CN104330912A - Mother board, mother board after box pairing, corresponding manufacturing method and liquid crystal display panel - Google Patents
Mother board, mother board after box pairing, corresponding manufacturing method and liquid crystal display panel Download PDFInfo
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- CN104330912A CN104330912A CN201410683152.6A CN201410683152A CN104330912A CN 104330912 A CN104330912 A CN 104330912A CN 201410683152 A CN201410683152 A CN 201410683152A CN 104330912 A CN104330912 A CN 104330912A
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- alignment mark
- sealed plastic
- plastic box
- motherboard
- underlay substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13398—Spacer materials; Spacer properties
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- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Optical Filters (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a mother board, a mother board after box pairing, a corresponding manufacturing method and a liquid crystal display panel. The mother board comprises a lining baseboard and a plurality of baseboard units which are located on the lining baseboard in a matrix mode and provided with counterpoint marks, wherein frame sealing glue is coated along the cutting line of the lining baseboard, the counterpoint marks are located inside the area of the frame sealing glue, due to the fact that at least the frame sealing glue coated at the counterpoint mark position is transparent frame sealing glue, or the frame sealing glue coated at the counterpoint mark position is the transparent frame sealing glue, the frame sealing glue coated at the area except the counterpoint marks is the transparent or non-transparent frame sealing glue, so that even the frame sealing glue is coated along the cutting line, the counterpoint marks are covered by the frame sealing glue, the problem that the counterpoint marks cannot be identified does not occur, the mother board after box pairing can be accurately cut, and the mother board can be detected and identified through the counterpoint marks when the bad phenomena of color mixing and lower transmitting rate occur on the liquid crystal display panel.
Description
Technical field
The present invention relates to display technique field, particularly relate to a kind of motherboard, to the motherboard after box, respective production method and display panels.
Background technology
Display panels forms primarily of subtend substrate, array base palte and the liquid crystal layer between this two substrates.In the actual fabrication process of display panels, first, on two motherboards, respective production is multiple subtend base board unit of matrix arrangement and multiple array base palte unit respectively, then, a motherboard is coated with sealed plastic box wherein, dispenser method molecule on an other motherboard, and carry out box technique, finally, respectively two motherboards are cut along the line of cut on two motherboards, form multiple display panels.
At present, in order to adapt to the development trend of the narrow frame of display panels, in the actual fabrication process of display panels, generally along the line of cut coating cutting-type sealed plastic box on motherboard, namely line of cut is positioned on the center line of cutting-type sealed plastic box of coating, and after to box technique, band glue cutting technique is adopted to cut along line of cut to the motherboard after box, like this, the frame of the display panels produced is narrower, and the area of viewing area is larger.But, said method is in actual mechanical process, cutting-type sealed plastic box along line of cut coating can cover the alignment mark be positioned near line of cut, opaque due to cutting-type sealed plastic box, alignment mark None-identified can be caused, like this, will be difficult to when cutting into display panels to the motherboard after box accurately cut, and, display panels occur colour mixture, transmitance on the low side etc. bad time, cannot by alignment mark carry out checking confirming above-mentioned bad whether be that aligning accuracy difference causes.
Therefore, along the identification how improving alignment mark during line of cut coating sealed plastic box, be the technical matters that those skilled in the art need solution badly.
Summary of the invention
In view of this, a kind of motherboard is embodiments provided, to the motherboard after box, respective production method and display panels, in order to improve the identification of alignment mark when being coated with sealed plastic box along line of cut.
Therefore, embodiments provide a kind of motherboard, comprising: underlay substrate and be positioned on described underlay substrate in matrix arrangement multiple base board units with alignment mark; Be coated with sealed plastic box along the line of cut on described underlay substrate, described alignment mark is positioned at sealed plastic box region;
The sealed plastic box of at least described alignment mark place coating is transparent sealed plastic box.
In a kind of possible implementation, in the above-mentioned motherboard that the embodiment of the present invention provides, the material of described transparent sealed plastic box comprises: acrylic acid epoxy resin, N-vinylpyrrolidone, light trigger and photoiniator.
In a kind of possible implementation, in the above-mentioned motherboard that the embodiment of the present invention provides, described motherboard to comprise in matrix multiple array base palte unit of arrangement, and the grid line in described alignment mark and described array base palte unit or data line are arranged with layer; Or,
Described motherboard to comprise in matrix multiple subtend base board units of arrangement, and the black matrix in described alignment mark and described subtend base board unit is arranged with layer.
The embodiment of the present invention additionally provides a kind of to the motherboard after box, comprising: the first motherboard relatively put and the second motherboard; Described first motherboard comprises the first underlay substrate and is positioned at multiple array base palte unit with the first alignment mark of the arrangement in matrix on described first underlay substrate; Described second motherboard comprises the second underlay substrate and is positioned at multiple subtend base board units with the second alignment mark of the arrangement in matrix on described second underlay substrate;
Be coated with sealed plastic box along the line of cut on described first underlay substrate, described first alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least described first alignment mark place coating is transparent sealed plastic box; And/or,
Be coated with sealed plastic box along the line of cut on described second underlay substrate, described second alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least described second alignment mark place coating is transparent sealed plastic box.
In a kind of possible implementation, the embodiment of the present invention provide above-mentioned in the motherboard after box, the material of described transparent sealed plastic box comprises: acrylic acid epoxy resin, N-vinylpyrrolidone, light trigger and photoiniator.
In a kind of possible implementation, the embodiment of the present invention provide above-mentioned in the motherboard after box, the grid line in described first alignment mark and described array base palte unit or data line are arranged with layer;
Black matrix in described second alignment mark and described subtend base board unit is arranged with layer.
The embodiment of the present invention additionally provides a kind of display panels, and described display panels is that the embodiment of the present invention provided above-mentioned obtains after the motherboard cutting after box.
The embodiment of the present invention additionally provides a kind of method for making of motherboard, comprising:
Underlay substrate is formed multiple figures with the base board unit of alignment mark of the arrangement in matrix;
Along the line of cut coating sealed plastic box on described underlay substrate; Wherein, described alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least described alignment mark place coating is transparent sealed plastic box.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, the material of described transparent sealed plastic box comprises: acrylic acid epoxy resin, N-vinylpyrrolidone, light trigger and photoiniator.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, described motherboard comprises multiple array base palte unit of the arrangement in matrix, and the described figure forming alignment mark on underlay substrate, specifically comprises:
Adopt a patterning processes, while the grid line in the figure forming each described array base palte unit or data line figure, form the figure of described alignment mark; Or,
Described motherboard comprises multiple subtend base board units of the arrangement in matrix, and the described figure forming alignment mark on underlay substrate, specifically comprises:
Adopt a patterning processes, while the black Matrix Pattern in the figure forming each described subtend base board unit, form the figure of described alignment mark.
The embodiment of the present invention additionally provides a kind of method for making to the motherboard after box, comprising:
First underlay substrate forms multiple figures with the array base palte unit of the first alignment mark of the arrangement in matrix, the corresponding multiple figures with the subtend base board unit of the second alignment mark forming the arrangement in matrix on the second underlay substrate;
Along the line of cut coating sealed plastic box on described first underlay substrate; Wherein, described first alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least described first alignment mark place coating is transparent sealed plastic box; And/or, along the line of cut coating sealed plastic box on described second underlay substrate; Wherein, described second alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least described second alignment mark place coating is transparent sealed plastic box;
Described first underlay substrate and described second underlay substrate are carried out box process.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, the material of described transparent sealed plastic box comprises: acrylic acid epoxy resin, N-vinylpyrrolidone, light trigger and photoiniator.
In a kind of possible implementation, in the said method that the embodiment of the present invention provides, the described figure forming the first alignment mark on the first underlay substrate, specifically comprises:
Adopt a patterning processes, while the grid line in the figure forming each described array base palte unit or data line figure, form the figure of described first alignment mark;
The described figure forming the second alignment mark on the second underlay substrate, specifically comprises:
Adopt a patterning processes, while the black Matrix Pattern in the figure forming each described subtend base board unit, form the figure of described second alignment mark.
The above-mentioned motherboard that the embodiment of the present invention provides, to the motherboard after box, respective production method and display panels, this motherboard comprises: underlay substrate and be positioned at multiple base board units with alignment mark of the arrangement in matrix on underlay substrate, be coated with sealed plastic box along the line of cut on underlay substrate, alignment mark is positioned at sealed plastic box region, because the sealed plastic box of at least alignment mark place coating is transparent sealed plastic box, namely the sealed plastic box of alignment mark place coating is transparent sealed plastic box, the sealed plastic box of the region coating except alignment mark is transparent or opaque sealed plastic box, like this, even if along the line of cut coating sealed plastic box on underlay substrate, alignment mark is covered by sealed plastic box, also there will not be the problem of None-identified alignment mark, thus accurately can cut to the motherboard after box, and, colour mixture is there is at display panels, transmitance is on the low side etc. bad time, inspection can also be carried out by alignment mark to confirm.
Accompanying drawing explanation
Fig. 1 a and Fig. 1 b is respectively the schematic top plan view of the motherboard that the embodiment of the present invention provides;
Fig. 2 a is the cut-open view of Fig. 1 a along AA direction;
Fig. 2 b is the cut-open view of Fig. 1 b along BB direction;
Fig. 3 a for the embodiment of the present invention provide on the first motherboard, sealed plastic box is coated with before to box technique to the motherboard after box after structural representation;
Fig. 3 b for the embodiment of the present invention provide on the second motherboard, sealed plastic box is coated with before to box technique to the motherboard after box after structural representation;
Fig. 4 a and Fig. 4 b is respectively the structural representation to the motherboard after box that the embodiment of the present invention provides;
The process flow diagram of the method for making of the motherboard that Fig. 5 provides for the embodiment of the present invention;
Fig. 6 is respectively the process flow diagram of the method for making to the motherboard after box that the embodiment of the present invention provides.
Embodiment
Below in conjunction with accompanying drawing, the motherboard that the embodiment of the present invention is provided, the embodiment of the motherboard after box, respective production method and display panels to be described in detail.
In accompanying drawing, the shape of each rete and thickness do not reflect the actual proportions of array base palte or subtend substrate, and object just signal illustrates content of the present invention.
A kind of motherboard that the embodiment of the present invention provides, as shown in Fig. 1 a, Fig. 1 b, Fig. 2 a and Fig. 2 b, wherein, Fig. 2 a is the cut-open view of Fig. 1 a along AA direction, Fig. 2 b is the cut-open view of Fig. 1 b along BB direction, comprising: underlay substrate 1 and be positioned at multiple base board units 3 (Fig. 1 a and Fig. 1 b is to illustrate the base board unit 3 that 2 row * 2 arrange) with alignment mark 2 of the arrangement in matrix on underlay substrate 1; Be coated with sealed plastic box 4 along the line of cut (shown in dotted line as illustrated in figs. ia and ib, can obtain four base board units 3 along line of cut cutting motherboard) on underlay substrate 1, alignment mark 2 is positioned at sealed plastic box 4 region;
At least the sealed plastic box 4 of alignment mark 2 place coating is transparent sealed plastic box, namely transparent sealed plastic box (shown in the dot-hatched as shown in Fig. 1 a and 2a) can be all coated with at dispensing area, or, also only transparent sealed plastic box (shown in the dot-hatched as shown in Fig. 1 b and Fig. 2 b) can be coated with at alignment mark 2 place, be coated with opaque sealed plastic box (shown in the linear shadow as shown in Fig. 1 b and Fig. 2 b) at the dispensing area except alignment mark 2, do not limit at this.
The above-mentioned motherboard that the embodiment of the present invention provides, because the sealed plastic box of at least alignment mark place coating is transparent sealed plastic box, namely the sealed plastic box of alignment mark place coating is transparent sealed plastic box, the sealed plastic box of the region coating except alignment mark is transparent or opaque sealed plastic box, like this, even if along the line of cut coating sealed plastic box on underlay substrate, make alignment mark be covered by sealed plastic box, also there will not be the problem of None-identified alignment mark.
In the specific implementation, the material of transparent sealed plastic box specifically can comprise the above-mentioned motherboard that the embodiment of the present invention provides: acrylic acid epoxy resin, N-vinylpyrrolidone, light trigger and photoiniator.The transparent sealed plastic box be made up of above-mentioned material can rapid curing under the irradiation of ultraviolet light, and, the transparent sealed plastic box of above-mentioned material composition is higher for the light transmission rate of different visible wavelengths, as can be seen from table 1 below, the transparent sealed plastic box that above-mentioned material forms all can reach more than 90% for the light transmission rate of different visible wavelengths.
Table 1
| Visible wavelength/nm | 440 | 460 | 500 | 560 | 600 |
| Light transmission rate/% | 92.4 | 96.5 | 97.1 | 98.3 | 98.6 |
In the specific implementation, in the above-mentioned motherboard that the embodiment of the present invention provides, base board unit is specifically as follows array base palte unit, or, can be also subtend base board unit, not limit at this.
In the specific implementation, when the above-mentioned motherboard that the embodiment of the present invention provides comprises multiple array base palte unit of the arrangement in matrix, alignment mark can be arranged with layer with the grid line in array base palte unit or data line, namely alignment mark can be formed by a patterning processes and grid line simultaneously, or alignment mark also can be formed by a patterning processes and data line, so simultaneously, the manufacture craft of array base palte unit can be simplified, reduce mask number of times.When the above-mentioned motherboard that the embodiment of the present invention provides comprises multiple subtend base board unit of the arrangement in matrix, alignment mark can be arranged with layer with the black matrix in subtend base board unit, namely alignment mark can be formed by a patterning processes and black matrix simultaneously, like this, the manufacture craft of subtend base board unit can be simplified, reduce mask number of times.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of to the motherboard after box, comprising: the first motherboard relatively put and the second motherboard; As shown in Figure 3 a, the first motherboard comprises the first underlay substrate 11 and is positioned at multiple array base palte unit 31 (Fig. 3 a is to illustrate the array base palte unit 31 that 2 row * 2 arrange) with the first alignment mark 21 of the arrangement in matrix on the first underlay substrate 11; As shown in Figure 3 b, the second motherboard comprises the second underlay substrate 12 and is positioned at multiple subtend base board units 32 (Fig. 3 b is to illustrate the subtend base board unit 32 that 2 row * 2 arrange) with the second alignment mark 22 of the arrangement in matrix on the second underlay substrate 12; In the specific implementation, the embodiment of the present invention provide above-mentioned to the motherboard after box before to box technique, sealed plastic box can be coated on the first motherboard, as shown in Figure 3 a, along the line of cut on the first underlay substrate 11 (shown in dotted line as shown in Figure 3 a, cut the first motherboard along line of cut and can obtain four array base palte unit 31) be coated with sealed plastic box 4, first alignment mark 21 is positioned at sealed plastic box 4 region, and the sealed plastic box 4 of at least the first alignment mark 21 place coating is transparent sealed plastic box; Or, the embodiment of the present invention provide above-mentioned to the motherboard after box before to box technique, also sealed plastic box can be coated on the second motherboard, as shown in Figure 3 b, along the line of cut on the second underlay substrate 12 (shown in dotted line as shown in Figure 3 b, cut the second motherboard along line of cut and can obtain four subtend base board units 32) be coated with sealed plastic box 4, second alignment mark 22 is positioned at sealed plastic box 4 region, and the sealed plastic box 4 of at least the second alignment mark 22 place coating is transparent sealed plastic box; Or, the embodiment of the present invention provide above-mentioned to the motherboard after box before to box technique, on the first motherboard and the second motherboard, all can also be coated with sealed plastic box, not limit at this.
In the specific implementation, the embodiment of the present invention provide above-mentioned to the motherboard after box before to box technique, when sealed plastic box being coated on the first motherboard, Fig. 3 a is described to be all coated with transparent sealed plastic box on the first motherboard, certainly, also only can be coated with transparent sealed plastic box at the first alignment mark 21 place, be coated with opaque sealed plastic box in the region except the first alignment mark 21, do not limit at this.In the specific implementation, the embodiment of the present invention provide above-mentioned to the motherboard after box before to box technique, when sealed plastic box being coated on the second motherboard, Fig. 3 b is described to be all coated with transparent sealed plastic box on the second motherboard, certainly, also only can be coated with transparent sealed plastic box at the second alignment mark 22 place, be coated with opaque sealed plastic box in the region except the second alignment mark 22, do not limit at this.
It should be noted that, the embodiment of the present invention provide above-mentioned to the motherboard after box before to box technique, no matter sealed plastic box being coated on is coated on the second motherboard on the first motherboard or by sealed plastic box, and the above-mentioned structure to the motherboard after box that the embodiment of the present invention provides is identical.Below with the embodiment of the present invention provide above-mentioned to the motherboard after box before to box technique, sealed plastic box is coated on the first motherboard as example is described.It is above-mentioned to the motherboard after box that the embodiment of the present invention provides, as shown in figures 4 a and 4b, sealed plastic box 4 is coated with along the line of cut on the first underlay substrate 11, first alignment mark 21 is positioned at sealed plastic box 4 region, because the sealed plastic box 4 of at least the first alignment mark 21 place coating is transparent sealed plastic box, namely transparent sealed plastic box (shown in dot-hatched as shown in fig. 4 a) can be all coated with at dispensing area, or, also transparent sealed plastic box (shown in dot-hatched as shown in Figure 4 b) only can be coated with at the first alignment mark 21 place, opaque sealed plastic box (shown in linear shadow as shown in Figure 4 b) is coated with at the dispensing area except the first alignment mark 21, like this, even if along the line of cut coating sealed plastic box 4 on the first underlay substrate 11, first alignment mark 21 is covered by sealed plastic box 4, also there will not be the problem of None-identified first alignment mark 21 and the second alignment mark 22 after to box technique, thus accurately can cut to the motherboard after box, and, colour mixture is there is at the display panels of cutting, transmitance is on the low side etc. bad time, can also be undertaken checking confirming by the first alignment mark 21 and the second alignment mark 22 above-mentioned bad whether because aligning accuracy difference causes.
In the specific implementation, the embodiment of the present invention provide above-mentioned in the motherboard after box, first alignment mark can be arranged with layer with the grid line in array base palte unit or data line, namely alignment mark can be formed by a patterning processes and grid line simultaneously, or alignment mark also can be formed by a patterning processes and data line, so simultaneously, the manufacture craft of array base palte unit can be simplified, reduce mask number of times; Black matrix in second alignment mark and subtend base board unit is arranged with layer, and namely alignment mark can be formed by a patterning processes and black matrix simultaneously, like this, can simplify the manufacture craft of subtend base board unit, reduces mask number of times.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of display panels, and this display panels obtains after the above-mentioned motherboard cutting to after box by the embodiment of the present invention being provided.The concrete enforcement of this display panels see the above-mentioned embodiment to the motherboard after box, can repeat part and repeats no more.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of method for making of motherboard, as shown in Figure 5, comprises the steps:
Multiple figures with the base board unit of alignment mark of S501, formation arrangement in matrix on underlay substrate;
S502, along on underlay substrate line of cut coating sealed plastic box; Wherein, alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least alignment mark place coating is transparent sealed plastic box.
The method for making of the above-mentioned motherboard that the embodiment of the present invention provides, because the sealed plastic box of at least alignment mark place coating is transparent sealed plastic box, namely the sealed plastic box of alignment mark place coating is transparent sealed plastic box, the sealed plastic box of the region coating except alignment mark is transparent or opaque sealed plastic box, like this, even if along the line of cut coating sealed plastic box on underlay substrate, make alignment mark be covered by sealed plastic box, also there will not be the problem of None-identified alignment mark.
In the specific implementation, step S501 in the said method that the embodiment of the present invention provides forms multiple base board units of the arrangement in matrix, specifically can form multiple array base palte unit of the arrangement in matrix, or, also can form multiple subtend base board units of the arrangement in matrix, not limit at this.
In the specific implementation, when step S501 in the said method that the embodiment of the present invention provides forms multiple array base palte unit of the arrangement in matrix, step S501 in the said method that the embodiment of the present invention provides forms the figure of alignment mark on underlay substrate, specifically can adopt a patterning processes, the figure of alignment mark is formed while grid line in the figure forming each array base palte unit or data line figure, like this, the manufacture craft of array base palte unit can be simplified, reduce mask number of times.When step S501 in the said method that the embodiment of the present invention provides forms multiple subtend base board unit of the arrangement in matrix, step S501 in the said method that the embodiment of the present invention provides forms the figure of alignment mark on underlay substrate, specifically can adopt a patterning processes, the figure of alignment mark is formed while black Matrix Pattern in the figure forming each subtend base board unit, like this, the manufacture craft of subtend base board unit can be simplified, reduce mask number of times.
Based on same inventive concept, the embodiment of the present invention additionally provides a kind of method for making to the motherboard after box, as shown in Figure 6, comprises the steps:
Multiple figures with the array base palte unit of the first alignment mark of S601, formation arrangement in matrix on the first underlay substrate, on the second underlay substrate, corresponding formation is multiple figures with the subtend base board unit of the second alignment mark of matrix arrangement;
S602, along on the first underlay substrate line of cut coating sealed plastic box; Wherein, the first alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least the first alignment mark place coating is transparent sealed plastic box; And/or, along the line of cut coating sealed plastic box on the second underlay substrate; Wherein, the second alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least the second alignment mark place coating is transparent sealed plastic box;
S603, the first underlay substrate and the second underlay substrate to be carried out box process.
The above-mentioned method for making to the motherboard after box that the embodiment of the present invention provides, when first underlay substrate is coated with sealed plastic box, because the sealed plastic box of at least the first alignment mark place coating is transparent sealed plastic box, namely the sealed plastic box of the first alignment mark place coating is transparent sealed plastic box, the sealed plastic box of the region coating except the first alignment mark is transparent or opaque sealed plastic box, like this, even if along the line of cut coating sealed plastic box on the first underlay substrate, first alignment mark is covered by sealed plastic box, also there will not be the problem of None-identified first alignment mark and the second alignment mark after to box technique, when second underlay substrate is coated with sealed plastic box, because the sealed plastic box of at least the second alignment mark place coating is transparent sealed plastic box, namely the sealed plastic box of the second alignment mark place coating is transparent sealed plastic box, the sealed plastic box of the region coating except the second alignment mark is transparent or opaque sealed plastic box, like this, even if along the line of cut coating sealed plastic box on the second underlay substrate, second alignment mark is covered by sealed plastic box, also there will not be the problem of None-identified first alignment mark and the second alignment mark after to box technique, thus accurately can cut to the motherboard after box, and, the display panels cut occur colour mixture, transmitance on the low side etc. bad time, can also be undertaken checking confirming by the first alignment mark and the second alignment mark above-mentioned bad whether because aligning accuracy difference causes.
In the specific implementation, in the said method that the embodiment of the present invention provides, can, after the step S603 in the said method that provides of the embodiment of the present invention being provided the first underlay substrate and the second underlay substrate are carried out box process, by the mode of immersion, liquid crystal molecule be added in the motherboard after to box; Or, also can when performing the step S602 in the said method that provides of the embodiment of the present invention along line of cut coating sealed plastic box on the first underlay substrate, dispenser method molecule on the second underlay substrate; Or, can also when performing the step S602 in the said method that provides of the embodiment of the present invention along line of cut coating sealed plastic box on the second underlay substrate, on the first underlay substrate, dispenser method molecule, does not limit at this.
In the specific implementation, step S601 in the said method that the embodiment of the present invention provides forms the figure of the first alignment mark on the first underlay substrate, specifically can adopt a patterning processes, the figure of the first alignment mark is formed while grid line in the figure forming each array base palte unit or data line figure, like this, the manufacture craft of array base palte unit can be simplified, reduce mask number of times; Step S601 in the said method that the embodiment of the present invention provides forms the figure of the second alignment mark on the second underlay substrate, specifically can adopt a patterning processes, the figure of the second alignment mark is formed while black Matrix Pattern in the figure forming each subtend base board unit, like this, the manufacture craft of subtend base board unit can be simplified, reduce mask number of times.
It should be noted that, in the specific implementation, the similar of the corresponding component in the structure of the miscellaneous part in array base palte unit and existing array base palte, the manufacturing process of the corresponding component in the manufacturing process of the miscellaneous part in array base palte unit and existing array base palte is similar; The similar of the corresponding component in the structure of the miscellaneous part in subtend base board unit and existing subtend substrate, the manufacturing process of the corresponding component in the manufacturing process of the miscellaneous part in subtend base board unit and existing subtend substrate is similar, does not repeat at this.
A kind of motherboard that the embodiment of the present invention provides, to the motherboard after box, respective production method and display panels, this motherboard comprises: underlay substrate and be positioned at multiple base board units with alignment mark of the arrangement in matrix on underlay substrate, be coated with sealed plastic box along the line of cut on underlay substrate, alignment mark is positioned at sealed plastic box region, because the sealed plastic box of at least alignment mark place coating is transparent sealed plastic box, namely the sealed plastic box of alignment mark place coating is transparent sealed plastic box, the sealed plastic box of the region coating except alignment mark is transparent or opaque sealed plastic box, like this, even if along the line of cut coating sealed plastic box on underlay substrate, alignment mark is covered by sealed plastic box, also there will not be the problem of None-identified alignment mark, thus accurately can cut to the motherboard after box, and, colour mixture is there is at the display panels of cutting, transmitance is on the low side etc. bad time, can also be undertaken checking confirming by the first alignment mark and the second alignment mark above-mentioned bad whether because aligning accuracy difference causes.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (13)
1. a motherboard, comprising: underlay substrate and be positioned on described underlay substrate in matrix arrangement multiple base board units with alignment mark; Be coated with sealed plastic box along the line of cut on described underlay substrate, described alignment mark is positioned at sealed plastic box region; It is characterized in that:
The sealed plastic box of at least described alignment mark place coating is transparent sealed plastic box.
2. motherboard as claimed in claim 1, it is characterized in that, the material of described transparent sealed plastic box comprises: acrylic acid epoxy resin, N-vinylpyrrolidone, light trigger and photoiniator.
3. motherboard as claimed in claim 1 or 2, is characterized in that, described motherboard comprises multiple array base palte unit of the arrangement in matrix, and the grid line in described alignment mark and described array base palte unit or data line are arranged with layer; Or,
Described motherboard to comprise in matrix multiple subtend base board units of arrangement, and the black matrix in described alignment mark and described subtend base board unit is arranged with layer.
4. to the motherboard after box, comprising: the first motherboard relatively put and the second motherboard; Described first motherboard comprises the first underlay substrate and is positioned at multiple array base palte unit with the first alignment mark of the arrangement in matrix on described first underlay substrate; Described second motherboard comprises the second underlay substrate and is positioned at multiple subtend base board units with the second alignment mark of the arrangement in matrix on described second underlay substrate; It is characterized in that:
Be coated with sealed plastic box along the line of cut on described first underlay substrate, described first alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least described first alignment mark place coating is transparent sealed plastic box; And/or,
Be coated with sealed plastic box along the line of cut on described second underlay substrate, described second alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least described second alignment mark place coating is transparent sealed plastic box.
5. as claimed in claim 4 to the motherboard after box, it is characterized in that, the material of described transparent sealed plastic box comprises: acrylic acid epoxy resin, N-vinylpyrrolidone, light trigger and photoiniator.
6. as described in claim 4 or 5 to the motherboard after box, it is characterized in that, the grid line in described first alignment mark and described array base palte unit or data line are arranged with layer;
Black matrix in described second alignment mark and described subtend base board unit is arranged with layer.
7. a display panels, is characterized in that, described display panels is by obtaining after the motherboard cutting after box as described in any one of claim 4-6.
8. a method for making for motherboard, is characterized in that, comprising:
Underlay substrate is formed multiple figures with the base board unit of alignment mark of the arrangement in matrix;
Along the line of cut coating sealed plastic box on described underlay substrate; Wherein, described alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least described alignment mark place coating is transparent sealed plastic box.
9. method as claimed in claim 8, it is characterized in that, the material of described transparent sealed plastic box comprises: acrylic acid epoxy resin, N-vinylpyrrolidone, light trigger and photoiniator.
10. method as claimed in claim 8 or 9, is characterized in that, described motherboard comprises multiple array base palte unit of the arrangement in matrix, and the described figure forming alignment mark on underlay substrate, specifically comprises:
Adopt a patterning processes, while the grid line in the figure forming each described array base palte unit or data line figure, form the figure of described alignment mark; Or,
Described motherboard comprises multiple subtend base board units of the arrangement in matrix, and the described figure forming alignment mark on underlay substrate, specifically comprises:
Adopt a patterning processes, while the black Matrix Pattern in the figure forming each described subtend base board unit, form the figure of described alignment mark.
11. 1 kinds to the method for making of the motherboard after box, is characterized in that, comprising:
First underlay substrate forms multiple figures with the array base palte unit of the first alignment mark of the arrangement in matrix, the corresponding multiple figures with the subtend base board unit of the second alignment mark forming the arrangement in matrix on the second underlay substrate;
Along the line of cut coating sealed plastic box on described first underlay substrate; Wherein, described first alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least described first alignment mark place coating is transparent sealed plastic box; And/or, along the line of cut coating sealed plastic box on described second underlay substrate; Wherein, described second alignment mark is positioned at sealed plastic box region, and the sealed plastic box of at least described second alignment mark place coating is transparent sealed plastic box;
Described first underlay substrate and described second underlay substrate are carried out box process.
12. methods as claimed in claim 11, it is characterized in that, the material of described transparent sealed plastic box comprises: acrylic acid epoxy resin, N-vinylpyrrolidone, light trigger and photoiniator.
13. methods as described in claim 11 or 12, it is characterized in that, the described figure forming the first alignment mark on the first underlay substrate, specifically comprises:
Adopt a patterning processes, while the grid line in the figure forming each described array base palte unit or data line figure, form the figure of described first alignment mark;
The described figure forming the second alignment mark on the second underlay substrate, specifically comprises:
Adopt a patterning processes, while the black Matrix Pattern in the figure forming each described subtend base board unit, form the figure of described second alignment mark.
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