JP2006245263A - Substrate break apparatus and method, and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cut a board accurately while preventing any crack from occurring. <P>SOLUTION: A break bar 31 is moved to a first direction Z1 extending to the board 101 on which a scribed line 105 is formed, and a position of cutting the board 101 is pressed with the break bar 31 to cut the board 101 at the position of cutting. At this time, a cut detection unit 61 detects the cut of the mother board 101 cut by the break bar 31. Thereafter, on the basis of the information of the cut of the board 101 detected by the cut detection unit 61, the moving direction of the break bar 31 is changed over from the first direction Z1 to a second direction Z2 away from the board 101 so as to correspond to the situation at the time the board 101 was cut. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate break device, a substrate break method, and a semiconductor device, and relates to a substrate break device, a substrate break method, and a scribe line that cut a substrate on which a scribe line is formed at a cutting position. The present invention relates to a semiconductor device in which a semiconductor element is formed on a substrate to be cut by the device or the method at the cutting position.

  In a semiconductor device such as a display device in which pixel switching elements for controlling switching of pixels are formed as semiconductor elements, a plurality of display panels are integrally formed on a large-area substrate made of a brittle material such as glass in a manufacturing process. Is done. Then, the substrate is cut and divided into a plurality of display panels.

  In the process of cutting the substrate in this way, a scribe line is formed in advance by scraping one surface of the substrate into a linear shape so as to correspond to the cutting position and providing a groove. Then, by applying stress from the other surface side of the substrate corresponding to the cutting position where the scribe line is formed, the breakage proceeds from the scribe line to divide the substrate into a plurality of display panels. When stress is applied to the other surface of the substrate, a break bar formed so as to extend along the scribe line is used (for example, see Patent Document 1 and Patent Document 2).

Japanese Patent Laid-Open No. 2002-187098 Japanese Patent Laid-Open No. 2002-37638

  FIG. 11 is an enlarged photograph of the substrate 101A cut by applying stress using a break bar. 11A is an enlarged photograph of the surface of the substrate 101A pressed by the break bar, and FIG. 11B is a view perpendicular to the surface of the substrate 101A pressed by the break bar. It is a figure which shows the enlarged photograph of the cut surface of an arbitrary direction.

  As shown in FIG. 11, when a substrate is cut using a break bar, a crack C may be generated on the surface cut by the impact of the break bar, resulting in a non-uniform cut surface and high accuracy. It was difficult to cut.

  For this reason, the display panel cut | disconnected as mentioned above may be damaged from the crack C as a starting point, and there is a problem that the reliability of the apparatus is impaired. And in connection with this, there existed a malfunction which became difficult to implement | achieve high manufacturing efficiency.

  Accordingly, an object of the present invention is to provide a substrate break apparatus and a substrate break method that can be cut with high accuracy and can improve reliability and manufacturing efficiency, and a semiconductor device manufactured thereby. It is in.

  A substrate breaker according to the present invention is a substrate breaker that cuts a substrate on which a scribe line is formed at a cutting position at the cutting position, a substrate support that supports the substrate, and the scribing of the substrate. A break bar that cuts the substrate by pressing the cutting position of the substrate supported by the substrate support, and is supported by the substrate support; A break bar moving unit that moves the break bar in a first direction toward the substrate and a second direction that is separated from the substrate supported by the substrate support, and controls the movement operation of the break bar moving unit. The movement controller and the break bar moving unit controlled by the movement controller move in the first direction and press the cutting position. A cutting detection unit that detects cutting of the substrate cut at the cutting position by a break bar, and the movement control unit moves the break bar in the first direction to the break bar moving unit, and When cutting the substrate, the break bar from the first direction to the second direction corresponding to the time when the substrate is cut based on the information on cutting the substrate detected by the cutting detection unit. The moving operation of the break bar moving unit is controlled so as to switch the moving direction.

  In the substrate breaking method according to the present invention, a scribe line is formed at a cutting position, and a break bar extending along the scribe line of the substrate is brought into contact with and pressed at the cutting position of the substrate supported by the substrate support base. In this way, the substrate breaking method cuts the substrate at the cutting position, and the break bar moving unit moves the break bar in a first direction toward the substrate supported by the substrate support. The movement control unit controls the break bar moving unit to cut the substrate at the cutting position, and the substrate cut at the cutting position by the break bar moving in the first direction. The substrate is cut based on the second step in which the cutting detection unit detects the cutting of the substrate and the information on the cutting of the substrate detected by the cutting detection unit. The movement control unit is configured so that the break bar moving unit switches the movement direction of the break bar from the first direction to a second direction away from the substrate supported by the substrate support, corresponding to the time point when the break bar moves. And a third step of controlling the break bar moving unit.

  In the semiconductor device according to the present invention, a scribe line is formed at a cutting position, and a break bar extending along the scribe line of the substrate is brought into contact with and pressed at the cutting position of the substrate supported by the substrate support. A semiconductor device comprising a substrate cut at the cutting position and having a semiconductor element formed on the cut substrate, wherein the substrate is directed to the substrate supported by the substrate support. When the break bar is moved in the direction and the substrate is cut at the cutting position, the cutting of the substrate to be cut at the cutting position is detected by the cutting detection unit and detected by the cutting detection unit. The second direction away from the substrate supported by the support base from the first direction so as to correspond to the time when the substrate is cut based on the information on cutting the substrate It is cut by being switched to the moving direction of the break bar to.

  According to the present invention, it is possible to provide a substrate break apparatus and a substrate break method that can be cut with high accuracy and can improve reliability and manufacturing efficiency, and a semiconductor device manufactured thereby. .

  An example of an embodiment according to the present invention will be described.

  FIG. 1 is a front view showing a configuration of a substrate breaker 1 in an embodiment according to the present invention. FIG. 2 is a side view showing the main part of the substrate breaking device 1.

  As shown in FIGS. 1 and 2, the substrate breaker 1 of the present embodiment includes a substrate breaker body 11, a substrate support 21, a break bar 31, a substrate fixing bar 32, a break bar moving unit 41, The break bar movement control unit 51 and the cutting detection unit 61 are provided to cut the mother substrate 101.

  First, the mother substrate 101 which is a cutting target in the substrate breaker 1 of the present embodiment will be described.

  FIG. 3 is a diagram illustrating a configuration of the mother substrate 101. 3, FIG. 3 (a) is a plan view, and FIG. 3 (b) is a cross-sectional view of the Y1-Y2 portion of FIG. 3 (a).

  As shown in FIG. 3A, the mother substrate 101 has a plurality of display panels 102 formed thereon. As shown in FIG. 3B, the mother substrate 101 has a color filter substrate 103 and an array substrate 104, and the color filter substrate 103 and the array substrate 104 are arranged so as to face each other with a space therebetween. Has been.

  As shown in FIG. 3B, the color filter substrate 103 is formed so that a color filter layer 103 a that colors light corresponds to a pixel region of the display panel 102. The color filter layer 103a has a black matrix layer (not shown) and colored layers of red, blue, and green (not shown), and each colored layer is formed in a mosaic pattern in a region partitioned by the black matrix layer. Has been. The color filter substrate 103 is formed with a common electrode (not shown) so as to face the pixel electrodes of the array substrate 104. The common electrode is formed so as to correspond to the pixel region of the display panel 102 using, for example, ITO (Indium Tin Oxide). The common electrode is integrally formed so as to cover the color filter layer 103a.

  On the other hand, as shown in FIG. 3B, the array substrate 104 is formed in an array so that the pixel switching elements 104a for controlling the switching of the pixels correspond to the respective pixels in the pixel region of the display panel 102. . The pixel switching element 104a is, for example, a thin film transistor (TFT), and a channel region is formed using, for example, a polycrystalline silicon semiconductor thin film. The array substrate 104 is formed in an array so that pixel electrodes (not shown) correspond to the pixels, and the pixel electrodes face the common electrode of the color filter substrate 103. The pixel electrode is made of, for example, ITO and is connected to the pixel switching element 104a.

  As shown in FIG. 3A, scribe lines 105 are formed in a grid pattern on the mother substrate 101 at cutting positions around each display panel 102 so as to correspond to the display panel 102. Here, as shown in FIG. 3B, as the scribe line 105, on one surface of the color filter substrate 103 opposite to the surface where the color filter substrate 103 and the array substrate 104 face each other, The first scribe line 105a is cut and formed to be a linear groove. Further, as the scribe line 105, the second scribe line 105b is formed as a linear groove on one surface of the array substrate 104 that is opposite to the surface on which the color filter substrate 103 and the array substrate 104 face each other. It is cut and formed to become. The first scribe line 105 a and the second scribe line 105 b are formed to face each other at the cutting position of the mother substrate 101. Then, the mother substrate 101 is cut for each display panel 102 by the substrate breaker 1 at a cutting position where the scribe lines 105 of the first scribe line 105a and the second scribe line 105b are formed. In the cut display panel 102, a liquid crystal layer is injected into the gap between the color filter substrate 103 and the array substrate 104 to form a liquid crystal panel.

  Each part of the substrate breaker 1 will be described sequentially.

  The substrate breaker main body 11 includes an accommodation space 111 for accommodating the mother substrate 101 to be cut. In addition, the substrate breaker main body 11 accommodates the substrate support 21, the break bar 31, and the break bar moving unit 41 in the accommodation space 111.

  The substrate support 21 is provided in the accommodation space 111 of the substrate breaker body 11. The substrate support 21 includes a substrate support plate 211 and an elastic plate 212, and supports the mother substrate 101 that is a cutting target. The substrate support plate 211 has a horizontal placement surface on which the mother substrate 101 is placed via the elastic plate 212, and supports the mother substrate 101 on the placement surface. The elastic plate 212 is a rubber-like elastic sheet made of urethane rubber or the like, and is provided on the mounting surface of the substrate support plate 211. In the elastic plate 212, when the mother substrate 101 is placed on the surface opposite to the substrate support base 211 side and stress is applied to the mother substrate 101 toward the substrate support plate 211 side, the mother substrate 101 is cut. Relaxes the stress.

  The break bar 31 is housed in the housing space 111 of the substrate breaker body 11. As shown in FIG. 1, the break bar 31 is formed so as to extend along the scribe line 105 of the mother substrate 101. That is, the break bar 31 extends linearly in the same manner as the scribe line 105 formed on the mother substrate 101 linearly. For example, the break bar 31 is made of a hard material such as plastic. As shown in FIG. 2, the break bar 31 is formed in a tapered shape so that one end portion on the substrate support base 21 side becomes narrower toward the substrate support base 21 side. The other end of the break bar 31 opposite to the substrate support 21 is coupled to the break bar moving unit 41, and the first direction toward the mother substrate 101 supported by the substrate support 21 is provided. It is moved by the break bar moving unit 41 in Z1 and in the second direction Z2 away from the mother substrate 101 supported by the substrate support 21. Then, the break bar 31 is moved in the first direction Z1 by the break bar moving unit 41, so that the cutting position of the mother substrate 101 supported by the substrate support base 21 is brought into contact with one end and pressed. 101 is cut.

  The substrate fixing bar 32 is accommodated in the accommodating space 111 of the substrate breaker body 11. As shown in FIG. 1, the substrate fixing bar 32 is formed so as to extend along the scribe line 105 of the mother substrate 101. That is, the substrate fixing bar 32 extends linearly in the same manner as the scribe line 105 formed on the mother substrate 101 linearly. The substrate fixing bar 32 is made of, for example, a hard material such as plastic. Further, as shown in FIG. 2, the substrate fixing bar 32 supports the substrate so that the two pressing surfaces that come into contact with the mother substrate 101 supported by the substrate supporting base 21 and press in the first direction Z1 sandwich the scribe line 105 therebetween. It is formed at one end of the base 21 side. The substrate fixing bar 32 fixes the mother substrate 101 by pressing the area along the scribe line 105 of the mother substrate 101 other than the cutting position of the mother substrate 101 in the first direction Z1 with this pressing surface. To do.

  As shown in FIGS. 1 and 2, the break bar moving unit 41 includes a servo motor 411 and a ball screw 412. As shown in FIG. 1, the servo motor 411 is fixed to the substrate breaker main body 11. The ball screw 412 is provided with a break bar 31 at one end on the substrate support 21 side, and the other end on the opposite side to the substrate support 21 is connected to the servo motor 411. In the break bar moving unit 41, the servo motor 411 rotates the ball screw 412 to move the break bar 31 in the vertical direction. Specifically, the break bar moving unit 41 breaks into a first direction Z1 toward the mother substrate 101 supported by the substrate support 21 and a second direction Z2 away from the mother substrate supported by the substrate support. Move the bar 31. As shown in FIG. 1, the break bar moving unit 41 is connected to a break bar moving control unit 51, and the break bar moving control unit 51 controls the moving operation of the break bar 31.

  The break bar movement control unit 51 controls the movement operation of the break bar moving unit 41. The break bar movement control unit 51 includes a computer and a program that causes the computer to function as the above-described means. The break bar movement control unit 51 is connected to the cutting detection unit 61. When the break bar moving unit 41 moves the break bar 31 in the first direction Z1 and cuts the mother substrate 101, the cutting detection unit Based on the cutting information of the mother substrate 101 detected by 61, the moving operation of the break bar moving unit 41 is controlled. Specifically, the break bar movement control unit 51 corresponds to the time when the mother substrate 101 is cut when it receives the cutting data S that is cutting information of the mother substrate 101 detected by the cutting detection unit 61. Thus, the movement direction of the break bar 31 is switched to the break bar moving part 41 from the 1st direction Z1 to the 2nd direction Z2.

  The cutting detection unit 61 detects the cutting of the mother substrate 101 cut at the cutting position by the break bar 31 that moves in the first direction Z1 and presses the cutting position of the mother substrate 101.

  As shown in FIG. 2, the cutting detection unit 61 includes a first vibration sensor 611a, a second vibration sensor 611b, an amplifier 612, an A / D converter 613, and a vibration calculator 614. Based on the time change of the vibration of the mother substrate 101, the cutting of the mother substrate 101 is detected. The cutting detection unit 61 includes first vibration data V1 detected by the vibration of the break bar 31 detected by the first vibration sensor 611a and second vibration data detected by the vibration of the substrate fixing bar 32 detected by the second vibration sensor 611b. Based on the time change of the difference data D with respect to V2, the cutting of the mother substrate 101 is detected. Each part of the cutting | disconnection detection part 61 is demonstrated.

The first vibration sensor 611 a is provided on the break bar 31 and detects vibration of the break bar 31. The first vibration sensor 611a is, for example, a contact type and a piezoelectric element type acceleration pickup sensor, and detects vibration by measuring the acceleration of the break bar 31. For example, an acceleration pickup sensor that outputs a DC voltage of 2 V with respect to an acceleration of 0.316 m / s ² is used. Then, the first vibration sensor 611a outputs the first vibration data V1 based on the detected vibration to the amplifier 612 as an analog signal.

  On the other hand, the second vibration sensor 611 b is provided on the substrate fixing bar 32 and detects the vibration of the substrate fixing bar 32. Similarly to the first vibration sensor 611a, the second vibration sensor 611b is an acceleration pickup sensor, and detects vibration by measuring the acceleration of the substrate fixing bar 32. The second vibration sensor 611b outputs the second vibration data V2 based on the detected vibration to the amplifier 612 as an analog signal.

  The amplifier 612 is connected to each of the first vibration sensor 611a and the second vibration sensor 611b. The amplifier 612 receives analog signals of the first vibration data V1 and the second vibration data V2 from the first vibration sensor 611a and the second vibration sensor 611b, respectively. Then, the amplifier 612 processes each of the first vibration data V1 and the second vibration data V2, generates difference data D of the analog signal, and outputs the difference data D to the A / D converter 613. . That is, the amplifier 612 performs a difference between the first vibration data V1 and the second vibration data V2 as the vibration DC voltage, and the difference data D as the relative vibration DC voltage is input to the A / D converter 613 as an analog signal. Output.

  The A / D converter 613 is connected to the amplifier 612, and the difference data D generated by the amplifier 612 is input as an analog signal. Then, the A / D converter 613 converts the difference data D that is an analog signal into a digital signal and outputs the digital signal to the vibration calculator 614.

  The vibration calculator 614 is connected to the A / D converter 613, and the difference data D converted into a digital signal by the A / D converter 613 is input. Then, the vibration calculator 614 generates the cutting data S indicating the cutting timing of the mother substrate 101 by performing an arithmetic comparison process with the difference data D and the preset and stored comparison data H. For example, the vibration computing unit 614 stores comparison data H in which the relative vibration DC voltage value at the moment of cutting is 4 V or more, and the difference data D from the A / D converter 613 is the relative vibration DC voltage. When the value is 4V or more, it is determined that the mother substrate 101 has been cut, and cutting data S indicating the cutting timing of the mother substrate 101 is generated. Then, the vibration computing unit 614 outputs the cutting data S to the break bar movement control unit 51, and the break bar movement control unit 51 outputs the cutting data S from the first direction Z1 corresponding to the time when the mother substrate 101 is cut. The moving operation of the break bar moving unit 41 is controlled so that the moving direction of the break bar 31 is switched to the two directions Z2.

  In the present embodiment, the substrate breaker 1 corresponds to the substrate breaker of the present invention. Further, the substrate support 21 of the present embodiment corresponds to the substrate support of the present invention. Moreover, the break bar 31 of this embodiment is corresponded to the break bar of this invention. Further, the substrate fixing bar 32 of the present embodiment corresponds to the substrate fixing bar of the present invention. Moreover, the break bar moving part 41 of this embodiment is corresponded to the break bar moving part of this invention. Moreover, the break bar movement control part 51 of this embodiment is corresponded to the movement control part of this invention. Moreover, the cutting | disconnection detection part 61 of this embodiment is corresponded to the cutting | disconnection detection part of this invention. Further, the color filter substrate 103 of the present embodiment corresponds to the substrate of the present invention and the first substrate. The array substrate 104 of this embodiment corresponds to the substrate of the present invention and the second substrate. Further, the pixel switching element 104a of the present embodiment corresponds to a semiconductor element or a pixel switching element of the present invention. Further, the scribe line 105 of the present embodiment corresponds to the scribe line of the present invention. Further, the first scribe line 105a of the present embodiment corresponds to the scribe line of the present invention. Further, the second scribe line 105b of the present embodiment corresponds to the scribe line of the present invention. Further, the first vibration sensor 611a of the present embodiment corresponds to the first vibration sensor of the present invention. Further, the second vibration sensor 611b of the present embodiment corresponds to the second vibration sensor of the present invention. Further, the first direction Z1 of the present embodiment corresponds to the first direction of the present invention. Further, the second direction Z2 of the present embodiment corresponds to the second direction of the present invention.

  Hereinafter, the substrate breaking method of the present embodiment will be described. Here, the mother substrate 101 is cut using the substrate breaker 1 described above.

  4, 5 and 6 are diagrams for explaining the substrate breaking method of the present embodiment.

  Here, FIG. 4 is a flowchart showing a substrate breaking method in the embodiment according to the present invention. FIG. 5 is a side view showing the operation of the break bar 31 portion of the substrate breaker 1 in the substrate breaking method of the present embodiment. The operation of the break bar 31 is shown in (a), (b), (c). Shown in order. Similarly to FIG. 5, FIG. 6 is a side view showing the operation of the break bar 31 portion of the substrate breaking device 1 in the substrate breaking method of the present embodiment, which is shown in FIGS. Operations following (c) are shown in the order of (d), (e), and (f).

  When the mother substrate 101 is cut using the substrate breaker 1, the mother substrate 101 is first placed on the substrate support 21 as shown in FIG. 4 (S11).

  Here, as shown in FIG. 5A, the substrate is arranged such that the array substrate 104 of the mother substrate 101 is on the substrate support base 21 side and the color filter substrate 103 is on the opposite side of the substrate support base 21 side. It is placed on the elastic plate 212 of the support base 21.

  Next, as shown in FIG. 4, the alignment of the scribe line 105 and the break bar 31 of the mother substrate 101 and the fixing of the mother substrate 101 by the substrate fixing bar 32 are performed (S21).

  Here, as shown in FIG. 5B, the mother substrate in which one end portion of the break bar 31 formed in a tapered shape on the substrate support base 21 side is formed with the second scribe line 105 b as the scribe line 105. The break bar 31 is aligned so as to face the cutting position 101 at a predetermined interval. Further, the break bar 31 is aligned so that the extending direction of the break bar 31 and the extending direction of the second scribe line 105b are along each other.

  Then, the two pressing surfaces pressing in the first direction Z1 at one end portion of the substrate fixing bar 32 on the substrate support table 21 side sandwich the cutting position where the second scribe line 105b is formed, and the substrate support table 21 supports. The substrate fixing bar 32 is aligned so as to contact the other surface of the mother substrate 101. Then, the area along the second scribe line 105b of the mother substrate 101 other than the cutting position of the mother substrate 101 is pressed in the first direction Z1 by the two pressing surfaces of the substrate fixing bar 32, and the mother substrate 101 is fixed. To do.

  Next, the break bar 31 starts to move in the first direction Z1 (S31).

  Here, in order to cut the array substrate 104 of the mother substrate 101 at the cutting position where the second scribe line 105b is formed, the mother substrate 101 supported by the substrate support 21 as shown in FIG. 5B. The break bar moving control unit 51 controls the break bar moving unit 41 so that the break bar moving unit 41 moves the break bar 31 in the first direction Z1 toward the front.

  Specifically, based on a movement start command input by an operator to an input device (not shown), the break bar movement control unit 51 controls the break bar moving unit 41 to start moving the break bar 31. To do. With this control, the servo motor 411 of the break bar moving unit 41 rotates the ball screw 412. Then, the break bar 31 is moved in the first direction Z1 toward the mother substrate 101 supported by the substrate support 21.

  Next, cutting of the mother substrate 101 is detected (S41).

  Here, as shown in FIG. 5C, the break bar 31 is moved in the first direction Z1, and the array substrate 104 in the mother substrate 101 is cut.

  FIG. 7 is an enlarged side view showing a state in which the array substrate 104 is cut, and shows a portion X in FIG.

  As shown in FIG. 7, when the array substrate 104 is cut, the cutting position is pressed from the color filter substrate 103 side of the mother substrate 101 by moving the break bar 31 in the first direction Z1. By this pressing, the rupture extends from the second scribe line 105b formed on the array substrate 104, and the array substrate 104 is divided into two.

  At this time, the cutting detector 61 detects the cutting of the array substrate 104 cut at the cutting position in the mother substrate 101 by the break bar 31 moving in the first direction Z1.

  In the present embodiment, the cutting detection unit 61 detects the cutting of the mother substrate 101 based on the time change of the vibration of the mother substrate 101. Specifically, the difference data between the first vibration data V1 of the break bar 31 detected by the first vibration sensor 611a and the second vibration data V2 of the substrate fixing bar 32 detected by the second vibration sensor 611b. Based on the time change of D, the cutting detector 61 detects the cutting of the mother substrate 101.

  Here, the first vibration sensor 611a of the cutting detection unit 61 detects the vibration of the break bar 31, and outputs the first vibration data V1 to the amplifier 612 as an analog signal. Further, the second vibration sensor 611b of the cutting detection unit 61 detects the vibration of the substrate fixing bar 32 and outputs the second vibration data V2 to the amplifier 612 as an analog signal.

  Thereafter, the amplifier 612 generates difference data D between the first vibration data V1 and the second vibration data V2, and outputs the difference data D to the A / D converter 613.

  FIG. 8 is a waveform diagram showing the first vibration data V1, the second vibration data V2, and the difference data D. 8A is a waveform diagram when the break bar 31 and the substrate fixing bar 32 are subjected to vibration due to disturbance, and FIG. 8B is a case where the break bar 31 is subjected to vibration. FIG. 8C is a waveform diagram when the substrate fixing bar 32 receives vibration. In each of FIGS. 8A and 8B, the horizontal axis indicates time, and the vertical axis indicates the voltage value. In the vertical axis, the origins of the first vibration data V1, the second vibration data V2, and the difference data D are different. From above, the first vibration data V1, the second vibration data V2, and the difference data D are shown in this order.

  As shown in FIG. 8A, when both the break bar 31 and the substrate fixing bar 32 receive vibration due to disturbance, the break bar 31 and the substrate fixing bar 32 vibrate similarly. Therefore, the first vibration data V1 for the break bar 31 detected by the first vibration sensor 611a and the second vibration data V2 for the substrate fixing bar 32 detected by the second vibration sensor 611b are similar to each other. Output in waveform. Then, the difference data D between the first vibration data V1 and the second vibration data V2 is output from the amplifier 612 so that it does not change over time regardless of the presence or absence of vibration due to disturbance. In other words, when receiving vibration due to disturbance instead of vibration due to cutting of the mother substrate 101, the amplifier 612 does not change the difference data D between the first vibration data V1 and the second vibration data V2. Is output from.

  Further, as shown in FIG. 8B, when the break bar 31 receives vibration, the first vibration data V1 for the break bar 31 detected by the first vibration sensor 611a and the second vibration sensor 611b. The second vibration data V2 for the substrate fixing bar 32 detected by the above is output in a waveform different from each other. The difference data D between the first vibration data V1 and the second vibration data V2 is output from the amplifier 612 so as to change over time according to the vibration of the break bar 31. That is, when the vibration due to the cutting of the mother substrate 101 is received, the first vibration data V1 and the second vibration data V2 are different, and therefore the difference data D is output from the amplifier 612 so as to change with time.

  Further, as shown in FIG. 8C, when the substrate fixing bar 32 receives vibration, the break bar 31 detected by the first vibration sensor 611a is the same as when the break bar 31 receives vibration. The first vibration data V1 for and the second vibration data V2 for the substrate fixing bar 32 detected by the second vibration sensor 611b are output in different waveforms. The difference data D between the first vibration data V1 and the second vibration data V2 is output from the amplifier 612 so as to change over time according to the vibration of the break bar 31. That is, when the vibration due to the cutting of the mother substrate 101 is received, the first vibration data V1 and the second vibration data V2 are different, and thus the difference data D is output from the amplifier 612 so as to change over time.

  In this way, the amplifier 612 outputs the difference data D to the A / D converter 613.

  Then, the A / D converter 613 converts the difference data D, which is an analog signal, into a digital signal and outputs it to the vibration calculator 614.

  Then, the vibration calculator 614 performs a comparison calculation process on the difference data D and the comparison data H set and stored in advance, and generates cutting data S indicating the cutting timing of the mother substrate 101. For example, the vibration calculator 614 compares the comparison data H that the relative vibration DC voltage value at the moment of cutting is 4 V or more, and the difference data D that is output from the A / D converter 613 in real time for the cutting operation. Are compared. Then, when the difference data D indicates the relative vibration DC voltage value 4V or more which is the comparison data H, the cutting data S indicating the cutting timing of the mother substrate 101 is generated.

  Next, as shown in FIG. 4, the movement of the break bar 31 is switched in the second direction Z2 (S51).

  Here, as shown in FIG. 6D, based on the cutting information of the mother substrate 101 detected by the cutting detection unit 61 as described above, the first time corresponding to the time when the mother substrate 101 is cut is shown. The break bar movement control unit 51 switches the break bar moving unit 41 so that the break bar moving unit 41 switches the moving direction of the break bar 31 from the one direction Z1 to the second direction Z2 away from the mother substrate 101 supported by the substrate support base 21. To control.

  FIG. 9 shows the position data P indicating the position in the vertical direction of the break bar 31 moved by the break bar moving unit 41 controlled by the break bar moving control unit 51, and the first vibration data V1 and the second vibration data V2. 4 is a waveform diagram showing difference data D. FIG. In FIG. 9, the horizontal axis represents time. On the other hand, in FIG. 9, the vertical axis indicates the position in the vertical direction in which the position data P has advanced from the initial position P0 in the first direction Z1, and the difference data D indicates the voltage value.

  As shown in FIG. 9, the break bar movement control unit is between the time t0 when the break bar 31 starts moving and the time t1 when the voltage value of the difference data D becomes equal to or higher than the comparison voltage value of the comparison data H. 51 moves the break bar 31 from the initial position P0 to the first direction Z1 by the break bar moving unit 41. For example, the break bar 31 is moved at a speed of 1000 μm / sec.

  Then, at the time t1 when the voltage value of the difference data D becomes equal to or higher than the comparison voltage value of the comparison data H, the break bar movement control unit 51 receives the cutting data S output from the vibration calculator 614, The moving unit 41 switches the moving direction of the break bar 31 from the first direction Z1 to the second direction Z2. Here, the switching of the movement is completed so that the overstroke amount in the first direction Z1 becomes 12 μm after 12 msec from the moment of cutting. The overstroke amount is preferably 50 μm or less.

  Then, the break bar 31 is advanced in the second direction Z2 and moved from the switching position PK to the initial position P0. For example, the break bar 31 is moved at a speed of 15 mm / sec.

  In this way, the array substrate 104 of the mother substrate 101 is cut as shown in FIG.

  Thereafter, as shown in FIG. 6E, the color filter substrate 103 of the mother substrate 101 is on the substrate support base 21 side, and the array substrate 104 is on the opposite side of the substrate support base 21 side. The mother substrate 101 is inverted and placed on the elastic plate 212 of the substrate support 21.

  Then, the color filter substrate 103 of the mother substrate 101 is cut as shown in FIG. 6F by the same procedure as that for the array substrate 104 of the mother substrate 101.

  The above operation is performed at the cutting position where each scribe line 105 is formed, and the mother substrate 101 is cut for each display panel 102.

  Thereafter, a liquid crystal layer (not shown) is injected into the space between the color filter substrate 103 and the array substrate 104 of the mother substrate 101 cut for each display panel 102, and the liquid crystal layer is aligned to form a liquid crystal panel. To do. Then, a display device is completed by mounting a driving circuit, a polarizing plate, a backlight, and the like.

  As described above, in the present embodiment, a scribe line is formed at the cutting position, and extends along the scribe line 105 of the mother substrate 101 to the cutting position of the mother substrate 101 supported by the substrate support 21. When the break bar 31 is brought into contact with and pressed, the mother substrate 101 is cut at the cutting position. Here, the break bar movement control unit 51 controls the movement operation of the break bar movement unit 41, and the break bar 31 is moved in the first direction Z1 toward the mother substrate 101 supported by the substrate support 21. Move. Then, the break bar 31 is brought into contact with the cutting position of the mother substrate 101 to press the cutting position, and the mother substrate 101 is cut at the cutting position. At this time, the cutting detector 61 detects the cutting of the mother substrate 101 cut at the cutting position by the break bar 31 moving in the first direction Z1. After that, the break bar movement control unit 51 determines the substrate from the first direction Z1 corresponding to the time when the mother substrate 101 is cut based on the information on the cutting of the mother substrate 101 detected by the cutting detection unit 61. The break bar moving unit 41 is controlled so as to switch the moving direction of the break bar 31 in the second direction Z2 away from the mother substrate 101 supported by the support base 21.

  FIG. 10 is an enlarged view of the mother substrate 101 cut in the present embodiment. 10A is a diagram showing an enlarged photograph of the surface of the mother substrate 101 pressed by the break bar 31, and FIG. 10B shows the surface of the substrate pressed by the break bar 31. It is a figure which shows the enlarged photograph of the cut surface of a perpendicular direction.

  As shown in FIG. 10, in this embodiment, the cut surface of the mother substrate 101 is not cracked and is cut with a uniform cut surface. In this embodiment, since the cutting of the mother substrate 101 is detected and the pressing direction of the break bar 31 is reversed in accordance with the cutting timing of the mother substrate 101, the impact by the break bar 31 is reduced. For this reason, as shown in FIG. 10, this embodiment can prevent generation | occurrence | production of a crack and can cut | disconnect with high precision, and can improve the reliability and manufacturing efficiency of an apparatus.

  In the present embodiment, the cutting detection unit 61 detects the cutting of the mother substrate 101 based on the time change of the vibration of the mother substrate 101. For this reason, since this embodiment can detect the cutting of the substrate with high sensitivity and with high sensitivity, it can prevent the generation of cracks and can cut the substrate with high accuracy, thereby improving the reliability and manufacturing efficiency of the apparatus. Can be improved.

  In the present embodiment, the cutting detection unit 61 includes the first vibration data V1 based on the vibration of the break bar 31 detected by the first vibration sensor 611a and the substrate fixing bar detected by the second vibration sensor 611b. Based on the time change of the difference data D from the second vibration data V2 due to the vibration of 32, the cutting of the mother substrate 101 is detected. Thus, in this embodiment, since the cutting of the mother substrate 101 is detected based on the relative vibration value, it is possible to detect the vibration due to the cutting with high accuracy without being affected by the vibration due to the disturbance. For this reason, this embodiment can prevent generation | occurrence | production of a crack and can cut | disconnect with high precision, and can improve the reliability and manufacturing efficiency of an apparatus. In addition, the difference data D and the like enable state management at the time of cutting and maintenance and statistical management of the apparatus, so that cutting failures due to variations in substrate lots can be improved by changing the setting.

  In the present embodiment, the first vibration sensor 611a detects the vibration by measuring the acceleration of the break bar 31, and the second vibration sensor 611b detects the vibration by measuring the acceleration of the substrate fixing bar 32. . That is, acceleration pickup sensors are used as the first vibration sensor 611a and the second vibration sensor 611b. Therefore, it is possible to detect high-frequency vibrations such as cutting of the substrate with high sensitivity, so that cracks can be prevented and cutting can be performed with high accuracy, and the reliability and manufacturing efficiency of the apparatus can be improved. Can do.

  In implementing the present invention, the present invention is not limited to the above-described embodiment, and various modifications can be employed.

  For example, in the above-described embodiment, the case where two substrates face each other with a gap so as to be cut into a liquid crystal panel has been described as the substrate to be cut, but the present invention is not limited to this. For example, the present invention can be similarly applied to a case where a single substrate is cut.

  In addition, when measuring vibration at the cutting detection unit, in addition to measurement by acceleration, vibration may be measured by displacement measurement and speed measurement according to the frequency of vibration. Capacitance type, eddy current type, A measurement type vibration sensor such as a laser Doppler type may be employed. Further, the vibration of the substrate may be measured by a non-contact type vibration sensor. In the above embodiment, the vibration of the substrate is indirectly measured by the vibrations of the break bar and the substrate fixing bar. However, the vibration of the substrate may be directly measured.

  In the cutting detection unit, the cutting of the substrate may be detected by measuring the displacement amount of the break bar at the time of cutting based on the load information by the load cell.

FIG. 1 is a front view showing a configuration of a substrate breaker 1 in an embodiment according to the present invention. FIG. 2 is a side view showing a main part of the substrate breaking device 1 in the embodiment according to the present invention. FIG. 3 is a diagram showing a configuration of the mother substrate 101 in the embodiment according to the present invention. 3, FIG. 3 (a) is a plan view, and FIG. 3 (b) is a cross-sectional view of the Y1-Y2 portion of FIG. 3 (a). FIG. 4 is a flowchart showing a substrate breaking method in the embodiment according to the present invention. FIG. 5 is a side view showing the operation of the break bar 31 portion of the substrate breaking apparatus 1 in the substrate breaking method of the present embodiment, which is shown in the order of (a), (b), and (c). FIG. 6 is a side view showing the operation of the break bar 31 portion of the substrate breaking device 1 in the substrate breaking method of the present embodiment, and the operations following (a), (b), (c) in FIG. (D), (e), and (f) are shown in this order. FIG. 7 is an enlarged side view showing a state of cutting the array substrate 104 in the embodiment according to the present invention, and shows an X portion of FIG. FIG. 8 is a waveform diagram showing the first vibration data V1, the second vibration data V2, and the difference data D in the embodiment according to the present invention. 8A is a waveform diagram when the break bar 31 and the substrate fixing bar 32 are subjected to vibration due to disturbance, and FIG. 8B is a case where the break bar 31 is subjected to vibration. FIG. 8C is a waveform diagram when the substrate fixing bar 32 receives vibration. FIG. 9 shows the position data P in the vertical direction of the break bar 31 moved by the break bar moving unit 41 controlled by the break bar movement control unit 51, the first vibration data V1, and the second in the embodiment according to the present invention. It is a wave form diagram which shows difference data D with vibration data V2. In FIG. 9, the horizontal axis represents time. On the other hand, in FIG. 9, the vertical axis represents the position in the vertical direction that has advanced from the initial position P0 to the first direction Z1 for the position data P, and the voltage value for the difference data D. FIG. 10 is a view showing an enlarged photograph of the cut mother substrate 101 in the embodiment according to the present invention. 10A is a diagram showing an enlarged photograph of the surface of the mother substrate 101 pressed by the break bar 31, and FIG. 10B shows the surface of the substrate pressed by the break bar 31. It is a figure which shows the enlarged photograph of the cut surface of a perpendicular direction. FIG. 11 is an enlarged photograph of a substrate cut by applying stress using a break bar. 11A is an enlarged view of the surface of the substrate pressed by the break bar, and FIG. 11B is a direction perpendicular to the surface of the substrate pressed by the break bar. It is a figure which shows the enlarged photograph of a cut surface.

Explanation of symbols

1 ... Substrate break device (substrate break device),
11 ... Substrate breaker body,
21 ... Substrate support (substrate support),
31 ... Break bar (break bar),
32 ... Substrate fixing bar (Substrate fixing bar),
41 ... break bar moving part (break bar moving part),
51 ... Breakbar movement control unit (movement control unit),
61 ... cutting detection part (cutting detection part),
101 ... Mother board,
102 ... display panel,
103 ... color filter substrate (substrate, first substrate),
103a ... color filter layer,
104 ... Array substrate (substrate, second substrate),
104a ... Pixel switching element,
105 ... scribe line (scribe line),
105a ... 1st scribe line (scribe line),
105b ... the second scribe line (scribe line),
111 ... Containment space,
211 ... Substrate support plate,
212 ... elastic plate,
411 ... Servo motor,
412 ... Ball screw,
611a ... first vibration sensor (first vibration sensor),
611b ... second vibration sensor (second vibration sensor),
612 ... Amplifier,
613 ... A / D converter,
614 ... Vibration calculator,
Z1 ... 1st direction (1st direction),
Z2 ... 2nd direction (2nd direction),
V1 ... first vibration data,
V2 ... second vibration data,
D: Differential data,
H ... Comparison data

Claims (8)

A substrate breaking device for cutting a substrate on which a scribe line is formed at a cutting position, at the cutting position,
A substrate support for supporting the substrate;
A break bar that is formed to extend along the scribe line of the substrate and that cuts the substrate by pressing the cutting position of the substrate supported by the substrate support;
A break bar moving unit that moves the break bar in a first direction toward the substrate supported by the substrate support and in a second direction away from the substrate supported by the substrate support;
A movement control unit for controlling the movement operation of the break bar moving unit;
A cutting detection unit that detects cutting of the substrate cut at the cutting position by the break bar that moves in the first direction by the break bar moving unit controlled by the movement control unit and presses the cutting position; Have
The movement control unit moves the break bar in the first direction to the break bar moving unit to cut the substrate based on the information on the cutting of the substrate detected by the cutting detection unit. A substrate breaker that controls a movement operation of the break bar moving unit so as to switch the movement direction of the break bar from the first direction to the second direction in response to the time when the substrate is cut. The substrate breaker according to claim 1, wherein the cutting detection unit detects the cutting of the substrate based on a temporal change in vibration of the substrate. A substrate that is formed so as to extend along the scribe line of the substrate and fixes the substrate by pressing an area along the scribe line of the substrate other than the cutting position of the substrate. A fixed bar,
The cutting detector is
A first vibration sensor for detecting vibration of the break bar;
A second vibration sensor for detecting vibration of the substrate fixing bar;
Detecting cutting of the substrate based on a temporal change in difference data between the vibration of the break bar detected by the first vibration sensor and the vibration of the substrate fixing bar detected by the second vibration sensor The substrate breaker according to claim 1. The first vibration sensor detects vibration by measuring acceleration of the break bar;
The substrate breaker according to claim 3, wherein the second vibration sensor detects vibration by measuring an acceleration of the substrate fixing bar. Cutting the substrate including a first substrate and a second substrate facing the first substrate at an interval, wherein the scribe line is formed on at least one of the first substrate and the second substrate; The substrate breaker according to claim 1. A scribe line is formed at a cutting position, and a break bar extending along the scribe line of the substrate is brought into contact with and pressed against the cutting position of the substrate supported by the substrate support base, thereby cutting the substrate. A substrate breaking method of cutting at a position,
A movement control unit controls the break bar moving unit so that the break bar moving unit moves the break bar in a first direction toward the substrate supported by the substrate support, and the substrate at the cutting position. A first step of cutting
A second step in which a cutting detection unit detects cutting of the substrate cut at the cutting position by the break bar moving in the first direction;
Based on the information on the cutting of the substrate detected by the cutting detector, the second direction away from the substrate supported by the substrate support base from the first direction corresponding to the time when the substrate is cut. And a third step in which the movement control unit controls the break bar moving unit so that the break bar moving unit switches the moving direction of the break bar. A scribe line is formed at the cutting position, and a break bar extending along the scribe line of the substrate is brought into contact with and pressed at the cutting position of the substrate supported by the substrate support table. A semiconductor device comprising a cut substrate and a semiconductor element formed on the cut substrate,
The substrate is
When the break bar is moved in the first direction toward the substrate supported by the substrate support and the substrate is cut at the cutting position, the cutting of the substrate cut at the cutting position is detected. And the support base supports from the first direction so as to correspond to the time when the substrate is cut based on the information on cutting the substrate detected by the cutting detection unit. The semiconductor device is cut by switching a movement direction of the break bar in a second direction away from the substrate. The semiconductor device according to claim 7, wherein the semiconductor element is formed as a pixel switching element that controls switching of a pixel.