CN103874321B - Circuit board and its manufacture method - Google Patents
Circuit board and its manufacture method Download PDFInfo
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- CN103874321B CN103874321B CN201410068186.4A CN201410068186A CN103874321B CN 103874321 B CN103874321 B CN 103874321B CN 201410068186 A CN201410068186 A CN 201410068186A CN 103874321 B CN103874321 B CN 103874321B
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Abstract
The present invention provides a kind of circuit board, the circuit board includes substrate, the first surface of the substrate is provided with the first pattern, the second surface of the substrate is provided with the second pattern, wherein, the first mark is provided with the first surface of the substrate, the second mark is provided with the second surface of the substrate, first mark and the described second mark are aligned with each other along the thickness direction of the substrate, so that thickness direction of first pattern on the basis of being able to first mark with second pattern on the basis of the described second mark along the substrate is aligned with each other.The present invention also provides the manufacture method of the circuit board.Because the first mark and the second mark are aligned with each other along the thickness direction of substrate, the thickness direction of the first pattern for being formed and the second pattern for being formed on the basis of the second mark along substrate is also aligned with each other on the basis of the first mark.
Description
Technical field
The present invention relates to the manufacture field of electronic product, in particular it relates to which a kind of two sides all forms figuratum circuit board
And the manufacture method of the circuit board.
Background technology
In the manufacturing process of current electronic product, the reverse side of two-sided making technology, i.e. substrate can be more and more run into
There are pattern, such as touch-screen, 3D gratings field.But according to existing manufacturing technology, either front or back, is making
During the first layer pattern, a process that exposure machine and substrate are aligned in advance is had, and what follow-up process made according to first layer
Alignment mark is aligned, but precision is mostly high（At ± 30 μm or so）, this is resulted in for two-sided first layer pair
There is certain error between the mark of position.Positive and negative pattern shifts, and touching product for high accuracy will result in touch precision
Not high, maloperation, the bad phenomenons such as light leak, image quality decline are will result in for liquid crystal display panel.Existing two-sided system
In journey technology, for the not high product of required precision, often using the processing mode without the unified contraposition of double-side pattern.So
Although processing procedure it is simple, precision is too low, and the display of positive and negative surface rear end can be affected.It is higher for some required precisions
Product, can first be made a face figure, then carry out contraposition identification to realize aligning for position by the figure of reverse side and obtained face.This
Although kind of a mode can realize the unified contraposition of positive and negative, the identification difficulty of exposure machine is very big, and the yield rate of product is very low.
Therefore, the accurate technical problem urgently to be resolved hurrily as this area of pattern contraposition of the tow sides of substrate how is made.
The content of the invention
It is an object of the invention to provide a kind of circuit board and its manufacture method, the circuit manufactured using the manufacture method
Pattern contraposition on the first surface and second surface of plate is accurate.
To achieve these goals, as one aspect of the present invention there is provided a kind of circuit board, the circuit board includes base
Plate, the first surface of the substrate is provided with the first pattern, and the second surface of the substrate is provided with the second pattern, wherein, it is described
It is provided with the first surface of substrate on the first mark, the second surface of the substrate and is provided with the second mark, first mark
Note and the described second mark are aligned with each other along the thickness direction of the substrate, so that described on the basis of being able to first mark
Thickness direction of first pattern with second pattern on the basis of the described second mark along the substrate is aligned with each other.
Preferably, the substrate is made of clear material, and first mark and the described second mark are by negativity black
Photosensitive material is made.
Preferably, the thickness of first mark is between 0.3 μm to 0.5 μm.
Preferably, forming the material of first mark includes thermal initiator.
Preferably, first mark can stop passing through for light, and first mark is by negativity black photosensitive material
It is made, second mark is made up of positivity black photosensitive material.
Preferably, the thickness of first mark is between 1.2 μm to 2.0 μm.
As another aspect of the present invention there is provided a kind of manufacture method of circuit board, the circuit board includes substrate, the base
The first surface of plate is formed with the first pattern, and the second surface of the substrate is formed with the second pattern, wherein, the manufacture method
Including：
Form first to mark, first mark is on the first surface of the substrate；
Form second to mark, second mark is located on the second surface of the substrate, and second mark and institute
State thickness direction of first mark along the substrate aligned with each other；
Being formed on the basis of the described first mark on the first surface of the substrate includes the first of first pattern
Patterned layer；With
Being formed on the basis of the described second mark on the second surface of the substrate includes the second of second pattern
Patterned layer.
Preferably, first mark is formed by the first black photosensitive material layer of the first surface for being arranged on substrate, institute
State the second mark to be formed by the second black photosensitive material layer for being arranged on the second surface of substrate, the step for forming the first mark
Suddenly the step of being marked with the formation second is carried out simultaneously,
Light can reach the second black photosensitive material through the first black photosensitive material layer and the substrate
Layer, the first black photosensitive material layer and the second black photosensitive material layer are made by negativity black photosensitive material, institute
The step of stating the step of forming the first mark and the mark of the formation second includes：
Mask plate is set above the first black photosensitive material layer, with to the first black photosensitive material layer and
Two black photosensitive material layers are exposed, and the hole corresponding to the described first mark are provided with the mask plate so that light can
To reach the first black photosensitive material layer and the second black photosensitive material layer through the hole；With
The first black photosensitive material layer and the second black photosensitive material layer are developed, to form described
One mark and the described second mark.
Preferably, the thickness of the first black photosensitive material layer is between 0.3 μm to 0.5 μm.
Preferably, forming the material of the first black photosensitive material layer includes thermal initiator, black forming described first
After color sensation optical material layer and before the second black photosensitive material layer is formed, to the first black photosensitive material layer
Preheated, so that the first black photosensitive material layer precuring.
Preferably, first mark is formed by the first black photosensitive material layer of the first surface for being arranged on substrate, institute
State the second mark to be formed by the second black photosensitive material layer for being arranged on the second surface of substrate, the step for forming the first mark
Rapid to be carried out before the step of formation second is marked, the first black photosensitive material layer is by negativity black photosensitive material system
Into, the second black photosensitive material layer is made up of positivity black photosensitive material, wherein,
The step of formation first is marked includes：
After the first black photosensitive material layer is formed and before the second black photosensitive material layer is formed, to described the
One black photosensitive material layer, which is exposed, is developed to first mark, and first mark can stop that light passes through；
With
The step of formation second is marked includes：
The first surface of the substrate is irradiated from bottom, so that light, which is passed through, is not provided with first mark on the substrate
Position reach the second black photosensitive material layer, to be exposed to the second black photosensitive material layer；
The second black photosensitive material layer after exposure is developed, to form second mark.
Preferably, the thickness of the first black photosensitive material layer is between 1.2 μm to 2.0 μm.
Preferably, before being exposed to the second black photosensitive material layer, the substrate is overturn, makes the base
The first surface of plate is down.
When manufacturing circuit board provided by the present invention, the first mark and the second mark are manufactured first.Due to the first mark
With the second label size is smaller, do not have other to be an impediment to the first mark and the second mark shape in simple shape, and the surface of substrate
Into pattern, therefore, easily cause first mark and second mark along substrate thickness direction align.Due to the first mark and the
Two marks are aligned with each other along the thickness direction of substrate, the first pattern for being formed and are labeled as on the basis of the first mark with second
Thickness direction of second pattern of benchmark formation along substrate is also aligned with each other.
Brief description of the drawings
Accompanying drawing is, for providing a further understanding of the present invention, and to constitute a part for specification, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1（a）To Fig. 1（d）It is the first embodiment of displaying according to the manufacture method of circuit board provided by the present invention
Schematic flow sheet；
Fig. 2（a）To Fig. 2（d）It is second embodiment party of the displaying according to the manufacture method of circuit board provided by the present invention
The schematic flow sheet of formula.
Description of reference numerals
10：Substrate 20：First black photosensitive material layer
21：First mark 30：Second black photosensitive material layer
31：Second mark 40：Mask plate
41：Hole
Embodiment
The embodiment of the present invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
In the present invention, described " upper and lower " direction refers to Fig. 1（a）To Fig. 1（d）And Fig. 2（a）To Fig. 2（d）In
" upper and lower " direction.
It is used as one aspect of the present invention, such as Fig. 1（d）And Fig. 2（d）It is shown there is provided a kind of circuit board, the circuit board includes
Substrate 10, the first surface of the substrate 10 is provided with the first pattern（It is not shown）, the second surface of substrate 10 is provided with the second figure
Case（It is not shown）, wherein, the first surface of substrate 10 is provided with the first mark 21, and the second surface of substrate 10 is provided with the second mark
Note 31, the thickness direction of the first mark 21 and the second mark 31 along substrate 10 is aligned with each other, so as to be able to the first mark 21 for base
First pattern of standard and thickness direction of second pattern along substrate 10 on the basis of the second mark 31 are aligned with each other.
When manufacturing circuit board provided by the present invention, the first mark 21 and the second mark 31 are manufactured first.Due to first
Mark 21 and second mark, 31 sizes are smaller, do not have other to be an impediment to the first mark 21 in simple shape, and the surface of substrate 10
With the pattern of the second mark 31 formation, therefore, easily cause the thickness direction of the first mark 21 and the second mark 31 along substrate 10
Alignment.
Thickness direction due to the first mark 21 and the second mark 31 along substrate 10 is aligned with each other, is base with the first mark 21
Thickness direction of the first pattern and the second pattern for being formed on the basis of the second mark 31 that standard is formed along substrate 10 is also mutual
Alignment.
Circuit board provided by the present invention may be used as the touch display screen of display device, first pattern and described
Two pattern aligning accuracies are higher, so as to be accurately determined the position of touch point when carrying out touch operation, reduce maloperation,
Improve performance accuracy.
Circuit board provided by the present invention is also used as the array base palte or color membrane substrates of liquid crystal display panel, due to
One pattern and the second pattern aligning accuracy are higher, so as to reduce the light leakage phenomena of liquid crystal display panel, improve liquid crystal display
The display quality of panel.
In the present invention, the quantity of the first mark 21 and the quantity of the second mark 31 are equal, still, to the He of the first mark 21
The particular number of second mark 31 is not particularly limited, for example, in two kinds of embodiments provided by the present invention, substrate
The both sides of 10 first surface are provided with the first mark 21, and the both sides of the second surface of substrate 10 are provided with the second mark
31.The quantity of first mark 21 and the second mark 31 is more, and the contraposition to first pattern and the second pattern is more accurate.
In the present invention, the shape to the first mark 21 and the second mark 31 is not also limited, as long as in second substrate
It can be recognized in follow-up patterning processes.For example, the first mark 21 can be circular or square, the second mark 31 can also be
It is circular or square.
When the board application in above-mentioned two situations and it is similar with above-mentioned two situations in the case of when, substrate 10
To be transparent, for example, substrate 10 can be by transparent material（For example, transparent glass）It is made.
In the present invention, the first mark 21 and the second mark 31 can be formed in several ways, for example, can pass through structure
Figure technique formation the first mark 21 and the second mark 31, can also pass through the technique such as printing, spraying the first mark 21 of formation and the
Two marks 31, are specifically discussed below, repeat no more here.
It is excellent for the ease of forming the first mark and the second mark on the substrate 10 when substrate 10 is made of clear material
First mark 21, can be set to relatively thin by selection of land, reach second so that light can pass through the first mark 21 and substrate 10 and mark
Remember 31, and the first mark 21 and the second mark 31 are made by negativity black photosensitive material.
Generally, black photosensitive material includes propylene glycol methyl ether acetate（Percentage by weight is 20-50%）, diethylene glycol first
Ether（Percentage by weight is 10-30%）, ethoxyl ethyl propionate（Percentage by weight is 10-30%）, light initiator（That is, light draws
Send out agent）（Percentage by weight is 0-15%）, black pigment（Percentage by weight is 3-15%）, acrylic monomer（Percentage by weight is
1-10%）And acryl resin（Percentage by weight is 1-15%）.
Black photosensitive material is divided into two kinds of negativity black photosensitive material and positivity black photosensitive material.Negativity black photosensitive material
The pattern and the pattern of mask plate formed after material is exposed is on the contrary, the pattern formed after positivity black photosensitive material is exposed is with covering
The pattern of diaphragm plate is identical.Negativity black photosensitive material generally comprise alkali solubility methacrylic resin, methacrylic monomers,
Black pigment, light trigger, solvent etc.；Positivity black color photosensitive resin generally comprises phenolic resin, photosensitive resin（Diazo naphthoquinone
System）, solvent, black pigment.
When with patterning processes the first mark 21 of formation and the second mark 31, such as Fig. 1（a）And Fig. 1（b）It is shown, exist first
The first black photosensitive material layer 20 for forming the first mark 21 is formed on the first surface of substrate 10, then again in substrate 10
Second surface on formed for formed the second mark 31 the second black photosensitive material layer 30.First black photosensitive material layer 20
Thickness be the first mark 21 thickness, therefore, light can be reached through the first black photosensitive material layer 20 and substrate 10
Second black photosensitive material layer 30.
When setting mask plate 40 in the top of the first black photosensitive material layer 20, light is passed through through the hole 41 on mask plate 40
First black photosensitive material layer 20 and substrate 10 can reach the second black photosensitive material layer 30, so that in a step patterning processes
First black photosensitive material layer 20 and the second black photosensitive material layer 30 are exposed simultaneously.Due to the first black photosensitive material
The black photosensitive material layer 30 of layer 20 and second is negativity black photosensitive material, and therefore, light is through hole 41 in the first black sense
Optical material layer 20 is identical with the graph position formed in the second black photosensitive material layer 30, and the first mark 21 is formed after development
It is identical with the shape of the second mark 31 and be aligned with each other.A step composition work is not only reduced when manufacturing circuit board using the above method
Skill, and also improve the accuracy of the first mark 21 and the contraposition of the second mark 31.In the present embodiment, the first black photosensitive
Material layer 20 can be made up of the negativity black photosensitive material of brown, the second black photosensitive material layer 30 can by black negativity
Black photosensitive material is made.
Formed after the first black photosensitive material layer 20, it is necessary to substrate 10 is overturn, made on the first surface of substrate 10
Down, the second surface of substrate 10 upward, is then formed first black photosensitive material layer 20 on the second surface of substrate 10 again
Second black photosensitive material layer 30.In order to prevent the first black photosensitive material while the second black photosensitive material layer 30 is formed
Layer 20 is peeled off, it is preferable that can be carried out precuring to the first black photosensitive material layer 20, be had the first black photosensitive material layer 20
There is certain hardness.For example, forming second comprising light trigger and thermal initiator simultaneously in the material of the first mark 21 of formation
Before black photosensitive material layer 30, the first black photosensitive material layer 20 is preheated, thermal initiator is had an effect, so that
Obtain the precuring of the first black photosensitive material layer 20.
When utilizing Fig. 2（a）To Fig. 2（d）Shown in manufacture method manufacture the circuit board when, the thickness of the first mark 21
It is larger, and can stop that light passes through first mark 21, in the present embodiment, the first mark 21 is by negativity black photosensitive
Material is made, and the second mark 31 is made up of positivity black photosensitive material.
Specifically, such as Fig. 2（b）Shown in, the first mark 21, Ran Houzai can be first formed on the first surface of substrate 10
The second black photosensitive material layer 30 is formed on the second surface of substrate 10, then can be black by the use of the first mark 21 as second
The mask layer of color sensation optical material layer 30, irradiates substrate 10 in the side of the first mark 21, the second black photosensitive material layer 30 is entered
Row exposure.Because the second black photosensitive material layer 30 is made up of positivity black photosensitive material, so as to be formed at the first mark
21 shapes, the second corresponding mark 31 of size and position.
Utilize Fig. 2（a）To Fig. 2（d）Shown in method manufacture the circuit board and can equally reduce the step of patterning processes
Rapid quantity, improves the aligning accuracy of the first mark 21 and the second mark 31.
As one embodiment of the present invention, the thickness of the first mark 21 between 1.2 μm to 2.0 μm, so as to
Realize the purpose for stopping light.
It is used as another aspect of the present invention, such as Fig. 1（a）To Fig. 1（d）And Fig. 2（a）To Fig. 2（d）It is shown that there is provided one kind
The manufacture method of circuit board, the circuit board includes substrate 10, and the first surface of the substrate 10 is formed with the first pattern, substrate 10
Second surface is formed with the second pattern, wherein, the manufacture method includes：
The first mark 21 is formed, first mark 21 is located on the first surface of substrate 10（Such as Fig. 1（d）And Fig. 2（b）Institute
Show）；
The second mark 31 is formed, second mark 31 is located on the second surface of substrate 10, and the second mark 31 and the
Thickness direction of one mark 21 along substrate 10 is aligned with each other；
Being formed on the basis of the first mark 21 on the first surface of substrate 10 includes the first pattern of first pattern
Layer（It is not shown）；With
Being formed on the basis of the second mark 31 on the second surface of substrate 10 includes the second pattern of second pattern
Layer（It is not shown）.
As mentioned above it is possible, when manufacturing circuit board provided by the present invention, the first mark 21 and the second mark are manufactured first
Note 31.Due to the first mark 21 and the size of the second mark 31 is smaller, do not have other to hinder in simple shape, and the surface of substrate 10
In the first mark 21 and the pattern of the second mark 31 formation, therefore, easily cause the first mark 21 and the second mark 31 along substrate
10 thickness direction alignment.
Thickness direction due to the first mark 21 and the second mark 31 along substrate 10 is aligned with each other, is base with the first mark 21
Thickness direction of the first pattern and the second pattern for being formed on the basis of the second mark 31 that standard is formed along substrate 10 is also mutual
Alignment.
In the present invention, do not have particular determination to forming the first mark 21 and forming the order of the second mark 31.Below
With reference to Fig. 1（a）To Fig. 1（d）And Fig. 2（a）To Fig. 2（d）Introduce two kinds of embodiments of manufacture method provided by the present invention.
In circuit board provided by the present invention, the first mark 21 is by being arranged on the first black of the first surface of substrate 10
Photosensitive material layer 20 is formed, and the second mark 31 is by being arranged on the shape of the second black photosensitive material layer 30 of the second surface of substrate 10
Into such as Fig. 1（a）To Fig. 1（d）Shown, the step of the step of forming the first mark 21 is with forming the second mark 31 is carried out simultaneously, institute
The advance for the step of stating the step of manufacture method is additionally included in the first mark 21 of the formation and the second mark of the formation 31
Capable：
It is provided for being formed the first black photosensitive material layer 20 of the first mark 21 in the first surface of substrate 10（Such as Fig. 1
（a）It is shown）；With
It is provided for being formed the second black photosensitive material layer 30 of the second mark 31 in the second surface of substrate 10（Such as Fig. 1
（b）It is shown）.
Further, light can reach the second black photosensitive material through the first black photosensitive material layer 20 and substrate 10
Layer 30（Fig. 1（c）Shown in the direction of arrow be light direction of illumination）, the first black photosensitive material layer 20 and the second black sense
Optical material layer 30 is made by negativity black photosensitive material, and the manufacture method can also include：
Mask plate 40 is set in the top of the first black photosensitive material layer 20, with to the first black photosensitive material layer 20 and second
Black photosensitive material layer 30 is exposed, and the hole 41 corresponding to the first mark 21 is provided with mask plate 40 so that light can be with
The first black photosensitive material layer 20 and the second black photosensitive material layer 30 are reached through hole 41（Such as Fig. 1（c）It is shown）；With
First black photosensitive material layer 20 and the second black photosensitive material layer 30 are developed, to form the first mark 21
With the second mark 31（Such as Fig. 1（d）It is shown）.In the present invention, can be by the method for immersion to the first black photosensitive material layer
20 and second black photosensitive material layer 30 developed.Development is formed after the first mark 21 and the second mark 31, can be to shape
Into thering is the first mark 21 and the substrate of the second mark 31 to be dried, so that the first mark 21 and the second mark 31 are more firm.
Utilize Fig. 1（a）To Fig. 1（d）Shown in manufacture method manufacture the circuit board and can reduce the use of mask plate,
Production efficiency is improved, production cost is reduced, and utilize the same black of 41 pair of first black photosensitive material layer in hole 20 and second
Photosensitive material layer 30, which is patterned, can improve the aligning accuracy of the first mark 21 and the second mark 31.
As mentioned above it is possible, black photosensitive material includes propylene glycol methyl ether acetate（Percentage by weight is 20-50%）, two
Ethylene glycol methyl ether（Percentage by weight is 10-30%）, ethoxyl ethyl propionate（Percentage by weight is 10-30%）, light initiator
（That is, light trigger）（Percentage by weight is 0-15%）, black pigment（Percentage by weight is 3-15%）, acrylic monomer（Weight
Percentage is 1-10%）And acryl resin（Percentage by weight is 1-15%）.
In order to ensure light can pass through the first black photosensitive material layer 20, it is preferable that the first black photosensitive material layer 20
Thickness can be between 0.3 μm to 0.5 μm.
As mentioned above it is possible, in order to prevent from being formed on the second surface of substrate 10 during the second black photosensitive material layer 30,
First black photosensitive material layer 20 is peeled off from the first surface of substrate 10, it is preferable that form the first black photosensitive material layer 20
Material can include thermal initiator, the manufacture method is additionally may included in be formed after the first black photosensitive material layer 20 simultaneously
And before the second black photosensitive material layer 30 is formed, the first black photosensitive material layer 20 is preheated, so that the first black
The precuring of photosensitive material layer 20.
Of course, it is possible to the first mark 21 and the second mark 31 be formed respectively, for example, the of manufacturing method according to the invention
Two kinds of embodiments, such as Fig. 2（b）To Fig. 2（d）Shown, the step of forming the first mark 21 is the step of the second mark 31 are formed
Carry out before, and the first black photosensitive material layer 20 is made up of negativity black photosensitive material, the second black photosensitive material layer 30 by
Positivity black photosensitive material is made, wherein,
Such as Fig. 2（b）Shown, the step of forming the first mark 21 can include：
After the first black photosensitive material layer 20 is formed and between the second black photosensitive material layer 30 is formed, to the
One black photosensitive material layer 20, which is exposed, is developed to the first mark 21, and the first mark 21 can stop light；With
Such as Fig. 2（c）Shown, the step of forming the second mark 31 can include：
The first surface of substrate 10 is irradiated from bottom, so that light passes through the position that the first mark 21 is not provided with substrate 10
The second black photosensitive material layer 30 is reached, to be exposed to the second black photosensitive material layer 30；
The second black photosensitive material layer 30 after exposure is developed, to form the second mark 31.
In the present embodiment, the first black photosensitive material layer 20 and the second black photosensitive material layer 30 can be black.
In above-mentioned second of embodiment, by the use of the first mark 21 as mask plate during the second black photosensitive material layer 30 of etching,
The part blocked in second black photosensitive material layer 30 by the first mark 21 will not be exposed.Both may be used using second of embodiment
To reduce by a step pattern step, and the aligning accuracy of the first mark 21 and the second mark 31 can be improved.
Above also describe the difference between positivity black photosensitive material and negativity black photosensitive material in detail, here not
Repeat again.
In order to ensure light does not pass through the first mark 21, the thickness of the first black photosensitive material layer 20 is at 1.2 μm to 2.0
Between μm.
The method that can be exposed using bottom is exposed to the second black photosensitive material layer 30, i.e. such as Fig. 2（c）It is shown,
Include overturning substrate 10 before the second black photosensitive material layer 30 is exposed, make the first surface of substrate 10 down.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, but the invention is not limited in this.For those skilled in the art, the essence of the present invention is not being departed from
In the case of refreshing and essence, various changes and modifications can be made therein, and these variations and modifications are also considered as protection scope of the present invention.
Claims (7)
1. a kind of circuit board, the circuit board includes substrate, and the first surface of the substrate is provided with the first pattern, the of the substrate
Two surfaces are provided with the second pattern, it is characterised in that the first mark is provided with the first surface of the substrate, the substrate
The second mark is provided with second surface, first mark and the described second mark are mutually relative along the thickness direction of the substrate
Together, so that first pattern on the basis of being able to first mark and second figure on the basis of the described second mark
Thickness direction of the case along the substrate is aligned with each other, and light can be through the described first mark.
2. circuit board according to claim 1, it is characterised in that the substrate is made of clear material, first mark
Note and the described second mark are made by negativity black photosensitive material.
3. circuit board according to claim 2, it is characterised in that the thickness of first mark 0.3 μm to 0.5 μm it
Between.
4. circuit board as claimed in any of claims 1 to 3, it is characterised in that form the material of first mark
Material includes thermal initiator.
5. a kind of manufacture method of circuit board, the circuit board includes substrate, the first surface of the substrate is formed with the first pattern, institute
The second surface for stating substrate is formed with the second pattern, it is characterised in that the manufacture method includes：
Form first to mark, first mark is on the first surface of the substrate；
Form second to mark, second mark is located on the second surface of the substrate, and second mark and described the
One mark is aligned with each other along the thickness direction of the substrate；
Being formed on the basis of the described first mark on the first surface of the substrate includes the first pattern of first pattern
Layer；With
Being formed on the basis of the described second mark on the second surface of the substrate includes the second pattern of second pattern
Layer；
It is described first mark formed by the first black photosensitive material layer of the first surface for being arranged on substrate, it is described second mark by
The the second black photosensitive material layer for being arranged on the second surface of substrate is formed, and the step of formation first is marked is formed with described
The step of second mark, is carried out simultaneously,
Light can reach the second black photosensitive material layer, institute through the first black photosensitive material layer and the substrate
State the first black photosensitive material layer and the second black photosensitive material layer is made by negativity black photosensitive material, it is described to be formed
The step of the step of first mark and the mark of the formation second, includes：
Mask plate is set above the first black photosensitive material layer, with black to the first black photosensitive material layer and second
Color sensation optical material layer is exposed, and the hole corresponding to the described first mark is provided with the mask plate so that light can be saturating
Cross the hole and reach the first black photosensitive material layer and the second black photosensitive material layer；With
The first black photosensitive material layer and the second black photosensitive material layer are developed, to form first mark
Note and the described second mark.
6. manufacture method according to claim 5, it is characterised in that the thickness of the first black photosensitive material layer exists
Between 0.3 μm to 0.5 μm.
7. the manufacture method according to claim 5 or 6, it is characterised in that form the first black photosensitive material layer
Material includes thermal initiator, after the first black photosensitive material layer is formed and in formation the second black photosensitive material
Before the bed of material, the first black photosensitive material layer is preheated, so that the first black photosensitive material layer precuring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410068186.4A CN103874321B (en) | 2014-02-27 | 2014-02-27 | Circuit board and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410068186.4A CN103874321B (en) | 2014-02-27 | 2014-02-27 | Circuit board and its manufacture method |
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| Publication Number | Publication Date |
|---|---|
| CN103874321A CN103874321A (en) | 2014-06-18 |
| CN103874321B true CN103874321B (en) | 2017-11-07 |
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| CN201410068186.4A Expired - Fee Related CN103874321B (en) | 2014-02-27 | 2014-02-27 | Circuit board and its manufacture method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105764234B (en) * | 2014-12-19 | 2019-01-25 | 鹏鼎控股(深圳)股份有限公司 | Board structure of circuit and preparation method thereof |
| TWI664885B (en) * | 2018-09-14 | 2019-07-01 | 友達光電股份有限公司 | Fabricating method of double-sided circuit board and double-sided circuit board |
| CN110568734B (en) * | 2019-08-26 | 2021-10-26 | 武汉华星光电技术有限公司 | Display panel exposure alignment method and display panel |
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