 2, the separating unit 3 is specifically disposed at an output end of the conveying track 24, and the separating unit 3 is configured to receive and separate the chips 200 conveyed by the direction adjusting unit 2. Since the size of the chip 200 is small, the chips 200 output from the vibration plate 21 are chips 200 arranged in series, and the adjacent chips 200 are close together, which is not favorable for the conveying of the chip 200 by the conveying device 1 and the detection and film sticking of the chip 200. In the embodiment, the chip 200 output by the vibrating disk 21 can be separated by the separation unit 3, so that the subsequent detection and film sticking of the chip 200 are facilitated.

Wherein the separating unit 3 separates the adjacent chips 200 by receiving one chip 200 at a time, which is fed from the direction adjusting unit 2. That is, no matter how many chips 200 are sequentially arranged at the output end of the direction adjusting unit 2, the separating unit 3 can only receive one chip 200 at a time, so that the conveying device 1 conveys one chip 200 to the performance detecting device 6 and the film sticking device 9 at a time, and the separation of the chips 200 can be well realized. It is understood that in other embodiments of the present application, the separating unit 3 may separate the chips 200 by other means, for example, at least two chip slots spaced apart are provided at the output end of the vibrating plate 21, and each chip slot can only accommodate one chip 200 for separating the chips 200.

Specifically, referring to fig. 5 and 6, the separating unit 3 includes a separating driving structure 31, a receiving member 33 and a detecting member 34; the receiving member 33 has a receiving slot 331 for accommodating the chip 200, and the detecting member 34 is used for detecting whether the chip 200 is received in the receiving slot 331; the separation driving structure 31 is connected with the receiving member 33, and the separation driving structure 31 is electrically connected with the detecting member 34. In practical application, the material receiving member 33 is driven to be abutted with the output end of the direction adjusting unit 2 by the separation driving structure 31, so that the chip 200 in the direction adjusting unit 2 can be vibrated from the output end of the vibration disc 21 into the material receiving groove 331; the detection part 34 detects whether the chip 200 is in the material receiving groove 331 or not in real time, when the detection part 34 detects the chip 200 in the material receiving groove 331, the detected information is sent to the separation driving structure 31, the separation driving structure 31 drives the material receiving part 33 to reset, that is, the material receiving part 33 is driven to be away from the direction adjusting unit 2. This embodiment can guarantee through the setting of detection piece 34 that material receiving member 33 can both receive a chip 200 near vibration dish 21 at every turn, the maloperation phenomenon can not appear, also makes simultaneously when material receiving member 33 receives chip 200 after, and separation drive structure 31 can withdraw material receiving member 33 fast, avoids the next chip 200 of vibration dish 21 to jump out.

Wherein, connect the inner wall size of silo 331 to set up to be with the outer peripheral size looks adaptation of chip 200 to make and connect silo 331 not only can receive a chip 200 at every turn, and can carry out preliminary location to the position of chip 200, make chip 200 in follow-up alignment, rotary motion, not have too big position adjustment.

The detecting member 34 may be an optical fiber detecting member or an infrared detecting member.

Referring to fig. 5, the separating driving structure 31 includes a separating driving member 311, an eccentric disc 312, a connecting shaft 313, a connecting seat 314 and a material receiving seat 32, wherein the separating driving member 311, the eccentric disc 312, the connecting shaft 313, the connecting seat 314, the material receiving member 33 and the detecting member 34 are all mounted on the material receiving seat 32. The separating driving member 311 outputs a rotation motion, the eccentric disc 312 is sleeved on the shaft of the separating driving member 311, the eccentric disc 312 has an eccentric hole, the connecting shaft 313 is connected with the eccentric hole of the eccentric disc 312, the connecting seat 314 is connected with the connecting shaft 313 and is slidably arranged on the material receiving seat 32, and the material receiving member 33 is installed on the connecting seat 314. The separating driving member 311 can drive the eccentric disc 312 to rotate, and the eccentric disc 312 drives the connecting shaft 313 and the connecting seat 314 to move, so as to drive the receiving member 33 to move. It is understood that in other embodiments of the present application, the separation driving structure 31 may also be a linear air cylinder, a linear motor or a roller screw structure, which is not limited herein.

In addition, referring to fig. 4, an absorbing member 25 is disposed at an output port of the direction adjusting unit 2; the adsorption member 25 is used for adsorbing the chip 200 located at the output port, and the adsorption member 25 is used for loosening the chip 200 when the receiving member 33 is in butt joint with the output port, and sucking the next chip 200 after the chip 200 enters the receiving groove 331. In this embodiment, through the arrangement of the adsorption member 25, before the material receiving member 33 is butted with the direction adjustment unit, the chip 200 in the direction adjustment unit does not fall out, and after the material receiving member 33 receives one chip 200, the next chip 200 in the direction adjustment unit is prevented from falling out.

In an embodiment, referring to fig. 1, the preprocessing apparatus further includes a position detection unit 4, where the position detection unit 4 is configured to detect whether a position of each pad of the chip 200 is at a preset position; the position adjusting unit 5 is electrically connected to the position detecting unit 4, and the position adjusting unit 5 is configured to adjust the position of the chip 200 according to the detection result of the position detecting unit 4.

Specifically, the position detection unit 4 is provided between the direction adjustment unit 2 and the position adjustment unit 5. First, the direction adjusting unit 2 adjusts the chip 200 to a pad-down state; the conveying device 1 conveys the chip 200 of the direction adjusting unit 2 to the position detecting unit 4, and the position detecting unit 4 detects whether each bonding pad of the chip 200 is at a preset position; when each pad of the chip 200 is not at the preset position, the conveying device 1 conveys the chip 200 to the position adjusting unit 5, and the position adjusting unit 5 adjusts the position of the chip 200 so that each pad of the chip 200 is at the preset position; when the pads of the chip 200 are at the predetermined positions, the chip 200 can be directly conveyed to the performance testing device 6 by the conveying device 1, so as to perform the performance testing of the chip 200.

Preferably, the position detecting unit 4 includes an image acquiring device, and the image acquiring device is configured to acquire an image of the surface 201 to be measured of the chip 200, that is, determine whether each pad of the chip 200 is at the preset position according to the image of the surface 201 to be measured. The image acquisition device is, for example, a CCD camera 41 or a video camera.

Referring to fig. 7, the image capturing device includes a CCD camera 41, a reflector 42, and a light source 43, the image capturing device further has a detection station, the chip 200 is disposed at the detection station with the bonding pad facing downward, the light source 43 is disposed right below the detection station, the light source 43 includes beads distributed along the circumferential direction, and each bead emits light toward the chip 200. Each lamp pearl is circular distribution, and the centre is formed with the light trap, and speculum 42 locates the light source 43 under and be 45 degrees slope settings, and CCD camera 41 locates one side of speculum 42, and the downside image of chip 200 is reflected and is acquireed by CCD camera 41 via speculum 42. In this embodiment, the CCD camera 41 has a long length, and the CCD camera 41 has a long distance to the chip 200, which occupies a large vertical space, so that the position detection unit 4 cannot adapt to the conveying height of the conveying device 1. The CCD camera 41 is horizontally placed and reflected by the reflecting mirror 42, so that the space occupied by the position detecting unit 4 in the vertical direction can be greatly reduced.

In addition, the position detecting unit 4 further includes a control board electrically connected to the image acquiring device, a preset position image of each pad is prestored in the control board, and the control board is configured to compare the acquired image with the preset image, so as to determine whether each pad of the chip 200 is at the preset position, determine an angle at which the chip 200 needs to be rotated, and rotate the chip 200 through the position adjusting unit 5.

In one embodiment, referring to fig. 8, the position adjustment unit 5 includes a rotation structure 51, and the rotation structure 51 is used for rotating the chip 200 to rotate each pad of the chip 200 to a predetermined position. For example, referring to fig. 2, when the largest pad is located at the top right corner, the chip 200 needs to be rotated by 180 degrees, and when the largest pad is located at the top left corner or the bottom right corner, the chip 200 needs to be rotated by 90 degrees. It is understood that in other embodiments of the present application, when the shapes of the chips 200 and the distribution of the bonding pads are different, the chips 200 need to be rotated by different angles.

In one embodiment, referring to fig. 8, the position adjusting unit 5 further includes a centering mechanism 52, the centering mechanism 52 is used for centering the position of the chip 200, and the rotating mechanism 51 is used for rotating the centered chip 200.

Here, the chip 200 is described as a cube as an example, and although the chip 200 is regularly conveyed by the vibration plate 21 and the conveying rail 24, the pad of the chip 200 faces downward and the general direction is almost correct. However, the chip 200 is not exactly located at the correct position in the front, back, left and right directions, and there may be a slight angular deviation, for example, the chip 200 indicated by the dotted line in fig. 2 has an inclination of 5 degrees or 10 degrees, at this time, the inclination of the chip 200 needs to be adjusted by the adjusting mechanism 52, at this time, when the chip 200 is rotated by the rotating mechanism 51, only 90 degrees or 180 degrees need to be rotated, the driving of the rotating mechanism 51 is simple, and the internal software support of the system is also simple. It is understood that, in other embodiments of the present application, the position adjusting unit 5 may not be provided with the adjusting mechanism 52, but directly rotate the chip 200 through the rotating structure 51 according to the actual design situation and the specific requirement, where the angle of the chip 200 to be rotated may be 80 degrees, 100 degrees or 105 degrees, and the angle of the chip 200 to be rotated is calculated according to the image acquired by the CCD camera.

Referring to fig. 8 to 11, the centering mechanism 52 includes a centering driving structure and at least two positioning blocks 5225, wherein the at least two positioning blocks 5225 are respectively connected to the output end of the centering driving structure and can be driven by the centering driving structure to approach each other to abut against the centering chip 200 or move away from each other to release the chip 200; wherein, the rotating structure 51 is connected with the positioning block 5225 or the swing driving structure.

For example, four positioning blocks 5225 may be disposed on the chip 200 corresponding to the cube, each positioning block 5225 has a positioning surface, the four positioning surfaces are perpendicular to the vertical direction, two positioning surfaces are disposed opposite to each other, and adjacent positioning surfaces are perpendicular to each other, so that when the four positioning surfaces approach and attach to four sides of the chip 200 from four directions, the position of the chip 200 can be adjusted. It is understood that in other embodiments of the present application, two positioning blocks 5225 may be provided, and each positioning block 5225 is provided with two positioning surfaces perpendicular to each other; in addition, one or two of positioning blocks 5225 may be fixed, and the rest of positioning blocks 5225 may be moved, which is not limited herein.

Specifically, the swing driving mechanism includes a linear mechanism 521 and a motion conversion mechanism 522. The linear mechanism 521 is used for outputting linear motion; a motion conversion mechanism 522 is connected to an output end of the linear mechanism 521, and converts a linear motion into a motion of the positioning blocks 5225 approaching or separating from each other. In other words, the linear motion of the linear mechanism 521 can be converted into the motion of the positioning blocks 5225 approaching to or separating from each other by the motion conversion mechanism 522, that is, the motion of the positioning blocks 5225 can be driven by one linear mechanism 521, so that the number and cost of the linear mechanism 521 can be saved, and the structure of the entire aligning mechanism 52 can be simplified.

The linear mechanism 521 includes a swing drive 5211, an eccentric 5212, and a follower 5213. The centering driving member 5211 is configured to output a rotational motion, the eccentric wheel 5212 is sleeved on a central shaft of the centering driving member 5211, the follower 5213 abuts against an outer profile of the eccentric wheel 5212 and can be driven by the eccentric wheel 5212 to move linearly, and the follower 5213 is connected to the motion conversion mechanism 522. In the embodiment, since the position adjusting unit 5 includes the rotating structure 51 and the centering mechanism 52, the centering mechanism 52 and the rotating structure 51 both have driving members, and occupy a large space, and the follower 5213 abuts against the outer contour of the eccentric wheel 5212, the linear motion direction of the follower 5213 is perpendicular to the rotating shaft direction of the eccentric wheel 5212, that is, the centering driving member 5211 can be horizontally placed, and the follower 5213 is set to move in the vertical direction, thereby facilitating the layout of each structure. It is understood that in other embodiments of the present application, the linear mechanism 521 may also be of other types, such as a linear motor, a linear cylinder or a roller screw structure, which directly outputs linear motion, and is not limited herein.

The swing driving member 5211 is a motor or a cylinder capable of outputting rotational motion.

In addition, the follower 5213 has a contact surface parallel to the horizontal plane, and when the eccentric 5212 is rotated by the swinging driving member 5211, the contact surface is driven to move up and down in the vertical direction, and the follower 5213 is driven to move up and down.

In one embodiment, referring to fig. 10, since the swing drive 5211 always outputs a rotational motion in one direction, only the follower 5213 can be driven up, but the follower 5213 cannot be driven down. In this regard, the linear mechanism 521 further includes a linear reset element 5214, one end of the linear reset element 5214 is fixed, and the other end is connected to the follower 5213, and the linear reset element 5214 is used for linearly resetting the follower 5213, and particularly, driving the follower 5213 to descend.

Specifically, the swing mechanism 52 further includes a swing frame 523, one end of the linear reset component 5214 is fixedly connected to the swing frame 523, and the other end is connected to the follower 5213; when the follower 5213 rises, the linear reset piece 5214 accumulates elastic force, and when the swing driving piece 5211 is not driven, the linear reset piece 5214 brings the follower 5213 down.

Preferably, the linear return 5214 is a compression spring.

Referring to fig. 10 and 11, the motion conversion mechanism 522 includes at least two swinging members 5223 and at least two swinging reset members 5224; at least two positioning blocks 5225 are mounted on at least two swinging members 5223, respectively; one end of the swinging reset piece 5224 is fixed, and the other end of the swinging reset piece 5224 is connected with the swinging piece 5223; the at least two swinging members 5223 can swing respectively under the driving of the follower 5213 to drive the positioning blocks 5225 to move away from each other, and the swinging reset members 5224 can drive the swinging members 5223 to reset one by one so that the positioning blocks 5225 approach each other. In the initial state, each swing reset piece 5224 is in a compressed state, and each positioning block 5225 is in a mutually close state; when the chip 200 needs to be swung, the swinging driving piece 5211 drives the eccentric wheel 5212 to rotate, the eccentric wheel 5212 drives the follower 5213 to linearly lift, the follower 5213 drives the swinging pieces 5223 to swing so as to enable the positioning blocks 5225 to be away from each other, and meanwhile, the swinging resetting pieces 5224 accumulate elastic force; then, the driving of the swing driving member 5211 is stopped, and the swing reset members 5224 reset the swing members 5223, so as to drive the positioning blocks 5225 to approach each other, so that the positioning blocks 5225 approach and abut against the side surfaces of the chip 200 from various directions, respectively, thereby swinging the position of the chip 200. In the present embodiment, the follower 5213, the at least two swinging members 5223 and the at least two swinging resetting members 5224 are mutually matched, so that one driving can drive the plurality of positioning blocks 5225 to move, and the present embodiment has a simple structure and a low driving cost. It is understood that in other embodiments of the present application, when the space is large enough, the plurality of positioning blocks 5225 may be driven by a plurality of driving members, respectively, and is not limited herein.

In one embodiment, referring to fig. 10, the motion conversion mechanism 522 further includes a top bar 5221 and at least two rotating shafts 5222. One end of the top rod 5221 is connected with the follower 5213, and the outer diameter of the other end of the top rod 5221 is gradually increased along the direction close to the follower 5213; at least two rotating shafts 5222 are respectively abutted against different positions on the outer periphery of the top rod 5221, and the swinging members 5223 are correspondingly mounted on the rotating shafts 5222 one by one; the top rod 5221 can push the rotating shafts 5222 to rotate to drive the swinging members 5223 to swing when being driven to move away from the follower 5213. In practical applications, taking the movement of the top rod 5221 as an example of a lifting movement, when the follower 5213 drives the top rod 5221 to ascend, the position where the other end of the top rod 5221 abuts against each rotating shaft 5222 changes along the moving direction of the top rod 5221, for example, the diameter of the position where the top rod 5221 abuts against each rotating shaft 5222 gradually increases, so as to push each rotating shaft 5222 to rotate clockwise, and further drive each swinging member 5223 to rotate clockwise, and each positioning block 5225 is disposed at the top end of the swinging member 5223, so as to drive each positioning block 5225 to move away from each other; the swinging resetting member 5224 is connected to the bottom end of each swinging member 5223, so that when the swinging resetting member 5224 pulls the bottom end of each swinging member 5223, the swinging resetting member 5224 can be driven to rotate and drive the positioning blocks 5225 to approach each other. In this embodiment, the outer periphery of the top rod 5221 and the at least two rotating shafts 5222 are abutted and matched, so that one top rod 5221 drives the swinging members 5223 to swing.

Preferably, the righting mechanism 52 includes four positioning blocks 5225, and the motion converting mechanism 522 includes four rotating shafts 5222, four swinging members 5223, and four swinging return members 5224. The four rotation shafts 5222 are circumferentially distributed at equal intervals in the circumferential direction of the top bar 5221, and are abutted against the top bar 5221. It should be understood that in other embodiments of the present application, the number of the positioning block 5225, the rotating shaft 5222, the swinging member 5223 and the swinging resetting member 5224 may be two, three, five or more, and is not limited herein.

In order to ensure that the rotating shaft 5222 and the top bar 5221 are tightly pressed against each other, a torsion spring is mounted on the rotating shaft 5222, and the rotating shaft 5222 is always tightly pressed against the periphery of the top bar 5221 by the rotation force of the torsion spring. In addition, a protective sleeve is sleeved on the outer surface of the rotating shaft 5222 to ensure the contact between the top rod 5221 and the rotating shaft 5222.

Referring to fig. 10, the centering mechanism 52 further includes a supporting block 524, the supporting block 524 is used for swinging the chip 200, and the chip 200 can be centered on the supporting block 524 by the positioning blocks 5225 and driven to rotate by the rotating structure 51.

In this embodiment, since each positioning block 5225 is a swinging motion, the driving force of the positioning block 5225 is an inclined driving force, in order to ensure that each positioning block 5225 abuts against the chip 200 stably, the positions of the supporting block 524 corresponding to each positioning block 5225 are respectively provided with a first limiting surface 5241, each first limiting surface 5241 is a vertical surface, the corresponding position of each positioning block 5225 is respectively provided with a second limiting surface 5226, and when each positioning block 5225 is close to each other, each first limiting surface 5241 and each second limiting surface 5226 are correspondingly attached one to one, so that each positioning surface is ensured to be kept in a vertical state, and the aligning precision of the aligning mechanism 52 on the chip 200 is improved.

Referring to fig. 10, the centering mechanism 52 further includes a centering frame 523 and a sleeve 525, the sleeve 525 is sleeved outside the top rod 5221 and connected with the top rod 5221, and the sleeve 525 is rotatably disposed on the centering frame 523; the output end of the rotating structure 51 is connected to the sleeve 525 and is used to drive the sleeve 525, the top rod 5221, the rotating shaft 5222, the swinging member 5223, the positioning block 5225 and the chip 200 to rotate. When the rotary structure 51 outputs a rotary motion, the sleeve 525, the follower 5213, the linear restoring member 5214, the post rod 5221, the rotating shaft 5222, the swinging member 5223, the swinging restoring member 5224, the positioning block 5225 and the chip 200 rotate along with the rotary structure 51, so that the pad of the chip 200 is rotated to a preset position.

The sleeve 525 is further provided with a mounting seat 526 above, the rotating shaft 5222, the swinging member 5223, the supporting block 524, the positioning block 5225 and the chip 200 are all mounted on the mounting seat 526, and the mounting seat 526 rotates along with the sleeve 525.

In addition, referring to fig. 10, in order to reduce friction between the follower 5213 and the eccentric 5212 during rotation, an eccentric bearing 5215 is sleeved on the eccentric 5212, so as to reduce the friction between the eccentric 5212 and the follower 5213.

In the present embodiment, referring to fig. 8 and 10, the rotating structure 51 includes a rotating driving member 511 and a transmission belt structure 512, the rotating driving member 511 is disposed vertically, the transmission belt structure 512 is disposed horizontally, one pulley 5121 of the transmission belt structure 512 is installed at an output end of the rotating driving member 511, and the other pulley 5121 is sleeved outside the sleeve 525, so as to drive the sleeve 525 to rotate. By providing the belt structure 512, the rotary driving member 511 can be installed at a distance from the sleeve 525, and interference of the structure is avoided. It is understood that in other embodiments of the present application, the above-mentioned rotary driving member 511 can be connected with the sleeve 525 through a chain structure or a gear transmission structure, which is not limited herein.

In one embodiment, referring to fig. 12, the performance testing apparatus 6 includes a circuit board, at least two probes 61 and a limiting member 62; the limiting member 62 has at least two positioning holes 621, and the at least two probes 61 are respectively inserted into the at least two positioning holes 621 one by one; one end of each of the at least two probes 61 is electrically connected to the circuit board, and the other end of each of the at least two probes 61 is used for being abutted to at least two pads of the chip 200 in a one-to-one correspondence manner, so that the at least two probes 61 are electrically connected to the at least two pads in a one-to-one correspondence manner, and performance detection of the chip 200 is realized.

In this embodiment, the positions of the at least two probes 61 are arranged through the at least two positioning holes 621, so that the at least two probes 61 and the at least two pads at the preset positions are arranged in a one-to-one correspondence manner, and the accuracy and effectiveness of the performance detection device 6 for detecting the performance of the chip 200 are improved.

Referring to fig. 12, since the length of the probe 61 is long, the performance detecting apparatus 6 further includes a positioning member 63, and the middle position of the probe 61 is positioned by the positioning member 63.

In one embodiment, the transportation device 1 includes the suction nozzle 12, and the suction nozzle 12 is used not only for transporting to suck the chip 200, but also for sucking the chip 200 by the suction nozzle 12 at the time of performance inspection. That is, in the performance test, after the chip 200 is directly transferred from the pretreatment device by the transfer device 1, the chip 200 is directly tested by the at least two probes 61 without taking down the chip 200. The chip 200 is sucked by the suction nozzle 12, so that the bonding pad faces downwards, and the chip 200 can be detected by the probes 61; meanwhile, the step of placing the chip 200 is also reduced, so that the chance of generating deviation on the position of the chip 200 is reduced, the precision of performance detection of the chip 200 is improved, and the efficiency of performance detection of the chip 200 is also improved. It is understood that in other embodiments of the present application, a material table may be disposed in the performance detecting device 6, and the conveying device 1 conveys the chip 200 and then places the chip on the material table for detection, which is not limited herein.

In one embodiment, referring to fig. 1, the screening apparatus further includes a fine tuning device 7, and the fine tuning device 7 is used for fine tuning the position of the qualified chip 200 detected by the performance detection device 6 for subsequent film pasting. Because the size of the chip 200 is very small, and thousands of chips 200 can be attached to one membrane 951, the chips 200 qualified for detection are finely adjusted through the fine adjustment device 7, so that the film attaching precision of the chips 200 on the membrane 951 is ensured, the overlapping of the adjacent chips 200 is prevented, and the situation that the intervals of the adjacent chips 200 are large is also prevented.

Referring to fig. 13-15, the fine adjustment device 7 includes a fine adjustment driving structure 71 and at least two abutting members 72, and the fine adjustment driving structure 71 is used for respectively driving the at least two abutting members 72 to move to approach each other to abut against the fine adjustment chip 200 or move away from each other to release the chip 200. In this embodiment, since the movement of at least two of the abutments 72 is a movement, the abutment force of each abutment 72 against the chip 200 is always perpendicular to the chip 200, and the positional adjustment accuracy of the chip 200 is higher.

The abutting pieces 72 have abutting surfaces 721, and each abutting surface 721 of at least two abutting pieces 72 is used for abutting against a peripheral surface of the chip 200 to perform fine adjustment on the position of the chip 200.

Preferably, the chip 200 has four side surfaces, the fine adjustment device 7 includes four abutting members 72, each abutting member 72 has one abutting surface 721, and the four abutting surfaces 721 move from four directions to abut against the four side surfaces of the chip 200, so as to achieve the purpose of fine adjustment of the position of the chip 200. It is understood that in other embodiments of the present application, when the chip 200 has five or more sides, the fine adjustment device 7 may also include five or more abutments 72; in addition, two abutting surfaces 721 perpendicular to each other may be provided for each abutting piece 72, so that the number of abutting pieces 72 can be reduced, and the fine adjustment driving structure 71 can be simplified.

Specifically, the fine adjustment driving structure 71 includes a fine adjustment driving member 711, a rotating member 712, and at least two mating members 713; the at least two mating members 713 respectively abut against the outer peripheral wall of the rotating member 712, and the at least two abutting members 72 are respectively connected with the at least two mating members 713; the rotating member 712 can be driven to rotate by the fine adjustment driving member 711 to push the mating members 713 closer to or away from each other and to move the abutments 72 closer to or away from each other to fine adjust the chip 200 or to release the chip 200. In the present embodiment, the rotation element 712 and the at least two mating elements 713 are disposed, so that the fine tuning driving element 711 can simultaneously drive the abutting elements 72 to approach or separate from each other, and the structure is simple and the driving cost is low.

Preferably, referring to fig. 15, the cross-section of the rotating member 712 is square, and four corners of the rotating member 712 are arranged in a circular arc; the fine adjustment device 7 comprises four abutment members 72 and four engagement members 713, and the engagement members 713 are rollers. In the initial state, the four rollers respectively abut against the four sides of the rotating member 712 under the action of the torsion springs, and at this time, the distance between the four rollers is the closest; when the position of the chip 200 needs to be fine-tuned, the rotation member 712 is driven to rotate by the fine-tuning driving member 711, for example, after the rotation member is rotated by 45 degrees, the four rollers respectively abut against four corner positions of the rotation member 712, that is, the distance between two opposite rollers is changed from the side length of the rotation member 712 to a diagonal line, the four rollers are arranged away from each other, and the four abutting members 72 are driven to be away from each other, so that the chip 200 can be arranged at the positions between the four abutting members 72; finally, the rotation member 712 is driven to rotate by the fine tuning driving member 711, so that the four rollers respectively abut against the four sides of the rotation member 712, thereby driving the four abutting members 72 to approach each other and abut against the four sides of the chip 200, and achieving fine tuning.

In the present embodiment, the outer peripheral profile of the rotating member 712 is designed such that the rotating member 712 is an eccentric member for each roller, and in order to realize the simultaneous driving of the four rollers by the rotating member 712, the rotating member 712 is provided as a combination of four eccentric members, and finally the rotating member 712 is provided in a shape having a directional cross section. It will be appreciated that the rotation element 712 can also be arranged on the same principle when the number of rollers is changed, so that a plurality of abutments 72 can be driven simultaneously by one fine adjustment drive 711.

Referring to fig. 14, the trimming device 7 further includes a sensor 74 and a connecting member 75. Wherein, sensor 74 is infrared ray sensor, including transmitting terminal and receiving terminal, connecting piece 75 is connected with one of them butt piece 72, when butt piece 72 outwards removed, connecting piece 75 will insert between transmitting terminal and the receiving terminal, be connected with the communication between disconnection transmitting terminal and the receiving terminal, sensor 74 passes through the positional information of connecting piece 75, thereby feedback out the position of butt piece 72, and then know whether accurate of the displacement route of butt piece 72, if not accurate, can adjust butt piece 72 and drive.

In one embodiment, the conveying device 1 further includes a suction nozzle 12, and the suction nozzle 12 is used for sucking the chip 200, that is, when the chip 200 performs position fine adjustment, the chip 200 is sucked by the suction nozzle 12, so that errors caused by the chip 200 being put down and sucked are reduced, the position adjustment of the chip 200 is more accurate, and the fine adjustment precision of the chip 200 is also improved.

Referring to fig. 13, the fine adjustment device 7 further includes a fine adjustment seat 73, the fine adjustment driving member 711 is mounted on the mounting seat 526, the rotating member 712 is rotatably disposed on the mounting seat 526, a connection block is connected between each roller and the abutting member 72, and four connection blocks are slidably disposed on the mounting seat 526 respectively.

The mount 526 is also provided with a guide surface 731 that is provided obliquely, and the guide surface 731 guides the chip 200 that is not sucked by the suction nozzle 12 downward, thereby preventing the chip 200 that is not sucked from being accumulated between the four contact members 72 and interfering with the fine adjustment function of the chip 200 by the four contact members 72.

In one embodiment, referring to fig. 1, the screening apparatus further includes a waste recycling device 8, and the waste recycling device 8 is used for recycling the chips 200 that are detected to be defective by the performance detecting device 6. The setting of waste recycling device 8 is passed through to this embodiment, avoids detecting unqualified chip 200 and is abandoned by the confusion.

Specifically, referring to fig. 16, the waste recycling device 8 includes a guide tube 81 and a recycling box 82, the guide tube 81 is disposed obliquely, one end of the guide tube 81 is used for being abutted to the suction nozzle 12 of the conveying device 1 to receive waste, the other end of the guide tube 81 is connected to the recycling box 82, and the guide tube 81 is used for guiding the waste into the recycling box 82 to be stored for standby.

In one embodiment, referring to fig. 17 and 18, the film pasting device 9 includes a film pasting driving structure 91 and a film tray 95, the film tray 95 includes a film 951, the film 951 is mounted on the film pasting driving structure 91, and the film pasting driving structure 91 is used for driving the film 951 to move so that the suction nozzles 12 paste the chips 200 on different positions of the film 951.

Before each lamination, the membrane 951 may be moved to a proper position by the lamination driving structure 91, and then the chip 200 may be attached to the membrane 951 by the suction nozzle 12. The moving position of the membrane 951 can be calculated according to a system, so that all the chips 200 are exactly positioned on a circle after being attached, and the adjacent chips 200 are arranged at equal intervals.

The film sticking driving structure 91 comprises a film sticking driving member 911, a first direction conveying assembly 912 and a second direction conveying assembly 913; the first direction conveying assembly 912 is connected with the output end of the film sticking driving component 911, the second direction conveying assembly 913 is connected with the output end of the first direction conveying assembly 912, the film 951 is installed at the output end of the second direction conveying assembly 913, and the conveying direction of the first direction conveying assembly 912 is perpendicular to the conveying direction of the second direction conveying assembly 913. In this embodiment, the first direction conveying assembly 912 and the second direction conveying assembly 913 cooperate to adjust the position coordinates of the chip 200 on the film 951 along the X axis and the Y axis, so as to realize the precise placement of each chip 200.

In one embodiment, referring to fig. 17, the film sticking apparatus 9 further includes a supporting structure 97, the supporting structure 97 is disposed right below the film sticking station, and the supporting structure 97 is configured to be supported below the film 951 when the suction nozzle 12 sticks the chip 200 to the film 951. The present embodiment is provided with the supporting member, so that the suction nozzle 12 does not damage the membrane 951 when the membrane is attached.

In one embodiment, referring to fig. 17 and 18, a membrane ring 952 is mounted around a perimeter edge of the membrane 951 for tensioning the membrane 951. Wherein, diaphragm 951 is preferably the UV membrane, installs membrane ring 952 at the edge of a week of UV membrane for the UV membrane is in the tensioning state, does benefit to chip 200 pad pasting.

The film sticking device 9 further comprises a film sticking seat 92, a convex ring 93 and a tensioning driving piece 94. The film sticking seat 92 is installed at the output end of the second direction conveying assembly 913, the film ring 952, the convex ring 93 and the tensioning driving member 94 are all installed on the film sticking seat 92, and the convex ring 93 is arranged right below the film 951. The tensioning driving member 94 is used for driving the convex ring 93 and/or the membrane 951 to move, so that the convex ring 93 abuts against a peripheral edge of the membrane 951 to tension the membrane 951, that is, the convex ring 93 and the membrane 951 approach each other to abut against each other, thereby tensioning the membrane 951.

In this embodiment, the tension driving member 94 is a linear cylinder, the output end of the tension driving member 94 is connected to the membrane ring 952, and the tension driving member 94 drives the membrane ring 952 to move downward to make the convex ring 93 abut against the lower side surface of the membrane 951. It is understood that in other embodiments of the present application, the tension driver 94 may be connected to the protruding ring 93, and the protruding ring 93 is driven to move upward to abut against the diaphragm 951; or the collar 93 and the membrane ring 952 may be driven separately to move the collar 93 and the membrane 951 closer to each other, so that the collar 93 abuts against the membrane ring 952, which is not limited herein.

In one embodiment, referring to fig. 1, the screening apparatus further includes a film supply device 10 and a film feeding device 11011. The film supply device 10 is used for supplying empty film sheets, the film feeding device 11011 is used for conveying the empty film sheets to the film sticking device 9, and the film feeding device 11011 is also used for conveying finished film sheets with the chips 200 stuck to the film supply device 10. In this embodiment, through the arrangement of the film supply device 10 and the film feeding device 11011, the empty film can be continuously supplied to the film sticking device 9, and the finished film with the chip 200 can be timely sent away, which is beneficial to the batch operation of sticking the film on the chip 200.

In one embodiment, referring to fig. 19, the film supplying device 10 includes a film supplying driving structure 101 and a film cabinet 102, wherein the film supplying driving structure 101 is connected to the film cabinet 102 and is used for driving the film cabinet 102 to move up and down. The membrane cabinet 102 has a plurality of membrane grooves 1021 that are uniformly distributed in the vertical direction. In an initial state, the film pieces in each film groove 1021 are all empty film pieces, and the film feeding device 11011 takes out and conveys the lowermost empty film piece 951 to the film sticking device 9; after a piece of membrane is pasted, the membrane conveying device 11011 conveys the membrane finished products to the bottommost membrane groove 1021, then the membrane supply driving structure 101 drives the membrane cabinet 102 to move up by the height of one membrane groove 1021, so that the second membrane groove 1021 from bottom to top corresponds to the clamping jaw 113 of the membrane conveying device 11011, and therefore the membrane conveying device 11011 can convey the empty membrane 951 in the second membrane groove 1021 to the membrane pasting device 9, and so on until all membrane grooves 1021 are filled with the membrane 951 finished products, and then all membrane 951 finished products are taken away, and then the empty membrane 951 is replaced.

Referring to fig. 20, the film feeding device 11011 includes a mold frame 111, a horizontal conveying structure 112 and a clamping jaw 113, the horizontal conveying structure 112 is installed on the mold frame 111, the clamping jaw 113 is installed on the horizontal conveying structure 112, the clamping jaw 113 is used for clamping a film ring 952 on a film 951, and the clamping jaw 113 is driven by the horizontal conveying structure 112 to move in a horizontal direction, so that the film 951 can be conveyed back and forth in the film sticking device 9 and the film feeding device 10.

Preferably, the horizontal transport structure 112 is a conveyor belt transport structure. In other embodiments of the present application, the horizontal conveying structure 112 may also be a roller screw structure or a rack and pinion structure, which is not limited herein.

In one embodiment, the film 951 is removably mounted to the lamination drive structure 91 so that the jaws 113 can remove the film 951 from the lamination device 9.

Specifically, the film holder 92 is provided with a mounting structure 96, and the film 951 is detachably mounted on the mounting structure 96. The mounting structure 96 is formed with a slot 961, the slot 961 horizontally penetrates the mounting structure 96, and the membrane 951 is inserted into the slot 961. When the film 951 needs to be taken out, the clamping jaws 113 are driven by the horizontal conveying structure 112 to move and clamp the film 951, so that the film 951 is taken out.

In summary, referring to fig. 1, the separating unit 3, the position detecting unit 4, the position adjusting unit 5, the performance detecting device 6, the fine adjusting device 7, the waste recycling device 8, and the film sticking device 9 are sequentially arranged around the periphery of the turntable 11 along the circumferential direction. For the turntable 11, the larger the diameter of the turntable 11 is, the larger the peripheral space of the turntable 11 is, and the more peripheral devices can be placed on the turntable 11; however, the larger the diameter of the turntable 11, the further the suction nozzle 12 is from the center of the turntable 11, the worse the positional accuracy of the chip 200 is, and the performance detection and film attachment of the chip 200 are affected.

To this, this application need not occupy the peripheral space of carousel 11 through directly setting up direction detecting element 22 and material returned unit 23 in the output position of vibration dish 21 to make the peripheral space of carousel 11 can not crowd, the diameter of carousel 11 can reduce, has improved the pad pasting precision of chip 200. Meanwhile, the chip with the incorrect bonding pad is returned to the vibration disc 21 before the chip position is adjusted, the bonding pad orientation of the chip cannot be detected after the chip is positioned like the prior art, the invalid positioning of the chip is reduced, and the screening efficiency and the screening yield of the chip are improved. Meanwhile, a waste recovery mechanism does not need to be arranged after positioning, and unnecessary space waste is reduced.

In addition, the chip 200 is righted and rotationally combined in the position adjusting unit 5, so that the position adjusting unit can be suggested to occupy the peripheral space of the turntable 11, the times of sucking and putting down the chip 200 are reduced, the position error of the chip 200 is reduced, and the detection and film pasting precision of the chip 200 is improved. And simultaneously, the working times and the working cost of the lifting mechanism 13 are reduced.

The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. The utility model provides a screening installation for the screening of chip, the chip has the face that awaits measuring, the face that awaits measuring has two at least pads, its characterized in that, screening installation includes:

2. The screening apparatus as claimed in claim 1, wherein the pre-treatment device comprises:

3. The screening apparatus of claim 2, wherein the direction adjustment unit comprises a vibratory pan.

4. The screening apparatus of claim 3, wherein the direction adjustment unit further comprises:

a direction detection unit for detecting whether the chip on the vibration disk is downward;

and the material returning unit is used for returning the chip with the bonding pad not facing downwards to the vibration disc according to the detection result of the direction detection unit.

5. The screening apparatus according to claim 2, wherein the preprocessing device further includes a position detecting unit for detecting whether each of the pads of the chip is at a preset position;

6. The screening apparatus of claim 5, wherein the position adjustment unit includes a rotation structure for rotating the chip to rotate each of the pads of the chip to a preset position.

7. The screening apparatus according to claim 6, wherein the position adjusting unit further comprises a centering mechanism for centering the position of the chip, and the rotating mechanism is configured to rotate the chip after centering.

8. The screening apparatus of claim 7, wherein the squaring mechanism includes a squaring drive structure and at least two locating blocks; the at least two positioning blocks are respectively connected with the output end of the centering driving structure and can be driven by the centering driving structure to mutually approach to abut against and center the chip or mutually depart from to loosen the chip; the rotating structure is connected with the positioning block or the swing driving structure.

9. The screening apparatus of claim 8, wherein the yaw drive structure comprises:

the linear mechanism is used for outputting linear motion;

10. The screening apparatus of claim 9, wherein the linear mechanism comprises:

a centering drive;

the eccentric wheel is sleeved on the central shaft of the swing driving piece;

11. A screening apparatus according to claim 10, wherein the linear mechanism further comprises a linear reset member fixed at one end and connected at the other end to the follower member for linear resetting of the follower member.

12. A screening apparatus according to claim 10, wherein said motion conversion mechanism comprises at least two oscillating members and at least two oscillating return members; the at least two positioning blocks are respectively arranged on the at least two swinging pieces; one end of the swinging reset piece is fixed, and the other end of the swinging reset piece is connected with the swinging piece; at least two swinging pieces can swing under the driving of the follower respectively to drive the positioning blocks to be away from each other, and each swinging reset piece can drive each swinging piece to reset one by one to enable the positioning blocks to be close to each other.

13. A screening apparatus according to claim 12, wherein the motion conversion mechanism further comprises a ram and at least two rotatable shafts; one end of the ejector rod is connected with the follower, and the outer diameter of the other end of the ejector rod is gradually increased along the direction close to the follower; the at least two rotating shafts are respectively abutted against different positions on the periphery of the other end of the ejector rod, and the swinging pieces are correspondingly arranged on the rotating shafts one by one; when the push rod is driven to move in a direction departing from the follower, the push rod can push the rotating shafts to rotate so as to drive the swinging pieces to swing.

14. The screening apparatus of claim 13, wherein the centering mechanism further comprises a centering frame and a sleeve, the sleeve is sleeved outside the ejector rod and connected with the ejector rod, and the sleeve is rotatably disposed on the centering frame; the output end of the rotating structure is connected with the sleeve and used for driving the sleeve, the ejector rod, the rotating shaft, the swinging piece, the positioning block and the chip to rotate.

15. The screening apparatus as claimed in claim 2, wherein the pre-processing device further comprises a separating unit disposed at an output end of the direction adjusting unit, the separating unit being configured to receive and separate the chips conveyed by the direction adjusting unit.

16. The screening apparatus according to claim 15, wherein said separating unit separates adjacent ones of said chips by receiving one at a time of said chips conveyed from said direction adjusting unit.

17. The screening apparatus of claim 16, wherein the separation unit includes a separation drive structure, a receiving member, and a detection member; the receiving part is provided with a receiving groove for accommodating the chip, and the detecting part is used for detecting whether the chip is received in the receiving groove; the separation driving structure is used for driving the receiving part to be in butt joint with the output end of the direction adjusting unit and driving the receiving part to reset after the detection part detects the chip from the receiving groove.

18. The screening apparatus according to claim 17, wherein the outlet of the direction adjustment unit is provided with an adsorption member, and the adsorption member is electrically connected to the detection member; the adsorption piece is used for adsorbing the chip positioned at the output port, and the adsorption piece is used for loosening the chip when the material receiving piece is in butt joint with the output port, and sucking the next chip after the chip enters the material receiving groove.

19. The screening apparatus of any one of claims 1 to 18, wherein the performance detection device comprises a circuit board, at least two probes, and a limit stop; the limiting piece is provided with at least two positioning holes, and the at least two probes are respectively inserted into the at least two positioning holes in a one-to-one corresponding manner; one ends of the at least two probes are respectively and electrically connected with the circuit board, and the other ends of the at least two probes are respectively in one-to-one correspondence to be abutted against the at least two bonding pads of the chip.

20. The screening apparatus according to any one of claims 1 to 18, further comprising fine-tuning means for fine-tuning a position of the chip qualified by the detection by the performance detection means for subsequent lamination.

21. The screening apparatus of claim 20, wherein the fine adjustment device comprises a fine adjustment driving structure and at least two abutting members, the fine adjustment driving structure is configured to drive the at least two abutting members to move toward each other to abut against the fine adjustment of the chip or move away from each other to release the chip.

22. The screening apparatus of claim 21, wherein the abutment members have abutment surfaces, each of the abutment surfaces of at least two of the abutment members being adapted to abut against a peripheral surface of the chip for fine adjustment of the position of the chip.

23. The screening apparatus of claim 21, wherein the fine drive structure includes a fine drive member, a rotatable member, and at least two mating members; the at least two matching pieces are respectively abutted against the peripheral wall of the rotating piece, and the at least two abutting pieces are respectively connected with the at least two matching pieces; the rotating piece can be driven to rotate by the fine adjustment driving piece to push the matching pieces to approach or move away from each other.

24. The screening apparatus of claim 23, wherein the rotatable member is square in cross-section, with four corner arcs of the rotatable member; the fine adjustment device comprises four abutting connection pieces and four matching pieces, and the matching pieces are rollers; the four idler wheels are respectively abutted against four side edges of the rotating member in the initial state, and after the rotating member rotates, the four idler wheels are respectively abutted against four corner positions of the rotating member.

25. The screening apparatus according to claim 20, wherein the conveying device includes a suction nozzle for sucking the chip for fine adjustment of the position of the chip by the fine adjustment device.

26. The screening apparatus according to any one of claims 1 to 18, further comprising a scrap recycling device for recycling the chips that are detected as being defective by the performance detecting device.

27. The screening apparatus as claimed in any one of claims 1 to 18, wherein the conveying device includes a turntable and a plurality of suction nozzles, the suction nozzles are sequentially distributed around the turntable along a circumferential direction, the pre-processing device, the performance testing device and the film pasting device are distributed around the turntable along the circumferential direction, and the turntable is configured to drive the suction nozzles to rotate so as to transport the chips.

28. The screening apparatus according to any one of claims 1 to 18, wherein the conveying device includes a suction nozzle, the film sticking device includes a film sticking driving structure and a film, the film is mounted on the film sticking driving structure, and the film sticking driving structure is used for driving the film to move so that the suction nozzle sticks the chip to different positions of the film.

29. The screening apparatus according to claim 28 wherein a peripheral edge of the membrane sheet is fitted with a membrane ring for tensioning the membrane sheet;

the film sticking device also comprises a film sticking seat, a convex ring and a tensioning driving piece, wherein the film ring, the convex ring and the tensioning driving piece are all arranged on the film sticking seat; the convex ring is arranged right below the diaphragm, and the tensioning driving part is used for driving the convex ring and/or the diaphragm to move so that the convex ring abuts against the periphery of the diaphragm to tension the diaphragm.

30. The screening apparatus according to any one of claims 1 to 18, further comprising a film supply device for supplying an empty film sheet and a film feeding device for feeding the empty film sheet to the film sticking device, and further for feeding a finished film sheet with stuck chips to the film supply device.