TWI407851B - Method and equipment for manufacturing the backlight - Google Patents

Abstract

A method and an equipment for manufacturing a backlight are provided, wherein the method includes the steps of: providing a plurality of light-emitting diodes(LED), testing the LEDs, providing a receiver to receive the LEDs which have passed the previous testing, providing a circuit board where the receiver aims at certain positions of the circuit board that the LEDs could be mounted on said positions from the receiver, and applying an external forces on the LEDs to fasten the LEDs on the circuit board. The method and the equipment are applied for manufacturing a circuit board where LEDs are mounted on automatically. Furthermore, the LEDs have been selected and tested before the LEDs are mounted on the circuit board, so that the product quality and backlight efficiency are improved.

Description

Backlight manufacturing method and manufacturing equipment

The present invention relates to a method of manufacturing a backlight and a manufacturing apparatus.

The backlight typically includes a plurality of light emitting diodes and a circuit board for driving the light emitting diodes. At present, the surface mount technology (SMT) is widely used in the industry to manufacture backlights for backlight modules, including semi-automatic or fully automated mechanization processes. In the installation of the backlight, the previous process needs to set these LEDs on the circuit board. First, the robot on the packaging mechanical table sucks the LED pieces on the coil, and then correspondingly set to a certain circuit board. Position, repeat this step multiple times until the complete assembly of the light-emitting diodes on one circuit is completed. However, with this manufacturing method, since the assembled circuit board is tested in the subsequent order, all the LEDs of one circuit board cannot pass the lighting test, so that the manufacturing method will cause multiple rework and the production efficiency is low. Can not meet the production requirements. Furthermore, since the robot only takes one light-emitting diode at a time for setting, the assembly efficiency is low. In addition, it is necessary to use a light-emitting diode coil material so that the manufacturing cost is high.

The present invention provides a method of manufacturing a backlight that reduces the number of rework and improves production efficiency.

In addition, a manufacturing apparatus for the above manufacturing method is provided.

A method for manufacturing a backlight is an automated group of light emitting diodes Performing the following steps in a manufacturing device mounted on a circuit board: providing a plurality of light emitting diodes; detecting a plurality of light emitting diodes; providing a carrier for filling the plurality of light emitting diodes that have passed the detection and passing Inside the carrier; providing a circuit board, aligning the carrier with the position of the preset LED of the circuit board; applying an external force to the LED to be attached to the circuit board.

A manufacturing apparatus suitable for the manufacturing method of the backlight described above, comprising a loading mechanism, a detecting mechanism, and a bonding mechanism for automatically assembling the light emitting diode to the circuit board, the loading mechanism presetting the bulk electronic component The detection mechanism is to be tested; the detecting mechanism detects the electronic component; the bonding mechanism comprises a carrier and a presser; the carrier houses the qualified electronic component; the carrier and a predetermined electronic component of the circuit board to be assembled The position corresponds to; the presser completes assembly of the electronic components in the carrier with the circuit board. Optionally, the manufacturing apparatus further includes a transport mechanism for transporting the circuit board to complete assembly with the electronic components.

Compared with the prior art, the above manufacturing method automatically sets an electronic component such as a light-emitting diode on a circuit board, performs a work test before setting, selects a qualified light-emitting diode, and then performs a qualified light-emitting diode. The fitting setting enables each LED to work normally without rework, which improves the product quality and production efficiency of the backlight.

Please refer to FIG. 1 , which is a perspective view of a preferred embodiment of a manufacturing device for a backlight. The manufacturing apparatus 10 of the backlight includes a loading mechanism 11, a detecting mechanism 13, and a bonding mechanism 15. The loading mechanism 11 transmits the light emitting diode to the detecting mechanism 13, and the detecting The measuring mechanism 13 detects the light-emitting diodes supplied from the loading mechanism 11, and transmits the light-emitting diodes that can meet the detection conditions to the bonding mechanism 15. The bonding mechanism 15 bonds the light-emitting diodes that have been tested by the detecting mechanism 13 to the circuit board. Optionally, the manufacturing apparatus further includes a transport mechanism 17 at which the transport circuit board completes the bonding of the light emitting diodes.

Preferably, the loading mechanism 11 includes a vibrating plate (not shown) including a hopper 112, a spiral track 113, and a discharge port 114. The spiral track 113 surrounds the inner wall of the hopper 112. The discharge port 114 is located at the upper lead end of the spiral track 113. The vibrating plate is vibrated by the electromagnetic vibrator, and the hopper 112 is twisted up and down to vibrate, so that the electronic components of the bulk material, such as the light-emitting diodes, move from low to high along the spiral track, and are automatically aligned until the upper discharge is performed. The port 114 enters the first infeed tank 101, and the plurality of light emitting diodes are transported to the detecting mechanism 13 in a certain direction by the first infeed tank 101.

Please refer to FIG. 2 , which is a perspective view of the detecting mechanism 13 of the manufacturing device 10 of the backlight. The detecting mechanism 13 is configured to detect whether the LED, whether the required model, polarity orientation, and the like meet the requirements and whether it can work normally. In an embodiment, the detecting mechanism 13 can determine the image of the LED model by using a Charge Coupled Device (CCD) to capture the image of the LED to be detected and compare it with the preset image. It is determined whether the size and model of the detected light-emitting diode meet the requirements. In another embodiment, the detecting mechanism 13 can also latch the surfaces of the LED to be detected from different directions, calculate the distance of the opposite surface of the LED to be detected, and set the distance to a preset value. Compare and determine whether the size and model of the detected LEDs meet the requirements. Judging light dipole Whether the body is the size, model and other methods of demand, not enumerated. The operation principle of the detecting mechanism 13 will be described below by taking a light-emitting diode as an example.

The detecting mechanism 13 includes a rotating table 130 and a detecting disk 135. The rotating table 130 aligns the light-emitting diodes arranged in a certain direction by the loading mechanism 11 through the first feeding slot 101 on the detecting disk 135, and detects the qualified light-emitting diodes. The bonding mechanism 15 is supplied through the second feed slot 103. The structural design of the rotating table 130 and the detecting plate 135 ensures the detection of the loop of the detecting mechanism and improves the detection efficiency.

The rotary table 130 includes a rotary disk 131, a rotary shaft 132, a plurality of absorption rods 133, a brake 134, and a vacuum tube 137. The rotary disk 131 is horizontally disposed and rotatable about the rotary shaft 132. The plurality of crystal rods 133 are partially housed in the rotating disk 131, and are rotatable about the rotating shaft 132 by the rotating disk 131. The main body of the brake 134 is housed in the rotating shaft 132. One end of the vacuum tube 137 is connected to one end of the absorption rod 133, and the vacuum tube 137 is filled with a vacuum to provide the absorption rod 133 with a force for adsorbing the light-emitting diode. The other end of the vacuum tube 137 is connected to a brake 134 for acquiring the braking force of the plurality of crystal rods 133. The aspiration rod 133 includes a rod body 1331, a crystal absorption head 1332, and a stopper 1335. The rod body 1331 is connected to one end of the vacuum tube 137, and the other end is provided with the crystal head 1332. The limiting member 1335 is disposed on the rod body 1331 and adjacent to the vacuum tube 137. The limiting member 1335 is substantially cylindrical. The central axis of the cylinder is the same line as the central axis of the rod 1331, and the diameter of the bottom surface of the limiting member 1335 is larger than the cross-sectional diameter of the rod 1331.

The rotating disk 131 includes a plurality of cylindrical holes 136, and the center of the plurality of cylindrical holes 136 is The distance of the center of the rotating disk is equal. The cylindrical hole 136 has a larger or smaller diameter than the cross-sectional diameter of the rod 1331 but smaller than the bottom surface of the limiting member 1335. One end of the crystal head 1332 of the plurality of rods 1331 passes through the plurality of cylindrical holes to be received in the plurality of cylindrical holes 136, respectively. Since the diameter of the bottom surface of the limiting member 1335 is larger than the diameter of the bottom surface of the cylindrical hole 136, the limiting member 1335 defines the length of the rod 1331 passing through the rotating plate 131 above the rotating disk 131 to ensure that each of the rods 1331 passes through. The length of the rotating disk 131 is uniform. A cushioning member (not shown) is disposed between the limiting member 1335 and the rotating disc 131, such as a spring to serve as a buffer when the limiting member 1335 collides with the rotating disc 131.

The detection disk 135 includes a chassis 1351 and a plurality of detection stations 1352. The chassis 1351 is disposed in parallel with the rotating disk 131. The plurality of detecting holes 1352 are disposed on the chassis 1351 corresponding to the plurality of cylindrical holes 136 of the rotating disk 131. The height of the inspection station 1352 is slightly smaller than the distance from the crystal absorption head 1332 of the absorption rod 133 to the chassis 1351. The number of the detection stations 1352 can be increased or decreased by a fixed factor according to the requirements of the work efficiency.

In one embodiment, the inspection station 1352 can include a size inspection station 1353, a first unloading station 1354, a first lighting detection station 1355, a second lighting detection station 1356, and a second unloading station 1357. The size detecting station 1353 can detect the incoming material, that is, whether the light emitting diode to be tested is of a set size, and the detecting method can detect the size of the light emitting diode to be tested by using the foregoing enumerated method, and determine whether it is the same as the preset value. , the judgment result is automatically recorded. The first unloading stage 1354 recovers the light-emitting diodes that are not in conformity with the size requirements detected by the size detecting station 1353. The first lighting detection station 1355 performs the first lighting detection on the light emitting diode, and if it can be lit, the liquid crystal head 1332 The sucking light-emitting diode is sent to the second feed slot 103 to supply the bonding mechanism 15. If the LED cannot be lit, the electrode of the LED may not match the electrode of the first lighting detection station 1355, and the first lighting detection station 1355 drives the LED on the LED to rotate 180 degrees. The orientation of the positive and negative electrodes of the light-emitting diode is changed, and then the light-emitting diode whose orientation of the positive and negative electrodes has been changed is sucked by the crystal head 1332 into the second lighting detection stage 1356 for the lighting test. The first lighting detection station 1355 is automatically reset to accept the detection of the next LED. When the second lighting detection stand 1356 performs the lighting test, if the light can be turned on, the light-emitting diode is taken up by the crystal head 1332 and sent to the second transfer tank 103 to supply the bonding mechanism 15. If the lighting test is still not performed when the lighting test is performed on the second lighting inspection stand 1356, the light-emitting diode is taken up by the liquid crystal head 1332 and transferred to the second discharging table 1357 for recycling. The first unloading stage 1354 and the second unloading stage 1357 receive the waste according to the above-described detection result, and do not receive the qualified material.

3 and FIG. 4, FIG. 3 is a partial schematic view of the bonding mechanism 15 of the manufacturing apparatus 10 of the backlight shown in FIG. 2, and FIG. 4 is a bonding mechanism 15 of the manufacturing apparatus 10 of the backlight shown in FIG. 2. A partial schematic of another part of it. The fitting mechanism 15 includes an automatic guide 151 and a presser 155. The automatic guide 151 receives the light emitting diodes transmitted by the detecting mechanism 13 and implants the light emitting diodes on the circuit board provided with the solder paste. The presser 155 presses the light emitting diode onto the circuit board.

The automatic guide 151 includes a hopper 1512, an implanter 1514, and a carrier 1516. The hopper 1512 delivers the qualified LEDs provided by the detection mechanism 13 through the second delivery slot 103 to the implanter 1514, which delivers the received LEDs to the carrier 1516. Can manually set the hopper 1512 to transmit each time The number of light-emitting diodes for the implanter 1514 can also be artificially set by the implanter 1514 each time receiving the number of light-emitting diodes, which is set according to the required number of light-emitting diodes per unit on the circuit board. Preferably, the number of light-emitting diodes that can be transported by the implanter 1514 is set to be an integral multiple of the number of light-emitting diodes per unit on the circuit board. The carrier 1516 can accurately position the material to a position above the pre-pressed circuit board.

The hopper 1512 includes a transfer tank 1521, a transfer tray 1522, a motor 1523, and a cross rail 1524. The transfer groove 1521 is strip-shaped and disposed at an edge of the transfer tray 1522 to rotate the central axis of the rotating tray 1522 at the transfer tray 1522. The transfer tray 1522 is disposed on the cross rail 1524 and is at the motor 1523. The brakes are moved up and down and left and right on the cross rail 1524. The transfer tray 1522 and the transfer slot 1521 are connected to each other to include a small shaft 1529 whose axis is perpendicular to the axis of the transfer tray 1522. The small rotating shaft 1529 rotates the transfer groove 1521 about the central axis of the small rotating shaft 1529. The small rotating shaft 1529 drives the transfer slot 1521 to rotate and the transfer tray 1522 is driven by the motor 1523 to realize the transfer slot 1521 and the second feed slot 103 to receive the light emitting diode. After receiving, the motor 1523 drives the transfer tray 1522 and the small rotating shaft 1529 to move, and the transfer slot 1521 is docked with the implanter 1514 to transfer the LED to the implanter 1514.

The implanter 1514 is used to prime the carrier 1516. Preferably, the interior of the implanter 1514 includes a slanted trough body, and the design can cause the illuminating diodes to be blanked one by one by the action of gravity. The implanter 1514 receives the LEDs transmitted from the transfer slot 1521 and transports them to the carrier 1516, driven by motors (not shown) and rails (not shown). Preferably, the carrier 1516 includes a plurality of guiding channels 1517 corresponding to the size of the LED, and the position of the plurality of guiding channels 1517 can be corresponding according to the set position of the preset LEDs on the circuit board. The implanter 1514 implants a plurality of light emitting diodes into the plurality of channels 1517.

The presser 155 can be moved by the guide rail 1557 to the upper side of the carrier 1516, and the plurality of guide grooves 1517 are aligned for pressing. Preferably, the presser 155 includes a cylinder, and the telescopic legs of the cylinders are directly contacted with the telescopic legs (not labeled) of the cylinders to be attached to the circuit board provided with the solder paste. Each time the bonding step is completed, the plurality of stampers 155 can be disposed to fit the entire row of the LEDs, so that one of the strips or one of the strips can be completed as needed.

The transport mechanism 17 is configured to transfer the circuit board to the bonding mechanism 15 to complete the bonding of the light emitting diodes. The transport mechanism 17 includes a plurality of transport units 170 and a transport circuit board and a mating mechanism 15 for completing the assembly of the light-emitting diodes. Each of the motion units 170 includes a transport belt 171, a transport motor 172, and a transport shaft 173. The transport motor 172 drives the transport shaft 173 to rotate. The transport belt 171 is sleeved on the transport shaft 173 and can be transported by the transport shaft 173. The transport mechanism 179 includes a rail 175 and a servo motor 177 disposed below the motion unit 170. The rail 175 of the transport mechanism 179 and the servo motor 177 can transport each transport unit 170 above the carrier 1516, align the circuit board with the carrier 1516, and drive the circuit board into rows for the light-emitting diode. The line is pressed at a constant speed.

The present invention is not limited to the above embodiments, such as improving the resistance of the detecting mechanism 13 The test of the various electronic components such as the test of the capacitor, the test of the capacitor, and the like, the manufacturing apparatus 10 of the backlight can perform the bonding of the board to various electronic components. If the manufacturing device 10 of the backlight performs the bonding of the circuit board to the resistor, the detection mechanism 13 is changed to use the resistance of the universal meter to detect the resistance. For example, if the manufacturing device 10 of the backlight performs the bonding of the board to the connector, The detection mechanism 13 is changed to use the CCD to detect the size or model of the connector.

Furthermore, in another embodiment, the implanter 1514 implants a plurality of light-emitting diodes on a circuit board below the plurality of channels 1517, and the plurality of light-emitting diodes are positioned by the plurality of channels 1517.

Referring to FIG. 5 , a method for manufacturing a backlight and a working principle and a manufacturing device of the backlight of the present invention are described by taking a light-emitting diode as an example: feeding: providing a plurality of light-emitting diodes; and the bulk of the light-emitting diodes in the vibration plate Aligned in a certain direction in a certain direction under vibration and transmitted to the detecting mechanism 13 by the first feeding slot 101; detecting: detecting a plurality of light emitting diodes; providing a detecting mechanism 13 for detecting the feeding mechanism 11 The light-emitting diode transmits the light-emitting diode that can meet the detection condition to the bonding mechanism 15; the crystal-absorbing head 1332 on the absorption rod 133 of the detecting mechanism 13 picks up one of the first transfer tanks 101. The light-emitting diode drives the light-emitting diode to rotate to the size detecting station 1353 for detecting the size and type, and records the detection result; the crystal-absorbing head 1332 sucks the light-emitting diode detected by the size detecting station 1353 and rotates to the first one. Material table 1354, the first unloading station 1354 receives the unqualified light-emitting diode according to the detection result of the size and type of the light-emitting diode, and does not receive the qualified light-emitting diode; the crystal-injecting head 1332 is from the size detecting station 1353 qualified light-emitting diodes perform the first lighting detection, and the crystal-absorbing heads 1332 corresponding to the unqualified light-emitting diodes received by the first unloading stage 1354 are idling until after returning to the first feeding trough And re-absorbing the light-emitting diodes conveyed by the first feeding tank 101; providing the electrodes of the light-emitting diodes after the first lighting detecting station 1355 receives the qualified light-emitting diodes transmitted by the crystal-absorbing heads 1332 The electric energy, if it can be lighted, is transmitted from the crystal atomizing head 1332 to the second feeding trough 103. If it is not lit, the first lighting detecting station 1355 is rotated by 180 degrees, thereby driving the LEDs thereon. The polarity rotation, the polarity-changing light-emitting diode is sucked by the crystal head 1332 into the second lighting detection stage 1356 for the lighting test. When the second lighting detection stand 1356 performs the lighting test, if the light can be turned on, the light-emitting diode is taken up by the crystal head 1332 and sent to the second transfer tank 103 to supply the bonding mechanism 15. If the lighting test is still not performed when the lighting test is performed on the second lighting inspection stand 1356, the light-emitting diode is taken up by the liquid crystal head 1332 and transferred to the second discharging table 1357 for recycling. The first unloading stage 1354 and the second unloading stage 1357 receive the waste according to the above-described detection result, and do not receive the qualified material.

Alignment: a carrier 1514 is provided, and a plurality of light-emitting diodes that have passed the detection and pass are filled into the carrier 1514; and a bonding mechanism 15 is provided to affix the light-emitting diodes that have passed the detection by the detecting mechanism 13 Coupling to the circuit board; the transfer tray 1522 of the bonding mechanism 15 is moved on the cross rail 1524 by the motor 1523, and moved to the vicinity of the second delivery slot 103. The position, the small rotating shaft 1529 adjusts the rotation angle of the transfer groove 1521, and the one end of the transfer groove 1521 is docked with the second feeding groove 103, and further receives the light emitting diode transmitted by the second feeding groove 103. The transfer tray 1522 and the small rotating shaft 1529 drive the transfer slot 1521 to rotate, and the transfer slot 1521 is inclined to interface with the implanter 1514, and the light-emitting diode carried thereon is transmitted to the implanter 1514.

A circuit board is provided to align the carrier 1514 with the position of the circuit board preset light-emitting diode. The position of the light-emitting diode is preset on the circuit board, an electrode is disposed at the corresponding position, and a solder paste is disposed at the electrode.

Referring to FIG. 6 to FIG. 9 together, the implanter 1514 is filled with a carrier 1516, and the presser 155 presses the LEDs onto the circuit board. The implanter 1514 includes a motor and a rail (not labeled). The implanter 1514 receives the light-emitting diode and moves it to the upper side of the carrier 1516 under the driving of the motor and the guide rail, and fills the light-emitting diode in a certain direction into the plurality of guide grooves 1517 of the carrier 1516. . After completing the filling of a unit of the circuit board, such as a row, the implanter 1514 is removed by the motor to expose the space above the carrier 1516.

An external force is applied to the light emitting diode to be attached to the circuit board.

The presser 155 includes a motor and a guide rail (not shown) that is moved by the motor and the guide rail to the carrier 1516 to align the light-emitting diodes in each of the guide grooves 1517. Pressing, the light-emitting diode is squeezed and then sinks, and the circuit board is finished.

Transportation: providing a transport mechanism 17 transport circuit board is completed at the fitting mechanism 15 The bonding of the light-emitting diodes.

The circuit board is transported above the servo motor 177 and the rail 175 by the transport belt 171, and driven by the servo motor 177 and the rail 175, the circuit board is transported to a position corresponding to the carrier, and the fitting of each unit is performed. Driven by the servo motor 177, the iso-speed moves in a certain direction to complete the bonding of the entire circuit board.

The light-emitting diode is automatically attached to the circuit board by using the above-mentioned backlight manufacturing method and manufacturing equipment, and a plurality of light-emitting diodes are attached at the same time, thereby improving production efficiency, and performing work test and screening before bonding. The qualified light-emitting diodes are then attached to the qualified light-emitting diodes, so that each of the light-emitting diodes can work normally without rework, thereby improving product quality.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Backlight manufacturing equipment

11‧‧‧Feeding agency

13‧‧‧Test institutions

15‧‧‧Fitting organization

17‧‧‧Transportation agencies

101‧‧‧First feed trough

103‧‧‧Second feed trough

112‧‧‧ hopper

113‧‧‧Spiral track

114‧‧‧Outlet

130‧‧‧Rotary table

135‧‧‧Detection disk

131‧‧‧ rotating disk

132‧‧‧Rotary axis

133‧‧‧Inhalation rod

136‧‧‧ cylindrical hole

137‧‧‧vacuum tube

151‧‧‧Automatic feeder

155‧‧‧Parts

171‧‧‧Transportation belt

172‧‧‧Carriage motor

173‧‧‧Transportation shaft

170‧‧‧Transportation unit

175‧‧‧ Track

177‧‧‧Servo motor

179‧‧‧Transportation agency

1331‧‧‧rod

1332‧‧‧Sucker head

1335‧‧‧Limited parts

134‧‧‧ brake

1351‧‧‧Chassis

1352‧‧‧Testing station

1353‧‧‧Size inspection table

1354‧‧‧First unloading station

1355‧‧‧The first lighting test stand

1356‧‧‧Second lighting test bench

1357‧‧‧Second loading station

1512‧‧‧Transfer

1514‧‧‧ implanter

1516‧‧‧carrier

1517‧‧‧ Guide slot

1557‧‧‧rail

1521‧‧‧Transfer trough

1522‧‧‧Transfer tray

1523‧‧‧Motor

1524‧‧‧ cross rail

1529‧‧‧Small shaft

1 is a perspective view of a preferred embodiment of a manufacturing apparatus for a backlight.

2 is a perspective view of a detecting mechanism of a manufacturing apparatus of a backlight.

3 is a partial schematic view showing a fitting mechanism of a manufacturing apparatus of the backlight shown in FIG. 2.

4 is a partial schematic view showing another portion of the bonding mechanism of the manufacturing apparatus of the backlight shown in FIG. 2.

Fig. 5 is a flow chart showing the steps of a method for manufacturing a backlight of the present invention.

6 to FIG. 9 are schematic diagrams showing the flow of the carrier to the carrier, and the presser for pressing the LED to the circuit board.

10‧‧‧Backlight manufacturing equipment

11‧‧‧Feeding agency

13‧‧‧Test institutions

15‧‧‧Fitting organization

17‧‧‧Transport structure

101‧‧‧First feed trough

103‧‧‧Second feed trough

112‧‧‧ hopper

113‧‧‧Spiral track

114‧‧‧Outlet

Claims (15)

A manufacturing method of a backlight is to perform the following steps in a manufacturing apparatus capable of automatically assembling a light emitting diode to a circuit board: providing a plurality of light emitting diodes; detecting a plurality of light emitting diodes; providing one a carrier that fills the carrier with a plurality of light-emitting diodes that are inspected and qualified; a circuit board is provided to align the carrier with the position of the preset light-emitting diode of the circuit board; and an external force is applied to the light-emitting device The diode is attached to the circuit board. The method for manufacturing a backlight according to claim 1, wherein a loading mechanism is provided for arranging the plurality of light-emitting diodes in a predetermined direction to be tested. The method of manufacturing a backlight according to claim 1, wherein the detecting of the light emitting diode comprises at least one of size, model, polarity, or lighting. The method for manufacturing a backlight according to claim 3, wherein the size or type of the light emitting diode is detected by using a charge coupled device to capture an image of the light emitting diode to be detected, and the preset image. A comparison is made to determine whether the size or model of the detected light-emitting diode meets the requirements. The method for manufacturing a backlight according to claim 3, wherein another detection method of the size or model of the light emitting diode is to calculate the position of each surface of the light emitting diode to be detected from different directions, and calculate The distance from the opposite surface of the light-emitting diode to be detected is compared with a preset value to determine whether the size or model of the detected light-emitting diode meets the requirements. The method for manufacturing a backlight according to claim 3, wherein the polarity detecting method of the light emitting diode is to adjust the light emitting diode whose polarity does not conform to a predetermined orientation to a polarity conforming to a predetermined orientation. The method for manufacturing a backlight according to the third aspect of the invention, wherein the light-emitting diode is illuminated and the light-emitting diode is qualified for polarity detection. The body performs lighting detection, and the light-emitting diode that cannot be detected by lighting is eliminated. A manufacturing apparatus suitable for a method of manufacturing a backlight according to claim 1, comprising a loading mechanism, a detecting mechanism, and a bonding mechanism to automatically assemble the light emitting diode to the circuit board, the loading mechanism The bulk electronic components are arranged in a predetermined direction and are to be tested; the detecting mechanism detects the electronic components; the bonding mechanism comprises a carrier and a presser; the carrier accommodates the qualified electronic components; the carrier and a device to be assembled The circuit board presets the position of the electronic component; the presser assembles the electronic component in the carrier with the circuit board. The manufacturing apparatus of claim 8, wherein the manufacturing apparatus further comprises a transport mechanism for transporting the circuit board to complete assembly with the electronic component. The manufacturing apparatus of claim 8 or 9, wherein the loading mechanism is a vibrating plate, the vibrating plate comprises a hopper, a spiral track and a discharge opening, the spiral track surrounding an inner wall of the hopper, the discharging The port is located at the upper lead end of the spiral track. The vibrating plate moves the electronic components from low to high along the spiral track and automatically orients them until the upper discharge port, so that the electronic components are arranged in a predetermined direction and transmitted to the detecting mechanism. The manufacturing device of claim 8 or 9, wherein the electronic component is a light emitting diode, the detecting mechanism comprises an inhalation bar, a size detecting station, a first unloading table, a first lighting detecting station, The second lighting inspection table and the second material discharging table are used, and the liquid absorption diode sucks the light emitting diodes provided by the loading mechanism, and performs detection according to the order of the above detecting stations. The manufacturing apparatus according to claim 11, wherein the liquid absorption rod sucks the light emitting diode to perform the first lighting detection of the lighting test, and if it can be lit, the light absorption diode is sucked by the liquid absorption rod to be transmitted to the light emitting diode. If the bonding mechanism fails to illuminate, the first time the lighting detection level is rotated, and the polarity-changing light-emitting diode enters the second lighting detection station for the lighting test under the suction of the suction rod. When the second lighting detection station performs the lighting test, if it can be lit, the light is absorbed by the absorption rod. The diode is transferred to the bonding mechanism. If the lighting test is still not performed when the lighting test is performed for the second time, the light-emitting diode is sucked by the absorption rod to be transferred to the second discharging station for recycling. The manufacturing apparatus of claim 12, wherein the first lighting detection station comprises detecting the polarity of the light emitting diode, which can drive the light emitting diode thereon to rotate, thereby changing the light emitting diode The polarity of the body. The manufacturing apparatus of claim 12, wherein the suction rod is connected to a vacuum tube, and the vacuum tube provides an adsorption force for the absorption rod. The manufacturing apparatus of claim 8 or 9, wherein the carrier comprises a guiding slot corresponding to the size of the electronic component, the guiding slot corresponding to a position of a predetermined electronic component on the circuit board, the guiding slot receiving the guiding slot Electronic component.