TW201441168A - Substrate processing system and substrate processing method - Google Patents

Substrate processing system and substrate processing method Download PDF

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TW201441168A
TW201441168A TW103102207A TW103102207A TW201441168A TW 201441168 A TW201441168 A TW 201441168A TW 103102207 A TW103102207 A TW 103102207A TW 103102207 A TW103102207 A TW 103102207A TW 201441168 A TW201441168 A TW 201441168A
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substrate
scribe line
unit
terminal region
scribing
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Keisuke Tominaga
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Mitsuboshi Diamond Ind Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

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Abstract

Provided are a substrate processing system and a substrate processing method for processing with high precision a terminal area of a laminated substrate having the terminal area on at least one side of the periphery, comprising: a first scribing part 101 for processing a first scribing line S1 in order to cut a short rectangular substrate M1 from a mother substrate M; a first breaking part 102 for breaking along the first scribing line S1 to obtain the short rectangular substrate M1; a second scribing part 103 for processing a second scribing line S2 in order to cut a unit substrate U from the short rectangular substrate M1; a second breaking part 104 for breaking along the second scribing line S2 to obtain each unit substrate U; a third scribing part 105 for processing a third scribing line S3 in order to dissect the terminal T of the second substrate for each unit substrate U after the second breaking; and a third breaking part 106 for breaking the end portion E covering the terminal area T by breaking along the third scribing line S3.

Description

基板加工系統及基板加工方法 Substrate processing system and substrate processing method

本發明係關於一種將貼合脆性材料基板之貼合基板加以分斷以獲得複數個單位基板之貼合基板之基板加工系統及基板加工方法。更詳細而言,關於一種在從貼合基板獲得單位基板時,以在單位基板周邊形成外部連接用之端子區域之方式進行分斷之貼合基板之基板加工系統及基板加工方法。本發明係利用於例如液晶顯示面板之單位顯示面板等之加工。 The present invention relates to a substrate processing system and a substrate processing method for separating a bonded substrate on which a brittle material substrate is bonded to obtain a bonded substrate of a plurality of unit substrates. More specifically, the present invention relates to a substrate processing system and a substrate processing method for bonding a substrate to be formed by forming a terminal region for external connection around a unit substrate when a unit substrate is obtained from a bonded substrate. The present invention is applied to processing such as a unit display panel of a liquid crystal display panel.

液晶顯示面板之製造,係使用二片大面積玻璃基板,在一方之基板上形成彩色濾光片CF(Color Filter),在另一方之基板上形成驅動液晶之薄膜電晶體TFT(Thin Film Transistor)及外部連接用之端子區域。接著,形成將此等二片基板加以貼合且已封入液晶之母基板,接著,分斷成一個一個之單位顯示面板。 The liquid crystal display panel is manufactured by using two large-area glass substrates, forming a color filter CF (Color Filter) on one of the substrates, and forming a thin film transistor TFT (Thin Film Transistor) for driving the liquid crystal on the other substrate. And the terminal area for external connection. Next, a mother substrate in which the two substrates are bonded together and sealed with liquid crystals is formed, and then, the unit display panels are individually divided into one.

一般而言,在將母基板分斷成單位顯示面板之製程中,係利用使用刀輪之分斷方法。此場合,首先,對構成母基板之二片基板(CF側基板與TFT側基板)之各個將刀輪壓接於分斷預定位置並使其相對移動以將刻劃線(刻劃槽)刻於各基板。接著,沿刻劃線以使其撓曲之方式施力進行裂斷,據以將母基板完全分斷成各單位顯示面板。接著,藉由搬送機械臂將分斷後之每一個單位顯示面板移送至後續製程。 In general, in the process of dividing the mother substrate into a unit display panel, the breaking method using the cutter wheel is utilized. In this case, first, each of the two substrates (the CF side substrate and the TFT side substrate) constituting the mother substrate is pressed against the predetermined breaking position and moved relative to each other to engrave the scribe line (scribed groove). On each substrate. Next, the scribe line is biased to be deflected so as to be deflected, whereby the mother substrate is completely divided into unit display panels. Then, each unit display panel after the division is transferred to the subsequent process by the transfer robot arm.

對上下二面同時進行此等一連串之基板加工並高效率進行 加工之基板加工系統(基板分斷系統)及基板加工方法已有揭示(參照專利文獻1、專利文獻2)。根據此等文獻,以上下一對刀輪從上下方向對母基板兩面同時進行刻劃,接著藉由蒸氣裂斷機構或滾輪裂斷機構對兩面同時進行裂斷以分斷成單位顯示面板。將以上述方式獲得之單位顯示面板逐一取出並送往後續製程。 Simultaneously performing a series of substrate processing on both the upper and lower sides and performing high efficiency A substrate processing system (substrate breaking system) and a substrate processing method have been disclosed (see Patent Document 1 and Patent Document 2). According to these documents, the next pair of cutter wheels simultaneously scribe both sides of the mother substrate from the up and down direction, and then the both sides are simultaneously broken by the steam cracking mechanism or the roller breaking mechanism to be divided into unit display panels. The unit display panels obtained in the above manner are taken out one by one and sent to subsequent processes.

母基板,係將形成有彩色濾光片側之第一基板(CF側基板)與形成有TFT及端子區域側之第二基板(TFT側基板),夾著密封材加以貼合而成。 The mother substrate is formed by bonding a first substrate (CF side substrate) on the color filter side and a second substrate (TFT side substrate) on the side where the TFT and the terminal region are formed, and sandwiching the sealing material.

端子區域係在TFT與外部機器之間連接訊號線之區域,因此必須使端子區域露出。因此,將母基板分斷成單位顯示面板時,對與端子區域對向之第一基板(CF側基板)之部位,沿著與連接TFT側相反側之端子區域之外端側(亦即單位顯示面板之周邊)進行分斷,且將用以從端子區域之外端側安裝訊號線之所需寬度(端子寬度)作為端材切除。 The terminal area is an area where the signal line is connected between the TFT and the external device, so the terminal area must be exposed. Therefore, when the mother substrate is divided into unit display panels, the portion of the first substrate (CF side substrate) facing the terminal region is along the end side of the terminal region opposite to the side connecting the TFTs (ie, the unit) The periphery of the display panel is divided, and the required width (terminal width) for mounting the signal line from the outer end side of the terminal region is cut off as an end material.

圖12係顯示液晶顯示面板用母基板之基板配置之一例之俯視圖。圖中,在母基板M上配置有合計8個單位顯示面板U。此外,圖12(a)係顯示從母基板M裁切之單位顯示面板U之端子區域T形成在周圍四邊中之一邊之情形,圖12(b)係顯示二邊之情形,圖12(c)係顯示三邊之情形。 Fig. 12 is a plan view showing an example of a substrate arrangement of a mother substrate for a liquid crystal display panel. In the figure, a total of eight unit display panels U are arranged on the mother substrate M. Further, Fig. 12(a) shows a case where the terminal region T of the unit display panel U cut from the mother substrate M is formed on one of the four sides, and Fig. 12(b) shows the case of two sides, Fig. 12 (c) ) shows the situation on three sides.

又,圖13係說明形成在從圖12之母基板M裁切出之單位顯示面板U之端子區域T之圖(俯視圖、前視圖、右側視圖)。其中,圖13(a)係顯示端子區域T形成在一邊之一端子之單位顯示面板U,圖13(b)係顯示端子區域T形成在二邊之二端子之單位顯示面板U,圖13(c)係顯示端子區域T形成在三邊之三端子之單位顯示面板U。又,除此以外亦有端子區域 形成在四邊之四端子顯示面板。形成端子區域之邊數係依據單位顯示面板U所含之像素數選擇。 Moreover, FIG. 13 is a view (top view, front view, right side view) of the terminal region T formed on the unit display panel U cut out from the mother substrate M of FIG. 13(a) shows the unit display panel U in which the terminal region T is formed on one of the terminals, and FIG. 13(b) shows the unit display panel U in which the terminal region T is formed on the two terminals of the two sides, FIG. 13 (FIG. 13) c) The unit display panel U in which the terminal region T is formed at three terminals of three sides. In addition, there are terminal areas in addition to this. A four-terminal display panel formed on four sides. The number of sides forming the terminal area is selected in accordance with the number of pixels included in the unit display panel U.

在將母基板加以分割時,如圖14所示,在相鄰之單位顯示面板U1,U2之邊界附近,形成二種類之切斷面。 When the mother substrate is divided, as shown in FIG. 14, two types of cut surfaces are formed in the vicinity of the boundary between the adjacent unit display panels U1 and U2.

其中一者,係以第一基板G1與第二基板G2之端面對齊之方式將兩基板加以分斷(全切斷)之切斷面,將此稱為對齊切斷面Ca。對齊切斷面Ca係使單位顯示面板U1與單位顯示面板U2完全分離之面。 One of them is a cut surface in which the two substrates are separated (completely cut) so that the end faces of the first substrate G1 and the second substrate G2 are aligned, and this is referred to as an aligned cut surface Ca. The alignment cut surface Ca is a surface that completely separates the unit display panel U1 from the unit display panel U2.

另一者,係在從對齊切斷面Ca離開端子寬度W之位置僅分斷第一基板G1(半切斷)之切斷面,將此稱為端子切斷面Cb。端子切斷面Cb係用以使端子區域T露出而分斷之切斷面。此外,在對齊切斷面Ca與端子切斷面Cb之間之第一基板G1產生端材部分E。 The other is to cut the cut surface of the first substrate G1 (semi-cut) from the position where the alignment cut surface Ca is separated from the terminal width W, and this is referred to as a terminal cut surface Cb. The terminal cut surface Cb is a cut surface that is formed by exposing the terminal region T to the break. Further, the first substrate G1 between the aligned cut surface Ca and the terminal cut surface Cb generates the end portion E.

上述對齊切斷面Ca以及端子切斷面Cb之刻劃加工,一般而言係以下述方式進行。 The scribed processing of the alignment cut surface Ca and the terminal cut surface Cb is generally performed in the following manner.

如圖15(a)所示,將刀輪K1壓接於第一基板G1側之對齊切斷面Ca之位置,且將刀輪K2壓接於第二基板G2側之對齊切斷面Ca之位置以進行第一次刻劃加工。在進行第一次刻劃加工之時點,由於在對齊切斷面Ca之附近不存在應力,因此在第一基板G1、第二基板G2之兩基板皆沒問題地形成刻劃線之槽,形成與壓接力對應之深度之槽。 As shown in Fig. 15 (a), the cutter wheel K1 is press-contacted to the position of the aligned cut surface Ca on the side of the first substrate G1, and the cutter wheel K2 is crimped to the aligned cut surface Ca of the second substrate G2 side. Position for the first scoring process. At the time of the first scribing process, since there is no stress in the vicinity of the alignment cut surface Ca, the grooves of the scribe lines are formed on both the first substrate G1 and the second substrate G2 without any problem. A groove of depth corresponding to the crimping force.

接著,如圖15(b)所示,使刀輪K1壓接於第一基板G1之端子切斷面Cb之位置,使支援滾輪K3(周面平坦之滾輪)壓接於與該刀輪K1對向之第二基板G2表面之位置,進行第二次刻劃加工。在進行第二次刻劃加工之時點,藉由第一次刻劃加工形成之刻劃線之槽裂開,由於該槽與介 於兩基板之間之密封材之影響,端子切斷面Cb之附近成為已施加壓縮應力之狀態。亦即,第一基板G1之對齊切斷面Ca往端子切斷面Cb側裂開,但由於上述應力與密封材阻止其開放力,因此妨礙在端子切斷面Cb之裂痕往深度方向之伸展。 Next, as shown in FIG. 15(b), the cutter wheel K1 is pressed against the terminal cut surface Cb of the first substrate G1, and the support roller K3 (roller having a flat surface) is pressed against the cutter wheel K1. A second scribe process is performed on the position of the surface of the second substrate G2. At the time of the second scoring process, the groove formed by the first scribing process is split, due to the groove and the mediation The influence of the sealing material between the two substrates is such that the vicinity of the terminal cut surface Cb is in a state in which compressive stress is applied. In other words, the alignment cut surface Ca of the first substrate G1 is split toward the terminal cut surface Cb side. However, since the stress and the sealing member prevent the opening force, the crack in the terminal cut surface Cb is prevented from extending in the depth direction. .

因此,在第二次刻劃加工,無法對第一基板G1之端子切斷面Cb較深地形成刻劃線之槽。此外,若抗衡基板之應力而使刀輪之按壓力變強,則會有產生玻璃屑或往下方之第二基板產生龜裂等之問題。尤其是,在母基板之厚度薄至0.05~0.2mm之情形,即使僅承受較小外力基板亦容易裂開,因此無法賦予較強按壓力。是以,端子切斷面Cb之刻劃線並不一定形成至將第一基板G1完全分離之深度,抑制在有限深度(例如板厚之7~8成程度之深度),防止缺陷之產生。 Therefore, in the second scribe process, the groove of the scribe line cannot be formed deeper than the terminal cut surface Cb of the first substrate G1. Further, if the pressing force of the cutter wheel is made strong against the stress of the substrate, there is a problem that glass swarf or cracks occur in the second substrate below. In particular, in the case where the thickness of the mother substrate is as thin as 0.05 to 0.2 mm, even if the substrate is only subjected to a small external force, the substrate is easily cracked, so that a strong pressing force cannot be imparted. Therefore, the scribe line of the terminal cut surface Cb is not necessarily formed to a depth at which the first substrate G1 is completely separated, and is suppressed to a limited depth (for example, a depth of about 7 to 80% of the sheet thickness) to prevent the occurrence of defects.

上述結果,如圖15(c)所示,從對齊切斷面Ca將單位顯示面板U1,U2分離時,端材部分E附著於端子切斷面Cb而殘留。 As a result, as shown in FIG. 15(c), when the unit display panels U1 and U2 are separated from the alignment cut surface Ca, the end portion E adheres to the terminal cut surface Cb and remains.

專利文獻1:國際公開WO2005/087458號公報 Patent Document 1: International Publication WO2005/087458

專利文獻2:國際公開WO2002/057192號公報 Patent Document 2: International Publication WO2002/057192

近年來,液晶顯示面板,從素材之有效利用或使液晶顯示裝置之厚度變薄之觀點觀之,要求使母基板之厚度更薄,具體而言,謀求使第一基板G1以及第二基板G2之厚度為0.05~0.2mm程度。又,關於形成在單位顯示面板之端子區域之寬度、亦即端子寬度,亦謀求狹小化,具體而言,謀求小至1~2mm程度。 In recent years, from the viewpoint of effective use of materials or reduction in thickness of a liquid crystal display device, it is required to make the thickness of the mother substrate thinner, and specifically, to make the first substrate G1 and the second substrate G2. The thickness is about 0.05 to 0.2 mm. Moreover, the width of the terminal region formed in the unit display panel, that is, the width of the terminal is also narrowed, and specifically, it is as small as about 1 to 2 mm.

然而,如上述,若端子寬度狹小化至1~2mm,則不易無偏 差地精密地長距離刻劃用以形成端子切斷面Cb之刻畫線。 However, as described above, if the terminal width is narrowed to 1 to 2 mm, it is not easy to be unbiased. The scribed line for forming the terminal cut surface Cb is poorly and precisely distanced.

因此,本發明係有鑑於上述課題而構成,其目的在於提供一種可高精度地除去覆蓋端子區域之端材部分之貼合基板之基板加工系統及基板加工方法。 Accordingly, the present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing system and a substrate processing method capable of removing a bonded substrate covering an end portion of a terminal region with high precision.

為了達成上述目的,本發明講求下述技術手段。亦即,本發明之基板加工系統,係從貼合有第一基板與第二基板之母基板裁切在至少一邊部具備端子區域之單位基板,其特徵在於,具備:第一刻劃部,對第一基板與第二基板加工用以從該母基板裁切複數個單位基板排列成一列之短矩形基板之第一刻劃線;第一裂斷部,藉由沿著該第一刻劃線進行裂斷以獲得短矩形基板;第二刻劃部,對第一基板與第二基板加工用以從該短矩形基板裁切單位基板之第二刻劃線;第二裂斷部,藉由沿著該第二刻劃線進行裂斷以獲得各單位基板;第三刻劃部,對各單位基板,在第一基板之與該端子區域對向之位置加工用以將設在第二基板之端子區域區分之第三刻劃線;以及第三裂斷部,沿著該第三刻劃線進行裂斷以將覆蓋該端子區域之第一基板之端材部分加以分斷。 In order to achieve the above object, the present invention is directed to the following technical means. In the substrate processing system of the present invention, the unit substrate having the terminal region at least one side is cut from the mother substrate to which the first substrate and the second substrate are bonded, and the first scribing portion is provided. Processing, by the first substrate and the second substrate, a first scribe line for cutting a plurality of unit substrates arranged in a row from the mother substrate; the first rupture portion, along the first scribe The line is broken to obtain a short rectangular substrate; the second scribed portion is processed for the first substrate and the second substrate to cut a second scribe line of the unit substrate from the short rectangular substrate; the second rupture portion is borrowed Breaking along the second scribe line to obtain each unit substrate; the third scribe portion, for each unit substrate, is processed at a position opposite to the terminal region of the first substrate for being placed in the second a third scribe line of the terminal region of the substrate; and a third rupture portion along which the third scribe line is broken to break the end portion of the first substrate covering the terminal region.

本發明,如上述,從母基板裁切短矩形基板,進一步從短矩形基板裁切出單位基板後,加工端子區域形成用之第三刻劃線S3,因此相較於加工(複數個單位基板排列之)大面積之母基板之情形,可大幅縮短端子區域形成用之第三刻劃線S3之加工域、亦即刀輪之轉動距離。藉此,即使是2mm程度之小寬度之端子區域,刀輪之移動距離亦短,因此可在第三刻劃線S3之全長高精度地進行刻劃。 According to the present invention, as described above, the short rectangular substrate is cut from the mother substrate, and the unit substrate is further cut out from the short rectangular substrate, and the third scribe line S3 for forming the terminal region is formed. Therefore, compared to the processing (a plurality of unit substrates) In the case of a large-area mother substrate, the processing range of the third scribe line S3 for forming the terminal region, that is, the rotational distance of the cutter wheel can be greatly shortened. Thereby, even in the terminal region having a small width of about 2 mm, the moving distance of the cutter wheel is short, so that the entire length of the third scribe line S3 can be scored with high precision.

又,先將母基板分斷成成為單位基板,之後加工端子區域形成用之第 三刻劃線S3以除去端材部分,因此端子區域直至成為單位基板前一刻被端材部分覆蓋而受到保護,可減少在基板搬送中端子區域受損之缺陷。 Further, the mother substrate is first divided into a unit substrate, and then the processing terminal region is formed. The three-scribe line S3 is removed to remove the end material portion, so that the terminal region is covered by the end portion portion until the unit substrate is formed, and the terminal region is protected from damage during the substrate transfer.

上述發明中,第三裂斷部,具備:旋轉體,與該端材部分接觸;按壓構件,夾著該第三刻劃線按壓與該端材部分相反側之第一基板之表面;以及裂斷桿,配置在第二基板側之與該第三刻劃線對向之位置,按壓第二基板之表面亦可。 In the above invention, the third splitting portion includes: a rotating body that is in contact with the end material portion; and a pressing member that presses the surface of the first substrate opposite to the end portion of the portion with the third scribe line; The broken rod may be disposed on the second substrate side at a position opposite to the third scribe line, and may be pressed against the surface of the second substrate.

據此,以裂斷桿按壓將端材部分完全分斷後,使旋轉體旋轉接觸,藉此將端材部分從單位基板之本體部分拉開之力作用,可確實地除去端材部分。 According to this, the end portion is completely divided by the rupture rod pressing, and the rotating body is brought into rotational contact, whereby the end portion is pulled away from the body portion of the unit substrate, and the end portion can be surely removed.

此外,上述基板加工系統中,兼用第一刻劃部與第二刻劃部,且兼用第一裂斷部與第二裂斷部,使加工系統之構成小型化亦可。 Further, in the above-described substrate processing system, the first scribed portion and the second scribed portion may be used in combination, and the first rupture portion and the second rupture portion may be used together, and the configuration of the processing system may be reduced in size.

又,另一觀點之本發明之基板加工方法,係從貼合有第一基板與第二基板之母基板裁切在至少一邊部具備端子區域之單位基板,其特徵在於,由下述步驟構成:第一刻劃步驟,對第一基板與第二基板加工用以從該母基板裁切複數個單位基板排列成一列之短矩形基板之第一刻劃線;第一裂斷步驟,藉由沿著該第一刻劃線進行裂斷以獲得短矩形基板;第二刻劃步驟,對第一基板與第二基板加工用以從該短矩形基板裁切單位基板之第二刻劃線;第二裂斷步驟,藉由沿著該第二刻劃線進行裂斷以獲得各單位基板;第三刻劃步驟,對各單位基板,在第一基板之與該端子區域對向之位置加工用以將設在第二基板之端子區域區分之第三刻劃線;以及第三裂斷步驟,沿著該第三刻劃線進行裂斷以將覆蓋該端子區域之第一基板之端材部分加以分斷。 According to another aspect of the present invention, in the substrate processing method of the present invention, the unit substrate having the terminal region at least one side is cut from the mother substrate to which the first substrate and the second substrate are bonded, and is characterized by the following steps a first scribing step of processing the first substrate and the second substrate to cut a first scribe line of the short rectangular substrate in which the plurality of unit substrates are arranged in a row from the mother substrate; Breaking along the first scribe line to obtain a short rectangular substrate; and second dicing step, processing the first substrate and the second substrate to cut a second scribe line of the unit substrate from the short rectangular substrate; a second severing step of severing along the second scribe line to obtain each unit substrate; and a third scribe step for processing each unit substrate at a position opposite to the terminal region of the first substrate a third scribe line for distinguishing the terminal regions disposed on the second substrate; and a third cleavage step along which the third scribe line is broken to cover the end plates of the first substrate of the terminal region Partially broken.

據此,如上述,可縮短刀輪之轉動距離,因此可在第三刻劃線S3之全長高精度地進行刻劃,且端子區域直至成為單位基板前一刻被端材部分覆蓋而受到保護,可減少在基板搬送中端子區域受損之缺陷。 According to this, as described above, since the rotation distance of the cutter wheel can be shortened, the entire length of the third scribe line S3 can be accurately scribed, and the terminal region is covered by the end material portion and protected until the unit substrate is formed. It can reduce defects in the terminal area during substrate transfer.

10‧‧‧端材除去機構(端子區域加工裝置) 10‧‧‧End material removal mechanism (terminal area processing device)

12‧‧‧基板保持構件 12‧‧‧Substrate holding member

15‧‧‧按壓構件 15‧‧‧ Pressing members

16‧‧‧旋轉體 16‧‧‧Rotating body

17‧‧‧裂斷桿 17‧‧‧Break

18‧‧‧旋轉滾輪 18‧‧‧Rotating wheel

20‧‧‧旋轉帶 20‧‧‧Rotating belt

21‧‧‧剝離構件 21‧‧‧Exfoliation members

Ca‧‧‧對齊切斷面 Ca‧‧‧Aligned cut surface

Cb‧‧‧端子切斷面 Cb‧‧‧ terminal cut surface

G1‧‧‧第一基板(CF側基板) G1‧‧‧First substrate (CF side substrate)

G2‧‧‧第二基板(TFT側基板) G2‧‧‧Second substrate (TFT side substrate)

E‧‧‧端材部分 E‧‧‧End material section

M‧‧‧母基板 M‧‧‧ mother substrate

S1‧‧‧Y方向之刻劃線 Scribing in the direction of S1‧‧‧Y

S2‧‧‧X方向之刻劃線 S2‧‧‧X direction marking

S3‧‧‧端子區域形成用之刻劃線 S3‧‧‧Drawing line for terminal area formation

T‧‧‧端子區域 T‧‧‧Terminal area

U‧‧‧單位顯示面板 U‧‧‧unit display panel

圖1(a)、(b)係顯示本發明之基板加工系統之整體構成之配置圖。 1(a) and 1(b) are layout diagrams showing the overall configuration of a substrate processing system of the present invention.

圖2係顯示本發明所用之刻劃裝置之一例之概略俯視圖。 Fig. 2 is a schematic plan view showing an example of a scoring apparatus used in the present invention.

圖3係顯示進行兩面刻劃之刻劃裝置之主要部分構成之前視圖。 Fig. 3 is a front elevational view showing the main part of the scoring apparatus for performing double-sided scribing.

圖4(a)~(f)係說明母基板之單位顯示面板裁切步驟之俯視圖。 4(a) to 4(f) are plan views showing the steps of cutting the unit display panel of the mother substrate.

圖5係顯示本發明所用之裂斷裝置之一例之剖面圖。 Fig. 5 is a cross-sectional view showing an example of a breaking device used in the present invention.

圖6係顯示進行端子區域形成用之單面刻劃之刻劃裝置之主要部分構成之前視圖。 Fig. 6 is a front elevational view showing the configuration of a main portion of a scribing device for performing single-sided scribing for forming a terminal region.

圖7(a)~(c)係顯示本發明之端材除去機構之前視圖。 7(a) to (c) are front views showing the end material removing mechanism of the present invention.

圖8(a)、(b)係顯示圖6之端材除去機構之動作之說明圖。 8(a) and 8(b) are explanatory views showing the operation of the end material removing mechanism of Fig. 6.

圖9(a)、(b)係顯示端材除去機構之另一實施例之說明圖。 9(a) and 9(b) are explanatory views showing another embodiment of the end material removing mechanism.

圖10(a)、(b)係顯示端材除去機構之又一實施例之說明圖。 Fig. 10 (a) and (b) are explanatory views showing still another embodiment of the end material removing means.

圖11(a)、(b)係顯示端材除去機構之再一實施例之說明圖。 Fig. 11 (a) and (b) are explanatory views showing still another embodiment of the end material removing means.

圖12(a)~(c)係顯示母基板之基板配置之一例之俯視圖。 12(a) to (c) are plan views showing an example of a substrate arrangement of a mother substrate.

圖13(a)~(c)係顯示形成在單位顯示面板之端子區域之形成例之說明圖。 13(a) to (c) are explanatory views showing an example of formation of a terminal region formed on a unit display panel.

圖14係顯示形成在相鄰單位顯示面板間之端子區域部分之剖面圖。 Figure 14 is a cross-sectional view showing a portion of a terminal region formed between adjacent unit display panels.

圖15(a)~(c)係說明端子區域之加工步驟之剖面圖。 15(a) to (c) are cross-sectional views showing the processing steps of the terminal region.

以下,根據圖式說明本發明之基板加工系統之實施形態。圖1係顯示本發明之基板加工系統之整體構成之配置圖,圖1(a)係連續方式之配置圖,圖1(b)係精簡方式之配置圖。 Hereinafter, embodiments of the substrate processing system of the present invention will be described with reference to the drawings. 1 is a layout view showing the overall configuration of a substrate processing system of the present invention, and FIG. 1(a) is a layout diagram of a continuous mode, and FIG. 1(b) is a layout diagram of a simplified mode.

本系統中,由對貼合基板同時進行兩面刻劃之兩面用刻劃裝置SW(第一刻劃部101、第二刻劃部103)、對此兩面用刻劃裝置SW所刻劃後之基板進行裂斷之裂斷裝置B(第一裂斷部102、第二裂斷部104)、僅對單面(端子區域之對向部分)進行刻劃之單面用刻劃裝置SS(第三刻劃部105)、及對單面用刻劃裝置SS所刻劃後之端材部分進行裂斷且附設有將分離後之端材部分除去之除去機構之端子露出用裂斷裝置BB(第三裂斷部106)構成。 In this system, the two-side scribing device SW (the first scoring portion 101 and the second scribing portion 103) for simultaneously engraving the bonded substrate is scribed after the scribing device SW is used for both surfaces. The cracking device B (the first fracture portion 102 and the second fracture portion 104) on which the substrate is broken, and the single-sided scribe device SS (the first surface-only portion) The third scribe portion 105) and the end portion of the end portion scribed by the single-side scribe device SS are broken, and the terminal exposing device BB for removing the separated end portion is attached. The third splitting portion 106) is configured.

圖1(a)之連續(inline)方式中,兩面用刻劃裝置SW(第一刻劃部101)、裂斷裝置B(第一裂斷部102)、兩面用刻劃裝置SW(第二刻劃部103)、裂斷裝置B(第二裂斷部104)、單面用刻劃裝置SS(第三刻劃部105)、端子露出用裂斷裝置BB(第三裂斷部106)係依據串列配置,基板一邊往單方向依序被搬送一邊被加工。 In the inline mode of Fig. 1(a), the scribing device SW (first scribing portion 101), the cracking device B (first fissure portion 102), and the scribing device SW for both sides (second Scribe 103), rupture device B (second rupture portion 104), single-sided scribe device SS (third scribe portion 105), and terminal exposure rupture device BB (third rupture portion 106) According to the tandem arrangement, the substrates are processed while being transported sequentially in a single direction.

圖1(b)之精簡方式中,兩面用刻劃裝置SW(兼用第一刻劃部101與第二刻劃部103)、裂斷裝置B(兼用第一裂斷部102與第二裂斷部104)、單面用刻劃裝置SS(第三刻劃部105)、端子露出用裂斷裝置BB(第三裂斷部106)係依據串列配置,基板可在兩面用刻劃裝置SW與裂斷裝置B之間往返移動。 In the simplified mode of Fig. 1(b), the scribing device SW (using both the first scoring portion 101 and the second scoring portion 103) and the rupturing device B (both the first rupture portion 102 and the second rupture) are used for both surfaces. The part 104), the single-sided scribe device SS (third scribe portion 105), and the terminal exposure rupture device BB (third rupture portion 106) are arranged in series, and the substrate can be used on both sides with the scribing device SW Move back and forth with the breaking device B.

接著,藉由兩面用刻劃裝置SW與裂斷裝置B進行從母基板經由短矩形基板分離成各單位基板之加工,之後,藉由單面用刻劃裝置SS與端子露出用裂斷裝置BB進行形成端子區域之加工。 Then, the both sides of the sculpt device SW and the rupturing device B are separated from each other by the short rectangular substrate into a unit substrate, and then the single-sided scribe device SS and the terminal exposure cleavage device BB are used. The processing for forming the terminal region is performed.

此外,圖1(a)、(b)中,用以在各裝置間進行搬送之搬送機構(搬送滾輪、 旋轉台)或使基板反轉之基板反轉機構(反轉機械臂)雖安裝在必要之部位,但關於此等係省略圖示。亦即,圖1(a)中,除了設在各裝置間之搬送滾輪之外,配置有在第一裂斷部102與第二刻劃部103之間使基板旋轉90度之旋轉台,再者,在第一裂斷部102及第二裂斷部104設有用以對兩面進行裂斷而使基板上下反轉之反轉機械臂。 In addition, in FIGS. 1(a) and 1(b), a transport mechanism (transport roller, for transporting between devices) The rotary table or the substrate reversing mechanism (reverse arm) that reverses the substrate is attached to a necessary portion, but the illustration is omitted. That is, in Fig. 1(a), in addition to the transport rollers provided between the respective devices, a rotary table that rotates the substrate by 90 degrees between the first splitting portion 102 and the second scribing portion 103 is disposed. The first splitting portion 102 and the second splitting portion 104 are provided with a reversing mechanical arm for breaking both surfaces and reversing the substrate upside down.

又,圖1(b)中,除了在各裝置間進行搬送之搬送滾輪之外,配置有在第一刻劃部101(兼用第二刻劃部103)上使基板旋轉90度之旋轉台,又,設有在第一裂斷部102及第二裂斷部104使基板上下反轉之反轉機械臂。 Further, in Fig. 1(b), in addition to the transport roller that transports between the devices, a rotary table that rotates the substrate by 90 degrees in the first scribing portion 101 (which also serves as the second scribing portion 103) is disposed. Further, an inversion robot arm that vertically reverses the substrate in the first fracture portion 102 and the second fracture portion 104 is provided.

在本系統之加工對象之母基板M具有貼合有第一基板(CF側基板)與第二基板(TFT側基板)之基板構造。此處,單位顯示面板U,如圖4(a)所示,針對從在X方向排列2列、在Y方向排列4列之母基板M裁切單位顯示面板U,對裁切出之各單位顯示面板U之四個周邊中之一個周邊加工外部連接用之端子區域T之情形進行說明。此外,圖4中以二點鏈線所示之假想線L表示刻劃預定線,又,本說明書中所謂XY方向係如圖中所示。 The mother substrate M to be processed in the present system has a substrate structure in which a first substrate (CF side substrate) and a second substrate (TFT side substrate) are bonded together. Here, as shown in FIG. 4( a ), the unit display panel U cuts the unit display panel U from the mother substrate M arranged in two rows in the X direction and arranged in four rows in the Y direction, and the respective units are cut out. A case where one of the four peripherals of the display panel U is peripherally processed for the external connection terminal region T will be described. Further, the imaginary line L indicated by the two-dot chain line in Fig. 4 indicates the scribed line, and the XY direction in the present specification is as shown in the drawing.

圖2係概略地顯示用以在母基板M形成刻劃線之兩面刻劃裝置SW及單面刻劃裝置SS之俯視圖。又,圖3係兩面刻劃裝置SW之前視圖,圖6係單面刻劃裝置SS之前視圖。 2 is a plan view schematically showing a two-face scribing device SW and a single-sided scribing device SS for forming a score line on the mother substrate M. 3 is a front view of the two-sided scoring device SW, and FIG. 6 is a front view of the single-sided scoring device SS.

刻劃裝置SW,SS具備從基板搬入側朝向基板搬出側往Y方向搬送母基板M之前後一對帶式輸送機2a,2b,在此等帶式輸送機2a,2b間之基板搬送途中進行刻劃加工。 The scribing device SW and the SS are provided with a pair of belt conveyors 2a and 2b before and after transporting the mother substrate M from the substrate carrying-in side to the substrate carrying-out side in the Y direction, and are carried out during the substrate transport between the belt conveyors 2a and 2b. Characterization processing.

在圖3所示之兩面刻劃裝置SW之前後之帶式輸送機2a,2b 之間,以從上下夾著母基板M之方式配置有上部刀輪3a以及下部刀輪3b。各刀輪3a,3b係保持在刻劃頭4,4,可上下移動而能以設定之按壓力按壓母基板M,且能一邊按壓母基板M之表面一邊沿著樑5,5往圖2之X方向轉動。 The belt conveyors 2a, 2b before and after the two-sided scribing device SW shown in Fig. 3 The upper cutter wheel 3a and the lower cutter wheel 3b are disposed to sandwich the mother substrate M from above and below. Each of the cutter wheels 3a, 3b is held by the scribing heads 4, 4, and can be moved up and down to press the mother substrate M with a set pressing force, and can be pressed along the beam 5, 5 while pressing the surface of the mother substrate M toward FIG. The X direction rotates.

又,在進行圖6所示之端子區域形成用之刻劃加工之單面刻劃裝置SS,替代圖3之下部刀輪3b,使用平坦面且與基板(單位顯示面板U)相接之支援滾輪8。 Further, the single-sided scribing device SS for performing the dicing process for forming the terminal region shown in FIG. 6 is used instead of the lower cutter wheel 3b of FIG. 3, and the flat surface is used to support the substrate (unit display panel U). Roller 8.

對母基板M以下述步驟進行刻劃與裂斷。 The mother substrate M is scored and broken in the following steps.

首先,對圖4(a)所示之母基板M,藉由上述刻劃裝置SW之上下之刀輪3a,3b進行沿著所有Y方向之刻劃預定線L之刻劃,接著,如圖4(b)所示,在基板M之上下加工分斷用之刻劃線S1。之後,母基板M被送往裂斷裝置B,從上述刻劃線S1被分斷,如圖4(c)所示,裁切4個單位顯示面板U串列排列之長方形之短矩形基板M1。 First, the mother substrate M shown in FIG. 4(a) is scored along the scribe line L along all the Y directions by the cutter wheels 3a, 3b above the scribing device SW, and then, as shown in FIG. As shown in FIG. 4(b), the scribe line S1 for cutting is processed on the substrate M. After that, the mother substrate M is sent to the cracking device B, and is cut off from the above-described scribe line S1, and as shown in FIG. 4(c), a rectangular short rectangular substrate M1 in which four unit display panels U are arranged in series is cut. .

本發明所使用之裂斷裝置B,可使用一般公知者。例如,如圖5所示,由夾著刻劃線S1從下面承受短矩形基板M1之左右一對承受部6,6與從上方朝向刻劃線S1下降之裂斷桿7構成,將裂斷桿7按壓刻劃線S1以使基板M1撓曲,進行裂斷。此外,裂斷係使用反轉機械臂(未圖示)使基板M1上下反轉而逐面進行。 As the breaking device B used in the present invention, a generally known one can be used. For example, as shown in Fig. 5, the pair of right and left receiving portions 6, 6 which receive the short rectangular substrate M1 from below by the scribe line S1 and the split rod 7 which descends from the upper direction toward the scribe line S1 are formed, and are broken. The rod 7 presses the score line S1 to deflect the substrate M1 to perform cracking. Further, the splitting system is performed by turning the substrate M1 upside down using a reversing robot arm (not shown).

接著,裁切出之短矩形基板M1在水平面上旋轉90度。基板之旋轉動作係藉由旋轉台(未圖示)進行。接著,藉由上下之刀輪3a,3b進行沿著X方向之所有刻劃預定線L之刻劃。藉此,如圖4(d)所示,在短矩形基板M1之上下(X方向)加工分斷用之刻劃線S2。之後,短矩形基板M1, 與上述相同,被送往裂斷裝置B,如圖4(e)所示,從刻劃線S2分斷成各單位顯示面板U。 Next, the cut short rectangular substrate M1 is rotated by 90 degrees on a horizontal plane. The rotation of the substrate is performed by a rotating table (not shown). Next, the scribes of all the scribe lines L along the X direction are performed by the upper and lower cutter wheels 3a, 3b. Thereby, as shown in FIG. 4(d), the scribe line S2 for dividing is cut in the upper (X direction) of the short rectangular substrate M1. After that, the short rectangular substrate M1, Similarly to the above, it is sent to the breaking device B, and as shown in Fig. 4(e), the unit display panel U is divided from the scribe line S2.

之後,單位顯示面板U被送往用以形成端子區域之單面刻劃裝置SS(參照圖6),如圖4(f)所示,形成端子區域T之半切斷之刻劃線S3被加工在第一基板G1。此刻劃線S3係加工在接近單位顯示面板U之四個周邊中之一個周邊之位置、例如從周邊往內側進入2mm之位置。 Thereafter, the unit display panel U is sent to the single-sided scribing device SS (see FIG. 6) for forming the terminal region, and as shown in FIG. 4(f), the half-cut line S3 forming the terminal region T is processed. On the first substrate G1. At this time, the scribe line S3 is processed at a position close to one of the four periphery of the unit display panel U, for example, from the periphery to the inside by 2 mm.

加工時,單位顯示面板U,從正面觀察則如圖6所示,以上側成為第一基板G1(CF側基板)、下側成為第二基板G2(TFT側基板)之方式載置在帶式輸送機6上。接著,使上部刀輪3a下降至第一基板G1之表面以加工刻劃線S3。此時,與上部刀輪3a對向之單位顯示面板U之下面(第二基板G2側)係藉由周面平坦之支援滾輪8承受。此支援滾輪8預先設置在刻劃裝置SS之下部樑5。此外,進行刻劃加工時,使刻劃線S3之槽深成為第一基板G1之厚度之八成程度,不產生過度按壓造成之非預期之裂痕。 In the processing, the unit display panel U is placed on the front side as shown in FIG. 6 , and the upper side is placed on the first substrate G1 (CF side substrate) and the lower side is placed on the second substrate G2 (TFT side substrate). On the conveyor 6. Next, the upper cutter wheel 3a is lowered to the surface of the first substrate G1 to process the score line S3. At this time, the lower surface (the second substrate G2 side) of the unit display panel U opposed to the upper cutter wheel 3a is received by the support roller 8 whose circumference is flat. This support roller 8 is previously set in the lower beam 5 of the scoring device SS. Further, when the scribing process is performed, the groove depth of the score line S3 is made to be about 80% of the thickness of the first substrate G1, and unintended cracks due to excessive pressing are not generated.

以上述方式,將母基板M裁切成單位顯示面板U後,加工端子區域T形成用之刻劃線S3,藉此,相較於加工大面積之母基板M之情形,可大幅縮短刻劃線S3之加工域、亦即刀輪3a之轉動距離。藉此,即使是2mm程度之小寬度之端子區域,由於刀輪之轉動距離短,因此亦能在刻劃線S3之全長以設定之精度進行刻劃。 In the above manner, after the mother substrate M is cut into the unit display panel U, the processing terminal region T is formed with the scribe line S3, whereby the scribe can be greatly shortened compared to the case of processing the large-area mother substrate M. The processing range of the line S3, that is, the rotational distance of the cutter wheel 3a. Thereby, even in the terminal region having a small width of about 2 mm, since the rotational distance of the cutter wheel is short, the entire length of the score line S3 can be scored with the set accuracy.

又,端子區域T在以下說明之步驟之前一刻為止不露出,被端材E(參照圖7等)覆蓋,因此能保護其免於受到搬送中之碰撞等。 Further, the terminal region T is not exposed until immediately before the step described below, and is covered by the end material E (see FIG. 7 and the like), so that it can be protected from collision or the like during transportation.

加工出用以形成端子區域T之刻劃線S3之單位顯示面板U,接下來除去覆蓋端子區域T之端材部分E,被送往圖7所示之端材除去 機構10(端子區域加工裝置)。 The unit display panel U for forming the scribe line S3 of the terminal region T is processed, and then the end portion E covering the terminal region T is removed, and is sent to the end material shown in FIG. Mechanism 10 (terminal area processing device).

此端材除去機構10,如圖7(a)~(c)所示,具備吸附單位顯示面板U並舉起、使端子區域T(參照圖6)朝向下方並同時以樞軸11為支點旋動至成為垂直姿勢為止之基板保持構件12。此基板保持構件12,例如,可藉由在吸附面具備複數個空氣吸引孔之吸附板構成。再者,基板保持構件12可藉由汽缸13上下移動,汽缸13可沿著軌道14移動至端材除去位置。在圖示之例,雖沿著與Y方向正交之X方向移動,但往Y方向移動亦可。 As shown in FIGS. 7( a ) to 7 ( c ), the end material removing mechanism 10 includes an adsorption unit display panel U and lifts up, and the terminal region T (see FIG. 6 ) faces downward while pivoting with the pivot 11 as a fulcrum. The substrate holding member 12 is in a vertical posture. The substrate holding member 12 can be formed, for example, by an adsorption plate having a plurality of air suction holes on the adsorption surface. Further, the substrate holding member 12 can be moved up and down by the cylinder 13, and the cylinder 13 can be moved along the rail 14 to the end material removing position. In the example shown in the figure, although it moves in the X direction orthogonal to the Y direction, it may move in the Y direction.

再者,端材除去機構10,在端材除去位置,如圖8所示,具備按壓形成在垂直豎立之單位顯示面板U之第一基板G1之刻劃線S3附近之按壓構件15、夾著刻劃線S3在該刻劃線S3之附近往拉開該端材部分E之方向旋轉接觸端材部分E之表面之旋轉體16、及配置在第二基板G2側之與刻劃線S3對向之位置且按壓第二基板G2之表面之板狀之裂斷桿17。此外,圖8之實施例中,作為旋轉體16係使用圓形之旋轉滾輪18。 Further, as shown in FIG. 8, the end material removing mechanism 10 is provided with a pressing member 15 that presses the vicinity of the scribe line S3 formed on the first substrate G1 of the unit display panel U that is vertically erected, and sandwiches the end member. The scribe line S3 rotates the rotating body 16 contacting the surface of the end portion E in the direction in which the end portion E is pulled in the vicinity of the scribe line S3, and the pair of scribe lines S3 disposed on the side of the second substrate G2. The plate-shaped splitting bar 17 is pressed against the surface of the second substrate G2. Further, in the embodiment of Fig. 8, a circular rotating roller 18 is used as the rotating body 16.

裂斷桿17,按壓與按壓構件15和旋轉體16所夾之第一基板G1之刻劃線S3之位置對應之相反側之第二基板G2之表面,藉此使單位顯示面板U在按壓構件15和旋轉體16之間撓曲,使(基板板厚之八成程度之深度)之刻劃線S3之裂痕往第一基板G1之厚度方向浸透而完全分斷。旋轉體16在裂斷桿17動作後逆時針旋轉,藉由與旋轉體16之接觸使端材部分E從單位顯示面板U剝離往下方落下。旋轉體16之表面以橡膠等摩擦係數大之材料構成較佳,以藉由旋轉接觸容易地剝離端材部分E。 The split rod 17 presses the surface of the second substrate G2 on the opposite side to the position of the scribe line S3 of the first substrate G1 sandwiched between the pressing member 15 and the rotating body 16, whereby the unit display panel U is placed on the pressing member 15 and the rotating body 16 are deflected so that the crack of the scribing line S3 is soaked in the thickness direction of the first substrate G1 and completely broken. The rotating body 16 rotates counterclockwise after the breaking lever 17 operates, and the end portion E is peeled off from the unit display panel U and falls downward by contact with the rotating body 16. The surface of the rotating body 16 is preferably made of a material having a large friction coefficient such as rubber to easily peel the end portion E by a rotational contact.

以上述方式,完成在一個周邊形成有端子區域T之一端子之單位顯示面板U。 In the above manner, the unit display panel U in which one terminal of the terminal region T is formed at one periphery is completed.

在上述實施例雖使用圓形之旋轉滾輪18作為旋轉體16,但如圖9所示,亦可形成為在二個輪體19,19之間旋轉之旋轉帶20。在此情形,旋轉帶20之一部分與垂直豎立之單位顯示面板U之端材部分E接觸。 In the above embodiment, the circular rotating roller 18 is used as the rotating body 16, but as shown in Fig. 9, the rotating belt 20 may be formed to rotate between the two wheel bodies 19, 19. In this case, one portion of the rotating belt 20 is in contact with the end portion E of the unit display panel U that is vertically erected.

又,本發明中,以黏著性材料形成上述旋轉體16之表面亦可。藉此,可更確實地從單位顯示面板U除去端材部分E。此情形,吸附於旋轉體16之端材部分E,如圖10(a)、(b)所示,在從單位顯示面板U離開之位置抵接於鏟子般之剝離構件21而從旋轉體16剝離較佳。又,如圖10(b)所示,預先設置洗淨附著於旋轉體16表面之微少玻璃屑屑等之洗淨槽22,使旋轉體16之一部分潛入此洗淨槽22以洗淨亦可。 Further, in the present invention, the surface of the rotating body 16 may be formed of an adhesive material. Thereby, the end material portion E can be removed from the unit display panel U more surely. In this case, as shown in FIGS. 10(a) and 10(b), the end portion E of the rotating body 16 is abutted against the shovel-like peeling member 21 at a position separated from the unit display panel U, and is rotated from the rotating body 16. Peeling is preferred. Further, as shown in FIG. 10(b), a cleaning tank 22 for cleaning a small amount of glass scraps or the like adhering to the surface of the rotating body 16 is provided in advance, and a part of the rotating body 16 is dive into the cleaning tank 22 to be washed. .

上述實施例中,藉由基板保持構件12使單位顯示面板U在垂直豎立之姿勢除去端材部分E,因此端材部分E因本身重量與旋轉體16之旋轉接觸能容易地剝離並往下方落下。此外,在刻劃加工時產生之微小玻璃屑等之屑亦與端材部分E之除去同時地因本身重量往下方落下,可製得良品之產品。 In the above embodiment, the unit holding panel 12 removes the end portion E in a vertically erected posture by the substrate holding member 12, so that the end portion E can be easily peeled off and dropped downward by the rotational contact of the rotating body 16 by its own weight. . Further, the scraps of fine glass swarf or the like which are generated during the dicing process are also dropped by the weight of the end portion E at the same time as the end portion E, and a good product can be obtained.

然而,本發明中,如圖11所示,使單位顯示面板U維持水平姿勢下如上述藉由旋轉體16除去端材部分E之構成亦可。此情形,以加工出刻劃線S3之第一基板G1成為下側之方式載置,且以刻劃線S3之部分從支承單位顯示面板U之台板23露出之方式載置於台板23上。接著,使裂斷桿17位於上側,以與上述實施例相同之位置關係配置按壓構件15和旋轉體16。接著,使裂斷桿17下降,將第一基板G1之刻劃線S3裂斷,且藉由旋轉體16之旋轉除去端材部分E。 However, in the present invention, as shown in FIG. 11, the unit display panel U may be maintained in a horizontal posture, and the end portion E may be removed by the rotating body 16 as described above. In this case, the first substrate G1 on which the scribe line S3 is formed is placed on the lower side, and the portion of the scribe line S3 is placed on the platen 23 so as to be exposed from the platen 23 of the support unit display panel U. on. Next, the split rod 17 is placed on the upper side, and the pressing member 15 and the rotating body 16 are disposed in the same positional relationship as in the above embodiment. Next, the split rod 17 is lowered, the score line S3 of the first substrate G1 is broken, and the end portion E is removed by the rotation of the rotary body 16.

以上實施例中,針對一端子之單位顯示面板進行說明,但在 二端子、三端子以及四端子之單位顯示面板之情形,皆進行與端子區域數對應之上述端子區域形成用之刻劃步驟與端材部分之除去步驟即可。 In the above embodiment, the unit display panel of one terminal is described, but In the case of the two-terminal, three-terminal, and four-terminal unit display panels, the step of forming the terminal region corresponding to the number of terminal regions and the step of removing the end portion may be performed.

以上,說明本發明代表性實施例,但本發明並不限於上述實施形態,為了達成其目的,可在不脫離發明趣旨之範圍內適當地修正、變更。 In the above, the present invention is not limited to the above-described embodiments, and the present invention is not limited to the embodiments described above, and may be appropriately modified or changed without departing from the scope of the invention.

本發明之基板加工系統及基板加工方法,可利用於在周邊之至少一邊具備端子區域部分之單位顯示面板之加工。 The substrate processing system and the substrate processing method of the present invention can be used for processing a unit display panel having a terminal region portion on at least one side of the periphery.

101‧‧‧第一刻劃部 101‧‧‧The first characterization department

102‧‧‧第一裂斷部 102‧‧‧First Broken Section

103‧‧‧第二刻劃部 103‧‧‧The second characterization department

104‧‧‧第二裂斷部 104‧‧‧Second Broken

105‧‧‧第三刻劃部 105‧‧‧The third characterization department

106‧‧‧第三裂斷部 106‧‧‧The third fracture

B‧‧‧裂斷裝置 B‧‧‧cracking device

BB‧‧‧端子露出用裂斷裝置 BB‧‧‧ terminal exposure device

SS‧‧‧單面用刻劃裝置 SS‧‧‧Single-sided scoring device

SW‧‧‧兩面用刻劃裝置 SW‧‧‧Two-sided scoring device

Claims (3)

一種基板加工系統,係從貼合第一基板與第二基板之母基板裁切出至少一邊部具備端子區域之單位基板,其特徵在於,具備:第一刻劃部,係將用以從該母基板裁切出複數個單位基板排成一列之短矩形基板之第一刻劃線加工於第一基板與第二基板加工;第一裂斷部,藉由沿著該第一刻劃線進行裂斷以獲得短矩形基板;第二刻劃部,係將用以從該短矩形基板裁切單位基板之第二刻劃線加工於第一基板與第二基板加工;第二裂斷部,藉由沿著該第二刻劃線進行裂斷以獲得各單位基板;第三刻劃部,係對各單位基板,將用以區分設在第二基板之端子區域之第三刻劃線加工在第一基板之與該端子區域對向之位置;以及第三裂斷部,沿著該第三刻劃線進行裂斷以將覆蓋該端子區域之第一基板之端材部分加以分斷。 A substrate processing system for cutting a unit substrate having at least one side of a terminal region from a mother substrate to which a first substrate and a second substrate are bonded, wherein the first scribing portion is provided for The first scribe line of the short rectangular substrate in which the plurality of unit substrates are arranged in a row is processed on the first substrate and the second substrate; the first rupture portion is performed along the first scribe line Breaking to obtain a short rectangular substrate; the second scribing portion is configured to process the first substrate and the second substrate by cutting the second scribe line of the unit substrate from the short rectangular substrate; the second rupture portion, Breaking along the second scribe line to obtain each unit substrate; the third scribe portion is for each unit substrate, and the third scribe line processing for distinguishing the terminal region provided on the second substrate Positioning the first substrate opposite the terminal region; and the third breaking portion is broken along the third scribe line to break the end portion of the first substrate covering the terminal region. 如申請專利範圍第1項之基板加工系統,其中,該第三裂斷部,具備:旋轉體,與該端材部分接觸;按壓構件,夾著該第三刻劃線按壓與該端材部分相反側之第一基板之表面;以及裂斷桿,配置在第二基板側之與該第三刻劃線對向之位置,按壓第二基板之表面。 The substrate processing system of claim 1, wherein the third fracture portion includes: a rotating body in contact with the end material portion; and a pressing member that presses the third scribe line and the end portion a surface of the first substrate on the opposite side; and a cracking bar disposed on the second substrate side opposite to the third scribe line to press the surface of the second substrate. 一種基板加工方法,係從貼合第一基板與第二基板之母基板裁切出至少一邊部具備端子區域之單位基板,其特徵在於,由下述步驟構成:第一刻劃步驟,將用以從該母基板裁切出複數個單位基板排成一列之 短矩形基板之第一刻劃線加工於第一基板與第二基板加工;第一裂斷步驟,藉由沿著該第一刻劃線進行裂斷以獲得短矩形基板;第二刻劃步驟,將用以從該短矩形基板裁切出單位基板之第二刻劃線加工於第一基板與第二基板加工;第二裂斷步驟,藉由沿著該第二刻劃線進行裂斷以獲得各單位基板;第三刻劃步驟,對各單位基板,將用以區分設在第二基板之端子區域之第三刻劃線加工在第一基板之與該端子區域對向之位置;以及第三裂斷步驟,沿著該第三刻劃線進行裂斷以將覆蓋該端子區域之第一基板之端材部分加以分斷。 A substrate processing method is a unit substrate in which at least one side portion includes a terminal region is cut out from a mother substrate to which a first substrate and a second substrate are bonded, and is characterized in that: a first scribing step is used Cutting a plurality of unit substrates from the mother substrate into a row The first scribe line of the short rectangular substrate is processed on the first substrate and the second substrate; the first cleavage step is performed by breaking along the first scribe line to obtain a short rectangular substrate; and the second scribe step a second scribe line for cutting a unit substrate from the short rectangular substrate is processed on the first substrate and the second substrate; and a second cleavage step is performed by severing along the second scribe line Obtaining a unit substrate; a third scribing step, for each unit substrate, a third scribe line for distinguishing between the terminal regions of the second substrate is processed at a position of the first substrate opposite to the terminal region; And a third cracking step along which the third scribe line is broken to break the end portion of the first substrate covering the terminal region.
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