CN107340940B - Method for checking deviation of lead in process of manufacturing touch screen and wire brush device - Google Patents
Method for checking deviation of lead in process of manufacturing touch screen and wire brush device Download PDFInfo
- Publication number
- CN107340940B CN107340940B CN201710488426.XA CN201710488426A CN107340940B CN 107340940 B CN107340940 B CN 107340940B CN 201710488426 A CN201710488426 A CN 201710488426A CN 107340940 B CN107340940 B CN 107340940B
- Authority
- CN
- China
- Prior art keywords
- substrate
- small
- lead
- forming
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 194
- 238000007689 inspection Methods 0.000 claims abstract description 33
- 238000000926 separation method Methods 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 8
- 238000011179 visual inspection Methods 0.000 abstract description 7
- 239000011521 glass Substances 0.000 description 12
- 238000005192 partition Methods 0.000 description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 239000002355 dual-layer Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pinball Game Machines (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a method for checking lead deviation in the process of manufacturing a touch screen and a wire brush device. The method for detecting the lead deviation in the process of manufacturing the touch screen comprises the following steps: providing a large substrate for forming a plurality of small substrates, wherein the area between two adjacent small substrates is a separation area; forming leads on the small-piece substrate and forming inspection marks at edges of the small-piece substrate, wherein one part of each inspection mark is positioned on the small-piece substrate, and the other part of each inspection mark is positioned on the separation area; separating the small substrate from the large substrate; the test marks on the die substrate are visually inspected to determine if the leads are offset. In the process of manufacturing the touch screen, whether the lead is deviated or not can be determined by visual inspection marks on the small-piece substrate, and compared with a mode of measuring the distance between the lead and the edge of the small-piece substrate, the operation efficiency is higher.
Description
Technical Field
The present invention relates to the field of touch technologies, and in particular, to a method for inspecting lead misalignment during a process of manufacturing a touch screen, and a wire brush device.
Background
Capacitive touch screens can be divided into two types: (1) a glass capacitive touch screen; (2) Film capacitive touch screen.
When the glass capacitive touch screen is manufactured, touch electrodes for determining touch coordinates and leads for connecting the touch electrodes with a chip are formed on a large piece of glass according to typesetting design of a drawing, and then the large piece of glass is cut to obtain a small piece of glass (the size of the small piece of glass is equivalent to that of an actual product).
When the Film capacitive touch screen is manufactured, according to the typesetting design of a drawing, touch electrodes for determining touch coordinates, leads for connecting the touch electrodes and a chip and targets are formed on a large Film, and then the large Film is punched through the targets and the sleeve positions to obtain small Film (the Film size of the small Film is equivalent to that of an actual product).
When cutting large pieces of glass or punching large pieces of Film, the existence of the inner shrinkage and outer expansion imagination and the existence of machining errors of materials (materials of leads and materials of targets) can cause that the distance between the leads on the small pieces of glass or the small pieces of Film and the edges of the small pieces of glass or the small pieces of Film is too large or too small, namely the phenomenon of cutting deviation exists. When judging whether the cutting is deviated, usually, a worker is required to measure the distance between the lead wire on each piece of small piece of glass or small piece of Film and the edge of the small piece of glass or small piece of Film, so that the deviation defective product is detected, and the operation efficiency is low.
Disclosure of Invention
Based on this, it is necessary to provide a method for inspecting the deviation of the lead wire in the process of manufacturing the touch screen and a wire brush device with high operation efficiency.
A method for inspecting lead misalignment during the fabrication of a touch screen, comprising the steps of:
providing a large substrate for forming a plurality of small substrates, wherein the area between two adjacent small substrates is a separation area;
forming leads on the small-piece substrate and forming inspection marks at edges of the small-piece substrate, wherein one part of each inspection mark is positioned on the small-piece substrate, and the other part of each inspection mark is positioned on the separation area;
separating the small substrate from the large substrate; and
visual inspection of the test marks on the die substrate to determine if the leads are offset.
According to the method for inspecting the lead deviation in the process of manufacturing the touch screen, the lead is formed on the small substrate and the inspection marks are formed at the edge of the small substrate, wherein one part of each inspection mark is positioned on the small substrate, the other part of each inspection mark is positioned on the separation area, and then whether the lead is deviated or not can be determined by visual inspection of the inspection mark on the small substrate in the process of manufacturing the touch screen, so that the operation efficiency is higher than that in a mode of measuring the distance between the lead and the edge of the small substrate.
In one embodiment, the large-scale substrate comprises a central area and a frame area, wherein the central area is used for forming a plurality of small-scale substrates;
the method further includes the step of forming a target in the border region prior to the step of separating the small substrate from the large substrate. Therefore, the small substrates can be separated from the large substrates in a positioning target sleeving manner, and the production efficiency and the yield are improved.
In one embodiment, the test flag is formed simultaneously with the leads. Thus, the problem of increased process steps caused by the addition of the test mark can be avoided.
In one embodiment, the test flag is the same material as the leads. Therefore, the problem of increased process steps caused by the addition of the test mark can be further avoided.
In one embodiment, the test mark is in a center symmetrical pattern, and a center line of the test mark coincides with a side line of the small chip substrate. Thus, the center-symmetrical pattern is more useful for visual judgment because the center-symmetrical pattern such as semicircle, major arc and minor arc has a higher degree of recognition than the non-center-symmetrical pattern such as right triangle.
In one embodiment, the dimensional tolerance of the leads is positive and negative X, and the maximum length of the inspection mark in the arrangement direction along the adjacent two die substrates is twice the X. By the arrangement, on one hand, the inspection mark can be ensured to be convenient for naked eye observation, and on the other hand, manufacturing materials of the inspection mark can be reduced, and cost is reduced.
In one embodiment, the plurality of die substrates are arranged in an array form, each column and each row comprises a plurality of die substrates, each die substrate is square, each die substrate comprises a first side line and a second side line which are opposite, a third side line and a fourth side line which are opposite, the first side lines and the second side lines of two adjacent die substrates are arranged in a staggered manner in each row, and the third side lines and the fourth side lines of two adjacent die substrates are arranged in a staggered manner in each column;
the inspection mark is arranged on at least one of the first side line and the third side line. Therefore, the small substrate can be conveniently cut from the large substrate, meanwhile, whether the lead is deviated or not can be determined through visual inspection marks on the small substrate in the process of manufacturing the touch screen, and the operation efficiency is higher than that of adopting a mode of measuring the distance between the lead and the edge of the small substrate.
A method for inspecting lead misalignment during the fabrication of a touch screen, comprising the steps of:
providing a first large substrate and a second large substrate, wherein the first large substrate is used for forming a plurality of first small substrates, the second large substrate is used for forming a plurality of second small substrates, and a region between two adjacent first small substrates is a first separation region;
forming a first lead and a first touch electrode on the first small-piece substrate, forming a test mark at the edge of the first small-piece substrate, and forming a second lead and a second touch electrode on the second small-piece substrate, wherein one part of each test mark is positioned on the first small-piece substrate, and the other part of each test mark is positioned on the first separation area;
attaching the surface of the first large substrate far away from the first lead to the second large substrate, wherein the edge of the first small substrate is overlapped with the edge of the second small substrate;
separating the first small substrate from the first large substrate while separating the second small substrate from the second large substrate; and
visual inspection of the test marks on the first die substrate to determine if the first leads are offset. Thus, when the first small-chip substrates are produced in batches, whether the first leads are deviated or not can be determined by only visually inspecting the first small-chip basic inspection marks once, so that the production efficiency can be improved.
A wire brush device includes a first wire print area for forming a lead wire and a second wire print area for forming an inspection mark.
In one embodiment, a third silk screened area for forming a target is also included.
Drawings
FIG. 1 is a schematic view of a large substrate according to an embodiment;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is an enlarged view of a portion of FIG. 2;
FIG. 4 is a partial enlarged view at B in FIG. 1;
FIG. 5 is a schematic diagram corresponding to FIG. 1;
FIG. 6 is a schematic view of a structure of a die substrate according to an embodiment;
fig. 7 is a partial enlarged view at C in fig. 6.
Detailed Description
The method for checking the lead wire deviation in the process of manufacturing the touch screen and the wire brush device are further described below with reference to the accompanying drawings and the specific embodiments.
The method for checking the lead deviation in the process of manufacturing the touch screen comprises the following steps:
in step S110, a large substrate for forming a plurality of small substrates is provided, wherein a region between two adjacent small substrates is a separation region.
In step S120, a lead is formed on the die substrate and test marks are formed at edges of the die substrate, wherein a portion of each test mark is located on the die substrate and another portion is located on the separation region.
In step S130, the small substrate is separated from the large substrate.
In step S140, the test marks on the die substrate are visually inspected to determine if the leads are offset.
In the process of manufacturing the touch screen, whether the lead is deviated or not can be determined by visual inspection marks on the small-piece substrate, and compared with a mode of measuring the distance between the lead and the edge of the small-piece substrate, the operation efficiency is higher.
In this embodiment, before step S120, a step of providing a design drawing is further included, and step S120 is performed according to the design drawing. Specifically, as shown in fig. 1 to 5, according to the design drawing, the large substrate 10 is used to form a plurality of small substrates 12, and the area between two adjacent small substrates 12 is a partition 14, where the partition 14 includes a transverse partition 14a and a longitudinal partition 14b. The large substrate 10 includes a central region 10a and a frame region 10b, the central region 10a being used to form a plurality of small substrates 12. The plurality of die substrates 12 are arranged in an array, each column and each row including a plurality of die substrates 12. The die substrates 12 are square, and each die substrate 12 includes a first side line 12a and a second side line 12b opposite to each other, and a third side line 12c and a fourth side line 12d opposite to each other. In each row, the first side lines 12a and the second side lines 12b of the adjacent two small substrates 12 are staggered; in each column, the third lines 12c and the fourth lines 12d of the adjacent two small substrates 12 are arranged in a staggered manner. Leads 20 are formed on the die substrate 12 and test marks 30 are formed at the edges of the die substrate 12. One portion of each test mark 30 is located on the die substrate 12 and the other portion is located on the separation region 14.
In the present embodiment, before step S120 is performed, the mark for distinguishing the small substrate 12 is not provided on the large substrate 10, and the edge line of the small substrate 12 is formed at the same time as the small substrate 12 is formed, that is, the edge line of the small substrate 12 is formed in step S130. The formation of the leads 20 and the test marks 30, as well as the formation of the edges of the die substrate 12, are formed by an automated process according to the design drawing. It will be appreciated that in other embodiments, a marker for distinguishing the small substrate 12 may be provided on the large substrate 10 in advance, for example, a line overlapping with an edge line of the small substrate 12 may be manufactured on the large substrate 10 in advance.
The die substrates 12 are square, each die substrate 12 has four edges, the test marks 30 may be disposed on all four edges, or the test marks 30 may be disposed on only one or two edges. Preferably, in the present embodiment, the check mark 30 is provided on at least one of the first side line 12a and the third side line 12 c.
Further, in the present embodiment, the partition 14 includes a lateral partition 14a and a longitudinal partition 14b, the longitudinal partition 14b being located between the first side line 12a and the second side line 12b, the lateral partition 14a being located between the third side line 12c and the fourth side line 12d. The longitudinal partition 14b has a longitudinal centerline 14c parallel to the first edge 12a, and the transverse partition 14a has a transverse centerline 14d parallel to the third edge 12 c. The test flag 30 is also disposed on at least one of the longitudinal centerline 14c and the transverse centerline 14d. Specifically, in the present embodiment, the test mark 30 is provided on the longitudinal center line 14c. Providing a test flag 30 on at least one of the longitudinal centerline 14c and the transverse centerline 14d may assist in determining if the lead 20 is offset.
Further, in the present embodiment, before step S120, a step of forming a touch electrode (not shown) on the die substrate 12 is further included. After forming the touch electrode, step S120 is performed. One end of the lead 20 formed in step S120 is connected to the touch electrode, and the other end is connected to a flexible circuit board (i.e., FPC) of the touch screen. Specifically, in the present embodiment, the touch electrode is an ITO electrode.
Further, in the present embodiment, the large substrate 10 is a film substrate, and the step of forming the targets 40 in the frame region 10b is further included before the step of separating the small substrate 12 from the large substrate 10. The targets 40 are provided on the frame region 10b of the large substrate 10, and the small substrate 12 can be separated from the large substrate 10 by sleeving the targets 40. The large substrate 10 may be a mylar substrate. In other embodiments, when the large substrate is a glass substrate, the small substrate may be separated from the large substrate by dicing.
Further, in the present embodiment, the lead 20 is formed simultaneously with the check mark 30, so that the problem of an increase in the number of process steps due to the addition of the check mark 30 can be avoided. Further, in the present embodiment, the material of the lead 20 and the test mark 30 is the same, so that the problem of increasing the number of process steps due to the addition of the test mark 30 can be further avoided. Specifically, in the present embodiment, the material of the lead 20 and the test mark 30 is silver paste, and the lead 20 and the test mark 30 are formed by screen printing.
Further, in the present embodiment, the check mark 30 is a center-symmetrical pattern, and the center line of the check mark 30 coincides with the edge line of the die substrate 12. The test mark 30 may be a ring, a dot (circular spot), an isosceles triangle, or the like. In this embodiment, the test mark 30 is preferably a ring, which is less expensive than a dot of the same size and has a small effect on the non-visible area (area where the leads 20 are located) of the die substrate 12. Compared with an isosceles triangle, the circular ring is more beneficial to visual inspection judgment, and the semicircle, the major arc and the minor arc have higher identification degree compared with the right triangle.
Further, in the present embodiment, the dimensional tolerance of the formation leads 20 is positive and negative X, and when designing the test marks, the maximum length of the test marks in the arrangement direction along the adjacent two die substrates is twice as large as that of the formation X. Specifically, as shown in fig. 6 and 7, in the present embodiment, the distance between the designed lead 20 and the edge line is 0.40±0.15mm, the dimensional tolerance of the formed lead 20 is plus or minus 0.15mm, and the diameter of the inspection mark is 0.30mm.
The test marks 30 on the die substrate 12 are visually inspected to determine if the leads 20 are offset. For example, whether the lead 20 is offset when the test mark 30 is not present on the die substrate 12 or when the pattern of the test mark 30 on the die substrate 12 is complete, that is, when designing, the size of the test mark 30 on the die substrate 12 is visually checked as being out of the standard, that is, when the size of the test mark 30 on the die substrate 12 is out of the standard, that is, when the lead 20 is out of the standard, based on the extent that the lead is not offset or out of the standard, can be determined based on the condition of the test mark 30 present on the die substrate 12. In this embodiment, the test marks 30 are circular rings or dots, and the leads 20 are not offset when the test marks 30 on the die substrate 12 are half rings or half dots.
In this embodiment, the touch screen is a dual-layer touch screen, and the manufacturing of the dual-layer touch screen includes the following steps:
step S210, providing a first large substrate and a second large substrate, wherein the first large substrate is used for forming a plurality of first small substrates, the second large substrate is used for forming a plurality of second small substrates, and a region between two adjacent first small substrates is a first separation region.
In step S220, a first lead, a first touch electrode, and an inspection mark are formed on the first die substrate and at a border of the first die substrate, and a second lead and a second touch electrode are formed on the second die substrate, wherein a portion of each inspection mark is located on the first die substrate and another portion is located on the first separation region.
In step S230, the surface of the first large substrate far from the first lead is attached to the second large substrate, and the edge of the first small substrate is overlapped with the edge of the second small substrate.
In step S240, the first small substrate is separated from the first large substrate, and the second small substrate is separated from the second large substrate.
In step S250, the inspection mark on the first die substrate is visually inspected to determine whether the first lead is offset.
Because the attaching precision of the first large substrate and the second large substrate can enable the edge line of the first small substrate to be overlapped with the edge line of the second small substrate, whether the first lead is deviated or not can indicate whether the second lead is deviated or not.
The leads 20 and the test marks 30 are formed by screen printing. In this embodiment, there is also provided a wire brush device including a first wire print area for forming a lead wire and a second wire print area for forming an inspection mark. Further, in this embodiment, the wire brush device further includes a third silk-screened area for forming a target.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (8)
1. A method for inspecting lead misalignment during the manufacture of a touch screen, comprising the steps of:
providing a large substrate for forming a plurality of small substrates, wherein the area between two adjacent small substrates is a separation area;
forming leads on the small-piece substrate and forming inspection marks at edges of the small-piece substrate, wherein one part of each inspection mark is positioned on the small-piece substrate, and the other part of each inspection mark is positioned on the separation area;
separating the small substrate from the large substrate; and visually inspecting the test marks on the die substrate to determine if the leads are offset;
the inspection mark is in a central symmetrical pattern, and the central line of the inspection mark coincides with the side line of the small substrate;
the dimensional tolerance of the leads is positive and negative X, and the maximum length of the inspection mark in the arrangement direction along the adjacent two small chip substrates is twice of the X.
2. The method of claim 1, wherein the large substrate includes a central region and a border region, the central region being used to form a plurality of the small substrates;
the method further includes the step of forming a target in the border region prior to the step of separating the small substrate from the large substrate.
3. The method of claim 1, wherein the test mark is formed simultaneously with the leads.
4. A method of inspecting a lead for misalignment during manufacture of a touch screen as claimed in claim 3 wherein the inspection mark is the same material as the lead.
5. The method of claim 1, wherein a plurality of said die substrates are arranged in an array, each column and each row comprising a plurality of said die substrates, each said die substrate being square, each said die substrate comprising opposing first and second edges, and opposing third and fourth edges, said first and second edges of two adjacent die substrates being staggered in each row, said third and fourth edges of two adjacent die substrates being staggered in each column;
the inspection mark is arranged on at least one of the first side line and the third side line.
6. A method for inspecting lead misalignment during the manufacture of a touch screen, comprising the steps of:
providing a first large substrate and a second large substrate, wherein the first large substrate is used for forming a plurality of first small substrates, the second large substrate is used for forming a plurality of second small substrates, and a region between two adjacent first small substrates is a first separation region;
forming a first lead and a first touch electrode on the first small-piece substrate, forming a test mark at the edge of the first small-piece substrate, and forming a second lead and a second touch electrode on the second small-piece substrate, wherein one part of each test mark is positioned on the first small-piece substrate, and the other part of each test mark is positioned on the first separation area;
attaching the surface of the first large substrate far away from the first lead to the second large substrate, wherein the edge of the first small substrate is overlapped with the edge of the second small substrate;
separating the first small substrate from the first large substrate while separating the second small substrate from the second large substrate; and visually inspecting the test mark on the first die substrate to determine if the first lead is offset;
the inspection mark is in a central symmetrical pattern, and the central line of the inspection mark coincides with the side line of the small substrate;
the dimensional tolerance of the leads is positive and negative X, and the maximum length of the inspection mark in the arrangement direction along the adjacent two small chip substrates is twice of the X.
7. A wire brush device comprising a first screen printed area for forming a wire and a second screen printed area for forming an inspection mark.
8. The wire brush device of claim 7, further comprising a third silk screened area for forming a target.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710488426.XA CN107340940B (en) | 2017-06-23 | 2017-06-23 | Method for checking deviation of lead in process of manufacturing touch screen and wire brush device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710488426.XA CN107340940B (en) | 2017-06-23 | 2017-06-23 | Method for checking deviation of lead in process of manufacturing touch screen and wire brush device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107340940A CN107340940A (en) | 2017-11-10 |
| CN107340940B true CN107340940B (en) | 2023-10-24 |
Family
ID=60221611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710488426.XA Active CN107340940B (en) | 2017-06-23 | 2017-06-23 | Method for checking deviation of lead in process of manufacturing touch screen and wire brush device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107340940B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108388376B (en) * | 2018-03-07 | 2021-05-25 | 张家港康得新光电材料有限公司 | Conductive film layer structure, manufacturing method thereof and touch screen |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1345010A (en) * | 2000-09-26 | 2002-04-17 | 洋华光电股份有限公司 | Manufacture of touching control panel |
| JP2004342664A (en) * | 2003-05-13 | 2004-12-02 | Juki Corp | Electronic part packaging apparatus |
| KR20050032530A (en) * | 2005-01-28 | 2005-04-07 | (주)포틱스테크놀로지 | Automatic inspection apparatus of substrate for semiconductor package |
| CN101844864A (en) * | 2009-03-24 | 2010-09-29 | 北京京东方光电科技有限公司 | Glass substrate and cutting method thereof |
| CN102096505A (en) * | 2011-01-07 | 2011-06-15 | 牧东光电（苏州）有限公司 | Touch panel jointed fragmentally and manufacturing method thereof |
| CN103853395A (en) * | 2012-11-30 | 2014-06-11 | 比亚迪股份有限公司 | Capacitive screen and manufacturing method thereof |
| CN104035642A (en) * | 2014-06-16 | 2014-09-10 | 南京点面光电有限公司 | OGS (one glass solution) capacitive touch screen and preparation method thereof |
| CN104166485A (en) * | 2013-05-17 | 2014-11-26 | 袁博 | Monolithic substrate capacitive touch screen and manufacturing method thereof |
| CN104181768A (en) * | 2013-05-27 | 2014-12-03 | 佳能株式会社 | Imprinting method, imprinting apparatus, and device manufacturing method |
| CN104330912A (en) * | 2014-11-24 | 2015-02-04 | 京东方科技集团股份有限公司 | Mother board, mother board after box pairing, corresponding manufacturing method and liquid crystal display panel |
| CN104718519A (en) * | 2013-08-23 | 2015-06-17 | 林龙辰 | Process module, fabricating method thereof and substrate processing method using the process module |
| CN205029958U (en) * | 2015-09-25 | 2016-02-10 | 广州兴森快捷电路科技有限公司 | V -CUT prevents slow -witted graphic structure |
| CN106842838A (en) * | 2017-04-19 | 2017-06-13 | 武汉华星光电技术有限公司 | Alignment mark and substrate alignment method |
-
2017
- 2017-06-23 CN CN201710488426.XA patent/CN107340940B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1345010A (en) * | 2000-09-26 | 2002-04-17 | 洋华光电股份有限公司 | Manufacture of touching control panel |
| JP2004342664A (en) * | 2003-05-13 | 2004-12-02 | Juki Corp | Electronic part packaging apparatus |
| KR20050032530A (en) * | 2005-01-28 | 2005-04-07 | (주)포틱스테크놀로지 | Automatic inspection apparatus of substrate for semiconductor package |
| CN101844864A (en) * | 2009-03-24 | 2010-09-29 | 北京京东方光电科技有限公司 | Glass substrate and cutting method thereof |
| CN102096505A (en) * | 2011-01-07 | 2011-06-15 | 牧东光电（苏州）有限公司 | Touch panel jointed fragmentally and manufacturing method thereof |
| CN103853395A (en) * | 2012-11-30 | 2014-06-11 | 比亚迪股份有限公司 | Capacitive screen and manufacturing method thereof |
| CN104166485A (en) * | 2013-05-17 | 2014-11-26 | 袁博 | Monolithic substrate capacitive touch screen and manufacturing method thereof |
| CN104181768A (en) * | 2013-05-27 | 2014-12-03 | 佳能株式会社 | Imprinting method, imprinting apparatus, and device manufacturing method |
| CN104718519A (en) * | 2013-08-23 | 2015-06-17 | 林龙辰 | Process module, fabricating method thereof and substrate processing method using the process module |
| CN104035642A (en) * | 2014-06-16 | 2014-09-10 | 南京点面光电有限公司 | OGS (one glass solution) capacitive touch screen and preparation method thereof |
| CN104330912A (en) * | 2014-11-24 | 2015-02-04 | 京东方科技集团股份有限公司 | Mother board, mother board after box pairing, corresponding manufacturing method and liquid crystal display panel |
| CN205029958U (en) * | 2015-09-25 | 2016-02-10 | 广州兴森快捷电路科技有限公司 | V -CUT prevents slow -witted graphic structure |
| CN106842838A (en) * | 2017-04-19 | 2017-06-13 | 武汉华星光电技术有限公司 | Alignment mark and substrate alignment method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107340940A (en) | 2017-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101330804B (en) | Printed circuit board and method of manufacturing the same | |
| WO2019019339A1 (en) | Multi-functional circuit board detection module and detection method | |
| US10146385B2 (en) | Touch substrate, display device and method for detecting touch electrode pattern | |
| KR20230148853A (en) | Electroconductive film, roll, connected structure, and process for producing connected structure | |
| JP2008532295A (en) | Multilayer printed circuit board having conductive test area and method for measuring misalignment of intermediate layer | |
| CN102480852B (en) | Method for manufacturing circuit boards | |
| JP2009147397A (en) | Inspection mark structure, substrate sheet laminate, multilayer circuit board, method of inspecting lamination matching precision of multilayer circuit board, and method of designing substrate sheet laminate | |
| CN107340940B (en) | Method for checking deviation of lead in process of manufacturing touch screen and wire brush device | |
| CN103796417B (en) | Circuit board and preparation method thereof | |
| CN108107342B (en) | Test module | |
| CN102931186A (en) | Wafer with narrower scribing slots | |
| CN113163591B (en) | HDI blind hole board test structure and HDI blind hole board | |
| CN1972560B (en) | A flexible printed circuit board and its manufacturing method | |
| CN206740921U (en) | Vacation pressure test FPC | |
| CN207443205U (en) | A kind of multi-layer flexible circuit board of anti-stacked fault position | |
| JP2005210028A (en) | Multi-molded wiring board | |
| US20080186045A1 (en) | Test mark structure, substrate sheet laminate, multilayered circuit substrate, method for inspecting lamination matching precision of multilayered circuit substrate, and method for designing substrate sheet laminate | |
| CN111344656A (en) | Touch screen detection structure, manufacturing method thereof and touch screen with detection structure | |
| CN101917821B (en) | High-density circuit board registration hole and manufacturing method thereof | |
| CN110996502A (en) | Circuit board and punching method thereof, judging method of punching deviation and display module | |
| KR20180075277A (en) | Printed circuit board | |
| JPH03151615A (en) | Manufacture of laminar electronic parts | |
| CN209845430U (en) | Detection circuit board | |
| CN219761509U (en) | High-level high-precision alignment test Coupon | |
| US10705117B2 (en) | Probe assembly and probe structure thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210223 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Applicant after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 215143 No. 233 Kangyang Road, Huangdi Town, Xiangcheng District, Suzhou City, Jiangsu Province Applicant before: SUZHOU OFILM TECH Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |