CN202434480U - Automatic feeding device, packaging equipment and packaging system for IC (integrated circuit) chips - Google Patents
Automatic feeding device, packaging equipment and packaging system for IC (integrated circuit) chips Download PDFInfo
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- CN202434480U CN202434480U CN2012200160454U CN201220016045U CN202434480U CN 202434480 U CN202434480 U CN 202434480U CN 2012200160454 U CN2012200160454 U CN 2012200160454U CN 201220016045 U CN201220016045 U CN 201220016045U CN 202434480 U CN202434480 U CN 202434480U
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- vibrating disk
- breach
- automatic charging
- charging device
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Abstract
The utility model discloses an automatic feeding device for IC (integrated circuit) chips. The automatic feeding device comprises a vibrating disc and an IC holding component and a turning component, the IC holding portion is positioned above the vibrating disc, a spiral groove is arranged on the inner wall of the vibrating disc, the IC holding component is provided with a notch for holding IC chips, the turning component consists of a turning cylinder and a rotary shaft, the turning cylinder is positioned on the upper portion of a base and fixedly connected with the base, the rotary shaft matches with the turning cylinder, one end of the rotary shaft penetrates through the turning cylinder, a rotary arm is perpendicularly arranged at the other end of the rotary shaft, a bent portion is arranged at the tail end of the rotary arm, and a sucker capable of being fastened with the notch is disposed on the bent portion. The utility model further discloses packaging equipment for the IC chip and a packaging system for the IC chips. The automatic feeding device, the packaging equipment and the packaging system have the advantages that double faces of each IC chip can be packaged, and production efficiency of the packaging system for the IC chips is improved.
Description
Technical field
The utility model belongs to IC (integrated circuit, integrated circuit) chip fabrication techniques field, particularly a kind of IC chip automatic charging device, chip encapsulating device and package system.
Background technology
Along with the development of electronic product, contactless intellective IC card is popularized.As everyone knows, the package system in the prior art non-contact intelligent IC-card technological process of production can only be realized the single face encapsulation, and production efficiency is not high, can not satisfy the commercial production demand, needs improvement badly.
The utility model content
The main purpose of the utility model is to provide a kind of automatic charging device of IC chip, is intended to realize IC chip double-faced packaging, improves the production efficiency of IC chip.
To achieve these goals; The utility model provides a kind of IC chip automatic charging device; Involving vibrations dish and the IC that is positioned at vibrating disk top accommodate parts, and the inwall of said vibrating disk is provided with helical groove, said IC accommodate parts be provided with one be used to accommodate the IC chip breach; Said IC chip automatic charging device also comprises a turning part, and the turning part part comprises:
The upset cylinder is positioned at base top, is fixedly connected with said base;
Rotating shaft, adaptive with said upset cylinder, an end of said rotating shaft passes said upset cylinder, and the other end is vertically installed with turning arm, and the end of said turning arm is provided with a bending part, and said bending part is provided with the sucker that fastens with said breach.
Preferably, the face that contacts with the IC chip of the helical groove of said vibrating disk is provided with some through holes that run through said vibrating disk inside and outside wall.
Preferably, the one side of said breach placement IC chip is provided with vertical through hole.
The utility model also provides a kind of IC chip encapsulating device; Comprise IC chip automatic charging device and IC chip automatic fetching device; Said IC chip automatic charging device involving vibrations dish and the IC that is positioned at vibrating disk top accommodate parts; The inwall of said vibrating disk is provided with helical groove, said IC accommodate parts be provided with one be used to accommodate the IC chip breach, said IC chip automatic charging device also comprises:
The upset cylinder is positioned at base top, is fixedly connected with said base;
Rotating shaft, adaptive with said upset cylinder, an end of said rotating shaft passes said upset cylinder, and the other end is vertically installed with turning arm, and the end of said turning arm is provided with a bending part, and said bending part is provided with the sucker that fastens with said breach.
Preferably; Said IC chip automatic fetching device comprises a correcting part; Said correcting part comprises a framework; Be uniformly distributed with four correction cylinders that run through framework around the said framework, said correction cylinder is positioned at the inboard end of framework and is provided with the trimming head that points to the framework center, and said trimming head is the plane setting near an end at said framework center.
The utility model also provides a kind of IC Chip Packaging system; Said IC Chip Packaging system comprises at least two IC chip encapsulating devices; Said IC chip encapsulating device comprises IC chip feeding device and IC chip take out device, and said IC chip feeding device involving vibrations dish and the IC that is positioned at vibrating disk top accommodate parts, and the inwall of said vibrating disk is provided with helical groove; Said IC accommodate parts be provided with one be used to accommodate the IC chip breach, said IC chip automatic charging device also comprises:
The upset cylinder is positioned at base top, is fixedly connected with said base;
Rotating shaft, adaptive with said upset cylinder, an end of said rotating shaft passes said upset cylinder, and the other end is vertically installed with turning arm, and the end of said turning arm is provided with a bending part, and said bending part is provided with the sucker that fastens with said breach.
Preferably, supply the horizontal guide rail of IC chip automatic fetching device horizontal slip to interconnect in the said IC chip encapsulating device.
The utility model overturns to the IC chip through the turning part of IC chip automatic charging device, can realize IC chip double-faced packaging, improves the production efficiency of IC Chip Packaging system; In addition, the utility model also can be revised the position of IC chip through revising cylinder, improves the encapsulation precision of IC chip.
Description of drawings
Fig. 1 is the structural representation of the utility model one example I C chip automatic charging device;
Fig. 2 is the partial structurtes sketch map of vibrating disk among the utility model one embodiment;
Fig. 3 is the partial structurtes sketch map of the utility model one example I C chip automatic charging device;
Fig. 4 is the structural representation of the utility model IC chip encapsulating device one embodiment;
Fig. 5 is the upset sketch map of IC chip among the utility model IC chip encapsulating device one embodiment;
Fig. 6 is the structural representation of front material loading among the utility model IC chip encapsulating device one embodiment;
Fig. 7 is the structural representation of reverse side material loading among the utility model IC chip encapsulating device one embodiment;
Fig. 8 is the partial structurtes sketch map of IC chip automatic fetching device among the utility model IC chip encapsulating device one embodiment.
The realization of the utility model purpose, functional characteristics and advantage will combine embodiment, further specify with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
With reference to Fig. 1, Fig. 1 is the structural representation of the utility model one example I C chip automatic charging device.This IC chip automatic charging device comprises:
Vibrating body 10;
Vibrating disk 20 is positioned at vibrating body 10 tops, is fixedly connected with vibrating body 10, and these vibrating disk 20 inwalls are bowl-shape setting, and this inwall is provided with origin or beginning and is positioned at 20 ends of vibrating disk, and not-go-end is positioned at the helical groove 201 of vibrating disk 20 Pan Kou.
IC accommodates parts 30, IC accommodate parts 30 be provided with one be used to accommodate the IC chip breach 301, breach 301 joins with above-mentioned not-go-end.
Above-mentioned IC chip automatic charging device also comprises a turning part 40, and this turning part 40 comprises:
Concrete, above-mentioned turning part 40 is by upset cylinder 401 driven rotary axles 403 and turning arm 404 Rotate 180s °; Sucker 406 and breach 301 are fastened; And with the IC chip adhesive in the breach 301, behind the sucker 406 absorption IC chips, upset cylinder 401 resets; Turning arm 404 resets, and can make the IC chip with 180 ° of sucker 406 upsets.
The utility model embodiment overturns 180 ° through the upset cylinder to the IC chip, solved in the prior art can only the single face material loading problem, improved the production efficiency of IC chip, satisfied the commercial production application.
In conjunction with Fig. 1, Fig. 2 and Fig. 3, Fig. 2 is the partial structurtes sketch map of vibrating disk among the utility model one embodiment, and Fig. 3 is the partial structurtes sketch map of the utility model one example I C chip automatic charging device.The face 2011 that the helical groove 201 of this vibrating disk 20 contacts with the IC chip is provided with some through holes 2012 that run through vibrating disk 20 inside and outside walls.In the present embodiment, the quantity of through hole 2012 is preferably four.Concrete; These four through holes are positioned near the above-mentioned not-go-end; The length setting of the IC chip in space, when first IC chip fell into IC and accommodates the breach 301 in the parts 30, a corresponding through hole 2012 can be blocked in the front of ensuing second to the 5th IC chip.The middle part of these four through holes 2012 is interconnected, and is connected with the end of bleeding of an air extractor.When work; When first IC chip dropped into IC and accommodates parts 30, air extractor began to bleed, and the end air pressure that through hole 2012 is blocked by the IC chip reduces; The IC chip that absorption is corresponding makes the IC chip no longer continue to accommodate parts 30 motions to IC with the vibration of vibrating disk 20.
Further, the one side 302 that IC accommodates the breach 301 placement IC chips of parts 30 is provided with vertical through hole 303, and promptly this vertical through hole 303 is positioned at breach 301 and the contacted one side of IC chip front side.Preferably, this vertical through hole 303 is positioned at the center of face 302.Can comprise an optical fiber head under the vertical through hole 303, whether breach 301 in have IC chip, and control the operating state of above-mentioned air extractor if being used to detect.Concrete, this optical fiber head comprises infrared transmission module and infrared receiving module.When vertical through hole was not covered by the IC chip, the IR that infrared transmission module sends can pass vertical through hole and inject the external world; When through hole was covered by the IC chip, the IR that is reflected by the IC chip was received by infrared receiving module.When falling into breach 301 like the IC chip at helical groove 201, promptly when this vertical through hole 303 is blocked by the IC chip, optical fiber head will send the signal of bleeding at the beginning to air extractor, and air extractor begins to bleed; When the IC chip that falls into breach 301 was taken away, promptly this through hole was not blocked by the IC chip, and optical fiber head will send the signal that stops to bleed to air extractor, and air extractor stops to bleed.Should be noted that in the present embodiment that reverse side scribbles the one side of protecting glue for the IC chip, the positive one side that is not coated with protection glue for the IC chip.
Optical fiber head through transceiver detects in the breach 301 whether have the IC chip, and the operating state of control air extractor, can guarantee that IC accommodates only to fall into an IC chip in the parts 30, reduces the spoilage of IC chip.
The utility model also provides a kind of IC chip encapsulating device, and is as shown in Figure 4, and Fig. 4 is the structural representation of the utility model IC chip encapsulating device one embodiment.This IC chip encapsulating device comprises the Y traversing guide 22 and directions X guide rail 33 and above-mentioned IC chip automatic charging device 44 that is fixedly connected and is positioned at workbench 11 tops with workbench 11.Wherein, The height of Y traversing guide 22 is lower than directions X guide rail 33; And Y traversing guide 22 and the 33 mutual vertical settings of directions X guide rail, Y traversing guide 22 is provided with can be along its PVC that moves in the Y direction (Poly Vinyl Chloride, polyvinyl chloride) fixed head 55; This PVC fixed head 55 is between Y traversing guide 22 and directions X guide rail 33, and IC chip automatic charging device 44 is positioned at a side of PVC fixed head 55.Directions X guide rail 33 is provided with can be along its IC chip automatic fetching device 66 that moves at directions X.The concrete packaged type that faces up, in conjunction with Fig. 1, Fig. 5 and Fig. 6, Fig. 5 is the upset sketch map of IC chip among the utility model IC chip encapsulating device one embodiment, Fig. 6 is the structural representation of the utility model IC chip encapsulating device front material loading.By the vibration of the vibrating disk in the IC chip automatic charging device 44 with vibrating body; The IC chip front side is contacted with the helical groove 201 of vibrating disk 20; And along the orbiting motion of this helical groove 201 to not-go-end; Fall into the breach 301 that IC accommodates parts 30, the reverse side of IC chip up at this moment.Optical fiber head in the above-mentioned IC automatic charging device will detect vertical through hole 303 and covered; And the signal that transmission is bled at the beginning is to air extractor; Air extractor begins to bleed; The end air pressure that through hole 2012 is blocked by the IC chip reduces, and the IC chip will be adsorbed on the corresponding through hole 2012 of helical groove, stops to accommodate parts 30 motions to IC.At this moment; Through the IC chip in 180 ° of adhesive breach of upset cylinder 401 driven rotary arms upset 301; Upset cylinder 401 resets back IC chip with 180 ° of sucker 406 upsets; Make facing up of IC chip, IC chip automatic fetching device 66 aligns supine IC chip through directions X guide rail 33 and corresponding cylinder cooperation and encapsulates.After the IC chip that falls into breach 301 was taken away by sucker 406, vertically through hole 303 was not blocked by the IC chip, and optical fiber head will send the signal that stops to bleed to air extractor, and air extractor stops to bleed, and makes the IC chip continue to accommodate parts 30 to IC and moves.The mode of the material loading of its reverse side, in conjunction with Fig. 1 and Fig. 7, Fig. 7 is the structural representation of the utility model IC chip encapsulating device reverse side material loading.Only need in above-mentioned steps, save IC chip in 401 pairs of breach 301 of upset cylinder and overturn and get final product, promptly when the IC chip drops into breach 301 in after the IC automatic fetching device 66 direct IC chips that pass through in directions X guide rail 33 and the corresponding cylinder cooperation taking-up breach 301.Should be noted that in the present embodiment that reverse side scribbles the one side of protecting glue for the IC chip, the positive one side that is not coated with protection glue for the IC chip.The structure of IC chip automatic charging device 44 is consistent with the foregoing description, repeats no more at this.
The utility model IC chip encapsulating device can be realized IC chip double-faced packaging through above-mentioned IC chip automatic charging device has been installed, and has improved the production efficiency of IC chip, has satisfied the commercial production application, has reduced the spoilage of IC chip simultaneously.
Further, with reference to Fig. 8, Fig. 8 is the partial structurtes sketch map of IC chip automatic fetching device among the utility model IC chip encapsulating device one embodiment.This IC chip automatic fetching device 66 comprises a correcting part 50; This correcting part 50 comprises a framework 501; Be uniformly distributed with four correction cylinders 502 that run through framework 501 around this framework 501; This correction cylinder 502 is positioned at framework 501 inboard ends and is provided with the trimming head 503 that points to framework 501 centers, and this trimming head 503 is the plane setting near an end at framework 501 centers.Concrete, like Fig. 4 and shown in Figure 8, directions X guide rail 33 is provided with first fixed block, 60, the first fixed blocks 60 that move along it towards directions X and is fixedly connected with IC chip automatic fetching device 66, and these fixed block 60 lower ends are provided with horizontal fixed plate 70.Above-mentioned framework 501 is connected with horizontal fixed plate 70 horizontal fixed, and the suction nozzle 661 of IC chip automatic fetching device 66 can move up and down along the center of these frame 501 bodies.During work; This suction nozzle 661 cooperates with corresponding cylinder; In the adsorbable breach 301 or the IC chip on the sucker 406, through suction nozzle 661 the IC chip is moved to framework 501 centers behind the absorption IC chip, and revise cylinders 502 through above-mentioned four and cooperate; Fitted with suction nozzle 661 fully in the edge, surrounding of IC chip, the direction of the IC chip that IC automatic fetching device 66 is placed on encapsulate on the PVC plate is consistent.IC chip position through on 50 pairs of suction nozzles 661 of above-mentioned correcting part is revised, and can increase the encapsulation precision of IC chip.
The utility model also provides a kind of IC Chip Packaging system, comprises at least two above-mentioned IC chip encapsulating devices.Sealed in unit all is positioned on the same workbench; And each sealed in unit can separately be provided with; Two perhaps adjacent IC chip encapsulating devices can interconnect through the horizontal guide rail (being above-mentioned directions X guide rail 33) that supplies the horizontal slip of IC chip automatic fetching device in the IC chip encapsulating device.Because this IC Chip Packaging system is provided with above-mentioned IC chip encapsulating device, can realize IC chip double-faced packaging, improve the production efficiency of IC Chip Packaging system, satisfied the commercial production application, reduced the spoilage of IC chip simultaneously.The combination of a plurality of IC chip encapsulating devices is used, and wherein separately the separate material loading of vibrating disk can further improve IC chip production efficient.
More than be merely the preferred embodiment of the utility model; Be not thus the restriction the utility model claim; Every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the utility model.
Claims (9)
1. IC chip automatic charging device; Involving vibrations dish and the IC that is positioned at vibrating disk top accommodate parts; The inwall of said vibrating disk is provided with helical groove, said IC accommodate parts be provided with one be used to accommodate the IC chip breach, it is characterized in that; Said IC chip automatic charging device also comprises a turning part, and the turning part part comprises:
The upset cylinder is positioned at base top, is fixedly connected with said base;
Rotating shaft, adaptive with said upset cylinder, an end of said rotating shaft passes said upset cylinder, and the other end is vertically installed with turning arm, and the end of said turning arm is provided with a bending part, and said bending part is provided with the sucker that fastens with said breach.
2. IC chip automatic charging device as claimed in claim 1 is characterized in that the face that the helical groove of said vibrating disk contacts with the IC chip is provided with some through holes that run through said vibrating disk inside and outside wall.
3. IC chip automatic charging device as claimed in claim 2 is characterized in that, the one side that said breach is placed the IC chip is provided with vertical through hole.
4. IC chip encapsulating device; Comprise IC chip automatic charging device and IC chip automatic fetching device; Said IC chip automatic charging device involving vibrations dish and the IC that is positioned at vibrating disk top accommodate parts, and the inwall of said vibrating disk is provided with helical groove, said IC accommodate parts be provided with one be used to accommodate the IC chip breach; It is characterized in that said IC chip automatic charging device also comprises:
The upset cylinder is positioned at base top, is fixedly connected with said base;
Rotating shaft, adaptive with said upset cylinder, an end of said rotating shaft passes said upset cylinder, and the other end is vertically installed with turning arm, and the end of said turning arm is provided with a bending part, and said bending part is provided with the sucker that fastens with said breach.
5. IC chip encapsulating device as claimed in claim 4 is characterized in that, the face that the helical groove of said vibrating disk contacts with the IC chip is provided with some through holes that run through said vibrating disk inside and outside wall.
6. IC chip encapsulating device as claimed in claim 5 is characterized in that, the one side that said breach is placed the IC chip is provided with vertical through hole.
7. IC chip encapsulating device as claimed in claim 6; It is characterized in that; Said IC chip automatic fetching device comprises a correcting part, and said correcting part comprises a framework, is uniformly distributed with four correction cylinders that run through framework around the said framework; Said correction cylinder is positioned at the inboard end of framework and is provided with the trimming head that points to the framework center, and said trimming head is the plane setting near an end at said framework center.
8. an IC Chip Packaging system is characterized in that, comprises at least two like each described IC chip encapsulating device of claim 4 to 7.
9. IC Chip Packaging as claimed in claim 8 system is characterized in that, in the said IC chip encapsulating device, supplies the horizontal guide rail of IC chip automatic fetching device horizontal slip to interconnect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200160454U CN202434480U (en) | 2012-01-13 | 2012-01-13 | Automatic feeding device, packaging equipment and packaging system for IC (integrated circuit) chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200160454U CN202434480U (en) | 2012-01-13 | 2012-01-13 | Automatic feeding device, packaging equipment and packaging system for IC (integrated circuit) chips |
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|---|---|
| CN202434480U true CN202434480U (en) | 2012-09-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012200160454U Expired - Fee Related CN202434480U (en) | 2012-01-13 | 2012-01-13 | Automatic feeding device, packaging equipment and packaging system for IC (integrated circuit) chips |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103674590A (en) * | 2013-11-09 | 2014-03-26 | 皖江新兴产业技术发展中心 | Automatic alarm system implementation method of semiconductor chip full-automatic packaging equipment |
| CN103928374A (en) * | 2014-05-02 | 2014-07-16 | 广州市佑航电子有限公司 | Automation device and method for manufacturing sensor |
| CN107161651A (en) * | 2017-07-11 | 2017-09-15 | 深圳市智领芯科技有限公司 | A kind of multifunctional high speed pendulum machine |
| CN109429440A (en) * | 2017-09-01 | 2019-03-05 | 中国科学院长春光学精密机械与物理研究所 | SMD components turn-over rig and method |
| CN115892589A (en) * | 2022-05-11 | 2023-04-04 | 深圳市三一联光智能设备股份有限公司 | Screening apparatus |
-
2012
- 2012-01-13 CN CN2012200160454U patent/CN202434480U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103674590A (en) * | 2013-11-09 | 2014-03-26 | 皖江新兴产业技术发展中心 | Automatic alarm system implementation method of semiconductor chip full-automatic packaging equipment |
| CN103674590B (en) * | 2013-11-09 | 2016-04-20 | 皖江新兴产业技术发展中心 | Semiconductor chip full-automatic sealed in unit automatic alarm system implementation method |
| CN103928374A (en) * | 2014-05-02 | 2014-07-16 | 广州市佑航电子有限公司 | Automation device and method for manufacturing sensor |
| CN103928374B (en) * | 2014-05-02 | 2016-08-24 | 广州市佑航电子有限公司 | For the automation equipment making sensor and the method making sensor |
| CN107161651A (en) * | 2017-07-11 | 2017-09-15 | 深圳市智领芯科技有限公司 | A kind of multifunctional high speed pendulum machine |
| CN109429440A (en) * | 2017-09-01 | 2019-03-05 | 中国科学院长春光学精密机械与物理研究所 | SMD components turn-over rig and method |
| CN109429440B (en) * | 2017-09-01 | 2021-07-16 | 中国科学院长春光学精密机械与物理研究所 | Surface mount device and method |
| CN115892589A (en) * | 2022-05-11 | 2023-04-04 | 深圳市三一联光智能设备股份有限公司 | Screening apparatus |
| CN115892589B (en) * | 2022-05-11 | 2023-09-22 | 深圳市三一联光智能设备股份有限公司 | Screening apparatus |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Four, building 518000, building A2, Nanchang second industrial zone, Xixiang street, Baoan District, Guangdong, Shenzhen, China (A) Patentee after: Shenzhen Yuanmingjie Technology Co., Ltd. Address before: Four, building 518000, building A2, Nanchang second industrial zone, Xixiang street, Baoan District, Guangdong, Shenzhen, China (A) Patentee before: SHENZHEN YUANMINGJIE TECHNOLOGY CO., LTD. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120912 Termination date: 20200113 |
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| CF01 | Termination of patent right due to non-payment of annual fee |