CN106569359A - Method for cutting bonded substrate and adhesive substrate cutting system using the same - Google Patents
Method for cutting bonded substrate and adhesive substrate cutting system using the same Download PDFInfo
- Publication number
- CN106569359A CN106569359A CN201610864426.0A CN201610864426A CN106569359A CN 106569359 A CN106569359 A CN 106569359A CN 201610864426 A CN201610864426 A CN 201610864426A CN 106569359 A CN106569359 A CN 106569359A
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- China
- Prior art keywords
- submounts
- cut
- substrate
- cutting
- base plate
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
The present invention discloses a method for cutting a bonded substrate and an adhesive substrate cutting system using the same. The method comprising the steps of: cutting off the upper substrate and the lower substrate along the cut line at the same time; and a step of separating the sub-substrate from the mother substrate, wherein the sub-substrate is formed by cutting the upper sub- And a step of cutting off any one of the upper sub-substrate and the lower sub-substrate along the second cut line; and separating the sub-substrate from the second sub-substrate The line cut off the removed part of the step. Since the cutting process for cutting off the mother substrate is divided into a second cutting step of separating the two substrates from separating the two substrates and separating only one of the two substrates, it is possible to easily and safely cut off Processing.
Description
Technical field
The present invention relates to adhesive base plate cutting-off method and the adhesive base plate cutting system using the method, more particularly to it is a kind of
For cutting off the adhesive base plate cutting-off method of the bonding brittle base such as LCD panel (LCD Panel) and gluing using the method
Close substrate cutting system.
Background technology
LCD panel is typically to bond brittle base, can be by (cutting) is cut off along cutting line by multiple units
(Cell) mother (mother) substrate for constituting is divided into each subelement and is formed.As above, can be by being formed along the operation that cutting line cuts off
LCD panel.
The mother substrate has the upper substrate for being formed with light filter (color filter) and is formed with thin film transistor (TFT)
The structure that is bonded to each other of lower basal plate.Herein, the upper substrate is formed with top cutting line, and the lower basal plate is formed with
Bottom cutting line, in most cases the lower basal plate be also formed with perform electrode connecting portion effect gasket part, therefore
It is inconsistent between the top cutting line and the bottom cutting line.
Fig. 1 is the concept map for illustrating existing adhesive base plate cutting-off method.
Referring to Fig. 1, due to inconsistent between the top cutting line and the bottom cutting line, therefore in the past can be along institute
Upper substrate described in the cutting line irradiating laser tractotomy of top is stated, along under described in the bottom cutting line irradiating laser tractotomy
Portion's substrate.
However, the adhesive base plate cutting-off method according to Fig. 1, due to the top cutting line and the bottom cutting line
Between it is inconsistent, therefore cut off operation is considerably complicated, and when cutting off the upper substrate laser beam a part through being mapped to
In the case of being formed at the electrode pattern or adjacent part of the gasket part of the lower basal plate, the electrode pattern can be caused
Thermal deformation.Herein, these thermal deformations ultimately cause product occur be powered it is bad such that it is able to cause using its display device without
Method light or cannot normally image output etc. it is bad.
Furthermore it is also possible to the skive (Diamond wheel) for passing through directly contact different from laser beam is cut
Disconnected processing.However, these cutting off processing are also caused because of inconsistent between the top cutting line and the bottom cutting line
The physical pressure point of interaction is inconsistent, therefore the section right angle out of plumb of adhesive base plate can be crushed.Especially in bonding
In the case of the thickness of thin of substrate, this phenomenon can be aggravated.
The content of the invention
Technical problem
The present invention is used to solve these problems, it is an object of the invention to provide one kind simpler, safely can be entered
The adhesive base plate cutting-off method of row cutting off processing.
Also, a kind of it is an object of the invention to provide adhesive base plate cut-out system using the adhesive base plate cutting-off method
System.
Technical scheme
Adhesive base plate cutting-off method according to an embodiment of the invention is used for cut-out and is glued by upper substrate and lower basal plate
The mother substrate for closing, including：(cutting) described upper substrate and the lower basal plate are cut off simultaneously along the first cutting line
The step of；The step of submounts are separated from the mother substrate, wherein the submounts are by described along first cutting line cut-out
The top submounts and the bottom submounts for cutting off the lower basal plate formation along first cutting line that upper substrate is formed glue
Close and formed；The step of any one substrate in the top submounts and the bottom submounts is cut off along the second cutting line；With
And separate from described any one substrate need along second cutting line cut off the part for removing the step of.
Ultra-short pulse laser (ultra-short pulse can be utilized along in the step of the first cutting line cut-out
Laser filament (filamentation))) cuts off the upper substrate and the bottom simultaneously along first cutting line
Substrate.
Or, can utilize along in the step of the first cutting line cut-out and be arranged respectively at the upper substrate and institute
Upper and lower two for stating lower basal plate fracture (scribing) device along first cutting line while cutting off the top base
Plate and the lower basal plate, herein, each breaking device is included in laser and skive (diamond wheel) arbitrarily
One.
The submounts can be adsorbed by selection machine (picker) in the step of submounts are separated from the mother substrate
The submounts are separated from the mother substrate.
Or, the step of separate the submounts from the mother substrate in can pass through fracture bar (breaking bar) and disconnected
Material roller (breaking roller) pressurizes the submounts from the mother substrate separation submounts.
The step along the cut-out of the second cutting line can be described along second cutting line cut-out using CO2 laser
Any one substrate in top submounts and the bottom submounts.
The step of part for needing to remove is separated from described any one substrate can be by by bar (bar) and roller
(roller) the presser unit pressurization that any one is constituted in needs the part for removing to fracture along second cutting line
(break), after, the part for needing to remove is separated from described any one substrate.
The presser unit can have width from outer lateral second cutting line of the part for needing to remove by
Gradual change narrow awl (taper) shape.
Also, adhesive base plate cutting system according to an embodiment of the invention is used for cut-out by upper substrate and bottom base
The mother substrate that plate is bonded, including the first cut-out equipment, the second cut-out equipment and control device.
The first cut-out equipment cuts off (cutting) described upper substrate and the bottom base along the first cutting line
Plate, separates submounts from the mother substrate, wherein the submounts cut off the upper substrate shape by along first cutting line
Into top submounts and cut off the bottom submounts that the lower basal plate formed along first cutting line and bond and to be formed.It is described
Second cut-out equipment cuts off any one substrate in the top submounts and the bottom submounts along the second cutting line, from institute
Stating any one substrate and separating needs the part for removing is cut off along second cutting line.The control device control described first
Cut-out equipment and the second cut-out equipment.
The first cut-out equipment may include the first workbench, the first shearing device, the first mobile device and the first separation
Device.First workbench can support the mother substrate.First shearing device can cut off the mother substrate.It is described
First mobile device can move in first shearing device and first workbench at least one so that described first cuts
Disconnected device can cut off the upper substrate and the lower basal plate along first cutting line.The first segregation apparatuss energy
It is enough to separate the submounts from the mother substrate.
First shearing device is may include at least one in laser and skive (diamond wheel).Or,
First shearing device includes can be using filament (filamentation) while cutting off the upper substrate and the bottom
The ultra-short pulse laser of substrate.
First segregation apparatuss include to separate the submounts from the mother substrate by adsorbing the submounts
Selection machine (picker).
Or, first segregation apparatuss may include can be described from mother substrate separation by the submounts that pressurize
At least one in the fracture bar (breaking bar) and material breaking roller (breaking roller) of submounts.
The control device can control first shearing device and first mobile device is caused along described
Cut off along first cutting line after any one substrate in the one cutting line cut-out upper substrate and the lower basal plate
Another substrate, or while cut off the upper substrate and the lower basal plate.
The second cut-out equipment may include the second workbench, the second shearing device, the second mobile device and the second separation
Device.Second workbench can support the submounts.Second shearing device can cut off the submounts.It is described
Second mobile device can move in second shearing device and second workbench at least one so that described second cuts
Disconnected device can cut off any one in the top submounts and the bottom submounts along second cutting line.It is described
Second segregation apparatuss can separate the part for needing to remove from described any one substrate.
Second shearing device is included at least one in laser and skive (diamond wheel).Also, institute
Stating the second shearing device may include laser of the absorbance higher than transmitance.Also, second shearing device may include that CO2 swashs
Light.
Second segregation apparatuss may include to pressurize needs the part for removing to cause the portion for needing to remove
Dividing can be from the detached presser unit of described any one substrate.
Second segregation apparatuss can also include：Side support unit, its support corresponding to the top submounts and
The part of second cutting line of another substrate in the bottom submounts；And opposite side support unit, which supports institute
State any one substrate.
The presser unit may include any one in bar (bar) and roller (roller).
Outer lateral second cutting line of the part that the presser unit can be removed from needs with width is gradually
Awl (taper) shape for narrowing.
The adhesive base plate cutting system can also include cutting to described second under the control of the control device
Transporting apparatus of the disconnected equipment transfer in the detached submounts of the described first cut-out equipment.
Technique effect
As described above, adhesive base plate cutting-off method of the invention and the adhesive base plate cutting system using the method,
Cut-out is divided into the operation for separating submounts by the mother substrate of two base plate bondings and cut off together described two substrates and enter
Detached first cut off operation of row carries out detached second cut off operation with the substrate only cut off in described two substrates and enters
OK, therefore, it is possible to simplify device structure, and the management of operation parameter can also become to be more prone to.
Also, even if the size of mother substrate or submounts changes, operating personnel still can be in the not addition on equipment
Easily tackle in the case of other devices.
Also, when second cut off operation only cuts off a substrate in described two substrates, using absorbance it is higher than
The CO2 laser or the skive without thermal property of transmitance is cut off, therefore, it is possible to suppressing or minimize to described two
Another substrate in individual substrate causes hot injury.
Description of the drawings
Fig. 1 is the concept map for illustrating existing adhesive base plate cutting-off method；
Fig. 2 is the block diagram for showing adhesive base plate cutting system according to an embodiment of the invention；
Fig. 3 is the plane graph for showing the mother substrate for needing to cut off by the adhesive base plate cutting system of Fig. 2；
Fig. 4 is the profile of the second segregation apparatuss of the second cut-out equipment in the adhesive base plate cutting system for show Fig. 2；
Fig. 5 is the flow chart for illustrating adhesive base plate cutting-off method according to an embodiment of the invention；
Fig. 6 is the plane graph for illustrating the process cut off along the first cutting line in the adhesive base plate cutting-off method of Fig. 5；
Fig. 7 be conceptually illustrate Fig. 5 adhesive base plate cutting-off method in along the first cutting line cut-out after carry out it is detached
The axonometric chart of process；
Fig. 8 is the plane graph for illustrating the process cut off along the second cutting line in the adhesive base plate cutting-off method of Fig. 5；
Fig. 9 is the axonometric chart for illustrating the process cut off along the second cutting line in the adhesive base plate cutting-off method of Fig. 5；
Figure 10 is the axonometric chart for conceptually showing the state after the process of Fig. 9 is separated.
Description of reference numerals
10：Mother substrate 20：Submounts
100：First cut-out equipment 110：First workbench
120：First shearing device 130：First mobile device
140：First segregation apparatuss 200：Transporting apparatus
300：Second cut-out equipment 310：Second workbench
320：Second shearing device 330：Second mobile device
340：Second segregation apparatuss 342：Side support unit
344：Opposite side support unit 336：Presser unit
Specific embodiment
The present invention can do numerous variations, can have variform, show specific embodiment below in the accompanying drawings and saying
It is specifically described in bright book.
But its purpose not limits the invention to disclosed form, is actually construed as including inventive concept
And the had altered, equivalent and substitute in technical scope.First, second grade term can be used to illustrate various elements,
But the element must not be defined in the term.The term is only intended to distinguish an element and other compositions will
Element.For example, on the premise of without departing from technical solution of the present invention, the first element can be named as the second element,
Equally the second element can also be named as the first element.
Term used in this application be only intended to illustrate specific embodiment, and and the non-limiting present invention.The table of odd number
Existing form also includes plural number in the case of without specified otherwise.The terms such as " the including " or " having " in the application should be understood
To there is feature described in description, numeral, step, action, element, part or its combination, and should not be construed as pre-
One or more other features or numeral, step, action, element, part or its combination are excluded first
The preferred embodiments of the present invention are illustrated referring to accompanying drawing below.
Fig. 2 is the block diagram for showing adhesive base plate cutting system according to an embodiment of the invention, and Fig. 3 needs logical for display
Cross the plane graph of the mother substrate of the adhesive base plate cutting system cut-out of Fig. 2.
Referring to Fig. 2 and Fig. 3, the adhesive base plate cutting system of the present embodiment be turned off upper substrate and lower basal plate bonding and
Into mother substrate 10 shearing device.
In the present embodiment, the mother substrate 10 may include at least one submounts 20, for example, may include to be arranged in two rows four
Eight submounts 20 of row.Also, could be formed with for performing the first cut off operation first to cut off on the mother substrate 10
Line CL1 and the second cutting line CL2 for performing the second cut off operation.Herein, the first cutting line CL1 and the second cutting line
CL2 can directly be marked on the line of the mother substrate 10 but it is also possible to be not directly being marked on the mother substrate 10 but only in institute
State the imaginary line that the control process of control device 400 shows.
In addition, can be for example LCD panel, have by each described submounts 20 that the mother substrate 10 will be generated
Machine luminescence display panel.For lifting specific example, the lower basal plate can be formed with multiple pixels, various drive circuits and pad
Portion, the upper substrate can also be formed with light filter.Also, the upper substrate and the lower basal plate can be by as crisp
Property material glass material constitute.
The adhesive base plate cutting system may include the first cut-out equipment 100, transporting apparatus 200, the second cut-out equipment 300
And control device 400.
The first cut-out equipment 100 can be performed under the control of the control device 400 and cut off the mother substrate 10
The first cut off operation.Specifically, the first cut-out equipment 100 can be being cut off along the first cutting line CL1
(cutting), after the upper substrate and the lower basal plate, execution is individually separated the submounts 20 from the mother substrate 10
Action.Herein, detached each submounts 20 are to cut off the upper of the upper substrate formation along the first cutting line CL1
The structure that portion's submounts and the bottom submounts for cutting off the lower basal plate formation along the first cutting line CL1 are bonded.
The transporting apparatus 200 are driven under the control of the control device 400.The transporting apparatus 200 can be by from described
First cut-out equipment, 100 detached each submounts 20 are transplanted on the second cut-out equipment 300.For example, the transfer sets
Standby 200 can have the transfer members such as conveyer belt, transfer robot.
The second cut-out equipment 300 can be performed under the control of the control device 400 and cut through the transfer
Second cut off operation of the submounts 20 of the transfer of equipment 200.Specifically, the second cut-out equipment 300 can be performed
Any one substrate in the top submounts and the bottom submounts is cut off along the second cutting line CL2, from described
One substrate of meaning separates the action for needing that the part for removing is cut off along the second cutting line CL2.Herein, can make described any
One substrate is the top submounts, and another substrate is the bottom submounts.
The control device 400 can control the first cut-out equipment 100, transporting apparatus 200 and described respectively
Two cut-out equipment 300.The control device 400 can be the computer installation for being provided with the program for performing cut off operation.
Hereinafter the first cut-out equipment 100 is specifically described.
The first cut-out equipment 100 may include the first workbench 110, the first shearing device 120, the first mobile device
130 and first segregation apparatus 140.Herein, first shearing device 120, first mobile device 130 and described first point
Can be controlled by the control device 400 respectively from device 140.
First workbench 110 can support the mother substrate 10.
First shearing device 120 be separated by positioned at the top of first workbench 110, can cut off and be configured at institute
State the mother substrate 10 on the first workbench 110.First shearing device 120 can for example include laser and boart boart
At least one in wheel (diamond wheel).Herein, in the case that first shearing device 120 is made up of laser, can wrap
Including by applying the general laser that cut off of heat-flash to focus, or can include utilizing filament
(filamentation) while cutting off the ultra-short pulse laser (ultra-short of the upper substrate and the lower basal plate
pulselaser)。
First mobile device 130 can be moved in first shearing device 120 and first workbench 110 extremely
Few one enable first shearing device 120 along the first cutting line CL1 cut-outs upper substrate and it is described under
Portion's substrate.For example, first mobile device 130 may include to be arranged at first workbench 110 along X-axis movement described the
The X-axis move portion of one workbench 110 and be arranged at first shearing device 120 and first shearing device moved along Y-axis
120 Y-axis move portion.In addition, the X-axis move portion and the Y-axis move portion can all be arranged at the first cut-out dress
Put 120 and first shearing device 120 is moved along X-axis and Y-axis, or can all be arranged at 110 edge of the first workbench
X-axis and Y-axis moves first workbench 110.
First segregation apparatuss 140 can be separated from the mother substrate 10 and be cut off by first shearing device 120
The submounts 20.For example, first segregation apparatuss 140 may include to adsorb the submounts 20 from 10 points of the mother substrate
From the selection machine (picker) of the submounts 20.That is, described selection machine can slightly apply after the submounts 20 are adsorbed external force from
The mother substrate 10 separates the submounts 20.Or, first segregation apparatuss 140 may include can be by the son that pressurizes
Substrate 20 separates the fracture bar (breaking bar) and material breaking roller (breaking of the submounts 20 from the mother substrate 10
Roller at least one in).
Second cut-out equipment 300 described in detailed description below.
The second cut-out equipment 300 may include the second workbench 310, the second shearing device 320, the second mobile device
330 and second segregation apparatus 340.
Second workbench 310 can support the submounts 20.
Second shearing device 320 be separated by positioned at the top of second workbench 310, can cut off and be configured at institute
State the submounts 20 on the second workbench 310.Second shearing device 320 for example may include laser and skive
At least one in (diamond wheel).Herein, in the case that second shearing device 320 is made up of laser, can include
Transmitance can for example include CO2 laser higher than the laser of absorbance.For lifting specific example, second shearing device 320
May include centre wavelength be for about the Surface absorption rate of 9um～11um and glass be that more than 87.3%, reflectance is 12.7%, passes through
Rate is less than 0.01% CO2 laser.
Second mobile device 330 can be moved in second shearing device 320 and second workbench 310 extremely
Few one enables second shearing device 320 to cut off any one in the top submounts and the bottom submounts
Substrate, for example, make it possible to cut off the top submounts along the second cutting line CL2.For example, the second movement dress
Put 330 may include to be arranged at second workbench 310 and along an axle move second workbench 310 an axle move portion and
Be arranged at second shearing device 320 and second shearing device 320 is moved along another axle perpendicular to an axle
Another axle move portion.Furthermore it is possible to make the axle move portion and another axle move portion all be arranged at described second cut
Disconnected device 320 and second shearing device 320 is moved along an axle and another axle, or make all to be arranged at institute
State the second workbench 310 and second workbench 310 is moved along an axle and another axle.
Second segregation apparatuss 340 can be from described any one substrate, and for example separating from the top submounts needs
The part for removing is cut off along the second cutting line CL2.
Fig. 4 is the profile of the second segregation apparatuss of the second cut-out equipment in the adhesive base plate cutting system for show Fig. 2.
Referring to Fig. 4, second segregation apparatuss 340 may include side support unit 342, opposite side support unit 344 and
Presser unit 336.
The side support unit 342 can support another substrate in the top submounts and the bottom submounts,
The part of the second cutting line CL2 corresponding to the bottom submounts can for example be supported.Herein, the side supports single
Unit 342 may include to press the pressure that the part of the second cutting line CL2 corresponding to the bottom submounts is supported
Roller.
344 pressable of opposite side support unit supports described any one substrate, such as described top submounts.This
Place, the opposite side support unit 344 are configurable in described any one substrate from the second cutting line CL2 to inner side phase
Every position pressurization support described in any one substrate.
The presser unit 336 can be pressurizeed described any one substrate, the portion for needing and removing of can for example pressurizeing
Divide and the part for needing to remove is separated from the top submounts.The presser unit 336 can for example include bar
(bar) and in roller (roller) any one.Herein, the presser unit 336 can have width to need removal portion from described
Awl (taper) shape that the outer lateral second cutting line CL2 for dividing becomes narrow gradually, enabling efficiently separate the need
Part to be removed.
The method that detailed description below cuts off adhesive base plate using the adhesive base plate cutting system.
Fig. 5 is the flow chart for illustrating adhesive base plate cutting-off method according to an embodiment of the invention, Fig. 6 be for
The plane graph of the process cut off along the first cutting line in illustrating the adhesive base plate cutting-off method of Fig. 5, Fig. 7 are conceptually explanation figure
The axonometric chart of detached process is carried out in 5 adhesive base plate cutting-off method along the cut-out of the first cutting line.
Fig. 5, Fig. 6 and Fig. 7 show the adhesive base plate cutting-off method of the present embodiment, in step S10, the control device 400
Can pass through to control first shearing device 120 respectively and first mobile device 130 is cut along the first cutting line CL1
The disconnected mother substrate 10 being configured on first workbench 110.Specifically, can be along the first cutting line CL1
Cut off the upper substrate and the lower basal plate simultaneously.
In the present embodiment, first shearing device 120 includes ultra-short pulse laser (ultra-short pulse
Laser in the case of), it is possible to use filament (filamentation) is cut off on described simultaneously along the first cutting line CL1
Portion's substrate and the lower basal plate.
Conversely, first shearing device 120 includes being respectively arranged at the upper of the upper substrate and the lower basal plate
Under two (scribing) devices that fracture in the case of, it is possible to use the breaking device is along the first cutting line CL1
Cut off the upper substrate and the lower basal plate simultaneously.Herein, each breaking device may include that applying heat-flash to focus enters
The general laser of row cut-out and by contacting any one in the skive (diamond wheel) that cut off.
Afterwards, in step S20, the control device 400 can be by controlling first segregation apparatuss 140, from described
Mother substrate 10 separates the submounts 20 along the first cutting line CL1 cut-outs.For example, first segregation apparatuss 140 are wrapped
In the case of including the selection machine (picker), the selection machine is slightly applied after adsorbing the submounts 20 by external force from the mother
Substrate 10 separates the submounts 20.Or, first segregation apparatuss 140 are appointed in including the fracture bar and the material breaking roller
In the case of meaning one, the submounts 20 can be separated from the mother substrate 10 by the submounts 20 that pressurize.
In addition, as above the detached submounts can cut off the upper substrate along the first cutting line CL1
The top submounts for being formed and the bottom subbase that the lower basal plate formation is cut off along the first cutting line CL1
The structure of plate bonding.
Then, in step S30, the control device 400 can will be by described the by controlling the transporting apparatus 200
One segregation apparatuss, the 140 detached submounts 20 are transplanted on second workbench 310.
Fig. 8 is the plane graph for illustrating the process cut off along the second cutting line in the adhesive base plate cutting-off method of Fig. 5, is schemed
9 is that Figure 10 is from concept for the axonometric chart for illustrating the process cut off along the second cutting line in the adhesive base plate cutting-off method of Fig. 5
The upper axonometric chart for showing the state after the process of Fig. 9 is separated.
Referring to Fig. 5 and Fig. 8 to Figure 10, in step S40, the submounts 20 are transplanted on the feelings of second workbench 310
Under condition, the control device 400 can be by controlling second shearing device 320 and second mobile device 330, edge respectively
The submounts 20 that the second cutting line CL2 cut-outs are configured on second workbench 310.Specifically, can be with
Any one substrate in the top submounts and the bottom submounts is cut off, for example can be along second cutting line
CL2 cuts off the top submounts.
In the present embodiment, second shearing device 320 can for example include laser and skive (diamond
Wheel at least one in).Herein, the laser can be laser of the absorbance higher than transmitance, for example, can be CO2 laser.
Then, in step S50, the control device 400 can be by controlling second segregation apparatuss 340 from described
One substrate of meaning is separated needs the part for removing is cut off along the second cutting line CL2.
For lifting specific example, the side support unit 342 supports the top submounts and the bottom submounts
In another substrate, for example support the part of the second cutting line CL2 corresponding to the bottom submounts, the opposite side
When the pressing of support unit 344 supports described any one substrate, such as top submounts, the presser unit 336 is pressurizeed
The part for needing to remove is separating from described any one substrate after fractureing (break) along the second cutting line CL2
It is described to need removal part.
According to above-mentioned the present embodiment, described female base that cut-out is bonded by the upper substrate and the lower basal plate
Plate 10 be divided into the operation for separating the submounts 10 cut off together described two substrates carry out detached first cut off operation with
Only cutting off a substrate in described two substrates and carrying out detached second cut off operation is carried out, therefore, it is possible to simplify equipment knot
Structure, and operation parameter management can also become to be more prone to.
Even if also, the size of the mother substrate 10 or submounts 20 changes with species, operating personnel still can be
Easily tackle in the case of not adding other devices on equipment.
Also, when second cut off operation only cuts off a substrate in described two substrates, using absorbance it is higher than
The CO2 laser or the skive without thermal property of transmitance is cut off, therefore, it is possible to suppressing or minimize to described two
Another substrate in individual substrate causes hot injury.
The present invention is illustrated above by reference to the preferred embodiments of the present invention, but the ordinary skill people of this area
Member is it should be understood which still can enter to the present invention in the range of the inventive concept and field recorded without departing from technical scheme
The various modifications of row and deformation.
Claims (24)
1. a kind of adhesive base plate cutting-off method, for cutting off the mother substrate being bonded by upper substrate and lower basal plate, which is special
Levy and be, including：
The step of cutting off the upper substrate and the lower basal plate simultaneously along the first cutting line；
The step of submounts are separated from the mother substrate, wherein the submounts cut off the top by along first cutting line
Top submounts and cut off the bottom submounts bonding shape that the lower basal plate is formed along first cutting line that substrate is formed
Into；
The step of any one substrate in the top submounts and the bottom submounts is cut off along the second cutting line；And
The step of part that needs are removed along second cutting line cut-out is separated from described any one substrate.
2. adhesive base plate cutting-off method according to claim 1, it is characterised in that：
Along in the step of the first cutting line cut-out, the filament using ultra-short pulse laser is same along first cutting line
When cut off the upper substrate and the lower basal plate.
3. adhesive base plate cutting-off method according to claim 1, it is characterised in that：
Along in the step of the first cutting line cut-out, using being arranged respectively at the upper substrate and the lower basal plate
Two upper and lower breaking devices cut off the upper substrate and the lower basal plate simultaneously along first cutting line,
Each breaking device includes any one in laser and skive.
4. adhesive base plate cutting-off method according to claim 1, it is characterised in that：
In the step of submounts are separated from the mother substrate, machine is selected by adsorbing the submounts from the mother substrate point
From the submounts.
5. adhesive base plate cutting-off method according to claim 1, it is characterised in that：
In the step of submounts are separated from the mother substrate, fracture bar and material breaking roller are by the submounts that pressurize from described
Mother substrate separates the submounts.
6. adhesive base plate cutting-off method according to claim 1, it is characterised in that：
Along in the step of the second cutting line cut-out, the top is cut off along second cutting line using CO2 laser
Any one substrate in submounts and the bottom submounts.
7. adhesive base plate cutting-off method according to claim 1, it is characterised in that：
In the step of part for needing to remove is separated from described any one substrate, by bar and roller any one constitute
After presser unit pressurization needs the part for removing to fracture along second cutting line, separating from described any one substrate needs
The part to be removed.
8. adhesive base plate cutting-off method according to claim 7, it is characterised in that：
The presser unit has what width was become narrow gradually from outer lateral second cutting line of the part for needing to remove
Awl shape.
9. a kind of adhesive base plate cutting system, for cutting off the mother substrate being bonded by upper substrate and lower basal plate, which is special
Levy and be, including：
First cut-out equipment, which cuts off the upper substrate and the lower basal plate along the first cutting line, and from female base
Plate separates submounts, wherein the submounts cut off the top submounts that the upper substrate is formed by along first cutting line
And the bottom submounts formed along first cutting line cut-out lower basal plate are bonded and to be formed；
Second cut-out equipment, which cuts off any one base in the top submounts and the bottom submounts along the second cutting line
Plate, and the part for needing that removal is cut off along second cutting line is separated from described any one substrate；And
Control device, its control first cut-out equipment and the second cut-out equipment.
10. adhesive base plate cutting system according to claim 9, it is characterised in that the first cut-out equipment includes：
First workbench, which can support the mother substrate；
First shearing device, which can cut off the mother substrate；
First mobile device, its can move in first shearing device and first workbench at least one cause it is described
First shearing device can cut off the upper substrate and the lower basal plate along first cutting line；And
First segregation apparatuss, which can separate the submounts from the mother substrate.
11. adhesive base plate cutting systems according to claim 10, it is characterised in that：
First shearing device is included at least one in laser and skive.
12. adhesive base plate cutting systems according to claim 10, it is characterised in that：
First shearing device includes to utilize filament while cutting off the ultrashort of the upper substrate and the lower basal plate
Pulse laser.
13. adhesive base plate cutting systems according to claim 10, it is characterised in that：
First segregation apparatuss include to pass through to adsorb the choosing that the submounts separate the submounts from the mother substrate
Select a good opportunity.
14. adhesive base plate cutting systems according to claim 10, it is characterised in that first segregation apparatuss include：
The submounts can be passed through to pressurize from least one in the fracture bar and material breaking roller of the mother substrate separation submounts
It is individual.
15. adhesive base plate cutting systems according to claim 10, it is characterised in that：
The control device controls first shearing device and first mobile device is caused along first cutting line
Cut off in the upper substrate and the lower basal plate another base is cut off along first cutting line after any one substrate
Plate, or while cut off the upper substrate and the lower basal plate.
16. adhesive base plate cutting systems according to claim 9, it is characterised in that the second cut-out equipment includes：
Second workbench, which can support the submounts；
Second shearing device, which can cut off the submounts；
Second mobile device, its can move in second shearing device and second workbench at least one cause it is described
Second shearing device can cut off any one in the top submounts and the bottom submounts along second cutting line
It is individual；And
Second segregation apparatuss, which can separate the part for needing to remove from described any one substrate.
17. adhesive base plate cutting systems according to claim 16, it is characterised in that：
Second shearing device is included at least one in laser and skive.
18. adhesive base plate cutting systems according to claim 16, it is characterised in that：
Second shearing device includes laser of the absorbance higher than transmitance.
19. adhesive base plate cutting systems according to claim 16, it is characterised in that：
Second shearing device includes CO2 laser.
20. adhesive base plate cutting systems according to claim 16, it is characterised in that second segregation apparatuss include：
Presser unit, its can pressurize need the described part for removing enable to need the part that removes from it is described arbitrarily
One substrate is separated.
21. adhesive base plate cutting systems according to claim 20, it is characterised in that second segregation apparatuss are also wrapped
Include：
Side support unit, its support is corresponding to described in another substrate in the top submounts and the bottom submounts
The part of the second cutting line；And
Opposite side support unit, which supports described any one substrate.
22. adhesive base plate cutting systems according to claim 20, it is characterised in that：
The presser unit includes any one in bar and roller.
23. adhesive base plate cutting systems according to claim 20, it is characterised in that：
The presser unit has what width was become narrow gradually from outer lateral second cutting line of the part for needing to remove
Awl shape.
24. adhesive base plate cutting systems according to claim 9, it is characterised in that also include：
Transporting apparatus, which can be cut off to the described second cut-out equipment transfer described first under the control of the control device
The detached submounts of equipment.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2015-0140660 | 2015-10-07 | ||
| KR20150140660 | 2015-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106569359A true CN106569359A (en) | 2017-04-19 |
Family
ID=58532574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610864426.0A Pending CN106569359A (en) | 2015-10-07 | 2016-09-29 | Method for cutting bonded substrate and adhesive substrate cutting system using the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106569359A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527802A (en) * | 2001-07-12 | 2004-09-08 | ������ҵ�ɷ�����˾ | Flat display panel and method of dividing the flat display panel |
| CN101232982A (en) * | 2005-05-30 | 2008-07-30 | 三星钻石工业株式会社 | Device and method for cutting off substrate of fragile material |
| CN101630804A (en) * | 2008-07-18 | 2010-01-20 | 三星钻石工业股份有限公司 | Method for processing terminal in bonded substrate |
| CN104118984A (en) * | 2013-04-25 | 2014-10-29 | 三星钻石工业股份有限公司 | Substrate processing system and substrate processing method |
-
2016
- 2016-09-29 CN CN201610864426.0A patent/CN106569359A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1527802A (en) * | 2001-07-12 | 2004-09-08 | ������ҵ�ɷ�����˾ | Flat display panel and method of dividing the flat display panel |
| CN101232982A (en) * | 2005-05-30 | 2008-07-30 | 三星钻石工业株式会社 | Device and method for cutting off substrate of fragile material |
| CN101630804A (en) * | 2008-07-18 | 2010-01-20 | 三星钻石工业股份有限公司 | Method for processing terminal in bonded substrate |
| CN104118984A (en) * | 2013-04-25 | 2014-10-29 | 三星钻石工业股份有限公司 | Substrate processing system and substrate processing method |
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Application publication date: 20170419 |