TWI491572B - Breaking apparatus and method for glass substrate - Google Patents

Description

Glass substrate breaking device and method

The invention relates to a breaking device and a breaking method for a glass substrate, in particular to a breaking device and a breaking method for breaking a strengthened glass substrate.

At present, glass substrates are widely used in various parts of electronic products, such as screens and casings. Generally, a glass substrate for electronic products has a layer of electrically conductive circuit sandwiched therebetween, and an electrical contact for external connection. In order to prevent the glass substrate from being easily scratched or broken, the glass substrate generally used for electronic products needs to have sufficient end face strength. In the manufacturing process, in order to cut the glass substrate into a small size to meet the requirements of the final product or expose the central electrical contact of the two-layer substrate for connection with the electrical circuit, it must be performed from both surfaces of the glass substrate. Break. The conventional breaking device and the breaking method first break the surface of one of the glass substrates, and then turn the other surface after the turning, however, the turning process will cause the end surface defects of the broken portion of the glass substrate. Since the glass substrate has end surface defects, its overall strength is lowered. Therefore, how to break the glass substrate and take into account sufficient end face strength is an important issue in the industry.

Referring to FIG. 1A , a glass substrate 1 includes a first substrate 11 and a second substrate 12 . The first substrate 11 has a first substrate surface 110 , and the second substrate 12 has a second substrate surface 120 . After the tool is first scribed on the first substrate 11 along the predetermined breaking line, the surface 110 generates a second scribe 1100 which facilitates the subsequent breaking process of the first substrate 11. Thereafter, as shown in FIG. 1B, the conventional method uses a breaking tool 100 to abut the position on the second substrate surface 120 corresponding to the scratch 1100, and places the first substrate surface 110 over a desktop 10'. On the rubber mat 10 . As shown in FIG. 1C, by applying pressure on the breaking tool 100, the substrate 1 is deformed on the rubber mat 10 so that the first substrate 11 can be broken along the second scoring 1100. As shown in FIG. 1D, if the second substrate 12 is to be further divided, the substrate 1 has to be turned over so that the second substrate surface 120 is placed upward on the rubber pad 10 of the table top 10', and is broken along the predetermined line. The second substrate surface 120 is scored to create a first scored 1200 to assist in breaking the second substrate 12. As shown in FIG. 1E, the breaking tool 100 is pressed against the position of the first substrate surface 110 corresponding to the first scoring mark 1200. At this time, the second substrate surface 120 is in contact with the rubber pad 10. As shown in FIG. 1F, pressure is applied to the breaking tool 100 to enable the second substrate 12 to be broken along the first score 1200. In this way, the glass substrate 1 can be separated along the front and rear positions of the electrical contacts of a specific region above it.

Although this method can break the two surfaces of the glass substrate 1, only the flipping process as shown in FIG. 1D is required, and the turning process will cause end defects of the first substrate 11 that has been broken, eventually resulting in The end face strength of the glass substrate 1 is lowered. Further, the physical properties of the rubber mat 10 gradually deteriorate with time, and particularly the deterioration of the resilience, which is one of the causes of undesired cracks, burrs, and the like in the glass substrate 1 during the breaking process. It can be seen from the above that how to avoid the occurrence of end faces or surface defects in the glass substrate 1 during the breaking process has been an object of improvement in the industry.

It is an object of the present invention to provide an apparatus for breaking a glass substrate that has been scored. The use of this breaking device avoids the risk of end face defects due to the turning process. The breaking device of the present invention comprises two breaking tools and two supporting portions, wherein each breaking tool is in contact with one of two surfaces of the glass substrate, and each supporting portion is also respectively combined with a glass base One of the two surfaces of the plate is in contact, and each of the breaking tools holds the glass substrate together with one supporting portion, so that the device can simultaneously break the two surfaces of the glass substrate without going through the turning process. .

Another object of the present invention is to provide a method for breaking a glass substrate that has been scribed. By means of the above-mentioned breaking device, the glass substrate is separated at a certain breaking position along a boundary position of the electrical contact of the specific region, and then the glass substrate is transported to another point through a conveyor belt or a roller mechanism. The broken position causes the glass substrate to be separated along another boundary position of the electrical contact of its specific region, so that the central electrical contact can be exposed.

1‧‧‧ glass substrate

10‧‧‧ rubber mat

10'‧‧‧ Desktop

11‧‧‧First substrate

12‧‧‧second substrate

13‧‧‧Electrical contacts

20‧‧‧ Breaking device

20'‧‧‧ Breaking device

31‧‧‧Conveyor belt

32‧‧‧Rolling mechanism

100‧‧‧Disconnecting tools

110‧‧‧First substrate surface

120‧‧‧Second substrate surface

121‧‧‧ Bordering section

201‧‧‧First Breaking Tool

201'‧‧‧First support

202‧‧‧Second breaking tool

202'‧‧‧Second support

1100‧‧‧second scratches

1100'‧‧‧ fourth scratches

1101‧‧‧Contact points

1102‧‧‧Support position

1200‧‧‧ first scratches

1200'‧‧‧ Third scratches

1201‧‧‧Support position

1202‧‧‧Contact points

P‧‧‧Disconnected position

P'‧‧‧ break position

1A to 1F are schematic views showing a glass substrate according to a conventional apparatus and method; FIG. 2 is a schematic view of the glass substrate breaking device of the present invention; and FIGS. 3A to 3B are schematic views showing the transportation of the glass substrate to the breaking position; 4A to 4G are schematic views showing a method of dividing a glass substrate of the present invention.

The invention comprises a breaking device for a glass substrate, which does not need to be equipped with a turning process as in the prior art. The two surfaces of the glass substrate can be combined by two sets of the cutting tool and the supporting portion of the glass substrate. It is simultaneously cut off without turning over the surface to improve the occurrence of end face defects in the glass substrate during the breaking process.

As shown in FIG. 2, a glass substrate 1 has a first substrate 11 and a second substrate 12, and a cutter is respectively disposed along one of the first substrate surface 110 and the second substrate 12 of the first substrate 11. After the predetermined breaking line on the two substrate surfaces 120 is scribed to a certain depth, the second substrate surface 120 has a first scribe mark 1200 formed along a predetermined breaking line. The device is further divided by a breaking device 20, which includes a first breaking tool 201 and a first supporting portion 201'. The first substrate 11 can be a thin film transistor layer, and the second substrate 12 can be a color filter layer. However, this is merely an exemplary embodiment and is not intended to limit the present invention. Bright. The first breaking tool 201 has two contact points 1101 at one end thereof that can contact the first substrate surface 110 of the glass substrate 1 , and the two contact points 1101 straddle both sides of the first scoring mark 1200 ; The first supporting portion 201 ′ has two supporting positions 1201 , and the two supporting positions 1201 can simultaneously contact the second substrate surface 120 of the glass substrate 1 for supporting the glass substrate 1 during the breaking operation, and spanning the The first breaking tool 201 is on both sides of the contact point 1101. However, the first support portion 201' does not contact the first score scratch 1200 during the breaking operation. When the second substrate 12 is divided, a force is applied to the first breaking tool 201 toward the position of the first scoring 1200, so that the substrate 1 is bent in the direction of the first scoring 1200, resulting in the second substrate. 12 is broken along the predetermined break line. The breaking device 20 may further include: a second breaking tool 202 and a second supporting portion 202'; and the first substrate surface 110 of the glass substrate 1 has a shape formed along a predetermined breaking line. Two scratches 1100; the second breaking tool 202 has two contact points 1202 at one end thereof that can contact the second substrate surface 120 of the glass substrate 1 , and the two contact points 1202 straddle the first substrate 11 The second support portion 202' has two support positions 1102. The two support positions 1102 can simultaneously contact the first substrate surface 110 of the glass substrate 1 during the breaking operation. And spanning on both sides of the two contact points 1202 of the second breaking tool 202. However, the second support portion 202' does not contact the second score 12100 during the breaking operation. 2 shows that the contact points (1101, 1202) of the first breaking tool 201 and the second breaking tool 202 have a circular arc shape. When a force is applied from the first breaking tool 201 and the second breaking tool 202 to the glass substrate 1, the second substrate 12 is broken due to the first scribe mark 1200 on the surface 120 extending toward the inside of the substrate. Similarly, the first substrate 11 is broken due to the second scribe mark 1100 located on the first substrate surface 110 extending toward the inside of the substrate; thus, the circuit layer located between the first substrate 11 and the second substrate 12 is formed. The electrical contacts in the middle are bare. In addition, the breaking device 20 may include a detecting device for detecting the breaking of the glass substrate. When the glass substrate 1 is divided, the detecting device may output a signal by detecting a change of the reaction force. The breaking device stops allowing the first breaking tool 201 or the second breaking tool 202 to continue to apply force to the Glass substrate 1; the detector is not shown in the drawings. The glass substrate 1 can be transported to one of the breaking points of the breaking device 20 by a conveyor belt 31 as shown in Fig. 3A or a roller mechanism 32 as shown in Fig. 3B.

The invention also includes a method for breaking the glass substrate 1, whereby the glass substrate 1 having a depth of one of the depths has been previously cut by the cutter along the predetermined breaking line so that the electrical contacts of the central circuit layer can be exposed. The glass substrate 1 is divided by the following steps: First, as shown in FIG. 4A, the glass substrate 1 is placed in a breaking position P of one of the first component breaking devices 20 as described above, wherein the glass substrate 1 is It is transported to the breaking position P by a conveyor belt 31 or a roller mechanism 32.

As shown in FIG. 4B, the first supporting portion 201' of the first component breaking device 20 supports the glass substrate 1 so that the two supporting positions 1201 are simultaneously in contact with the second substrate surface 120 of the glass substrate 1. The glass substrate 1 is supported during the breaking operation and spans both sides of the two contact points 1101 of the first breaking tool 201.

As shown in FIG. 4C, the first breaking tool 201 of the first component breaking device 20 applies force to the glass substrate 1, and the two contact points 1101 contact the first substrate surface of the glass substrate 1. 110 and spanning on both sides of the first scribe 1200; the second substrate 12 is separated along the first scribe 1200 by bending the substrate 1 in the direction in which the first scribe 1200 is located. . Similarly, while the first breaking tool 201 applies force to the glass substrate 1, the second breaking tool 202 applies force to the glass substrate 1, and the two contact points 1202 contact the glass substrate. The second substrate surface 120 of the first substrate 11 is along the second side of the second scribe mark 1100; and the first substrate 11 is along the second surface by bending the substrate 1 in the direction of the second scribe 1100. The scratch 1100 is divided; thereby, the glass substrate 1 is separated along the front and rear boundaries of one of the electrical contacts located in the circuit layer between the first substrate 11 and the second substrate 12, and is detected by a detector. The change of the reaction force is obtained, and the time point at which the glass substrate is broken is obtained, and then the application of force to the glass substrate 1 is stopped, but the detector is not shown in the drawing.

As shown in FIG. 4D, the glass substrate 1 is transported in the predetermined processing direction (in the present embodiment, to the right) by a predetermined distance through the conveyor belt 31 or the roller mechanism 32, and reaches the foregoing. One of the second component breaking devices 20' breaks the position P'.

As shown in FIG. 4E, the first supporting portion 201' of the second component breaking device 20' supports the glass substrate 1 such that the two supporting positions 1201 are simultaneously in contact with the second substrate surface 120 of the glass substrate 1. And spanning on both sides of the two contact points 1101 of the first breaking tool 201.

As shown in FIG. 4F, the first breaking tool 201 of the second component breaking device 20' applies force to the glass substrate 1, and the first contact substrate of the glass substrate 1 is contacted by the two contact points 1101. The surface 110 extends across a side of a third scored 1200' previously scored along a predetermined break line; the second substrate 12 is caused by bending the substrate 1 in the direction in which the third score 1200' is located. Along the third scratch 1200' is broken; likewise, while the first breaking tool 201 applies force to the glass substrate 1, the second breaking tool 202 applies force to the glass substrate. 1, and the second contact surface 1202 of the glass substrate 1 contacts the second substrate surface 120 of the glass substrate 1 and traverses a fourth scratched surface 1100' which is previously scribed along a predetermined breaking line and the first broken portion The sides of the scratches 1200 are scored; by bending the substrate 1 in the direction in which the fourth scores 1100' are located, the glass substrate 1 is broken along the fourth scores 1100'. Thereby, the glass substrate 1 is separated along the other front and rear boundaries of the electrical contacts located in the circuit layer between the first substrate 11 and the second substrate 12.

Finally, as shown in FIG. 4G, the edge portion 121 of the glass substrate 1 that has been broken is cut and removed, so that the glass substrate 1 is located in the electrical contact layer between the first substrate 11 and the second substrate 12. 13 can be exposed. According to FIG. 4A to FIG. 4G, the glass substrate which is set to the length and the finished glass substrate can be obtained by transporting, dividing and removing the edge material at a certain distance and time by the conveyor belt or the roller. And having electrical contacts in a particular length of intermediate circuit layer that are intended to be exposed.

The above embodiments are merely illustrative of a preferred embodiment of the invention and are not intended to limit the invention. Those skilled in the art can easily refer to the above embodiments with reference to the above embodiments. Other implementations. The scope of the patent application in this case shall be subject to the scope of the patent application.

1‧‧‧ glass substrate

11‧‧‧First substrate

12‧‧‧second substrate

20‧‧‧ Breaking device

110‧‧‧First substrate surface

120‧‧‧Second substrate surface

201‧‧‧First Breaking Tool

201'‧‧‧First support

202‧‧‧Second breaking tool

202'‧‧‧Second support

1100‧‧‧second scratches

1101‧‧‧Contact points

1102‧‧‧Support position

1200‧‧‧ first scratches

1201‧‧‧Support position

1202‧‧‧Contact points

Claims (13)

A breaking device for breaking a glass substrate that has been scribed, comprising: a first breaking tool, a first supporting portion, a second breaking tool and a second supporting portion; and the glass substrate The first substrate surface has a second scribe mark formed along a predetermined breaking line; wherein the glass substrate has a first substrate and a second substrate; the first substrate has a first substrate surface, The second substrate has a second substrate surface, the second substrate surface having a first scribe line formed along a predetermined breaking line; the first breaking tool has a first substrate surface contactable with the glass substrate Two contact points spanning both sides of the first scored scratch; the first support portion has two support positions, the two support positions being in contact with the second substrate surface of the glass substrate, and Across the two contact points of the first breaking tool; the second breaking tool has two contact points that can contact the second substrate surface of the glass substrate, the two contact points spanning the The second side of the scratch; the second support has Supporting position, the second support location may be in contact with the first substrate surface of the glass substrate, and on both sides across the two contact points of the second breaking means. The breaking device of claim 1, wherein the contact points formed in the breaking tools have a circular arc shape. The breaking device of claim 1, further comprising a detector for detecting a break point of the glass substrate. The breaking device of claim 1, wherein the glass substrate is transported by a conveyor belt or a roller mechanism to one of the breaking devices. The breaking device of claim 1, wherein the first substrate is a thin film transistor layer, The outer surface is a first substrate surface, the second substrate is a color filter layer, and the outer surface is a second substrate surface. A glass substrate breaking method, wherein the glass substrate has a first substrate surface formed by a first substrate and a second substrate surface formed by a second substrate, the second substrate surface having a predetermined fraction a first scratch formed by the broken line, the first substrate surface having a second scored mark formed along a predetermined breaking line; the glass substrate is divided by the following steps: (a) the glass Inserting, by the substrate, one of the breaking positions of the first component breaking device of item 1 of the claim 1; (b) supporting the glass substrate with the first supporting portion of the first component breaking device, so that the two supports Positioning in contact with the surface of the second substrate of the glass substrate and across the two contact points of the first breaking tool; (c) applying force to the first breaking tool of the first component breaking device And the two contact points contact the first substrate surface of the glass substrate and straddle both sides of the first scribe mark so that the second substrate is along the first scribe mark Breaking; wherein, in step (c), applying force to the first breaking tool While the glass substrate is being used, the second breaking tool applies force to the glass substrate, and the two contact points contact the second substrate surface of the glass substrate and straddle both sides of the second scoring mark. The first substrate is separated along the second scribe mark; thereby, the glass substrate is separated along the front and rear boundary positions of the electrical contacts of a specific region thereof. In the breaking method of claim 6, in the step (a), the glass substrate is transported to the breaking position in the breaking device by a conveyor belt or a roller mechanism. According to the breaking method of claim 6, in step (c), the detector further detects the time point at which the glass substrate is broken, and then stops continuing to apply force to the glass base. board. The breaking method of claim 7, further comprising the steps of: (d) transporting the glass substrate in a predetermined processing direction by a predetermined distance through the conveyor belt or the roller mechanism, and reaching the request item (1) supporting the glass substrate with the first support portion of the second component breaking device to make the two supporting positions and the glass substrate Two substrate surfaces are in contact and span both sides of the two contact points of the first breaking tool; (f) applying force to the glass substrate by the first breaking tool of the second component breaking device, and The two contact points contact the first substrate surface of the glass substrate and straddle two sides of a third scribe line formed along a predetermined breaking line, so that the second substrate is along the third scribe mark Was broken. The breaking method of claim 9, in the step (f), further applying a force to the glass substrate by the first breaking tool while applying force to the glass substrate, and The two contact points contact the surface of the second substrate of the glass substrate and straddle a fourth scribe line formed along a predetermined breaking line and two sides of the first scribe line that has been broken, so that the glass The substrate is broken along the fourth scored scratch; thereby, the glass substrate is separated along the front and rear boundary positions of the electrical contacts of one of the other specific regions. The breaking method of claim 9 further comprises the steps of: (g) cutting and removing the edge portion of the broken glass substrate. The breaking method of claim 6, wherein the first substrate is a thin film transistor layer, and the second substrate is a color filter layer. In the breaking method of claim 9, in step (f), the detector further detects the time point at which the glass substrate is broken, and then stops the application of force to the glass substrate.