JP2002043703A - Multiple mother board and liquid crystal display element - Google Patents

Multiple mother board and liquid crystal display element

Info

Publication number
JP2002043703A
JP2002043703A JP2000230762A JP2000230762A JP2002043703A JP 2002043703 A JP2002043703 A JP 2002043703A JP 2000230762 A JP2000230762 A JP 2000230762A JP 2000230762 A JP2000230762 A JP 2000230762A JP 2002043703 A JP2002043703 A JP 2002043703A
Authority
JP
Japan
Prior art keywords
substrate
cell substrate
cell
mother board
mother
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000230762A
Other languages
Japanese (ja)
Other versions
JP4472843B2 (en
Inventor
Mutsumi Abe
睦 阿部
Original Assignee
Optrex Corp
オプトレックス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optrex Corp, オプトレックス株式会社 filed Critical Optrex Corp
Priority to JP2000230762A priority Critical patent/JP4472843B2/en
Publication of JP2002043703A publication Critical patent/JP2002043703A/en
Application granted granted Critical
Publication of JP4472843B2 publication Critical patent/JP4472843B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To easily recognize the position where a cell board has been located on a mother board even if the cell board is cut out of the mother board and assembled in a product. SOLUTION: Cutting marks 12 are fiducial marks when the cell boards 11a, 11b, 11c are cut out of the multiple mother board 1. The cutting marks 12 have identification elements which can identify locations of the call boards on the multiple mother board 1, e.g. alphabet.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【0001】[0001]
【発明の属する技術分野】本発明は多面取りマザー基板
および液晶表示素子に関し、さらに詳しく言えば、不良
セル基板の出所を容易に追跡することができるようにし
た製品管理的な技術に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple mother board and a liquid crystal display device, and more particularly, to a product management technique capable of easily tracking the source of a defective cell substrate. .
【0002】[0002]
【従来の技術】液晶表示素子の製造には、その基本的な
構成要素としてF板と称される前面パネルとR板と称さ
れる背面パネルの2枚のセル基板(透明電極基板)が用
いられるが、実際の生産工程において、F,Rの各セル
基板はその複数枚がマザー基板上で同時に形成される。
2. Description of the Related Art In manufacturing a liquid crystal display device, two cell substrates (transparent electrode substrates) of a front panel called an F plate and a rear panel called an R plate are used as basic components. However, in the actual production process, a plurality of F and R cell substrates are simultaneously formed on the mother substrate.
【0003】そして、いずれか一方のマザー基板の各セ
ル基板の周囲に周辺シール材を印刷する工程、F板側の
マザー基板とR板のマザー基板の貼り合わせ工程、貼り
合わせマザー基板から行単位もしくは列単位でスティッ
ク基板を切り出して注入口出しする工程、個々のセル内
に液晶を注入して注入口を封止する工程を経た後、ステ
ィック基板から個々の製品が切り出される。
Then, a step of printing a peripheral sealing material around each cell substrate of one of the mother substrates, a step of bonding the mother board on the F plate side and the mother board of the R plate, Alternatively, after a step of cutting out the stick substrate in a row unit to form an injection port and a step of injecting liquid crystal into each cell to seal the injection port, individual products are cut out from the stick substrate.
【0004】[0004]
【発明が解決しようとする課題】ところで、マザー基板
上で複数のセル基板を形成するには、例えばITO(イ
ンジウム・錫酸化物)よりなる透明導電膜が形成された
マザー基板に対してフォトマスクを介して露光(パター
ニング)が行なわれるが、例えばそのフォトマスクにゴ
ミが付着していたとすると、各マザー基板の同一個所す
なわち同じ位置のセル基板にITO断線や隣接するIT
O電極間の短絡などの不良が発生する。
By the way, in order to form a plurality of cell substrates on a mother substrate, a photomask is formed on the mother substrate on which a transparent conductive film made of, for example, ITO (indium tin oxide) is formed. Exposure (patterning) is performed through a mask. For example, if dust is adhered to the photomask, the ITO substrate is disconnected at the same location on each mother substrate, that is, the cell substrate at the same position, and the adjacent IT
A defect such as a short circuit between the O electrodes occurs.
【0005】上記断線不良がマザー基板からの切り出し
後のセル基板で発見されたとすると、同じ位置のセル基
板が使用されている製品(仕掛品も含む)も断線不良と
なっているおそれが多分にある。しかしながら、従来で
は各セル基板に特にマザー基板上での番地(位置)など
が表示されていないため、不良品と目される製品を探す
のに多大な労力を要していた。
If the disconnection defect is found on the cell substrate cut out from the mother substrate, there is a possibility that a product (including a work-in-progress) in which the cell substrate at the same position is used also has a disconnection defect. is there. However, conventionally, since an address (position) on the mother substrate is not particularly displayed on each cell substrate, a great deal of labor has been required to search for a product regarded as a defective product.
【0006】[0006]
【課題を解決するための手段】本発明によれば、セル基
板がマザー基板から切り出されて製品に組み込まれたと
しても、セル基板がマザー基板のどの位置に属していた
かを容易に知ることができる。
According to the present invention, even if a cell substrate is cut from a mother substrate and incorporated into a product, it is easy to know which position of the mother substrate the cell substrate belongs to. it can.
【0007】そのため、本発明は、透明電極が形成され
る複数のセル基板形成領域を含み、その各セル基板形成
領域内の四隅に各セル基板を切り出す際の基準となる切
断マークが上記透明電極とともに形成される多面取りマ
ザー基板において、上記切断マークに、当該多面取りマ
ザー基板上における上記各セル基板の位置を識別可能と
する識別要素を持たせることを特徴としている。
[0007] Therefore, the present invention includes a plurality of cell substrate forming regions on which transparent electrodes are formed, and a cutting mark serving as a reference for cutting each cell substrate at four corners in each cell substrate forming region is provided with the transparent electrode. The multi-cut mother board formed together with the multi-cut mother board is characterized in that the cutting mark has an identification element for identifying a position of each of the cell substrates on the multi-cut mother board.
【0008】本発明において、上記識別要素は上記切断
マーク内に形成された数字もしくは英文字などの記号で
あることが好ましく、これによれば上記切断マーク自体
の外形を変える必要はない。また、各セル基板のマザー
基板上での位置を分かりやすくするには、上記識別要素
に各セル基板の行位置および列位置を割り当てるとよ
い。
In the present invention, the identification element is preferably a symbol such as a numeral or an alphabetic character formed in the cutting mark. According to this, it is not necessary to change the outer shape of the cutting mark itself. Further, in order to make the position of each cell substrate on the mother substrate easy to understand, it is preferable to assign the row position and the column position of each cell substrate to the identification element.
【0009】上記切断マークはセル基板内に形成される
ため、液晶表示素子として組み立てられた後において
も、セル基板の出所を知ることができる。したがって、
上記多面取りマザー基板から切り出された上記セル基板
を備えている液晶表示素子も本発明の範囲に含まれる。
Since the cutting mark is formed in the cell substrate, the source of the cell substrate can be known even after the liquid crystal display device is assembled. Therefore,
A liquid crystal display device provided with the cell substrate cut out from the multiple mother board is also included in the scope of the present invention.
【0010】なお、本明細書において、セル基板形成領
域とはマザー基板でセル基板を形成する領域であり、セ
ル基板はそのセル基板形成領域に形成され、その後にお
いてマザー基板から切り出されるものを言う。
In this specification, a cell substrate forming region is a region where a cell substrate is formed on a mother substrate, and the cell substrate is formed in the cell substrate forming region and then cut out from the mother substrate. .
【0011】[0011]
【発明の実施の形態】次に、図面を参照しながら、本発
明の実施形態について説明する。図1の第1実施形態に
おいて、多面取りマザー基板1は、これに含まれる複数
のセル基板形成領域11を3列並びとしているが、行数
については作図の都合上、その第1行〜第4行までが示
されている。
Next, an embodiment of the present invention will be described with reference to the drawings. In the first embodiment shown in FIG. 1, the multiple mother board 1 has a plurality of cell substrate formation regions 11 included therein arranged in three columns, but the number of rows is not limited to the first row to the first row for convenience of drawing. Up to four lines are shown.
【0012】この多面取りマザー基板1は、一方の面の
全面にITOよりなる透明導電膜が形成されたガラス基
板からなり、各セル基板形成領域11には図示しないフ
ォトマスクを介して例えばF板側の透明電極パターンが
露光され、続いてその現像が行なわれるが、この透明電
極のパターニングと同時に、各セル基板形成領域11の
四隅の各々にITOよりなる切断マーク12が形成され
る。なお、切断マーク12はセル基板形成領域11内の
みでなく、マザー基板1の外周部に存在する捨て基板部
1aにも形成される。
The mother substrate 1 is a glass substrate having a transparent conductive film made of ITO formed on one entire surface thereof. The transparent electrode pattern on the side is exposed and then developed. Simultaneously with the patterning of the transparent electrode, cutting marks 12 made of ITO are formed at each of the four corners of each cell substrate formation region 11. Note that the cutting marks 12 are formed not only in the cell substrate forming region 11 but also in the discarded substrate portion 1 a existing on the outer peripheral portion of the mother substrate 1.
【0013】切断マーク12は、各セル基板形成領域1
1に形成されたセル基板を切り出す際の基準となるマー
クであり、通常は正四角形が採用されている。切断マー
ク12は、各セル基板形成領域11の四隅に配置されて
いることから、隣接する4つのセル基板形成領域11の
角には4つの切断マーク12が集合することになり、図
1に鎖線で示されている切断線Cを、これら切断マーク
12間を通るように列方向および行方向に入れることに
より、マザー基板1からセル基板の切り出しが行なわれ
る。
The cutting mark 12 is formed in each cell substrate forming region 1
This mark serves as a reference when cutting the cell substrate formed in No. 1 and is usually a square. Since the cutting marks 12 are arranged at the four corners of each cell substrate forming region 11, four cutting marks 12 are gathered at the corners of four adjacent cell substrate forming regions 11. Is cut in the column direction and the row direction so as to pass between the cutting marks 12, whereby the cell substrate is cut out from the mother substrate 1.
【0014】したがって、切断マーク12は切り出され
たセル基板とともに下流側工程にもって回られることに
なる。本発明によると、切断マーク12にマザー基板1
上におけるセル基板の位置を識別可能とする識別要素が
付される。なお、この識別要素もフォトマスクを介して
の露光により切断マーク12と同時に形成される。
Therefore, the cutting mark 12 is carried to the downstream process together with the cut cell substrate. According to the present invention, the motherboard 1
An identification element for identifying the position of the cell substrate above is attached. This identification element is also formed simultaneously with the cutting mark 12 by exposure through a photomask.
【0015】この第1実施形態では、隣接する4つのセ
ル基板形成領域11の角に集合する4つの切断マーク1
2を1グループとして、各グループごとに上から行方向
に沿ってアルファベットを順に付している。図1に示さ
れている3列,4行について言えば、各グループごとに
A〜Jが付されている。
In the first embodiment, four cutting marks 1 gathered at the corners of four adjacent cell substrate forming regions 11
2 is one group, and alphabetical letters are given to each group in order from the top in the row direction. Speaking of the three columns and four rows shown in FIG. 1, A to J are assigned to each group.
【0016】図2に上記マザー基板1の第1列,第1行
目から切り出されたセル基板11aを拡大して示すが、
このセル基板11aのマザー基板1からの出所番地(ア
ドレス)は4つの切断マーク12を例えば時計方向回り
に読むとすればA,B,F,Eとなる。
FIG. 2 is an enlarged view of the cell substrate 11a cut out from the first column and the first row of the mother substrate 1.
The source address (address) of the cell substrate 11a from the mother substrate 1 is A, B, F, and E if the four cutting marks 12 are read, for example, clockwise.
【0017】同様に、上記マザー基板1の第2列,第1
行目から切り出されたセル基板11bの出所番地はB,
C,G,Fとなり、第3列,第1行目から切り出された
セル基板11cの出所番地はC,D,H,Gとなり、同
一のマザー基板1上には同じ出所番地は存在しない。
Similarly, the second row, the first
The source address of the cell substrate 11b cut out from the row is B,
The source addresses of the cell substrate 11c cut out from the third column and the first row are C, D, H, and G, and the same source address does not exist on the same mother substrate 1.
【0018】したがって、同じフォトマスクによりマザ
ー基板1を1ロット単位で露光した場合、そのロット内
のマザー基板1から切り出されたセル基板に例えば断線
不良が発見された場合には、そのセル基板と同じ出所番
地のものを探せばよい。
Accordingly, when the mother substrate 1 is exposed in units of one lot using the same photomask, for example, when a disconnection failure is found in a cell substrate cut out from the mother substrate 1 in the lot, the cell substrate is exposed. Find the same source.
【0019】なお、マザー基板1の面取り数が多くなる
と、上記第1実施形態のようにアルファベットのみでは
対応が困難になる場合がある。また、算用数字などを用
いるにしても、切断マーク12自体が例えば1×1mm
角程度と小さいためできれば3桁以上は避けたい。
When the number of chamfers on the mother substrate 1 is increased, it may be difficult to cope with only alphabets as in the first embodiment. In addition, even if arithmetic numerals or the like are used, the cutting mark 12 itself is, for example, 1 × 1 mm.
Because it is as small as an angle, we want to avoid three digits or more if possible.
【0020】図3の第2実施形態によれば、限られた記
号により識別要素を拡張することができる。すなわち、
この第2実施形態においても、上記第1実施形態と同じ
く隣接する4つのセル基板形成領域11の角に集合する
4つの切断マーク12を1グループとして扱うが、この
場合には4つの切断マーク12の内の2つに行番号の意
味を持たせ、残りの2つに列番号の意味を持たせる。
According to the second embodiment shown in FIG. 3, the identification element can be expanded with limited symbols. That is,
Also in the second embodiment, the four cutting marks 12 gathered at the corners of the four adjacent cell substrate forming regions 11 are treated as one group as in the first embodiment. In this case, the four cutting marks 12 Are given the meaning of row numbers, and the remaining two are given the meaning of column numbers.
【0021】具体的には、上2つの切断マーク12に行
番号としてのアルファベットA,B,C…を付し、下2
つの切断マーク12に列番号としての1,2,3…を付
している。図4に、図3のマザー基板1の第1列,第1
行目から切り出されたセル基板11aを拡大して示す
が、これによるとセル基板11aの出所番地は4つの切
断マーク12を例えば時計方向回りに読むとすれば1,
2,B,Bとなる。
More specifically, alphabets A, B, C,...
The two cutting marks 12 are assigned 1, 2, 3,... As column numbers. FIG. 4 shows the first row and the first row of the mother substrate 1 shown in FIG.
The cell substrate 11a cut out from the row is shown in an enlarged manner. According to this, the source address of the cell substrate 11a is 1 if four cutting marks 12 are read clockwise, for example.
2, B, B.
【0022】同様に、図3のマザー基板1の第2列,第
1行目から切り出されたセル基板11bの出所番地は
2,3,B,Bとなり、第3列,第1行目から切り出さ
れたセル基板11cの出所番地は3,4,B,Bとな
り、この第2実施形態においても同一のマザー基板1上
には同じ出所番地は存在しない。
Similarly, the source addresses of the cell substrate 11b cut out from the second column and the first row of the mother substrate 1 in FIG. 3 are 2, 3, B and B, and from the third column and the first row. The source addresses of the cut-out cell substrate 11c are 3, 4, B, and B, and the same source address does not exist on the same mother substrate 1 also in the second embodiment.
【0023】本発明は上記の各実施形態に限定されるも
のではない。特に、切断マーク12に付される記号につ
いては任意に選択できる。また、上記各実施形態では隣
接する4つのセル基板形成領域11の角に集合する4つ
の切断マーク12の全部に識別要素を付しているが、例
えばセル基板形成領域11の四隅に設けられる4つの切
断マーク12の内の少なくとも一つに識別要素を付する
ようにしてもよい。場合によっては、ロット番号を識別
要素として付加することも可能である。また、もとより
本発明はR板側のマザー基板にも適用可能である。
The present invention is not limited to the above embodiments. In particular, the symbol attached to the cutting mark 12 can be arbitrarily selected. In each of the above embodiments, the identification elements are attached to all the four cutting marks 12 gathered at the corners of the adjacent four cell substrate formation regions 11. An identification element may be added to at least one of the two cutting marks 12. In some cases, a lot number can be added as an identification element. In addition, the present invention is naturally applicable to the motherboard on the R plate side.
【0024】[0024]
【発明の効果】以上説明したように、本発明によれば、
多面取りマザー基板から各セル基板を切り出す際の基準
となる切断マークに、当該多面取りマザー基板上におけ
るセル基板の位置を識別可能とする識別要素を持たせた
ことにより、セル基板がマザー基板から切り出されて製
品に組み込まれたとしても、そのセル基板がマザー基板
のどの位置に属していたかを容易に知ることができる。
As described above, according to the present invention,
The cutting mark, which is used as a reference when cutting each cell substrate from the multi-plane mother board, has an identification element that allows the position of the cell substrate on the multi-plane mother board to be identified. Even if the cell substrate is cut out and incorporated into a product, it can be easily known to which position on the mother substrate the cell substrate belongs.
【0025】したがって、例えばフォトマスクを同じく
する同一生産ロット内のマザー基板から切り出されたセ
ル基板に断線などの不良が発見された場合には、そのセ
ル基板と同じ識別要素(出所番地)を有するのものを探
せばよく、不良出現に対して迅速に対処することができ
る。
Therefore, for example, when a defect such as disconnection is found in a cell substrate cut out from a mother substrate in the same production lot having the same photomask, it has the same identification element (source address) as the cell substrate. What is necessary is just to search for, and it is possible to quickly cope with the appearance of a defect.
【図面の簡単な説明】[Brief description of the drawings]
【図1】本発明の第1実施形態による多面取りマザー基
板の一部分を模式的に示した平面図。
FIG. 1 is a plan view schematically showing a part of a multiple mother board according to a first embodiment of the present invention.
【図2】上記第1実施形態の多面取りマザー基板から切
り出された一つのセル基板を模式的に示した平面図。
FIG. 2 is a plan view schematically showing one cell substrate cut out from the multiple mother board of the first embodiment.
【図3】本発明の第2実施形態による多面取りマザー基
板の一部分を模式的に示した平面図。
FIG. 3 is a plan view schematically showing a part of a multiple mother board according to a second embodiment of the present invention;
【図4】上記第2実施形態の多面取りマザー基板から切
り出された一つのセル基板を模式的に示した平面図。
FIG. 4 is a plan view schematically showing one cell substrate cut out from the multiple mother board according to the second embodiment.
【符号の説明】[Explanation of symbols]
1 多面取りマザー基板 11 セル基板形成領域 11a,11b,11c セル基板 12 切断マーク C 切断線 DESCRIPTION OF SYMBOLS 1 Multi-faced mother board 11 Cell board formation area 11a, 11b, 11c Cell board 12 Cutting mark C Cutting line

Claims (4)

    【特許請求の範囲】[Claims]
  1. 【請求項1】 透明電極が形成される複数のセル基板形
    成領域を含み、その各セル基板形成領域内の四隅に各セ
    ル基板を切り出す際の基準となる切断マークが上記透明
    電極とともに形成される多面取りマザー基板において、 上記切断マークに、当該多面取りマザー基板上における
    上記各セル基板の位置を識別可能とする識別要素を持た
    せることを特徴とする多面取りマザー基板。
    A plurality of cell substrate forming regions on which transparent electrodes are formed, and cut marks serving as references for cutting each cell substrate at four corners in each of the cell substrate forming regions are formed together with the transparent electrodes. A multiple mother board, wherein the cutting mark has an identification element for identifying a position of each of the cell substrates on the multiple mother board.
  2. 【請求項2】 上記識別要素が上記切断マーク内に形成
    された数字もしくは英文字などの記号からなる請求項1
    に記載の多面取りマザー基板。
    2. The method according to claim 1, wherein the identification element comprises a symbol such as a numeral or a letter formed in the cutting mark.
    A mother board according to any one of the above items.
  3. 【請求項3】 上記識別要素に上記各セル基板の行位置
    および列位置が割り当てられている請求項1または2に
    記載の多面取りマザー基板。
    3. The multiple mother board according to claim 1, wherein a row position and a column position of each of the cell substrates are assigned to the identification element.
  4. 【請求項4】 上記多面取りマザー基板から切り出され
    た上記セル基板を備えていることを特徴とする液晶表示
    素子。
    4. A liquid crystal display device comprising the cell substrate cut out from the multiple mother board.
JP2000230762A 2000-07-31 2000-07-31 Multi-sided mother board and liquid crystal display element Expired - Fee Related JP4472843B2 (en)

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