TW201345856A - Method of cutting glasses and cutting apparatus - Google Patents

Method of cutting glasses and cutting apparatus Download PDF

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TW201345856A
TW201345856A TW101115634A TW101115634A TW201345856A TW 201345856 A TW201345856 A TW 201345856A TW 101115634 A TW101115634 A TW 101115634A TW 101115634 A TW101115634 A TW 101115634A TW 201345856 A TW201345856 A TW 201345856A
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glass substrate
cutting
predetermined
strengthened glass
predetermined cutting
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TW101115634A
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TWI481576B (en
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Tsutomu Ueno
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Taiwan Mitsuboshi Diamond Ind Co Ltd
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Abstract

A cutting method and a cutting apparatus are provided for cutting a strengthened glass substrate to form a plurality of glass products. The strengthened glass substrate comprises a plurality of edges. The cutting apparatus applies the cutting method of this invention and comprises a cutting tool and a taking-out tool. The cutting tool is for scribing the strengthened glass substrate along a plurality of first predetermined cutting lines. Therein, each of the first predetermined cutting lines extends along a plurality of edges of each of the glass products and spaced apart from all other predetermined cutting lines on the strengthened glass substrate and the edges of the strengthened glass substrate. The taking-out tool is for taking out the glass products from the strengthened glass substrate.

Description

切割玻璃之方法及切割設備Method for cutting glass and cutting device

本發明係關於一種切割玻璃之方法及切割設備,特別是關於一種切割一強化玻璃基板之切割方法及切割設備。The present invention relates to a method of cutting glass and a cutting apparatus, and more particularly to a cutting method and a cutting apparatus for cutting a strengthened glass substrate.

目前玻璃基板廣泛運用在電子產品之各種零件中,如螢幕、觸控面板、外殼等。為了避免玻璃基板被刮傷或易於破裂,通常用於電子產品之玻璃基板均需經過強化。如圖1所示,強化玻璃基板1包含一拉伸層11及形成於拉伸層11外側上之至少一壓縮層12。其中,拉伸層11具有拉伸內應力,而壓縮層12具有壓縮內應力,如此的應力分布方式使強化玻璃基板1外層即使受到外力造成淺層刮痕,亦不易碎裂,但強化玻璃基板1亦因此而難以切割,所以需要特殊的工具與設備進行裁切。請參考圖1及2A,通常,強化玻璃基板1具較大尺寸,需經切割成配合各式家電或電子產品之所需之玻璃產品10。At present, glass substrates are widely used in various parts of electronic products, such as screens, touch panels, and housings. In order to prevent the glass substrate from being scratched or easily broken, the glass substrate generally used for electronic products needs to be strengthened. As shown in FIG. 1, the strengthened glass substrate 1 includes a stretched layer 11 and at least one compressive layer 12 formed on the outer side of the stretched layer 11. The tensile layer 11 has a tensile internal stress, and the compression layer 12 has a compressive internal stress. The stress distribution is such that the outer layer of the strengthened glass substrate 1 is not easily broken even if it is subjected to a shallow scratch caused by an external force, but the glass substrate is strengthened. 1 is also difficult to cut, so special tools and equipment are required for cutting. Referring to FIGS. 1 and 2A, in general, the tempered glass substrate 1 has a large size and needs to be cut into a glass product 10 required for various home appliances or electronic products.

茲敘述一習知強化玻璃基板1之切割方法如下。於第一步驟,將強化玻璃基板1沿如圖2A所示之預定切割線201,自強化玻璃基板1之其中之一邊緣13,預先刻劃強化玻璃基板1。其中,刻劃強化玻璃基板1之深度需超過壓縮層12之厚度,如此強化玻璃基板1便會因拉伸層11之拉伸內應力而自然分裂成為複數子基板1A,如圖2B所示。於第一步驟後,亦可施加外力使強化玻璃基板1彎曲,以協助強化玻璃基板1分裂成為複數子基板1A。A method of cutting a conventional tempered glass substrate 1 is described below. In the first step, the tempered glass substrate 1 is scribed in advance on one of the edges 13 of the tempered glass substrate 1 along a predetermined dicing line 201 as shown in FIG. 2A. Here, the depth of the tempered glass substrate 1 needs to exceed the thickness of the compression layer 12, so that the tempered glass substrate 1 is naturally split into the plurality of sub-substrates 1A due to the tensile internal stress of the tensile layer 11, as shown in FIG. 2B. After the first step, an external force may be applied to bend the strengthened glass substrate 1 to assist in strengthening the splitting of the glass substrate 1 into the plurality of sub-substrates 1A.

於第二步驟,預設一用於將強化玻璃基板1之子基板1A切割成所需尺寸的預定切割線202,其係如圖2B所示之預定切割線202,實際刻劃時,係自強化玻璃基板1之子基板1A之另一邊緣13上之一點,沿著箭號朝子基板1A之預定切割線202刻劃,如此則刻劃線將沿相應各強化玻璃產品10之預定複數邊緣延伸,而環繞刻劃出玻璃產品10之形狀。In the second step, a predetermined cutting line 202 for cutting the sub-substrate 1A of the tempered glass substrate 1 into a desired size is prepared, which is a predetermined cutting line 202 as shown in FIG. 2B, and is self-reinforcing when actually scribing. A point on the other edge 13 of the sub-substrate 1A of the glass substrate 1 is scored along the arrow toward the predetermined cutting line 202 of the sub-substrate 1A, so that the scribe line will extend along the predetermined plurality of edges of the respective tempered glass products 10, and The shape of the glass product 10 is engraved around.

在上述第二步驟後,如圖2B所示,習知切割方法為了更容易將強化玻璃產品10取出,而於第三步驟中於耳料14上沿複數預定切割線203刻劃,而使耳料14易於分離為複數片,以便手動裂片。其中,預定切割線203與預定切割線202及邊緣13相接。After the second step described above, as shown in FIG. 2B, the conventional cutting method is characterized in that the tempered glass product 10 is more easily removed, and in the third step, the plurality of predetermined cutting lines 203 are scored on the ear piece 14 to make the ear The material 14 is easily separated into a plurality of pieces for manual splitting. The predetermined cutting line 203 is in contact with the predetermined cutting line 202 and the edge 13.

相似地,刻劃強化玻璃基板1之子基板1A之深度亦超過壓縮層12之厚度,如此強化玻璃基板1之子基板1A便容易因拉伸層11之拉伸內應力而自然分裂成為複數玻璃產品10,如圖2C所示。Similarly, the depth of the sub-substrate 1A in which the tempered glass substrate 1 is scribed also exceeds the thickness of the compression layer 12, so that the sub-substrate 1A of the tempered glass substrate 1 is easily split naturally into a plurality of glass products by the tensile internal stress of the tensile layer 11. , as shown in Figure 2C.

習知切割方法均自強化玻璃基板1或子基板1A之邊緣13向強化玻璃基板1或子基板1A之內部刻劃。因此欲將強化玻璃基板1切割為多數列之玻璃產品10時,皆須依照第一步驟將強化玻璃基板1先行刻劃切割為子基板1A。因此,必須浪費時間在並非直接用於切割玻璃產品10之預先切割步驟。此外,於第二步驟中,刻劃切割必須自子基板1A之邊緣13沿該預定切割線202延伸,爾後沿相應各強化玻璃產品10之複數邊緣延伸。在第二步驟之後,子基板1A易於沿預定切割線202自邊緣13自然分裂,而使玻璃產品10與複數耳料14分離。而在第三步驟之後,子基板1A更易於沿預定切割線202以及預定切割線203自然分裂,而使玻璃產品10更易於與複數耳料14分離。The conventional cutting method scribes the inside of the strengthened glass substrate 1 or the sub-substrate 1A from the edge 13 of the strengthened glass substrate 1 or the sub-substrate 1A. Therefore, when the tempered glass substrate 1 is to be cut into a plurality of glass products 10, the tempered glass substrate 1 is first scribed and cut into the sub-substrate 1A in accordance with the first step. Therefore, time must be wasted in the pre-cutting step that is not directly used to cut the glass product 10. Further, in the second step, the scribe cut must extend from the edge 13 of the sub-substrate 1A along the predetermined cut line 202, and then extend along the plurality of edges of the respective tempered glass products 10. After the second step, the sub-substrate 1A is easily split naturally from the edge 13 along the predetermined cutting line 202, separating the glass product 10 from the plurality of ear pieces 14. After the third step, the sub-substrate 1A is more easily split naturally along the predetermined cutting line 202 and the predetermined cutting line 203, making the glass product 10 easier to separate from the plurality of ear pieces 14.

玻璃產品10與耳料14完全分離後,玻璃產品10與耳料14之相對位置便容易偏移,而難以使用自動化輸送設備,將玻璃產品10精確輸送至正確目的地位置。因此,運用習知方法進行自動化工程之難度甚高。After the glass product 10 is completely separated from the ear material 14, the relative position of the glass product 10 to the ear material 14 is easily offset, and it is difficult to accurately transport the glass product 10 to the correct destination position using an automated conveying device. Therefore, it is very difficult to carry out automation engineering using conventional methods.

因此,如何克服習知切割強化玻璃基板之方法,其切割時間長並且難以全面自動化之問題,為此一業界之重要課題。Therefore, how to overcome the conventional method of cutting a tempered glass substrate, which has a long cutting time and is difficult to fully automate, is an important issue in the industry.

本發明之一目的在於提供一種適以切割一強化玻璃基板,以形成複數玻璃產品之切割方法及應用該切割方法之切割設備,其能夠更節省切割時間並更易於自動化。It is an object of the present invention to provide a cutting method suitable for cutting a tempered glass substrate to form a plurality of glass products and a cutting apparatus using the same, which can save cutting time and be easier to automate.

為達上述目的,本發明之切割方法包含以下步驟。於步驟(a)中,沿複數第一預定切割線刻劃強化玻璃基板。其中,各第一預定切割線係沿相應各玻璃產品之複數邊緣延伸,並離開所有於強化玻璃基板上之其他預定切割線及強化玻璃基板之複數邊緣。於步驟(b)中,自強化玻璃基板取出玻璃產品。To achieve the above object, the cutting method of the present invention comprises the following steps. In the step (a), the tempered glass substrate is scribed along the plurality of first predetermined cutting lines. Each of the first predetermined cutting lines extends along a plurality of edges of the respective glass products and exits all of the predetermined cutting lines on the strengthened glass substrate and the plurality of edges of the strengthened glass substrate. In step (b), the glass product is taken out from the strengthened glass substrate.

為達上述目的,本發明之切割設備包含一切割工具及一取出工具。切割工具用以沿複數第一預定切割線刻劃強化玻璃基板。其中,各第一預定切割線係沿各玻璃產品之複數邊緣延伸,並離開所有於強化玻璃基板上之其他預定切割線及強化玻璃基板之複數邊緣。取出工具用以自強化玻璃基板取出玻璃產品。To achieve the above object, the cutting apparatus of the present invention comprises a cutting tool and a removal tool. The cutting tool is used to scribe the strengthened glass substrate along a plurality of first predetermined cutting lines. Each of the first predetermined cutting lines extends along a plurality of edges of each of the glass products and exits all of the predetermined cutting lines on the strengthened glass substrate and the plurality of edges of the strengthened glass substrate. The removal tool is used to remove the glass product from the strengthened glass substrate.

首先請參考圖1之強化玻璃基板1,其包含一拉伸層11、形成於拉伸層11外側之至少一壓縮層12及複數邊緣13。其中,拉伸層11具有拉伸內應力,而壓縮層12具有壓縮內應力。First, please refer to the tempered glass substrate 1 of FIG. 1 , which comprises a tensile layer 11 , at least one compression layer 12 formed on the outer side of the tensile layer 11 , and a plurality of edges 13 . Among them, the stretched layer 11 has a tensile internal stress, and the compressed layer 12 has a compressive internal stress.

本發明之切割方法之第一實施例如圖3A至3C所示,其適以切割一強化玻璃基板1,以形成複數玻璃產品10。其中,如圖3A所示,玻璃產品10於強化玻璃基板1上可排列為具有任意行數及列數之一矩陣,或亦可為其他的排列方式;而本發明之切割方法不需要預先將強化玻璃基板1切割為複數子基板1A,以形成用於進刀切割出個別的玻璃產品10的一邊緣(如預定切割線201),再將子基板1A切割為玻璃產品10。A first embodiment of the cutting method of the present invention is illustrated in Figures 3A through 3C, which is adapted to cut a tempered glass substrate 1 to form a plurality of glass products 10. As shown in FIG. 3A, the glass product 10 may be arranged on the strengthened glass substrate 1 as a matrix having any number of rows and columns, or may be other arrangements; however, the cutting method of the present invention does not need to be previously The tempered glass substrate 1 is cut into a plurality of sub-substrates 1A to form an edge for cutting an individual glass product 10 (such as a predetermined dicing line 201), and the sub-substrate 1A is cut into a glass product 10.

本發明之切割方法之第一實施例,詳述如下。如圖3A所示,首先,沿複數第一預定切割線301刻劃強化玻璃基板1。其中,各第一預定切割線301係沿相應各玻璃產品10之複數邊緣延伸,並離開所有於強化玻璃基板1上之其他預定切割線及強化玻璃基板1之邊緣13。亦即,各第一預定切割線301與所有強化玻璃基板1上之其他預定切割線及強化玻璃基板1之邊緣13間均留有間隙。The first embodiment of the cutting method of the present invention is described in detail below. As shown in FIG. 3A, first, the tempered glass substrate 1 is scribed along a plurality of first predetermined cutting lines 301. Each of the first predetermined cutting lines 301 extends along the plurality of edges of the respective glass products 10 and leaves all of the predetermined cutting lines on the strengthened glass substrate 1 and the edges 13 of the strengthened glass substrate 1. That is, a gap is left between each of the first predetermined cutting lines 301 and the other predetermined cutting lines on all of the strengthened glass substrates 1 and the edges 13 of the strengthened glass substrate 1.

其中,沿第一預定切割線301刻劃強化玻璃基板1之深度較佳係超過壓縮層12之厚度,如此強化玻璃基板1便會因拉伸層11之拉伸內應力而沿第一預定切割線301自然分裂成為複數玻璃產品10。但此時,已分裂之複數玻璃產品10尚未能夠與耳料14'彼此間相對位移,此係因耳料14'形成為圍繞玻璃產品10且無中斷之形狀之故。Wherein, the depth of the tempered glass substrate 1 along the first predetermined cutting line 301 is preferably greater than the thickness of the compression layer 12, so that the tempered glass substrate 1 is cut along the first predetermined due to the tensile internal stress of the tensile layer 11. Line 301 naturally splits into a plurality of glass products 10. At this point, however, the split plurality of glass products 10 have not been able to be displaced relative to each other with respect to the ear pieces 14', since the ear pieces 14' are formed to surround the glass product 10 and have an uninterrupted shape.

如圖3A所示,為協助自強化玻璃基板1取出玻璃產品10,本發明之切割方法在自強化玻璃基板1取出玻璃產品10前,可進一步沿鄰近而離開所有第一預定切割線301及強化玻璃基板1之邊緣13之複數第二預定切割線302刻劃強化玻璃基板1。亦即,所有第二預定切割線302與所有第一預定切割線301及強化玻璃基板1之邊緣13間均留有間隙。As shown in FIG. 3A, in order to assist in taking out the glass product 10 from the strengthened glass substrate 1, the cutting method of the present invention can further remove all the first predetermined cutting lines 301 and strengthen the adjacent glass sheets 10 before taking out the glass product 10 from the strengthened glass substrate 1. The plurality of second predetermined cutting lines 302 of the edges 13 of the glass substrate 1 are scribed to strengthen the glass substrate 1. That is, a gap is left between all of the second predetermined cutting lines 302 and all of the first predetermined cutting lines 301 and the edges 13 of the strengthened glass substrate 1.

於強化玻璃基板1上刻劃第一預定切割線301及第二預定切割線302後,因為在圍繞玻璃產品10且形成於強化玻璃基板1上之複數耳料14'上沒有如習知技術自玻璃基板1之邊緣13向內延伸之刻痕,因此耳料14'與玻璃產品10彼此尚未分離,玻璃產品10仍受到耳料14'之支撐,尚不會脫離強化玻璃基板1。因此,縱然於強化玻璃基板1上刻劃第一預定切割線301,甚至進一步刻劃第二預定切割線302後,此時強化玻璃基板1進行上的耳料14'與玻璃產品10仍不會分散開來,故仍適以利用自動化設備運送至其他製程設備處。After the first predetermined cutting line 301 and the second predetermined cutting line 302 are scribed on the strengthened glass substrate 1, since there are no conventional techniques on the plurality of ear materials 14' surrounding the glass product 10 and formed on the strengthened glass substrate 1, The edge 13 of the glass substrate 1 is scored inwardly, so that the ear material 14' and the glass product 10 are not separated from each other, and the glass product 10 is still supported by the ear material 14' and does not leave the strengthened glass substrate 1. Therefore, even if the first predetermined cutting line 301 is scribed on the tempered glass substrate 1, even after the second predetermined cutting line 302 is further scribed, at this time, the reinforced glass substrate 1 is not subjected to the ear material 14' and the glass product 10 Dispersed, it is still suitable for transportation to other process equipment using automated equipment.

爾後,將沿第一預定切割線301及第二預定切割線302刻劃後之強化玻璃基板1輸送至另一處以進行下一製程之加工,即自強化玻璃基板1中取出玻璃產品10。其中,如圖3B所示,第二預定切割線302有利於自強化玻璃基板1取出玻璃產品10之步驟中,使圍繞玻璃產品10且形成於強化玻璃基板1上之複數耳料14'分離成如圖示之耳料形狀,以使取出玻璃產品10更為容易。取出後之玻璃產品10形狀如圖3C所示。Thereafter, the tempered glass substrate 1 scribed along the first predetermined cutting line 301 and the second predetermined cutting line 302 is transported to another place for processing in the next process, that is, the glass product 10 is taken out from the tempered glass substrate 1. Wherein, as shown in FIG. 3B, the second predetermined cutting line 302 facilitates the step of separating the plurality of ear materials 14' formed around the glass product 10 and formed on the strengthened glass substrate 1 in the step of taking out the glass product 10 from the strengthened glass substrate 1. The shape of the ear piece as shown is such that it is easier to remove the glass product 10. The shape of the removed glass product 10 is as shown in Fig. 3C.

因為強化玻璃基板1具有高硬度,相當難以切割。因此,於上述沿第一預定切割線301刻劃強化玻璃基板1之步驟中,可先於各第一預定切割線301之一初始進刀點303,向下刻劃強化玻璃基板1,以形成一深度超過強化玻璃基板1之壓縮層12之厚度之初始缺口後,再沿各第一預定切割線301刻劃強化玻璃基板1。Since the tempered glass substrate 1 has high hardness, it is quite difficult to cut. Therefore, in the step of scribing the tempered glass substrate 1 along the first predetermined cutting line 301, the tempered glass substrate 1 may be scribed downward at an initial infeed point 303 prior to each of the first predetermined cutting lines 301 to form After an initial gap having a depth exceeding the thickness of the compression layer 12 of the tempered glass substrate 1, the tempered glass substrate 1 is scribed along each of the first predetermined cutting lines 301.

相似地,於沿第二預定切割線302刻劃強化玻璃基板1之步驟中,刻劃強化玻璃基板1之深度亦需超過壓縮層12之厚度,並且亦可於各第二預定切割線302之一初始進刀點,向下刻劃強化玻璃基板1,以形成一深度超過強化玻璃基板1之壓縮層12之厚度之初始缺口後,再沿各第二預定切割線302刻劃強化玻璃基板1。Similarly, in the step of scribing the strengthened glass substrate 1 along the second predetermined cutting line 302, the depth of the tempered glass substrate 1 also needs to exceed the thickness of the compressed layer 12, and may also be in each of the second predetermined cutting lines 302. An initial infeed point, the tempered glass substrate 1 is scribed downward to form an initial gap having a depth exceeding the thickness of the compressive layer 12 of the tempered glass substrate 1, and then the tempered glass substrate 1 is scribed along each of the second predetermined cutting lines 302. .

詳細而言,如圖3A所示,各第一預定切割線301具有複數角落,並且第二預定切割線302鄰近設置於第一預定切割線301之角落。於一實施例中,預定自強化玻璃基板1切割而成之複數玻璃產品10之角落係為圓角,因此第一預定切割線301之角落係複數圓角301A。於此實施例中,沿第二預定切割線302方向延伸之假想線可通過鄰近之第一預定切割線301之相應圓角301A之複數圓心301B。In detail, as shown in FIG. 3A, each of the first predetermined cutting lines 301 has a plurality of corners, and the second predetermined cutting line 302 is adjacent to a corner of the first predetermined cutting line 301. In one embodiment, the corners of the plurality of glass products 10 cut from the tempered glass substrate 1 are rounded, so that the corners of the first predetermined cutting line 301 are a plurality of rounded corners 301A. In this embodiment, the imaginary line extending in the direction of the second predetermined cutting line 302 may pass through the plurality of centers 301B of the corresponding rounded corners 301A of the first predetermined cutting line 301.

如圖3A所示,可於強化玻璃基板1上定義不平行於第一預定切割線301之複數直線段之一第一方向3A及一第二方向3B,而第二預定切割線302係平行於第一方向3A及第二方向3B之至少其中之一延伸,並分佈於第一預定切割線301以及強化玻璃基板1之邊緣13間。此時,沿第二預定切割線302方向延伸之假想線仍通過鄰近之相應圓角301A之複數圓心301B。因此,於本實施例之第二預定切割線302形成複數X形。As shown in FIG. 3A, one of the plurality of straight line segments not parallel to the first predetermined cutting line 301 may be defined on the strengthened glass substrate 1 in a first direction 3A and a second direction 3B, and the second predetermined cutting line 302 is parallel to At least one of the first direction 3A and the second direction 3B extends and is distributed between the first predetermined cutting line 301 and the edge 13 of the strengthened glass substrate 1. At this time, the imaginary line extending in the direction of the second predetermined cutting line 302 still passes through the plural center 301B of the adjacent corresponding rounded corner 301A. Therefore, the second predetermined cutting line 302 of the present embodiment forms a complex X shape.

然而,於其他實施例中,所有第二預定切割線302亦可僅平行於第一方向3A或第二方向3B延伸,或其延伸方向不通過鄰近之第一預定切割線301之相應圓角301A之複數圓心301B。However, in other embodiments, all of the second predetermined cutting lines 302 may extend only parallel to the first direction 3A or the second direction 3B, or the direction of extension thereof does not pass through the corresponding rounded corner 301A of the adjacent first predetermined cutting line 301. The plural center 301B.

本發明之切割方法之第二實施例相似於上述第一實施例,請參考圖4A至4C,其差別僅在於第二實施例中第二預定切割線302'形式不同。如圖4A所示,於強化玻璃基板1上可定義一平行於第一預定切割線301之複數直線段之其中之一之第三方向3C,第二實施例之第二預定切割線302'係平行於第三方向3C延伸,並分佈於第一預定切割線301以及強化玻璃基板1之邊緣13間。The second embodiment of the cutting method of the present invention is similar to the first embodiment described above, with reference to Figs. 4A to 4C, the only difference being that the second predetermined cutting line 302' is different in the second embodiment. As shown in FIG. 4A, a third direction 3C parallel to one of the plurality of straight line segments of the first predetermined cutting line 301 may be defined on the strengthened glass substrate 1, and the second predetermined cutting line 302' of the second embodiment is It extends parallel to the third direction 3C and is distributed between the first predetermined cutting line 301 and the edge 13 of the strengthened glass substrate 1.

如圖4A所示,於第二實施例中,所有第二預定切割線302'亦鄰近而離開所有第一預定切割線301及強化玻璃基板1之邊緣13,而與所有第一預定切割線301及強化玻璃基板1之邊緣13間均留有間隙。此時,第二預定切割線302'之延伸方向仍通過鄰近之相應圓角301A之複數圓心301B。As shown in FIG. 4A, in the second embodiment, all of the second predetermined cutting lines 302' are also adjacent to all of the first predetermined cutting lines 301 and the edges 13 of the strengthened glass substrate 1, and all of the first predetermined cutting lines 301. A gap is left between the edges 13 of the tempered glass substrate 1. At this time, the extending direction of the second predetermined cutting line 302' still passes through the plurality of centers 301B of the corresponding corresponding rounded corners 301A.

相似於第一實施例,於第二實施例中,將沿第一預定切割線301及第二預定切割線302'刻劃後之強化玻璃基板1輸送至另一處,再自強化玻璃基板1取出玻璃產品10。其中,如圖4B所示,第二預定切割線302'有利於自強化玻璃基板1取出玻璃產品10之步驟中,使圍繞玻璃產品10且形成於強化玻璃基板1上之複數耳料14"分離,以協助取出玻璃產品10。取出後之玻璃產品10如圖4C所示。Similar to the first embodiment, in the second embodiment, the tempered glass substrate 1 scribed along the first predetermined cutting line 301 and the second predetermined cutting line 302' is transported to another place, and the glass substrate 1 is self-reinforced. Remove the glass product 10. Wherein, as shown in FIG. 4B, the second predetermined cutting line 302' facilitates the separation of the plurality of ear materials 14 which are formed around the glass product 10 and formed on the strengthened glass substrate 1 in the step of taking out the glass product 10 from the strengthened glass substrate 1. To assist in taking out the glass product 10. The removed glass product 10 is shown in Figure 4C.

然而,於其他實施例中,第二實施例之第二預定切割線302'中之一些除第三方向3C外,亦可沿垂直第三方向3C並平行於第一預定切割線301之複數直線段之另一方向延伸。本發明之切割方法之第二實施例之其他步驟相似於上述第一實施例,在此不再贅述。However, in other embodiments, some of the second predetermined cutting lines 302' of the second embodiment may be in a plurality of straight lines along the third direction 3C and parallel to the first predetermined cutting line 301 in addition to the third direction 3C. The other direction of the paragraph extends. The other steps of the second embodiment of the cutting method of the present invention are similar to those of the first embodiment described above, and are not described herein again.

第一預定切割線301及第二預定切割線302、302'與所有其他預定切割線及強化玻璃基板1之邊緣13間所留之間隙之大小,需視強化玻璃基板1之厚度以及預定切割線之密度而定。間隙之大小之設定需要讓強化玻璃基板1經第一預定切割線301及第二預定切割線302、302'刻劃後進行取出玻璃產品10之步驟前,使玻璃產品10仍受到耳料14'、14"之支撐,而尚不會脫離強化玻璃基板1,以使玻璃產品10與耳料14'、14"間之相對位置不會移動,並且同時需要在自強化玻璃基板1取出玻璃產品10時,使圍繞玻璃產品10且形成於強化玻璃基板1上之複數耳料14'仍可順利分離。The gap between the first predetermined cutting line 301 and the second predetermined cutting line 302, 302' and all other predetermined cutting lines and the edge 13 of the strengthened glass substrate 1 depends on the thickness of the strengthened glass substrate 1 and the predetermined cutting line. Depending on the density. The size of the gap needs to be such that the tempered glass substrate 1 is subjected to the step of taking out the glass product 10 after being scribed by the first predetermined cutting line 301 and the second predetermined cutting line 302, 302', so that the glass product 10 is still subjected to the ear piece 14'. , 14" support, and will not leave the strengthened glass substrate 1 so that the relative position between the glass product 10 and the ear materials 14', 14" does not move, and at the same time, the glass product 10 needs to be taken out from the self-tempered glass substrate 1. At this time, the plurality of ear materials 14' surrounding the glass product 10 and formed on the strengthened glass substrate 1 can be smoothly separated.

本發明之第一預定切割線301及第二預定切割線302、302'可有其他形狀,並非僅限制於前述實施例所揭露者。惟,本發明之個別第一預定切割線301及第二預定切割線302、302'均必須與所有其他預定切割線及強化玻璃基板1之邊緣13間留有適當間隙。請參考圖5A及5B,本發明之切割設備3,係為一種切割一強化玻璃基板1,以形成複數玻璃產品10之自動化設備或半自動化設備,並適可應用本發明之上述切割方法。如上所述,強化玻璃基板1包含複數邊緣13,並且玻璃產品10於強化玻璃基板1上可排列為具有任意行數及列數之一矩陣。The first predetermined cutting line 301 and the second predetermined cutting line 302, 302' of the present invention may have other shapes and are not limited only to those disclosed in the foregoing embodiments. However, the individual first predetermined cut lines 301 and the second predetermined cut lines 302, 302' of the present invention must have a suitable gap with all other predetermined cut lines and edges 13 of the strengthened glass substrate 1. Referring to Figures 5A and 5B, the cutting apparatus 3 of the present invention is an automated or semi-automated apparatus for cutting a tempered glass substrate 1 to form a plurality of glass products 10, and is suitable for applying the above-described cutting method of the present invention. As described above, the strengthened glass substrate 1 includes a plurality of edges 13, and the glass product 10 can be arranged on the strengthened glass substrate 1 as a matrix having an arbitrary number of rows and a number of columns.

本發明之切割設備3大致含有切割加工站、取料加工站與廢料收集加工站。本發明之切割設備3之第一實施例請參考圖5A,其包含一運算控制單元,用以預先設定並儲存切割之玻璃產品10之一外形及在強化玻璃基板1上配置之一型式。切割設備3另包含一位於切割加工站之切割工具31、一位於取料加工站之取出工具32及一輸送裝置33。本發明之切割設備3之第二實施例請參考圖5B,其相似於切割設備3之第一實施例,主要差別在於切割工具31之切割方式以及輸送裝置33不同。因此,以下將以切割設備3之第一實施例為主,進行詳細說明。The cutting device 3 of the present invention generally comprises a cutting processing station, a reclaiming processing station and a waste collection processing station. Referring to FIG. 5A, a first embodiment of the cutting apparatus 3 of the present invention includes an arithmetic control unit for presetting and storing one of the shapes of the cut glass product 10 and one of the configurations on the strengthened glass substrate 1. The cutting device 3 further comprises a cutting tool 31 at the cutting station, a removal tool 32 at the reclaiming station and a conveying device 33. Referring to Figure 5B, a second embodiment of the cutting apparatus 3 of the present invention is similar to the first embodiment of the cutting apparatus 3, the main difference being the manner in which the cutting tool 31 is cut and the conveying means 33 are different. Therefore, the first embodiment of the cutting device 3 will be mainly described below and will be described in detail.

切割工具31用以沿如圖3A及4A所示之預設於運算控制單元中之複數第一預定切割線301刻劃強化玻璃基板1。其中,各第一預定切割線301係沿各玻璃產品10之複數邊緣延伸,並離開所有於強化玻璃基板1上之其他預定切割線及強化玻璃基板1之邊緣13。其中,如圖5A所示之切割工具31為一切割輪,然切割工具31亦可為雷射或切割刀等其他玻璃切割工具。The cutting tool 31 is used to scribe the tempered glass substrate 1 along a plurality of first predetermined cutting lines 301 preset in the arithmetic control unit as shown in FIGS. 3A and 4A. Each of the first predetermined cutting lines 301 extends along the plurality of edges of each of the glass products 10 and leaves all of the predetermined cutting lines on the strengthened glass substrate 1 and the edges 13 of the strengthened glass substrate 1. The cutting tool 31 shown in FIG. 5A is a cutting wheel, and the cutting tool 31 can also be other glass cutting tools such as a laser or a cutting blade.

輸送裝置33用以將強化玻璃基板1輸送至鄰近切割工具31處進行刻劃切割後,再將經切割工具31刻劃之強化玻璃基板1,自鄰近切割工具31處輸送至鄰近取出工具32處。The conveying device 33 is configured to convey the strengthened glass substrate 1 to the adjacent cutting tool 31 for scribe cutting, and then the tempered glass substrate 1 scribed by the cutting tool 31 is transported from the adjacent cutting tool 31 to the adjacent removal tool 32. .

取出工具32用以自強化玻璃基板1取出玻璃產品10。其後,輸送裝置33更將強化玻璃基板1取出玻璃產品10後剩餘之耳料14'、14"排出至廢料收集加工站之一耳料收集部35。The take-up tool 32 is used to take out the glass product 10 from the strengthened glass substrate 1. Thereafter, the conveying device 33 further discharges the ear materials 14', 14" remaining after the tempered glass substrate 1 is taken out of the glass product 10 to the ear collecting portion 35 of the waste collection processing station.

請參考圖3A及4A,本發明之切割工具31可應用上述本發明之切割方法,切割強化玻璃基板1,詳述如下。切割工具31可於各第一預定切割線301之一初始進刀點303,刻劃強化玻璃基板1形成一初始缺口後,再沿各第一預定切割線301刻劃強化玻璃基板1。切割工具31更用以沿如上所述鄰近而離開所有第一預定切割線301之複數第二預定切割線302、302',刻劃強化玻璃基板1。藉此,取出工具32可使圍繞玻璃產品10且形成於強化玻璃基板1上之複數耳料14'、14"與玻璃產品10分離,並且可進一步使第二預定切割線302、302'彼此斷離,以協助取出玻璃產品10。關於第一預定切割線301及第二預定切割線302、302'之詳細內容,請參考本發明之切割方法之實施例,在此不再贅述。Referring to FIGS. 3A and 4A, the cutting tool 31 of the present invention can apply the above-described cutting method of the present invention to cut the strengthened glass substrate 1, as described in detail below. The cutting tool 31 can scribe the tempered glass substrate 1 along each of the first predetermined cutting lines 301 after the initial infeed point 303 of each of the first predetermined cutting lines 301 is formed, and the tempered glass substrate 1 is scribed. The cutting tool 31 is further used to scribe the strengthened glass substrate 1 along a plurality of second predetermined cutting lines 302, 302' adjacent to all of the first predetermined cutting lines 301 as described above. Thereby, the take-out tool 32 can separate the plurality of ear materials 14', 14" formed around the glass product 10 and formed on the strengthened glass substrate 1 from the glass product 10, and can further break the second predetermined cutting lines 302, 302' from each other. For the details of the first predetermined cutting line 301 and the second predetermined cutting line 302, 302', please refer to the embodiment of the cutting method of the present invention, and details are not described herein again.

請參考圖3A、4A及5A,於本發明之一特定實施例中,切割設備3之輸送裝置33用以沿一第四方向3D移動強化玻璃基板1,而切割工具31用以沿一第五方向3E移動。藉由輸送裝置33配合切割工具31分別沿彼此垂直之軸向移動,切割工具31適可以沿第一預定切割線301及第二預定切割線302、302'等預先設定並儲存於自動化切割設備3之運算單元中之二維圖形刻劃強化玻璃基板1。Referring to Figures 3A, 4A and 5A, in a particular embodiment of the invention, the transport device 33 of the cutting device 3 is adapted to move the strengthened glass substrate 1 in a fourth direction 3D, and the cutting tool 31 is used along a fifth Direction 3E moves. By means of the conveying device 33 and the cutting tool 31 respectively moving in the axial direction perpendicular to each other, the cutting tool 31 can be preset and stored in the automatic cutting device 3 along the first predetermined cutting line 301 and the second predetermined cutting line 302, 302' or the like. The two-dimensional pattern in the arithmetic unit is scribed to strengthen the glass substrate 1.

如圖5A所示,於本發明之實施例中,取出工具32包含至少一吸盤321及複數頂出銷322。請一併參考圖3A及4A,當吸盤321用以吸附並向上移動取出各玻璃產品10時,頂出銷322用以向下頂抵耳料14'、14",使圍繞玻璃產品10且形成於強化玻璃基板1上之複數耳料14'、14"與玻璃產品10分離,並且可進一步使第二預定切割線302、302'彼此斷離,以協助吸盤321用以吸附並向上移動取出各玻璃產品10。As shown in FIG. 5A, in the embodiment of the present invention, the removal tool 32 includes at least one suction cup 321 and a plurality of ejection pins 322. Referring to FIG. 3A and FIG. 4A together, when the suction cup 321 is used for sucking and moving up to take out the glass products 10, the ejector pin 322 is used to press down the ear pieces 14', 14" to form the surrounding glass product 10 and form. The plurality of ear materials 14', 14" on the strengthened glass substrate 1 are separated from the glass product 10, and the second predetermined cutting lines 302, 302' can be further separated from each other to assist the suction cup 321 for adsorbing and moving upwards to take out each Glass product 10.

請參考圖5A,本發明切割設備3之第一實施例之輸送裝置33不同於第二實施例,其包含設置於切割工具31前之至少一第一輸送帶331及設置於切割工具331後之至少一第二輸送帶332。強化玻璃基板1傳送於第一輸送帶331及第二輸送帶332上,並在第一輸送帶331及第二輸送帶332上運輸。第一輸送帶331及第二輸送帶332同時作動,以將強化玻璃基板1輸送至鄰近切割工具31處,進行刻劃切割。第二輸送帶332進一步用以將強化玻璃基板1自鄰近切割工具31處輸送至鄰近取出工具32處進行耳料14'、14"斷離作業,並且當取出工具32取出各玻璃產品10後,第二輸送帶332用以將分離之耳料14'、14"輸送至耳料收集部35中。其中,第一輸送帶331及第二輸送帶332均可由一或複數子輸送帶並列而組成。Referring to FIG. 5A, the conveying device 33 of the first embodiment of the cutting device 3 of the present invention is different from the second embodiment, and includes at least one first conveying belt 331 disposed in front of the cutting tool 31 and disposed behind the cutting tool 331. At least one second conveyor belt 332. The tempered glass substrate 1 is transported onto the first conveyor belt 331 and the second conveyor belt 332, and transported on the first conveyor belt 331 and the second conveyor belt 332. The first conveyor belt 331 and the second conveyor belt 332 are simultaneously actuated to convey the strengthened glass substrate 1 to the adjacent cutting tool 31 for scoring and cutting. The second conveyor belt 332 is further configured to transport the strengthened glass substrate 1 from the adjacent cutting tool 31 to the vicinity of the removal tool 32 for the ear piece 14', 14" to be separated, and when the removal tool 32 takes out the glass products 10, The second conveyor belt 332 is used to convey the separated ear pieces 14', 14" into the ear collection portion 35. The first conveyor belt 331 and the second conveyor belt 332 may each be composed of one or a plurality of sub-conveyor belts.

較佳地,第一實施例之輸送裝置33可進一步包含至少二支撐平臺333(然支撐平臺333並非必要),分別設置於第一輸送帶331及第二輸送帶332用於支撐強化玻璃基板1之一側之下方,以當第一輸送帶331及第二輸送帶332輸送強化玻璃基板1時,以及當取出工具32自強化玻璃基板1取出玻璃產品10時,輔助支撐第一輸送帶331及第二輸送帶332。Preferably, the conveying device 33 of the first embodiment may further comprise at least two supporting platforms 333 (other than the supporting platform 333), which are respectively disposed on the first conveying belt 331 and the second conveying belt 332 for supporting the strengthened glass substrate 1 One of the lower sides, when the first conveyor belt 331 and the second conveyor belt 332 convey the tempered glass substrate 1, and when the removal tool 32 takes out the glass product 10 from the tempered glass substrate 1, assists in supporting the first conveyor belt 331 and The second conveyor belt 332.

當切割工具31係為一切割輪時,第一實施例之切割設備3更包含一刻劃支撐滾輪34,以當切割輪進行切割時提供支撐。於進行刻劃切割時,強化玻璃基板1適可跨置於第一輸送帶331及第二輸送帶332上,而沿第四方向3D移動。刻劃支撐滾輪34設置於切割工具31下方及第一輸送帶331及第二輸送帶332間。當切割工具31刻劃強化玻璃基板1時,強化玻璃基板1受到刻劃支撐滾輪34支撐,以利刻劃。因本實施例之切割工具31需要如圖5A中箭頭所示旋轉,刻劃支撐滾輪34亦可相應配合切割工具31旋轉。切割工具31藉由沿第五方向3E移動以及輸送裝置33之第一輸送帶331及第二輸送帶332之配合,其適可以沿第一預定切割線301及第二預定切割線302、302'等預定之二維圖形刻劃強化玻璃基板1。When the cutting tool 31 is a cutting wheel, the cutting apparatus 3 of the first embodiment further includes a scoring support roller 34 to provide support when the cutting wheel performs cutting. When the scribe is cut, the tempered glass substrate 1 is adapted to straddle the first conveyor belt 331 and the second conveyor belt 332 and move in the fourth direction 3D. The scribing support roller 34 is disposed under the cutting tool 31 and between the first conveyor belt 331 and the second conveyor belt 332. When the cutting tool 31 scores the strengthened glass substrate 1, the strengthened glass substrate 1 is supported by the scribing support roller 34 to facilitate scribing. Since the cutting tool 31 of the present embodiment needs to be rotated as shown by the arrow in FIG. 5A, the scribing support roller 34 can also rotate correspondingly with the cutting tool 31. The cutting tool 31 is adapted to move along the first predetermined cutting line 301 and the second predetermined cutting line 302, 302' by the movement of the first conveyor belt 331 and the second conveyor belt 332 in the fifth direction 3E and the conveying device 33. The glass substrate 1 is scribed by a predetermined two-dimensional pattern.

請參考圖5A,本實施例之上述較佳為切割輪之切割工具31與刻劃支撐滾輪34之位置可上下對調,抑或將刻劃支撐滾輪34替換為切割輪,而使得上下均為切割輪,以此切割強化玻璃基板1。Referring to FIG. 5A, in the above embodiment, the cutting tool 31 of the cutting wheel and the position of the scribing support roller 34 can be up-and-down, or the scribing support roller 34 can be replaced with a cutting wheel, so that the upper and lower cutting wheels are all Thereby, the tempered glass substrate 1 is cut.

請參考圖5B,本發明切割設備3之第二實施例之輸送裝置33不同於第一實施例,其包含至少一第三輸送帶334及一具高平坦度之刻劃平臺335。強化玻璃基板1傳送於第三輸送帶334上。Referring to FIG. 5B, the conveying device 33 of the second embodiment of the cutting device 3 of the present invention is different from the first embodiment in that it includes at least a third conveyor belt 334 and a scoring platform 335 having a high flatness. The strengthened glass substrate 1 is transferred onto the third conveyor belt 334.

第三輸送帶334用以將強化玻璃基板1輸送至鄰近切割工具31處進行刻劃切割,再用以將強化玻璃基板1自鄰近切割工具31處輸送至鄰近取出工具32處。當取出工具32取出各玻璃產品10後,第三輸送帶334較佳地更用以將斷離之耳料14'、14"輸送至耳料收集部35中。其中,第三輸送帶334亦可由一或複數子輸送帶並列而組成。The third conveyor belt 334 is used to convey the strengthened glass substrate 1 to the adjacent cutting tool 31 for scoring cutting, and then to transport the strengthened glass substrate 1 from the adjacent cutting tool 31 to the adjacent removal tool 32. After the removal tool 32 takes out each of the glass products 10, the third conveyor belt 334 is preferably further used to convey the separated ear materials 14', 14" into the ear collection portion 35. wherein the third conveyor belt 334 is also It can be composed of one or more sub-conveyor belts juxtaposed.

強化玻璃基板1傳送於第三輸送帶334上,而沿第四方向3D移動。切割工具31藉由沿第五方向3E移動以及輸送裝置33之第三輸送帶334之配合,其適可以沿第一預定切割線301及第二預定切割線302、302'等預定之二維圖形刻劃強化玻璃基板1。The tempered glass substrate 1 is transferred onto the third conveyor belt 334 and moved in the fourth direction 3D. The cutting tool 31 is adapted to move along the fifth direction 3E and the third conveyor belt 334 of the conveying device 33, and is adapted to be along the first predetermined cutting line 301 and the second predetermined cutting line 302, 302' and the like. The tempered glass substrate 1 is scribed.

如上所述,當切割工具31係為一切割輪時,切割輪進行切割時需要支撐。因此,一刻劃平臺335設置於切割工具31下方且第三輸送帶334用以支撐強化玻璃基板1一側之下方。當切割工具31刻劃強化玻璃基板1時,強化玻璃基板1經由第三輸送帶334受到具高平坦度之該刻劃平臺335支撐,以利精確刻劃強化玻璃基板1。As described above, when the cutting tool 31 is a cutting wheel, the cutting wheel needs to be supported for cutting. Therefore, a scribing platform 335 is disposed under the cutting tool 31 and the third conveyor belt 334 is used to support the underside of the side of the strengthened glass substrate 1. When the cutting tool 31 scribes the tempered glass substrate 1, the tempered glass substrate 1 is supported by the scribed platform 335 having high flatness via the third conveyor belt 334 to accurately scribe the tempered glass substrate 1.

第二實施例之輸送裝置33更包含至少一支撐平臺333,其設置於取出工具32下方且第三輸送帶334用於支撐強化玻璃基板1之一側之下方且鄰近取出工具32處,以當第三輸送帶334輸送強化玻璃基板1時,以及當取出工具32自強化玻璃基板1取出玻璃產品10時,輔助支撐第三輸送帶334。The conveying device 33 of the second embodiment further comprises at least one supporting platform 333 disposed under the taking-out tool 32 and the third conveying belt 334 is for supporting the lower side of one side of the strengthened glass substrate 1 and adjacent to the taking-out tool 32. When the third conveyor belt 334 conveys the tempered glass substrate 1, and when the take-up tool 32 takes out the glass product 10 from the tempered glass substrate 1, it assists in supporting the third conveyor belt 334.

於當切割設備3為半自動化機械設備時,運算控制單元在切割設備3運作時至少可控制切割設備3之切割工具31之切割與移動。當切割設備3為全自動機械設備時,運算控制單元更在切割設備3運作時控制切割設備3之各裝置之運轉與運作,例如控制輸送裝置33於適當時機輸送強化玻璃基板1至位於切割加工站之切割工具31之進行切割、控制輸送裝置33於切割工具31進行切割後於適當時機輸送強化玻璃基板1至位於取料加工站之取出工具32、以及控制輸送裝置33將耳料14'、14"排出至廢料收集加工站之一耳料收集部35中。When the cutting device 3 is a semi-automated mechanical device, the arithmetic control unit controls at least the cutting and movement of the cutting tool 31 of the cutting device 3 when the cutting device 3 is in operation. When the cutting device 3 is a fully automatic mechanical device, the arithmetic control unit controls the operation and operation of each device of the cutting device 3 when the cutting device 3 is in operation, for example, controlling the conveying device 33 to transport the strengthened glass substrate 1 to the cutting process at an appropriate timing. The cutting tool 31 of the station performs cutting, and the control conveying device 33 performs cutting after the cutting tool 31, and then transports the strengthened glass substrate 1 to the take-out tool 32 at the take-out processing station at an appropriate timing, and controls the conveying device 33 to receive the ear piece 14', 14" is discharged to the ear collection portion 35 of one of the waste collection processing stations.

本發明所屬領域中具有通常知識者,應可瞭解本發明之輸送裝置33可有其他實施態樣,在此不作限制。It is to be understood that the delivery device 33 of the present invention may have other embodiments and is not limited thereto.

上述實施例僅例示本發明較佳之實施態樣,並非用以限制本發明。本發明所屬領域具有通常知識者可參考上述實施例而輕易推及其他實施態樣。本案之專利範圍應以申請專利範圍所載為準。The above embodiments are merely illustrative of preferred embodiments of the invention and are not intended to limit the invention. Those skilled in the art can easily refer to other embodiments with reference to the above embodiments. The patent scope of this case shall be subject to the scope of the patent application.

1...強化玻璃基板1. . . Reinforced glass substrate

10...玻璃產品10. . . Glass product

11...拉伸層11. . . Stretch layer

12...壓縮層12. . . Compression layer

13...邊緣13. . . edge

14...耳料14. . . Ear

14'...耳料14'. . . Ear

14"...耳料14"...ears

1A...子基板1A. . . Subsubstrate

201...預定切割線201. . . Scheduled cutting line

202...預定切割線202. . . Scheduled cutting line

203...預定切割線203. . . Scheduled cutting line

3...切割設備3. . . Cutting equipment

301...第一預定切割線301. . . First predetermined cutting line

301A...圓角301A. . . Fillet

301B...圓心301B. . . Center of mind

302...第二預定切割線302. . . Second predetermined cutting line

302'...第二預定切割線302'. . . Second predetermined cutting line

303...初始進刀點303. . . Initial infeed point

31...切割工具31. . . Cutting tool

32...取出工具32. . . Removal tool

321...吸盤321. . . Suction cup

322...頂出銷322. . . Top output

33...輸送裝置33. . . Conveyor

331...第一輸送帶331. . . First conveyor belt

332...第二輸送帶332. . . Second conveyor belt

333...支撐平臺333. . . Support platform

334...第三輸送帶334. . . Third conveyor belt

335...刻劃平臺335. . . Scribe platform

34...刻劃支撐滾輪34. . . Scribing support roller

35...耳料收集部35. . . Ear collection unit

3A...第一方向3A. . . First direction

3B...第二方向3B. . . Second direction

3C...第三方向3C. . . Third direction

3D...第四方向3D. . . Fourth direction

3E...第五方向3E. . . Fifth direction

圖1係強化玻璃基板之一示意圖;Figure 1 is a schematic view of a tempered glass substrate;

圖2A至2C係習知強化玻璃基板之切割方法之示意圖;2A to 2C are schematic views showing a conventional method of cutting a tempered glass substrate;

圖3A至3C係本發明之切割方法之第一實施例之示意圖;3A to 3C are schematic views of a first embodiment of the cutting method of the present invention;

圖4A至4C係本發明之切割方法之第二實施例之示意圖;4A to 4C are schematic views showing a second embodiment of the cutting method of the present invention;

圖5A係本發明之切割設備之第一實施例之一示意圖;及Figure 5A is a schematic view showing a first embodiment of the cutting device of the present invention; and

圖5B係本發明之切割設備之第二實施例之一示意圖。Figure 5B is a schematic illustration of a second embodiment of the cutting apparatus of the present invention.

1...強化玻璃基板1. . . Reinforced glass substrate

10...玻璃產品10. . . Glass product

13...邊緣13. . . edge

14'...耳料14'. . . Ear

301...第一預定切割線301. . . First predetermined cutting line

301A...圓角301A. . . Fillet

301B...圓心301B. . . Center of mind

302...第二預定切割線302. . . Second predetermined cutting line

303...初始進刀點303. . . Initial infeed point

3A...第一方向3A. . . First direction

3B...第二方向3B. . . Second direction

3D...第四方向3D. . . Fourth direction

3E...第五方向3E. . . Fifth direction

Claims (23)

一種切割方法,適以切割一強化玻璃基板,以形成複數玻璃產品,其中該強化玻璃基板包含複數邊緣,並且該切割方法包含以下步驟:(a)沿複數第一預定切割線刻劃該強化玻璃基板,其中各該第一預定切割線係沿設定為相應各該玻璃產品之複數邊緣延伸,並離開所有於該強化玻璃基板上之其他預定切割線及該強化玻璃基板之該等邊緣;及(b)自該強化玻璃基板取出該等玻璃產品。A cutting method for cutting a strengthened glass substrate to form a plurality of glass products, wherein the strengthened glass substrate comprises a plurality of edges, and the cutting method comprises the steps of: (a) scribing the strengthened glass along a plurality of first predetermined cutting lines a substrate, wherein each of the first predetermined cutting lines extends along a plurality of edges of the respective glass products, and leaves all of the predetermined cutting lines on the strengthened glass substrate and the edges of the strengthened glass substrate; and b) removing the glass products from the strengthened glass substrate. 如請求項1所述之切割方法,其中該切割方法在步驟(b)前更包含:(a-1)沿鄰近而離開所有該等第一預定切割線之複數第二預定切割線刻劃該強化玻璃基板,以於步驟(b)中使圍繞該等玻璃產品且形成於該強化玻璃基板上之複數耳料斷離,以協助取出該等玻璃產品。The cutting method of claim 1, wherein the cutting method further comprises: (a-1) scribing the plurality of second predetermined cutting lines adjacent to all of the first predetermined cutting lines adjacent to the step (b); The glass substrate is reinforced to break apart the plurality of ear materials surrounding the glass products and formed on the strengthened glass substrate in step (b) to assist in the removal of the glass products. 如請求項2所述之切割方法,其中該等玻璃產品於該強化玻璃基板上排列為一矩陣。The cutting method of claim 2, wherein the glass products are arranged in a matrix on the strengthened glass substrate. 如請求項2所述之切割方法,其中於步驟(a)中,於各該第一預定切割線之一初始進刀點,刻劃該強化玻璃基板形成一初始缺口後,沿各該第一預定切割線刻劃該強化玻璃基板。The cutting method of claim 2, wherein in step (a), at an initial infeed point of each of the first predetermined cutting lines, the tempered glass substrate is scribed to form an initial gap, along each of the first The dicing glass substrate is scribed by a predetermined cutting line. 如請求項2所述之切割方法,其中各該第一預定切割線具有複數角落,並且該等第二預定切割線鄰近該等第一預定切割線之該等角落。The cutting method of claim 2, wherein each of the first predetermined cutting lines has a plurality of corners, and the second predetermined cutting lines are adjacent to the corners of the first predetermined cutting lines. 如請求項5所述之切割方法,其中該等第一預定切割線之該等角落係複數圓角,並且沿該等第二預定切割線延伸之假想線通過鄰近之相應該等圓角之複數圓心。The cutting method of claim 5, wherein the corners of the first predetermined cutting lines are rounded, and the imaginary lines extending along the second predetermined cutting lines pass through the corresponding plurality of corresponding rounded corners Center of the circle. 如請求項5所述之切割方法,其中不平行於該等第一預定切割線之複數直線段之一第一方向及一第二方向定義於該強化玻璃基板上,並且該等第二預定切割線係平行於該第一方向及該第二方向之至少其中之一延伸,並分佈於該等第一預定切割線以及該強化玻璃基板之該等邊緣間。The cutting method of claim 5, wherein a first direction and a second direction of the plurality of straight line segments not parallel to the first predetermined cutting lines are defined on the strengthened glass substrate, and the second predetermined cuts are The wire extends parallel to at least one of the first direction and the second direction and is distributed between the first predetermined cutting line and the edges of the strengthened glass substrate. 如請求項5所述之切割方法,其中平行於該等第一預定切割線之複數直線段之一第三方向定義於該強化玻璃基板上,並且該等第二預定切割線係平行於該第三方向延伸,並分佈於該等第一預定切割線以及該強化玻璃基板之該等邊緣間。The cutting method of claim 5, wherein a third direction of one of the plurality of straight line segments parallel to the first predetermined cutting lines is defined on the strengthened glass substrate, and the second predetermined cutting lines are parallel to the first The three directions extend and are distributed between the first predetermined cutting lines and the edges of the strengthened glass substrate. 一種切割設備,適以切割一強化玻璃基板,以形成複數玻璃產品,其中該強化玻璃基板包含複數邊緣,並且該切割設備包含:一運算控制單元,用以預先設定並儲存切割之該玻璃產品之一外形及在該強化玻璃基板上配置之一型式;一切割工具,用以沿預設於該運算控制單元中之複數第一預定切割線刻劃該強化玻璃基板,其中各該第一預定切割線係沿各該玻璃產品之複數邊緣延伸,並離開所有於該強化玻璃基板上之其他預定切割線及該強化玻璃基板之該等邊緣;及一取出工具,用以自該強化玻璃基板取出該等玻璃產品。A cutting device adapted to cut a tempered glass substrate to form a plurality of glass products, wherein the tempered glass substrate comprises a plurality of edges, and the cutting device comprises: an arithmetic control unit for presetting and storing the cut glass product a shape and a type on the tempered glass substrate; a cutting tool for scribing the tempered glass substrate along a plurality of first predetermined cutting lines preset in the arithmetic control unit, wherein each of the first predetermined cuts a wire system extending along a plurality of edges of each of the glass products and leaving all of the other predetermined cutting lines on the strengthened glass substrate and the edges of the strengthened glass substrate; and a removal tool for taking out the strengthened glass substrate And other glass products. 如請求項9所述之切割設備,其中該切割工具更用以沿鄰近而離開所有該等第一預定切割線之複數第二預定切割線,刻劃該強化玻璃基板,並且該取出工具用以使圍繞該等玻璃產品且形成於該強化玻璃基板上之複數耳料斷離,以協助取出該等玻璃產品。The cutting device of claim 9, wherein the cutting tool is further configured to scribe the tempered glass substrate along a plurality of second predetermined cutting lines adjacent to all of the first predetermined cutting lines, and the removing tool is used for The plurality of ear materials surrounding the glass products and formed on the strengthened glass substrate are broken apart to assist in the removal of the glass products. 如請求項10所述之切割設備,其中該等玻璃產品於該強化玻璃基板上排列為一矩陣。The cutting device of claim 10, wherein the glass products are arranged in a matrix on the strengthened glass substrate. 如請求項10所述之切割設備,其中該切割工具於各該第一預定切割線之一初始進刀點,刻劃該強化玻璃基板形成一初始缺口後,沿各該第一預定切割線刻劃該強化玻璃基板。The cutting device of claim 10, wherein the cutting tool is formed at an initial infeed point of each of the first predetermined cutting lines, and the tempered glass substrate is scribed to form an initial gap, and each of the first predetermined cutting lines is engraved The tempered glass substrate is drawn. 如請求項10所述之切割設備,其中各該第一預定切割線具有複數角落,並且該等第二預定切割線鄰近該等第一預定切割線之該等角落。The cutting apparatus of claim 10, wherein each of the first predetermined cutting lines has a plurality of corners, and the second predetermined cutting lines are adjacent to the corners of the first predetermined cutting lines. 如請求項13所述之切割設備,其中該等第一預定切割線之該等角落係複數圓角,並且該等第二預定切割線延伸之假想線係通過鄰近之該等圓角之複數圓心。The cutting apparatus of claim 13, wherein the corners of the first predetermined cutting lines are rounded, and the imaginary lines extending by the second predetermined cutting lines pass through the plurality of round centers of the rounded corners . 如請求項13所述之切割設備,其中不平行於該等第一預定切割線之複數直線段之一第一方向及一第二方向定義於該強化玻璃基板上,並且該等第二預定切割線係平行於該第一方向及該第二方向至少其中之一延伸,並分佈於該等第一預定切割線以及該強化玻璃基板之該等邊緣間。The cutting device of claim 13, wherein a first direction and a second direction of the plurality of straight line segments that are not parallel to the first predetermined cutting lines are defined on the strengthened glass substrate, and the second predetermined cuts are The wire system extends parallel to at least one of the first direction and the second direction and is distributed between the first predetermined cutting lines and the edges of the strengthened glass substrate. 如請求項14所述之切割設備,其中平行於該等第一預定切割線之複數直線段之一第三方向定義於該強化玻璃基板上,並且該等第二預定切割線係平行於該第三方向延伸,並分佈於該等第一預定切割線以及該強化玻璃基板之該等邊緣間。The cutting apparatus of claim 14, wherein a third direction of one of a plurality of straight line segments parallel to the first predetermined cutting lines is defined on the strengthened glass substrate, and the second predetermined cutting lines are parallel to the first The three directions extend and are distributed between the first predetermined cutting lines and the edges of the strengthened glass substrate. 如請求項10所述之切割設備,其中該取出工具包含至少一吸盤及複數頂出銷,當該吸盤用以吸附並取出各該玻璃產品時,該等頂出銷用以頂抵該等耳料。The cutting device of claim 10, wherein the removal tool comprises at least one suction cup and a plurality of ejection pins, wherein the ejection pins are used to abut the ear when the suction cup is used for adsorbing and taking out the glass products. material. 如請求項10所述之切割設備,其中該切割設備更包含一輸送裝置,用以將該強化玻璃基板自鄰近該切割工具處輸送至鄰近該取出工具處。The cutting device of claim 10, wherein the cutting device further comprises a transport device for transporting the strengthened glass substrate from adjacent the cutting tool adjacent to the removal tool. 如請求項18所述之切割設備,其中該輸送裝置包含設置於該切割工具前之至少一第一輸送帶及設置於該切割工具後之至少一第二輸送帶,且該切割設備更包含一刻劃支撐滾輪,該強化玻璃基板傳送於該第一輸送帶及該第二輸送帶上,該刻劃支撐滾輪設置於該切割工具下方及該第一輸送帶及該第二輸送帶間,並且當該切割工具刻劃該強化玻璃基板時,該強化玻璃基板受到該刻劃支撐滾輪支撐。The cutting device of claim 18, wherein the conveying device comprises at least one first conveyor belt disposed in front of the cutting tool and at least one second conveyor belt disposed behind the cutting tool, and the cutting device further comprises a Marking the support roller, the tempered glass substrate is conveyed on the first conveyor belt and the second conveyor belt, the scribe support roller is disposed under the cutting tool and between the first conveyor belt and the second conveyor belt, and When the cutting tool scores the strengthened glass substrate, the strengthened glass substrate is supported by the scribing support roller. 如請求項18所述之切割設備,其中該輸送裝置包含至少一第三輸送帶及一具高平坦度之刻劃平臺,該強化玻璃基板傳送於該第三輸送帶上,該刻劃平臺設置於該切割工具下方及該第三輸送帶下,並且當該切割工具刻劃該強化玻璃基板時,該強化玻璃基板經由該第三輸送帶受到該刻劃平臺支撐。The cutting device of claim 18, wherein the conveying device comprises at least a third conveyor belt and a high flatness scribing platform, the tempered glass substrate is conveyed on the third conveyor belt, the scoring platform setting Under the cutting tool and under the third conveyor belt, and when the cutting tool scores the strengthened glass substrate, the strengthened glass substrate is supported by the scoring platform via the third conveyor belt. 如請求項18所述之切割設備,其中該輸送裝置用以沿一第四方向移動該強化玻璃基板,該切割工具用以沿一第五方向移動,並且該輸送裝置配合該切割工具,以沿該等第一預定切割線及該等第二預定切割線刻劃該強化玻璃基板。The cutting device of claim 18, wherein the conveying device is configured to move the tempered glass substrate in a fourth direction, the cutting tool is configured to move in a fifth direction, and the conveying device cooperates with the cutting tool to The first predetermined cutting line and the second predetermined cutting line scribe the strengthened glass substrate. 如請求項18所述之切割設備,其中該切割設備更包含一耳料收集部,該輸送裝置更將該強化玻璃基板取出該等玻璃產品後剩餘之複數耳料排出至該耳料收集部。The cutting device of claim 18, wherein the cutting device further comprises an ear collecting portion, and the conveying device further discharges the plurality of ear materials remaining after the strengthened glass substrate is taken out of the glass products to the ear collecting portion. 如請求項10所述之切割設備,其中該切割工具為一切割輪。The cutting device of claim 10, wherein the cutting tool is a cutting wheel.
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