CN101844864B - Glass substrate and cutting method thereof - Google Patents
Glass substrate and cutting method thereof Download PDFInfo
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- CN101844864B CN101844864B CN 200910080148 CN200910080148A CN101844864B CN 101844864 B CN101844864 B CN 101844864B CN 200910080148 CN200910080148 CN 200910080148 CN 200910080148 A CN200910080148 A CN 200910080148A CN 101844864 B CN101844864 B CN 101844864B
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- glass substrate
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- cut
- alignment mark
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Abstract
The invention provides a glass substrate and a cutting method thereof, wherein the glass substrate comprises more than one liquid crystal panel and process marks, the process mark positioned between every two liquid crystal panels on a grid line and/or data line direction is in common. The embodiment of the invention also discloses a cutting method of the glass substrate, which comprises the steps of: cutting the glass substrate by a cutting tool bit according to cutting position information determined by the process mark shared between every two liquid crystal panels on the grid line and/or data line direction; moving the cutting tool bit to a secondary cutting position after arriving at a destination point; and carrying out secondary cutting on the glass substrate by the cutting tool bit. The glass substrata and the cutting method thereof can meet the maximization of edge benefit, lower the cost of unit product, and can improve the efficiency of cutting the glass substrate.
Description
Technical field
The present invention relates to liquid crystal manufacturing technology field, particularly the cutting method of a kind of glass substrate and glass substrate.
Background technology
In the liquid-crystal display manufacturing processed, usually technology marks such as alignment mark and cut mark need be set at glass substrate, and when glass substrate is cut, can determine cutting position according to alignment mark, determine cutting quality according to cut mark, and then realize technologies such as contraposition, cutting to glass substrate, the size of above-mentioned technology mark be the product development design phase according to the requirement design of the ability of each processing unit and device parameter.
Fig. 1 is the structural representation of glass substrate in the prior art, as shown in Figure 1, each panel (panel) on the glass substrate has oneself independently alignment mark, quantity is 8, above-mentioned 8 contrapositions indicate and are divided into 4 groups, and the four edges along liquid crystal panel distributes respectively, and two alignment marks that wherein distribute on each direction can be regarded one group as, when carrying out the cutting of glass substrate, each liquid crystal panel positions, cuts according to one group of alignment mark separately; Can also cut mark be set in the edge of liquid crystal panel in addition, can determine cutting quality according to this cut mark.Cutting flow process to glass substrate in the prior art comprises the steps: carrying glass sheet to position to be cut, at first carry out the contraposition affirmation before each cutting and calculate cutting position, carry out cutting action afterwards, after arriving cutting end point cutter head is returned origin position, wait for that transport device repeats above-mentioned steps with the glass substrate conveyance behind same position, namely finish cutting for the second time.
In the design of the glass substrate of prior art, the alignment mark that arranges in order arts demand such as to cut has taken a large amount of design spaces, can't satisfy the maximization of edge benefit, the cost height of unit product.
Summary of the invention
The cutting method that the purpose of this invention is to provide a kind of glass substrate and glass substrate satisfying the maximization of glass substrate edge benefit, and can improve the cutting efficiency of glass substrate.
For achieving the above object, the invention provides a kind of glass substrate, comprise more than one liquid crystal panel and technology mark, the technology mark between the adjacent lcd panel on grid line and/or the data line direction shares.
The present invention also provides a kind of cutting method of glass substrate, comprising:
Cutter head cuts glass substrate according to the cutting position information that the technology mark that shares between the adjacent lcd panel on grid line and/or the data line direction is determined;
After reaching cutting end point, cutter head is moved to the secondary cut position;
Cutter head carries out secondary cut to glass substrate.
The present invention also provides the cutting method of another kind of glass substrate, comprising:
Cutter head cuts glass substrate according to the cutting position information that the technology mark that shares between the adjacent lcd panel on grid line or the data line direction is determined;
After reaching cutting end point, transport device arrives cutting position with the glass substrate conveyance;
Cutter head cuts glass substrate according to the secondary cut positional information that the technology mark that shares between the adjacent lcd panel is determined.
The present invention also provides the cutting method of another glass substrate, comprising:
Cutter head cuts glass substrate according to the cutting position information that the technology mark that shares between the adjacent lcd panel on grid line or the data line direction is determined;
After reaching cutting end point, cutter head is moved to origin position;
Transport device arrives cutting position with the glass substrate conveyance;
Cutter head cuts glass substrate according to the secondary cut positional information that the technology mark that shares between the adjacent lcd panel is determined.
The glass substrate that the embodiment of the invention provides and the cutting method of glass substrate, by shared technology mark is being set between the adjacent lcd panel on grid line and/or the data line direction on the glass substrate, can reduce the quantity of technology mark, and then reduce technology and be marked at occupation space on the glass substrate, to increase operation rate.The embodiment of the invention also provides the cutting method of corresponding glass substrate simultaneously, can improve the cutting efficiency to glass substrate.
Description of drawings
Fig. 1 is glass substrate structural representation in the prior art;
Fig. 2 is the structural representation of glass substrate embodiment one of the present invention;
Fig. 3 is the structural representation of glass substrate embodiment two of the present invention;
Fig. 4 is the schematic flow sheet of the cutting method embodiment one of glass substrate of the present invention;
Fig. 5 is the operation chart of the cutting method of glass substrate shown in Figure 4;
Fig. 6 is the schematic flow sheet of the cutting method embodiment two of glass substrate of the present invention;
Fig. 7 is the operation chart of the cutting method of glass substrate shown in Figure 6;
Fig. 8 is the schematic flow sheet of the cutting method embodiment three of glass substrate of the present invention;
Fig. 9 is the operation chart of the cutting method of glass substrate shown in Figure 8.
Embodiment
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
In the design and manufacturing processed of glass substrate, need to pursue higher utilization ratio, technical scheme by adopting technology marks such as alignment mark and cut mark to share among the present invention effectively reduces the shared design space of technology mark, and the present invention also provides corresponding cutting method in addition.
In the technical solution of the present invention technology mark is shared, one of them aspect is that two groups of alignment marks between the adjacent lcd panel in the traditional design are shared is one group of alignment mark, this group alignment mark is that two adjacent liquid crystal panels share, when the liquid crystal panel to these group alignment mark both sides cuts maintenance, all can use one group of above-mentioned alignment mark that shares.Can also cut mark be set in the edge of liquid crystal panel in the present embodiment, after utilizing above-mentioned shared alignment mark to carry out contraposition and cutting, the cutting position of this cut mark with reality can be compared, determine the quality of cutting.Fig. 2 is the structural representation of glass substrate embodiment one of the present invention, as shown in Figure 2, on the grid direction, between two liquid crystal panels on the glass substrate, one group of alignment mark is set, above-mentioned two liquid crystal panels share one group of alignment mark when technology such as cutting.Between two liquid crystal panels on the data line direction, also can carry out same setting in addition, share one group of alignment mark by two adjacent on data line direction liquid crystal panels.Can be both between the adjacent lcd panel on the grid line direction in addition, again one group of alignment mark is being set between the adjacent lcd panel on the data line direction.
The present invention shares alignment mark by adjacent liquid crystal panel, reduces the quantity that plays the alignment mark of indicative function on the glass substrate, can improve the space availability ratio of glass substrate.
In the technical solution of the present invention technology mark is shared, another aspect is that alignment mark and cut mark are shared, in design, will between the liquid crystal panel on grid line direction or the data line direction, only be provided for the cut mark of contraposition and cutting, this cut mark both can be used for contraposition, can be used for cutting again, thereby can no longer be provided for the alignment mark of contraposition, make that liquid crystal panel arranges continuously on grid line direction or data line direction, Fig. 3 is the structural representation of glass substrate embodiment two of the present invention, as shown in Figure 3, liquid crystal panel arranges on the grid line direction continuously, the centre does not arrange alignment mark, liquid crystal panel can be arranged on the direction of data line continuously in addition yet.When carrying out the cutting of glass substrate, can cut according to cut mark, by liquid crystal panel is arranged continuously in glass substrate upper edge grid line direction or data line direction, reduce the quantity of alignment mark on the glass substrate in the present embodiment, can improve the utilization ratio of glass substrate.
For the glass substrate among the described embodiment of Fig. 3, when cutting, on the grid line direction, only need carry out a cutting operation between two crystal liquid substrates and get final product in addition.
At the glass substrate that provides in above-described embodiment, the embodiment of the invention also provides corresponding cutting method, namely utilize the technology mark that shares to carry out contraposition and definite cutting position information, cutter head cuts glass substrate according to above-mentioned cutting position information, and after cutting is finished, can compare according to the cutting position of the cut mark on the glass substrate with reality, to determine cutting quality.The invention provides following embodiment, Fig. 4 is for the schematic flow sheet of the cutting method embodiment one of glass substrate of the present invention, and in conjunction with Fig. 5, Fig. 5 is the operation chart of the cutting method of glass substrate shown in Figure 4, as shown in Figure 4, comprises the steps:
2. step 103, cutter head cut glass substrate, and after arriving cutting end point and finishing 3. the location, do not return initial point;
Cutting method in the present embodiment is when carrying out the cutting of glass substrate, only comprising between two adjacent liquid crystal panels under the situation of one group of alignment mark, determine the cutting position information of cutting twice by utilizing above-mentioned only one group of alignment mark, cutter head is finished when cutting first, do not return initial point, but directly move to the secondary cut position, pending contraposition is calculated and is determined to carry out secondary cut after the cutting position information, after finishing, secondary cut returns initial point, the glass substrate cutting scheme that present embodiment provides can reduce the cutting step flow process, improves cutting efficiency.Cutting scheme in the present embodiment also can be applied in traditional glass substrate in addition.
The situation of cut mark only is set at alignment mark not being set among the above-mentioned glass substrate embodiment on grid line or data line direction in addition, the present invention also provides corresponding cutting method, utilize cut mark to carry out contraposition in this technical scheme and carry out contraposition and determine cutting position information, cut then.Fig. 6 is for the schematic flow sheet of the cutting method embodiment two of glass substrate of the present invention, and in conjunction with Fig. 7, Fig. 7 is the operation chart of the cutting method of glass substrate shown in Figure 6, as shown in Figure 6, comprises the steps:
Step 201, transport device arrive position to be cut with the glass substrate conveyance;
Step 202, carry out 1. contraposition by the image identifying system according to cut mark and calculate to obtain cutting position information, the image encoding system that uses in this step has the identification capability to cut mark;
2. step 203, cutter head cut glass substrate according to above-mentioned cutting position information, and after arriving cutting end point and finishing 3. the location, do not return initial point;
Step 204, transport device with glass substrate 4. conveyance to the secondary cut position;
Step 205, carry out the cutting position information that secondary cut was calculated and determined in 5. contraposition by the image identifying system according to cut mark, i.e. 1. identical to bit manipulation in the information such as cut point and line of cut, the contraposition calculating in this step and step 202;
Step 206,6. cut according to above-mentioned cutting position information by cutter head;
Step 207, after glass substrate cutting is finished, cutter head carries out 7. original point position, gets back to initial point.
The cutting method of the glass substrate that provides in the present embodiment, at the situation that does not have alignment mark on the glass substrate, by the contraposition of identification cut mark realization to glass substrate, cutting, and after once cutting, keep the cutter head invariant position, use transport device that the secondary cut position is arrived in the glass substrate conveyance, cut by cutter head again, can improve the cutting efficiency of glass substrate, because liquid crystal panel is middle continuous setting of not establishing alignment mark at grid line or data line direction, between two liquid crystal panels that arrange continuously on the direction, only carries out a cutting operation in the present embodiment and get final product simultaneously.
Fig. 8 is for the schematic flow sheet of the cutting method embodiment three of glass substrate of the present invention, and in conjunction with Fig. 9, Fig. 9 is the operation chart of the cutting method of glass substrate shown in Figure 8, as shown in Figure 8, comprises the steps:
Step 301, transport device arrive position to be cut with the glass substrate conveyance;
Step 302, carry out 1. contraposition by the image identifying system according to cut mark and calculate to obtain cutting position information, the image encoding system in this step has the identification capability to cut mark;
2. step 303, cutter head cut glass substrate according to above-mentioned cutting position information;
Step 304, cutter head turn back to 4. origin position after arriving cutting end point and finishing 3. the location;
Step 305, transport device with glass substrate 5. conveyance to the secondary cut position;
Step 306, carry out 6. contraposition by the image identifying system according to cut mark and calculate and determine cutting position information, be i.e. 1. identical to bit manipulation in the information such as cut point and line of cut, the contraposition calculating in this step and step 302;
Step 307,7. cut according to above-mentioned cutting position information by cutter head;
Step 308, after glass substrate cutting is finished, cutter head carries out 8. original point position, gets back to 9. origin position.
The cutting method of the glass substrate that present embodiment provides can share at alignment mark and cut mark, when only comprising cut mark between the liquid crystal panel, carries out contraposition according to cut mark, and glass substrate is cut.
The glass substrate that the above embodiment of the present invention provides and the cutting method of glass substrate, share one group of alignment mark by two adjacent liquid crystal panels, perhaps on grid line or data line direction, alignment mark and cut mark are shared, alignment mark is not set, make liquid crystal panel arrange continuously, all can reduce the design space of technology mark on the glass substrate, improve marginal contribution.The cutting method of the corresponding glass substrate that provides of the embodiment of the invention can be cut at the glass substrate that the above embodiments provide, and can be improved the cutting efficiency of glass substrate in addition.
It should be noted that at last: above embodiment is only in order to technical scheme of the present invention to be described but not limit it, although with reference to preferred embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can make amendment or be equal to replacement technical scheme of the present invention, and these modifications or be equal to replacement and also can not make amended technical scheme break away from the spirit and scope of technical solution of the present invention.
Claims (1)
1. the cutting method of a glass substrate is characterized in that, comprising:
The shared alignment mark that is used for determining cutting position information is set between the adjacent lcd panel on grid line and/or the data line direction, and described alignment mark is specially: one group of alignment mark between two lines of cut between the adjacent lcd panel on grid line direction and/or the data line direction;
Position to be cut is arrived in the glass substrate conveyance;
Carry out contraposition by the image identifying system according to described alignment mark, determine cutting position information;
Cutter head cuts described glass substrate, and after arriving cutting end point and finishing the location, does not return initial point;
Described glass substrate holding position is fixed, and described cutter head is moved to the secondary cut position along the direction perpendicular to cut direction;
Carrying out contraposition by described image identifying system according to described alignment mark calculates and determines the secondary cut positional information;
Cut according to described secondary cut positional information by described cutter head;
After cutting is finished, carry out original point position described cutter head is returned described initial point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910080148 CN101844864B (en) | 2009-03-24 | 2009-03-24 | Glass substrate and cutting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910080148 CN101844864B (en) | 2009-03-24 | 2009-03-24 | Glass substrate and cutting method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101844864A CN101844864A (en) | 2010-09-29 |
| CN101844864B true CN101844864B (en) | 2013-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910080148 Expired - Fee Related CN101844864B (en) | 2009-03-24 | 2009-03-24 | Glass substrate and cutting method thereof |
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| CN (1) | CN101844864B (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102180592B (en) * | 2011-03-01 | 2013-01-02 | 上海维宏电子科技股份有限公司 | High-speed cutting method based on tangent following glass cutting system |
| CN102807314B (en) * | 2011-06-03 | 2015-06-17 | 洛阳北方玻璃技术股份有限公司 | Heating device for plate glass |
| CN102514385B (en) * | 2011-11-29 | 2015-04-15 | 深圳市华星光电技术有限公司 | Identification code printing method and identification code printing device |
| US8823998B2 (en) | 2011-11-29 | 2014-09-02 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Identification code printing method and printing apparatus |
| CN102515495B (en) * | 2011-12-13 | 2015-01-21 | 意力(广州)电子科技有限公司 | Panel glass multimode processing method and semi-finished product processed by adopting method |
| KR20130092713A (en) * | 2012-02-13 | 2013-08-21 | (주)미코씨엔씨 | Method of processing a tempered glass substrate for touch screens |
| TWI481576B (en) * | 2012-05-02 | 2015-04-21 | Taiwan Mitsuboshi Diamond Ind Co Ltd | Method of cutting glasses and cutting apparatus |
| CN104297989B (en) * | 2014-10-22 | 2017-06-27 | 京东方科技集团股份有限公司 | substrate, mask plate and liquid crystal display device |
| CN104280922B (en) * | 2014-10-27 | 2017-05-03 | 京东方科技集团股份有限公司 | Method and device for cutting glass of liquid crystal display screen |
| US10052890B2 (en) * | 2015-04-17 | 2018-08-21 | Hewlett-Packard Development Company, L.P. | Target for a printing and cutting process |
| CN104977745B (en) * | 2015-06-24 | 2018-05-25 | 武汉华星光电技术有限公司 | Substrate for liquid crystal display panel and liquid crystal display panel cutting method |
| CN105572939A (en) * | 2016-02-01 | 2016-05-11 | 武汉华星光电技术有限公司 | Alignment and assembly method of liquid crystal display panel |
| CN105652484A (en) * | 2016-03-29 | 2016-06-08 | 深圳市华星光电技术有限公司 | Method for cutting liquid crystal display panel |
| CN107340940B (en) * | 2017-06-23 | 2023-10-24 | 安徽精卓光显技术有限责任公司 | Method for checking deviation of lead in process of manufacturing touch screen and wire brush device |
| CN107357060A (en) * | 2017-08-29 | 2017-11-17 | 惠科股份有限公司 | The manufacture method and manufacturing equipment of a kind of display panel |
| CN109283728B (en) * | 2018-11-12 | 2022-07-05 | 成都中电熊猫显示科技有限公司 | Cutting correction method, device and storage medium |
| CN110142989A (en) * | 2019-04-02 | 2019-08-20 | 万维科研有限公司 | A kind of preparation method of lenticular sheet film |
| CN111679473A (en) * | 2020-06-04 | 2020-09-18 | 深圳市华星光电半导体显示技术有限公司 | Display mother board, manufacturing method thereof and display panel |
| CN111965870B (en) * | 2020-08-05 | 2022-11-08 | 武汉华星光电技术有限公司 | Display substrate mother board and cutting method thereof |
| CN117524003B (en) * | 2024-01-02 | 2024-04-02 | 长春希龙显示技术有限公司 | Display unit and repairing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2795200Y (en) * | 2004-06-10 | 2006-07-12 | 上海广电液晶显示器有限公司 | Blass with cutting butt point mark |
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| JP2002043703A (en) * | 2000-07-31 | 2002-02-08 | Optrex Corp | Multiple mother board and liquid crystal display element |
| CN101109860A (en) * | 2006-07-19 | 2008-01-23 | 群康科技(深圳)有限公司 | Panel Used for LCD device |
| CN101334541A (en) * | 2008-07-23 | 2008-12-31 | 友达光电股份有限公司 | Array substrate and its display panel |
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| Publication number | Publication date |
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| CN101844864A (en) | 2010-09-29 |
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Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150713 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150713 |
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Effective date of registration: 20150713 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 Beijing economic and Technological Development Zone, West Central Road, No. 8 Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |
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Granted publication date: 20130828 Termination date: 20210324 |