TW201441168A - Substrate processing system and substrate processing method - Google Patents

Abstract

Provided are a substrate processing system and a substrate processing method for processing with high precision a terminal area of a laminated substrate having the terminal area on at least one side of the periphery, comprising: a first scribing part 101 for processing a first scribing line S1 in order to cut a short rectangular substrate M1 from a mother substrate M; a first breaking part 102 for breaking along the first scribing line S1 to obtain the short rectangular substrate M1; a second scribing part 103 for processing a second scribing line S2 in order to cut a unit substrate U from the short rectangular substrate M1; a second breaking part 104 for breaking along the second scribing line S2 to obtain each unit substrate U; a third scribing part 105 for processing a third scribing line S3 in order to dissect the terminal T of the second substrate for each unit substrate U after the second breaking; and a third breaking part 106 for breaking the end portion E covering the terminal area T by breaking along the third scribing line S3.

Description

Substrate processing system and substrate processing method

The present invention relates to a substrate processing system and a substrate processing method for separating a bonded substrate on which a brittle material substrate is bonded to obtain a bonded substrate of a plurality of unit substrates. More specifically, the present invention relates to a substrate processing system and a substrate processing method for bonding a substrate to be formed by forming a terminal region for external connection around a unit substrate when a unit substrate is obtained from a bonded substrate. The present invention is applied to processing such as a unit display panel of a liquid crystal display panel.

The liquid crystal display panel is manufactured by using two large-area glass substrates, forming a color filter CF (Color Filter) on one of the substrates, and forming a thin film transistor TFT (Thin Film Transistor) for driving the liquid crystal on the other substrate. And the terminal area for external connection. Next, a mother substrate in which the two substrates are bonded together and sealed with liquid crystals is formed, and then, the unit display panels are individually divided into one.

In general, in the process of dividing the mother substrate into a unit display panel, the breaking method using the cutter wheel is utilized. In this case, first, each of the two substrates (the CF side substrate and the TFT side substrate) constituting the mother substrate is pressed against the predetermined breaking position and moved relative to each other to engrave the scribe line (scribed groove). On each substrate. Next, the scribe line is biased to be deflected so as to be deflected, whereby the mother substrate is completely divided into unit display panels. Then, each unit display panel after the division is transferred to the subsequent process by the transfer robot arm.

Simultaneously performing a series of substrate processing on both the upper and lower sides and performing high efficiency A substrate processing system (substrate breaking system) and a substrate processing method have been disclosed (see Patent Document 1 and Patent Document 2). According to these documents, the next pair of cutter wheels simultaneously scribe both sides of the mother substrate from the up and down direction, and then the both sides are simultaneously broken by the steam cracking mechanism or the roller breaking mechanism to be divided into unit display panels. The unit display panels obtained in the above manner are taken out one by one and sent to subsequent processes.

The mother substrate is formed by bonding a first substrate (CF side substrate) on the color filter side and a second substrate (TFT side substrate) on the side where the TFT and the terminal region are formed, and sandwiching the sealing material.

The terminal area is an area where the signal line is connected between the TFT and the external device, so the terminal area must be exposed. Therefore, when the mother substrate is divided into unit display panels, the portion of the first substrate (CF side substrate) facing the terminal region is along the end side of the terminal region opposite to the side connecting the TFTs (ie, the unit) The periphery of the display panel is divided, and the required width (terminal width) for mounting the signal line from the outer end side of the terminal region is cut off as an end material.

Fig. 12 is a plan view showing an example of a substrate arrangement of a mother substrate for a liquid crystal display panel. In the figure, a total of eight unit display panels U are arranged on the mother substrate M. Further, Fig. 12(a) shows a case where the terminal region T of the unit display panel U cut from the mother substrate M is formed on one of the four sides, and Fig. 12(b) shows the case of two sides, Fig. 12 (c) ) shows the situation on three sides.

Moreover, FIG. 13 is a view (top view, front view, right side view) of the terminal region T formed on the unit display panel U cut out from the mother substrate M of FIG. 13(a) shows the unit display panel U in which the terminal region T is formed on one of the terminals, and FIG. 13(b) shows the unit display panel U in which the terminal region T is formed on the two terminals of the two sides, FIG. 13 (FIG. 13) c) The unit display panel U in which the terminal region T is formed at three terminals of three sides. In addition, there are terminal areas in addition to this. A four-terminal display panel formed on four sides. The number of sides forming the terminal area is selected in accordance with the number of pixels included in the unit display panel U.

When the mother substrate is divided, as shown in FIG. 14, two types of cut surfaces are formed in the vicinity of the boundary between the adjacent unit display panels U1 and U2.

One of them is a cut surface in which the two substrates are separated (completely cut) so that the end faces of the first substrate G1 and the second substrate G2 are aligned, and this is referred to as an aligned cut surface Ca. The alignment cut surface Ca is a surface that completely separates the unit display panel U1 from the unit display panel U2.

The other is to cut the cut surface of the first substrate G1 (semi-cut) from the position where the alignment cut surface Ca is separated from the terminal width W, and this is referred to as a terminal cut surface Cb. The terminal cut surface Cb is a cut surface that is formed by exposing the terminal region T to the break. Further, the first substrate G1 between the aligned cut surface Ca and the terminal cut surface Cb generates the end portion E.

The scribed processing of the alignment cut surface Ca and the terminal cut surface Cb is generally performed in the following manner.

As shown in Fig. 15 (a), the cutter wheel K1 is press-contacted to the position of the aligned cut surface Ca on the side of the first substrate G1, and the cutter wheel K2 is crimped to the aligned cut surface Ca of the second substrate G2 side. Position for the first scoring process. At the time of the first scribing process, since there is no stress in the vicinity of the alignment cut surface Ca, the grooves of the scribe lines are formed on both the first substrate G1 and the second substrate G2 without any problem. A groove of depth corresponding to the crimping force.

Next, as shown in FIG. 15(b), the cutter wheel K1 is pressed against the terminal cut surface Cb of the first substrate G1, and the support roller K3 (roller having a flat surface) is pressed against the cutter wheel K1. A second scribe process is performed on the position of the surface of the second substrate G2. At the time of the second scoring process, the groove formed by the first scribing process is split, due to the groove and the mediation The influence of the sealing material between the two substrates is such that the vicinity of the terminal cut surface Cb is in a state in which compressive stress is applied. In other words, the alignment cut surface Ca of the first substrate G1 is split toward the terminal cut surface Cb side. However, since the stress and the sealing member prevent the opening force, the crack in the terminal cut surface Cb is prevented from extending in the depth direction. .

Therefore, in the second scribe process, the groove of the scribe line cannot be formed deeper than the terminal cut surface Cb of the first substrate G1. Further, if the pressing force of the cutter wheel is made strong against the stress of the substrate, there is a problem that glass swarf or cracks occur in the second substrate below. In particular, in the case where the thickness of the mother substrate is as thin as 0.05 to 0.2 mm, even if the substrate is only subjected to a small external force, the substrate is easily cracked, so that a strong pressing force cannot be imparted. Therefore, the scribe line of the terminal cut surface Cb is not necessarily formed to a depth at which the first substrate G1 is completely separated, and is suppressed to a limited depth (for example, a depth of about 7 to 80% of the sheet thickness) to prevent the occurrence of defects.

As a result, as shown in FIG. 15(c), when the unit display panels U1 and U2 are separated from the alignment cut surface Ca, the end portion E adheres to the terminal cut surface Cb and remains.

Patent Document 1: International Publication WO2005/087458

Patent Document 2: International Publication WO2002/057192

In recent years, from the viewpoint of effective use of materials or reduction in thickness of a liquid crystal display device, it is required to make the thickness of the mother substrate thinner, and specifically, to make the first substrate G1 and the second substrate G2. The thickness is about 0.05 to 0.2 mm. Moreover, the width of the terminal region formed in the unit display panel, that is, the width of the terminal is also narrowed, and specifically, it is as small as about 1 to 2 mm.

However, as described above, if the terminal width is narrowed to 1 to 2 mm, it is not easy to be unbiased. The scribed line for forming the terminal cut surface Cb is poorly and precisely distanced.

Accordingly, the present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing system and a substrate processing method capable of removing a bonded substrate covering an end portion of a terminal region with high precision.

In order to achieve the above object, the present invention is directed to the following technical means. In the substrate processing system of the present invention, the unit substrate having the terminal region at least one side is cut from the mother substrate to which the first substrate and the second substrate are bonded, and the first scribing portion is provided. Processing, by the first substrate and the second substrate, a first scribe line for cutting a plurality of unit substrates arranged in a row from the mother substrate; the first rupture portion, along the first scribe The line is broken to obtain a short rectangular substrate; the second scribed portion is processed for the first substrate and the second substrate to cut a second scribe line of the unit substrate from the short rectangular substrate; the second rupture portion is borrowed Breaking along the second scribe line to obtain each unit substrate; the third scribe portion, for each unit substrate, is processed at a position opposite to the terminal region of the first substrate for being placed in the second a third scribe line of the terminal region of the substrate; and a third rupture portion along which the third scribe line is broken to break the end portion of the first substrate covering the terminal region.

According to the present invention, as described above, the short rectangular substrate is cut from the mother substrate, and the unit substrate is further cut out from the short rectangular substrate, and the third scribe line S3 for forming the terminal region is formed. Therefore, compared to the processing (a plurality of unit substrates) In the case of a large-area mother substrate, the processing range of the third scribe line S3 for forming the terminal region, that is, the rotational distance of the cutter wheel can be greatly shortened. Thereby, even in the terminal region having a small width of about 2 mm, the moving distance of the cutter wheel is short, so that the entire length of the third scribe line S3 can be scored with high precision.

Further, the mother substrate is first divided into a unit substrate, and then the processing terminal region is formed. The three-scribe line S3 is removed to remove the end material portion, so that the terminal region is covered by the end portion portion until the unit substrate is formed, and the terminal region is protected from damage during the substrate transfer.

In the above invention, the third splitting portion includes: a rotating body that is in contact with the end material portion; and a pressing member that presses the surface of the first substrate opposite to the end portion of the portion with the third scribe line; The broken rod may be disposed on the second substrate side at a position opposite to the third scribe line, and may be pressed against the surface of the second substrate.

According to this, the end portion is completely divided by the rupture rod pressing, and the rotating body is brought into rotational contact, whereby the end portion is pulled away from the body portion of the unit substrate, and the end portion can be surely removed.

Further, in the above-described substrate processing system, the first scribed portion and the second scribed portion may be used in combination, and the first rupture portion and the second rupture portion may be used together, and the configuration of the processing system may be reduced in size.

According to another aspect of the present invention, in the substrate processing method of the present invention, the unit substrate having the terminal region at least one side is cut from the mother substrate to which the first substrate and the second substrate are bonded, and is characterized by the following steps a first scribing step of processing the first substrate and the second substrate to cut a first scribe line of the short rectangular substrate in which the plurality of unit substrates are arranged in a row from the mother substrate; Breaking along the first scribe line to obtain a short rectangular substrate; and second dicing step, processing the first substrate and the second substrate to cut a second scribe line of the unit substrate from the short rectangular substrate; a second severing step of severing along the second scribe line to obtain each unit substrate; and a third scribe step for processing each unit substrate at a position opposite to the terminal region of the first substrate a third scribe line for distinguishing the terminal regions disposed on the second substrate; and a third cleavage step along which the third scribe line is broken to cover the end plates of the first substrate of the terminal region Partially broken.

According to this, as described above, since the rotation distance of the cutter wheel can be shortened, the entire length of the third scribe line S3 can be accurately scribed, and the terminal region is covered by the end material portion and protected until the unit substrate is formed. It can reduce defects in the terminal area during substrate transfer.

10‧‧‧End material removal mechanism (terminal area processing device)

12‧‧‧Substrate holding member

15‧‧‧ Pressing members

16‧‧‧Rotating body

17‧‧‧Break

18‧‧‧Rotating wheel

20‧‧‧Rotating belt

21‧‧‧Exfoliation members

Ca‧‧‧Aligned cut surface

Cb‧‧‧ terminal cut surface

G1‧‧‧First substrate (CF side substrate)

G2‧‧‧Second substrate (TFT side substrate)

E‧‧‧End material section

M‧‧‧ mother substrate

Scribing in the direction of S1‧‧‧Y

S2‧‧‧X direction marking

S3‧‧‧Drawing line for terminal area formation

T‧‧‧Terminal area

U‧‧‧unit display panel

1(a) and 1(b) are layout diagrams showing the overall configuration of a substrate processing system of the present invention.

Fig. 2 is a schematic plan view showing an example of a scoring apparatus used in the present invention.

Fig. 3 is a front elevational view showing the main part of the scoring apparatus for performing double-sided scribing.

4(a) to 4(f) are plan views showing the steps of cutting the unit display panel of the mother substrate.

Fig. 5 is a cross-sectional view showing an example of a breaking device used in the present invention.

Fig. 6 is a front elevational view showing the configuration of a main portion of a scribing device for performing single-sided scribing for forming a terminal region.

7(a) to (c) are front views showing the end material removing mechanism of the present invention.

8(a) and 8(b) are explanatory views showing the operation of the end material removing mechanism of Fig. 6.

9(a) and 9(b) are explanatory views showing another embodiment of the end material removing mechanism.

Fig. 10 (a) and (b) are explanatory views showing still another embodiment of the end material removing means.

Fig. 11 (a) and (b) are explanatory views showing still another embodiment of the end material removing means.

12(a) to (c) are plan views showing an example of a substrate arrangement of a mother substrate.

13(a) to (c) are explanatory views showing an example of formation of a terminal region formed on a unit display panel.

Figure 14 is a cross-sectional view showing a portion of a terminal region formed between adjacent unit display panels.

15(a) to (c) are cross-sectional views showing the processing steps of the terminal region.

Hereinafter, embodiments of the substrate processing system of the present invention will be described with reference to the drawings. 1 is a layout view showing the overall configuration of a substrate processing system of the present invention, and FIG. 1(a) is a layout diagram of a continuous mode, and FIG. 1(b) is a layout diagram of a simplified mode.

In this system, the two-side scribing device SW (the first scoring portion 101 and the second scribing portion 103) for simultaneously engraving the bonded substrate is scribed after the scribing device SW is used for both surfaces. The cracking device B (the first fracture portion 102 and the second fracture portion 104) on which the substrate is broken, and the single-sided scribe device SS (the first surface-only portion) The third scribe portion 105) and the end portion of the end portion scribed by the single-side scribe device SS are broken, and the terminal exposing device BB for removing the separated end portion is attached. The third splitting portion 106) is configured.

In the inline mode of Fig. 1(a), the scribing device SW (first scribing portion 101), the cracking device B (first fissure portion 102), and the scribing device SW for both sides (second Scribe 103), rupture device B (second rupture portion 104), single-sided scribe device SS (third scribe portion 105), and terminal exposure rupture device BB (third rupture portion 106) According to the tandem arrangement, the substrates are processed while being transported sequentially in a single direction.

In the simplified mode of Fig. 1(b), the scribing device SW (using both the first scoring portion 101 and the second scoring portion 103) and the rupturing device B (both the first rupture portion 102 and the second rupture) are used for both surfaces. The part 104), the single-sided scribe device SS (third scribe portion 105), and the terminal exposure rupture device BB (third rupture portion 106) are arranged in series, and the substrate can be used on both sides with the scribing device SW Move back and forth with the breaking device B.

Then, the both sides of the sculpt device SW and the rupturing device B are separated from each other by the short rectangular substrate into a unit substrate, and then the single-sided scribe device SS and the terminal exposure cleavage device BB are used. The processing for forming the terminal region is performed.

In addition, in FIGS. 1(a) and 1(b), a transport mechanism (transport roller, for transporting between devices) The rotary table or the substrate reversing mechanism (reverse arm) that reverses the substrate is attached to a necessary portion, but the illustration is omitted. That is, in Fig. 1(a), in addition to the transport rollers provided between the respective devices, a rotary table that rotates the substrate by 90 degrees between the first splitting portion 102 and the second scribing portion 103 is disposed. The first splitting portion 102 and the second splitting portion 104 are provided with a reversing mechanical arm for breaking both surfaces and reversing the substrate upside down.

Further, in Fig. 1(b), in addition to the transport roller that transports between the devices, a rotary table that rotates the substrate by 90 degrees in the first scribing portion 101 (which also serves as the second scribing portion 103) is disposed. Further, an inversion robot arm that vertically reverses the substrate in the first fracture portion 102 and the second fracture portion 104 is provided.

The mother substrate M to be processed in the present system has a substrate structure in which a first substrate (CF side substrate) and a second substrate (TFT side substrate) are bonded together. Here, as shown in FIG. 4( a ), the unit display panel U cuts the unit display panel U from the mother substrate M arranged in two rows in the X direction and arranged in four rows in the Y direction, and the respective units are cut out. A case where one of the four peripherals of the display panel U is peripherally processed for the external connection terminal region T will be described. Further, the imaginary line L indicated by the two-dot chain line in Fig. 4 indicates the scribed line, and the XY direction in the present specification is as shown in the drawing.

2 is a plan view schematically showing a two-face scribing device SW and a single-sided scribing device SS for forming a score line on the mother substrate M. 3 is a front view of the two-sided scoring device SW, and FIG. 6 is a front view of the single-sided scoring device SS.

The scribing device SW and the SS are provided with a pair of belt conveyors 2a and 2b before and after transporting the mother substrate M from the substrate carrying-in side to the substrate carrying-out side in the Y direction, and are carried out during the substrate transport between the belt conveyors 2a and 2b. Characterization processing.

The belt conveyors 2a, 2b before and after the two-sided scribing device SW shown in Fig. 3 The upper cutter wheel 3a and the lower cutter wheel 3b are disposed to sandwich the mother substrate M from above and below. Each of the cutter wheels 3a, 3b is held by the scribing heads 4, 4, and can be moved up and down to press the mother substrate M with a set pressing force, and can be pressed along the beam 5, 5 while pressing the surface of the mother substrate M toward FIG. The X direction rotates.

Further, the single-sided scribing device SS for performing the dicing process for forming the terminal region shown in FIG. 6 is used instead of the lower cutter wheel 3b of FIG. 3, and the flat surface is used to support the substrate (unit display panel U). Roller 8.

The mother substrate M is scored and broken in the following steps.

First, the mother substrate M shown in FIG. 4(a) is scored along the scribe line L along all the Y directions by the cutter wheels 3a, 3b above the scribing device SW, and then, as shown in FIG. As shown in FIG. 4(b), the scribe line S1 for cutting is processed on the substrate M. After that, the mother substrate M is sent to the cracking device B, and is cut off from the above-described scribe line S1, and as shown in FIG. 4(c), a rectangular short rectangular substrate M1 in which four unit display panels U are arranged in series is cut. .

As the breaking device B used in the present invention, a generally known one can be used. For example, as shown in Fig. 5, the pair of right and left receiving portions 6, 6 which receive the short rectangular substrate M1 from below by the scribe line S1 and the split rod 7 which descends from the upper direction toward the scribe line S1 are formed, and are broken. The rod 7 presses the score line S1 to deflect the substrate M1 to perform cracking. Further, the splitting system is performed by turning the substrate M1 upside down using a reversing robot arm (not shown).

Next, the cut short rectangular substrate M1 is rotated by 90 degrees on a horizontal plane. The rotation of the substrate is performed by a rotating table (not shown). Next, the scribes of all the scribe lines L along the X direction are performed by the upper and lower cutter wheels 3a, 3b. Thereby, as shown in FIG. 4(d), the scribe line S2 for dividing is cut in the upper (X direction) of the short rectangular substrate M1. After that, the short rectangular substrate M1, Similarly to the above, it is sent to the breaking device B, and as shown in Fig. 4(e), the unit display panel U is divided from the scribe line S2.

Thereafter, the unit display panel U is sent to the single-sided scribing device SS (see FIG. 6) for forming the terminal region, and as shown in FIG. 4(f), the half-cut line S3 forming the terminal region T is processed. On the first substrate G1. At this time, the scribe line S3 is processed at a position close to one of the four periphery of the unit display panel U, for example, from the periphery to the inside by 2 mm.

In the processing, the unit display panel U is placed on the front side as shown in FIG. 6 , and the upper side is placed on the first substrate G1 (CF side substrate) and the lower side is placed on the second substrate G2 (TFT side substrate). On the conveyor 6. Next, the upper cutter wheel 3a is lowered to the surface of the first substrate G1 to process the score line S3. At this time, the lower surface (the second substrate G2 side) of the unit display panel U opposed to the upper cutter wheel 3a is received by the support roller 8 whose circumference is flat. This support roller 8 is previously set in the lower beam 5 of the scoring device SS. Further, when the scribing process is performed, the groove depth of the score line S3 is made to be about 80% of the thickness of the first substrate G1, and unintended cracks due to excessive pressing are not generated.

In the above manner, after the mother substrate M is cut into the unit display panel U, the processing terminal region T is formed with the scribe line S3, whereby the scribe can be greatly shortened compared to the case of processing the large-area mother substrate M. The processing range of the line S3, that is, the rotational distance of the cutter wheel 3a. Thereby, even in the terminal region having a small width of about 2 mm, since the rotational distance of the cutter wheel is short, the entire length of the score line S3 can be scored with the set accuracy.

Further, the terminal region T is not exposed until immediately before the step described below, and is covered by the end material E (see FIG. 7 and the like), so that it can be protected from collision or the like during transportation.

The unit display panel U for forming the scribe line S3 of the terminal region T is processed, and then the end portion E covering the terminal region T is removed, and is sent to the end material shown in FIG. Mechanism 10 (terminal area processing device).

As shown in FIGS. 7( a ) to 7 ( c ), the end material removing mechanism 10 includes an adsorption unit display panel U and lifts up, and the terminal region T (see FIG. 6 ) faces downward while pivoting with the pivot 11 as a fulcrum. The substrate holding member 12 is in a vertical posture. The substrate holding member 12 can be formed, for example, by an adsorption plate having a plurality of air suction holes on the adsorption surface. Further, the substrate holding member 12 can be moved up and down by the cylinder 13, and the cylinder 13 can be moved along the rail 14 to the end material removing position. In the example shown in the figure, although it moves in the X direction orthogonal to the Y direction, it may move in the Y direction.

Further, as shown in FIG. 8, the end material removing mechanism 10 is provided with a pressing member 15 that presses the vicinity of the scribe line S3 formed on the first substrate G1 of the unit display panel U that is vertically erected, and sandwiches the end member. The scribe line S3 rotates the rotating body 16 contacting the surface of the end portion E in the direction in which the end portion E is pulled in the vicinity of the scribe line S3, and the pair of scribe lines S3 disposed on the side of the second substrate G2. The plate-shaped splitting bar 17 is pressed against the surface of the second substrate G2. Further, in the embodiment of Fig. 8, a circular rotating roller 18 is used as the rotating body 16.

The split rod 17 presses the surface of the second substrate G2 on the opposite side to the position of the scribe line S3 of the first substrate G1 sandwiched between the pressing member 15 and the rotating body 16, whereby the unit display panel U is placed on the pressing member 15 and the rotating body 16 are deflected so that the crack of the scribing line S3 is soaked in the thickness direction of the first substrate G1 and completely broken. The rotating body 16 rotates counterclockwise after the breaking lever 17 operates, and the end portion E is peeled off from the unit display panel U and falls downward by contact with the rotating body 16. The surface of the rotating body 16 is preferably made of a material having a large friction coefficient such as rubber to easily peel the end portion E by a rotational contact.

In the above manner, the unit display panel U in which one terminal of the terminal region T is formed at one periphery is completed.

In the above embodiment, the circular rotating roller 18 is used as the rotating body 16, but as shown in Fig. 9, the rotating belt 20 may be formed to rotate between the two wheel bodies 19, 19. In this case, one portion of the rotating belt 20 is in contact with the end portion E of the unit display panel U that is vertically erected.

Further, in the present invention, the surface of the rotating body 16 may be formed of an adhesive material. Thereby, the end material portion E can be removed from the unit display panel U more surely. In this case, as shown in FIGS. 10(a) and 10(b), the end portion E of the rotating body 16 is abutted against the shovel-like peeling member 21 at a position separated from the unit display panel U, and is rotated from the rotating body 16. Peeling is preferred. Further, as shown in FIG. 10(b), a cleaning tank 22 for cleaning a small amount of glass scraps or the like adhering to the surface of the rotating body 16 is provided in advance, and a part of the rotating body 16 is dive into the cleaning tank 22 to be washed. .

In the above embodiment, the unit holding panel 12 removes the end portion E in a vertically erected posture by the substrate holding member 12, so that the end portion E can be easily peeled off and dropped downward by the rotational contact of the rotating body 16 by its own weight. . Further, the scraps of fine glass swarf or the like which are generated during the dicing process are also dropped by the weight of the end portion E at the same time as the end portion E, and a good product can be obtained.

However, in the present invention, as shown in FIG. 11, the unit display panel U may be maintained in a horizontal posture, and the end portion E may be removed by the rotating body 16 as described above. In this case, the first substrate G1 on which the scribe line S3 is formed is placed on the lower side, and the portion of the scribe line S3 is placed on the platen 23 so as to be exposed from the platen 23 of the support unit display panel U. on. Next, the split rod 17 is placed on the upper side, and the pressing member 15 and the rotating body 16 are disposed in the same positional relationship as in the above embodiment. Next, the split rod 17 is lowered, the score line S3 of the first substrate G1 is broken, and the end portion E is removed by the rotation of the rotary body 16.

In the above embodiment, the unit display panel of one terminal is described, but In the case of the two-terminal, three-terminal, and four-terminal unit display panels, the step of forming the terminal region corresponding to the number of terminal regions and the step of removing the end portion may be performed.

In the above, the present invention is not limited to the above-described embodiments, and the present invention is not limited to the embodiments described above, and may be appropriately modified or changed without departing from the scope of the invention.

The substrate processing system and the substrate processing method of the present invention can be used for processing a unit display panel having a terminal region portion on at least one side of the periphery.

101‧‧‧The first characterization department

102‧‧‧First Broken Section

103‧‧‧The second characterization department

104‧‧‧Second Broken

105‧‧‧The third characterization department

106‧‧‧The third fracture

B‧‧‧cracking device

BB‧‧‧ terminal exposure device

SS‧‧‧Single-sided scoring device

SW‧‧‧Two-sided scoring device

Claims (3)

A substrate processing system for cutting a unit substrate having at least one side of a terminal region from a mother substrate to which a first substrate and a second substrate are bonded, wherein the first scribing portion is provided for The first scribe line of the short rectangular substrate in which the plurality of unit substrates are arranged in a row is processed on the first substrate and the second substrate; the first rupture portion is performed along the first scribe line Breaking to obtain a short rectangular substrate; the second scribing portion is configured to process the first substrate and the second substrate by cutting the second scribe line of the unit substrate from the short rectangular substrate; the second rupture portion, Breaking along the second scribe line to obtain each unit substrate; the third scribe portion is for each unit substrate, and the third scribe line processing for distinguishing the terminal region provided on the second substrate Positioning the first substrate opposite the terminal region; and the third breaking portion is broken along the third scribe line to break the end portion of the first substrate covering the terminal region. The substrate processing system of claim 1, wherein the third fracture portion includes: a rotating body in contact with the end material portion; and a pressing member that presses the third scribe line and the end portion a surface of the first substrate on the opposite side; and a cracking bar disposed on the second substrate side opposite to the third scribe line to press the surface of the second substrate. A substrate processing method is a unit substrate in which at least one side portion includes a terminal region is cut out from a mother substrate to which a first substrate and a second substrate are bonded, and is characterized in that: a first scribing step is used Cutting a plurality of unit substrates from the mother substrate into a row The first scribe line of the short rectangular substrate is processed on the first substrate and the second substrate; the first cleavage step is performed by breaking along the first scribe line to obtain a short rectangular substrate; and the second scribe step a second scribe line for cutting a unit substrate from the short rectangular substrate is processed on the first substrate and the second substrate; and a second cleavage step is performed by severing along the second scribe line Obtaining a unit substrate; a third scribing step, for each unit substrate, a third scribe line for distinguishing between the terminal regions of the second substrate is processed at a position of the first substrate opposite to the terminal region; And a third cracking step along which the third scribe line is broken to break the end portion of the first substrate covering the terminal region.