CN114700285A - Chip sorting device, equipment and method - Google Patents

Abstract

The invention relates to a chip sorting device, which comprises a workbench, a blanking mechanism and a sorting mechanism, wherein the workbench is used for bearing and processing wafers; the blanking mechanism is used for storing the chip; a first sensor in the sorting mechanism is arranged in an alignment way with the workbench and used for guiding the moving assembly to pick up a chip from the processed wafer; the second inductor is arranged in an alignment mode with the blanking mechanism and used for guiding the moving assembly to place the picked chip to the blanking mechanism. According to the chip sorting device, unprocessed wafers are stored in the chip sorting equipment and processed by the workbench in sequence through the feeding device, the first sensor guides the moving assembly to accurately pick up the needed target chips from the wafers, and the second sensor can guide the moving assembly to group and place the picked different chips into the blanking mechanism. The process has high automation degree, can greatly save labor cost, improves the speed of chip separation, and is favorable for large-scale industrial production.

Description

Chip sorting device, equipment and method

Technical Field

The invention relates to the technical field of semiconductor packaging test, in particular to a chip sorting device, equipment and a method.

Background

The semiconductor production flow consists of wafer manufacturing, wafer testing, chip packaging and packaging testing. The semiconductor packaging test refers to a process of processing a wafer passing the test according to a product model and a functional requirement to obtain an independent chip.

In the field of semiconductor package testing technology, in the process of processing a wafer to be tested according to a product model and a functional requirement to obtain an independent Chip, a Chip On Flex (or, Chip On Film, commonly called a Chip On Film) Chip On the wafer needs to be sorted and sorted, and the Chip is placed in a Tray (also called a Tray) for holding the Chip.

However, the existing semiconductor packaging equipment does not have a visual guidance function, and only relies on a mechanical adjustment mode to pick and sort, so that the efficiency is low, errors are easy to occur, and the requirements of the current industrialized large-scale and high-efficiency production cannot be met.

Disclosure of Invention

In view of the above, the present invention is necessary to provide a chip sorting apparatus, device and method capable of sorting COF chips exclusively.

A chip sorting device comprises a workbench, a blanking mechanism and a sorting mechanism, wherein the workbench is used for bearing and processing wafers; the blanking mechanism is used for storing chips; the sorting mechanism comprises a moving assembly, a first sensor and a second sensor, wherein the first sensor is arranged in an alignment mode with the workbench and used for guiding the moving assembly to pick up chips from the processed wafers; the second sensor is arranged in an alignment mode with the blanking mechanism and used for guiding the moving assembly to place the picked chip to the blanking mechanism.

In the chip sorting device, unprocessed wafers are stored and sorted by the feeding device in the chip sorting equipment, the wafers are transferred to the workbench from the storage bin by the transmission device, and the wafers are processed by the workbench. The first sensor can guide the moving assembly to accurately pick the required target chip from the wafer, and the second sensor can guide the moving assembly to group and place the picked different chips into the blanking mechanism. The process has high automation degree, can greatly save labor cost, improves the speed of chip separation, and is favorable for large-scale industrial production.

In one embodiment, the moving assembly comprises a swing arm and a first driver, wherein a suction nozzle is arranged on the swing arm, and the first driver is used for driving the swing arm to move so as to enable at least the suction nozzle to pick up a chip in the wafer; or, the wafer on the suction nozzle is placed on the blanking mechanism.

In one embodiment, a plurality of the suction nozzles are arranged on the swing arm at intervals, and the suction nozzles are used for picking up chips on corresponding positions from a wafer on the workbench.

In one embodiment, the sorting mechanism further comprises a vacuum tank, and the vacuum tank is communicated with the suction nozzle air passage.

In one embodiment, the worktable is provided with a rotation module, a first moving module and a second moving module, the rotation module is used for driving the wafer to rotate and complete the wafer expanding action, the first module is used for driving the rotation module to move along a first direction, the second module is used for driving the first module to move along a second direction, and the first direction and the second direction are intersected.

In one embodiment, the chip sorting equipment comprises a rack, and a loading device, a conveying device and the chip sorting device, wherein the loading device is placed on the rack and used for storing wafers, and the conveying device is used for conveying the wafers in the loading device to the workbench.

In one embodiment, the loading device includes a storage bin, a scanner, and a second driver, the storage bin is used for stacking a plurality of wafers, the scanner is disposed at an opening of the storage bin and is used for scanning information of the wafers, and the second driver is connected to a side surface of the storage bin and is used for driving the wafers to move in the storage bin.

In one embodiment, the loading device further comprises a guide rod connected to the opening of the storage bin and used for guiding the wafer from the storage bin to the conveying device.

In one embodiment, the conveying device includes a clamping member and a moving module, the clamping member is connected to the moving module and can move along the length direction of the moving module, and the clamping member is used for clamping the wafer from the storage bin and moving the wafer to the workbench.

A chip sorting method, adapted to any of the above chip sorting apparatus, comprising the steps of:

providing a wafer to a feeding device;

starting a transmission device, and moving the wafer in the feeding device to a workbench;

starting a workbench, and processing the wafer on the workbench to separate chips in the wafer from each other;

starting a sorting mechanism, and driving a moving assembly to pick up a chip from a wafer on the workbench under the guidance of a first sensor;

under the guidance of a second sensor, driving a moving assembly to move the picked chip to the position of a blanking mechanism;

and the chip is placed on the blanking mechanism by the driving moving assembly.

Drawings

FIG. 1 is a schematic view showing the overall configuration of a chip sorting apparatus according to an embodiment;

FIG. 2 is a schematic view of the overall structure of the loading device according to an embodiment;

FIG. 3 is a schematic diagram of the overall structure of the transfer device according to an embodiment;

FIG. 4 is a schematic diagram of the overall structure of the work table in one embodiment;

FIG. 5 is a schematic view showing the overall structure of the sorting mechanism according to one embodiment;

fig. 6 is a schematic view of the overall structure of the blanking mechanism in one embodiment.

Description of reference numerals:

10. chip sorting equipment; 20. a wafer; 100. a frame; 200. a feeding device; 210. a storage bin; 220. a code scanning gun; 230. a second driver; 240. a guide rod; 300. a transmission device; 310. a clamping member; 320. a moving module; 400. a chip sorting device; 410. a work table; 411. a rotating module; 412. a first moving module; 413. a second moving module; 420. a sorting mechanism; 421. a moving assembly; 4211. swinging arms; 4212. a first driver; 4213. a suction nozzle; 422. a first inductor; 423. a second inductor; 424. a vacuum tank; 430. a blanking mechanism; 431. a material tray; 432. a tray moving module; 433. and a tray storage module.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

As shown in fig. 1 and 2, a chip sorting apparatus 10 according to an embodiment of the present invention includes a frame 100, and a loading device 200, a transporting device 300, and a chip sorting device 400 placed on the frame 100. The loading device 200 is used for storing the wafers 20. The transfer device 300 is used for transferring the wafer 20 located in the loading device 200 to the chip sorting device 400. The chip sorting apparatus 400 processes the wafer 20, and sorts and picks up chips on the wafer 20.

It should be noted that the loading device 200, the conveying device 300, and the chip sorting device 400 are sequentially disposed on the rack 100, so that the wafer 20 can sequentially pass through the loading device 200, the conveying device 300, and the chip sorting device 400 to complete the sorting and storage of the chips.

As shown in fig. 2, in one embodiment, a loading device 200 for storing wafers 20 includes a storage bin 210 and a code scanning gun 220. The storage bin 210 defines a cavity (not shown) capable of accommodating a plurality of wafers 20 for stacking the plurality of wafers 20. The stocker 210 is provided with an opening (not shown) for moving the wafer 20 in and out. The code scanning gun 220 is arranged at the opening.

It will be appreciated that the wafer 20 to be processed and sorted is placed in the cavity prior to processing and sorting the wafer 20. The scan gun 220 is used to scan and read the data of the wafers 20 in the storage bin 210, and facilitates data tracking of each processed and sorted wafer 20.

It should be noted that the code scanning gun 220 is disposed outside the storage bin 210 to prevent the wafer 20 and the code scanning gun 220 from colliding with each other to damage the wafer 20 or the code scanning gun 220 during the storage and movement of the wafer 20 in the cavity. In addition, the specific type and model of the yard scanning gun 220 are not limited herein and can be adjusted according to actual needs.

As shown in fig. 2, in one embodiment, a second driver 230 is further disposed in the feeding device 200. The second driver 230 is used to control the movement of the wafers 20 in the stocker 210.

It should be noted that when the wafers 20 are horizontally stacked in the storage bin 210, the second driver 230 should control the wafers 20 to move up and down in the storage bin 210. When the wafers 20 in the storage bin 210 need to be removed, the uppermost wafer 20 in the cavity should be moved upward to the position where the code scanning gun 220 can scan, and after the code scanning gun 220 scans and verifies the uppermost wafer 20, the uppermost wafer 20 is moved out of the storage bin 210 along the horizontal plane where the uppermost wafer is located, and then enters the transmission device 300.

When the wafers 20 are vertically stacked in the stocker 210, the second driver 230 should control the horizontal movement of the wafers 20 in the stocker 210. When the wafer 20 in the storage bin 210 needs to be removed, the wafer 20 located at the leftmost side (or the right side) in the cavity should be moved to the position where the code scanning gun 220 can scan, and after the code scanning gun 220 scans and verifies the wafer, the wafer 20 is moved out of the storage bin 210 along the vertical plane where the wafer is located, and then enters the transmission device 300.

Specifically, in the present embodiment, the wafers 20 are horizontally stacked in the stocker 210.

Further, as shown in fig. 2, in one embodiment, the feeding device 200 is further provided with a guide rod 240. The guide bar 240 is connected to the opening and serves to guide the wafer 20 from the storage bin 210 into the transfer device 300. The number of the guide rods 240 may be one or more.

It should be noted that the second driver 230 should control the movement of the wafer 20 to a position higher than the guide rods 240 in the storage bin 210. When the wafer 20 leaves the storage bin 210, the guide rod 240 supports and guides the wafer 20, which is beneficial to improving the stability of the wafer 20 during the moving process.

Specifically, in the present embodiment, there are two guide rods 240. The two guide rods 240 are oppositely arranged at the opening of the storage bin 210. The plane of the two guide rods 240 is parallel to the plane of the wafers 20 in the storage bin 210.

As shown in fig. 3, in one embodiment, the transfer device 300 includes a gripper 310 and a moving module 320. The clamping member 310 is connected to the moving module 320 and can move along the length direction of the moving module 320. The gripper 310 is used to grip the wafer 20 from the storage bin 210 and move the wafer 20 to the chip handler 400.

It should be noted that the clamping member 310 can move back and forth at both ends of the moving module 320. Among them, the position where the clamp 310 can clamp the wafer 20 from the storage bin 210 is the initial position, and the position where the clamp 310 can place the wafer 20 to the chip handler 400 is the completed position.

When the wafer 20 is moved to the completed position by the clamping member 310, the wafer 20 is released by the clamping member 310. The wafer 20 falls by its own weight into the chip sorting apparatus 400 for processing and sorting. After the gripper 310 releases the wafer 20, it will continue to move in the reverse direction back to the original position to grip the next wafer 20 from the storage bin 210.

As shown in fig. 1 and 4, in one embodiment, the chip sorting apparatus 400 includes a table 410, a sorting mechanism 420, and a blanking mechanism 430. The table 410 is used for carrying and processing the wafer 20 transferred from the clamping member 310. The sorting mechanism 420 is used for picking up the chips in the wafer 20 from the table 410 and placing the picked chips into the blanking mechanism 430. The blanking mechanism 430 is used to store chips. Therefore, in the present chip sorting apparatus 10, after the unprocessed wafers 20 are stored and sorted by the loading device 200, the wafers 20 are transferred from the storage bin 210 to the working table 410 by the transfer device 300, and after the working table 410 finishes processing the wafers 20, the chip sorting device 400 picks up the chips in the wafers 20 and moves the chips to the unloading mechanism 430 for sorting and storage. The process has high automation degree, can greatly save labor cost, improves the speed of chip separation, and is favorable for large-scale industrial production.

It will be appreciated that the positions of the devices in the chip sorting apparatus 10 may be adjusted according to actual needs.

Specifically, in the present embodiment, the worktable 410 is located at the center of the top of the frame 100, the loading device 200, the conveying device 300, the sorting device, and the unloading mechanism 430 are distributed near the worktable 410, the movement track of the wafer 20 on the chip sorting device 400 resembles a transverse "S" shape, and the loading device 200 and the unloading mechanism 430 are respectively located at the ends of the "S".

As shown in fig. 4, in one embodiment, a rotating module 411, a first moving module 412 and a second moving module 413 are disposed on the worktable 410. The rotation module 411 is used to drive the wafer 20 to rotate and complete the wafer expanding operation. The rotating module 411 is connected to an upper side of the first moving module 412, and the second moving module 413 is connected to a lower side of the first moving module 412. The first moving module 412 is used to drive the rotating module 411 to move along a first direction (any direction indicated by the arrow S in fig. 4). The second moving module 413320 is used to drive the first module to move in a second direction (either direction indicated by the arrow T in fig. 4).

It should be noted that the first direction and the second direction are arranged at an included angle, that is, the first direction intersects with the second direction. In this embodiment, the first direction is arranged at right angles to the second direction. Therefore, the first moving module 412320 and the second moving module are matched to drive the rotating module 411 to move on the plane, so as to adjust the position of the rotating module 411, and better match the transferring device 300 to receive the transferred wafer 20. In addition, during the process that the wafer 20 is rotated by the rotation module 411 and the wafer expanding operation is completed, the first moving module 412320 and the second moving module 413320 can accurately move the rotation module 411 and the wafer 20 from the receiving position to the sorting position.

The receiving position is a position of the rotating module 411 when the rotating module 411 receives the wafer 20, and the sorting position is a position of the rotating module 411 when the chip sorting apparatus 400 picks up the chip from the wafer 20. It will be appreciated that the receiving station is located near the completion location on the transfer device 300 and the sorting station is located near the chip sorting device 400.

As shown in fig. 5, in one embodiment, sorting mechanism 420 includes a moving assembly 421, a first inductor 422, and a second inductor 423. The first sensor 422 is aligned with the table 410 and is used to guide the moving assembly 421 to pick up the chips from the wafer 20 processed by the rotating module 411. The second sensor 423 is aligned with the blanking mechanism 430 and is used for guiding the moving assembly 421 to place the picked chip on the blanking mechanism 430.

Therefore, the first sensor 422 can guide the moving assembly 421 to precisely pick the desired target chips from the wafer 20, and the second sensor 423 can guide the moving assembly 421 to group the picked different chips into the blanking mechanism 430.

Specifically, in the present embodiment, the first sensor 422 and the second sensor 423 are both visual sensors.

It should be noted that the blanking mechanism 430 is provided with a plurality of classified storage spaces at intervals for storing different chips in a classified manner.

Further, as shown in fig. 5, in one embodiment, the movement assembly 421 includes a swing arm 4211 and a first driver 4212. A suction nozzle 4213 is arranged on the swing arm 4211. The first driver 4212 is used for driving the swing arm 4211 to move, so that at least the suction nozzle 4213 picks up the chips in the wafer 20; alternatively, the wafer 20 on the suction nozzle 4213 is placed on the blanking mechanism 430. When the suction nozzle 4213 can pick up a chip in the wafer 20, the position of the swing arm 4211 is a picking position; the position where the suction nozzle 4213 places the wafer 20 on the loading mechanism 430 is a loading position.

Therefore, under the guidance of the first sensor 422, the first driver 4212 drives the swing arm 4211 to move to the pick-up position, and the suction nozzle 4213 applies an adsorption force to the chips in the wafer 20 to pick up the chips in the wafer 20; under the guidance of the second sensor 423, the first driver 4212 drives the swing arm 4211 to move to the blanking position (in the process, the suction nozzle 4213 keeps the suction force on the chip unchanged), and the suction nozzle 4213 cuts off the suction force on the chip to place the chip on the blanking mechanism 430.

Further, as shown in fig. 5, in one embodiment, a plurality of suction nozzles 4213 are provided at intervals on the swing arm 4211. The plurality of suction nozzles 4213 can pick up chips on corresponding positions from the wafer 20 positioned on the table 410.

Therefore, the swing arm 4211 is provided with the plurality of suction nozzles 4213, so that a plurality of chips in the wafer 20 can be picked up at the same time, and the chip sorting efficiency can be improved.

Specifically, in the present embodiment, the swing arm 4211 is provided in an elongated shape, and the plurality of suction nozzles 4213 are sequentially provided at intervals along the length direction of the swing arm 4211. During the sorting process, the straight line of the length direction of the swing arm 4211 is parallel to the diameter of the wafer 20, so that all chips on the same diameter (or radius) track of the wafer 20 can be picked up by the suction nozzles 4213 at the same time. The swing arm 4211 places the picked chips on the blanking mechanism 430, and moves to a position above the wafer 20 to continuously pick up all the chips on the adjacent diameter (or radius) cabinet. This action is repeated until all of the dies on the wafer 20 are picked up onto the blanking mechanism 430.

Further, the sorting mechanism 420 also includes a vacuum tank 424. Vacuum reservoir 424 is in fluid communication with mouthpiece 4213 and is configured to provide suction to mouthpiece 4213. When the swing arm 4211 is provided with a plurality of suction nozzles 4213, the vacuum tank 424 should be communicated with the working suction nozzles 4213.

As shown in fig. 6, in one embodiment, the blanking mechanism 430 includes a tray 431, a tray moving module 432, and a tray storage module 433. The tray moving module 432 is used for driving the face tray to move, so that the tray 431 is driven to move to the tray storage module 433 after the tray 431 receives the chip transferred by the moving assembly 421. A plurality of chips can be placed on the tray 431, and a plurality of trays 431 can be placed in the tray storage module 433. When the tray 431 is full of chips, a new tray 431 may be replaced.

The present invention also provides a chip sorting method, please refer to fig. 1-6, which includes the following steps:

providing the wafer 20 into the loading device 200;

starting the transmission device 300, and moving the wafer 20 in the loading device 200 to the worktable 410;

starting the workbench 410, and processing the wafer 20 on the workbench 410 to separate the chips in the wafer 20 from each other;

starting the sorting mechanism 420, and driving the moving assembly 421 to pick up the chip from the wafer 20 on the worktable 410 under the guidance of the first sensor 422; under the guidance of the second inductor 423, the moving assembly 421 is driven to move the picked chip to the position of the blanking mechanism 430;

driving the moving assembly 421 to place the chip on the discharging mechanism 430;

the above steps are repeated until the chips in the wafer 20 on the worktable 410 are completely removed, and then a new wafer 20 is replenished onto the worktable 410 through the transfer device 300.

The tray moving module 432 moves the tray 431 to a position below the blanking position to receive the chip on the suction nozzle 4213. After the chips are placed in the tray 431, the tray moving module 432 moves the tray 431 to the tray storage module 433 to store different chips in a classified manner.

It should be noted that when there is insufficient wafer 20 in the loading device 200, the loading device 200 is replenished with the wafer 20. The blanking mechanism 430 can be provided with a plurality of trays 431 for storing chips alternately.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," "mated" and the like are to be construed broadly and can, for example, be fixedly connected, releasably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A chip sorting apparatus, comprising:

the workbench is used for bearing and processing the wafer;

the blanking mechanism is used for storing the chip; and

the sorting mechanism comprises a moving assembly, a first sensor and a second sensor, wherein the first sensor is arranged in an alignment mode with the workbench and used for guiding the moving assembly to pick up chips from the processed wafer; the second sensor is arranged in an alignment mode with the blanking mechanism and used for guiding the moving assembly to place the picked chip to the blanking mechanism.

2. The chip sorting device according to claim 1, wherein the moving assembly comprises a swing arm and a first driver, the swing arm is provided with a suction nozzle, and the first driver is used for driving the swing arm to move so as to enable at least the suction nozzle to pick up the chip in the wafer; or, the wafer on the suction nozzle is placed on the blanking mechanism.

3. The chip sorting apparatus according to claim 2, wherein a plurality of the suction nozzles are provided at intervals on the swing arm, and the plurality of the suction nozzles are used for picking up chips at corresponding positions from the wafer positioned on the worktable.

4. The chip sorting apparatus according to claim 3, wherein the sorting mechanism further comprises a vacuum tank in communication with the suction nozzle air passage.

5. The apparatus for sorting chips as claimed in claim 1, wherein the worktable has a rotation module, a first moving module and a second moving module, the rotation module is configured to rotate the wafer and perform the wafer expanding operation, the first module is configured to drive the rotation module to move along a first direction, the second module is configured to drive the first module to move along a second direction, and the first direction intersects with the second direction.

6. A chip sorting apparatus, wherein the chip sorting apparatus comprises a frame, and a loading device and a transmission device which are arranged on the frame, wherein the loading device is used for storing wafers, and the transmission device is used for transmitting the wafers in the loading device to the workbench, and the chip sorting apparatus of any one of the claims 1 to 5 is also used.

7. The apparatus for sorting chips according to claim 6, wherein the loading device comprises a storage bin for stacking a plurality of the chips, a scanner disposed at an opening of the storage bin for scanning information of the chips, and a second driver connected to a side of the storage bin for driving the chips to move in the storage bin.

8. The apparatus for sorting chips according to claim 7, wherein the loading device further comprises a guide rod connected to an opening of the storage bin and used for guiding the wafers from the storage bin into the conveying device.

9. The apparatus for sorting chips as claimed in claim 6, wherein the transporting device comprises a holding member and a moving module, the holding member is connected to the moving module and can move along the length direction of the moving module, and the holding member is used for holding the wafers from the storage bin and moving the wafers to the worktable.

10. A chip sorting method applied to the chip sorting apparatus according to any one of claims 5 to 9, comprising the steps of:

providing a wafer into a feeding device;

starting a transmission device, and moving the wafer in the feeding device to a workbench;

starting a workbench, and processing the wafer on the workbench to separate chips in the wafer from each other;

starting a sorting mechanism, and driving a moving assembly to pick up a chip from a wafer on the workbench under the guidance of a first sensor;

under the guidance of a second sensor, driving a moving assembly to move the picked chip to the position of a blanking mechanism;

and driving the moving assembly to place the chip on the blanking mechanism.

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