TWI655045B - Disconnecting device for patterned substrate - Google Patents
Disconnecting device for patterned substrate Download PDFInfo
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- TWI655045B TWI655045B TW104122532A TW104122532A TWI655045B TW I655045 B TWI655045 B TW I655045B TW 104122532 A TW104122532 A TW 104122532A TW 104122532 A TW104122532 A TW 104122532A TW I655045 B TWI655045 B TW I655045B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
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Abstract
提供不發生未分離和基板損傷的圖案化基板的斷開方法及斷開裝置。在脆性材料基板表面或內部形成有電子電路圖案的圖案化基板的斷開方法及裝置包括：雷射加工步驟(雷射加工裝置(A))，將圖案化基板(W)黏貼於伸展膠帶(2)，對圖案化基板(W)表面照射雷射，形成沿預定斷開線(L)的複數個斷開起點(5)；第一伸展步驟(第一伸展機構)，對圖案化基板(W)施加拉張應力，使斷開起點(5)的裂紋擴展；未分離部位斷開步驟(未分離部位斷開機構)，用光學檢查部件(16)檢查裂紋擴展的斷開起點(5)，用斷開刀片(12)使有不完全斷開起點的預定斷開線(L)斷開；第二伸展步驟(第二伸展機構)，根據需要，將所有預定斷開線(L)完全斷開。 Provided are a method and a device for cutting a patterned substrate without causing non-separation and substrate damage. A method and device for disconnecting a patterned substrate having an electronic circuit pattern formed on or inside a brittle material substrate includes a laser processing step (laser processing device (A)), and attaching the patterned substrate (W) to a stretch tape ( 2) irradiating the surface of the patterned substrate (W) with a laser to form a plurality of disconnection starting points (5) along a predetermined disconnection line (L); a first stretching step (first stretching mechanism), W) Applying tensile stress to cause the crack at the starting point (5) to propagate; in the unseparated part breaking step (unseparated part breaking mechanism), use an optical inspection component (16) to check the starting point (5) of crack propagation. , Using a disconnecting blade (12) to disconnect the predetermined disconnection line (L) with an incomplete disconnection starting point; the second stretching step (second stretching mechanism), as required, all the predetermined disconnection lines (L) are completely disconnect.
Description
本發明有關將在玻璃、陶瓷或矽等脆性材料基板的表面或內部形成有精細的電子電路圖案的圖案化基板斷開為一個個器件的斷開方法及斷開裝置。 The invention relates to a method and a device for disconnecting a patterned substrate having fine electronic circuit patterns formed on the surface or inside of a brittle material substrate such as glass, ceramics, or silicon into individual devices.
先前技術中，例如，專利文獻1等中披露了一種下述的斷開方法，其中，通過對基板的表面照射雷射並使其焦點合於基板內部，從而沿著預定斷開線在基板內部形成因多光子吸收而形成的改性區域(裂紋區域、熔融處理區域、折射率變化區域)，然後，對基板施加拉張應力，以改性區域為起點而使基板斷開，該方法即所謂的“伸展(expand)方式”的斷開方法。 In the prior art, for example, Patent Literature 1 and the like disclose a disconnection method in which a surface of a substrate is irradiated with laser light and its focus is focused on the inside of the substrate, so that it is inside the substrate along a predetermined disconnection line. The modified region (crack region, melt-processed region, and refractive index change region) formed by multiphoton absorption is formed, and then a tensile stress is applied to the substrate, and the substrate is disconnected with the modified region as a starting point. This method is called The "expand mode" disconnection method.
參照圖1、圖2及圖9、圖10，對該“伸展方式”的斷開方法進行說明。 The disconnection method of this "stretching method" is demonstrated with reference to FIG.1, FIG.2, FIG.9, and FIG.10.
如圖1、圖2所示，將需斷開的圖案化基板W黏貼在張設於切割環1的可伸縮的伸展膠帶(一般也稱為切割膠帶)2上，使焦點P合於基板內部來對圖案化基板W照射雷射，從而沿著預定斷開線L，在基板內部形成因多光子吸收而形成的改性區域的斷開起點5。 As shown in FIGS. 1 and 2, the patterned substrate W to be disconnected is adhered to a stretchable stretch tape (commonly also referred to as a dicing tape) 2 stretched on the cutting ring 1 so that the focus P is inside the substrate. Then, the patterned substrate W is irradiated with laser light, and along the predetermined disconnection line L, a disconnection starting point 5 of a modified region formed by multiphoton absorption is formed inside the substrate.
接下來，如圖9、圖10所示，在使圖案化基板W位於上側的狀態下，將伸展膠帶2置於升降台11’上，使升 降台11’上升(或下降)而使伸展膠帶2的黏貼有圖案化基板W的區域的外側周邊部向上(或向下)撓曲來使伸展膠帶2拉伸(伸展)，從而使得黏貼於伸展膠帶2的圖案化基板W上產生拉張應力，從斷開起點5將圖案化基板W斷開。 Next, as shown in FIG. 9 and FIG. 10, with the patterned substrate W positioned on the upper side, the stretch tape 2 is placed on the lifting table 11 ′, The descending platform 11 'rises (or descends) to bend (or down) the outer peripheral portion of the area where the patterned substrate W is adhered to the stretch tape 2 to stretch (stretch) the stretch tape 2 so as to adhere to A tensile stress is generated on the patterned substrate W of the stretch tape 2, and the patterned substrate W is disconnected from the disconnection starting point 5.
斷開起點的形成也可以通過利用熱應力分布的初始裂紋擴展方法形成。如圖3所示，這種方法是對黏貼於伸展膠帶2的圖案化基板W的表面形成初始裂紋(trigger crack)，從初始裂紋開始邊掃描雷射邊照射加熱，並隨之從冷卻機構的噴嘴6向加熱區域噴射冷卻劑。通過此時的加熱引起的壓縮應力、以及接下來的速冷引起的拉張應力所致的基板厚度方向的熱應力分布(溫度分布)，從而使初始裂紋(crack)沿著預定斷開線在圖案化基板W的表面擴展。可以將該擴展的裂紋作為斷開起點5。 The formation of the fracture origin can also be formed by an initial crack propagation method using a thermal stress distribution. As shown in FIG. 3, in this method, an initial crack is formed on the surface of the patterned substrate W adhered to the stretch tape 2. The initial crack is scanned while the laser is irradiated and heated from the initial crack. The nozzle 6 sprays a coolant toward the heating area. Based on the compressive stress caused by the heating at this time, and the thermal stress distribution (temperature distribution) in the thickness direction of the substrate caused by the subsequent tensile stress caused by the rapid cooling, the initial cracks are caused along the predetermined break line. The surface of the patterned substrate W is expanded. This expanded crack can be used as the starting point of disconnection 5.
斷開起點的形成也可以通過利用雷射(例如，紫外線(UV)雷射)照射而在基板表面形成消融(形成槽)、改性區域、在基板內部形成改性區域來進行，還可以通過藉助雷射(例如，紅外線(IR)雷射)的加熱和冷卻所引起的熱應力裂紋擴展來進行。 Formation of the cut-off point can also be performed by forming an ablation (forming a groove) on the substrate surface, forming a modified region, and forming a modified region inside the substrate by using laser (for example, ultraviolet (UV) laser) irradiation. This is done by means of thermal stress crack propagation caused by heating and cooling of a laser (for example, infrared (IR) laser).
需要說明的是，在本發明中，如上所述，包含因利用雷射所形成的多光子吸收而在基板表面或內部形成的改性區域、通過消融形成的槽、以及根據熱應力分布形成的裂紋在內，將它們統稱為“斷開起點”。 It should be noted that, in the present invention, as described above, a modified region formed on the surface or inside of a substrate by multiphoton absorption formed by laser, a groove formed by ablation, and a thermal stress distribution formed are included. Including cracks, they are collectively referred to as "start of disconnection."
[專利文獻] [Patent Literature]
專利文獻1：日本特開2003-334812號公報。 Patent Document 1: Japanese Patent Application Laid-Open No. 2003-334812.
上述“伸展方式”的斷開方法中，通過使伸展膠帶拉伸而將沿著預定斷開線形成的斷開起點斷開，因此，能夠以較小的力同時將複數條預定斷開線斷開。 In the above-mentioned "stretching method", the starting point of the disconnection formed along the predetermined disconnection line is broken by stretching the stretch tape, so that a plurality of predetermined disconnection lines can be disconnected simultaneously with a small force. open.
然而，採用這種斷開方法的話，如圖5的(a)的俯視圖和圖5的(b)的剖面圖所示，當在預定斷開線L亦即照射雷射的道(street)上存在TEG等圖案13時，其有時會阻礙雷射的透過而不能形成充分的斷開起點。因此，在下一伸展斷開步驟中使伸展膠帶2拉伸時，會產生下述問題：亦即，發生未分離、或在預定斷開線L以外產生枝狀裂紋或斷開、或電子電路圖案破損等損傷將會發生等。 However, with this disconnection method, as shown in the top view of FIG. 5 (a) and the cross-sectional view of FIG. 5 (b), when the predetermined disconnection line L, that is, the street where the laser is irradiated, is shown. When the pattern 13 such as TEG is present, it may hinder the transmission of the laser and may not form a sufficient starting point for disconnection. Therefore, when the stretch tape 2 is stretched in the next stretch-opening step, the following problems occur: that is, no separation occurs, or branch-like cracks or breaks occur outside the predetermined break line L, or an electronic circuit pattern occurs. Damage such as breakage will occur.
在此，“TEG”是指，為了評價是否已根據加工工程形成了期望的器件而與主體器件分開製作的半導體元件。TEG中有布線電阻測定、通孔電阻測定、微粒所致的圖案缺損測定、二極體特性測定、短路、洩漏測定等各種元素。 Here, the "TEG" refers to a semiconductor element manufactured separately from a host device in order to evaluate whether a desired device has been formed according to a processing process. TEG includes various elements such as wiring resistance measurement, through-hole resistance measurement, pattern defect measurement due to particles, diode characteristic measurement, short circuit, and leakage measurement.
本發明的目的在於，提供一種可解決上述先前技術問題，且不會發生未分離和基板損傷的新的斷開方法及斷開裝置。 An object of the present invention is to provide a new disconnecting method and a disconnecting device that can solve the above-mentioned problems in the prior art without causing non-separation and substrate damage.
為了達到上述目的，本發明中採取了下述的技術方案。即，本發明的斷開方法是圖案化基板的斷開方法，其中，所述圖案化基板在玻璃、陶瓷、或矽等脆性材料基板 的表面或內部形成有電子電路圖案，所述斷開方法包括：雷射加工步驟，將需斷開的圖案化基板黏貼於具有伸縮性的伸展膠帶，通過對所述圖案化基板的表面照射雷射，從而形成沿著預定斷開線的複數個斷開起點；第一伸展步驟，通過拉伸所述伸展膠帶而對所述圖案化基板施加拉張應力，以使所述斷開起點的裂紋沿基板厚度方向擴展；未分離部位斷開步驟，用光學檢查部件對經歷了所述第一伸展步驟的斷開起點進行檢查，對於檢出的具有不完全斷開起點的預定斷開線，通過施加外壓使所述圖案化基板撓曲來進行斷開。根據需要，還包括第二伸展步驟，使所述伸展膠帶拉伸而將所有的預定斷開線完全斷開。 In order to achieve the above object, the following technical solutions are adopted in the present invention. That is, the disconnection method of the present invention is a disconnection method of a patterned substrate, wherein the patterned substrate is a substrate made of a brittle material such as glass, ceramic, or silicon. An electronic circuit pattern is formed on or on the surface of the substrate, and the disconnection method includes a laser processing step of attaching the patterned substrate to be disconnected to a stretchable stretch tape, and irradiating the surface of the patterned substrate with a laser. Shot to form a plurality of starting points for breaking along a predetermined breaking line; a first stretching step, applying tensile stress to the patterned substrate by stretching the stretching tape, so that the cracks at the starting points of cracking Extending in the thickness direction of the substrate; in the unseparated portion disconnection step, the disconnection starting point that has undergone the first stretching step is inspected with an optical inspection component, and a predetermined disconnection line having an incomplete disconnection starting point is passed through The patterned substrate is flexed to be disconnected by applying an external pressure. As needed, a second stretching step is also included to stretch the stretching tape to completely break all the predetermined breaking lines.
在本說明書中，對未分離部位施加外壓而“使圖案化基板撓曲”也包括例如用斷開棒以敲擊方式壓未分離部位而“使圖案化基板彎曲”，以下也同樣。 In this specification, “flexing the patterned substrate” by applying an external pressure to the unseparated portion includes, for example, “bending the patterned substrate” by pressing the unseparated portion with a breaking bar in a knocking manner, and the same applies hereinafter.
而且，本發明是一種圖案化基板的斷開裝置，其中，所述圖案化基板在脆性材料基板的表面或內部形成有電子電路圖案，所述斷開裝置的特徵也在於下述構成：亦即，包括：雷射加工裝置，具有對黏貼於伸展膠帶的所述圖案化基板的表面照射雷射而形成沿著預定斷開線的複數個斷開起點的雷射照射部；第一伸展機構，通過拉伸所述伸展膠帶而對所述圖案化基板施加拉張應力，以使所述斷開起點的裂紋沿基板厚度方向擴展；光學檢查部件，對通過所述第一伸展機構處理後的斷開起點進行檢查；未分離部位斷開機構，具有斷開刀片，對於由所述光學檢查部件檢出 的存在不完全斷開起點的預定斷開線，通過用所述斷開刀片施加外壓而使所述圖案化基板撓曲來進行斷開；以及第二伸展機構，根據需要，使所述伸展膠帶拉伸，從而將所有的預定斷開線完全斷開。 Moreover, the present invention is a disconnecting device for a patterned substrate, wherein the patterned substrate has an electronic circuit pattern formed on the surface or inside of a brittle material substrate, and the disconnecting device is also characterized by the following structure: And comprising: a laser processing device having a laser irradiation portion for irradiating the surface of the patterned substrate adhered to the stretching tape to form a plurality of disconnection starting points along a predetermined disconnection line; a first stretching mechanism, Applying tensile stress to the patterned substrate by stretching the stretching tape, so that the cracks at the starting point of disconnection propagate in the thickness direction of the substrate; an optical inspection component, Open the starting point for inspection; the unseparated part disconnecting mechanism has a disconnecting blade, and is detected by the optical inspection component There is a predetermined disconnection line that does not completely disconnect the starting point, and disconnection is performed by flexing the patterned substrate by applying external pressure with the disconnection blade; and a second stretching mechanism, which stretches the stretching as required. The tape is stretched to completely break all the predetermined disconnection lines.
所述斷開起點可以通過使雷射的焦點合於所述圖案化基板的內部來進行照射、從而在基板內部產生因多光子吸收所致的改性區域而形成。 The disconnection starting point may be formed by aligning the focal point of the laser with the inside of the patterned substrate and irradiating it, thereby generating a modified region due to multiphoton absorption inside the substrate.
而且，所述斷開起點也可以通過對所述圖案化基板表面邊掃描雷射，邊照射加熱，並隨之從冷卻機構的噴嘴對加熱區域噴射冷卻劑，從而通過因前面的加熱而產生的壓縮應力、和因後面的速冷而產生的拉張應力所致的基板厚度方向的應力分布，使所述圖案化基板的表面產生裂紋而形成。 In addition, the starting point of the disconnection can also be achieved by scanning the surface of the patterned substrate while irradiating the laser beam with heating, and then spraying the coolant from the nozzle of the cooling mechanism to the heating area, thereby generating the heat generated by the previous heating. The stress distribution in the thickness direction of the substrate due to the compressive stress and the tensile stress caused by the subsequent rapid cooling causes cracks to form on the surface of the patterned substrate.
也就是說，斷開起點既可以通過利用雷射(例如，紫外線(UV)雷射)照射而在基板表面形成消融(形成槽)、改性區域、在基板內部形成改性區域來形成，還可以通過藉助雷射(例如，紅外線(IR)雷射)的加熱和冷卻所引起的熱應力裂紋擴展來形成。 That is, the starting point of the disconnection can be formed by forming an ablation (forming a groove) on the surface of the substrate, forming a modified region, forming a modified region inside the substrate using laser (eg, ultraviolet (UV) laser) irradiation, or It can be formed by thermal stress crack propagation caused by heating and cooling by means of a laser (for example, infrared (IR) laser).
在所述未分離部位斷開步驟中，既可以在使用所述光學檢查部件依次檢查所述斷開起點的同時，每次檢出不完全斷開起點便進行斷開，也可以在先使用所述光學檢查部件檢查了所有的所述斷開起點之後再將檢出的不完全斷開起點斷開。 In the step of disconnecting the unseparated portion, while the starting point of disconnection is sequentially checked using the optical inspection member, the disconnection may be performed every time the incomplete disconnection starting point is detected, or the starting point may be used first. The optical inspection component inspects all the disconnection start points before disconnecting the detected incomplete disconnection start points.
本發明之斷開裝置係一種圖案化基板的斷開裝置，其中，前述圖案化基板在脆性材料基板的表面或內部形成有電子電路圖案，前述圖案化基板的斷開裝置係由以下所構成：雷射加工裝置部分，具有對黏貼於由切割環支撐的伸展膠帶的前述圖案化基板的表面照射雷射而形成沿著預定斷開線的複數個斷開起點的雷射照射部；斷開裝置部分，係包括：第一伸展機構，通過拉伸前述伸展膠帶而對前述圖案化基板施加拉張應力，以使前述斷開起點的裂紋沿基板厚度方向擴展；光學檢查部件，對通過前述第一伸展機構處理後的前述斷開起點進行檢查；以及未分離部位斷開機構，係具有斷開刀片，對於由前述光學檢查部件檢出的存在不完全斷開起點的預定斷開線，通過用前述斷開刀片施加外壓而使前述圖案化基板撓曲來進行斷開；前述斷開裝置部分係具有用於放置固定前述切割環的台座，前述台座的中間部分形成為中空部，在前述中空部配置有可升降的升降台，前述升降台兼用作以夾著前述斷開起點的方式承接前述斷開起點的兩側部分的左右一對的定刀片，在前述左右一對的定刀片的上方以可升降的方式配置有斷開刀片；前述光學檢查部件係由以下所構成：光源，從上方向前述左右一對的定刀片之間照射光；以及相機，配置在前述左右一對的定刀片之間，用於觀察來自前述光源的光；前述光學檢查部件係形成為可以與前述左右一對的定刀片及前述斷開刀片同步地移動。 The disconnecting device of the present invention is a disconnecting device for a patterned substrate, wherein the patterned substrate has an electronic circuit pattern formed on the surface or inside of a brittle material substrate, and the disconnecting device for the patterned substrate is composed of the following: The laser processing device includes a laser irradiation unit for irradiating the surface of the patterned substrate adhered to the stretched tape supported by the cutting ring to form a plurality of disconnection starting points along a predetermined disconnection line; the disconnection device; The part includes: a first stretching mechanism that applies a tensile stress to the patterned substrate by stretching the stretching tape, so that a crack at the starting point of the disconnection propagates in the thickness direction of the substrate; an optical inspection component, The above-mentioned disconnection starting point processed by the stretching mechanism is inspected; and the unseparated portion disconnecting mechanism is provided with a disconnecting blade, and the predetermined disconnection line for the existence of the incomplete disconnection starting point detected by the aforementioned optical inspection component is determined by using the foregoing The disconnecting blade applies external pressure to bend the patterned substrate to disconnect; the disconnecting device part is A pedestal for fixing the cutting ring, a middle portion of the pedestal is formed as a hollow portion, and a lifting table capable of being raised and lowered is arranged in the hollow portion, and the lifting table also serves as a two for receiving the starting point of the disconnection by sandwiching the starting point of the disconnection. The left and right pair of fixed blades in the side portion are provided with a disconnecting blade that can be raised and lowered above the left and right pair of fixed blades. The optical inspection component is composed of a light source, the left and right pair from above. Light is irradiated between the fixed blades; and a camera is disposed between the left and right pair of fixed blades for observing light from the light source; the optical inspection member is formed to be compatible with the left and right pair of fixed blades and the foregoing Disconnect blades move synchronously.
根據本發明，利用光學檢查部件對需在前面的雷射加工步驟中形成的斷開起點形成得不完全而可能發生未分離的部分進行檢測，並用斷開刀片對該檢出的部位施加外壓而使圖案化基板撓曲(彎曲)，從而將該檢出部位先行斷開。由此，可以防止在接下來的第二伸展步驟中對圖案化基板施加拉張應力而使預定斷開線斷開時產生未分離部位，並能抑制在預定斷開線以外產生枝狀裂紋或斷開、或電子電路圖案破損等損傷的發生，可以得到端面強度優異的高精度的單位器件。 According to the present invention, an optical inspection member is used to detect a portion where the starting point of the disconnection to be formed in the previous laser processing step is incomplete and unseparable may occur, and an external pressure is applied to the detected portion with a disconnecting blade. Then, the patterned substrate is flexed (bent), so that the detection portion is disconnected in advance. Thereby, it is possible to prevent an unseparated portion from being generated when the predetermined disconnection line is disconnected by applying a tensile stress to the patterned substrate in the next second stretching step, and it is possible to suppress the occurrence of branch cracks or The occurrence of damage such as disconnection or damage to the electronic circuit pattern can provide a high-precision unit device with excellent end face strength.
而且，由於在光學檢查部件的檢查步驟之前先在第一伸展步驟中對圖案化基板施加拉張應力而使完全的斷開起點稍微分離，同時使因TEG等圖案而形成得不完全的斷開起點保持未分離地殘存，因此，具有斷開起點分離的部位與未分離部位的光的透過率表現出顯著差異而可以容易地辨別相機圖像的明暗，並能準確地進行未分離部位的檢測等效果。 Furthermore, since the tensile starting stress is applied to the patterned substrate in the first stretching step before the inspection step of the optical inspection member, the complete disconnection starting point is slightly separated, and at the same time, the incomplete disconnection is formed due to a pattern such as TEG. The starting point remains unseparated. Therefore, the light transmittance of the part separated from the starting point and the unseparated part shows a significant difference in light transmittance, and the camera image can be easily discerned, and the unseparated part can be accurately detected. And other effects.
在所述未分離部位斷開步驟中，較佳通過將前端尖的板狀的斷開刀片壓抵於未分離部位的預定斷開線而使所述圖案化基板撓曲(彎曲)，從而從所述預定斷開線斷開。由此，可以將圖案化基板的未分離部位可靠地斷開。 In the step of disconnecting the unseparated portion, it is preferable that the patterned substrate is flexed (bent) by pressing a plate-shaped disconnecting blade having a pointed tip against a predetermined disconnection line of the unseparated portion, thereby removing The predetermined disconnection line is disconnected. Thereby, unseparated parts of the patterned substrate can be reliably disconnected.
A‧‧‧雷射加工裝置 A‧‧‧laser processing device
B‧‧‧斷開裝置 B‧‧‧ Disconnect device
L‧‧‧預定斷開線 L‧‧‧ scheduled disconnect
W‧‧‧圖案化基板 W‧‧‧ patterned substrate
P‧‧‧焦點 P‧‧‧ Focus
1‧‧‧切割環 1‧‧‧ cutting ring
2‧‧‧伸展膠帶 2‧‧‧ Stretch Tape
3‧‧‧工作台 3‧‧‧Workbench
4‧‧‧雷射照射部 4‧‧‧laser irradiation section
5‧‧‧斷開起點 5‧‧‧ Disconnect starting point
6‧‧‧噴嘴 6‧‧‧ Nozzle
7‧‧‧台座 7‧‧‧ pedestal
9‧‧‧中空部 9‧‧‧ hollow section
10‧‧‧升降機構 10‧‧‧ Lifting mechanism
11、11’‧‧‧升降台 11, 11’‧‧‧ lifting platform
11a、11b‧‧‧定刀片 11a, 11b ‧‧‧ fixed blade
12‧‧‧斷開刀片 12‧‧‧ Disconnect the blade
13‧‧‧TEG等圖案 13‧‧‧TEG and other patterns
14‧‧‧光源 14‧‧‧light source
15‧‧‧相機 15‧‧‧ Camera
16‧‧‧光學檢查部件 16‧‧‧ Optical Inspection Parts
圖1是示出將作為斷開對象的圖案化基板黏貼於了切割環的伸展膠帶的狀態的立體圖。 FIG. 1 is a perspective view showing a state where a patterned substrate as a disconnection target is stuck to a stretch tape with a dicing ring.
圖2是示出斷開起點的加工例的說明圖。 FIG. 2 is an explanatory diagram showing a processing example of a break starting point.
圖3是示出斷開起點的另一加工例的說明圖。 FIG. 3 is an explanatory diagram showing another processing example of the starting point of disconnection.
圖4是簡要示出斷開裝置的剖面圖。 FIG. 4 is a cross-sectional view schematically showing a disconnecting device.
圖5中的(a)和(b)是示出在圖案化基板的預定斷開線上具有TEG圖案的狀態的俯視圖和剖面圖。 (A) and (b) in FIG. 5 are a top view and a cross-sectional view showing a state where a TEG pattern is provided on a predetermined disconnection line of the patterned substrate.
圖6是示出第一伸展步驟的剖面圖。 Fig. 6 is a sectional view showing a first stretching step.
圖7是示出第二伸展步驟的剖面圖。 Fig. 7 is a sectional view showing a second stretching step.
圖8是示出本發明的斷開方法的流程圖。 FIG. 8 is a flowchart showing a disconnection method of the present invention.
圖9是說明以往的伸展方式下的斷開方法的剖面圖。 FIG. 9 is a cross-sectional view illustrating a disconnection method in a conventional stretching method.
圖10是示出使圖9的升降台上升後的伸展膠帶的拉伸狀態的剖面圖。 FIG. 10 is a cross-sectional view showing a stretched state of the stretch tape after raising the lifting platform of FIG. 9.
以下，根據附圖，對本發明有關的斷開方法和斷開裝置的詳情進行詳細的說明。 Hereinafter, details of the disconnection method and the disconnection device according to the present invention will be described in detail with reference to the drawings.
本發明的斷開方法和斷開裝置以在玻璃、陶瓷、或矽等脆性材料基板的表面或內部形成有電子電路、TEG等圖案的圖案化基板W為斷開對象。 In the disconnection method and the disconnection device of the present invention, a patterned substrate W in which a pattern such as an electronic circuit or a TEG is formed on or in the surface or inside of a brittle material substrate such as glass, ceramics, or silicon is used as the disconnection object.
如圖1、圖2所示，圖案化基板W被黏貼於由切割環1支撑的具有伸縮性的伸展膠帶2，並被放置在雷射加工裝置A的工作台3上。然後，從雷射照射部4，使焦點P合於基板內部地對圖案化基板W的表面照射雷射，沿著X方向(或Y方向)的預定斷開線L在基板內部形成因多光子吸收而形成的改性區域(變脆弱的熔融處理區域等)，亦即斷開起點5。沿所有X方向的預定斷開線形成斷開起點5之後，使工作台3旋轉等，從而沿著Y方向的預定斷開線 L形成斷開起點5(雷射加工步驟)。 As shown in FIGS. 1 and 2, the patterned substrate W is adhered to a stretchable stretch tape 2 supported by the cutting ring 1, and is placed on the table 3 of the laser processing apparatus A. Then, from the laser irradiating part 4, the focus P is applied to the inside of the substrate, and the surface of the patterned substrate W is irradiated with laser, and a multiphoton is formed inside the substrate along a predetermined break line L in the X direction (or Y direction). The modified region (such as a weakened melt-processed region) formed by absorption, that is, the starting point 5 is disconnected. After the break starting point 5 is formed along all the predetermined break lines in the X direction, the table 3 is rotated, etc., so that the predetermined break lines in the Y direction are formed. L forms the starting point 5 (laser processing step).
如前所述，通過利用熱應力分布的方法也可以加工形成斷開起點5。 As described above, the method of using the thermal stress distribution can also be used to form the break starting point 5.
亦即，如圖3所示，從雷射照射部4對黏貼於伸展膠帶2的圖案化基板W的表面邊掃描雷射，邊照射加熱，並隨之從冷卻機構的噴嘴6對加熱區域噴射冷卻劑。通過此時的加熱引起的壓縮應力、以及接下來的速冷引起的拉張應力所致的基板厚度方向的熱應力分布(溫度分布)，從而能夠使初始裂紋(crack)沿著預定斷開線L在圖案化基板W的表面擴展，也就是說，可以形成作為斷開起點5的連續擴展的裂紋。 That is, as shown in FIG. 3, the surface of the patterned substrate W adhered to the stretching tape 2 is scanned from the surface of the laser irradiation section 4 while the laser is scanned and irradiated to heat, and the heating area is sprayed from the nozzle 6 of the cooling mechanism. Coolant. Thermal stress distribution (temperature distribution) in the thickness direction of the substrate due to compressive stress due to heating at this time and subsequent tensile stress due to rapid cooling can cause the initial crack to follow a predetermined breaking line L spreads on the surface of the patterned substrate W, that is, a crack that continuously expands as a break-off point 5 can be formed.
在上述的雷射加工步驟中，如圖5所示，當在圖案化基板W的預定斷開線L亦即照射雷射的道(street)上存在例如TEG等圖案13時，其會在照射雷射時阻礙雷射的透過而無法形成充分的斷開起點，往往會形成得不完全而留有殘餘。因此，在接下來的第一伸展步驟及未分離部位檢查步驟中檢測不完全的斷開起點，並在未分離部位斷開步驟中用斷開刀片將該部位斷開。 In the above-mentioned laser processing steps, as shown in FIG. 5, when a pattern 13 such as TEG is present on a predetermined breaking line L of the patterned substrate W, that is, a street irradiating the laser, it will be irradiated. In the case of lasers, the transmission of lasers is blocked and a sufficient starting point cannot be formed, which is often incomplete and leaves a residue. Therefore, the incomplete disconnection starting point is detected in the next first stretching step and the unseparated portion inspection step, and the unseparated portion disconnection step is used to disconnect the portion in the unseparated portion disconnection step.
圖4簡要示出了斷開裝置B，該斷開裝置B包括：用於進行第一伸展步驟的第一伸展機構、用於進行未分離部位的檢查的光學檢查部件、以及用於使未分離部位斷開的未分離部位斷開機構。該斷開裝置B也兼用作用於進行後述的第二伸展步驟的第二伸展機構。 FIG. 4 schematically illustrates a disconnecting device B including a first stretching mechanism for performing a first stretching step, an optical inspection member for inspecting an unseparated portion, and an Unseparated part disconnection mechanism for part disconnection. This breaking device B also functions as a second stretching mechanism for performing a second stretching step described later.
斷開裝置B具有用於放置固定具有圖案化基板W的切 割環1的台座7。台座7的中間部分形成為中空，在該中空部9配置有具有平的上表面的升降台11，升降台11可藉助氣缸等升降機構10而升降。升降台11兼用作左右一對的定刀片11a、11b，該左右一對的定刀片11a、11b以夾著圖案化基板W的需斷開的預定斷開線L亦即夾著斷開起點5的方式承接其兩側部分。 The disconnecting device B has a slit for placing and fixing the patterned substrate W. 切 座 1 的 座 7。 7 cutting ring 1. The intermediate portion of the pedestal 7 is hollow, and a lifting platform 11 having a flat upper surface is arranged in the hollow portion 9. The lifting platform 11 can be raised and lowered by a lifting mechanism 10 such as an air cylinder. The lifting table 11 also serves as a pair of left and right fixed blades 11 a and 11 b. The left and right fixed blades 11 a and 11 b sandwich the patterned substrate W to be disconnected by a predetermined disconnection line L, that is, the disconnection starting point 5. Way to undertake its two sides.
而且，在左右的定刀片11a、11b的上方以可升降的方式配置有前端尖的板狀的斷開刀片12。 Furthermore, a plate-shaped cutting blade 12 having a tip end is arranged above the left and right fixed blades 11a and 11b so as to be able to be raised and lowered.
進而，設置有光學檢查部件16，光學檢查部件16包括：從上方向定刀片11a、11b之間照射光的光源14、和配置在定刀片11a、11b之間的用於觀察來自光源14的光的相機(例如IR相機)15。 Furthermore, an optical inspection member 16 is provided. The optical inspection member 16 includes a light source 14 for irradiating light between the fixed blades 11a and 11b from above and a light source 14 arranged between the fixed blades 11a and 11b for observing light from the light source 14. Camera (eg IR camera) 15.
光學檢查部件16形成為：可以與定刀片11a、11b及斷開刀片12同步地在中空部9內沿圖4的左右方向(箭頭方向)移動而改變其位置。 The optical inspection member 16 is formed so that it can move in the hollow portion 9 in the left-right direction (arrow direction) in FIG. 4 to synchronize with the fixed blades 11 a and 11 b and the disconnection blade 12 to change its position.
在圖案化基板W位於上側的狀態下將其放置於該斷開裝置B的升降台11，將切割環1固定在台座7上。然後，如圖6所示，使升降台11少許上升而使伸展膠帶2拉伸(第一伸展步驟)。 The patterned substrate W is placed on the lifting table 11 of the disconnection device B with the patterned substrate W on the upper side, and the cutting ring 1 is fixed on the stand 7. Then, as shown in FIG. 6, the elevating table 11 is raised slightly to stretch the stretch tape 2 (first stretching step).
該第一伸展步驟中的升降台11的上升量被設定為使圖案化基板W因伸展膠帶2的拉伸而被向外牽拉、且預定斷開線L的斷開起點5的裂紋向厚度方向滲透(擴展)而例如稍微分離10μm~1000μm左右。但是，因TEG等圖案而形成得不完全的斷開起點5未分離而保持原樣。 The lifting amount of the lifting table 11 in the first stretching step is set so that the patterned substrate W is pulled outward by the stretching of the stretching tape 2 and the thickness of the crack starting point 5 of the breaking line L is predetermined. It penetrates (expands) in the direction and is slightly separated, for example, from about 10 μm to 1000 μm. However, the disconnection starting point 5 formed incompletely by a pattern such as TEG is not separated and remains as it is.
在這種狀態下，為使圖案化基板W的預定斷開線L來到光源14的正下方，將光源14和相機15與升降台11一起左右移動，並從光源14照射光，根據相機15的圖像中映現的明暗來進行斷開起點5是否分離得當的判斷。然後，當判斷為未分離時，使斷開刀片12下降，通過由斷開刀片12和定刀片11a、11b形成的三點彎矩，以敲擊方式壓圖案化基板W而使其彎曲，從而使未分離部位斷開。需要說明的是，伸展膠帶2較佳由透過光的材料形成。 In this state, in order to bring the predetermined disconnection line L of the patterned substrate W directly below the light source 14, the light source 14 and the camera 15 are moved left and right together with the lifting platform 11, and the light is radiated from the light source 14. The lightness and darkness appearing in the image to determine whether the disconnection starting point 5 is properly separated. Then, when it is judged that it is not separated, the breaking blade 12 is lowered, and the patterned substrate W is bent by the knocking method with a three-point bending moment formed by the breaking blade 12 and the fixed blades 11a and 11b, thereby bending. Disconnect the unseparated area. It should be noted that the stretch tape 2 is preferably formed of a material that transmits light.
用光學檢查部件16進行檢查的話，可以根據透過的光的明暗來檢測未分離部位，因此，可以使用廉價簡單的光學系統的檢查器具。 When the inspection is performed by the optical inspection member 16, the unseparated portion can be detected based on the brightness of the transmitted light. Therefore, an inexpensive and simple inspection system of an optical system can be used.
在上述斷開步驟中，既可以在用光學檢查部件16依次對預定斷開線L的斷開起點5進行檢查的同時，每當發現未分離部位，便用斷開刀片12進行斷開；也可以在檢查了所有的預定斷開線L之後再用斷開刀片12將檢出的未分離部位斷開。 In the above-mentioned disconnection step, the optical inspection member 16 can be used to sequentially inspect the disconnection starting point 5 of the predetermined disconnection line L, and whenever an unseparated portion is found, the disconnection blade 12 is used to disconnect; The disconnected blade 12 may be used to disconnect the detected unseparated portion after inspecting all the predetermined disconnection lines L.
後者的情況下，較佳先編程，使指定了檢出的未分離部位的加工處方自動輸入附帶的計算機，在檢查了所有的預定斷開線L之後，根據輸入的加工處方，用斷開刀片12依次使未分離部位斷開。 In the latter case, it is better to program first so that the processing recipe that specifies the detected unseparated part is automatically entered into the attached computer. After checking all the predetermined disconnection lines L, use the disconnection blade according to the input processing recipe. 12 Disconnect the unseparated parts in sequence.
接下來，如圖7所示，將升降台11進一步上升，使所有的預定斷開線L完全斷開(第二伸展步驟)。 Next, as shown in FIG. 7, the lifting platform 11 is further raised so that all the predetermined disconnection lines L are completely disconnected (a second stretching step).
通過第二伸展步驟，伸展膠帶2被進一步拉伸，黏貼於伸展膠帶2的圖案化基板W受到向外的拉張應力，所有 的預定斷開線L均被完全斷開。斷開為單個的單位器件在黏貼於伸展膠帶2的狀態下被取出。 Through the second stretching step, the stretching tape 2 is further stretched, and the patterned substrate W adhered to the stretching tape 2 is subjected to outward tensile stress. The predetermined disconnection lines L are all completely disconnected. The individual unit devices that have been broken down are taken out while being adhered to the stretch tape 2.
在該第二伸展步驟中，較佳預先設定升降台11的升降率，使斷開的各單位器件的間隔(斷開寬度)為0.05mm~2mm左右。 In this second stretching step, it is preferable to set the lifting rate of the lifting platform 11 in advance so that the interval (breaking width) of each unit device that is turned off is about 0.05 mm to 2 mm.
而且，也可以在拉伸伸展膠帶2的狀態下將圖案化基板W(斷開成單個的單位器件)重新黏貼在其它的切割環(伸展膠帶)上。在這種情況下，由於狀態變為斷開成單個的單位器件被黏貼在未拉伸狀態的新的伸展膠帶上，因此，可以容易地從伸展膠帶取出(拾取)被斷開成單個的單位器件。 Further, the patterned substrate W (disconnected into a single unit device) may be re-adhered to another dicing ring (stretch tape) in a state where the stretch tape 2 is stretched. In this case, since the state becomes broken into a single unit, the device is stuck on a new stretch tape in an unstretched state, so it can be easily taken out (picked up) from the stretch tape and broken into a single unit. Device.
如圖8所示，以流程圖簡要示出上述斷開方法的步驟。 As shown in FIG. 8, the steps of the disconnection method are briefly shown in a flowchart.
首先，通過雷射加工裝置A對黏貼於伸展膠帶2的圖案化基板W加工斷開起點5(S1)。 First, the laser processing apparatus A processes the starting point 5 of the patterned substrate W adhered to the stretch tape 2 (S1).
接下來，通過第一伸展步驟，使預定斷開線L的斷開起點5少許分離(S2)。 Next, through the first stretching step, the starting point 5 for disconnection of the predetermined disconnection line L is slightly separated (S2).
接下來，通過光學檢查部件16對預定斷開線L的未分離部位進行檢測(S3)。 Next, an unseparated portion of the predetermined disconnection line L is detected by the optical inspection member 16 (S3).
接下來，通過斷開刀片12使預定斷開線L的未分離部位斷開(S4)。該斷開既可以是在光學檢查部件16進行檢查的同時每次發現未分離部位便進行斷開，也可以是在檢查了所有的預定斷開線L之後將未分離部位斷開。 Next, the unseparated portion of the predetermined disconnection line L is disconnected by the disconnection blade 12 (S4). This disconnection may be performed every time an unseparated portion is found while the optical inspection member 16 performs the inspection, or the unseparated portion may be disconnected after all the predetermined disconnection lines L are inspected.
接下來，通過第二伸展步驟，將圖案化基板W的所有預定斷開線L同時斷開(S5)。 Next, through the second stretching step, all the predetermined disconnection lines L of the patterned substrate W are simultaneously disconnected (S5).
如上所述，根據本斷開方法，利用光學檢查部件16對需在前面的雷射加工步驟中形成在圖案化基板W上的斷開起點5形成得不完全而可能發生未分離的部分進行檢測，並用斷開刀片12對該檢出的部位施加外壓而使圖案化基板W撓曲，從而將該檢出部位先行斷開。由此，可以防止在第二伸展步驟中拉伸伸展膠帶2時產生未分離部位，並能抑制在預定斷開線以外產生枝狀裂紋或斷開、或電子電路圖案破損等損傷的發生，可以得到端面強度優異的高精度的單位器件。 As described above, according to the present disconnection method, the optical inspection member 16 is used to detect a portion where the disconnection starting point 5 to be formed on the patterned substrate W in the preceding laser processing step is not completely formed and may not be separated. Then, the disconnected blade 12 is used to apply external pressure to the detected portion to flex the patterned substrate W, so that the detected portion is disconnected first. Thereby, it is possible to prevent an unseparated portion from being generated when the stretching tape 2 is stretched in the second stretching step, and it is possible to suppress the occurrence of damage such as branch-like cracks or breaks other than the predetermined breaking line, or damage to the electronic circuit pattern. A high-precision unit device with excellent end face strength is obtained.
而且，由於在光學檢查部件16的檢查步驟之前先在第一伸展步驟中對圖案化基板W施加拉張應力而使完全的斷開起點5稍微分離，同時使因TEG等圖案而形成得不完全的斷開起點保持未分離地殘存，因此，斷開起點5分離的部位與未分離部位的光的透過率表現出顯著差異，可以容易地辨別相機圖像的明暗，能夠準確地進行未分離部位的檢測。 Furthermore, since the tensile stress is applied to the patterned substrate W in the first stretching step before the inspection step of the optical inspection member 16, the complete break starting point 5 is slightly separated, and at the same time, the formation due to a pattern such as TEG is incomplete. The disconnection starting point remains unseparated. Therefore, the light transmittance of the separated portion of the disconnection starting point 5 and the unseparated portion show a significant difference in light transmittance. The brightness of the camera image can be easily discerned, and the unseparated portion can be accurately performed. Detection.
以上，對本發明的代表性實施例進行了說明，但本發明並不僅限於上述的實施例結構，可在達到其目的且不脫離申請專利範圍的範圍內適當進行修改、變更。 The representative embodiments of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiment structure, and can be appropriately modified and changed within the scope of achieving its purpose without departing from the scope of patent application.
例如，在上述實施例中，是在相同平台上進行圖案化基板W的未分離部位的檢查和未分離部位的斷開，但也可以在其它平台上進行光學檢查部件的未分離檢查步驟，並在檢出未分離部位之後，通過由斷開刀片和定刀片形成的三點彎曲方式的斷開單元進行斷開。 For example, in the above-mentioned embodiment, the unseparated portion inspection and disconnection of the unseparated portion of the patterned substrate W are performed on the same platform, but the unseparated inspection step of the optical inspection component may also be performed on another platform, and After the unseparated part is detected, it is disconnected by a three-point bending disconnecting unit formed by a disconnecting blade and a fixed blade.
另外，上述實施例中，在斷開步驟中採用的是以升降台11支撑黏貼於伸展膠帶2的圖案化基板W的方式，但也可以採用用普通工作台支撑的方式來加以實施。需要說明的是，在用工作台支撑圖案化基板的情況下，較佳在工作台表面配置彈性體，經由彈性體來進行支撑，為了進行未分離檢查，較佳使用透明的工作台和彈性體。 In addition, in the above-mentioned embodiment, the method of supporting the patterned substrate W adhered to the stretching tape 2 by the lifting platform 11 is adopted in the disconnecting step, but it can also be implemented by supporting by a common table. It should be noted that, when a patterned substrate is supported by a table, it is preferable to arrange an elastic body on the surface of the table and support it through the elastic body. In order to perform non-separation inspection, it is preferable to use a transparent table and elastic body. .
本發明適用於以伸展方式來對在玻璃、陶瓷等脆性材料基板的表面或內部形成有電子電路圖案、薄膜的圖案化基板進行斷開。 The present invention is suitable for disconnecting a patterned substrate in which electronic circuit patterns and films are formed on the surface or inside of a brittle material substrate such as glass or ceramics in a stretched manner.
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| JP2014-200115 | 2014-09-30 | ||
| JP2014200115A JP6428112B2 (en) | 2014-09-30 | 2014-09-30 | Patterning substrate breaker |
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| TWI655045B true TWI655045B (en) | 2019-04-01 |
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| KR (1) | KR20160038713A (en) |
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| JP6888809B2 (en) * | 2017-03-30 | 2021-06-16 | 三星ダイヤモンド工業株式会社 | Brittle material substrate with metal film Dividing method and dividing device |
| JP6888808B2 (en) * | 2017-03-30 | 2021-06-16 | 三星ダイヤモンド工業株式会社 | Brittle material substrate with resin layer Dividing method and dividing device |
| JP7370902B2 (en) | 2020-02-28 | 2023-10-30 | 株式会社ディスコ | Crack detection method |
| WO2023176068A1 (en) * | 2022-03-16 | 2023-09-21 | ナルックス株式会社 | Methods for manufacturing microlens and microlens array |
| CN115592257B (en) * | 2022-12-13 | 2023-04-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Mechanical stripping device for stripping wafer from laser modified crystal |
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| JP2003334675A (en) * | 2002-03-12 | 2003-11-25 | Hamamatsu Photonics Kk | Cutting method for workpiece |
| JP2006173520A (en) * | 2004-12-20 | 2006-06-29 | Canon Inc | Laser fracture method and member to be fractured which can be fractured by the method |
| JP2011165766A (en) * | 2010-02-05 | 2011-08-25 | Disco Abrasive Syst Ltd | Method of processing optical device wafer |
| JP2013149932A (en) * | 2011-12-20 | 2013-08-01 | Nitto Denko Corp | Substrate fragmentation method and substrate fragmentation device using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003334675A (en) * | 2002-03-12 | 2003-11-25 | Hamamatsu Photonics Kk | Cutting method for workpiece |
| JP2006173520A (en) * | 2004-12-20 | 2006-06-29 | Canon Inc | Laser fracture method and member to be fractured which can be fractured by the method |
| JP2011165766A (en) * | 2010-02-05 | 2011-08-25 | Disco Abrasive Syst Ltd | Method of processing optical device wafer |
| JP2013149932A (en) * | 2011-12-20 | 2013-08-01 | Nitto Denko Corp | Substrate fragmentation method and substrate fragmentation device using the same |
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| CN105470198B (en) | 2020-11-24 |
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| CN105470198A (en) | 2016-04-06 |
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