CN101844864A - Glass substrate and cutting method thereof - Google Patents

Glass substrate and cutting method thereof Download PDF

Info

Publication number
CN101844864A
CN101844864A CN200910080148A CN200910080148A CN101844864A CN 101844864 A CN101844864 A CN 101844864A CN 200910080148 A CN200910080148 A CN 200910080148A CN 200910080148 A CN200910080148 A CN 200910080148A CN 101844864 A CN101844864 A CN 101844864A
Authority
CN
China
Prior art keywords
cutting
glass substrate
mark
cut
data line
Prior art date
Application number
CN200910080148A
Other languages
Chinese (zh)
Other versions
CN101844864B (en
Inventor
刘家安
高翔
张莹
Original Assignee
北京京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京京东方光电科技有限公司 filed Critical 北京京东方光电科技有限公司
Priority to CN 200910080148 priority Critical patent/CN101844864B/en
Publication of CN101844864A publication Critical patent/CN101844864A/en
Application granted granted Critical
Publication of CN101844864B publication Critical patent/CN101844864B/en

Links

Abstract

The invention provides a glass substrate and a cutting method thereof, wherein the glass substrate comprises more than one liquid crystal panel and process marks, the process mark positioned between every two liquid crystal panels on a grid line and/or data line direction is in common. The embodiment of the invention also discloses a cutting method of the glass substrate, which comprises the steps of: cutting the glass substrate by a cutting tool bit according to cutting position information determined by the process mark shared between every two liquid crystal panels on the grid line and/or data line direction; moving the cutting tool bit to a secondary cutting position after arriving at a destination point; and carrying out secondary cutting on the glass substrate by the cutting tool bit. The glass substrata and the cutting method thereof can meet the maximization of edge benefit, lower the cost of unit product, and can improve the efficiency of cutting the glass substrate.

Description

The cutting method of glass substrate and glass substrate
Technical field
The present invention relates to liquid crystal manufacturing technology field, the cutting method of particularly a kind of glass substrate and glass substrate.
Background technology
In the liquid-crystal display manufacturing processed, usually technology marks such as alignment mark and cut mark need be set on glass substrate, and when glass substrate is cut, can determine cutting position according to alignment mark, determine cutting quality according to cut mark, and then realize technologies such as contraposition, cutting to glass substrate, the size of above-mentioned technology mark be the product development design phase according to the requirement design of the ability of each processing unit and device parameter.
Fig. 1 is the structural representation of glass substrate in the prior art, as shown in Figure 1, each panel (panel) on the glass substrate has oneself independently alignment mark, quantity is 8, above-mentioned 8 contrapositions indicate and are divided into 4 groups, and the four edges along liquid crystal panel distributes respectively, and two alignment marks that wherein distribute on each direction can be regarded one group as, when carrying out the cutting of glass substrate, each liquid crystal panel positions, cuts according to one group of alignment mark separately; Can also cut mark be set in the edge of liquid crystal panel in addition, can determine cutting quality according to this cut mark.Cutting flow process to glass substrate in the prior art comprises the steps: carrying glass sheet to position to be cut, at first carry out the contraposition affirmation before each cutting and calculate cutting position, carry out cutting action afterwards, after arriving cutting end point cutter head is returned origin position, wait for that transport device repeats above-mentioned steps with the glass substrate conveyance behind same position, promptly finish cutting for the second time.
In the design of the glass substrate of prior art, the alignment mark that is provided with in order arts demand such as to cut has taken a large amount of design spaces, can't satisfy the maximization of edge benefit, the cost height of unit product.
Summary of the invention
The cutting method that the purpose of this invention is to provide a kind of glass substrate and glass substrate satisfying the maximization of glass substrate edge benefit, and can improve the cutting efficiency of glass substrate.
For achieving the above object, the invention provides a kind of glass substrate, comprise more than one liquid crystal panel and technology mark, the technology mark between the adjacent lcd panel on grid line and/or the data line direction is shared.
The present invention also provides a kind of cutting method of glass substrate, comprising:
Cutter head cuts glass substrate according to the cutting position information that the shared technology mark between the adjacent lcd panel on grid line and/or the data line direction is determined;
After reaching cutting end point, cutter head is moved to the secondary cut position;
Cutter head carries out secondary cut to glass substrate.
The present invention also provides the cutting method of another kind of glass substrate, comprising:
Cutter head cuts glass substrate according to the cutting position information that the shared technology mark between the adjacent lcd panel on grid line or the data line direction is determined;
After reaching cutting end point, transport device arrives cutting position with the glass substrate conveyance;
Cutter head cuts glass substrate according to the secondary cut positional information that the shared technology mark between the adjacent lcd panel is determined.
The present invention also provides the cutting method of another glass substrate, comprising:
Cutter head cuts glass substrate according to the cutting position information that the shared technology mark between the adjacent lcd panel on grid line or the data line direction is determined;
After reaching cutting end point, cutter head is moved to origin position;
Transport device arrives cutting position with the glass substrate conveyance;
Cutter head cuts glass substrate according to the secondary cut positional information that the shared technology mark between the adjacent lcd panel is determined.
The glass substrate that the embodiment of the invention provides and the cutting method of glass substrate, by shared technology mark is being set between the adjacent lcd panel on grid line and/or the data line direction on the glass substrate, can reduce the quantity of technology mark, and then reduce technology and be marked at occupation space on the glass substrate, to increase operation rate.The embodiment of the invention also provides the cutting method of corresponding glass substrate simultaneously, can improve the cutting efficiency to glass substrate.
Description of drawings
Fig. 1 is a glass substrate structural representation in the prior art;
Fig. 2 is the structural representation of glass substrate embodiment one of the present invention;
Fig. 3 is the structural representation of glass substrate embodiment two of the present invention;
Fig. 4 is the schematic flow sheet of the cutting method embodiment one of glass substrate of the present invention;
Fig. 5 is the operation chart of the cutting method of glass substrate shown in Figure 4;
Fig. 6 is the schematic flow sheet of the cutting method embodiment two of glass substrate of the present invention;
Fig. 7 is the operation chart of the cutting method of glass substrate shown in Figure 6;
Fig. 8 is the schematic flow sheet of the cutting method embodiment three of glass substrate of the present invention;
Fig. 9 is the operation chart of the cutting method of glass substrate shown in Figure 8.
Embodiment
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
In the design and manufacturing processed of glass substrate, need to pursue higher utilization ratio, by adopting the shared technical schemes of technology mark such as alignment mark and cut mark, effectively reduce the shared design space of technology mark among the present invention, the present invention also provides corresponding cutting method in addition.
In the technical solution of the present invention that the technology mark is shared, one of them aspect be with two groups of alignment marks between the adjacent lcd panel in the traditional design shared be one group of alignment mark, this group alignment mark is that adjacent two liquid crystal panels are shared, when the liquid crystal panel to these group alignment mark both sides cuts maintenance, all can use one group of above-mentioned shared alignment mark.Can also cut mark be set in the edge of liquid crystal panel in the present embodiment, after utilizing above-mentioned shared alignment mark to carry out contraposition and cutting, the cutting position of this cut mark with reality can be compared, determine the quality of cutting.Fig. 2 is the structural representation of glass substrate embodiment one of the present invention, as shown in Figure 2, on the grid direction, between two liquid crystal panels on the glass substrate, one group of alignment mark is set, the shared one group of alignment mark of above-mentioned two liquid crystal panels when technology such as cutting.Between two liquid crystal panels on the data line direction, also can carry out same setting in addition, by the shared one group of alignment mark of two adjacent on data line direction liquid crystal panels.Can be both between the adjacent lcd panel on the grid line direction in addition, again one group of alignment mark is being set between the adjacent lcd panel on the data line direction.
The present invention reduces the quantity that plays the alignment mark of indicative function on the glass substrate by the adjacent shared alignment mark of liquid crystal panel, can improve the space availability ratio of glass substrate.
In the technical solution of the present invention that the technology mark is shared, another aspect is that alignment mark and cut mark is shared, in design, will between the liquid crystal panel on grid line direction or the data line direction, only be provided for the cut mark of contraposition and cutting, this cut mark both can be used for contraposition, can be used for cutting again, thereby can no longer be provided for the alignment mark of contraposition, make that liquid crystal panel is provided with continuously on grid line direction or data line direction, Fig. 3 is the structural representation of glass substrate embodiment two of the present invention, as shown in Figure 3, liquid crystal panel is provided with on the grid line direction continuously, the centre is not provided with alignment mark, liquid crystal panel can be provided with on the direction of data line continuously in addition yet.When carrying out the cutting of glass substrate, can cut according to cut mark, by liquid crystal panel is provided with continuously in glass substrate upper edge grid line direction or data line direction, reduce the quantity of alignment mark on the glass substrate in the present embodiment, can improve the utilization ratio of glass substrate.
For the glass substrate among the described embodiment of Fig. 3, when cutting, on the grid line direction, only need carry out a cutting operation between two crystal liquid substrates and get final product in addition.
At the glass substrate that provides in the foregoing description, the embodiment of the invention also provides corresponding cutting method, promptly utilize shared technology mark to carry out contraposition and definite cutting position information, cutter head cuts glass substrate according to above-mentioned cutting position information, and after cutting is finished, can compare according to the cutting position of the cut mark on the glass substrate with reality, to determine cutting quality.The invention provides following embodiment, Fig. 4 is for the schematic flow sheet of the cutting method embodiment one of glass substrate of the present invention, and in conjunction with Fig. 5, Fig. 5 is the operation chart of the cutting method of glass substrate shown in Figure 4, as shown in Figure 4, comprises the steps:
Step 101, transport device arrive position to be cut with the glass substrate conveyance;
Step 102, carry out 1. contraposition according to only one group of alignment mark between the adjacent lcd panel on grid line direction and/or the data line direction, determine cutting position information, i.e. information such as cut point and line of cut by the image identifying system;
2. step 103, cutter head cut glass substrate, and after arriving cutting end point and finishing 3. the location, do not return initial point;
Step 104, glass substrate holding position are fixed, and 4. cutter head is moved to the secondary cut position along the direction perpendicular to cut direction;
Step 105, carry out contraposition by the image identifying system according to above-mentioned only one group of alignment mark and calculate and determine the secondary cut positional information, be i.e. 1. identical in the information such as cut point and line of cut, the contraposition calculating in this step and step 102 bit manipulation;
Step 106,5. cut according to above-mentioned cutting position information by cutter head;
Step 107, after cutting is finished, carry out 6. original point position cutter head is returned initial point.
Cutting method in the present embodiment is when carrying out the cutting of glass substrate, only comprising between two adjacent liquid crystal panels under the situation of one group of alignment mark, determine the cutting position information of cutting twice by utilizing above-mentioned only one group of alignment mark, cutter head is finished when cutting first, do not return initial point, but directly move to the secondary cut position, pending contraposition is calculated and is determined to carry out secondary cut after the cutting position information, after finishing, secondary cut returns initial point, the glass substrate cutting scheme that present embodiment provides can reduce the cutting step flow process, improves cutting efficiency.Cutting scheme in the present embodiment also can be applied in traditional glass substrate in addition.
The situation of cut mark only is set at alignment mark not being set among the above-mentioned glass substrate embodiment on grid line or data line direction in addition, the present invention also provides corresponding cutting method, utilize cut mark to carry out contraposition in this technical scheme and carry out contraposition and determine cutting position information, cut then.Fig. 6 is for the schematic flow sheet of the cutting method embodiment two of glass substrate of the present invention, and in conjunction with Fig. 7, Fig. 7 is the operation chart of the cutting method of glass substrate shown in Figure 6, as shown in Figure 6, comprises the steps:
Step 201, transport device arrive position to be cut with the glass substrate conveyance;
Step 202, carry out 1. contraposition by the image identifying system according to cut mark and calculate to obtain cutting position information, the image encoding system that uses in this step has the identification capability to cut mark;
2. step 203, cutter head cut glass substrate according to above-mentioned cutting position information, and after arriving cutting end point and finishing 3. the location, do not return initial point;
Step 204, transport device with glass substrate 4. conveyance to the secondary cut position;
Step 205, carry out the cutting position information that secondary cut was calculated and determined in 5. contraposition according to cut mark, i.e. 1. identical in the information such as cut point and line of cut, the contraposition calculating in this step and step 202 to bit manipulation by the image identifying system;
Step 206,6. cut according to above-mentioned cutting position information by cutter head;
Step 207, after glass substrate cutting is finished, cutter head carries out 7. original point position, gets back to initial point.
The cutting method of the glass substrate that provides in the present embodiment, at the situation that does not have alignment mark on the glass substrate, by the contraposition of identification cut mark realization to glass substrate, cutting, and after once cutting, keep the cutter head invariant position, use transport device that the secondary cut position is arrived in the glass substrate conveyance, cut by cutter head again, can improve the cutting efficiency of glass substrate, because liquid crystal panel is middle continuous setting of not establishing alignment mark on grid line or data line direction, between two liquid crystal panels that are provided with continuously on the direction, only carries out a cutting operation in the present embodiment and get final product simultaneously.
Fig. 8 is for the schematic flow sheet of the cutting method embodiment three of glass substrate of the present invention, and in conjunction with Fig. 9, Fig. 9 is the operation chart of the cutting method of glass substrate shown in Figure 8, as shown in Figure 8, comprises the steps:
Step 301, transport device arrive position to be cut with the glass substrate conveyance;
Step 302, carry out 1. contraposition by the image identifying system according to cut mark and calculate to obtain cutting position information, the image encoding system in this step has the identification capability to cut mark;
2. step 303, cutter head cut glass substrate according to above-mentioned cutting position information;
Step 304, cutter head turn back to 4. origin position after arriving cutting end point and finishing 3. the location;
Step 305, transport device with glass substrate 5. conveyance to the secondary cut position;
Step 306, carry out 6. contraposition by the image identifying system according to cut mark and calculate and determine cutting position information, be i.e. 1. identical in the information such as cut point and line of cut, the contraposition calculating in this step and step 302 bit manipulation;
Step 307,7. cut according to above-mentioned cutting position information by cutter head;
Step 308, after glass substrate cutting is finished, cutter head carries out 8. original point position, gets back to 9. origin position.
The cutting method of the glass substrate that present embodiment provides can be shared at alignment mark and cut mark, when only comprising cut mark between the liquid crystal panel, carries out contraposition according to cut mark, and glass substrate is cut.
The glass substrate that the above embodiment of the present invention provides and the cutting method of glass substrate, by the shared one group of alignment mark of two adjacent liquid crystal panels, perhaps on grid line or data line direction that alignment mark and cut mark is shared, alignment mark is not set, make liquid crystal panel be provided with continuously, all can reduce the design space of technology mark on the glass substrate, improve marginal contribution.The cutting method of the corresponding glass substrate that provides of the embodiment of the invention can be cut at the glass substrate that the above embodiments provide, and can be improved the cutting efficiency of glass substrate in addition.
It should be noted that at last: above embodiment is only in order to technical scheme of the present invention to be described but not limit it, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that: it still can make amendment or be equal to replacement technical scheme of the present invention, and these modifications or be equal to replacement and also can not make amended technical scheme break away from the spirit and scope of technical solution of the present invention.

Claims (10)

1. a glass substrate comprises more than one liquid crystal panel and technology mark, it is characterized in that, the technology mark between the adjacent lcd panel on grid line and/or the data line direction is shared.
2. glass substrate according to claim 1 is characterized in that, shared being specially of technology mark between the described adjacent lcd panel on grid line and/or data line direction:
Between the adjacent lcd panel on grid line direction and/or the data line direction, has one group of alignment mark.
3. glass substrate according to claim 1 is characterized in that, shared being specially of technology mark between the described adjacent lcd panel on grid line and/or data line direction:
Between the liquid crystal panel on grid line or the data line direction, only be provided for the cut mark of contraposition and cutting.
4. the cutting method of a glass substrate is characterized in that, comprising:
Cutter head cuts glass substrate according to the cutting position information that the shared technology mark between the adjacent lcd panel on grid line and/or the data line direction is determined;
After reaching cutting end point, cutter head is moved to the secondary cut position;
Cutter head carries out secondary cut to glass substrate.
5. the cutting method of glass substrate according to claim 4 is characterized in that, the shared technology mark between the described adjacent lcd panel on grid line and/or data line direction is specially:
One group of alignment mark between the adjacent lcd panel on grid line direction and/or the data line direction.
6. the cutting method of glass substrate according to claim 5 is characterized in that, described secondary cut position is obtained according to one group of alignment mark between the adjacent lcd panel on described grid line direction and/or the data line direction by computing module.
7. the cutting method of a glass substrate is characterized in that, comprising:
Cutter head cuts glass substrate according to the cutting position information that the shared technology mark between the adjacent lcd panel on grid line or the data line direction is determined;
After reaching cutting end point, transport device arrives cutting position with the glass substrate conveyance;
Cutter head cuts glass substrate according to the secondary cut positional information that the shared technology mark between the adjacent lcd panel is determined.
8. the cutting method of glass substrate according to claim 7 is characterized in that, the shared technology mark between the described adjacent lcd panel on grid line or data line direction is specially:
The cut mark that between the liquid crystal panel on grid line or the data line direction, is used for contraposition and cutting.
9. the cutting method of a glass substrate is characterized in that, comprising:
Cutter head cuts glass substrate according to the cutting position information that the shared technology mark between the adjacent lcd panel on grid line or the data line direction is determined;
After reaching cutting end point, cutter head is moved to origin position;
Transport device arrives cutting position with the glass substrate conveyance;
Cutter head cuts glass substrate according to the secondary cut positional information that the shared technology mark between the adjacent lcd panel is determined.
10. the cutting method of glass substrate according to claim 9 is characterized in that, the shared technology mark between the described adjacent lcd panel on grid line and/or data line direction is specially:
The cut mark that between the liquid crystal panel on grid line or the data line direction, is used for contraposition and cutting.
CN 200910080148 2009-03-24 2009-03-24 Glass substrate and cutting method thereof CN101844864B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200910080148 CN101844864B (en) 2009-03-24 2009-03-24 Glass substrate and cutting method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200910080148 CN101844864B (en) 2009-03-24 2009-03-24 Glass substrate and cutting method thereof

Publications (2)

Publication Number Publication Date
CN101844864A true CN101844864A (en) 2010-09-29
CN101844864B CN101844864B (en) 2013-08-28

Family

ID=42769700

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200910080148 CN101844864B (en) 2009-03-24 2009-03-24 Glass substrate and cutting method thereof

Country Status (1)

Country Link
CN (1) CN101844864B (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102180592A (en) * 2011-03-01 2011-09-14 上海维宏电子科技有限公司 High-speed cutting method based on tangent following glass cutting system
CN102807314A (en) * 2011-06-03 2012-12-05 洛阳北方玻璃技术股份有限公司 Heating device for flat glass
WO2013078706A1 (en) * 2011-11-29 2013-06-06 深圳市华星光电技术有限公司 Identification code printing method and printing device
WO2013086787A1 (en) * 2011-12-13 2013-06-20 意力(广州)电子科技有限公司 Panel glass multi-mode processing method and semi-finished product processed adopting the same
CN103241931A (en) * 2012-02-13 2013-08-14 美高C&C有限公司 Method for processing tempered glass substrate of touch screen
US8823998B2 (en) 2011-11-29 2014-09-02 Shenzhen China Star Optoelectronics Technology Co., Ltd. Identification code printing method and printing apparatus
CN104280922A (en) * 2014-10-27 2015-01-14 京东方科技集团股份有限公司 Method and device for cutting glass of liquid crystal display screen
CN104297989A (en) * 2014-10-22 2015-01-21 京东方科技集团股份有限公司 Substrate, mask plate and liquid crystal display device
TWI481576B (en) * 2012-05-02 2015-04-21 Taiwan Mitsuboshi Diamond Ind Co Ltd Method of cutting glasses and cutting apparatus
CN104977745A (en) * 2015-06-24 2015-10-14 武汉华星光电技术有限公司 Substrate for liquid crystal display panel and liquid crystal display panel cutting method
CN105572939A (en) * 2016-02-01 2016-05-11 武汉华星光电技术有限公司 Alignment and assembly method of liquid crystal display panel
CN105652484A (en) * 2016-03-29 2016-06-08 深圳市华星光电技术有限公司 Method for cutting liquid crystal display panel
CN107223087A (en) * 2015-04-17 2017-09-29 惠普发展公司,有限责任合伙企业 For printing the target with cutting process
CN107357060A (en) * 2017-08-29 2017-11-17 惠科股份有限公司 The manufacture method and manufacturing equipment of a kind of display panel
CN109283728A (en) * 2018-11-12 2019-01-29 成都中电熊猫显示科技有限公司 Cut correction method, device and storage medium
CN111679473A (en) * 2020-06-04 2020-09-18 深圳市华星光电半导体显示技术有限公司 Display mother board, manufacturing method thereof and display panel

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2795200Y (en) * 2004-06-10 2006-07-12 上海广电液晶显示器有限公司 Blass with cutting butt point mark

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4472843B2 (en) * 2000-07-31 2010-06-02 オプトレックス株式会社 Multi-sided mother board and liquid crystal display element
CN101109860B (en) * 2006-07-19 2010-09-29 群康科技(深圳)有限公司 Panel Used for LCD device
CN101334541B (en) * 2008-07-23 2010-08-04 友达光电股份有限公司 Array substrate and its display panel

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2795200Y (en) * 2004-06-10 2006-07-12 上海广电液晶显示器有限公司 Blass with cutting butt point mark

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102180592A (en) * 2011-03-01 2011-09-14 上海维宏电子科技有限公司 High-speed cutting method based on tangent following glass cutting system
CN102180592B (en) * 2011-03-01 2013-01-02 上海维宏电子科技股份有限公司 High-speed cutting method based on tangent following glass cutting system
CN102807314A (en) * 2011-06-03 2012-12-05 洛阳北方玻璃技术股份有限公司 Heating device for flat glass
CN102807314B (en) * 2011-06-03 2015-06-17 洛阳北方玻璃技术股份有限公司 Heating device for plate glass
WO2013078706A1 (en) * 2011-11-29 2013-06-06 深圳市华星光电技术有限公司 Identification code printing method and printing device
US8823998B2 (en) 2011-11-29 2014-09-02 Shenzhen China Star Optoelectronics Technology Co., Ltd. Identification code printing method and printing apparatus
WO2013086787A1 (en) * 2011-12-13 2013-06-20 意力(广州)电子科技有限公司 Panel glass multi-mode processing method and semi-finished product processed adopting the same
CN103241931A (en) * 2012-02-13 2013-08-14 美高C&C有限公司 Method for processing tempered glass substrate of touch screen
TWI481576B (en) * 2012-05-02 2015-04-21 Taiwan Mitsuboshi Diamond Ind Co Ltd Method of cutting glasses and cutting apparatus
CN104297989A (en) * 2014-10-22 2015-01-21 京东方科技集团股份有限公司 Substrate, mask plate and liquid crystal display device
CN104297989B (en) * 2014-10-22 2017-06-27 京东方科技集团股份有限公司 substrate, mask plate and liquid crystal display device
CN104280922A (en) * 2014-10-27 2015-01-14 京东方科技集团股份有限公司 Method and device for cutting glass of liquid crystal display screen
CN104280922B (en) * 2014-10-27 2017-05-03 京东方科技集团股份有限公司 Method and device for cutting glass of liquid crystal display screen
WO2016065790A1 (en) * 2014-10-27 2016-05-06 京东方科技集团股份有限公司 Method and device for cutting lcd screen glass
CN107223087A (en) * 2015-04-17 2017-09-29 惠普发展公司,有限责任合伙企业 For printing the target with cutting process
CN104977745B (en) * 2015-06-24 2018-05-25 武汉华星光电技术有限公司 Substrate for liquid crystal display panel and liquid crystal display panel cutting method
CN104977745A (en) * 2015-06-24 2015-10-14 武汉华星光电技术有限公司 Substrate for liquid crystal display panel and liquid crystal display panel cutting method
CN105572939A (en) * 2016-02-01 2016-05-11 武汉华星光电技术有限公司 Alignment and assembly method of liquid crystal display panel
WO2017166397A1 (en) * 2016-03-29 2017-10-05 深圳市华星光电技术有限公司 Manufacturing method for liquid crystal panel
CN105652484A (en) * 2016-03-29 2016-06-08 深圳市华星光电技术有限公司 Method for cutting liquid crystal display panel
US20180164631A1 (en) * 2016-03-29 2018-06-14 Shenzhen China Star Optoelectronics Technology Co., Ltd. Cutting method of liquid crystal panel
US10293508B2 (en) 2016-03-29 2019-05-21 Shenzhen China Star Optoelectronics Technology Co., Ltd Cutting method of liquid crystal panel
CN107357060A (en) * 2017-08-29 2017-11-17 惠科股份有限公司 The manufacture method and manufacturing equipment of a kind of display panel
CN109283728A (en) * 2018-11-12 2019-01-29 成都中电熊猫显示科技有限公司 Cut correction method, device and storage medium
CN111679473A (en) * 2020-06-04 2020-09-18 深圳市华星光电半导体显示技术有限公司 Display mother board, manufacturing method thereof and display panel

Also Published As

Publication number Publication date
CN101844864B (en) 2013-08-28

Similar Documents

Publication Publication Date Title
US20190243343A1 (en) Sorting support method and flatbed machine tool
CN104122844B (en) Processing system and processing method
JP5649592B2 (en) Manufacturing method of glass substrate of cover glass for portable electronic device, glass substrate of cover glass for portable electronic device, and portable electronic device
CN102583965B (en) Methods and apparatus for reducing stress variations in glass sheets produced from a glass ribbon
CN100464211C (en) Mfg. appts. and method of liquid crystal display panel
CN102636910B (en) Display panel and preparation method thereof
Parry et al. Application of lean visual process management tools
JP4706985B2 (en) Content display device
CN101706886A (en) Order-driven Single-piece small-batch combined flow production method for processing workshop
CN102348545B (en) Method and device for producing square units
CN103777407B (en) A kind of LCD device and preparation method thereof
JP2007187781A (en) Method for manufacturing optical film product
CN101970363B (en) Scribing device and scribing method
US9731452B2 (en) Three dimensional printer and method for adjusting working coordinate of platform thereof
JPH091782A (en) Information transmission system
CN103341787B (en) The numerical control machining cutter radius compensation method of feature based
CN102768424B (en) Double-viewing angle display panel and manufacturing method thereof
AT384997T (en) Method and systems for exchange of accountability information and for switching between redundant interfaces in a network cluster
JPWO2014033960A1 (en) Production line management method and management system
CN101321240A (en) Method and device for multi-drawing layer stacking
EP2284911A3 (en) Laser ablation tool
CN101604145B (en) Integrative simulation system of production plan of steel making, continuous casting and hot rolling
CN102495712A (en) Map splicing display method based on a plurality of display terminals
TW200705235A (en) Systems, methods and media for managing the print speed of a variable speed printer
CN104718520A (en) Display device, display device manufacturing method, touch panel, and touch panel manufacturing method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY

Effective date: 20150713

Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD

Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD.

Effective date: 20150713

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20150713

Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No.

Patentee after: BOE Technology Group Co., Ltd.

Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd.

Address before: 100176 Beijing economic and Technological Development Zone, West Central Road, No. 8

Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd.