JP2014214055A - Substrate processing system and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing system and a substrate processing method that can precisely process a terminal region of a laminated substrate having the terminal region at least at one side of its periphery.SOLUTION: A substrate processing system includes: a first scribe part 101 which processes a first scribe line S1 so as to cut a strip-shaped substrate M1 out of a mother substrate M; a first break part 102 which obtains the strip-shaped substrate M1 by breaking along the first scribe line S1; a second scribe part 103 which processes a second scribe line S2 so as to cut unit substrates U out of the strip-shaped substrate M1; a second break part 104 which obtains the individual unit substrates U by breaking along the second scribe line S2; a third scribe part 105 which processes a third scribe line S3 sectioning off a terminal region T provided on a second substrate for each of the unit substrates U having been parted; and a third break part 106 which parts end material parts E covering the terminal region T by breaking along the third scribe line S3.

Description

  The present invention relates to a substrate processing system and a substrate processing method for a bonded substrate in which a bonded substrate bonded with a brittle material substrate is divided to obtain a plurality of unit substrates. More specifically, the present invention relates to a substrate processing system and a substrate processing method for a bonded substrate that are divided by forming a terminal region for external connection around the unit substrate when a unit substrate is obtained from the bonded substrate. The present invention is used for processing, for example, a unit display panel of a liquid crystal display panel.

  In manufacturing a liquid crystal display panel, two large-area glass substrates are used, a color filter CF (Color Filter) is formed on one substrate, and a thin film transistor TFT (Thin Film Transistor) that drives liquid crystal on the other substrate And a terminal region for external connection. Then, these two substrates are bonded together, and a mother substrate in which liquid crystal is sealed is formed, and then divided into individual unit display panels.

  Generally, in the process of dividing the mother substrate into unit display panels, a cutting method using a cutter wheel is used. In this case, first, a scribe line (scribe line) is formed on each of the two substrates (CF side substrate and TFT side substrate) constituting the mother substrate by pressing and moving the cutter wheel relative to each of the planned division positions. Engrave a groove. Next, the mother substrate is completely divided for each unit display panel by applying a force so as to bend along the scribe line. Each divided unit display panel is transferred to a subsequent process by a transfer robot.

  A substrate processing system (substrate cutting system) and a substrate processing method for efficiently processing these series of substrate processing on the upper and lower surfaces simultaneously have already been disclosed (see Patent Document 1 and Patent Document 2). According to these documents, both sides of the mother substrate are simultaneously scribed from above and below by a pair of upper and lower cutter wheels, and then both sides are simultaneously broken by a steam break mechanism or a roller break mechanism to divide into unit display panels. The unit display panels obtained in this way are taken out one by one and sent to the subsequent process.

  The mother substrate is bonded to the first substrate (CF side substrate) on the side where the color filter is formed and the second substrate (TFT side substrate) on the side where the TFT and the terminal region are formed with a sealing material interposed therebetween. It is like that.

  Since the terminal area is an area where the signal line is connected between the TFT and the external device, it is necessary to expose the terminal area. Therefore, when the mother substrate is divided into unit display panels, the outer end of the terminal region (on the side opposite to the side to which the TFT is connected) with respect to the portion of the first substrate (CF side substrate) facing the terminal region ( That is, it is divided along the periphery of the unit display panel), and the width (terminal width) necessary for attaching the signal line from the outer end of the terminal region is cut out as an end material.

  FIG. 12 is a plan view showing an example of a substrate layout of a mother substrate for a liquid crystal display panel. In the figure, a total of eight unit display panels U are arranged on the mother substrate M. 12A shows a case where the terminal region T of the unit display panel U cut out from the mother substrate M is formed on one side of the four surrounding sides, and FIG. 12B shows the case where there are two sides. 12 (c) shows the case of three sides.

  FIG. 13 is a diagram (a plan view, a front view, and a right side view) for explaining a terminal region T formed on the unit display panel U cut out from the mother board M in FIG. 13A shows a single-terminal unit display panel U in which the terminal region T is formed on one side, and FIG. 13B shows a two-terminal unit display panel in which the terminal region T is formed on two sides. U and FIG. 13C show the three-terminal unit display panel U in which the terminal region T is formed on three sides. In addition to this, there is a four-terminal display panel in which terminal regions are formed on four sides. The number of sides on which the terminal region is formed is selected according to the number of pixels included in the unit display panel U.

When the mother substrate is divided, two types of cut surfaces are formed in the vicinity of the boundary between the adjacent unit display panels U1 and U2, as shown in FIG.
One of them is a cut surface in which both substrates are divided (full cut) so that the end surfaces of the first substrate G1 and the second substrate G2 are aligned, and this is referred to as a just cut surface Ca. The just cut surface Ca is a surface that completely separates the unit display panel U1 and the unit display panel U2.
The other is a cut surface in which only the first substrate G1 is divided (half cut) at a position separated from the just cut surface Ca by the terminal width W, and this is referred to as a terminal cut surface Cb. The terminal cut surface Cb is a cut surface that is divided to expose the terminal region T. And the end material part E will generate | occur | produce in the 1st board | substrate G1 between the just cut surface Ca and the terminal cut surface Cb.

The scribing of the just cut surface Ca and the terminal cut surface Cb is generally performed as follows.
As shown in FIG. 15A, the cutter wheel K1 is pressed against the position of the just cut surface Ca on the first substrate G1 side, and the cutter wheel K2 is pressed against the position of the just cut surface Ca on the second substrate G2 side. The first scribe process. At the time of performing the first scribing process, since there is no stress in the vicinity of the just cut surface Ca, the groove of the scribe line is formed on both the first substrate G1 and the second substrate G2 without any problem. A groove having a depth corresponding to the pressing force is formed.

Next, as shown in FIG. 15B, the cutter wheel K1 is pressed against the position of the terminal cut surface Cb of the first substrate G1, and the backup roller K3 is positioned on the surface of the second substrate G2 opposite to the cutter wheel K1. (Roller with a flat peripheral surface) is pressed and the second scribe process is performed. At the time of performing the second scribing process, the groove of the scribe line formed by the first scribing process is open, and due to the influence of the sealing material interposed between this groove and both substrates, the terminal cut surface In the vicinity of Cb, a compressive stress is applied. That is, although the just cut surface Ca of the first substrate G1 tries to open to the terminal cut surface Cb side, the stress and the sealing material prevent the opening force, so that the crack direction in the terminal cut surface Cb is increased. Is hindered.
Therefore, in the second scribing process, the scribe line groove cannot be formed deeply with respect to the terminal cut surface Cb of the first substrate G1. If the pressing force of the cutter wheel is increased against the stress of the substrate, problems such as generation of cullet and cracking of the second substrate below occur. In particular, when the thickness of the mother substrate is as thin as 0.05 to 0.2 mm, a strong pressing force cannot be applied because the substrate is easily cracked only by receiving a small external force. Accordingly, the scribe line of the terminal cut surface Cb is not necessarily formed at a depth that completely separates the first substrate G1, but is limited to a finite depth (for example, a depth of about 70 to 80% of the plate thickness). , Preventing the occurrence of defects.

  As a result, as shown in FIG. 15C, when the unit display panels U1 and U2 are separated from the just cut surface Ca, the end material portion E is left attached to the terminal cut surface Cb.

International Publication WO2005 / 087458 International Publication No. WO2002 / 057192

  In recent years, liquid crystal display panels have been required to make the thickness of the mother substrate thinner than before from the viewpoints of effective use of materials and the reduction of the thickness of the liquid crystal display device, specifically, the first substrate G1. In addition, the thickness of the second substrate G2 is required to be about 0.05 to 0.2 mm. Further, the width of the terminal region formed in the unit display panel, that is, the terminal width is required to be narrowed, and specifically, it is required to be reduced to about 1 to 2 mm.

  However, when the terminal width is reduced to 1 to 2 mm as described above, it is difficult to precisely scribe the scribe line for forming the terminal cut surface Cb over a long distance without any unevenness.

  Then, an object of this invention is to provide the board | substrate processing system of a bonded substrate and the board | substrate processing method which can remove the edge material part which covers a terminal area | region accurately.

  In order to achieve the above object, the present invention takes the following technical means. That is, the substrate processing system of the present invention is a substrate processing system for cutting out a unit substrate having a terminal region on at least one side from a mother substrate obtained by bonding a first substrate and a second substrate, and from the mother substrate By breaking along the first scribe line, a first scribe portion that processes a first scribe line for cutting out a strip-shaped substrate in which a plurality of unit substrates are arranged in a line into a first substrate and a second substrate A first break portion for obtaining a strip-shaped substrate, a second scribe portion for processing a second scribe line for cutting out a unit substrate from the strip-shaped substrate into the first substrate and the second substrate, and the second scribe line A second break portion for obtaining individual unit substrates by breaking along and a terminal area provided on the second substrate for each unit substrate A third scribe portion that processes the third scribe line to a position facing the terminal area of the first substrate, and an end material portion of the first substrate that covers the terminal area by breaking along the third scribe line is divided. And a third break portion.

In the present invention, as described above, since the strip substrate is cut out from the mother substrate and the unit substrate is cut out from the strip substrate, the third scribe line S3 for forming the terminal region is processed. The processing area of the third scribe line S3, that is, the rolling distance of the cutter wheel can be greatly reduced as compared with the case of processing a large-area mother substrate (a plurality of unit substrates are arranged). Thereby, even if it is a terminal area | region with a small width | variety of about 2 mm, since the rolling distance of a cutter wheel is short, it can scribe accurately over the full length of 3rd scribe line S3.
In addition, the mother substrate is first divided until it becomes a unit substrate, and after that, the end material portion is removed by processing the scribe line S3 for forming the terminal region. It will be covered and protected by the material portion, and the problem of damaging the terminal area during substrate transportation can be drastically reduced.

In the above invention, the third break portion includes a rotating body that contacts the end material portion, a pressing member that presses the surface of the first substrate opposite to the end material portion across the third scribe line, and a second A break bar that is disposed at a position facing the third scribe line on the substrate side and presses the surface of the second substrate may be provided.
According to this, the force that separates the end material portion from the main body portion of the unit substrate works by pressing the breaker bar to completely sever the end material portion and then bringing the rotating body into rotational contact. It can be removed reliably.

  In the above substrate processing system, the first scribe unit and the second scribe unit can be used together, and the first break unit and the second break unit can be used together, and the configuration of the processing system can be made compact. Good.

Further, the substrate processing method of the present invention made from another viewpoint is a substrate processing method of cutting out a unit substrate having a terminal region on at least one side from a mother substrate obtained by bonding a first substrate and a second substrate. A first scribe process for processing a first scribe line for cutting out a strip-shaped substrate in which a plurality of unit substrates are arranged in a row from the mother substrate into a first substrate and a second substrate, and the first scribe line A first breaking step of obtaining a strip-shaped substrate by breaking along, a second scribe step of processing a second scribe line for cutting out the unit substrate from the strip-shaped substrate into the first substrate and the second substrate, A second breaking step of obtaining individual unit substrates by breaking along the second scribe line, and a terminal region provided on the second substrate for each unit substrate A third scribe process for processing a third scribe line for dividing the first scribe line to a position facing the terminal region of the first substrate; and an end of the first substrate that covers the terminal region by breaking along the third scribe line. A third breaking step of dividing the material portion.
According to this, as described above, since the rolling distance of the cutter wheel can be shortened, scribing can be performed accurately over the entire length of the third scribe line S3, and the terminal region is the end material portion until immediately before becoming the unit substrate. By being covered and protected, the problem of damaging the terminal area during substrate transport can be drastically reduced.

The layout figure which shows the whole structure of the board | substrate processing system of this invention. 1 is a schematic plan view showing an example of a scribing device used in the present invention. The front view which shows the principal part structure of the scribing apparatus which performs double-sided scribing. The top view explaining the unit display panel cutting-out process from a mother board | substrate. Sectional drawing which shows an example of the breaking apparatus used for this invention. The front view which shows the principal part structure of the scribe apparatus which performs the single-sided scribe for terminal region formation. The front view which shows the end material removal mechanism in this invention. Explanatory drawing which shows operation | movement of the end material removal mechanism of FIG. Explanatory drawing which shows another Example of a scrap material removal mechanism. Explanatory drawing which shows another Example of a scrap material removal mechanism. Explanatory drawing which shows another Example of a scrap material removal mechanism. The top view which shows an example of the board | substrate layout of a mother board | substrate. Explanatory drawing which shows the example of formation of the terminal area | region formed in a unit display panel. Sectional drawing which shows the terminal area | region part formed between adjacent unit display panels. Sectional drawing explaining the manufacturing process of a terminal area | region.

Embodiments of the substrate processing system of the present invention will be described below with reference to the drawings. FIG. 1 is a layout diagram showing the overall configuration of a substrate processing system according to the present invention. FIG. 1 (a) is an inline system, and FIG. 1 (b) is a compact layout diagram.
In this system, a double-side scribe device SW (first scribe unit 101, second scribe unit 103) that simultaneously scribes the bonded substrate on both sides, and a break device B (first device) that breaks the substrate scribed by this double-side scribe device. One break portion 102, second break portion 104), a single-side scribe device SS (third scribe portion 105) that scribes only one side (opposite portion of the terminal area), and an end material portion scribed by the single-side scribe device SS. And a terminal breaker device BB (third break portion 106) provided with a removal mechanism for removing the separated end material portion.

In the inline method of FIG. 1A, the double-sided scribing device SW (first scribe unit 101), the breaking device B (first breaking unit 102), the double-sided scribing device SW (second scribe unit 103), and the breaking device B (Second break unit 104), single-sided scribing device SS (third scribing unit 105), and terminal breaker device BB (third breaking unit 106) are arranged in series in this order, and the substrates are sequentially arranged in one direction. Processed while being conveyed.
In the compact system of FIG. 1 (b), the double-sided scribing device SW (the first scribing unit 101 and the second scribing unit 103 are combined) and the breaking device B (the first breaking unit 102 and the second breaking unit 104 are combined). ), A single-side scribe device SS (third scribe unit 105), and a terminal take-out break device BB (third break unit 106) are arranged in this order in series, and the double-side scribe device SW and break device B are The substrate can be reciprocated between them.

Then, the double-side scribing device SW and the breaking device B perform processing from the mother substrate through the strip-shaped substrate until the unit substrate is separated, and then the single-side scribing device SS and the terminal pulling breaking device BB. Thus, processing for forming the terminal region is performed.
In FIGS. 1A and 1B, a transport mechanism (transport roller, turntable) for transporting between the apparatuses and a substrate reversing mechanism (reversing robot) for reversing the substrate are attached to necessary portions. However, these are not shown. That is, in FIG. 1A, in addition to the conveying rollers provided between the devices, a turntable for rotating the substrate by 90 degrees is disposed between the first break unit 102 and the second scribe unit 103. The first break unit 102 and the second break unit 104 are provided with a reversing robot that flips the substrate upside down in order to break both sides.
In FIG. 1B, in addition to the transport rollers for transporting between the apparatuses, a turntable for rotating the substrate by 90 degrees on the first scribe unit 101 (also used as the second scribe unit 103) is arranged. In addition, the first break unit 102 and the second break unit 104 are provided with a reversing robot that flips the substrate upside down.

  The mother substrate M to be processed in this system has a substrate structure in which a first substrate (CF side substrate) and a second substrate (TFT side substrate) are bonded together. Here, as shown in FIG. 4A, the unit display panels U are cut out from the mother substrate M in which two rows are arranged in the X direction and four rows in the Y direction, as shown in FIG. A case where the terminal region T for external connection is processed in one of the four peripherals will be described. In addition, the imaginary line L shown with the dashed-two dotted line in FIG. 4 has shown the scribe plan line, and the XY directions said in this specification are as showing in the figure.

FIG. 2 is a plan view schematically showing a double-sided scribe device SW and a single-sided scribe device SS for forming a scribe line on the mother substrate M. FIG. 3 is a front view of the double-side scribe device SW, and FIG. 6 is a front view of the single-side scribe device SS.
The scribing devices SW and SS are provided with a pair of front and rear belt conveyors 2a and 2b that convey the mother substrate M in the Y direction from the substrate carry-in side toward the substrate carry-out side, and carry the substrate between these belt conveyers 2a and 2b. A scribing process is performed on the way.

An upper cutter wheel 3a and a lower cutter wheel 3b are disposed between the belt conveyors 2a and 2b before and after the double-side scribe device SW shown in FIG. 3 so as to sandwich the mother substrate M from above and below. The cutter wheels 3a and 3b are held by the scribe heads 4 and 4 and are configured to be movable up and down so that they can be pressed against the mother substrate M with a set pressing force. It is configured to roll along the beams 5 and 5 in the X direction in FIG.
Further, in the single-sided scribing apparatus SS that performs the scribing process for forming the terminal region shown in FIG. 6, a backup roller 8 that is in contact with the substrate (unit display panel U) on a flat surface is used instead of the lower cutter wheel 3b in FIG. Will be.

For the mother substrate M, scribing and breaking are performed in the following procedure.
First, scribing along all Y-direction scribe lines L is performed on the mother substrate M shown in FIG. 4A by the upper and lower cutter wheels 3a and 3b of the scribing device SW described above. As shown in FIG. 4B, scribe lines S1 for cutting are processed above and below the substrate M. Thereafter, the mother substrate M is sent to the breaking device B, and is divided from the scribe line S1, and a rectangular strip-shaped substrate M1 in which four unit display panels U are arranged in series as shown in FIG. Cut out.

  As the breaking device B used in the present invention, a generally known device can be used. For example, as shown in FIG. 5, it is constituted by a pair of left and right receiving parts 6 and 6 that receive the strip-shaped substrate M1 from the lower surface across the scribe line S1, and a break bar 7 that descends from above toward the scribe line S1, By pressing the break bar 7 against the scribe line S1, the substrate M1 is bent to break. The break is performed one side at a time by turning the substrate M1 upside down using a turning robot (not shown).

Next, the cut strip-shaped substrate M1 is rotated 90 degrees on a horizontal plane. The substrate is rotated by a turntable (not shown). Then, scribing along all the planned scribe lines L in the X direction is performed by the upper and lower cutter wheels 3a, 3b. As a result, as shown in FIG. 4 (d), the scribe line S2 for cutting is processed vertically (X direction) of the strip-shaped substrate M1. After that, the strip-shaped substrate M1 is sent to the break device B in the same manner as described above, and is divided into individual unit display panels U from the scribe line S2, as shown in FIG.
Thereafter, the unit display panel U is sent to a single-side scribe device SS (see FIG. 6) for forming a terminal region, and a half-cut scribe line for forming the terminal region T is formed as shown in FIG. S3 is processed into the first substrate G1. The scribe line S3 is processed at a position close to one of the four surroundings of the unit display panel U, for example, a position entering 2 mm inside from the periphery.

  When processing, the unit display panel U is a belt conveyor so that when viewed from the front, the upper side is the first substrate G1 (CF side substrate) and the lower side is the second substrate G2 (TFT side substrate). 6 is mounted. Then, the upper cutter wheel 3a is lowered on the surface of the first substrate G1 to process the scribe line S3. At this time, the lower surface (second substrate G2 side) of the unit display panel U facing the upper cutter wheel 3a is received by the backup roller 8 having a flat peripheral surface. The backup roller 8 is previously installed on the lower beam 5 of the scribe device SS. In the scribing process, the groove depth of the scribe line S3 is set to about 80% of the thickness of the first substrate G1, so that an unexpected crack due to excessive pressing does not occur.

In this way, after cutting the mother substrate M into the unit display panel U, by processing the scribe line S3 for forming the terminal region T, the processing area of the scribe line S3, that is, the rolling distance of the cutter wheel 3a, Compared with the case of processing the mother substrate M having a large area, it can be greatly shortened. Thereby, even if it is a terminal area | region with a small width | variety of about 2 mm, since the rolling distance of a cutter wheel is short, it can scribe with the precision as set over the full length of the scribe line S3.
Further, since the terminal region T is not exposed until immediately before the process described below and is covered with the end material E (see FIG. 7 and the like), the terminal region T is protected from an impact during transportation.

The unit display panel U in which the scribe line S3 for forming the terminal region T is processed next removes the end material portion E covering the terminal region T, so that the end material removing mechanism 10 (terminal region processing apparatus) shown in FIG. ).
As shown in FIGS. 7A to 7C, the end material removing mechanism 10 sucks and lifts the unit display panel U until the terminal region T (see FIG. 6) is in a vertical posture. A substrate holding member 12 that rotates about the pivot 11 is provided. The substrate holding member 12 can be constituted by, for example, a suction plate having a number of air suction holes on the suction surface. Furthermore, the board | substrate holding member 12 is comprised so that it can move up and down with the cylinder 13, and the cylinder 13 can move along the rail 14 to an end material removal position. In the illustrated example, the movement is made along the X direction orthogonal to the Y direction, but the movement may be made in the Y direction.

  Further, the end material removing mechanism 10 includes a pressing member 15 that presses the vicinity of the scribe line S3 formed on the first substrate G1 of the unit display panel U standing vertically, as shown in FIG. Opposite to the scribe line S3 on the second substrate G2 side, the rotating body 16 that rotates in contact with the surface of the end material portion E in the direction of separating the end material portion E in the vicinity of the scribe line S3 across the scribe line S3. And a plate-like break bar 17 which is disposed at a position and presses the surface of the second substrate G2. In the embodiment of FIG. 8, a circular rotating roller 18 is used as the rotating body 16.

The break bar 17 presses the surface of the second substrate G2 on the opposite side corresponding to the position of the scribe line S3 of the first substrate G1 sandwiched between the pressing member 15 and the rotator 16, so that the unit display panel U Is bent between the pressing member 15 and the rotary body 16 to penetrate the crack of the scribe line S3 (having a depth of about 80% of the substrate plate thickness) in the thickness direction of the first substrate G1, thereby completely dividing it. To do. The rotating body 16 rotates counterclockwise after the operation of the break bar 17, and the end material portion E is peeled off from the unit display panel U by the contact with the rotating body 16 and dropped downward. The surface of the rotating body 16 is preferably made of a material having a large coefficient of friction such as rubber so that the end material portion E can be easily peeled off by rotating contact.
In this way, a one-terminal unit display panel U in which the terminal region T is formed in one of the peripheral areas is completed.

  In the above embodiment, the circular rotating roller 18 is used as the rotating body 16, but it can also be formed as a rotating belt 20 that rotates between two ring bodies 19, 19 as shown in FIG. 9. In this case, the rotating belt 20 is configured such that a part of the rotating belt 20 comes into contact with the end material portion E of the unit display panel U set up vertically.

  In the present invention, it is also possible to form the surface of the rotating body 16 with an adhesive material. Thereby, the end material portion E can be more reliably removed from the unit display panel U. In this case, the end material portion E adsorbed by the rotating body 16 is brought into contact with a peeling member 21 such as a spatula at a position away from the unit display panel U as shown in FIGS. 10 (a) and 10 (b). It is preferable to peel from the rotating body 16. Further, as shown in FIG. 10B, a cleaning tank 22 for cleaning minute cullet debris adhering to the surface of the rotating body 16 is provided, and a part of the rotating body 16 is hidden in the cleaning tank 22. May be washed.

In the above embodiment, since the end material portion E is removed in a posture in which the unit display panel U is set up vertically by the substrate holding member 12, the end material portion E is easily moved by its own weight and the rotating contact of the rotating body 16. It can be peeled and dropped downward. In addition, fine cullet such as cullet generated during the scribe line processing can be dropped downward by its own weight simultaneously with the removal of the end material portion E, and a good product can be obtained.
However, in the present invention, as shown in FIG. 11, it is also possible to remove the end material portion E by the rotating body 16 in the same manner as described above while keeping the unit display panel U in a horizontal posture. In this case, the first substrate G1 processed with the scribe line S3 is placed on the lower side, and the part of the scribe line S3 is placed on the base plate 23 so as to protrude from the base plate 23 supporting the unit display panel U. Place. Then, the pressing member 15 and the rotating body 16 are arranged in the same positional relationship as in the previous embodiment with the break bar 17 facing upward. Then, the break bar 17 is lowered to break the scribe line S3 of the first substrate G1, and the end material portion E is removed by the rotation of the rotating body 16.

  In the above embodiment, a single-terminal unit display panel has been described. However, in the case of a two-terminal, three-terminal, and four-terminal unit display panel, the above-described scribing process for forming the terminal region and the end material portion The removal process may be performed by the number of terminal regions.

  Although typical examples of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and is appropriately modified and changed within the scope of achieving the object and not departing from the spirit of the invention. It is possible.

  The substrate processing system and the substrate processing method of the present invention can be used for processing a unit display panel having a terminal region portion on at least one side of the periphery.

10 End material removal mechanism (terminal area processing equipment)
12 substrate holding member 15 holding member 16 rotating body 17 break bar 18 rotating roller 20 rotating belt 21 peeling member Ca just cut surface Cb terminal cut surface G1 first substrate (CF side substrate)
G2 Second substrate (TFT side substrate)
E End material portion M Mother substrate S1 Y-direction scribe line S2 X-direction scribe line S3 Scribe line for forming terminal area T Terminal area U Unit display panel

Claims (3)

A substrate processing system for cutting out a unit substrate having a terminal region on at least one side from a mother substrate obtained by bonding a first substrate and a second substrate,
A first scribe section for processing a first scribe line for cutting out a strip-shaped substrate in which a plurality of unit substrates are arranged in a row from the mother substrate into a first substrate and a second substrate;
A first break portion for obtaining a strip-shaped substrate by breaking along the first scribe line;
A second scribe section for processing a second scribe line for cutting out a unit substrate from the strip-shaped substrate into a first substrate and a second substrate;
A second break part for obtaining individual unit substrates by breaking along the second scribe line;
For each unit substrate, a third scribe portion for processing a third scribe line for dividing a terminal region provided on the second substrate to a position facing the terminal region of the first substrate;
A substrate processing system comprising: a third break portion that breaks along the third scribe line and divides an end material portion of the first substrate that covers the terminal region. The third break portion is
A rotating body in contact with the end material portion;
A pressing member for pressing the surface of the first substrate opposite to the end material portion across the third scribe line;
The substrate processing system according to claim 1, further comprising: a break bar that is disposed at a position facing the third scribe line on the second substrate side and presses the surface of the second substrate. A substrate processing method for cutting out a unit substrate having a terminal region on at least one side from a mother substrate obtained by bonding a first substrate and a second substrate,
A first scribe step of processing a first scribe line for cutting out a strip-shaped substrate in which a plurality of unit substrates are arranged in a row from the mother substrate into a first substrate and a second substrate;
A first breaking step of obtaining a strip-shaped substrate by breaking along the first scribe line;
A second scribe step of processing a second scribe line for cutting out the unit substrate from the strip substrate into the first substrate and the second substrate;
A second breaking step of obtaining individual unit substrates by breaking along the second scribe line;
For each unit substrate, a third scribe step for processing a third scribe line for dividing a terminal region provided on the second substrate to a position facing the terminal region of the first substrate;
A substrate processing method comprising: a third breaking step that breaks along the third scribe line and divides an end material portion of the first substrate that covers the terminal region.

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